TWD168137S - 夾盤載具片 - Google Patents
夾盤載具片Info
- Publication number
- TWD168137S TWD168137S TW103302643F TW103302643F TWD168137S TW D168137 S TWD168137 S TW D168137S TW 103302643 F TW103302643 F TW 103302643F TW 103302643 F TW103302643 F TW 103302643F TW D168137 S TWD168137 S TW D168137S
- Authority
- TW
- Taiwan
- Prior art keywords
- carrier film
- chuck carrier
- chuck
- view
- symmetrical
- Prior art date
Links
Abstract
【物品用途】;本設計所請求具有原創性之夾盤載具片係應用於半導體領域中之夾盤載具上。;【設計說明】;左側視圖與右側視圖呈垂直鏡向對稱，故省略之。;仰視圖與俯視圖呈水平鏡向對稱，故省略之。
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US29/475,509 USD723077S1 (en) | 2013-12-03 | 2013-12-03 | Chuck carrier film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWD168137S true TWD168137S (zh) | 2015-06-01 |
Family
ID=52473496
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW103302643F TWD168137S (zh) | 2013-12-03 | 2014-05-05 | 夾盤載具片 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | USD723077S1 (zh) |
| TW (1) | TWD168137S (zh) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD766850S1 (en) * | 2014-03-28 | 2016-09-20 | Tokyo Electron Limited | Wafer holder for manufacturing semiconductor |
| USD741922S1 (en) * | 2015-01-21 | 2015-10-27 | Colgate-Palmolive Company | Die cutter |
| USD793971S1 (en) | 2015-03-27 | 2017-08-08 | Veeco Instruments Inc. | Wafer carrier with a 14-pocket configuration |
| USD793972S1 (en) | 2015-03-27 | 2017-08-08 | Veeco Instruments Inc. | Wafer carrier with a 31-pocket configuration |
| USD778247S1 (en) | 2015-04-16 | 2017-02-07 | Veeco Instruments Inc. | Wafer carrier with a multi-pocket configuration |
| USD790489S1 (en) * | 2015-07-08 | 2017-06-27 | Ebara Corporation | Vacuum contact pad |
| JP1549880S (zh) * | 2015-08-06 | 2016-05-23 | ||
| JP1549882S (zh) * | 2015-08-18 | 2016-05-23 | ||
| JP1550115S (zh) * | 2015-08-18 | 2016-05-23 | ||
| USD859331S1 (en) * | 2017-03-31 | 2019-09-10 | Ebara Corporation | Vacuum contact pad |
| JP1597807S (zh) * | 2017-08-21 | 2018-02-19 | ||
| USD931240S1 (en) * | 2019-07-30 | 2021-09-21 | Applied Materials, Inc. | Substrate support pedestal |
| USD913256S1 (en) * | 2019-07-31 | 2021-03-16 | Eryn Smith | Antenna pattern for a semiconductive substrate carrier |
| USD947802S1 (en) | 2020-05-20 | 2022-04-05 | Applied Materials, Inc. | Replaceable substrate carrier interfacing film |
| USD989012S1 (en) * | 2020-09-17 | 2023-06-13 | Ebara Corporation | Elastic membrane |
| USD1006768S1 (en) * | 2021-01-07 | 2023-12-05 | Solaero Technologies Corp. | Semiconductor wafer for mosaic solar cell fabrication |
| TWD223375S (zh) * | 2021-03-29 | 2023-02-01 | 大陸商北京北方華創微電子裝備有限公司 | 靜電卡盤 |
| USD1054388S1 (en) * | 2021-10-15 | 2024-12-17 | Shin-Etsu Chemical Co., Ltd. | Carrier substrate for handling |
-
2013
- 2013-12-03 US US29/475,509 patent/USD723077S1/en active Active
-
2014
- 2014-05-05 TW TW103302643F patent/TWD168137S/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| USD723077S1 (en) | 2015-02-24 |
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