CN1331237C - Active organic light emitting diode display and manufacturing method thereof - Google Patents
Active organic light emitting diode display and manufacturing method thereof Download PDFInfo
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- CN1331237C CN1331237C CNB021536775A CN02153677A CN1331237C CN 1331237 C CN1331237 C CN 1331237C CN B021536775 A CNB021536775 A CN B021536775A CN 02153677 A CN02153677 A CN 02153677A CN 1331237 C CN1331237 C CN 1331237C
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- display
- emitting diode
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 21
- 239000000758 substrate Substances 0.000 claims abstract description 77
- 239000000084 colloidal system Substances 0.000 claims abstract description 34
- 238000000034 method Methods 0.000 claims abstract description 24
- 239000000463 material Substances 0.000 claims description 13
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims description 7
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 claims description 7
- 238000005538 encapsulation Methods 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 238000004806 packaging method and process Methods 0.000 abstract description 8
- 239000004020 conductor Substances 0.000 description 11
- 239000010409 thin film Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 5
- 239000012780 transparent material Substances 0.000 description 4
- 230000003628 erosive effect Effects 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 229920001621 AMOLED Polymers 0.000 description 2
- 238000012536 packaging technology Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 235000013305 food Nutrition 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
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- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Led Device Packages (AREA)
Abstract
An active organic LED display and its manufacturing method, the method provides a substrate, wherein the substrate has a display area and a non-display area, and the display area of the substrate has several pixel structures. And forming several transparent wires connected electrically to the pixel structure on the substrate, wherein the transparent wires extend from the display area to the non-display area. And forming a photosensitive colloid around the display region on the substrate, and arranging a packaging cover above the substrate to cover the display region of the substrate, wherein the packaging cover is bonded with the substrate through the photosensitive colloid. Then, an irradiation step is performed from the back side of the substrate to solidify the photosensitive colloid. And finally, forming a driving chip in the non-display area on the substrate, wherein the driving chip is electrically connected with the pixel structure through a transparent conducting wire.
Description
Technical field
The invention relates to a kind of flat-panel screens and manufacture method thereof, and particularly relevant for a kind of active organic LED (Active Matrix Organic Light Emitting Diode, AMOLED) display and manufacture method thereof.
Background technology
Organic Light Emitting Diode is a kind of semiconductor element that converts electric energy to luminous energy and have high conversion efficiency, and common purposes is light-emitting component of indicator light, display floater and optical read/write head or the like.Because organic light-emitting diode element possesses some characteristics, as no visual angle, simple and easy, low-cost, the high answer speed of technology, serviceability temperature is in extensive range and full-colorization etc., meets the requirement of multimedia era display characteristics, has become the upsurge of research in recent years.
In positive development, it is to be formed with formation one organic luminous layer and a cathode layer on the substrate of thin film transistor (TFT) array to a kind of now active organic LED, and constitutes an active organic LED.Therefore active organic LED utilizes thin-film transistor with the driven for emitting lights diode element.And it is as described below about the manufacture method of known active organic LED display.
Shown in Figure 1, it is the schematic top plan view of a known active organic LED display; Fig. 2 is the generalized section of Fig. 1 by I-I '.
Please be simultaneously with reference to Fig. 1 and Fig. 2, the manufacture method of known active organic LED display at first provides a substrate 100, wherein substrate 100 has a viewing area 120 and a non-display area 122, and be formed with the dot structure 107 of several arrayed in the viewing area 120 of substrate 100, wherein each dot structure 107 comprises an active element (thin-film transistor) and an anode layer 102, a luminescent layer 104 and a cathode layer 106.
Wherein, each dot structure 107 is controlled by an one scan distribution (not illustrating) and a data wiring (not illustrating), and the scan wiring and the data wiring that are positioned at viewing area 120 2 edges can continue to extend to non-display area 120, and forming several outward extending plain conductors (fan-out) 108, it is to be used for electrically connecting with the follow-up chip for driving that is installed in the non-display area 122.
Afterwards, around the viewing area 120 of substrate 100, form a ultraviolet light colloid 112, and a cap 114 is set above substrate 100, substrate 100 and cap 114 are binded by ultraviolet light colloid 112.Then, substrate 100 is carried out a ultraviolet irradiation step 116, so that ultraviolet light colloid 112 solidifies.At last, installing one chip for driving 110 in the non-display area 122 on substrate 100, and electrically connect by plain conductor 108 between chip for driving 110 and the dot structure 107.
In known method, be used for making plain conductor 108 that dot structure 107 and chip for driving 110 electrically connect for the metal material of scan wiring and the identical material of data wiring.Therefore, follow-up in ultraviolet irradiation step 116, the ultraviolet light colloid 112 that disposes plain conductor 108 places can be covered by plain conductor 108, and makes ultraviolet light colloid 112 herein can't absorb ultraviolet light fully, so that ultraviolet light colloid 112 herein can't solidify completely.So, will directly to packaging effect negative effect be arranged, meaning is that aqueous vapor will be infiltrated display interior via uncured complete part easily, and then destroys the element of display interior.
Summary of the invention
Therefore, purpose of the present invention is providing a kind of active organic LED display and manufacture method thereof exactly, has the incomplete problem of encapsulation in known method and the structure to improve.
The present invention proposes a kind of manufacture method of active organic LED display, the method at first provides a substrate, wherein substrate has a viewing area and a non-display area, and be formed with the dot structure of several arrayed in the viewing area of substrate, and each dot structure comprises an active element (thin-film transistor) and an anode layer, a luminescent layer and a cathode layer.Then form several transparent leads in the non-display area on substrate, itself and dot structure electrically connect.Wherein, these several transparent lead can be to define simultaneously when forming the anode layer of dot structure.In the present invention, the material of transparent lead for example is electrically conducting transparent materials such as indium tin oxide or indium-zinc oxide.Continue it, be coated with a sensitive colloid around the viewing area of substrate, and a cap is set on substrate, wherein cap system covers the viewing area of substrate, and binds each other by sensitive colloid between cap and the substrate.Then, substrate is carried out an irradiation step, so that sensitive colloid is solidified.At last, installing one chip for driving in the non-display area on substrate wherein electrically connects by transparent lead between chip for driving and the dot structure again.
The present invention proposes a kind of active organic LED display, and it comprises a substrate, a chip for driving, several transparent leads, a cap and a sensitive colloid.Wherein, this substrate has a viewing area and a non-display area, and dispose the dot structure of several arrayed in the viewing area of this substrate, and each dot structure comprises an active element (thin-film transistor) and an anode layer, a luminescent layer and a cathode layer.Chip for driving is configured in the non-display area of substrate.And several transparent conductor configurations are on substrate, wherein transparent lead is to be extended to non-display area by the viewing area, and transparent lead and chip for driving and dot structure electrically connect, and the material of transparent lead for example is electrically conducting transparent materials such as indium tin oxide or indium-zinc oxide.In addition, cap is configured in the top of substrate, and covers the viewing area of substrate.Sensitive colloid then is around the viewing area that is configured on the substrate, in order to bind cap and substrate.
Because the lead that the present invention is used for dot structure and chip for driving are electrically connected is transparent lead, and be not to utilize plain conductor as known method, therefore active organic LED display of the present invention with and manufacture method can avoid known because of covering of plain conductor makes colloid can't completely crued problem.
Active organic LED display of the present invention with and manufacture method can improve the packaging effect of display, and make the element of display interior can not be subjected to the erosion of extraneous aqueous vapor.
Because the present invention can effectively improve the defective of active organic LED display packaging technology, therefore can promote the reliability of display integral body.
Description of drawings
Fig. 1 is the schematic top plan view of a known active organic LED display;
Fig. 2 is the generalized section of Fig. 1 by I-I ';
Fig. 3 is the schematic top plan view according to the active organic LED display of a preferred embodiment of the present invention; And
Fig. 4 is the generalized section of Fig. 3 by II-II '.
100: substrate
102: active element and anode layer
104: luminescent layer
106: cathode layer
107: dot structure
108: plain conductor
110: chip for driving
112: colloid
114: cap
116: UV-irradiation
120: the viewing area
122: non-display area
300: transparent lead
Embodiment
Fig. 3 is the schematic top plan view according to the active organic LED display of a preferred embodiment of the present invention; Fig. 4 is the generalized section of Fig. 3 by II-II '.
Please be simultaneously with reference to Fig. 3 and Fig. 4, the manufacture method of active organic LED display of the present invention at first provides a substrate 100, wherein substrate 100 has a viewing area 120 and a non-display area 122, and be formed with the dot structure 107 of several arrayed in the viewing area 120 of substrate 100, wherein each dot structure 107 comprises an active element (thin-film transistor) and an anode layer 102, a luminescent layer 104 and a cathode layer 106.
Particularly, in the anode layer 102 that forms dot structure 107, define several transparent leads 300 more simultaneously, wherein transparent lead 300 is to be extended to non-display area 120 by two edges of viewing area 120, and forms several outward extending leads (fan-out).The length of wherein transparent lead 300 is about about 2 centimetres to 4 centimetres, and it is to be used for electrically connecting with the follow-up chip for driving that is installed in the non-display area 122, so that the signal in the chip for driving can be passed in the dot structure 107.
And because transparent lead 300 and anode layer define simultaneously, therefore the material of transparent lead 300 is identical with the material of anode layer, and this material for example is electrically conducting transparent materials such as indium tin oxide or indium-zinc oxide.
Afterwards, locate to form a sensitive colloid 112 around the viewing area 120 on substrate 100, and a cap 114 is set, substrate 100 and cap 114 are binded by sensitive colloid 112 in the top of substrate 100.Wherein, cap 114 covers the viewing area 120 of substrate 100, avoids being subjected to the erosion of extraneous aqueous vapor in order to the element in the protection viewing area 120.And the material of cap 114 for example is a metal material or a glass material, in the present embodiment, preferably metal material, this is because the cost of manufacture of metallic packaging lid is lower, and is to use the metallic packaging lid mostly on the technology at present.In addition, sensitive colloid 112 for example is a ultraviolet light colloid.
After with cap 114 and substrate 100 bondings, then substrate 100 is carried out a ultraviolet irradiation step 116, so that sensitive colloid 112 is solidified.At this moment, owing to being a light-transmitting materials from dot structure 107 outward extending transparent leads 300, therefore in ultraviolet irradiation step 116 processes, the sensitive colloid 112 that is covered in by transparent lead 116 still can absorb ultraviolet light and full solidification fully.Therefore, the sensitive colloid after the curing 112 can provide excellent packaging effect.
At last, installing one chip for driving 110 wherein is to electrically connect by transparent lead 108 between chip for driving 110 and the dot structure 107 in the non-display area 122 on substrate 100.
Therefore, active organic LED display of the present invention comprises a substrate 100, a chip for driving 110, several transparent leads 300, a cap 114 and a sensitive colloid 112.
Wherein, substrate 100 has a viewing area 120 and a non-display area 122, and dispose the dot structure 107 of several arrayed in the viewing area 120 of this substrate 100, and each dot structure 107 comprises an active element (thin-film transistor) and an anode layer 102, a luminescent layer 104 and a cathode layer 106.Chip for driving 110 is configured in the non-display area 122 of substrate 100.And several transparent leads 300 are configured on the substrate 100, wherein transparent lead 300 is to be extended to non-display area 122 by viewing area 120, and transparent lead 300 is to electrically connect with chip for driving 110 and dot structure 107, and the material of transparent lead 300 for example is electrically conducting transparent materials such as indium tin oxide or indium-zinc oxide.
In addition, cap 114 is the top that is configured in substrate 100, and covers the viewing area 120 of substrate 100.Sensitive colloid 112 then be configured on the substrate 100 viewing area 120 around, in order to bind cap 114 and substrate 100.
What is particularly worth mentioning is that, the present invention can also be when forming transparent lead 300, in the non-display area 122 of substrate 100, define simultaneously a power line (not illustrating), this power line and dot structure 107 electrically connect, and its power supply that is used for an extraneous power supply unit is provided can be passed in the dot structure 107.
In addition, though the present invention is used for making chip for driving 110 higher than metal with the impedance of the transparent lead 300 (for example being indium tin oxide or indium-zinc oxide material) of dot structure 107 electric connections, but because general chip for driving 110 aquatic foods need big current flowing less, and the length of transparent lead 300 (by the distance of dot structure 107 to chip for driving 110) only has about 2 centimetres to 4 centimetres approximately, therefore very small for the influence that signal attenuation caused, and utilize the output signal voltage that promotes chip for driving 110 just can overcome said circumstances by way of compensation.
Comprehensive the above, the present invention has following advantages:
1. be transparent lead owing to the present invention is used for making dot structure and the lead that drives the chip electric connection, And be not to utilize plain conductor such as known method, active organic LED therefore of the present invention shows Device with and manufacture method can avoid known because of covering of plain conductor makes colloid can't be completely crued Problem.
Active organic LED display of the present invention with and manufacture method can improve demonstration The packaging effect of device, and make the element of display interior can not be subjected to the erosion of extraneous aqueous vapor.
3. because the present invention can effectively improve lacking of active organic LED display packaging technology Fall into, therefore can promote the reliability of display integral body.
Claims (11)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB021536775A CN1331237C (en) | 2002-12-03 | 2002-12-03 | Active organic light emitting diode display and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB021536775A CN1331237C (en) | 2002-12-03 | 2002-12-03 | Active organic light emitting diode display and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1505165A CN1505165A (en) | 2004-06-16 |
| CN1331237C true CN1331237C (en) | 2007-08-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB021536775A Expired - Lifetime CN1331237C (en) | 2002-12-03 | 2002-12-03 | Active organic light emitting diode display and manufacturing method thereof |
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| Country | Link |
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| CN (1) | CN1331237C (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100416851C (en) * | 2005-01-14 | 2008-09-03 | 铼宝科技股份有限公司 | Organic Electroluminescence Display Panel |
| CN100413042C (en) * | 2005-08-25 | 2008-08-20 | 矽格股份有限公司 | Method for packaging optical sensing semiconductor assembly |
| TWI458142B (en) * | 2011-05-16 | 2014-10-21 | Lextar Electronics Corp | Wire bonding structure |
| TWI472003B (en) | 2011-08-15 | 2015-02-01 | Au Optronics Corp | Display panel |
| CN103219474B (en) * | 2013-03-25 | 2016-03-23 | 京东方科技集团股份有限公司 | A kind of substrate packaging method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1312590A (en) * | 2000-02-01 | 2001-09-12 | 株式会社半导体能源研究所 | Semiconductor device and producing method thereof |
| CN1318870A (en) * | 2000-04-18 | 2001-10-24 | 株式会社半导体能源研究所 | Light-emitting device |
| JP2002151253A (en) * | 2000-08-18 | 2002-05-24 | Semiconductor Energy Lab Co Ltd | Light emitting device and display device |
| US20020146533A1 (en) * | 2001-04-10 | 2002-10-10 | Chi Mei Optoelectronics Corporation | Organic electro-luminescence element used in a display device |
-
2002
- 2002-12-03 CN CNB021536775A patent/CN1331237C/en not_active Expired - Lifetime
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1312590A (en) * | 2000-02-01 | 2001-09-12 | 株式会社半导体能源研究所 | Semiconductor device and producing method thereof |
| CN1318870A (en) * | 2000-04-18 | 2001-10-24 | 株式会社半导体能源研究所 | Light-emitting device |
| JP2002151253A (en) * | 2000-08-18 | 2002-05-24 | Semiconductor Energy Lab Co Ltd | Light emitting device and display device |
| US20020146533A1 (en) * | 2001-04-10 | 2002-10-10 | Chi Mei Optoelectronics Corporation | Organic electro-luminescence element used in a display device |
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| Publication number | Publication date |
|---|---|
| CN1505165A (en) | 2004-06-16 |
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Granted publication date: 20070808 |