TWI222838B - Packaging method of organic electroluminescence light-emitting display device - Google Patents
Packaging method of organic electroluminescence light-emitting display device Download PDFInfo
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- TWI222838B TWI222838B TW090108558A TW90108558A TWI222838B TW I222838 B TWI222838 B TW I222838B TW 090108558 A TW090108558 A TW 090108558A TW 90108558 A TW90108558 A TW 90108558A TW I222838 B TWI222838 B TW I222838B
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- 238000005401 electroluminescence Methods 0.000 title abstract description 19
- 238000000034 method Methods 0.000 title description 6
- 238000004806 packaging method and process Methods 0.000 title description 4
- 239000011521 glass Substances 0.000 claims abstract description 27
- 239000000758 substrate Substances 0.000 claims abstract description 25
- 239000000463 material Substances 0.000 claims abstract description 19
- 229910052751 metal Inorganic materials 0.000 claims abstract description 8
- 239000002184 metal Substances 0.000 claims abstract description 8
- 239000010410 layer Substances 0.000 claims description 55
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 10
- 239000001301 oxygen Substances 0.000 claims description 10
- 229910052760 oxygen Inorganic materials 0.000 claims description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 10
- 239000000853 adhesive Substances 0.000 claims description 9
- 230000001070 adhesive effect Effects 0.000 claims description 9
- 238000001035 drying Methods 0.000 claims description 9
- 238000001179 sorption measurement Methods 0.000 claims description 9
- 239000011248 coating agent Substances 0.000 claims description 8
- 238000000576 coating method Methods 0.000 claims description 8
- 239000002131 composite material Substances 0.000 claims description 8
- 239000007789 gas Substances 0.000 claims description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 5
- 230000002209 hydrophobic effect Effects 0.000 claims description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 4
- 239000003292 glue Substances 0.000 claims description 4
- 239000012535 impurity Substances 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- 239000012790 adhesive layer Substances 0.000 claims description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 3
- 230000035699 permeability Effects 0.000 claims description 3
- 229910052814 silicon oxide Inorganic materials 0.000 claims 3
- ODINCKMPIJJUCX-UHFFFAOYSA-N Calcium oxide Chemical compound [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 claims 2
- 239000003463 adsorbent Substances 0.000 claims 1
- 230000007797 corrosion Effects 0.000 claims 1
- 238000005260 corrosion Methods 0.000 claims 1
- 150000002500 ions Chemical class 0.000 claims 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims 1
- 238000005538 encapsulation Methods 0.000 abstract 1
- 238000003475 lamination Methods 0.000 abstract 1
- 239000000565 sealant Substances 0.000 description 10
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Chemical compound [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 239000010408 film Substances 0.000 description 5
- 238000001764 infiltration Methods 0.000 description 5
- 230000008595 infiltration Effects 0.000 description 5
- 230000008901 benefit Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 239000011575 calcium Substances 0.000 description 2
- 229910052593 corundum Inorganic materials 0.000 description 2
- 238000001723 curing Methods 0.000 description 2
- 239000002274 desiccant Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000004575 stone Substances 0.000 description 2
- 229910001845 yogo sapphire Inorganic materials 0.000 description 2
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- 241001674048 Phthiraptera Species 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- YZCKVEUIGOORGS-NJFSPNSNSA-N Tritium Chemical compound [3H] YZCKVEUIGOORGS-NJFSPNSNSA-N 0.000 description 1
- 238000003848 UV Light-Curing Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 239000002305 electric material Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000004945 emulsification Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- 235000003642 hunger Nutrition 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000008267 milk Substances 0.000 description 1
- 210000004080 milk Anatomy 0.000 description 1
- 235000013336 milk Nutrition 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 238000010943 off-gassing Methods 0.000 description 1
- 239000012044 organic layer Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229910052702 rhenium Inorganic materials 0.000 description 1
- WUAPFZMCVAUBPE-UHFFFAOYSA-N rhenium atom Chemical compound [Re] WUAPFZMCVAUBPE-UHFFFAOYSA-N 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000009331 sowing Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000001356 surgical procedure Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229910052722 tritium Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/874—Passivation; Containers; Encapsulations including getter material or desiccant
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/917—Electroluminescent
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/23—Sheet including cover or casing
- Y10T428/239—Complete cover or casing
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
Description
12228381222838
本發明係有關於一種有機電激發光顯示元件,特別 '· 關於一種有機電激發光顯示元件的封裝方法。 、 / 電激發光(Electr〇-LUminescence,EL)顯示元件的發 光原理是於特定的螢光或填光體加上電流以使電能轉換^ 光能’而依據發光層所使用的材料不同,可以區分為有 EL顯示元件與無機EL顯示元件,其中有機乩顯示元件是 用有機薄膜積層型式’其具有面發光的薄型、量輕特徵以 及自發光的高發光效率、低驅動電壓等優點。但^隨^ 用時間增加,環境中的水氣與氧氣很容易滲入&機=顯示 元件中,使得陰極與有機發光層之間剝離與材料裂解、 極氧化,進而產生暗點(dark spot),這會大幅降低有機 EL顯示元件之發光強度、發光均勻度等發光品質。 一般而言,於有機EL顯示元件之玻璃基板上完成金 電極與有機發光體薄膜的蒸鍍製程之後,會以背蓋板封 玻,基板表面之元件。而且為了延長有機EL顯示元件的^ 用壽命,會另置入乾燥劑以吸附顯示元件内部之水分盥 質、外界滲入之水分與氧氣、因框膠之排氣(〇ut ”” gassing)現象所滲入之水氣等等。此外,為了進一步改盖 暗點的缺陷,習知發展出多種降低溼度的技術,例如··二 玻璃基板上直接塗佈光硬化樹脂、鑛上金屬氧化物、氣 φ 物、硫化物、t蓋防水性保護膜、採用密閉式背蓋板 等方法’㉟是仍發現漏電流、干擾、氧化物溶解等缺點。、 美國專利第5, 882, 76 1揭露一種有機既顯示元件,如第i 所示,一有機EL顯示元件1〇包含有一玻璃基板12,一由紫The present invention relates to an organic electroluminescent display element, and particularly to a packaging method of an organic electroluminescent display element. / / The principle of light emission of an Electro-Luminescence (EL) display element is to add electricity to a specific fluorescent or light-filling body to convert electrical energy ^ light energy ', depending on the materials used in the light-emitting layer, you can It is divided into EL display elements and inorganic EL display elements. Among them, organic rhenium display elements are laminated with organic thin films. They have the advantages of thin surface light, light weight, high light-emitting efficiency, low driving voltage, and other advantages. However, as the use time increases, water and oxygen in the environment can easily penetrate into the & display device, causing the separation between the cathode and the organic light-emitting layer, the material cracking, and extreme oxidation, thereby creating dark spots. This will greatly reduce the luminous quality such as the luminous intensity and luminous uniformity of the organic EL display element. Generally speaking, after the gold electrode and the organic light-emitting film are evaporated on the glass substrate of the organic EL display element, the element on the surface of the substrate is sealed with a back cover. In addition, in order to prolong the service life of organic EL display elements, a desiccant is added to absorb the moisture inside the display element, the moisture and oxygen infiltrating into the outside, and the gas out phenomenon caused by the frame adhesive. Infiltration of moisture and so on. In addition, in order to further correct the defects of the dark spots, many techniques have been developed to reduce humidity, such as direct coating of light-hardening resin on two glass substrates, metal oxides on the mine, gas φ, sulfide, and t-caps. Methods such as waterproof protective film and the use of a closed back cover are still found to be shortcomings such as leakage current, interference, and oxide dissolution. US Patent No. 5,882,76 1 discloses an organic display element. As shown in item i, an organic EL display element 10 includes a glass substrate 12 and a purple substrate.
1222838 五、發明說明(2) ^線(uv)硬化膠所構成之封膠層14係塗佈於玻璃基板12之 、=处’以及一背蓋板16係藉由封膠層14之黏著性以與玻 璃基板12之表面邊框處接合,進而封裝成 玻璃基板12表面上包含有一積層物20,係經由- 電 I:,背ί =光材料層Μ以及一陰極金屬層26所構成。 接板之底部内側壁上設置有一乾燥層28,豆盥 =物20之間隔著一内部空間18,並於内部空間 如:氧化鋇(Ba〇)、氧化曰H固物所構成,例 缺而水分並維持其本身之固體狀態。 (#封膠層所採用之訂硬化膠主要為環氧樹脂1222838 V. Description of the invention (2) ^ The sealant layer 14 made of uv-hardened glue is coated on the glass substrate 12 and the back cover 16 is adhered by the sealant layer 14 It is bonded to the surface frame of the glass substrate 12 and is then packaged to include a laminate 20 on the surface of the glass substrate 12. The layer 20 is formed by an electric material I: a light material layer M and a cathode metal layer 26. A drying layer 28 is provided on the inner side wall of the bottom of the splicing plate, and an inner space 18 is separated by the toilet bowl 20, and the inner space is composed of barium oxide (Ba0) and oxidized H solids. Moisture and maintain its own solid state. (#The sealant used in the sealant layer is mainly epoxy resin
28來阻擋水氣之滲入並益,因此僅藉由乾燥層 發光品質。若要解決之個^王確保有機以顯示元件1〇之 第-,更換封膠層須考慮下列兩種方法: 低水氣/氧氣穿透率的要托、,’二達到同時維持高黏著性與 玻璃轉換溫度、接觸角度上旦疋旦沈熱膨脹係數匹配性、 適的材質;第二,大量二萨里,至今尚無法研發出合 化鈣(Ca〇)的數量,以提Π無層28之氧化鋇⑽)、氧 經由實驗證實當乾燥層28门:;層28之水氣吸收量’但是 水氣;果便不會再增加,故=㈣,其吸附 有鐘於此,為了達到阻声 ;J^T 效果,本發明則提出—種“顯示:=== 0628-6045tw. 第5頁 1222838 五、發明說明(3) 解決習知所產 本發明提 玻璃基板,其 生的問題。 出一種有機電激發 層、一 物;一 層係塗 周邊; 框處接 本 之背蓋 底部, 設置於 邊框處 藉由黏 有機發 乾燥層 佈於該 表面上 光材料 係塗佈 玻璃基 元件,包括有: 係由一陽極導電 層所構成之積層 以及一背蓋板 光顯示 設有一發光元件, 層以及一陰極金屬 板表面之邊框處;一封膠 框處 係與該 於該玻璃基 板表面之邊 ,其邊框處 密閉空間。 種有機電激 且環繞該乾燥層之 玻璃基板之表面邊 合,以 發明提 板設計 且相對 該溝槽底部;一黏著層, ;以及 著層以 構成一 出另' 成具有: 應於該發光元件之 溝槽 一半透膜,為透水 固定並覆蓋住溝槽 發光顯示元件,係將上述 係位於該背蓋板之内側壁 位置;一疏水性塗層,係 係塗佈於該溝槽之開口的 氣但不透水份之材質,係 之開口處。 圖式簡單說明 第1圖係顯示習知有機EL顯示元件的剖面示意圖。 第2圖顯示本發明第一實施例之有機EL顯示元件的剖 面示意圖。 第3圖顯示本發明第二實施例之有機EL顯示元件的剖 面示意圖。 符號說明 有機EL顯示元件〜3〇、5〇 ; 玻璃基板〜32 ;28 to block the penetration of water vapor and benefit, so only the dry layer luminous quality. If you want to solve the problem, you must ensure that the display element is 10th, and you must consider the following two methods to replace the sealant layer: Low water vapor / oxygen transmission rate, and two, while maintaining high adhesion It is compatible with the thermal expansion coefficient of glass transition temperature and contact angle, and suitable materials. Second, a large number of Sarri, so far it has not been possible to develop the amount of calcium (Ca) to improve Barium oxide ⑽) and oxygen have been confirmed by experiments when the layer 28 is dried :; the moisture absorption of layer 28 ', but the moisture will not increase, so = ㈣, its adsorption is here, in order to achieve sound blocking ; J ^ T effect, the present invention proposes a kind of "display: === 0628-6045tw. Page 5 1222838 V. Description of the invention (3) To solve the problems caused by the conventionally produced glass substrate of the present invention. An organic electrical excitation layer, an object; one layer is coated on the periphery; the frame is connected to the bottom of the back cover, and is arranged at the frame by a dry organic layer on the surface. The light-emitting material is coated with glass-based elements, including: : Is a laminated layer composed of an anode conductive layer And a back cover light display is provided with a light emitting element, a layer and a frame on the surface of the cathode metal plate; a plastic frame is connected to the edge on the surface of the glass substrate, and the frame is in a closed space. The surface of the glass substrate that surrounds the dry layer is edge-bonded, designed with an inventive lift plate and opposite to the bottom of the groove; an adhesive layer; and a layer formed to form another one to have: should be half of the groove of the light-emitting element Permeable film is used to fix and cover the light-emitting display element of the groove. It is located on the inner side wall of the back cover. A hydrophobic coating is a gas but not water-permeable coating on the opening of the groove. The material is part of the opening. The diagram is briefly explained. The first diagram is a schematic sectional view showing a conventional organic EL display element. The second diagram is a schematic sectional view of an organic EL display element according to the first embodiment of the present invention. A schematic cross-sectional view of an organic EL display element according to a second embodiment of the present invention is shown. Symbol description Organic EL display elements ~ 30, 50; glass substrate ~ 32;
0628-6045tw.ptd 第6頁0628-6045tw.ptd Page 6
陽極導電層〜36 ; 陰極金屬層〜4 0 ; 月盍板〜4 4 ; 改良式背蓋板〜48 疏水性塗層〜54 ; 黏著層〜5 8。 發光元件〜3 4 ; 有機發光材料層〜38 ; 封膠層〜4 2 ; 乾燥層〜4 6 ; 溝槽〜52 ; 半透膜〜5 6 ; 第一實施例 示元^ = =2圖’其顯不本發明第一實施例之有機EL顯 璃某板32 ί面示意圖。一有機豇顯示元件30包含有-玻 電ί36、表面上包含有一發光元件34係經由一陽極導 之二戶物Ϊ機發光材料層38以及一陰極金屬層40所構成 ,巧層物,其中陽極導電層36主要採用銦錫氧化物 元η=Γϋη Gxide’ ITG)作為透明導電材質,而且發光 ::未顯二另外製作一電洞輸送層(未顯示)與-電子輸 邊框處,以形成一 iu係塗佈於玻璃基板32之最外圍 夾裎征私驻f #第一閉合迴線(closed lo〇p),主要用 板32二矣二t f ΐ性,則一背蓋板44之邊框處可盥破璃某 板32之表面邊框處接合 处圾螭基 中,背蓋板44係由工“:封,形成-個密閉空間。其 合物/銘金屬/聚合物//、玻璃或是積層膜板(如:聚 除此之外,-乾燥層46乳:/:堆積而成的模板)所構成。 位於封膠層42之内胃係塗佈於玻璃基板32之邊框處,並 阻播並吸附水氣、1^成H合迴線’主要用來 孔虱之滲入,且可提供部份之黏著性。Anode conductive layer ~ 36; Cathode metal layer ~ 40; Moon plate ~ 4 4; Improved back cover ~ 48 Hydrophobic coating ~ 54; Adhesive layer ~ 58. Light-emitting element ~ 3 4; Organic light-emitting material layer ~ 38; Sealing layer ~ 4 2; Drying layer ~ 4 6; Trench ~ 52; Semi-permeable membrane ~ 5 6; First embodiment element ^ == 2 图 '其FIG. 32 is a schematic diagram showing a certain surface of an organic EL display panel 32 according to the first embodiment of the present invention. An organic tritium display element 30 includes a glass bulb 36, a light-emitting element 34 on the surface, and a light-emitting material layer 38 and a cathode metal layer 40, which are formed by an anode. The conductive layer 36 mainly uses indium-tin oxide (η = Γϋη Gxide 'ITG) as a transparent conductive material, and emits light :: Not shown Secondly, a hole transport layer (not shown) and an electron transport frame are formed to form a iu is coated on the outermost periphery of the glass substrate 32. The first closed loop (closed loop) is used. The main use of the plate 32 is t2. The frame of the back cover 44 is The back cover 44 is sealed in the junk base at the joint of the surface frame of a certain plate 32. The back cover 44 is sealed to form a closed space. Its composition / Ming metal / polymer / / glass or Laminated film plate (such as: in addition to the-dry layer 46 milk: /: stacked template). It is located inside the sealant layer 42 and is coated on the frame of the glass substrate 32 and blocks it. Sowing and adsorbing water vapor, 1 ^ H loops are mainly used for the infiltration of hole lice, and can provide partial adhesion.
1222838 五、發明說明(5) 位於封膠層42之内圍,以形成一第二閉合迴線,主要用來 阻播並吸附水氣、氧氣之滲入,且可提供部份之黏著性。 第一閉合迴線之封膠層42係由紫外線硬化膠所構成, 其對金屬或玻璃皆具有極佳之接著性,故可以提供玻璃基 板32與背蓋板44之間的接合效果。第二閉合迴線之乾燥層 46的構成物包含有具有黏著性之紫外線硬化膠以及具有^ ,水氣、氧氣、雜質、溶質之複合材料,其中複合材料可 選用無機吸附材質或是有機吸附材質如:單聚體(m〇n〇1222838 V. Description of the invention (5) It is located inside the sealant layer 42 to form a second closed loop, which is mainly used to block and absorb the penetration of moisture and oxygen, and can provide partial adhesion. The sealant layer 42 of the first closed loop is made of ultraviolet curing adhesive, which has excellent adhesion to metal or glass, so it can provide the bonding effect between the glass substrate 32 and the back cover 44. The composition of the dry layer 46 of the second closed loop includes an adhesive UV-curing adhesive and a composite material having ^, moisture, oxygen, impurities, and solutes. The composite material may be an inorganic adsorption material or an organic adsorption material. Example: Monomer (m〇n〇
Polymer)、共聚體(copolymer)、semi-IPN 或 IPN 等。本發 明所選用之最佳吸附材質組合包含有矽(siHc〇n)、氧化又 銘(Al2〇3)、氧化#5(CaO)以及氧化石夕(si〇2)。 依據上述之有機EL顯示元件30,本^明之封裝方法 於製作完成發光元件34之後,可以利用喷塗、印刷或是其 他沉積技術在玻璃基板32之邊框處同時製作第一 _ 之封膠層42以及第二閉合迴線之乾燥層46,也可以脒 層42與乾燥層46製作在背蓋板44之内侧壁邊框處,铁^ 由背蓋板44封裝住玻璃基板32之表面元件。相較於習' = 術丄本發明可同時完成封膠層42與乾燥層46之塗佈牛 並省略乾燥劑之注入步驟,因此整個封裝步驟變得^ 易。其次,由於乾燥層46可以提供部份黏著性、阻夕、卜二 水氣與氧氣之滲入、吸收内部之雜質與溶質、;卜: 質之出氣現象所產生的問題,因此在省略乾;‘ :,?膠層42與乾燥層46之設計仍可以 以 著性與低水氣/氧氣穿透率的效果。 卞、、隹持冋黏Polymer), copolymer, semi-IPN, or IPN. The best combination of adsorption materials used in the present invention includes silicon (siHcon), oxide (Al2O3), oxide # 5 (CaO), and oxidized stone (si02). According to the organic EL display element 30 described above, after the light-emitting element 34 is manufactured by the packaging method of the present invention, the first sealant layer 42 can be simultaneously produced on the frame of the glass substrate 32 by spraying, printing, or other deposition techniques. And the dry layer 46 of the second closed loop line can also be made at the inner side wall frame of the back cover 44 with the dry layer 42 and the dry layer 46. The back cover 44 encapsulates the surface elements of the glass substrate 32. Compared with Xi '= surgery, the present invention can complete the coating of the sealant layer 42 and the drying layer 46 at the same time and omit the desiccant injection step, so the entire packaging step becomes easier. Secondly, because the dried layer 46 can provide partial adhesion, resistance to the infiltration, the infiltration of water and oxygen, absorption of impurities and solutes inside, and the problem caused by the phenomenon of outgassing, so the drying is omitted; ' :,? The design of the glue layer 42 and the drying layer 46 can still achieve the effect of low permeability and low water vapor / oxygen permeability.卞,, 隹
1222838 五、發明說明(6) 第二實施例 示元:二3面圖人其:示/發明第二實施例之有機EL顯 EL顯示元:二;:圖二為ΙΓΓ強第一實施例有機 示元件5。提供: = 本:月第二實施例之有舰顯 水氣的滲入。改? m “十,可以有效阻擋過多 52,係相對庫ίίί月盍板48之内側壁底部包含有一溝槽 -疏水性件34之位置’且溝槽52底部設置有 置有L -半透^ °另外’ &良式背蓋板48之内侧壁底部設 作不n ΐΐ mi~Permeable film)56,其採用透水氣 ΐ ί 2材質’可以藉由塗佈於溝槽52之開口邊框處 8來提供黏著性,以固定並覆蓋住溝槽ill ^ 來,有機EL顯示元件5〇内部之水氣可以穿诱 ί 進入溝槽52内,而溝槽52内的水氣报容易因疏 水性塗層54而凝結為水珠’至於這些水珠 56的不透水分性質而存留在溝抓内, ^ =顯 示元件50中。所以,改良式背荖 止冉-人ο入顯 層46所需吸附&皮$ $ #盍板48的設計可以分攤乾燥 二46:而及附的水軋’將有助於增加乾燥層 | 命。除此之外,如果塗佈於溝槽5 用; 58採用乾燥層46的材質,包含有紫外線硬化膠Γ者層 (silicon)、氧化銘(Al2〇3)、氧化舞 (Si〇2)等等,不但能提供半透 ^ 乳化石夕 提供極佳之水氣吸附性,便沪釣:之站者性,還可以 件5〇的使用壽命。 —步提昇有飢顯示元1222838 V. Description of the invention (6) Second embodiment indicator: two three-dimensional diagrams: display / invention of the organic EL display of the second embodiment EL display element: two; Element 5. Provide: = This: In the second embodiment of the month, there is the infiltration of water vapor into the ship. change? m "Ten, it can effectively block too much 52, because the bottom of the inner wall of the moon plate 48 contains a groove-the position of the hydrophobic member 34 'and the bottom of the groove 52 is provided with an L-semi-permeable ^ ° In addition '& The bottom of the inner wall of the good-type back cover 48 is not 不 mi ~ Permeable film) 56, which is made of water-permeable gas ΐ 2 material' can be provided by coating on the opening frame 8 of the groove 52 Adhesiveness, to fix and cover the groove ill ^, the moisture inside the organic EL display element 50 can penetrate into the groove 52, and the moisture in the groove 52 is easily caused by the hydrophobic coating 54 Condensed into waterdrops. As for the water-impermeable properties of these waterdrops 56, they remain in the grooves, ^ = in the display element 50. Therefore, the modified backstop Zhiran-human ο adsorption into the display layer 46 & Pi $$ # 盍 板 48 design can share drying two 46: and the attached hydro-rolling will help increase the drying layer | life. In addition, if coated in the groove 5 is used; 58 uses a drying layer The material of 46 includes ultraviolet curing glue (silicon), oxide (Al203), oxidation dance (Si〇2), etc. But it provides semipermeable ^ Xi provide excellent emulsification stone adsorption of water vapor, then Shanghai fishing: those of the station, also member of the life 5〇 - further enhance display elements have hunger.
1222838 五、發明說明(7) 雖然本發明已以較佳實施例揭露如上,然其並非用以 限定本發明,任何熟習此技藝者,在不脫離本發明之精神 和範圍内,當可作些許之更動與潤飾,因此本發明之保護 範圍當視後附之申請專利範圍所界定者為準。 ❹1222838 V. Description of the invention (7) Although the present invention has been disclosed as above with preferred embodiments, it is not intended to limit the present invention. Anyone skilled in the art can make some changes without departing from the spirit and scope of the present invention. Changes and retouching, therefore, the protection scope of the present invention shall be determined by the scope of the appended patent application. ❹
0628-6045tw.ptd 第10頁0628-6045tw.ptd Page 10
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JP3409764B2 (en) * | 1999-12-28 | 2003-05-26 | 日本電気株式会社 | Manufacturing method of organic EL display panel |
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2001
- 2001-04-10 TW TW090108558A patent/TWI222838B/en not_active IP Right Cessation
- 2001-10-02 US US09/970,068 patent/US6878467B2/en not_active Expired - Lifetime
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US6878467B2 (en) | 2005-04-12 |
US20020146533A1 (en) | 2002-10-10 |
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