TW401728B - Built-in finger shaped plate type capacitor resistor and its manufacture method - Google Patents

Abstract

This invention relates to a built-in finger shaped plate type capacitor resistor and its manufacture method (2), which is mainly to proceed the photoresist coating, image transfer, etch steps on the substrate of which the surface and bottom face of the insulated substrate setting the copper layer; next, print the electrically conductive layer with high resistor coefficient to the suitable position of the substrate to composite plate type resistor; use the above-mentioned image transfer steps to transfer the specified image information to the substrate and go through the etching to form the cross finger shaped electrode, and coating it with high dielectric coefficient resin to composite the plate type capacitor which is sited on the same plane of the above-mentioned resistor. This could release a large amount of surface spaces of the printing circuit, elevate the density of passive device and improve the quality in transmitting the signals through the above-mentioned built-in capacitor resistor.

Description

401728 Λ7 R7 Printed by the Shellfish Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs. 5. Description of the invention (The present invention relates to a built-in finger flat capacitor resistor and its manufacturing method), especially an etching printing method on the same plane of the substrate. Simultaneously formed flat capacitor resistance. According to the printed circuit board, there are lines formed on the surface or internal multilayer structure, and each line is mainly used for electrical connection or signal transmission between electronic components. However, the rapid development of information and functional requirements greatly Under the increasing trend, two kinds of phenomena have occurred. One is that the number of circuit surface adhesive components has increased significantly, and the other is that the demand for high-density printed circuits is increasing, but the aforementioned trends have caused the following problems: 1 The number of electronic components has increased. The distance between adjacent components is shortened. When the circuit starts to work, the probability of radiated interference between components is greatly increased, which directly affects the stability of the circuit operation. 2. As the number of electronic components increases, component signals may have to pass through different forms of Paths (such as electrical connections or signals through vias) Loss), and increased line impedance mismatch and line noise 0 3 · Furthermore, the increase in the number of electronic components will reduce the production yield relatively 'and thus increase the manufacturing cost. 4. In addition, the number of electronic components The increase is not conducive to the reduction of the surface area of the printed circuit board. From the above, it can be known that in order to effectively solve the foregoing problems, various problems arising from high-density printed circuits, OHMEGA has proposed a technology of built-in resistors in printed circuit boards to Replace the high-density printed circuit with the surface of the resistance element 'The technical principle is mainly based on the following formula: This paper size applies to China National Standard (CNS) A4 specifications (210X29 * 7 mm (please read the note on the back first) Matters need to be filled out on this page) -pack-β

L W

R 40172 ^ " ^ a V. Explanation of the invention (>): (7): Resistance value, p2 resistivity, t = thickness, = width can be seen from the above formula. The change of L (length) and W (width) can be used to adjust R (electrical resistance, 佶, m resistance value). Therefore, OHMEGA uses different p (resistance coefficient) / t (tickling, thickness), and uses L (Length), W (width) changes to produce the required resistance (R). And using the currently popular multi-layer printed circuit manufacturing technology, the resistance is made in the structure of the printed circuit board to form a built-in resistance. The built-in resistors in the structure of the PCB structure can effectively replace the resistors on the surface of the printed circuit board. Therefore, the number of components and the area occupation rate on the surface of the printed circuit board can be reduced. In addition to the resistance, capacitors are often formed in other ways. For existing multilayer printed circuit boards, they often bring two power layers with different potentials (such as VCC and GND) close to each other and use the large copper surface where they are located. An additional capacitor to regulate the voltage. Its formula is as follows: C ( Capacity) = ε (dielectric coefficient) X product) d (distance) In the above formula, £ (dielectric coefficient) is controlled by the characteristics of the material, so it can be controlled by changing A (area) and d (distance) Generate the required capacitance. From the above, it can be known that it is feasible to embed passive components such as resistors and valleys in the structure of printed circuits to effectively reduce the number of surface components and free up surface space. However, the aforementioned built-in resistors and embedded capacitors are feasible. It was achieved through different technical means, respectively, that it could not be completed in the same process, which caused the paper size to apply the Chinese National Standard (CNS) A4 specification (210 × 297 mm) — ΙΗΓί ί " 丨 1 ~ ------ Order --------- Bing (Please read the notes on the back before filling out this page) Printed by the Consumers' Cooperatives of the Central Bureau of Standards of the Ministry of Economic Affairs 4〇1728 Λ7 B7 5. Description of the invention (inconvenience in application) and because the aforementioned capacitors and resistors are located on different substrates, there is also the possibility that materials are improperly added to increase costs. In order to solve the foregoing problems, the main purpose of the present invention is to provide an etching method. The printing method is a method of forming a flat-plate resistor and a capacitor on a substrate at the same time, and the flat-plate capacitor and the resistor will be formed on the same plane of the substrate at the same time. Provides a method for manufacturing a built-in finger flat capacitor resistor, which mainly performs steps such as silk coating, image transfer, and closing on a substrate; wherein the substrate is provided with copper on the bottom surface of the substrate After completing the steps described in the above paragraph, alternating finger electrodes will be formed on the substrate, and a high-resistance conductive layer will be printed on the substrate in an appropriate position by printing to form a flat-plate resistor. After the foregoing printing step, a high-dielectric-constant resin is coated on the finger electrodes and the flat-type resistor, and each finger-shaped electrode forms a flat-plate capacitor through the resin. The present invention also aims at: the aforementioned flat-type capacitor is based on the following The formula 疋. C =% ', where ^ is the dielectric constant of the resin, A is the area of the plate capacitor, d is the distance between the finger electrodes, and a = l χ, where L is the total length of the aforementioned finger electrodes 't is the thickness f of the finger electrode. Under the condition that the dielectric constant of the resin and the thickness of the electrode are fixed, the electrode area can be controlled indirectly through the change in the electrode length, and the required capacitance value can be obtained. The present invention has another purpose. The flat-plate resistance is determined according to the following formula: I--I ...... I I--I 1_1. 4 ί In / --1 —i I— n ^ i \ -J, (Please read the back first (Notes for filling in this page)

V. Description of the invention (y) Λ7 B7 Printed by the Consumer Cooperative of the Central Standards Bureau of the Ministry of Economics, where p is the resistivity of the electrical layer, and L, W, and T are the length, width, and thickness of the conductive layer in order. In order to make the review committee better understand the foregoing objectives and the technical features of the present invention, detailed drawings are attached as follows: (~) Schematic part: The first figure: a block diagram of the process of the present invention. The second figures A to E are schematic diagrams of the process steps of the present invention. The third diagrams A to E are schematic diagrams of the process steps of the flat-type resistor of the present invention. The fourth figure is a schematic diagram of coating resin on a flat-plate resistor according to the present invention. Fifth figure: It is a schematic diagram of a plate capacitor formed by coating the resin according to the present invention. (2) Part of drawing: (1 0) Substrate (1 1) Substrate (12) (13) Copper layer (14) Conductive layer (121) (122) Finger electrode (123) (124) Partial copper layer ( 1 5) Resin (20) Photoresist (3 0) Image data (3 1) Zigzag segment R resistor C capacitor For the manufacturing steps of the present invention for making a flat capacitor resistor, please refer to the first figure, which includes There are steps such as "substrate production", "photoresist coating and image transfer", "image etching", "removing photoresist", "printing conductive layer" and "resin coating"; among them: For the steps of "substrate production", please Referring to the second figure A, the substrate (1 0) is the basic material of the flat-plate capacitor, which is mainly based on

R This paper size applies to Chinese National Standards (CNS) A4 specifications (210X297 mm) C Please read the notes on the back before writing Qin Gong) ί Packing, 1T 401728 A7 B7 Printed by Peigong Consumer Cooperative, Central Bureau of Standards, Ministry of Economic Affairs V. Description of the invention (the surface and bottom surface of the substrate (1 1) are formed separately—copper layer 3). "Photoresist coating and image transfer" steps: Please refer to the second figure B ', which is coated on the surface and bottom of the substrate (1 Q) with a photoresist (22) (ph〇t〇-resister) 'Then use the photomask to design the finished image material Π3 0) onto the photoresist (20)' and dissolve and remove the photoresist within the coverage of the image data (30). Please refer to Figure 3a for its cooperation. The image data (30) that is not transferred to the surface of the photoresist (20), the image data (30) is a cross-shaped frame composed of appropriate line widths, and the central part of the scale is a continuous and symmetrical meandering line segment (31), and the photoresist (2 ◦) located at the cross-line frame and the zigzag line segment (3 1) will be dissolved and removed. "Image etching" step: After transferring the image data (30) to the photoresist (20), the copper layer (丄 2) _ (1 3) covered by the image data (30) is etched, and the etching is performed. After the steps are completed, it is as shown in the second figure ^, and after the step of "removing the photoresist" is completed, it is as shown in the second figure D. The state of the surface of the substrate (10) is as shown in the third figure B. The foregoing steps follow the structure of the image data (30) to remove a portion of the copper layer (i2), and form two groups in the center of the substrate (10). Interdigitated finger electrodes (1 2 1) (12 2), in which a group of finger electrodes (121) are connected at opposite outer ends to a local copper layer (i 2 3) formed after etching, and another finger electrode (122) is isolated from another local copper layer (124) formed after a while. The fingers (121) and (122) that are interdigitated are arranged at equal intervals at the same interval, and two sets of electrodes (丄 2 丄 工 .n · I »-1 * ι.ί—!. ≪ 1A ± " 9 ^ 1 ^ 1 I— I n ml n ^ i In One OJt ^ ni \ ....... I * Two t— (Please read the precautions on the back before filling this page)

Pain printed by the Shellfish Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs 0ί788 Λ7 ~ ------------ B7 V. Description of the invention (") '-~-2 2) Injected into the adjacent gap For high-dielectric-constant materials, the two sets of electrodes (1 21) (122) are equidistantly intersected, and the arms are respectively formed by high-dielectric-constant materials-plate capacitors. As for the capacitance value of the capacitor, it is determined by the following formula: C = ex · ^ ·, where A = LX t — and the aforementioned ε is the dielectric coefficient of the high-dielectric constant material, A is the area of the flat-type valley, d is the distance between the electrodes, and B is the two sets of finger electrodes (121) (122) total length, t is the thickness (mii) of the electrode (12 workers) (1 2 2); under the condition that the dielectric constant and the thickness of the electrode (121) (122) are fixed, the electrode is changed The total length of (1H) (122), that is, the area of the control electrode (121) (122) can be gated, and then the required capacitance value can be obtained by the conversion of the foregoing formula. The image data (30) is also used to determine the resistance of the plate-type resistor. Predetermined position 'as shown in the third figure B' The resistance is predetermined between the finger electrode (1 2 2) and the local electrode (1 2 4), which will be printed with The method is to form a plate-type resistor. "Image name engraving" step: After transferring the image data (3 G) to the photoresist (2 0) ## For the copper layer (1 2) one (1 3) covered by the image data (3 ◦) ) Carry out the last name engraving, where the area covered by the photoresist (20) is as shown in the first figure C. After the etching step is completed, it is like the second figure. As shown in the figure, after the photoresist is removed from the base π, it is shown in the second figure. "Printing conductive layer" step: This step is to print a conductive paste with high resistivity at a specific position on the substrate (1 0) by a P brush method. This paper is suitable for Guanjia County --- I ---:- --- i--1_- 衣 __ (Please read the precautions on the back before filling this page),-* · Λ7 B7 Printed by the Staff Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs 4〇1728-V. Description of the invention ( (Even) Board resistors, as shown in the second figure E and the third figure 0, are based on a specific position (such as the image data (30) in the range of 1) i = type printed on-conductive layer (14 ), And the structure-the flat-type electric ancient eight layers (1 4) may be composed of tungsten metal with high electrical resistivity or rhenium phase. In this embodiment, the conductive layer (14) also constitutes a thunder pain local copper layer. (1 2 4) and the finger electrode (1 2 2), respectively, are electrically connected. As for the actual resistance value of the plate-type resistor, it can be obtained by the following formula: Α: (Τ) × Φ Wherein refers to the aforementioned conductive layer (1 4 ) Resistivity, L, w 2: Do not specify the length, width, and thickness of the lead ("). Therefore, the * line describes the" printing conductive layer "step You only need to control the conductive layer (14, length, width, and thickness to make a flat-plate resistor with the required resistance.… "Resin coating" step riding: mainly based on the coverage of image data (3Q) will be high dielectric The resin (i 5) is coated on the substrate (work 0) (as shown in the third figure), except that the resin (1 5) will cover the conductive layer (14) of the plate resistance (as shown in the fourth figure). (Shown), to prevent it from contacting with the air to change the resistance value, the resin (filling the adjacent gaps between the two sets of finger electrodes (1 2 1) (1 2 2) at 1 5 (as shown in the fifth figure)) , And two sets of crossed finger electrodes (丄 2 丄) (丄 2 2) respectively constitute a capacitor c through a resin (i 5) having a high dielectric constant, and the capacitance value is determined by the aforementioned formula c = e > < ^ decided. According to the aforementioned formula, the dielectric constant of the resin (i 5), the thickness of the electrodes (121), (122), and the adjacent spacing (! are set to a fixed value ---: ------ --- Install -------- Order (Please read the precautions on the back before filling this page)

L R = px 9 401728 Λ7 V. Description of the invention

Under the following conditions, such as the total length of the Hanbian electrode (2 workers) (^ I 1 2 2), the area of the electrode (; [2 i) (/ Λ -V ^ ^ ^ 丄 2 2) can be controlled indirectly, and then the aforementioned A-type exchange to obtain the required capacitance. By forming a flat-plate resistor with the printed circuit board at the same time, and connecting the substrate (10) gp-r to the PCB process such as pressing plate, drilling, etc., a built-in flat-plate mine can be formed. , ms: ΗΛ ^ ^ Α The printed circuit board of resistors and valley elements will help reduce the transmission voltage, parasitic inductance, and parasitic resistance on the transmission line, and k is a better signal transmission path. ^ Heat丨 Furthermore, it can effectively reduce the resistance and electricity provided on the surface of the printed circuit board. The number of times in Zhao County is 1 and the surface of the printed circuit board is released for electrical connection and miscellaneous values in Qigan a. 1 Said that transmission or other processing and function upgrades are used to form flat capacitors on the same H on the same substrate. In addition to being convenient for transportation, it can also effectively reduce material waste and reduce manufacturing costs.-^ Mv j- * I · I — N (谙 Please read the precautions on the back before filling in this page) Printing from the Central Laboratories of the Ministry of Economic Affairs, Shellfish Consumer Cooperatives. As can be seen from the above, the present invention uses a multi-layer substrate with ㈣ printing method to simultaneously form on the same-plane of the substrate. Flat resistors, capacitors, and Resistive, capacitive and other passive components are used in a large number of printed circuit boards, and the use of the present invention to build them in the substrate can significantly reduce the number of components on the surface of the printed circuit board. More space is released on the surface of the board. 'Power supply gas connection, signal transmission or other security, function upgrade applications, and at the same time, the reduction of materials is used to effectively reduce manufacturing costs. It can be seen that the present invention uses built-in resistors and capacitors. This method can effectively solve various problems caused by too high circuit density, so it already has a high degree of industrial use value and progress, and meets the requirements of invention patents, and filed an application according to law. Order ---- —-rose- -------- I 1-. · ______10 This paper size applies to China National Standard (CNS) A4 specification (2I0X297 mm)

Claims (1)

4〇i728 'The scope of patent applications includes: Patent Application No. 87117557, please amend the patent scope 1 ·-a method of manufacturing a built-in finger flat capacitor resistance㈡, which is formed by forming copper on the bottom surface of the insulating base material to constitute The first step of the substrate is a step of coating a photoresist on the substrate and performing image transfer.-The step of performing an image on the substrate, and respectively forming a parent finger electrode and a local copper layer of an appropriate area on the substrate; A photoresist removal step;-a step of printing a high-resistance conductive layer on the substrate to form a plate resistance;-coating a high-dielectric coefficient tree between the plate-type resistance and the interdigitated electrodes to isolate the interdigitated electrodes The step of forming a flat capacitor with a resin. 2 · Please refer to the method for manufacturing a built-in finger flat capacitor resistor as described in Item 丨 of the patent scope. 'The substrate of the substrate has a fixed dielectric constant and thickness, which can be controlled by controlling the length and width of the conductive layer. Obtain the required resistance. Please read back I Binding Line Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 3. The built-in finger flat-type electric valley resistors described in item 1 or 2 of the scope of patent application ^ Manufacturer ^ ㈡, this flat-type The resistance value is based on: ^ = = determines' where p is the resistivity of the electrical layer, and L, W, and D are the length, width, and thickness of the conductive layer, respectively. 4. According to the manufacturing method of the built-in finger flat capacitor resistance described in item 1 of the scope of the patent application, the capacitance of the flat capacitor is based on the formula: c = 8x_t A = LX t I Standard (CNS ί 4〇i728 'The scope of patent applications includes: Patent Application No. 87117557, please amend the patent scope 1 ·-a method of manufacturing a built-in finger flat capacitor resistance㈡, which is formed by forming copper on the bottom surface of the insulating base material to constitute The first step of the substrate is a step of coating a photoresist on the substrate and performing image transfer.-The step of performing an image on the substrate, and respectively forming a parent finger electrode and a local copper layer of an appropriate area on the substrate; A photoresist removal step;-a step of printing a high-resistance conductive layer on the substrate to form a plate resistance;-coating a high-dielectric coefficient tree between the plate-type resistance and the interdigitated electrodes to isolate the interdigitated electrodes The step of forming a flat capacitor with a resin. 2 · Please refer to the method for manufacturing a built-in finger flat capacitor resistor as described in Item 丨 of the patent scope. 'The substrate of the substrate has a fixed dielectric constant and thickness, which can be controlled by controlling the length and width of the conductive layer. Obtain the required resistance. Please read back I Binding Line Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 3. The built-in finger flat-type electric valley resistors described in item 1 or 2 of the scope of patent application ^ Manufacturer ^ ㈡, this flat-type The resistance value is based on: ^ = = determines' where p is the resistivity of the electrical layer, and L, W, and D are the length, width, and thickness of the conductive layer, respectively. 4. According to the manufacturing method of the built-in finger flat capacitor resistance described in item 1 of the scope of the patent application, the capacitance of the flat capacitor is based on the formula: c = 8x_t A = LX t I Standard (CNS ί A8, B8, C8, D8, patent application scope), where ε is the dielectric coefficient of the south dielectric coefficient resin, A is the area of the flat capacitor, and it fa is the distance between the private electrodes; where L is the finger electrode The total t is the thickness of the finger electrode. 5 #Manufacturing method of the built-in finger plate valley resistor described in item 1 or 2 of Zhongqing Patent Scope, the conductive layer on the substrate is made of metal or conductive Molecular structure. 6-A kind of built-in finger flat capacitor resistance ㈡, mainly on an insulating substrate surface Φ, the bottom surface is formed with alternating finger electrodes and a suitable area of copper layer X on the substrate at an appropriate position A conductive layer with a high resistivity is provided. The conductive layer is electrically connected to a portion of the copper layer to form a flat-plate resistance. The interdigitated electrodes are filled with a high-dielectric constant material, so that the electrodes are separated by a high Dielectric constant material forms flat capacitor 7. The built-in finger flat capacitor resistance 所述 described in item 6 of the scope of the patent application, the base material system, which has a fixed dielectric constant and thickness 纟 can control the length and width of the conductive layer to obtain the required resistance 8. The built-in finger flat capacitor resistance 所述 described in item 6 or 7 of the scope of patent application, the value of the flat resistance is determined according to: R = pxi = (f) x ($), Among them, p indicates the resistivity of the electrical layer, and L, W, and D are the length, width, and thickness of the conductive layer, respectively. 9. The built-in finger-shaped plate-type capacitor resistor 所述 described in item 6 of the scope of patent application, the plate-type The capacitance value of the capacitor is based on the formula: C = sx · ^ A = LX td The aforementioned ε is the dielectric constant of the high-dielectric constant material, and A is the flat-plate type _____ 12 This paper is in accordance with the standard, using China National Standards (CNS) A4 size (210X297mm) ^ ^-1 ^---(Please read the note on the back—item and then this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs «1 ^ 1 m ml ί ί 6. Scope of patent application mm area, d is the distance between the finger electrodes, where L is the total length of the finger electrodes, and t is the thickness of the finger electrodes. (Please read the precautions on the back before # this page) 1 〇. The built-in finger-shaped electric resistors as described in item 6 or 7 of the scope of patent application, the conductive layer is made of metal or conductive polymer Composition 〇11. The built-in finger flat-plate capacitor resistor described in item 6 of the scope of the patent application, the high dielectric constant material is coated on the finger-covered flat-plate resistor. Also 1 2. According to the built-in finger flat capacitor resistance described in item 8 of the scope of the patent application, the high-dielectric constant material is coated on the finger-covered flat resistance. Also 1. According to the built-in finger flat capacitor resistance ㈡ described in item 6 of the scope of patent application, the high dielectric constant material is resin. x 14. According to the built-in finger flat capacitor resistor 所述 described in item 11 of the scope of patent application, the high dielectric constant material is resin. 15. According to the built-in finger-type flat valley resistance (1) described in item 12 of the scope of patent application, the high dielectric constant material is a tree. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs-printed on paper