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TWD188042S - Portion of light emitting diode package - Google Patents

Portion of light emitting diode package

Info

Publication number
TWD188042S
TWD188042S TW105305755F TW105305755F TWD188042S TW D188042 S TWD188042 S TW D188042S TW 105305755 F TW105305755 F TW 105305755F TW 105305755 F TW105305755 F TW 105305755F TW D188042 S TWD188042 S TW D188042S
Authority
TW
Taiwan
Prior art keywords
design
emitting diode
diode package
light emitting
packaging colloid
Prior art date
Application number
TW105305755F
Other languages
Chinese (zh)
Inventor
李皓鈞
詹勳賢
林育鋒
Original Assignee
新世紀光電股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 新世紀光電股份有限公司 filed Critical 新世紀光電股份有限公司
Priority to TW105305755F priority Critical patent/TWD188042S/en
Priority to US29/598,780 priority patent/USD854195S1/en
Publication of TWD188042S publication Critical patent/TWD188042S/en

Links

Abstract

【物品用途】;本設計是一種用於照明設備的發光二極體封裝體。;【設計說明】;本設計之設計特點在於物品之部分的形狀。圖式所揭露之虛線部分，為本案不主張設計之部分。;本設計的發光二極體封裝體包括晶粒以及封裝膠體，其中所述封裝膠體呈現外圍隆起而中央平坦的造型，所述晶粒配置於所述封裝膠體的平坦區域。[Use of item]; This design is a light-emitting diode package used in lighting equipment. ;[Design Description];The design feature of this design lies in the shape of the part of the object. The dotted line parts revealed in the diagram are the parts for which design is not advocated in this case. ; The light-emitting diode package of this design includes a chip and a packaging colloid, wherein the packaging colloid has a convex periphery and a flat center shape, and the chip is arranged in the flat area of the packaging colloid.

Description

發光二極體封裝體之部分Part of a light-emitting diode package

本設計是一種用於照明設備的發光二極體封裝體。The design is a light emitting diode package for a lighting device.

本設計之設計特點在於物品之部分的形狀。圖式所揭露之虛線部分，為本案不主張設計之部分。The design of this design is characterized by the shape of the part of the item. The dotted line section disclosed in the figure is not part of the design of this case.

本設計的發光二極體封裝體包括晶粒以及封裝膠體，其中所述封裝膠體呈現外圍隆起而中央平坦的造型，所述晶粒配置於所述封裝膠體的平坦區域。The LED package of the present invention comprises a die and an encapsulant, wherein the encapsulant exhibits a peripheral ridge and a central flat shape, and the die is disposed in a flat region of the encapsulant.

TW105305755F 2016-09-29 2016-09-29 Portion of light emitting diode package TWD188042S (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW105305755F TWD188042S (en) 2016-09-29 2016-09-29 Portion of light emitting diode package
US29/598,780 USD854195S1 (en) 2016-09-29 2017-03-29 Light emitting diode package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW105305755F TWD188042S (en) 2016-09-29 2016-09-29 Portion of light emitting diode package

Publications (1)

Publication Number Publication Date
TWD188042S true TWD188042S (en) 2018-01-21

Family

ID=67184103

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105305755F TWD188042S (en) 2016-09-29 2016-09-29 Portion of light emitting diode package

Country Status (2)

Country Link
US (1) USD854195S1 (en)
TW (1) TWD188042S (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD889027S1 (en) * 2018-07-31 2020-06-30 Lumenpulse Group Inc/Groupe Lumenpulse Inc. Luminaire
USD889026S1 (en) * 2018-07-31 2020-06-30 Lumenpulse Group Inc./Group Lumenpulse Inc. Luminaire
USD889028S1 (en) * 2018-07-31 2020-06-30 Lumenpulse Group Inc./Groupe Lumenpulse Inc. Luminaire
US11713873B2 (en) 2019-04-15 2023-08-01 Project Light, Llc Lighted mirror assembly
USD1018071S1 (en) * 2019-12-23 2024-03-19 Project Light Inc. Lighted mirror assembly
USD954320S1 (en) * 2020-11-05 2022-06-07 Siser NA Heated light pad
USD1052791S1 (en) * 2021-12-31 2024-11-26 Foshan Nationstar Optoelectronics Co., Ltd. Light emitting diode lead-frame

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD522466S1 (en) 2003-09-09 2006-06-06 Nichia Corporation Light emitting diode

Family Cites Families (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005086229A1 (en) 2004-03-05 2005-09-15 Neomax Materials Co., Ltd. Light transmitting window member, semiconductor package provided with light transmitting window member and method for manufacturing light transmitting window member
JP4547569B2 (en) 2004-08-31 2010-09-22 スタンレー電気株式会社 Surface mount type LED
USD570506S1 (en) 2006-06-20 2008-06-03 Matsushita Electric Industrial Co., Ltd. Lighting apparatus
USD575245S1 (en) 2007-04-24 2008-08-19 Edison Opto Corporation Matrix type light emitting diode assembly
TWM327545U (en) 2007-07-09 2008-02-21 Everlight Electronics Co Ltd Improved light-emitting diode packaging structure
USD634863S1 (en) * 2008-01-10 2011-03-22 Cree Hong Kong Limited Light source of light emitting diode
US8531126B2 (en) 2008-02-13 2013-09-10 Canon Components, Inc. White light emitting apparatus and line illuminator using the same in image reading apparatus
USD619975S1 (en) 2009-04-08 2010-07-20 Nichia Corporation Light emitting diode module
USD625694S1 (en) 2009-07-14 2010-10-19 Toshiba Lighting & Technology Corporation Light emitting diode module
USD611436S1 (en) 2009-08-16 2010-03-09 Edison Opto Corporation Planar illuminating LED module
TWD140184S1 (en) 2010-01-21 2011-04-21 億光電子工業股份有限公司 Led device
US20110186874A1 (en) 2010-02-03 2011-08-04 Soraa, Inc. White Light Apparatus and Method
JP2011204376A (en) 2010-03-24 2011-10-13 Stanley Electric Co Ltd Semiconductor light-emitting device
USD665519S1 (en) 2010-06-22 2012-08-14 Toshiba Lighting & Technology Corporation Light emitting diode module
TWD141210S1 (en) 2010-07-30 2011-06-21 億光電子工業股份有限公司 Light emitting diode
TWD141208S1 (en) 2010-07-30 2011-06-21 億光電子工業股份有限公司 Light emitting diode
TWD141207S1 (en) 2010-07-30 2011-06-21 億光電子工業股份有限公司 Light emitting diode
TWD141209S1 (en) 2010-07-30 2011-06-21 億光電子工業股份有限公司 Light emitting diode
USD647492S1 (en) 2010-08-19 2011-10-25 Citizen Electronics Co., Ltd. Light-emitting diode
EP2447595B1 (en) 2010-10-27 2017-08-02 LG Innotek Co., Ltd. Light emitting module
EP2448028B1 (en) 2010-10-29 2017-05-31 Nichia Corporation Light emitting apparatus and production method thereof
CN102468375B (en) 2010-11-15 2015-06-17 光宝电子(广州)有限公司 Light-emitting diode packaging structure and manufacturing method thereof
US8878221B2 (en) 2011-08-19 2014-11-04 Lg Innotex Co., Ltd. Light emitting module
USD667145S1 (en) * 2011-09-27 2012-09-11 Koninklijke Philips Electronics N.V. LED module
USD671674S1 (en) 2012-02-23 2012-11-27 Wooree Lighting Co., Ltd. LED lamp
US9515055B2 (en) 2012-05-14 2016-12-06 Cree, Inc. Light emitting devices including multiple anodes and cathodes
USD749051S1 (en) 2012-05-31 2016-02-09 Cree, Inc. Light emitting diode (LED) package
USD714744S1 (en) 2013-10-29 2014-10-07 Prolight Opto Technology Corporation Light emitting diode module
USD733670S1 (en) 2014-05-22 2015-07-07 Prolight Opto Technology Corporation LED module
TWI657597B (en) 2015-03-18 2019-04-21 新世紀光電股份有限公司 Edge lighting light emitting diode structure and method of manufacturing the same
USD761214S1 (en) 2015-04-02 2016-07-12 Genesis Photonics Inc. Light emitting diode package
USD762596S1 (en) 2015-04-02 2016-08-02 Genesis Photonics Inc. Light emitting diode package substrate
USD761213S1 (en) 2015-04-02 2016-07-12 Genesis Photonics Inc. Light emitting diode module
USD772181S1 (en) 2015-04-02 2016-11-22 Genesis Photonics Inc. Light emitting diode package substrate
TWD188043S (en) 2016-09-29 2018-01-21 新世紀光電股份有限公司 Light emitting diode package
CN108269899B (en) 2016-12-30 2020-06-05 光宝光电(常州)有限公司 Light emitting diode package structure and manufacturing method thereof

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD522466S1 (en) 2003-09-09 2006-06-06 Nichia Corporation Light emitting diode

Also Published As

Publication number Publication date
USD854195S1 (en) 2019-07-16

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