TW565690B - Method for detecting defects in a circuit chip - Google Patents

Abstract

A method for detecting failure location in a circuit chip includes following steps. Firstly, select an area that might include some defects inside. A conductive line resides in the selected area and a protection layer covers the conductive line. Next, use laser beam to remove the protection layer and expose the conductive line. Finally, check an enlarged image of the conductive line to find whether there are defects in the conductive line.

Description

565690 V. Description of the invention (1) [Technical field to which the invention belongs] The present invention relates to a method for detecting defects in a printed circuit board from a state circuit board in Zhouzhou, and said that 4 Shifang is related to a method that uses a laser copy and is particularly trapped. Methods. Remove the 4 layers to detect the lack of printed circuit boards. [Previous technology] Today's electronic orders are made by one family. For example, writing, crystal circuits, and cutting parts are assembled as molds, which is hard to imagine. After five failures, such as the very critical one million, the critical quality control has evolved, and the analysis and analysis of 5 key technologies have progressed, and the competition is fierce. Therefore, electronic products are manufactured by: Say 'as far as the MP3 player is concerned, it must be': circuit design, photomask, wafer fabrication, * deformation on wafer Ma Chengzhi electric type, round, package, and then many integrated circuits and other electrical The printed circuit board (printed circuit board, pcB), assembly wires, headphones, etc., involve complicated procedures. After this tedious procedure, how to maintain quality becomes a job, covering any electronic today. Products may include the previous item. // If one of them fails, the entire electronic product may be blocked. Therefore, quality plays a role for electronics manufacturing companies, which has prompted almost every company to have dedicated product personnel, and even relatively large companies will have so-called FauIt Analysis Engineers. In addition to quantity and quality control of the product stage that our company is responsible for,

Page 5 565690 V. Description of the invention (2) The member also needs to control the delivery from the upstream manufacturer and handle the quality of the finished product provided by the downstream manufacturer. In the electronics field, a common problem; controversial issues. ^ (Open 2 elements or wires cannot conduct current due to faults or breaks, and the circuit as a whole cannot function normally. Due to the increasing concentration of electrons, the size of the wires or components is also more fragile, etc. Mindfulness and inadequacy of some guarding processes will lead to wires: And for downstream manufacturers, they only know that the components they receive are defective and cannot operate normally. What is the problem? It depends on the failure to clarify the responsibility. For example, when a downstream assembly manufacturer places a processor on the motherboard, it finds that the processor is a defective product. However, this processor passes through the wafer fab and packaging plant. Was the fab or packaging plant responsible for the manufacturing process of the other units? Because the main job of the packaging plant is to add the die produced by the fab to the external lead to connect the pin (pi η). On the external wires, in order to avoid oxidation of the metal wires, a protective layer is added. This protective layer is called a solder mask (resist). In order to judge whether the metal wire is broken, in the past, the packaging layer will remove the protective layer of ^ with sandpaper or other abrasives to observe the state of the wire. = ’This method has serious flaws. During the grinding process, it can be corrected, not a broken wire, which is broken due to grinding. The other kind of dagger can be used to break the original broken wire. Because of the grinding process, it was rubbed together in 565690. Invention description (3), and the original broken condition could not be found. With regard to inter-company blame, such uncertainty often leads to many disputes, resulting in wasted capital. + Necessary achievements Therefore, how to find an effective and non-controversial way, and the point of occurrence of obstacles has become a very important task. ^ Detection [Summary of the Invention] Therefore, the object of the present invention is to provide a integrated circuit chip, etc., a method and system that can effectively find out the cause of a failure to clarify responsibilities, devices, and problems. To solve the problem, Chapter P is implemented according to one of the inventions (integrated ci rcu i, the circuit chip includes a printed circuit board substrate. This line to connect the die with the outside, this method includes the following steps to test, the problem described here The protective layer of the protective area composed of materials and the like is used to finally use optical amplification to break the use of the method of the present invention in the problem area to use laser light irradiation (for example, to provide a circuit chip t chip) Defective methods. The die (d i e) of the main circuit is placed and the circuit is mounted on the substrate of the printed circuit board. Xia Youdao ~. First, select a problem area to measure the area. The area contains a wire, and the wire is covered with a layer. Next, a laser light is used to illuminate the problem to remove the protective layer and expose the wire. The instrument enlarges the image of the problem area to determine whether the wire has a defect. It has the following advantages. First, due to the protective layer composed of the organic material and the like of the present invention,

V. Description of the invention (4) __ Protective layer 'without harming or changing the protective layer. It can clearly and effectively clarify the part of the wire where the problem lies. Therefore, the present invention can be used not only for circuit chips, but also for clear responsibility. In addition, the printed circuit board can be used as a test tool for fault detection, and it can also be used to provide a very useful tool for various types of detection. For tedious circuit faults In summary, the ancient and earthy obstacles disclosed in the present invention provide an effective solution to the problem of circuit board and other related problems. Embodiments The following will describe this & .. M 〇 slave 71 < technology. First, please refer to Figure 1 and Figure 2. This is a schematic diagram of an integrated circuit chip (soil CirCUlt chiP) 10. The integrated circuit processor, memory, control chip, and multiple outputs + J ^ ^,-Jru Digital, Number Processor (DSP), etc. The two refer to FIG. 1 (b), which is a schematic diagram of the internal structure of the integrated circuit chip 1G. The main circuit of the integrated circuit chip 10 is disposed on a die 102. Generally speaking, these main circuits are first formed on a wafer through a series of photomasks, etching, and deposition, and then the wafer is cut to obtain the crystal grain Γ02. ^ In order to provide the interaction between the die 102 and the external circuit, the die 102 is placed on the printed circuit board 101, and the wheel in and out ends of the die 102 are connected to the external circuit via the wire 103. In addition, in order to protect the die 100, the die 100 is further subjected to a packaging process such as adding a protective layer to form the integrated circuit wafer 10 shown in FIG. 1 (a). '

Page 8 565690 V. Description of the Invention (5) Next, please refer to Figure 2 (a) and Figure 2 (b), of which Figure 2. ) Is an enlarged top view of a part of the lead wire 103 in Fig. 1 and Fig. (B), and Fig. 2 (3) is a cross-sectional view of the printed circuit board 101 in Fig. (B). These two figures further illustrate the relationship between the lead 103 / die 102 and the printed circuit board 101. In general, in order to connect the input and output terminals of the die to the external circuit, many different paths of wires 103 must be placed on the printed circuit board 101. In Figure 2 (b), the wire 103 Includes many sections 1031, 1032, 1 033 ·, 1034 and 1035. The I / O terminals of the die 102+ are in contact with the wire portion 1032, and the wire portion 1 032 is continuously connected to the wire portion 1031 and 1033. Further, the lead portion 1 033 is then connected to the lead portion 1 034, where the lead 1034 is formed in a hole (thr0Ugh ho 1e) of the printed circuit board 101. The lead 1 034 is then connected to the lead portion 105, and the lead portion 1035 is connected to various pins (Pin) 'or connected to another printed circuit board in various ways. Fig. 2 (c) is a schematic view showing the other side of the circuit chip 10. In order to protect the lead portions 1031, 1 032 and 1 0 33 so that they are not directly exposed to the air, a protective layer 105 is often added above the lead portions 1031, 1032 and 1033. Such protective layers are often paints made of organic materials' and the materials of the organic protective layers include carbon-carbon (c-c) links, carbon-oxygen (C-0) links, and carbon-silicon (c- Si) links, or carbon-hydrogen (C-H) links. In the industry, this protective layer 105 is commonly referred to as a solder mask / resist. Then, please refer to FIG. 3, which is a flowchart illustrating an example of the method according to the present invention for finding a component such as FIG. 1 (a ) Defective method of the circuit wafer 10 shown.

IH1 Page 9 565690 V. Description of the invention (6) The area where the problem can be found (step 300). Basically, when the electric power is equal to, for example, an open-circuit type failure, the failure area of the substrate 10 and 2 il can be determined. For example, suppose that the circuit ΐ is working i, ^ 1 is the terminal 1035, and the circuit chip 1G cannot be located. The work of the instrument includes finding out which one or several input / output terminals 1 the open circuit problem occurs. 035. When there is a disconnection problem at the access point 1 035, it can be judged that the disconnection occurred in the construction of the package, such as the configuration of the lead 103, or the production of fJ〇2. At this time, ’chase the tide along the input / output end point 1 035; the wire 103 of the grain 102 is an area where a problem may occur. μ · Ϊ ^ Remove the protective layer 105 of the problem area with laser light (step 302). The preferred embodiment of the laser light used here is an ultraviolet laser (ltra II 10let laser), and examples of its wavelength are between ㈠㈣ to 40 m. = Laser light irradiation can shield the wire part ι〇3ι, 〇33 Seek = The protective layer 105 made of organic material is vaporized due to broken bonds, but at the same time, it will not affect the original appearance of the wire 丨 〇3 . …, Ί: image of the line Si area (step 304) 'to determine whether there is a defect in the wire in the problem area. Because the protective layer 105 above the wire part 1031, 1033, etc. has been removed, & At this time, as long as the problem area is enlarged, it can be found out whether the fault such as the open circuit is due to the seal \ 1 configuration Defects such as breakage occur. Magic wire If no defects are found in the whole wire 103, such as fracture, the failure of this wafer 10 can be further analyzed to determine whether the defect is caused by the converse of the manufacturing process of the grain 102. On the package, with Yue Yuan

Page 10 565690 V. Description of Invention (7) The manufacturer has nothing to do with it. In other words, the use of the present invention makes it possible to clarify the issue of responsibility between the fab and the packaging plant. ^ The receiver ‘Refer to Figure 4’ This figure illustrates a system for debt inspection of the aforementioned circuit chip defects. This system includes a platform 4 2 on which an electronic device 43 is placed, and a problem area 4 31 of the electronic device 43 is placed upwards, wherein the problem area 431 has a component, and the component is covered by the component. An organic protective layer. Examples of the electronic device 43 include the aforementioned circuit chip 10, and examples of the components and the protective layer include the aforementioned wires 3 and the protective layer 105. In addition, this system also has an operation interface 44, a laser light transmitter 45, and a control circuit 46. The control circuit 46 is connected to the operation interface 44 and the laser light transmitter 45, and the control circuit 46 provides a user to use the operation interface 44 to control the laser light transmitter 45 so that the laser light transmitter 45 emits a laser light to a problem area of the electronic device. Remove the organic protective layer and expose any possible problems. In addition, this system also has an observation device 47 for zooming in and capturing the image of the component in the problem area, so as to determine whether the component has a defect in the problem area. As a result of the inspection, it can be found that Fig. 5 is a 1-knife enlarged image using laser light to remove the protective layer. From Figure 5, a break can be clearly found on the wire. Although the circuit chip 10 is taken as an example here, it is not applied to the application of the circuit chip. Because it is generally used in the group: Companion 1: Brush the road board, the organic material technique is often covered on the wire, β Μ + Μ Μ π; Of course, the technique of the present invention can also be used. Or as a basis for attribution of responsibility.

Page 11 565690 V. Description of the invention (8)-= The above-mentioned preferred embodiment of the present invention shows that the application of the present invention has the following advantages over the present one in order to remove, but does not use the wire, etc. The protective layer is too abrasive. It is clear that the invention does not print the electric test, and it is clear that any application that can be made as a supplement can sometimes change the force to trap. It is possible that the defects may be eliminated. In the fault detection of the circuit chip, it can also be used for the detection of 'complicated electricity' on the 'C', but it is not intended to limit the "run" without departing from the spirit and The area defined shall prevail. The material of the machine shall protect its original observation and the ground, which may cause the original loss. It is also not possible to first determine the nature of the protective layer and the wire part by using the sandpaper to remove the trap, However, because of the shape, there is no responsibility. Second, although this type of road fault detection is in the scope of the present invention, it is clear that the protective layer is used because of laser vision or light during the protection process of the construction. The protective layer is too effective but it can be used as a road board. It is quite useful to familiarize yourself with the various patented laser lighting techniques. This is the case when the radiation of the same light is enlarged, or it is trapped, or Process so that the shape and wire covered by the layer composed of the problem can be learned. The technology is free of defects. What is the reason for the lack of management?

Page 565690 Brief Description of Drawings [Simplified Illustration of Drawings] Figure 1 (a) shows a schematic diagram of a circuit chip; Figure 1 (b) shows a schematic diagram of a circuit chip; Figure 2 (a) shows a part of a wire Schematic diagram; Figure 2 (b) shows a schematic diagram of the wires, a protective layer and a printed circuit board; Figure 2 (c) shows a schematic diagram of the back contacts of the integrated circuit; Figure 3 shows a flowchart according to an embodiment of the present invention Figure 4 shows a schematic diagram of an embodiment according to the present invention;

Figure 5 shows the experimental results according to the invention. Schematic mark description

1 0 Circuit chip 1 0 1 Printed circuit board 1 0 2 Die 1 0 3 Lead 1031 Lead part 1 0 3 2 Lead part 1 033 Lead part 1 034 Lead part 1 0 3 5 Lead part 1 0 5 Protective layer 42 Platform

Page 13 565690 Brief description of the drawings 43 Electronic device 431 Problem area 44 Operating interface 45 Laser light transmitter 4 6 Control circuit 47 Observation device

Page 14

Claims (1)

565690 6. The scope of the patent application has a side bearing output to connect the method to select a problem using a protective layer, using a photo area to detect defects in a circuit chip, the circuit chip die and a printed circuit board base Material, one of the grains of the printed circuit board substrate and the other side of the printed circuit board substrate has a plurality of points 'the majority of output contacts and the grain are connected by a plurality of wires, including: problem area' where The problem area includes at least one of the wires, and a protection layer is covered on the wire in the area; laser light illuminates the protection layer of the problem area, thereby removing the protection and exposing the wire; and amplifying an image of the problem area by a magnifying instrument In order to determine whether the wire in the question has a defect. 2. The method as described in item i of the patent application scope, wherein the protection is an organic protective layer. ] The method described in item 2 of the scope of tm, wherein the material of the organic protective layer in # is a carbon-carbon (c-c) link. The method described in item 2 of the it! range, wherein the material of the organic protective layer includes a carbon-oxygen (C-O) link. More] The method described in the second item of the range ==, wherein the material of the organic protective layer includes a carbon-silicon (C_Si) link. X 565690 6. Scope of patent application 6 · The method described in item 2 of the scope of patent application, wherein the material of the organic protective layer includes a carbon-hydrogen (C-H) link. 7. The method according to item 2 of the scope of patent application, wherein the laser light emits an ultraviolet spectrum. 8. The method according to item 2 of the scope of patent application, wherein the wavelength of the ultraviolet spectrum is between 10 nm and 40 nm. 9. The method as described in item 2 of the scope of patent application, wherein the defect is a fracture-type defect. 1 0 · A method for detecting a defective element in an electronic device, the method comprising: selecting a problem area, wherein the problem area includes a component, and the component is covered with an organic protective layer; The laser light is used to illuminate the organic protective layer in the component area to remove the protective layer and expose the component; and an optical magnification device is used to enlarge the image of the problem area to determine whether the component has a defect in the problem area. 1 1 · The method according to item 10 of the scope of patent application, wherein the element is made of a metal material. Page 16 565690 6. Scope of Patent Application 1 2 · The method described in item 11 of the scope of patent application, wherein the material of the organic protective layer includes a carbon-carbon (C-C) connection. 1 3 · The method as described in item 11 of the scope of patent application, wherein the material of the organic protective layer includes a carbon-oxygen (C-0) link. 14 · The method as described in item 11 of the scope of patent application, wherein the material of the organic protective layer includes a carbon-silicon (C-Si) link. 1 5. The method as described in item 11 of the scope of patent application, wherein the material of the organic protective layer includes a carbon-hydrogen (C-H) link. 16 · The method according to item 11 of the scope of patent application, wherein the laser light emits an ultraviolet spectrum. 17 · The method according to item 11 of the scope of patent application, wherein the wavelength of the ultraviolet spectrum is between 10 nm and 40 nm. 18 · The method as described in item 11 of the scope of patent application, wherein the defect is a fracture-type defect. 1 9 · A system for detecting defective components in an electronic device, the system includes: Page 17 565690 Patent Application Scope-An electronic device is placed on the stage, and the electronic device is two yuan? ^ The problem area has-elements, and the cow is covered with an organic protective layer; an operation interface; a laser light transmitter; a control circuit is connected to the operation interface and the laser light emission in violation of the control circuit ^ The U M control circuit provides the user with the operation interface to control the laser light. The device J causes the laser light emitter to emit a laser light to a problem area of the electronic device to remove the organic protective layer and expose the element; And = an observation device for zooming in and capturing an image of the component in the problem area to precisely determine whether the component has a defect in the problem area. 2 0. The system according to item 19 of the scope of patent application, wherein the element is a wire 'and the organic protective layer comprises a carbon-carbon link, a carbon-hydrogen link, a carbon-stone link or 1. The system as described in item 20 of the patent application range, wherein the emission spectrum of the laser light belongs to the ultraviolet light range. 2 2 · The system according to item 21 of the scope of patent application, wherein the wavelength of the laser light is between 10 nm and 40 nm. 2 3 · The system described in item 22 of the scope of patent application, wherein the defect is a fracture-type defect. ^ _ Page 18 565690 VI. Patent application scope 2 4-A method for detecting defects in a circuit wafer having a die and a printed circuit board substrate, and the printed side carries the die 'and The number of output contacts on the substrate of the printed circuit board, and the output of the majority of the circuit board substrate-the rain has multiple connections. The wire is covered with an organic material, and the majority of the wires are connected to the grains. Layer, wherein the method is characterized by judging whether the organic protective layer is removed by laser light under the organic protective layer. ---- ^