TWD140828S - Substrate retaining ring - Google Patents

Abstract

[Purpose of the item]: The item in this creation is a substrate holding ring. As shown in the reference diagram of the usage status, it is a holding ring used to hold a substrate such as a wafer in the ring for grinding a single side of the substrate in a substrate grinding process for semiconductor manufacturing. ;【Features of the Creation】;First, as shown in the three-dimensional diagram and the top view, the retaining ring is basically a stepped ring-shaped body, and a plurality of threaded holes are evenly spaced on the inner side of the top surface of the ring-shaped body. At the same time, referring to the enlarged cross-sectional view of the D-D part, it can be clearly seen that the lower edge of the outer circumference of the ring-shaped body is designed with two different outer diameters in a chamfered shape, while the inner circumference is formed with a thinner thickness, a larger inner diameter and a chamfered bottom edge with a small rounded corner on the upper side, and a thicker thickness and a smaller inner diameter on the lower side, thereby forming a special appearance.