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JP1713167S - Semiconductor module - Google Patents

Semiconductor module

Info

Publication number
JP1713167S
JP1713167S JP2021025166F JP2021025166F JP1713167S JP 1713167 S JP1713167 S JP 1713167S JP 2021025166 F JP2021025166 F JP 2021025166F JP 2021025166 F JP2021025166 F JP 2021025166F JP 1713167 S JP1713167 S JP 1713167S
Authority
JP
Japan
Prior art keywords
semiconductor module
article
plan
storing
rectangular shape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2021025166F
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2021025166F priority Critical patent/JP1713167S/en
Priority to US29/818,441 priority patent/USD1037163S1/en
Priority to TW110306704F priority patent/TWD219624S/en
Application granted granted Critical
Publication of JP1713167S publication Critical patent/JP1713167S/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Abstract

本物品は、パワー半導体素子等の回路構成部品が実装された回路基板等を、平面視矩形状の樹脂ケース内に格納して構成された半導体モジュールである。This article is a semiconductor module configured by storing a circuit board or the like on which circuit components such as power semiconductor elements are mounted in a resin case having a rectangular shape in a plan view.

JP2021025166F 2021-11-17 2021-11-17 Semiconductor module Active JP1713167S (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2021025166F JP1713167S (en) 2021-11-17 2021-11-17 Semiconductor module
US29/818,441 USD1037163S1 (en) 2021-11-17 2021-12-08 Semiconductor module
TW110306704F TWD219624S (en) 2021-11-17 2021-12-09 Semiconductor module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021025166F JP1713167S (en) 2021-11-17 2021-11-17 Semiconductor module

Publications (1)

Publication Number Publication Date
JP1713167S true JP1713167S (en) 2022-04-21

Family

ID=81209948

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021025166F Active JP1713167S (en) 2021-11-17 2021-11-17 Semiconductor module

Country Status (3)

Country Link
US (1) USD1037163S1 (en)
JP (1) JP1713167S (en)
TW (1) TWD219624S (en)

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD319425S (en) * 1989-06-23 1991-08-27 Whelen Technologies, Inc. Housing for an electronic power supply for warning lights
USD357672S (en) * 1993-09-16 1995-04-25 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
USD556686S1 (en) * 2006-04-27 2007-12-04 Hitachi, Ltd. Power module for power inverter
USD627299S1 (en) * 2009-07-29 2010-11-16 Tyco Electronics Japan G.K. Electrical connector
USD653634S1 (en) * 2010-10-28 2012-02-07 Fuji Electric Co., Ltd. Semiconductor
USD689446S1 (en) * 2010-10-28 2013-09-10 Fuji Electric Co., Ltd. Semiconductor
USD653633S1 (en) * 2010-12-14 2012-02-07 Fuji Electric Co., Ltd. Semiconductor
USD686174S1 (en) * 2011-08-12 2013-07-16 Fuji Electric Co., Ltd Semiconductor device
USD754084S1 (en) * 2013-08-21 2016-04-19 Mitsubishi Electric Corporation Semiconductor device
JP1536360S (en) * 2014-08-19 2015-10-26
JP1536359S (en) * 2014-08-19 2015-10-26
USD775593S1 (en) * 2014-08-19 2017-01-03 Infineon Technologies Ag Power semiconductor module
USD774479S1 (en) * 2014-11-28 2016-12-20 Fuji Electric Co., Ltd. Semiconductor module
USD772184S1 (en) * 2014-12-24 2016-11-22 Fuji Electric Co., Ltd. Semiconductor module
USD814431S1 (en) * 2015-05-15 2018-04-03 Mitsubishi Electric Corporation Power semiconductor device
USD799439S1 (en) * 2016-05-31 2017-10-10 Rohm Co., Ltd. Power converting semiconductor module
JP1578687S (en) * 2016-11-08 2017-06-12
US10002796B1 (en) * 2016-12-15 2018-06-19 Taiwan Semiconductor Manufacturing Co., Ltd. Dual epitaxial growth process for semiconductor device
TWD194614S (en) 2017-08-08 2018-12-11 大陸商歐品電子（昆山）有限公司 Hybrid connector
JP1598442S (en) * 2017-08-09 2018-02-26
USD864884S1 (en) * 2017-10-23 2019-10-29 Mitsubishi Electric Corporation Semiconductor device
JP1650295S (en) * 2019-01-11 2020-01-20 semiconductor module
JP1649258S (en) * 2019-01-11 2022-12-21 semiconductor module
JP1644633S (en) * 2019-03-26 2019-11-05
USD903611S1 (en) * 2019-03-29 2020-12-01 Mitsubishi Electric Corporation Semiconductor device
JP1656709S (en) * 2019-05-31 2020-04-06
TWD206651S (en) * 2020-04-24 2020-08-21 財團法人工業技術研究院 Power module
JP7577948B2 (en) * 2020-09-15 2024-11-06 富士電機株式会社 Cooler and semiconductor device

Also Published As

Publication number Publication date
TWD219624S (en) 2022-06-21
USD1037163S1 (en) 2024-07-30

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