TWD130137S1 - Crystal Boat - Google Patents
Crystal BoatInfo
- Publication number
- TWD130137S1 TWD130137S1 TW096301948F TW96301948F TWD130137S1 TW D130137 S1 TWD130137 S1 TW D130137S1 TW 096301948 F TW096301948 F TW 096301948F TW 96301948 F TW96301948 F TW 96301948F TW D130137 S1 TWD130137 S1 TW D130137S1
- Authority
- TW
- Taiwan
- Prior art keywords
- wafers
- wafer
- creation
- item
- supports
- Prior art date
Links
Abstract
【物品用途】;本創作的物品是一種晶舟,主要是為了載置整批晶圓,進行相關處理用的載具。;【創作特點】;該晶舟,乃如立體圖所示,大體上是由兩片位置互為平行的圓形端板,以及兩個圓形端板間設有三道軸向晶圓支架所組成;如左側視圖及右側視圖觀之,該端板的內周具有V形缺口,且端板的周面上設有U形槽及小圓孔等;另如前視圖所示,該晶圓支架具有密集的梳齒形構造,得以使多數片的晶圓被放置在支架間,形成平穩的載置性,且有利於處理整批晶圓的構造;整體觀之,確為一新穎獨特之設計。[Purpose of the item]; The item of this creation is a wafer boat, which is mainly used as a carrier for carrying a whole batch of wafers for related processing.; [Features of the creation]; As shown in the three-dimensional diagram, the wafer boat is generally composed of two circular end plates that are parallel to each other, and three axial wafer supports between the two circular end plates; as shown in the left and right side views, the inner circumference of the end plate has a V-shaped notch, and the circumference of the end plate is provided with a U-shaped groove and a small round hole; as shown in the front view, the wafer support has a dense comb-tooth structure, which allows most wafers to be placed between the supports, forming a stable loading structure that is conducive to processing a whole batch of wafers; overall, it is indeed a novel and unique design.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006029089 | 2006-10-25 |
Publications (1)
Publication Number | Publication Date |
---|---|
TWD130137S1 true TWD130137S1 (en) | 2009-08-01 |
Family
ID=39466907
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW096301948F TWD130137S1 (en) | 2006-10-25 | 2007-04-10 | Crystal Boat |
Country Status (2)
Country | Link |
---|---|
US (1) | USD570309S1 (en) |
TW (1) | TWD130137S1 (en) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWD140831S1 (en) * | 2008-03-28 | 2011-06-01 | 東京威力科創股份有限公司 | Semiconductor manufacturing heat preservation cylinder base |
WO2011008753A1 (en) * | 2009-07-13 | 2011-01-20 | Greene, Tweed Of Delaware, Inc. | Chimerized wafer boats for use in semiconductor chip processing and related methods |
USD734730S1 (en) * | 2012-12-27 | 2015-07-21 | Hitachi Kokusai Electric Inc. | Boat of substrate processing apparatus |
TWD163542S (en) * | 2013-03-22 | 2014-10-11 | 日立國際電氣股份有限公司 | Wafer boat for substrate processing equipment |
TWD166332S (en) * | 2013-03-22 | 2015-03-01 | 日立國際電氣股份有限公司 | Part of the wafer boat for substrate processing equipment |
TWD167988S (en) * | 2013-07-29 | 2015-05-21 | 日立國際電氣股份有限公司 | Wafer boats for semiconductor manufacturing equipment |
TWD168827S (en) * | 2013-07-29 | 2015-07-01 | 日立國際電氣股份有限公司 | Wafer boats for semiconductor manufacturing equipment |
TWD165429S (en) * | 2013-07-29 | 2015-01-11 | 日立國際電氣股份有限公司 | Wafer boats for semiconductor manufacturing equipment |
JP1537312S (en) * | 2014-11-20 | 2015-11-09 | ||
JP1537630S (en) * | 2014-11-20 | 2015-11-09 | ||
JP1537313S (en) * | 2014-11-20 | 2015-11-09 | ||
JP1537629S (en) * | 2014-11-20 | 2015-11-09 | ||
JP1563649S (en) * | 2016-02-12 | 2016-11-21 | ||
JP1597807S (en) * | 2017-08-21 | 2018-02-19 | ||
USD847105S1 (en) * | 2018-05-03 | 2019-04-30 | Kokusai Electric Corporation | Boat of substrate processing apparatus |
USD846514S1 (en) * | 2018-05-03 | 2019-04-23 | Kokusai Electric Corporation | Boat of substrate processing apparatus |
USD908103S1 (en) * | 2019-02-20 | 2021-01-19 | Veeco Instruments Inc. | Transportable semiconductor wafer rack |
USD908102S1 (en) * | 2019-02-20 | 2021-01-19 | Veeco Instruments Inc. | Transportable semiconductor wafer rack |
JP1658652S (en) * | 2019-08-07 | 2020-04-27 | ||
JP1706322S (en) * | 2021-08-27 | 2022-01-31 | ||
JP1731670S (en) * | 2022-03-04 | 2022-12-08 | ||
JP1741512S (en) * | 2022-09-14 | 2023-04-11 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD378675S (en) * | 1995-05-30 | 1997-04-01 | Tokyo Electron Limited | Wafer boat |
JP3122364B2 (en) * | 1996-02-06 | 2001-01-09 | 東京エレクトロン株式会社 | Wafer boat |
TW325588B (en) * | 1996-02-28 | 1998-01-21 | Asahi Glass Co Ltd | Vertical wafer boat |
USD404015S (en) * | 1997-01-31 | 1999-01-12 | Tokyo Electron Ltd. | Wafer boat for use in a semiconductor wafer heat processing apparatus |
KR100284567B1 (en) * | 1997-04-15 | 2001-04-02 | 후지이 아키히로 | Vertical wafer boat |
USD411176S (en) * | 1997-08-20 | 1999-06-22 | Tokyo Electron Limited | Wafer boat for use in a semiconductor wafer heat processing apparatus |
USD409158S (en) * | 1997-08-20 | 1999-05-04 | Tokyo Electron Limited | Wafer boat for use in a semiconductor wafer heat processing apparatus |
US6056123A (en) * | 1997-12-10 | 2000-05-02 | Novus Corporation | Semiconductor wafer carrier having the same composition as the wafers |
US20020130061A1 (en) * | 2000-11-02 | 2002-09-19 | Hengst Richard R. | Apparatus and method of making a slip free wafer boat |
-
2007
- 2007-04-10 TW TW096301948F patent/TWD130137S1/en unknown
- 2007-04-24 US US29/274,445 patent/USD570309S1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
USD570309S1 (en) | 2008-06-03 |
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