512418 Λ7 B7 五、發明說明（） 發明領域 本發明係關於一種晶圓食的Ί淨5又備與潔淨方法，一 特別是有關於一種包含動態嗔管組的晶圓盒清洗裝置，以 及利用此種裝置清洗晶圓盒的方法。 且 發明背景： 經濟部智慧財產局員工消費合作社印製 近 及增加 生產越 相關邏 斷向小 需求挑 路積集 也已降 開發階 在電力 優點也 速普及 備，即 年來，為了提供更舒適的生活、便利的行動空間以 工作上的生產效率，各類電子、電力產業莫不傾向 來越輕薄短小，且能量耗損越來越低的電子系統。 輯電路，記憶體半導體元件等半導體產業，因此不 型大谷量化、高頻化、以及低耗電化等方面的生產 裁，目如，隨者各方面技術上的突破，整體積體電 度不斷增加，線路微細度在線寬的設計、生產尺度 低至0.25微米、〇_ 18微米，甚至進入到奈米尺寸的 段。越微細的電子電$ ’代表其所購裝的電子系統 消耗、系統體積及整體重量上的表現就越佳，這些 就進一步衍生出更多樣性的應用機會。近年來，迅 於各國，適合攜帶且價廉物美的各式無線通訊設 是此類應用的最佳實例》 在半導體產業中’積體電路的製作過程是非常 複雜 ^--------^---------^ (請先閱讀背面之注意事項再填寫本頁) 512418 A7 B7 經 濟 部 智 慧 財 產 局 員 工 消 費 合 作 社 印 製 五、發明說明（ 的。基本上’約需經過數百個不同的步驟，耗時約一、兩 個月的時間才得以完成。期間，幾乎每一個製程都需要在 無塵的環境中進行，以避免空氣中的粒子，損壞了積體電 路精細的線路，或形成電路中的缺陷，進而發生零件性能 與生產良率下降的問題。因此，精細積體電路生產環境的 控制與維持’遂成為半導體產業技術上的一大課題。為保 持晶圓表面的潔淨，洗淨工程因此佔了半導體製造工程達2 〜3 成的比重。 隨著技術之創新發展，對於產品之高精密化、細小型 化之需求越迫切，去除對於製程良率影響頗大的微粒子就 越顯重要。無塵室又稱潔淨室便是提供半導體製程潔淨空 間的一項重要設施。無塵室的潔淨度要求分為各式各樣的 等級，依據美國聯邦標準209D有關無塵室的規格標準，其 定義早位立方英尺（ft3)空間内，存在直徑〇 5微米（ 粒子的多寡為分類等級。若單位體積内含直徑〇 5微米的 粒子數在10000以下，則稱為Class 1〇〇〇〇 ;若僅有1〇以 下則屬於Class 10等級的無麈室，相對於Class 1〇〇〇〇等級 來說，Class 10的潔淨程度相對高出許多，但成本更是大 幅增加。因此，傳統無塵室成為半導體製程一項昂責的成 本。-般來說，越高潔淨程度與越大潔淨空間的要求，將 使得無塵室的購裝成本與營運花費大幅提高…潔淨程 度難以維持之外，冑無塵室在遭遇到工安事件、斷電或天 -------------裝--------訂---------線 (請先閱讀背面之注意事項再填寫本頁) 512418 經濟部智慧財產局員工消費合作社印製 A7 _— _ B7_______ 五、發明說明（） 然k害後’其潔淨度恢復期的冗長，亦常成為生產停滯， 營收減少的主因。512418 Λ7 B7 V. INTRODUCTION TO THE INVENTION Field of the Invention The present invention relates to a method for cleaning and cleaning a wafer food, and particularly to a wafer box cleaning device including a dynamic tube set, and the use thereof. Method for cleaning wafer box by device. And the invention background: The Intellectual Property Bureau of the Ministry of Economic Affairs ’employee consumer cooperatives printed nearer and increased production. The more relevant the logic was, the more demanding the road to the small demand, the accumulation of the road has also been reduced, and the development stage has been rapidly popularized in the advantages of electricity. In recent years, in order to provide The living and convenient mobile space is based on the productivity of work. Various electronic and electric power industries are inclined to make electronic systems that are thinner and shorter, and whose energy consumption is getting lower and lower. Semiconductor industry such as memory circuits, memory semiconductor components, etc., therefore, the production rulings of Otani quantification, high frequency, and low power consumption, etc., for example, with the technological breakthroughs in all aspects, the overall integrated electricity Increased, the design of line fineness and line width, production scale as low as 0.25 microns, 0-18 microns, and even into the nano-sized segment. The finer the electronics, the better the performance of the electronic system purchased, system volume, and overall weight, which will further lead to more diverse application opportunities. In recent years, various wireless communication devices suitable for portable and inexpensive products are faster than other countries, and are the best examples of such applications. "In the semiconductor industry, the manufacturing process of integrated circuits is very complicated ^ ------- -^ --------- ^ (Please read the precautions on the back before filling out this page) 512418 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs After hundreds of different steps, it took about one or two months to complete. During this time, almost every process needs to be performed in a dust-free environment to avoid particles in the air and damage the integrated circuit Fine lines, or defects in the formation of the circuit, further reduce the performance of parts and production yield. Therefore, the control and maintenance of the production environment of fine integrated circuits has become a major issue in the technology of the semiconductor industry. The round surface is clean, so the cleaning process accounts for 20% to 30% of the semiconductor manufacturing process. With the innovation and development of technology, the demand for high precision and miniaturization of products is more and more urgent. , The more important it is to remove particles that have a significant impact on the yield of the process. The clean room, also known as the clean room, is an important facility that provides clean space for semiconductor processes. The cleanliness requirements of the clean room are divided into a variety of Grade, according to the United States Federal Standard 209D standard for clean rooms, which defines an early cubic foot (ft3) space with a diameter of 0.05 micrometers (the number of particles is a classification level. If a unit volume contains a diameter of 0.05 micrometers If the number of particles is below 10,000, it is called Class 1000; if there are only 10 or less, it belongs to Class 10 classless chamber. Compared to Class 1000, Class 10 is relatively clean. It is much higher, but the cost is greatly increased. Therefore, the traditional clean room has become a responsible cost of the semiconductor process.-Generally speaking, the higher the degree of cleanliness and the greater the requirement of clean space, the more clean the room will be. Purchase and installation costs and operating expenses have increased significantly ... In addition to the difficulty of maintaining cleanliness, 胄 clean rooms are experiencing industrial safety incidents, power outages or days ------------- installation ----- --- Order --------- line (please read first Please fill in this page again for the matters needing attention) 512418 Printed by A7 _— _ B7_______ of the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs V. Invention Description () However, after the harm, the lengthy recovery period of its cleanliness also often becomes a stagnation of production, The main reason for the decrease in revenue.
為求得較高的製程良率與較低的生產成本，半導體廠 商紛紛引用新一代的 SMIF (機械標準介面 Standard Mechanical Interface )系統。SMIF系統與傳統無塵室的生 產方式比較，最大的不同，就在於「將生產設備置於潔淨 室内」的觀念轉換成「將潔淨室置於生產設備内」，主要 包括 3 項技術要項：晶圓盒（POD ) 、SMIF I/O (Input/Output)、以及逑你潔淨環境（Mini-environment)。 SMIF系統的優點，在於晶片運送的進出作業，全控制在一 個自動化運作的迷你無塵室中，只要在這個迷你環境中維 持Classl等級，而外環的無塵室潔淨度要求便不用這麼 高，如此一來，SMIF系統不僅町達到省電及降低成本的效 果，生產良率立即有顯著的提升；更重要的是’由於藉由 自動化機械卸載晶圓’在SMIF系統下生產晶片，更可縮 短製程週期，簡短客戶的交貨時間。這項新的突破，可說 是半導體業的一項創舉。 晶圓盒（POD )即是SMIF系統的主要關鍵。晶圓盒為 一可密閉的盒子，用以裝運載送晶圓，並可以於盒内保持 達Ciassl的潔淨度，所有晶圓0於晶圓^中’透過機械 化的晶圓載入機及晶圓傳送f進行晶圓盒的開啟與晶圓的 本紙張又度適用中國國家標準（CNS)A4規格（210 X 2· — — III I — III — —» · I I I I I I I ·11111111 (請先閱讀背面之注意事項再填寫本頁) 512418 經濟部智慧財產局員工消費合作社印製 Α7 Β7 五、發明說明（） 卸載，將晶圓載卸進出於各項製程設備中。惰性氣體充填 機則應用於表面條件要求嚴苛的關鍵製造步驟，如熱製 程、化學氣相沈積、濺鍍等，用來將原先充滿晶圓盒内的 一般空氣置換’取代成惰性氣體，以確保晶圓片不受濕氣 及氧氣的影響。晶圓盒上的ID辨識讀取模組，則是生產線 自動化不可缺的功能，以追蹤各批晶圓於各廠區的位置， 確實掌控晶圓的傳送情形，建立整廠物流追蹤管理系統。 因此，晶圓盒已成為半導體製程中，各製程間晶圓轉 載的重要工具，且已漸漸成為半導體廠内的標準配備。可 惜的是，晶圓盒並不像傳統無塵室般，擁有各項污染檢測 系統，可隨時瞭解晶圓盒内的潔淨度是否受到污染。一般 來說，由於晶圓盒内的污染，將直接污染整個晶圓盒内的 所有晶圓片，進而影響整體製程的良率，所以，目前所有 的方法都傾向於確保晶圓盒能夠維持晶圓盒盒内的潔淨 度，晶圓盒盒内的潔淨因此受到了層層的保護。 然而，隨著晶圓盒的廣泛應用，各項晶圓盒的問題也 逐漸形成。例如，由》SMIF系統的引入，使得生產線上 各製程設備外部的無塵室潔淨度，不再維持於高標準’雖 T各項製程設備處於單元封閉的狀態，可是穿梭於其間的 晶圓盒，其晶園盒盒外卻不斷地接觸著低潔淨度的空氣， 擁有遠低於晶園盒盒内的潔淨度；更進一步的是，為了機 本紙張尺度適用中_家標i^、ns)A4規格⑽χ挪公餐） -------------裝--------訂---------線 (請先閱讀背面之注意事項再填寫本頁) 512418 五、發明說明（ 械化地卸載晶圓盒 槽，以適合各項機 在低潔淨度的空氣 盒被放置於平面， 時，該些凹槽更是 觸平面摩擦，所產 的凹槽中。令人擔 防污染物在晶圓盒 污染的情形。對於 面存在著各種不同 内的晶圓，晶圓盒底部常設計有許多凹 器手臂與執道的操作，然而，這些凹槽 下 $成為污染粒子的累積點，當晶圓 甚至於地面等高污染粒子聚集的地方 备易沾染或刮起污染粒子，包括與所接 生的許多粒子因此都囤積在晶圓盒底部 炎的是’目前仍然沒有任何設備可以預 上的累積，且更進一步解決晶圓盒盒外 晶圓盒底部所累積的污染，由於底部表 大小的凹槽，更是清洗時的一大難題。 •-------------裝— (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 發明目的及概述： 因此，如何預防及處理晶圓盒盒外的污染，已成為提 升良率的重要課題。晶圓盒盒外表面的潔、淨，其實與晶圓 盒盒内的潔淨-樣，都非常重要。我們可以想見，曰曰曰圓盒 盒内的污染將污染了整個晶圓盒盒内的晶圓；但是晶圓盒 盒外的污染，不但會於開啟時揚起污染物，污染了盒内的 晶圓，更嚴重的是，其將污染了每一套所經過的製程設備， 使得整條生產線的生產良率受到影響，或增加了各製程設 備進一步清洗的額外成本。 另一方面，由於晶圓盒底部表面的結構特殊，為了提 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 經濟部智慧財產局員工消費合作社印製 512418 A7 B7_;_ 五、發明說明（） 供自動化機械手臂的搬遷與晶圓片的載卸，晶圓盒底部表 面造型成許多凹槽與凸板，當此晶圓盒底部受到污染時， 污染物將於各個凹槽死角累積，非常難以清洗。 承上所述，本發明的一目的是為晶圓盒表面特別發展 一種潔淨設備，用以去除晶圓盒表面上的污染物。 本發明之另一目的，是針對晶圓盒底部表面容易累積 污染物，又難以清洗的凹槽與凸板，設計一專用的清洗設 備。 本發明再一目的是提供一立即排離污染的系統，使得 由晶圓盒表面去除的污染物可以立即被排離，而不會造成 二次污染。 因此，在本發明一較佳的實施例中提供了一種晶圓盒 表面的潔淨設備，可以用以預防晶圓盒表面污染物的累 積，以及進一步處理晶圓盒表面的污染。尤其是利用動態 式的喷管設備，清除晶圓盒最易遭受污染，卻最難清洗的 底部凹槽。其包含即時排離系統，立即排離清洗下來的污 染物，以免污染物二次污染晶圓盒或下一批次待清洗的晶 圓盒。 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） in *n tmmam i an flu n flu til flu I · i IK t— n 11 In n 一 f n an n —a— i Iw I (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 512418 Λ7 B7__ 五、發明說明（） 本發明進一步導引出一種方法，用以清洗晶圓盒盒外 表面，預防污染物持續累積在晶圓盒的表面而最終造成生 產線良率降低。該方法包括，提供一套設備支撐待清洗的 晶圓盒，將該晶圓盒待清洗的表面暴露出來；提供一套流 體驅動裝置，高壓驅動適當的清洗流體與該待清洗的晶圓 盒表面接觸；藉由該清洗流體與該表面上污染物之間的動 能傳送、浮力、吸引力或化學反應，將污染物從晶圓盒表 面上移除；提供一動態式喷管組，使得較少的清洗流體即 可提供高壓的衝擊力，藉由喷管動態式的運動，不斷變換 流體與晶圓盒表面接觸的衝擊角度，以擴大清洗面積、深 入凹槽的角落、並使得清洗流體與污染物的作用力方向不 斷改變，反應面積進一步擴大；立即排離該些污染物與剩 餘的清洗流體，以避免二次污染的發生。利用本發明在此 揭露的方法，將每一個即將進入製程的晶圓盒都先清洗一 遍，不但去除了晶圓盒上的污染物，避免污染物被帶入製 程設備中，更可預防污染物於晶圓盒表面死角進一步累 積。 圈式簡單說明： 本發明的較佳實施例將於往後之說明文字中輔以下列 圖形做更詳細的闡述，其中： 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -------------裝--------訂.--------線 (請先閱讀背面之注意事項再填寫本頁) 512418 A7 B7 五、發明說明（ 第1圖是本發明晶圓盒潔淨設備之一實施例的頂視 圖； (請先閱讀背面之注意事項再填寫本頁) 第2圖是本發明晶圓盒潔淨設備同第1圖之實施例的 側面剖面圖；及 第3圖是利用本發明晶圓盒潔淨設備同第1圖與第2 圖之實施例，所進行的晶圓盒底部清洗實驗數 據表。 圈號對照說明： 100 晶 圓 盒 潔 淨 設 備 13 晶 圓 盒 支撐 架 11 喷 管 旋 轉 環 12 喷 管 16 ( 電 動 閥 開 關 )開按鈕14 開 啟 狀 態 燈 21 電 動 進 氣 閥 22 電 動 排 氣 闊 25 壓 縮 乾 燥 空 氣 23 進 氣 管 道 21 電 動 進 氣 閥 26 混 和 廢 氣 24 抽 氣 管 道 17 ( 電 動 闊 開 關 15 關 閉 狀 態 燈 經濟部智慧財產局員工消費合作社印製 發明詳細說明： 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公t ) 512418 Λ7 B7 五、發明說明（ 本發明揭露一種晶圓盒的潔淨設備與方法。為了使本 發明之敘述更加詳細與完備，請參照下列描述並請配合第1 圖之圖解。 第1圖為本發明晶圓盒潔淨設備之一實施例的頂視 圖。本實施例係針對擁有許多凹槽及凸板的晶圓盒底部表 面所設計，依據本實施例，晶圓盒潔淨設備100有一組晶 圓盒支撐架1 3位於整個晶圓盒潔淨設備 1 0 〇的頂部，用 以放置晶圓盒（未繪示），支撐晶圓盒的底部。位於整套 晶圓盒潔淨設備1 〇 〇的内部，有一組動態噴管組，其包含 個喷官旋轉環1 1以及三支噴管1 2連結於該喷管旋轉環 11上，使得三支喷管12的末端的連線成為一三角形的形 狀。 當晶圓盒潔淨設備100頂部的電動閥開關16，n中 的開按姐按下時’狀態顯示燈組14，15中的開啟狀態 燈14將亮起，同時電動進氣㈤21 (繪示於第2圖）與電 動排氣闊 22 (纟會示於第2圖） ’ 一股壓縮乾燥 1;------------裝--------訂i (請先閱讀背面之注意事項再填寫本頁) 線 經 濟 部 智 慧 財 產 局 消 費 合 作 社 印 製 空氣25(繪示於第2圖）將進入進氣管道23 (纟會示於第 2圖），經由電動進氣㈤21 (綠示於第2圖）進入動態嘴 管組，並由分佈在喷管12上的喷孔喷出，所喷出的壓縮 乾燥空氣柱，不但立即沖洗晶圓盒的底部表面，更藉由噴 出時的動能，帶動該些喷管12以喷管旋轉環丨丨為旋轉中 10 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297^· 經濟部智慧財產局員工消費合作社印製 512418 A7 B7___ 五、發明說明（） 心而開始旋轉。喷管 12上的喷孔隨著喷管 12的旋轉不 斷地變動位置，並以各種不同的角度喷出壓縮乾燥空氣 柱，不斷來回高壓清洗晶圓盒底部表面的每一塊區域。同 時，清洗下來的污染物，將立即以壓縮乾燥空氣 2 5 (繪示 於第2圖）為載體形成一股混和廢氣 26，由晶圓盒潔淨設 備 100底部的抽氣管道 24 (繪示於第2圖）抽離。待清 洗完畢後，可按下電動闊開關 1 6,1 7中的關按鈕 1 7，則 電動進氣閥 21 (繪示於第2圖）與電動排氣闊 22 (繪示 於第2圖）將一起關閉，動態喷氣管組因為缺乏氣體喷出 的動力而漸漸停止轉動，同時，狀態顯示燈組 1 4,1 5中的 開啟狀態燈 14熄滅，換由關閉狀態燈 15亮起，以顯示 整套設備正處於關閉狀態。 另一方面，請參考第2圖。第2圖為本發明晶圓盒潔 淨設備同第1圖之實施例的側面剖面圖。當電動進氣閥與 電動排氣閥 22開啟時，壓縮乾燥空氣 25即由進氣管道 23進入動態喷管組，經由喷管旋轉環11進入喷管 12，再 由喷管 12上的喷孔喷出，喷出的氣流，同時帶動該些喷 管 1 2以喷管旋轉環1 1為旋轉中心而開始旋轉，隨著噴管 1 2的旋轉，由喷孔喷出的喷射氣流形成各種角度的沖洗 柱，高壓沖洗晶圓盒底部表面以及各個凹槽，將污染物沖 洗下來形成一股混和廢氣 26。混和廢氣 26沿著抽氣管道 24，再經由電動排氣閥 22排出，完成晶圓盒底部表面的 11 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） n m 11 l n ϋ tn m en n ί i 9 « n an —ϋ ·ϋ n n i 一ol¥ a n tM9 an ·ϋ HI ϋ n I (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 A7 五、發明說明（） 沖洗及污染物的排離。 Α ' ^配合參考第3圖的數據表。依據本實施例， 驗數诚、實際抽樣3 〇個晶圓盒進行清洗實驗’並記錄實 7此實驗數據表中。攔位一清洗前，所記錄的資料， 二、母個日日圓盒底部表面於清一 々 月，无貫驗刖，經巧*染檢視，實際 汁算出的污染物盤g .袖 數目，搁位〜清洗後，則記錄該晶圓盒底 部表面經過本實絲主 例備/月洗後，經污染檢視，所計算出 A晶圓盒底部表面仍然殘餘的污染物數目。 由此第J圖實驗數據表的資料中顯示，每個晶圓盒於 清洗前果然附著著污染物，且普遍存在著4個以上的污染 物。在經過本實施例設備清洗後，果然去除了大部分的污 木物，平均南達7 8 · 1 9 %的污染物因為本實施例晶圓盒潔淨 設備而移除。 本發明進一步揭露一種方法，用以清洗晶圓盒盒外表 面，預防污染物持續累積在晶圓盒的表面而最終造成生產 線良率降低。該方法包括，提供一套設備支撐待清洗的晶 圓盒’將該晶圓盒待清洗的表面暴露出來；提供一套流體 驅動裝置’高壓驅動適當的清洗流體與該待清洗的晶圓盒 表面接觸；藉由該清洗流體與該表面上污染物之間的動能 傳送、浮力、吸引力或化學反應，將污染物從晶圓盒表面 12 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） * ^--------訂·--------Φ·-- f請先閱讀背面之沒意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 512418 A7 B7 五、發明說明（） 上移除；提供一動態式喷管組，使得較少的清洗流體即可 提供高壓的衝擊力，藉由喷管動態式的運動，不斷變換流 體與晶圓盒表面接觸的衝擊角度，以擴大清洗面積、深入 凹槽的角落、並使得清洗流體與污染物的作用力方向不斷 改變，反應面積進一步擴大；立即排離該些污染物與剩餘 的清洗流體，以避免二次污染的發生。利用本發明在此揭 露的方法，將每一個即將進入製程的晶圓盒都先清洗一 遍，不但去除了晶圓盒上的污染物，避免污染物被帶入製 程設備中，更可預防污染物於晶圓盒表面死角進一步累 積。 另一個實施例是機械式且自動化的，晶圓盒由一輸送 帶不斷帶入經過此一實施例中的晶圓盒潔淨設備，當待清 洗的晶圓盒經過此潔淨設備時，此一設備即由四面八方將 清洗流體驅動到該晶圓盒的各個表面上，一次清除晶圓盒 所有表面上的所有污染物，並立即排離所有去除的污染物 與清洗流體。 在另一個實施例中，若待清洗的晶圓盒，其污染已累 積得非常嚴重，並非一般流體可以清洗，可於此晶圓盒潔 淨設備中加入適當材質動態式的刷毛，以增強污染物掃除 的功能；或藉由電腦控制進氣閥與排氣閥，使其分別開關， 以改變清洗流體的脈衝與壓力。 13 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） n i Hi n ^^1 m 1 n-1 ^^1 ft— n n I · ·ϋ i ΛβΜ— —ϋ ·ϋ n i 一 · i 11-- n Hi i i ϋ I (請先閱讀背面之注意事項再填寫本頁) 512418 A7 五、發明說明（） 本發明的一項優點為提供一種晶圓盒潔淨設備，此設 備利用一動態式喷管組，得以較少的清洗流體，提供較強 的衝擊力，除減少清洗成本之外，更能深入難以處理的晶 圓盒底部凹槽；藉由喷管組動態式的運動，可以不斷變換 清洗流體柱沖擊污染物的角度，以擴大清洗面積、變換清 洗流體與污染物之間的作用力方向；若利用化學反應的清 洗流體，更可以因此增加清洗流體與污染物之間的反應面 積，簡短污染物移除的時間。 本發明提供另一項優點為本發明的晶圓盒潔淨設備 中，擁有一即時污染物排離系統，可以將由晶圓盒表面移 除的污染物立即排離，以避免二次污染的發生。 如熟悉此技術之人員所瞭解的，以上所述僅為本發明 之較佳實施例而已，並非用以限定本發明之申請專利範 圍；凡其它未脫離本發明所揭示之精神下所完成之等效改 變或修飾，均應包含在下述之申請專利範圍内。 1· emm§ i^i n n i emme «m ϋ- n n n I · im ϋ4 n US n« —Bi flu ^ n ϋ —9 «Bn 11 n ΛΜΜΜ§ I (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準（CNS)A4規格（210 x 297公釐）In order to obtain higher process yields and lower production costs, semiconductor manufacturers have cited a new generation of SMIF (Standard Mechanical Interface) systems. Compared with the traditional clean room production method, the biggest difference between SMIF system is that the concept of "placing production equipment in clean room" has been transformed into "placing clean room in production equipment", which mainly includes 3 technical elements: crystal Round box (POD), SMIF I / O (Input / Output), and mini-environment. The advantage of the SMIF system is that the in and out operations of wafer transportation are fully controlled in a mini clean room that operates automatically. As long as the Classl level is maintained in this mini environment, the cleanliness requirements of the outer ring clean room need not be so high. In this way, the SMIF system not only achieves power saving and cost reduction effects, the production yield immediately improves significantly; more importantly, because the wafers are produced under the SMIF system by 'unloading wafers by automated machinery,' it can be shortened even more. Process cycle, short customer delivery time. This new breakthrough can be said to be an initiative of the semiconductor industry. The wafer box (POD) is the main key of the SMIF system. The wafer box is a sealable box for loading and transporting wafers, and can maintain the cleanliness of Ciassl in the box. All wafers are stored in wafers through a mechanical wafer loader and crystal. The circular conveying f is used to open the wafer box and the wafer is suitable for the China National Standard (CNS) A4 specification (210 X 2 · — — III I — III — — »IIIIIII · 11111111 (Please read the Note: Please fill in this page again) 512418 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs Α7 Β7 V. Description of the invention () Unloading, unloading the wafer into various process equipment. Inert gas filling machine is used for surface conditions Critical critical manufacturing steps, such as thermal processes, chemical vapor deposition, sputtering, etc., are used to replace the general air that originally filled the wafer box with an inert gas to ensure that the wafer is not protected from moisture and oxygen The ID identification reading module on the wafer box is an indispensable function of production line automation to track the position of each batch of wafers in each factory area, and indeed control the wafer transfer situation and establish the entire factory. Flow tracking management system. Therefore, the wafer box has become an important tool for wafer retransmission between semiconductor processes, and has gradually become a standard equipment in semiconductor factories. Unfortunately, wafer boxes are not as dust-free as traditional ones. It is like a room with various pollution detection systems to know at any time whether the cleanliness in the wafer box is contaminated. Generally speaking, due to the pollution in the wafer box, all wafers in the entire wafer box will be directly polluted. This further affects the yield of the overall process, so all current methods tend to ensure that the wafer box can maintain the cleanliness of the wafer box, and the cleanliness in the wafer box is therefore protected by layers. However, with With the wide application of wafer cassettes, various wafer cassette problems have gradually formed. For example, the introduction of the SMIF system has made the cleanliness of clean rooms outside various process equipment on the production line no longer maintained at high standards. The various process equipment is in a closed state. However, the wafer box shuttled between them is constantly exposed to low-purity air outside the wafer box. The cleanliness inside the box; furthermore, in order to apply the paper size of the machine _ house standard i ^, ns) A4 specifications ⑽χ Norwegian public meal) ------------- pack- ------ Order --------- Line (Please read the precautions on the back before filling out this page) 512418 5. Description of the invention (unload the wafer box slot mechanically to suit each machine When the air box with low cleanliness is placed on a flat surface, the grooves are rubbed against the flat surface. The grooves produced by the grooves can prevent the contamination of the wafer box from contamination. There are various types of surfaces. Different wafers, the bottom of the wafer box is often designed with a lot of recessed arms and operations. However, the bottom of these grooves becomes the accumulation point of contaminated particles. When the wafer and even the ground and other highly contaminated particles gather It is easy to contaminate or scrape contaminated particles, including many of the particles delivered, so they are hoarded at the bottom of the wafer box. The inflammation is' at present there is no equipment that can be accumulated in advance, and the wafer outside the wafer box is further solved The accumulated pollution at the bottom of the box is a big problem when cleaning because of the groove on the bottom table. . • ------------- Install— (Please read the precautions on the back before filling out this page) The purpose and summary of the invention printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs: Therefore, how to prevent and deal with Contamination outside the wafer box has become an important issue to improve yield. The cleanness and cleanliness of the outer surface of the wafer box is actually very important. We can imagine that the pollution inside the round box will contaminate the wafers inside the wafer box; but the pollution outside the wafer box will not only raise the pollutants when it is opened, but also pollute the inside of the box. What is more serious is that it will contaminate each set of process equipment, which will affect the production yield of the entire production line, or increase the additional cost of further cleaning of each process equipment. On the other hand, due to the special structure of the bottom surface of the wafer box, in order to increase the paper size, the Chinese National Standard (CNS) A4 specification (210 X 297 mm) is applied. 512418 A7 B7 printed by the Intellectual Property Bureau's Consumer Cooperatives of the Ministry of Economic Affairs; V. Description of the invention () For the relocation of automated robotic arms and loading and unloading of wafers, the bottom surface of the wafer box is shaped into many grooves and convex plates. When the bottom of the wafer box is contaminated, the pollutants will be in each concave. Groove dead ends accumulate, making it extremely difficult to clean. As mentioned above, an object of the present invention is to specifically develop a cleaning device for the surface of a wafer cassette to remove contaminants on the surface of the wafer cassette. Another object of the present invention is to design a special cleaning device for the grooves and convex plates that are easy to accumulate pollutants on the bottom surface of the wafer box and difficult to clean. Yet another object of the present invention is to provide a system for immediately removing pollution, so that the pollutants removed from the surface of the wafer cassette can be immediately discharged without causing secondary pollution. Therefore, in a preferred embodiment of the present invention, a wafer box surface cleaning device is provided, which can be used to prevent the accumulation of contaminants on the surface of the wafer box and further treat the surface of the wafer box. Especially with the dynamic nozzle equipment, the bottom groove of the wafer cassette which is most vulnerable to contamination, but the most difficult to clean is removed. It contains an instant evacuation system to immediately remove the cleaned pollutants to prevent the pollutants from contaminating the wafer box or the next batch of wafer boxes to be cleaned. This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) in * n tmmam i an flu n flu til flu I · i IK t— n 11 In n a fn an n —a— i Iw I (Please read the precautions on the back before filling this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 512418 Λ7 B7__ V. Description of the invention () The present invention further guides a method for cleaning the outer surface of the wafer cassette box In order to prevent the continuous accumulation of pollutants on the surface of the wafer box, the yield of the production line will eventually be reduced. The method includes providing a set of equipment to support the wafer box to be cleaned, and exposing the surface of the wafer box to be cleaned; providing a set of fluid driving device to drive a proper cleaning fluid and the surface of the wafer box to be cleaned at high pressure. Contact; removal of pollutants from the surface of the wafer cassette by kinetic energy transfer, buoyancy, attraction, or chemical reaction between the cleaning fluid and the pollutants on the surface; providing a dynamic nozzle set, making less The cleaning fluid can provide high-pressure impact force. Through the dynamic movement of the nozzle, the impact angle of the fluid in contact with the wafer box surface is continuously changed to expand the cleaning area, penetrate the corners of the groove, and make the cleaning fluid and pollution The direction of the force of the object is constantly changing, and the reaction area is further expanded; the pollutants and the remaining cleaning fluid are immediately discharged to avoid secondary pollution. By using the method disclosed herein, each wafer box that is about to enter the process is cleaned once, which not only removes the contaminants on the wafer box, prevents the contaminants from being brought into the process equipment, but also prevents the contaminants. Dead corners on the surface of the wafer cassette are further accumulated. Brief description of the circle method: The preferred embodiment of the present invention will be described in more detail in the following explanatory text with the following figures, of which: This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) ) ------------- Install -------- Order .-------- Line (Please read the precautions on the back before filling this page) 512418 A7 B7 V. Description of the Invention (Figure 1 is a top view of an embodiment of the wafer box cleaning equipment of the present invention; (Please read the precautions on the back before filling out this page) Figure 2 is the same as the wafer box cleaning equipment of the present invention. Fig. 1 is a side sectional view of the embodiment; and Fig. 3 is a data table of a wafer box bottom cleaning experiment performed using the wafer cassette cleaning equipment of the present invention in the same manner as in Figs. 1 and 2. Description: 100 wafer box cleaning equipment 13 wafer box support frame 11 nozzle rotation ring 12 nozzle 16 (electric valve switch) on button 14 on status light 21 electric inlet valve 22 electric exhaust valve 25 compressed dry air 23 inlet Air line 21 Electric inlet valve 26 Mixed Gas 24 Exhaust pipe 17 (Electric wide switch 15 OFF status light Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs Detailed description of the invention: This paper size applies to Chinese National Standard (CNS) A4 (210 X 297 g)) 512418 Λ7 B7 V. Description of the Invention (The present invention discloses a cleaning device and method for a wafer cassette. In order to make the description of the present invention more detailed and complete, please refer to the following description and cooperate with the diagram of Figure 1. Figure 1 is the wafer of the invention A top view of one embodiment of the cassette cleaning equipment. This embodiment is designed for the bottom surface of a wafer cassette having a plurality of grooves and convex plates. According to this embodiment, the wafer cassette cleaning equipment 100 has a set of wafer cassette support frames. 13 is located at the top of the entire wafer box cleaning equipment 100, which is used to place a wafer box (not shown) to support the bottom of the wafer box. It is located inside the entire wafer box cleaning equipment 100, with a set of dynamics Nozzle group, which includes a nozzle rotation ring 11 and three nozzles 12 connected to the nozzle rotation ring 11, so that the connection of the ends of the three nozzles 12 becomes a three When the electric valve switch 16, n in the top of the wafer cassette cleaning device 100 is pressed, the 'state display lamp group 14, 15' will be turned on, and the electric air inlet 21 will be turned on at the same time. (Shown in Figure 2) and electric exhaust wide 22 (纟 will be shown in Figure 2) '' a compression dry 1; ------------ install ------- -Order i (Please read the notes on the back before filling this page) Printed air 25 (shown in Figure 2) of the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs will enter the air intake duct 23 (shown in Figure 2) ), Enter the dynamic nozzle tube group through electric air intake ㈤21 (green is shown in Figure 2), and spray out from the nozzle holes distributed in the nozzle 12, the sprayed compressed dry air column not only immediately flushes the wafer box The bottom surface of the paper is driven by the kinetic energy during ejection, which drives the nozzles 12 to rotate the nozzle ring 丨 丨 is in rotation 10 This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 ^ · Ministry of Economic Affairs wisdom Printed by the Consumer Affairs Cooperative of the Property Bureau 512418 A7 B7___ V. Description of Invention () The heart started to rotate. The nozzle holes in the nozzle 12 constantly change position as the nozzle 12 rotates, and spray out a column of compressed and dry air at various angles, and continuously clean each area of the bottom surface of the wafer box by high pressure back and forth. At the same time, the cleaned pollutants will immediately form a mixed exhaust gas 26 with compressed dry air 2 5 (shown in FIG. 2) as a carrier, and an exhaust pipe 24 (shown in FIG. (Figure 2) Pull away. After the cleaning is completed, you can press the off button 17 of the electric switch 1, 6, 17 and the electric intake valve 21 (shown in Figure 2) and the electric exhaust valve 22 (shown in Figure 2) ) Will be turned off together, the dynamic jet tube group will gradually stop rotating due to the lack of power for gas ejection. At the same time, the on-state light 14 in the state display light groups 1 4, 15 will go out, and the off-state light 15 will turn on. Shows that the entire device is shutting down. On the other hand, please refer to Figure 2. Fig. 2 is a side sectional view of the embodiment of the wafer cassette cleaning equipment of the present invention as shown in Fig. 1; When the electric intake valve and electric exhaust valve 22 are opened, the compressed dry air 25 enters the dynamic nozzle group from the intake pipe 23, enters the nozzle 12 through the nozzle rotation ring 11, and then passes through the nozzle holes in the nozzle 12 The airflow that is ejected and ejected simultaneously drives the nozzles 12 to start rotating with the nozzle rotation ring 11 as the center of rotation. As the nozzle 12 rotates, the jets from the nozzle holes form various angles. The high-pressure washing column, the bottom surface of the wafer box and the various grooves are washed under high pressure to wash down the pollutants to form a mixed exhaust gas 26. The mixed exhaust gas 26 is exhausted along the exhaust pipe 24 and then discharged through the electric exhaust valve 22 to complete 11 of the bottom surface of the wafer box. The paper size applies to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) nm 11 ln ϋ tn m en n ί i 9 «n an —ϋ · ϋ nni ol ¥ an tM9 an · ϋ HI ϋ n I (Please read the notes on the back before filling out this page) Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 V. Description of the invention () Rinse and discharge of pollutants. A ′ ^ refers to the data table in FIG. 3. According to this embodiment, 30 wafer cassettes are actually sampled for cleaning experiments' and recorded in the experimental data table. First, before the cleaning, the recorded data, Second, the bottom surface of the female Japanese yen box was cleared for a month, and there was no continuous inspection. After inspection, the number of sleeves was calculated based on the actual juice. ~ After cleaning, record the bottom surface of the wafer box after the main silk preparation / monthly cleaning of this solid silk, and after contamination inspection, the number of pollutants remaining on the bottom surface of the A wafer box is calculated. Therefore, the data in the experimental data table in Figure J shows that each wafer box was indeed contaminated before cleaning, and more than 4 contaminates were generally present. After cleaning the equipment in this embodiment, most of the dirt was removed. On average, 78.19% of the pollutants were removed because of the wafer box cleaning equipment in this embodiment. The invention further discloses a method for cleaning the outer surface of the wafer cassette box to prevent the pollutants from continuously accumulating on the surface of the wafer cassette and eventually causing the production line yield to decrease. The method includes providing a set of equipment to support the wafer box to be cleaned, and exposing the surface of the wafer box to be cleaned; and providing a set of fluid driving device to drive a proper cleaning fluid at high pressure with the surface of the wafer box to be cleaned. Contact; by the kinetic energy transmission, buoyancy, attractive force or chemical reaction between the cleaning fluid and the pollutants on the surface, the pollutants are removed from the surface of the wafer box 12 This paper size applies Chinese National Standard (CNS) A4 specifications (210 X 297 mm) * ^ -------- Order · -------- Φ ·-f Please read the unintentional matter on the back before filling in this page) Staff Consumption of Intellectual Property Bureau, Ministry of Economic Affairs Cooperative printed 512418 A7 B7 V. Description of the invention () Removed; Provide a dynamic nozzle group, so that less cleaning fluid can provide high-pressure impact force, the fluid is continuously changed by the nozzle's dynamic movement The impact angle of contact with the surface of the wafer box, in order to expand the cleaning area, penetrate the corners of the groove, and continuously change the direction of the force of the cleaning fluid and pollutants, and the reaction area is further expanded; immediately remove these pollutants and the remaining clear Fluid, in order to avoid secondary pollution. By using the method disclosed herein, each wafer box that is about to enter the process is cleaned once, which not only removes the contaminants on the wafer box, prevents the contaminants from being brought into the process equipment, but also prevents the contaminants. Dead corners on the surface of the wafer cassette are further accumulated. Another embodiment is mechanical and automated. The wafer cassette is continuously brought by a conveyor belt through the wafer cassette cleaning equipment of this embodiment. When the wafer cassette to be cleaned passes the cleaning equipment, this equipment That is, the cleaning fluid is driven to all surfaces of the wafer box from all sides, and all pollutants on all surfaces of the wafer box are removed at once, and all the removed pollutants and cleaning fluid are immediately discharged. In another embodiment, if the wafer box to be cleaned has been contaminated very seriously, it cannot be cleaned by ordinary fluids. Dynamic bristles of appropriate material can be added to the wafer box cleaning equipment to enhance the pollutants. Sweep function; or control the intake valve and exhaust valve by computer to open and close separately to change the pulse and pressure of the cleaning fluid. 13 This paper size is in accordance with China National Standard (CNS) A4 (210 X 297 mm) ni Hi n ^^ 1 m 1 n-1 ^^ 1 ft— nn I · · ϋ i ΛβΜ— -ϋ · ϋ ni 一· I 11-- n Hi ii ϋ I (Please read the notes on the back before filling out this page) 512418 A7 V. Description of the invention () An advantage of the present invention is to provide a wafer cassette cleaning equipment, which uses a The dynamic nozzle group provides less cleaning fluid and provides a stronger impact force. In addition to reducing the cleaning cost, it can penetrate deeper into the groove of the bottom of the wafer box that is difficult to handle. With the dynamic movement of the nozzle group, The angle of the cleaning fluid column impacting the pollutants can be continuously changed to expand the cleaning area and change the direction of the force between the cleaning fluid and the pollutants; if the cleaning fluid with a chemical reaction is used, the Reaction area, short time for contaminant removal. Another advantage of the present invention is that the wafer box cleaning equipment of the present invention has an instant pollutant removal system, which can immediately remove pollutants removed from the surface of the wafer box to avoid secondary pollution. As will be understood by those familiar with this technology, the above is only a preferred embodiment of the present invention, and is not intended to limit the scope of the patent application for the present invention; all others completed without departing from the spirit disclosed by the present invention, etc. Effective changes or modifications should be included in the scope of patent application described below. 1 · emm§ i ^ inni emme «m ϋ- nnn I · im ϋ4 n US n« —Bi flu ^ n ϋ —9 «Bn 11 n ΛΜΜΜ§ I (Please read the notes on the back before filling this page) Economy Printed by the Ministry of Intellectual Property Bureau's Consumer Cooperatives Paper size applicable to Chinese National Standard (CNS) A4 (210 x 297 mm)