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TWD188043S - Light emitting diode package - Google Patents

Light emitting diode package

Info

Publication number
TWD188043S
TWD188043S TW105305761F TW105305761F TWD188043S TW D188043 S TWD188043 S TW D188043S TW 105305761 F TW105305761 F TW 105305761F TW 105305761 F TW105305761 F TW 105305761F TW D188043 S TWD188043 S TW D188043S
Authority
TW
Taiwan
Prior art keywords
emitting diode
design
diode package
light emitting
parts
Prior art date
Application number
TW105305761F
Other languages
Chinese (zh)
Inventor
劉顓籲
詹勳賢
曾春銘
吳囿蓉
林育鋒
Original Assignee
新世紀光電股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 新世紀光電股份有限公司 filed Critical 新世紀光電股份有限公司
Priority to TW105305761F priority Critical patent/TWD188043S/en
Priority to US29/598,778 priority patent/USD825499S1/en
Publication of TWD188043S publication Critical patent/TWD188043S/en
Priority to US29/638,942 priority patent/USD843957S1/en

Links

Abstract

【物品用途】;本設計是一種發光二極體封裝，用於提供照明。;【設計說明】;本設計之設計特點在於封裝基板頂部的晶粒及封裝膠體的形狀。圖式所揭露之虛線部分，為本案不主張設計之部分。【Item Usage】;This design is a light-emitting diode package used to provide lighting. ;[Design Description];The design feature of this design lies in the shape of the die and packaging colloid on the top of the packaging substrate. The dotted line parts revealed in the diagram are the parts that are not designed in this case.

Description

發光二極體封裝LED package

本設計是一種發光二極體封裝，用於提供照明。This design is a light emitting diode package for providing illumination.

本設計之設計特點在於封裝基板頂部的晶粒及封裝膠體的形狀。圖式所揭露之虛線部分，為本案不主張設計之部分。The design features of this design are the shape of the die on the top of the package substrate and the encapsulant. The dotted line section disclosed in the figure is not part of the design of this case.

TW105305761F 2016-09-29 2016-09-29 Light emitting diode package TWD188043S (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW105305761F TWD188043S (en) 2016-09-29 2016-09-29 Light emitting diode package
US29/598,778 USD825499S1 (en) 2016-09-29 2017-03-28 Light emitting diode package
US29/638,942 USD843957S1 (en) 2016-09-29 2018-03-02 Light emitting diode package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW105305761F TWD188043S (en) 2016-09-29 2016-09-29 Light emitting diode package

Publications (1)

Publication Number Publication Date
TWD188043S true TWD188043S (en) 2018-01-21

Family

ID=63079169

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105305761F TWD188043S (en) 2016-09-29 2016-09-29 Light emitting diode package

Country Status (2)

Country Link
US (2) USD825499S1 (en)
TW (1) TWD188043S (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1036711S1 (en) 2022-02-17 2024-07-23 Creeled, Inc. Light-emitting diode package
USD1060278S1 (en) 2022-03-09 2025-02-04 Creeled, Inc. Light-emitting diode package

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD188042S (en) 2016-09-29 2018-01-21 新世紀光電股份有限公司 Portion of light emitting diode package
TWD186014S (en) * 2016-09-29 2017-10-11 新世紀光電股份有限公司 Portion of light emitting diode module
TWD188043S (en) * 2016-09-29 2018-01-21 新世紀光電股份有限公司 Light emitting diode package
USD892068S1 (en) * 2018-04-13 2020-08-04 Seoul Semiconductor Co., Ltd. Light emitting diode package
USD892067S1 (en) * 2018-04-13 2020-08-04 Seoul Semiconductor Co., Ltd. Light emitting diode package
USD889421S1 (en) * 2018-04-13 2020-07-07 Seoul Semiconductor Co., Ltd. Light emitting diode package
USD919582S1 (en) * 2018-04-13 2021-05-18 Seoul Semiconductor Co., Ltd. Light emitting diode package
USD889422S1 (en) * 2018-04-13 2020-07-07 Seoul Semiconductor Co., Ltd. Light emitting diode package
USD881142S1 (en) * 2018-10-12 2020-04-14 Seoul Semiconductor Co., Ltd. Light emitting diode package
USD881143S1 (en) * 2018-10-12 2020-04-14 Seoul Semiconductor Co., Ltd. Light emitting diode package
USD894853S1 (en) * 2018-10-12 2020-09-01 Seoul Semiconductor Co., Ltd. Light emitting diode package

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USD749051S1 (en) 2012-05-31 2016-02-09 Cree, Inc. Light emitting diode (LED) package
USD772181S1 (en) 2015-04-02 2016-11-22 Genesis Photonics Inc. Light emitting diode package substrate

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USD510913S1 (en) 2003-09-09 2005-10-25 Nichia Corporation Light emitting diode
USD570506S1 (en) * 2006-06-20 2008-06-03 Matsushita Electric Industrial Co., Ltd. Lighting apparatus
USD565515S1 (en) 2007-04-18 2008-04-01 Edison Opto Corporation Light emitting diode assembly for linear illumination
USD619975S1 (en) * 2009-04-08 2010-07-20 Nichia Corporation Light emitting diode module
TWD140184S1 (en) * 2010-01-21 2011-04-21 億光電子工業股份有限公司 Led device
JP2011204376A (en) * 2010-03-24 2011-10-13 Stanley Electric Co Ltd Semiconductor light-emitting device
TWD141209S1 (en) * 2010-07-30 2011-06-21 億光電子工業股份有限公司 Light emitting diode
TWD141210S1 (en) * 2010-07-30 2011-06-21 億光電子工業股份有限公司 Light emitting diode
TWD141208S1 (en) * 2010-07-30 2011-06-21 億光電子工業股份有限公司 Light emitting diode
EP2447595B1 (en) * 2010-10-27 2017-08-02 LG Innotek Co., Ltd. Light emitting module
EP2448028B1 (en) * 2010-10-29 2017-05-31 Nichia Corporation Light emitting apparatus and production method thereof
CN102468375B (en) * 2010-11-15 2015-06-17 光宝电子(广州)有限公司 Light-emitting diode packaging structure and manufacturing method thereof
TWD146480S (en) 2011-01-24 2012-04-11 旭麗電子（廣州）有限公司 LED package
USD671674S1 (en) * 2012-02-23 2012-11-27 Wooree Lighting Co., Ltd. LED lamp
US9515055B2 (en) * 2012-05-14 2016-12-06 Cree, Inc. Light emitting devices including multiple anodes and cathodes
TWD161897S (en) 2013-02-08 2014-07-21 晶元光電股份有限公司 Portion of light-emitting diode
USD764424S1 (en) 2014-05-15 2016-08-23 Kabushiki Kaisha Toshiba Substrate for an electronic circuit
TWD174129S (en) 2014-06-17 2016-03-01 晶元光電股份有限公司 Portion of light-emitting diode
TWI657597B (en) * 2015-03-18 2019-04-21 新世紀光電股份有限公司 Edge lighting light emitting diode structure and method of manufacturing the same
USD761214S1 (en) * 2015-04-02 2016-07-12 Genesis Photonics Inc. Light emitting diode package
USD761213S1 (en) * 2015-04-02 2016-07-12 Genesis Photonics Inc. Light emitting diode module
TWD174515S (en) 2015-04-02 2016-03-21 新世紀光電股份有限公司 Portion of light emitting diode package substrate
TWD173073S (en) 2015-04-02 2016-01-11 新世紀光電股份有限公司 Portion of light emitting diode package
USD762596S1 (en) * 2015-04-02 2016-08-02 Genesis Photonics Inc. Light emitting diode package substrate
TWD176421S (en) 2015-04-02 2016-06-11 新世紀光電股份有限公司 Portion of light emitting diode package substrate
TWD188043S (en) * 2016-09-29 2018-01-21 新世紀光電股份有限公司 Light emitting diode package
CN108269899B (en) * 2016-12-30 2020-06-05 光宝光电(常州)有限公司 Light emitting diode package structure and manufacturing method thereof

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD749051S1 (en) 2012-05-31 2016-02-09 Cree, Inc. Light emitting diode (LED) package
USD772181S1 (en) 2015-04-02 2016-11-22 Genesis Photonics Inc. Light emitting diode package substrate

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1036711S1 (en) 2022-02-17 2024-07-23 Creeled, Inc. Light-emitting diode package
USD1060278S1 (en) 2022-03-09 2025-02-04 Creeled, Inc. Light-emitting diode package

Also Published As

Publication number Publication date
USD825499S1 (en) 2018-08-14
USD843957S1 (en) 2019-03-26

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