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TWD122891S1 - Heat Suppression Ring for Semiconductor Manufacturing - Google Patents

Heat Suppression Ring for Semiconductor Manufacturing

Info

Publication number
TWD122891S1
TWD122891S1 TW095306975F TW95306975F TWD122891S1 TW D122891 S1 TWD122891 S1 TW D122891S1 TW 095306975 F TW095306975 F TW 095306975F TW 95306975 F TW95306975 F TW 95306975F TW D122891 S1 TWD122891 S1 TW D122891S1
Authority
TW
Taiwan
Prior art keywords
semiconductor manufacturing
creation
heat dissipation
ring
suppression ring
Prior art date
Application number
TW095306975F
Other languages
Chinese (zh)
Inventor
岡田充弘
古澤純和
鈴木大介
Original Assignee
東京威力科創股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東京威力科創股份有限公司 filed Critical 東京威力科創股份有限公司
Publication of TWD122891S1 publication Critical patent/TWD122891S1/en

Links

Abstract

【物品用途】本創作的物品是一種半導體製造用散熱抑制環，配置於被配設在半導體製造用處理管之下熱插件上使用的散熱抑制環，可抑制下熱插件的散熱，其材質為石英。【創作特點】如各圖所示，該抑制環為一薄板型環體，具有一下凸緣，中間為一大中空狀的圓形體，且周圓為平面狀，使用時，如使用狀態參考圖所示，被放置在處理管的下方，達到散熱抑制效果；綜上所述，本創作確為一深具科技美感性之設計。[Purpose of the item] The item of this creation is a heat dissipation suppression ring for semiconductor manufacturing. It is placed on the heat sink installed under the processing tube for semiconductor manufacturing. It can suppress the heat dissipation of the lower heat sink. Its material is quartz. [Features of the creation] As shown in the various figures, the suppression ring is a thin plate-shaped ring with a lower flange, a large hollow circular body in the middle, and a flat circumference. When used, as shown in the reference figure of the use state, it is placed under the processing tube to achieve the effect of heat dissipation suppression; in summary, this creation is indeed a design with a deep sense of technological beauty.

TW095306975F 2006-06-16 2006-12-15 Heat Suppression Ring for Semiconductor Manufacturing TWD122891S1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006015663 2006-06-16

Publications (1)

Publication Number Publication Date
TWD122891S1 true TWD122891S1 (en) 2008-05-11

Family

ID=40417369

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095306975F TWD122891S1 (en) 2006-06-16 2006-12-15 Heat Suppression Ring for Semiconductor Manufacturing

Country Status (2)

Country Link
US (1) USD588078S1 (en)
TW (1) TWD122891S1 (en)

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Publication number Priority date Publication date Assignee Title
USD736261S1 (en) * 2012-11-29 2015-08-11 Cummins Inc. Shroud
TWD169790S (en) * 2013-07-10 2015-08-11 日立國際電氣股份有限公司 Part of the vaporizer for substrate processing equipment
WO2015113142A1 (en) 2014-01-30 2015-08-06 Draingarde Inc. Watershed protection device and system
USD768843S1 (en) * 2014-11-28 2016-10-11 Draingarde Inc. Catch basin cover
JP1545406S (en) * 2015-06-16 2016-03-14
JP1545407S (en) * 2015-06-16 2016-03-14
USD1055006S1 (en) 2022-03-18 2024-12-24 Applied Materials, Inc. Support ring for an interlocking process kit for a substrate processing chamber
USD1042373S1 (en) * 2022-03-18 2024-09-17 Applied Materials, Inc. Sliding ring for an interlocking process kit for a substrate processing chamber
USD1042374S1 (en) * 2022-03-18 2024-09-17 Applied Materials, Inc. Support pipe for an interlocking process kit for a substrate processing chamber

Family Cites Families (12)

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Publication number Priority date Publication date Assignee Title
US1637410A (en) * 1922-12-23 1927-08-02 Truscon Steel Co Coated metal lath
JPS62166624U (en) * 1986-04-14 1987-10-22
US5370736A (en) * 1992-10-26 1994-12-06 Texas Instruments Incorporated Horizontal reactor hardware design
US5846073A (en) * 1997-03-07 1998-12-08 Semitool, Inc. Semiconductor furnace processing vessel base
US5800616A (en) * 1997-12-15 1998-09-01 Sony Corporation Vertical LPCVD furnace with reversible manifold collar and method of retrofitting same
KR100360401B1 (en) * 2000-03-17 2002-11-13 삼성전자 주식회사 Process tube having a slit type process gas injection portion and a waste gas exhaust portion of multi hole type and apparatus for semiconductor fabricating
US6746240B2 (en) * 2002-03-15 2004-06-08 Asm International N.V. Process tube support sleeve with circumferential channels
US6902395B2 (en) * 2002-03-15 2005-06-07 Asm International, N.V. Multilevel pedestal for furnace
US6692249B1 (en) * 2003-01-06 2004-02-17 Texas Instruments Incorporated Hot liner insertion/removal fixture
JP4272484B2 (en) * 2003-08-28 2009-06-03 東京エレクトロン株式会社 Heat treatment method
USD516318S1 (en) * 2004-08-30 2006-03-07 The Procter & Gamble Company Bond pattern for a disposable fibrous nonwoven material
JP4369448B2 (en) * 2006-06-23 2009-11-18 東京エレクトロン株式会社 Quartz product baking method

Also Published As

Publication number Publication date
USD588078S1 (en) 2009-03-10

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