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TWD127499S1 - 發光二極體之封裝殼 - Google Patents

發光二極體之封裝殼

Info

Publication number
TWD127499S1
TWD127499S1 TW095302937F TW95302937F TWD127499S1 TW D127499 S1 TWD127499 S1 TW D127499S1 TW 095302937 F TW095302937 F TW 095302937F TW 95302937 F TW95302937 F TW 95302937F TW D127499 S1 TWD127499 S1 TW D127499S1
Authority
TW
Taiwan
Prior art keywords
metal film
hole
design
led package
frame
Prior art date
Application number
TW095302937F
Other languages
English (en)
Inventor
李光哲
Original Assignee
伊諾特有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 伊諾特有限公司 filed Critical 伊諾特有限公司
Publication of TWD127499S1 publication Critical patent/TWD127499S1/zh

Links

Abstract

【物品用途】;一種透過晶片取光效率與散熱性的提升,以提高LED的發光效率與輸入功率,可以有效增加LED的亮度輸出之LED的封裝。;【創作特點】;本創作係關於一種「發光二極體之封裝殼」之外觀設計者,其造型特殊、具現代感且線條布列新穎,誠為一匠心獨具之工業設計產品。;如圖所示,本創作所提供之LED的封裝,其主要形狀特徵係在於一本體,該本體為一具有盒子形狀的框架,該本體的中央部份具有一孔洞,該孔洞具有一斜邊,且孔洞頂端的圓圈尺寸大於其底端的圓圈尺寸,而孔洞的一底端係被一第一金屬膜所阻擋,另外,該框架的底端包含一第二金屬膜,再者,該本體包含一次要軸線與一主要軸線,該主要軸線係自該框架的側邊,經由框架頂端與孔洞的側邊,延伸至底邊的第一金屬膜,而第二金屬膜則與第三金屬膜相連接,各個金屬膜可反射一光束並可被一具有電子導線的電極所使用,且各金屬膜係以主要軸線的方向被個別地分開,使本創作所提供的LED封裝的整體外觀呈現一種線條分明且現代感十足之造型設計。;由上所述,本創作整體外觀上已展現出於習用完全不同之新穎風貌,符合新式樣專利之要件,援依法提出專利申請,懇請核賜專利,實深任感荷。
TW095302937F 2005-12-21 2006-05-30 發光二極體之封裝殼 TWD127499S1 (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR20050043207 2005-12-21

Publications (1)

Publication Number Publication Date
TWD127499S1 true TWD127499S1 (zh) 2009-02-21

Family

ID=38921418

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095302937F TWD127499S1 (zh) 2005-12-21 2006-05-30 發光二極體之封裝殼

Country Status (2)

Country Link
US (1) USD559804S1 (zh)
TW (1) TWD127499S1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD576115S1 (en) * 2006-11-14 2008-09-02 Lg Innotek Co., Ltd. Light-emitting diode
USD586765S1 (en) * 2008-01-31 2009-02-17 Lg Electronics Inc. Light-emitting diode
USD592160S1 (en) * 2008-02-14 2009-05-12 Seoul Semiconductor Co., Ltd. Light emitting diode (LED)
TWD133320S (zh) * 2008-06-20 2010-02-11 三星電機股份有限公司 發光二極體之殼體

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3768864B2 (ja) * 2001-11-26 2006-04-19 シチズン電子株式会社 表面実装型発光ダイオード及びその製造方法
KR100439402B1 (ko) * 2001-12-24 2004-07-09 삼성전기주식회사 발광다이오드 패키지
US7692206B2 (en) * 2002-12-06 2010-04-06 Cree, Inc. Composite leadframe LED package and method of making the same
USD514073S1 (en) * 2003-07-09 2006-01-31 Nichai Corporation Light emitting diode
US7183587B2 (en) * 2003-09-09 2007-02-27 Cree, Inc. Solid metal block mounting substrates for semiconductor light emitting devices
TWD114618S1 (zh) * 2005-03-31 2006-12-21 首爾半導體股份有限公司 發光二極體
KR100632003B1 (ko) * 2005-08-08 2006-10-09 삼성전기주식회사 열전달부에 오목부가 형성된 ｌｅｄ 패키지

Also Published As

Publication number Publication date
USD559804S1 (en) 2008-01-15

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