M358347 五、新型說明： 【新型所屬之技術領域】 種具有有效引導熱源快速散熱及可 一種散熱模組，尤指一 節省空間的散熱模組。 【先前技術】M358347 V. New description: [New technical field] It has a kind of effective guiding heat source for rapid heat dissipation and can be a heat dissipation module, especially a space-saving heat dissipation module. [Prior Art]
按隨著半導體技術的進步，積體電路的體積亦逐漸縮 小’而為了使積體電路能處理更多的資料，相同體積下的積 體電路’已經可以容納比雜多上數倍以上的元件，當積體 電路内的元件數量越來越多時，元缸作時所產生的熱能亦 越來越大]^見的中央處理器為例，在高滿載的工作量時， 中央處理器的散發出_度，以使中央處理器整個燒毀， 因此’積體電路的散熱裝置變成為重要的課題。 &而般的散熱器大多透過高導熱係數的金屬材 質來製 \同時為了提高散熱效果’除了將加I風扇來排熱之外， 大多設置域版_態來配合散熱，更進―步透過熱導管 來加速排除熱能’以防止積魏路產品燒燦。 、I閱第1、2 w ’係為習知散熱模組之立體示意圖及正 視圖’如圖所示習知之散麵組1係具有-散熱則組U複 f熱=管12及一基座13所組成，所述散熱韓片組11由複數 散熱縛片11A所組成且所述散_片组丨丨係具有一導熱部 〜及月文熱#112,所述導熱部in及散熱部112係開設有 複數孔洞113 ’前述熱導管12具有—導熱端121及-散熱端 3 M358347 122並分別穿設於前述散熱韓片組η之導熱部hi及散熱部 112所開設之孔洞113與前述散熱鰭片組n結合，所述散熱 鰭片組11之具有導熱部11丨之一端與前述基座13接合，透 過前述基座13與一發熱單元2結合並將所述發熱單元2之埶 源傳導至前述散熱鰭片組u之導熱部ηι及熱導管12之導 熱端121，再由所述熱導管12將熱源由散熱端122傳遞給前 述散熱鰭片組11之散熱部112進行散熱，習知技術係僅透過 熱導管12加速熱源之傳導，但卻未充分有效地將熱源確實傳 導至散熱鰭片外侧較冷端處，造成散熱模組之中央内部熱源 持續加溫無法有麟除’故使傳狀散賴丨無法發揮其 應有之政熱效旎，另者，習知技術之散熱模組1中因熱導管 12與散熱鰭片組η組設時熱導管12必須彎曲形成一彎曲部 123且具有一曲率半徑，若前述熱導管12彎曲部丨23之曲率 半徑過小時翁述鱗管12於導熱結構（圖巾未表示）將 又破壞令騎鮮管12失去效能，故需增大散細片組11 之韓片的面積以配合熱導管12之組設，但隨著前述散熱籍片 組11面積增大及熱導管12彎曲部123鱗半徑增大令散敎 模組1整體面積增大，當所述散麵組1錄於-電子設備 (圖令未表示）中進行輔助散熱時則會佔據所述電子設備（圖 中未表示）㈣多雜，因此在如何知較小面積之散教轉 片虹又可妥善與解管結合，⑽得難 這都是創作人目前積極解決之課題。 ，、、、果 M358347 欠創作人有鑑於上述缺失，乃搜集相關資料，經由多方 、、及考量，並以從事於此行業累積之多年經驗，經由不斷 試作及修改，始設計出此種散類組之新型專利者。 【新型内容】 /爰此’為解決上述習知技術之缺點，本創作之主要目的， 係提供—種藉由熱導管有效引導熱源提升散熱效能之散熱模 組。 本創作次要目的係提供—種可大幅節省空間的散熱模組。 本創作另-目的係提供—種可節省成柄散熱模組。 *為達上述之目的，本創作係提供一種散熱模組，所述散熱 模且係'包含.一散熱鱗片組、至少-第一熱導管、至少一 第…、導S ’該散熱鰭片組定義至少一第一導熱部、至少一 ★導及至v —第—散熱部、至少—第二散熱部，該第 一導熱部位於該散_片組中央處，該第二導熱部紕鄰該第 -=熱:並位於該散熱‘韓片組中央處外側；該第—散熱部位 於*近刖述散細片組外側，該第二散熱部赴鄰該第一散執 部並位於該散熱則組_;該第—熱導管兩端分別插驗 第一導熱部及第—散熱部，該第二熱導管兩端分別插設於第 二導熱部及第二散熱部，藉由前述第―、二熱導管與前述第 —、二導熱部及第―、二散熱部充分搭配組合，不僅於單位 _中充分配置散熱路财效提升散熱魏外，同時更可精 簡散熱歡之__節省空間及節省成本之絲；故本創 M358347 作具有下列優點： I較佳且快速的散熱效能； 2·節省空間； 3. 較大功率之散熱效能； 4. 節省成本。 【實施方式】 為達成上述目的及功效，本創作所採用之技術手段及構 造，茲繪圖就本創作較佳實施例詳加說明其特徵與功能如 卞’俾利完全了解。 明併參閱第3、4、5、6圖’本實施例係為一種散熱模 ，，且4在本創作之實施例中如圖所示，前述散熱模組4係包 含放-散熱籍片組41、至少-第一熱導管42、至少一第二熱 導^3 ’所述散熱鱗片組41具有複數散熱轉並定義 炱:-第-導熱部411、至少一第二導熱部412及至少一第 之、°卩413、至少—第二散熱部414，所述第-導熱部奶 _^散”、、’、、、曰片組41中央處’所述第二導熱部412毗鄰前述 熱部411並位於前述散熱則組41中央處外側，另， 熱部413位於靠近前述散熱鱗片_則，前述 姐41=M14晚鄰所述第一散熱部413並位於該散熱縛片 靖42缘熱㈣3分別具有 導管42之^ 及一散熱端422、432，所述第一熱 ,、、、端421及散熱端422分別插設於第一導熱部 M358347 川及第一散熱部413,所述第二熱導管 散熱端432分別插設於前述第_ ϋ 糊，藉由前瞥、二及前述第二散熱 及散熱端422、碰與前述第L=3之導熱端421、431 k罘—導熱部41卜412及第一、 二散熱部413、414連接搭配，不僅令所述散熱模組4於單位 充分崎韻賴，可有效_掏接受狀熱能作引 V以提升散絲組4之賴魏外，_更讀職熱模組 4之面積達卿省空間及節省成本之效果。 請復參閱第5、6、7W，係為本創作之賴模組之立體分 解及立體齡正涵，如_示，輯散鏡組4且有 -散熱鰭片組41及至少-第—熱導管42及至少—第二轉 管43，所述散熱鰭片組41具有—第—端44及-第二端45， 並開設有減制451貫穿所述散朗版41供所述第一、 二熱導管42、43插設，所述散熱鰭片、板41定義有一頂㈣ =底側47,前述第-、二導熱部411、412位於靠近前述 ，、中任一侧，前述第一、二散熱部413、抱位於靠近前述另 一側’所述第-熱導管42及第二熱導管43分別具有至少一 導㈣42卜431及至少一散熱端似、伽，當所述第一執 導管42由第-端44插設於散熱鰭片組41時，則第二執導: 43則由第二端45插設於散熱轉片組41，若所述第—敎^ 42由前述第二端45插設於散熱鰭片組41時則與其相鄰： 二熱導管43則由第-端44插設於散朗片組41，所述第—、 7 M358347 二熱導管42、43於所述散熱· 4i呈交錯組設，所述第 一、二熱導管42、43之蓴刼，山 ^ ^ “、、&似、431係分別插設於前述 =片組41之第一端44之第—導熱部奶及第二端45之 弟，部必所述第—、二鱗管Μ之散熱賴、 編i插設於前述散―組Μ之第—端&的第一散 = 413及第二端45之第二散熱轉，另者所述散熱鰭片 之㈠熱部411及第二導熱部4丨2係與-基座5組設 且-、二導熱部411、412及第一、二熱導管42、奶 =熱端42卜431與基座5間塗佈有導熱介質以避免彼此間 彻 生触現象，所述導齡f可秘膏或其他導熱 係數較佳之材料。 所述散熱輪41之第—導熱細位於該散麟片組 j處則所述第—導熱部412蛾鄰前述第一導熱部如並 π述散熱鰭片组41中央處外侧，另，所述第一散数部 I位於靠近前述散熱韓片組41外側，前述第屬 田/斤述第-散熱部413並位於該散熱縛片組幻内側，所述 2-熱導管42係由導熱端421及散熱端似連接前述第一 你、部411及第1熱部413，所述第二熱導管幻由導熱端 及散熱端432連接前述第二導熱部412及第二散熱部 4 ’所述散片組41具有第一導熱部4ΐι及第二導熱部 12之侧與基座5接合，所述基座5係與至少—發熱單元 (圖令未表示）接觸並傳導熱源，所述基座5靠近中間部位 M358347 係為與第一導熱部411所設之部位，該處所散發之熱源係具 有較局之溫度，與第二導熱部412所設之位置則次之，本創 作之實施例係將具有較高溫度之第一導熱部411冑（係為靠 近基座5中央處）之_經由所述第一熱導管42之傳導將熱 源傳導至前述第-散熱部413，又因所述第—散熱部仙位 於所述散賴組41靠近外侧處，溫度較低且熱源向外擴散速 度憾故將熱源由較焉溫處導向較低溫處則可提升整體散 熱效能，另者，可藉由所述散熱鰭片組41及第-、二熱導管 42、43之結構及組設方式充分發揮散熱模組4之散熱效能， 因本創作政熱換組4之結構充分將熱源作引導及散熱，故僅 管將散熱模組4之鰭片面積作縮減與習知散熱模組相較依然 具有較佳之散熱效能。 睛復參閱第8圖’如圖所示，係為本創作之另—實施例， 本創作之散熱藉片組41之該等散熱‘鳍片4U兩侧具有至少一 第一摺邊48及一第二摺邊49。 。月者以上所述僅為本案之較佳實施例，並非用以限 本則作’右依本創作之構想所作之改變，在不脫離本創作 精神範圍内，例如：對於構形或佈置型態加以變換，對於各 =攸，修飾與躺，所產生等效作用，均應包含於本案之 權利範圍内，合予陳明。 斤述本創作之「散^"模組」於使用時，為確實能 、力放及目的，故本創作誠為—實用性優異之創作，為 9 M358347 符合新型專利之申請要件，爰依法提出申請，紛審委早日 賜准本案卩保障創作人之辛苦創作，倘#釣局審委有任 何稽疑，請不吝來函指示，創作人定當竭力配合，實感德便。 【圖式簡單說明】 第1圖係習知之散熱模組立體圖； 第2圖係習知之散熱模組正視圖； 第3圖係摘作之實_之散_版域示意圖； 第4圖係本創作之實_之散熱鰭版正視圖； 第5圖係本創作之實施例之散熱模組立體分解圖； 第6圓係本創作之實施例之散熱模組立體組合圖； 第7圖係本!ι丨作之實施例之散熱模組正視圖； 第8圖係本創作之另—實侧之散熱獅立體圖。 【主要元件符號說明】 散熱模組4 散熱韓片41A 散熱鰭片組41 第一導熱部411 第二導熱部412 第一散熱部413 第二散熱部414 第一熱導管42 導熱端421 M358347 散熱端422 第二熱導管43 導熱端431 散熱端432 第一端44 第二端45 孔洞451 頂侧46 底側47 第一摺邊48 第二摺邊49 基座5According to the advancement of semiconductor technology, the volume of the integrated circuit is gradually reduced, and in order to enable the integrated circuit to process more data, the integrated circuit of the same volume can already accommodate components that are several times more than the impurity. When the number of components in the integrated circuit is increasing, the thermal energy generated by the element cylinder is also getting larger and larger. For example, the central processor is used as an example. At high load, the central processing unit The _ degree is emitted so that the central processing unit is completely burned, so the heat sink of the integrated circuit becomes an important issue. The general radiators are made of metal with high thermal conductivity. At the same time, in order to improve the heat dissipation effect, in addition to adding I fans to heat up, most of the domain version is set to match the heat dissipation. Heat pipes to accelerate the elimination of heat energy' to prevent the products from burning. I read the first and second w's as a schematic diagram and a front view of a conventional heat dissipation module. As shown in the figure, the conventional surface group 1 has a heat dissipation group U complex f heat = tube 12 and a base The heat dissipating Korean chip group 11 is composed of a plurality of heat dissipating die sets 11A, and the dispersing film set tanning system has a heat conducting portion ～ and a moon heat #112, and the heat conducting portion in and the heat dissipating portion 112 The heat pipe 12 has a plurality of holes 113. The heat pipe 12 has a heat conducting end 121 and a heat radiating end 3 M358347 122, and respectively penetrates the heat conducting portion hi of the heat dissipating Korean chip group η and the hole 113 formed by the heat radiating portion 112 and the heat dissipation. The fin group n is coupled, and one end of the heat dissipating fin group 11 having the heat conducting portion 11 is engaged with the pedestal 13 , and is coupled to a heat generating unit 2 through the pedestal 13 and conducts the cesium source of the heat generating unit 2 The heat transfer portion η of the heat dissipation fin group u and the heat conduction end 121 of the heat pipe 12 are further transferred from the heat dissipation end 122 to the heat dissipation portion 112 of the heat dissipation fin group 11 by the heat pipe 12 for heat dissipation. The technology only accelerates the conduction of heat through the heat pipe 12, but does not fully heat the heat source. It is actually transmitted to the colder end of the heat-dissipating fin, which causes the central internal heat source of the heat-dissipating module to continue to be warmed up, so that it cannot be used to make it possible to use its proper political effect. In the heat dissipation module 1 of the prior art, the heat pipe 12 must be bent to form a curved portion 123 and have a radius of curvature when the heat pipe 12 and the heat dissipation fin group η are assembled. If the curvature radius of the curved portion 丨 23 of the heat pipe 12 is excessive The hourly tube 12 is in a heat-conducting structure (not shown) and will destroy the riding tube 12, so it is necessary to increase the area of the Korean piece of the fine film group 11 to match the heat pipe 12, but As the area of the heat-dissipating chip group 11 increases and the scale radius of the curved portion 123 of the heat pipe 12 increases, the overall area of the heat dissipation module 1 increases, and when the surface group 1 is recorded in the electronic device (the command is not shown) In the case of auxiliary heat dissipation, it will occupy the electronic equipment (not shown in the figure) (4), so how to know how to use a small area of the pro-rotation can be properly combined with the unwinding, (10) is difficult The creators are currently actively addressing the issue. ,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, Group of new patents. [New content] / In order to solve the shortcomings of the above-mentioned prior art, the main purpose of the present invention is to provide a heat-dissipating module that effectively guides a heat source to improve heat dissipation performance by a heat pipe. The secondary purpose of this creation is to provide a cooling module that can save a lot of space. The purpose of this creation is to provide a heat-saving module that can be saved. For the purpose of the above, the present invention provides a heat dissipation module, which includes a heat dissipation scale group, at least a first heat pipe, at least one ..., a guide S 'the heat sink fin group Defining at least a first heat conducting portion, at least one guiding and to v-th heat radiating portion, at least a second heat radiating portion, wherein the first heat conducting portion is located at a center of the scattered sheet group, and the second heat conducting portion is adjacent to the first heat conducting portion -=热: and located outside the center of the heat dissipation 'Korean group; the first heat dissipation portion is located outside the *detailed fine film group, and the second heat dissipation portion is adjacent to the first dispersion portion and located at the heat dissipation portion The first heat conducting portion and the first heat radiating portion are respectively inserted into the two ends of the first heat pipe, and the two ends of the second heat pipe are respectively inserted into the second heat conducting portion and the second heat radiating portion, by the first The two heat pipes are fully combined with the first and second heat conducting parts and the first and second heat dissipating parts, not only in the unit _, but also fully equipped with the heat dissipating road to improve the heat dissipation, and at the same time, the cooling heat can be simplified __ saving space and Cost-saving silk; therefore, the original M358347 has the following advantages: I is better and Speed thermal performance; 2. save space; 3. greater thermal efficiency of power; 4. Cost savings. [Embodiment] In order to achieve the above objects and effects, the technical means and structure adopted by the present invention are described in detail in the preferred embodiment of the present invention, such as the features and functions of the present invention. Referring to Figures 3, 4, 5, and 6, the present embodiment is a heat dissipation mold, and 4 is shown in the embodiment of the present invention, and the heat dissipation module 4 includes a discharge-heat dissipation group. 41. The at least one first heat pipe 42 and the at least one second heat guide 3' have a plurality of heat dissipation turns and define: a first heat conducting portion 411, at least a second heat conducting portion 412, and at least one The second heat conducting portion 412 is adjacent to the heat portion 412, at least the second heat dissipating portion 414, the first heat conducting portion, the ', and the center of the cymbal group 41 411 is located outside the center of the heat dissipation group 41, and the hot portion 413 is located close to the heat dissipation scale _, then the sister 41=M14 is adjacent to the first heat dissipation portion 413 and is located at the heat dissipation tab jing 42 edge heat (4) 3 Each of the first heat, the end 421 and the heat dissipation end 422 are respectively inserted into the first heat conducting portion M358347 and the first heat radiating portion 413, the second portion The heat pipe heat dissipation end 432 is respectively inserted into the foregoing _ ϋ paste, by the front 瞥, the second and the second heat dissipation and heat dissipation end 422, and the front and the front The heat conducting end 421, 431 k 罘 of the L=3, the heat conducting portion 41 412, and the first and second heat dissipating portions 413 and 414 are connected and matched, so that the heat dissipating module 4 is not only sufficient in the unit, but is effective _掏Receiving heat can be used as a guide to improve the effect of the loose wire group 4, and the area of the hot module 4 will be more space-saving and cost-saving. Please refer to sections 5, 6, and 7W. The three-dimensional decomposition and stereoscopic age of the creation module, such as _, the mirror group 4 and the heat sink fin group 41 and at least the - heat pipe 42 and at least the second pipe 43 The heat dissipation fin group 41 has a first end 44 and a second end 45, and a subtraction 451 is inserted through the diverging plate 41 for inserting the first and second heat pipes 42 and 43 to dissipate heat. The fins and the plates 41 define a top (four)=bottom side 47, and the first and second heat conducting portions 411 and 412 are located adjacent to the front side, and the first and second heat radiating portions 413 are located close to the other side. The first heat pipe 42 and the second heat pipe 43 respectively have at least one guide (four) 42 431 and at least one heat sink end, gamma, when the first duct 42 is from the first end 44 When the heat sink fin group 41 is disposed, the second guide: 43 is inserted into the heat dissipation fin set 41 by the second end 45, and the first end 45 is inserted into the heat sink fin by the second end 45. When the group 41 is adjacent to it: the second heat pipe 43 is inserted into the slab group 41 from the first end 44, and the first and seventh M358347 two heat pipes 42 and 43 are staggered in the heat dissipation and 4i. The first and second heat pipes 42 and 43 are respectively inserted into the first end 44 of the chip group 41 and the first and second heat pipes 42 and 43 are respectively inserted into the first end 44 of the chip group 41. The second half of the 45th brother, the Ministry must be said that the first and second scales of the heat dissipation, the editor is inserted in the first part of the above-mentioned group - the first and the first = 413 and the second end 45 In the second heat-dissipating, the heat-dissipating fins 411 and the second heat-conducting portion 4丨2 are combined with the pedestal 5, and the two heat conducting portions 411 and 412 and the first and second heat pipes 42 are The milk = hot end 42 431 and the susceptor 5 are coated with a heat-conducting medium to avoid the phenomenon of mutual contact with each other. The lead-in type may be a secret paste or other material having a better thermal conductivity. The first heat conducting portion 412 of the heat dissipating wheel 41 is located at the outer side of the heat dissipating fin group j, and the first heat conducting portion 412 is adjacent to the first heat conducting portion, such as the center of the heat dissipating fin group 41. The first scatterer portion I is located outside the heat dissipating Korean chip group 41, and the first field/seat heat dissipating portion 413 is located inside the heat dissipating die set, and the 2-heat pipe 42 is connected to the heat conducting end 421. And the heat dissipation end is connected to the first portion 411 and the first heat portion 413, and the second heat pipe is connected to the second heat conduction portion 412 and the second heat dissipation portion 4' by the heat conduction end and the heat dissipation end 432. The side of the sheet group 41 having the first heat conducting portion 4ΐ and the second heat conducting portion 12 is joined to the susceptor 5, and the pedestal 5 is in contact with at least a heat generating unit (not shown) and conducts a heat source, the pedestal 5 The vicinity of the intermediate portion M358347 is a portion disposed with the first heat conducting portion 411, and the heat source radiated from the space has a relatively low temperature, and the position of the second heat conducting portion 412 is second, and the embodiment of the present invention will The first heat conducting portion 411 具有 having a higher temperature (close to the center of the susceptor 5) The conduction of the first heat pipe 42 conducts the heat source to the first heat dissipating portion 413, and because the first heat dissipating portion is located near the outer side of the dispersing group 41, the temperature is low and the heat source diffuses outwardly. The heat source is guided from a lower temperature to a lower temperature to improve the overall heat dissipation performance. Alternatively, the heat dissipation fins 41 and the first and second heat pipes 42 and 43 can be used to fully utilize the heat dissipation mode. The heat dissipation performance of the group 4, because the structure of the creation of the political heat exchange group 4 fully guides the heat source and dissipates heat, so the fin area of the heat dissipation module 4 is reduced compared with the conventional heat dissipation module. Cooling performance. Referring to FIG. 8 'as shown in the figure, which is another embodiment of the creation, the heat dissipation borrowing group 41 of the present invention has at least one first flange 48 and one side on the sides of the heat dissipation fin 4U. The second flange 49. . The above is only the preferred embodiment of the present case, and is not intended to limit the changes made by the concept of the right to the present, without departing from the spirit of the creation, for example, for the configuration or arrangement Transformation, for each = 攸, modification and lying, the equivalent effect, should be included in the scope of the case, combined with Chen Ming. The "Spray" module used in the creation of this book is really capable, powerful and purposeful. Therefore, the creation is sincerely - the creation of excellent practicality, 9 M358347 meets the requirements for new patents, When the application is filed, the trial committee will grant the case as soon as possible to protect the creator's hard work. If there is any doubt in the fishing bureau, please don't hesitate to give instructions, the creator will try his best to cooperate and feel good. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view of a conventional heat dissipation module; Fig. 2 is a front view of a conventional heat dissipation module; Fig. 3 is an abstract view of the _ _ version field; The real part of the creation is the front view of the heat sink fin; the fifth figure is the exploded view of the heat dissipation module of the embodiment of the present invention; the third circle is the three-dimensional combination diagram of the heat dissipation module of the embodiment of the present invention; The front view of the heat dissipation module of the embodiment of Fig. 1 is the perspective view of the heat lion of the other side of the creation. [Main component symbol description] Heat dissipation module 4 Heat dissipation film 41A Heat dissipation fin group 41 First heat conduction portion 411 Second heat conduction portion 412 First heat dissipation portion 413 Second heat dissipation portion 414 First heat pipe 42 Heat conduction end 421 M358347 Heat dissipation end 422 second heat pipe 43 heat conduction end 431 heat dissipation end 432 first end 44 second end 45 hole 451 top side 46 bottom side 47 first flange 48 second flange 49 base 5