TW527532B - Microprocessor heat dissipating structure and its manufacturing method - Google Patents

Abstract

There is provided a microprocessor heat dissipating structure, which is used for a microprocessor and other chip structure that generates a large amount of heat. The heat dissipating structure has a heat dissipating seat made of pure aluminum, which has an excellent heat conductive performance and is installed with the microprocessor to increase the heat dissipating area. A groove is extended outwardly from the surface between the heat dissipating seat and the microprocessor. A heat conductive tube is arranged in the groove. A heat sink set is arranged on an extended surface of the groove. The heat sink set is made of copper having the best heat dissipating performance. The bottom of the heat sink set and the heat dissipating seat are fixed in formation, so that the large amount of heat generated by the microprocessor can be effectively dissipated through the heat conductive tube in the groove to the heat sink set.

Description

527532 V. Description of the invention α) [Technical Field] The present invention relates to a microprocessor heat dissipation structure and a manufacturing method thereof, and particularly to a material or a combination of a heat sink and a heat sink group, and a serial microprocessor and heat dissipation Guide grooves and heat pipes of the film group: a novel structure and a method for making micro-processing to be politically excluded from the generated heat. [Previous technology] Please refer to Figures 1A and 1B for the heat dissipation structure of the conventional microprocessor. Its main structural features are a heat sink 丨 which is used to install the device; With a heat sink! The surface area of the heat sink 1 is ruled out by the large area ^, and uneven surfaces ^ are formed on the surface of the heat sink 1, and the heat sink is increased by the wrinkle U to provide better heat dissipation. . Because the heat dissipation structure of the microprocessor is not carefully considered, it is difficult to dissipate the heat. In the rapid growth of the performance of the microprocessor, it has not achieved its purpose of cooling. The shortcomings are summarized as follows. ·: The effectiveness of the heat dissipation structure depends entirely on how large the area is; the heat dissipation effect of the material is still 'therefore, even if it is used in the heat dissipation industry, it is the same material as the old C', so it is generally industrial 6063 'The two-state heat dissipation structure of this kind of material uses aluminum 6061 or aluminum to dissipate heat. The result is natural: discount:,: 吕 3oku, # is mixed with other substances, so it is not helpful at all. 〇 In the increasingly faster microprocessor now

Page 4 527532 V. Description of the invention (2) 2. Conventional equipment, but the designer mentioned in the previous 5 if the effect is not at all possible, the shortcomings of this case, the discovery and the process are all intensive research and its manufacturing method . [Objective of the invention The ability of the heat dissipation structure of the present invention 9 can quickly match the structure of the present invention, and the copper sheet has a better structure than the group. The heat dissipation structure in the heat dissipation groove is provided with the pleated part 11 Only heat cannot be used evenly. See 5 above and need to be clarified in view of the fact that Xi must be rooted in the discomfort 5 and finally achieved]] The purpose is to use the heat sink at the speed of the heat sink, the other purpose of the heat sink is even, the surface of aluminum is better. Another powerful purpose of the powerful heat dissipation effect is that the heat seat is in the device duct, and the folds 11 are provided on the back of the heat sink 1 through the heat guide. The 1 is installed to increase the heat dissipation area by fluctuations. If it is conducted uniformly, the heat dissipation area is There are still many shortcomings in the use of heat dissipation items, which is not a good breakthrough. Use the slightest, write the original book, think hard about the research and development, and provide pure! Lu Cai broadly conducts heat and is based on various processes derived from the heat dissipation structure of the micro-channeling tube transfer processor, that is, the structure of the conventional heat dissipation structure is innovated, and this micro-processing has been completed after years of hard work Microprocessor heat dissipation structure. The heat dissipation structure of the microprocessor has a high heat conduction and heat area design to effectively dissipate the microprocessor. Provide a heat sink group completed by the copper heat sink of the microprocessor. Therefore, a guide groove is provided below the position where the heat sink is appropriately provided to provide a microprocessor heat sink, extending to the position of the heat sink group, so that the heat sink group is lost.

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V. Explanation of the invention (3) Another object of the present invention is to provide a method for manufacturing a heat sink of a microprocessor. The heat sink group is welded together when the heat sink is formed, and is simply pasted, so the heat passes through the connection. It can still maintain a good time: = the efficiency of 5 makes the overall heat dissipation effect of the present invention effective. [Technical content] The heat dissipation structure of the microprocessor and its manufacturing method with the above advantages include: a heat sink and a heat sink set, which are used for fixing ^

Processor 'to dissipate the heat generated by the microprocessor, and the heat sink is made of = 1070, which can quickly and efficiently dissipate the heat. The heat sink ... is set on one side of the heat sink It is connected with the microprocessor by the heat pipe in ^ 1, so that the heat generated by the microprocessor can be transferred to the heat sink group to dissipate, and the heat sink group is made of copper. , = It has the best heat dissipation effect, and it can also cooperate with the second heat device installed on the heat sink group to make the heat dissipation effect play the best state. ~ [Simplified description of the drawings] Please refer to the following detailed description of a preferred embodiment of the present invention and the accompanying drawings, will you further understand the technical content of the present invention and its purpose and effect? The drawings related to this embodiment are: The first figure A is a three-dimensional exploded view of a conventional microprocessor heat dissipation structure;

The first figure B is another three-dimensional exploded view of a conventional microprocessor heat dissipation structure; the second figure is a three-dimensional exploded view of a microprocessor heat dissipation structure of the present invention The third figure is another three-dimensional exploded view of the microprocessor heat dissipation structure of the present invention

527532, description of the invention (4) The fourth figure is the flowchart C of the method for manufacturing the heat dissipation structure of the microprocessor of the present invention. [Description of the main components and symbols] 1 Heat sink 11 Wrinkle 2 Microprocessor 3 Heat sink 31 Guide groove 32 埶Conduit 4 heat sink group 41 copper sheet 5 heat sink fan [preferred embodiment] Please refer to the second and third figures. The microprocessor heat sink structure provided by the present invention mainly includes a heat sink 3, which The heat sink 3 is made of pure aluminum 1 0 70 with good thermal conductivity. The surface of the heat sink 3 contains a microprocessor 2 or other chips that generate high heat. The heat sink 3 has a wide surface area and can The high heat generated by the processor 2 is effectively dissipated; and a guide groove 31 extends outward from the surface of the heat sink 3 below the microprocessor 2, and a heat pipe 32 is provided in the guide groove 31; A heat sink group 4 is arranged on the extension end of 31, and the heat sink group 4 is composed of the copper plate 4 1 with the best heat dissipation properties, so that the bottom surface of the copper plate 41 of each composition is welded together with the heat sink 3; With the above structure, the microprocessor 2 produces Most of the heat generated is transferred to the heat sink group 4 through the heat pipe 32, and the heat is dissipated by the good heat conduction characteristics of the heat sink group 4, and the remaining heat must be dissipated through the body of the heat sink 3, so that the heat dissipation effect is far. Better than conventional heat dissipation structure. The heat sink group 4 and the guide groove 31 are not limited to be disposed at any position on the front and back sides of the heat sink base 3 to match the actual setting of the microprocessor 2. In addition, a heat sink fan 5 is installed on the heat sink group 4, To enhance the cooling effect.

Page 7 527532 V. Description of the invention (5) Please refer to the fourth figure. The method for manufacturing the heat dissipation structure of the microprocessor of the present invention includes the following steps: 1 0. The mold required for making the heat sink 3 is matched with the desired mold The installed microprocessor 2, heat sink group 4, guide groove 31, and other devices are divided in advance into relevant setting positions; 2 (K the copper plate 41 is appropriately cut and arranged to form a heat sink group 4; 3 0, The heat sink group 4 is placed on the planned position of the mold; the bottom of the heat sink group 4 is slightly penetrated into the mold space of the heat sink seat 3; 40. Melting pure aluminum, filtering impurities, and then melting the pure aluminum melt Cast into the mold space, so that the pure aluminum melt can cover the bottom of the heat sink group; 50, after cooling, a heat sink seat is formed which is in close contact with the heat sink group, and finally the thermal epoxy The heat pipe 32 is fixed in the guide groove 31. After the completion of the heat sink 3 device, after appropriate processing, it can be used to install the microprocessor 2 or other devices to perform practical functions. In addition, the aforementioned guide groove 3 1 Set directly on the mold, and then cast pure aluminum melt Of course, the guide groove 31 is also processed and set after the heat sink is formed to play the same function. [Features and Effects] The microprocessor heat sink structure and its manufacturing method provided by the present invention and the aforementioned conventional technology When compared with each other, it has the following advantages: 1. The present invention is made of pure aluminum material with good heat dissipation5, so the heat can be quickly and effectively removed, which is much more advanced than the conventional technology. 2. The invention has a more heat dissipation The best copper sheet is the heat sink group. Take 527532 V. Description of the invention (6) to improve its heat dissipation effect. The heat sink group and the heat sink base are welded together, and there is no obstacle to heat transfer, and the heat dissipation effect is quite good. A guide groove is provided to receive the heat pipe, which can conduct heat to be dissipated in an appropriate position, and facilitate the arrangement and setting of components and devices in the computer. The detailed description above is a specific description of a feasible embodiment of the present invention, but the implementation The examples are not intended to limit the patent scope of the present invention, and any equivalent implementation or change that does not depart from the technical spirit of the present invention should be included in the patent scope of this case. It is stated that the present invention is not only technically innovative, but also enhances the above-mentioned multiple effects compared with conventional items. It should have fully met the statutory invention patent requirements of novelty and advancement, and submitted an application in accordance with the law. Your office is requested to approve this invention patent The application is inspired by invention, and it is a virtue.

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Claims (1)

527532 t. Application for patent scope 1. A micro-processing-radiating base wafer device, the guiding effect 5 is provided with a guiding groove, and the guiding groove is conducted to one of the later-mentioned heat sink devices. If applying for a patent, the heat sink group end 3. If applying for a patent, the guide groove may be extended 4; if applying for a patent, the guide groove and thermal guide may be used. 5. — a kind of micro-processing a. Making diffuser, heat sink group b. Will dissipate heat c. Washing and casting the pure bottom, and in 6. if applying for a patent device heat dissipation structure, including:, used to fix a microprocessor or other The heat sink that generates high heat is made of pure aluminum material, which has a high degree of heat transfer. The position between the surface of the heat sink and the microprocessor extends outwards. A built-in heat pipe is used to place the heat sink generated by the microprocessor on the heat sink set. The group is formed by combining several copper pieces. The heat sink is extended on the surface of the guide groove to effectively dissipate the heat processed by the guide groove. The bottom of the heat sink is tightly formed by casting. The microprocessor heat dissipation structure described in the first item of the scope, wherein a heat dissipation fan is provided to enhance the heat dissipation effect. The microprocessor heat dissipation structure described in the first item, which is to any position of the heat sink. The heat dissipation structure of the microprocessor described in the first item of the scope, wherein the number of tubes can be determined according to the heat generated by the microprocessor. The method of manufacturing the heat dissipation structure of the determinator includes the mold of the hot seat, and the microprocessing and The relevant setting positions of the guide grooves; the chip group is placed on the planned position of the heat sink mold; the aluminum melt, so that the pure aluminum melt is covered with the heat sink group and cooled to form a close contact with the heat sink group Radiator. Microprocessor cooling structure as described in Scope 5 Page 10 527532 6. Method of applying for patent scope, in which the guide channel is directly formed by washing and casting. 7. The method for manufacturing a microprocessor heat dissipation structure as described in item 5 of the scope of the patent application, wherein the guide groove is processed and drilled after the heat sink is formed.