TWD228655S - 用於半導體處理的處理套件的沉積環 - Google Patents
用於半導體處理的處理套件的沉積環 Download PDFInfo
- Publication number
- TWD228655S TWD228655S TW112300435F TW112300435F TWD228655S TW D228655 S TWD228655 S TW D228655S TW 112300435 F TW112300435 F TW 112300435F TW 112300435 F TW112300435 F TW 112300435F TW D228655 S TWD228655 S TW D228655S
- Authority
- TW
- Taiwan
- Prior art keywords
- semiconductor substrate
- substrate processing
- process kit
- deposition ring
- deposition
- Prior art date
Links
- 230000008021 deposition Effects 0.000 title abstract description 3
- 239000004065 semiconductor Substances 0.000 title abstract description 3
- 238000000034 method Methods 0.000 title description 2
- 239000000758 substrate Substances 0.000 title 1
Abstract
【物品用途】;本設計所請求之處理套件的沉積環係用於半導體處理。;【設計說明】;無。
Description
本設計所請求之處理套件的沉積環係用於半導體處理。
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US202229848746 | 2022-08-04 | ||
| US29/848,746 | 2022-08-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWD228655S true TWD228655S (zh) | 2023-11-21 |
Family
ID=86900371
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW112300435F TWD228655S (zh) | 2022-08-04 | 2023-02-03 | 用於半導體處理的處理套件的沉積環 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP1747763S (zh) |
| TW (1) | TWD228655S (zh) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD1064005S1 (en) | 2022-08-04 | 2025-02-25 | Applied Materials, Inc. | Grounding ring of a process kit for semiconductor substrate processing |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWD211225S (zh) | 2019-08-22 | 2021-05-01 | 荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 | 排氣管 |
-
2023
- 2023-02-03 TW TW112300435F patent/TWD228655S/zh unknown
- 2023-02-06 JP JP2023002016F patent/JP1747763S/ja active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWD211225S (zh) | 2019-08-22 | 2021-05-01 | 荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 | 排氣管 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP1747763S (ja) | 2023-06-30 |
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