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TWD219624S - Semiconductor module - Google Patents

Semiconductor module Download PDF

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Publication number
TWD219624S
TWD219624S TW110306704F TW110306704F TWD219624S TW D219624 S TWD219624 S TW D219624S TW 110306704 F TW110306704 F TW 110306704F TW 110306704 F TW110306704 F TW 110306704F TW D219624 S TWD219624 S TW D219624S
Authority
TW
Taiwan
Prior art keywords
semiconductor module
view
design
left view
symmetrical
Prior art date
Application number
TW110306704F
Other languages
Chinese (zh)
Inventor
中村翼
吉田大輝
小山貴裕
Original Assignee
日商富士電機股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商富士電機股份有限公司 filed Critical 日商富士電機股份有限公司
Publication of TWD219624S publication Critical patent/TWD219624S/en

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Abstract

【物品用途】;本設計係將安裝有功率半導體元件等的電路構成部件的電路基板等，收納至俯視呈矩形形狀的樹脂殼體內而構成的半導體模組。;【設計說明】;左側視圖與右側視圖相對稱，故省略左側視圖。【Use of article】;This design is a semiconductor module composed of a circuit board, etc., on which circuit components such as power semiconductor elements are mounted, housed in a resin case that is rectangular in plan view. ;[Design Note];The left view is symmetrical to the right view, so the left view is omitted.

Description

半導體模組semiconductor module

本設計係將安裝有功率半導體元件等的電路構成部件的電路基板等，收納至俯視呈矩形形狀的樹脂殼體內而構成的半導體模組。This design is a semiconductor module configured by accommodating a circuit board or the like on which circuit components such as power semiconductor elements are mounted in a resin case having a rectangular shape in plan view.

左側視圖與右側視圖相對稱，故省略左側視圖。The left side view is symmetrical with the right side view, so the left side view is omitted.

TW110306704F 2021-11-17 2021-12-09 Semiconductor module TWD219624S (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-025166 2021-11-17
JP2021025166F JP1713167S (en) 2021-11-17 2021-11-17 Semiconductor module

Publications (1)

Publication Number Publication Date
TWD219624S true TWD219624S (en) 2022-06-21

Family

ID=81209948

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110306704F TWD219624S (en) 2021-11-17 2021-12-09 Semiconductor module

Country Status (3)

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US (1) USD1037163S1 (en)
JP (1) JP1713167S (en)
TW (1) TWD219624S (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD194614S (en) 2017-08-08 2018-12-11 大陸商歐品電子（昆山）有限公司 Hybrid connector

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USD319425S (en) * 1989-06-23 1991-08-27 Whelen Technologies, Inc. Housing for an electronic power supply for warning lights
USD357672S (en) * 1993-09-16 1995-04-25 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
USD556686S1 (en) * 2006-04-27 2007-12-04 Hitachi, Ltd. Power module for power inverter
USD627299S1 (en) * 2009-07-29 2010-11-16 Tyco Electronics Japan G.K. Electrical connector
USD653634S1 (en) * 2010-10-28 2012-02-07 Fuji Electric Co., Ltd. Semiconductor
USD689446S1 (en) * 2010-10-28 2013-09-10 Fuji Electric Co., Ltd. Semiconductor
USD653633S1 (en) * 2010-12-14 2012-02-07 Fuji Electric Co., Ltd. Semiconductor
USD686174S1 (en) * 2011-08-12 2013-07-16 Fuji Electric Co., Ltd Semiconductor device
USD754084S1 (en) * 2013-08-21 2016-04-19 Mitsubishi Electric Corporation Semiconductor device
JP1536360S (en) * 2014-08-19 2015-10-26
JP1536359S (en) * 2014-08-19 2015-10-26
USD775593S1 (en) * 2014-08-19 2017-01-03 Infineon Technologies Ag Power semiconductor module
USD774479S1 (en) * 2014-11-28 2016-12-20 Fuji Electric Co., Ltd. Semiconductor module
USD772184S1 (en) * 2014-12-24 2016-11-22 Fuji Electric Co., Ltd. Semiconductor module
USD814431S1 (en) * 2015-05-15 2018-04-03 Mitsubishi Electric Corporation Power semiconductor device
USD799439S1 (en) * 2016-05-31 2017-10-10 Rohm Co., Ltd. Power converting semiconductor module
JP1578687S (en) * 2016-11-08 2017-06-12
US10002796B1 (en) * 2016-12-15 2018-06-19 Taiwan Semiconductor Manufacturing Co., Ltd. Dual epitaxial growth process for semiconductor device
JP1598442S (en) * 2017-08-09 2018-02-26
USD864884S1 (en) * 2017-10-23 2019-10-29 Mitsubishi Electric Corporation Semiconductor device
JP1650295S (en) * 2019-01-11 2020-01-20 semiconductor module
JP1649258S (en) * 2019-01-11 2022-12-21 semiconductor module
JP1644633S (en) * 2019-03-26 2019-11-05
USD903611S1 (en) * 2019-03-29 2020-12-01 Mitsubishi Electric Corporation Semiconductor device
JP1656709S (en) * 2019-05-31 2020-04-06
TWD206651S (en) * 2020-04-24 2020-08-21 財團法人工業技術研究院 Power module
JP7577948B2 (en) * 2020-09-15 2024-11-06 富士電機株式会社 Cooler and semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD194614S (en) 2017-08-08 2018-12-11 大陸商歐品電子（昆山）有限公司 Hybrid connector

Also Published As

Publication number Publication date
JP1713167S (en) 2022-04-21
USD1037163S1 (en) 2024-07-30

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