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TWD226236S - 用於基板處理腔室的互鎖處理套件的支撐環 - Google Patents

用於基板處理腔室的互鎖處理套件的支撐環 Download PDF

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Publication number
TWD226236S
TWD226236S TW111304571F TW111304571F TWD226236S TW D226236 S TWD226236 S TW D226236S TW 111304571 F TW111304571 F TW 111304571F TW 111304571 F TW111304571 F TW 111304571F TW D226236 S TWD226236 S TW D226236S
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TW
Taiwan
Prior art keywords
substrate processing
support ring
processing chamber
process kit
interlocking process
Prior art date
Application number
TW111304571F
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English (en)
Inventor
薩希堤 納拉功達
強納森 賽門斯
黄昕暐
彼特 村岡
安德列亞斯 史密德
Original Assignee
美商應用材料股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 美商應用材料股份有限公司 filed Critical 美商應用材料股份有限公司
Publication of TWD226236S publication Critical patent/TWD226236S/zh

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Abstract

【物品用途】;本設計所請求之用於基板處理腔室的互鎖處理套件的支撐環係用於基板製程。;【設計說明】;無

Description

用於基板處理腔室的互鎖處理套件的支撐環
本設計所請求之用於基板處理腔室的互鎖處理套件的支撐環係用於基板製程。
TW111304571F 2022-03-18 2022-09-14 用於基板處理腔室的互鎖處理套件的支撐環 TWD226236S (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US29/831,297 USD1055006S1 (en) 2022-03-18 2022-03-18 Support ring for an interlocking process kit for a substrate processing chamber
US29/831,297 2022-03-18

Publications (1)

Publication Number Publication Date
TWD226236S true TWD226236S (zh) 2023-07-01

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW111304571F TWD226236S (zh) 2022-03-18 2022-09-14 用於基板處理腔室的互鎖處理套件的支撐環

Country Status (3)

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US (1) USD1055006S1 (zh)
JP (1) JP1734728S (zh)
TW (1) TWD226236S (zh)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD917825S1 (en) 2019-07-16 2021-04-27 Entegris, Inc. Wafer support ring

Family Cites Families (74)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD404372S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Ring for use in a semiconductor wafer heat processing apparatus
US6068548A (en) 1997-12-17 2000-05-30 Intel Corporation Mechanically stabilized retaining ring for chemical mechanical polishing
US6436228B1 (en) * 1998-05-15 2002-08-20 Applied Materials, Inc. Substrate retainer
US7252738B2 (en) * 2002-09-20 2007-08-07 Lam Research Corporation Apparatus for reducing polymer deposition on a substrate and substrate support
AU2003300375A1 (en) 2002-10-11 2004-05-04 Semplastics, L.L.C. Retaining ring for use on a carrier of a polishing apparatus
USD491963S1 (en) 2002-11-20 2004-06-22 Tokyo Electron Limited Inner wall shield for a process chamber for manufacturing semiconductors
WO2004053946A2 (en) * 2002-12-09 2004-06-24 Koninklijke Philips Electronics N.V. System and method for suppression of wafer temperature drift in cold-wall cvd system
US7029386B2 (en) 2004-06-10 2006-04-18 R & B Plastics, Inc. Retaining ring assembly for use in chemical mechanical polishing
TWD121115S1 (zh) * 2005-03-30 2008-01-21 東京威力科創股份有限公司 遮護環
USD559993S1 (en) * 2005-03-30 2008-01-15 Tokyo Electron Limited Cover ring
US7186171B2 (en) 2005-04-22 2007-03-06 Applied Materials, Inc. Composite retaining ring
US8617672B2 (en) * 2005-07-13 2013-12-31 Applied Materials, Inc. Localized surface annealing of components for substrate processing chambers
USD557226S1 (en) * 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD556704S1 (en) 2005-08-25 2007-12-04 Hitachi High-Technologies Corporation Grounded electrode for a plasma processing apparatus
US20070113783A1 (en) 2005-11-19 2007-05-24 Applied Materials, Inc. Band shield for substrate processing chamber
USD588078S1 (en) 2006-06-16 2009-03-10 Tokyo Electron Limited Heat dissipation deterrence link for semiconductor manufacture
US20090050272A1 (en) * 2007-08-24 2009-02-26 Applied Materials, Inc. Deposition ring and cover ring to extend process components life and performance for process chambers
USD599827S1 (en) * 2008-05-07 2009-09-08 Komatsu Ltd. Fan shroud for construction machinery
USD633991S1 (en) * 2008-11-26 2011-03-08 Nippon Valqua Industries, Ltd. Gate valve seal
USD655401S1 (en) * 2009-08-10 2012-03-06 Nippon Valqua Industries, Ltd. Hybrid seal member
US8298046B2 (en) 2009-10-21 2012-10-30 SPM Technology, Inc. Retaining rings
USD655797S1 (en) * 2010-03-24 2012-03-13 Nippon Valqua Industries, Ltd. Hybrid seal member
USD638522S1 (en) * 2010-07-20 2011-05-24 Wārtsilā Japan Ltd. Seal ring for stern tube
SG187625A1 (en) * 2010-08-20 2013-03-28 Applied Materials Inc Extended life deposition ring
US8491267B2 (en) * 2010-08-27 2013-07-23 Pratt & Whitney Canada Corp. Retaining ring arrangement for a rotary assembly
USD703160S1 (en) 2011-01-27 2014-04-22 Hitachi High-Technologies Corporation Grounded electrode for a plasma processing apparatus
US20120263569A1 (en) * 2011-04-14 2012-10-18 Scott Wayne Priddy Substrate holders and methods of substrate mounting
KR101317942B1 (ko) * 2013-03-13 2013-10-16 (주)테키스트 반도체 제조용 척의 에지링 냉각모듈
USD722966S1 (en) 2013-08-23 2015-02-24 Bridgeport Fittings, Inc. Split, non-metallic electrical insulating bushing
USD717746S1 (en) 2013-11-06 2014-11-18 Applied Materials, Inc. Lower chamber liner
USD783922S1 (en) * 2014-12-08 2017-04-11 Entegris, Inc. Wafer support ring
USD799690S1 (en) 2014-12-22 2017-10-10 Ebara Corporation Inner cylinder for exhaust gas treatment apparatus
USD767234S1 (en) * 2015-03-02 2016-09-20 Entegris, Inc. Wafer support ring
JP1546800S (zh) * 2015-06-12 2016-03-28
JP1546801S (zh) 2015-06-12 2016-03-28
JP1546799S (zh) 2015-06-12 2016-03-28
JP1545407S (zh) 2015-06-16 2016-03-14
JP1545406S (zh) 2015-06-16 2016-03-14
JP1564934S (zh) 2016-02-26 2016-12-05
JP1581911S (zh) * 2016-10-25 2017-07-24
JP1581994S (zh) * 2016-11-29 2017-07-24
JP1581995S (zh) * 2016-11-29 2017-07-24
MX2019014425A (es) * 2017-06-01 2020-02-10 Oerlikon Surface Solutions Ag Pfaeffikon Conjunto de blanco para la evaporación segura y económica de materiales frágiles.
JP1598984S (zh) * 2017-07-31 2018-03-05
USD895777S1 (en) * 2017-09-20 2020-09-08 Gardner Denver Petroleum Pumps Llc Header ring
USD871561S1 (en) * 2017-11-17 2019-12-31 Valqua, Ltd. Seal member for use in semiconductor production apparatus
JP1605779S (zh) 2017-12-19 2018-06-04
JP1605780S (zh) * 2017-12-19 2018-06-04
JP1612685S (zh) * 2018-02-08 2018-09-03
JP1612684S (zh) 2018-02-08 2018-09-03
USD888804S1 (en) 2018-05-04 2020-06-30 New Ideas Manufacturing LLC Step-up ring
US11201037B2 (en) 2018-05-28 2021-12-14 Applied Materials, Inc. Process kit with adjustable tuning ring for edge uniformity control
JP6859426B2 (ja) 2018-08-13 2021-04-14 ラム リサーチ コーポレーションLam Research Corporation エッジリングの位置決めおよびセンタリング機構を組み込んだプラズマシース調整のための交換可能および/または折りたたみ式エッジリングアセンブリ
USD909323S1 (en) * 2018-10-12 2021-02-02 Valqua, Ltd. Seal member for use in semiconductor production apparatus
JP1646504S (zh) * 2018-12-06 2019-11-25
JP1646505S (zh) * 2018-12-07 2019-11-25
JP1644757S (zh) 2018-12-14 2019-11-05
USD888903S1 (en) 2018-12-17 2020-06-30 Applied Materials, Inc. Deposition ring for physical vapor deposition chamber
USD891382S1 (en) 2019-02-08 2020-07-28 Applied Materials, Inc. Process shield for a substrate processing chamber
USD942516S1 (en) 2019-02-08 2022-02-01 Applied Materials, Inc. Process shield for a substrate processing chamber
USD933725S1 (en) * 2019-02-08 2021-10-19 Applied Materials, Inc. Deposition ring for a substrate processing chamber
JP1646366S (zh) 2019-03-19 2019-11-25
USD949116S1 (en) * 2019-05-03 2022-04-19 Lumileds Holding B.V. Flexible circuit board with connectors
JP2021012952A (ja) 2019-07-05 2021-02-04 東京エレクトロン株式会社 載置台、基板処理装置及び載置台の組立方法
JP1658652S (zh) * 2019-08-07 2020-04-27
USD931241S1 (en) 2019-08-28 2021-09-21 Applied Materials, Inc. Lower shield for a substrate processing chamber
JP1659287S (zh) 2019-10-18 2020-05-11
WO2021108178A1 (en) 2019-11-26 2021-06-03 Lam Research Corporation Carrier ring to pedestal kinematic mount for substrate processing tools
USD941371S1 (en) 2020-03-20 2022-01-18 Applied Materials, Inc. Process shield for a substrate processing chamber
USD934315S1 (en) * 2020-03-20 2021-10-26 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD941372S1 (en) 2020-03-20 2022-01-18 Applied Materials, Inc. Process shield for a substrate processing chamber
CN115398616A (zh) 2020-03-23 2022-11-25 朗姆研究公司 用于衬底处理系统的高精度边缘环对中
USD928591S1 (en) 2020-05-05 2021-08-24 Wade D. Morgan, Sr. Support ring for a water heater stand
USD933726S1 (en) * 2020-07-31 2021-10-19 Applied Materials, Inc. Deposition ring for a semiconductor processing chamber

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD917825S1 (en) 2019-07-16 2021-04-27 Entegris, Inc. Wafer support ring

Also Published As

Publication number Publication date
USD1055006S1 (en) 2024-12-24
JP1734728S (ja) 2023-01-17

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