TW508609B - Electromagnetic shielding component, process for producing the same, and display device - Google Patents
Electromagnetic shielding component, process for producing the same, and display device Download PDFInfo
- Publication number
- TW508609B TW508609B TW088108316A TW88108316A TW508609B TW 508609 B TW508609 B TW 508609B TW 088108316 A TW088108316 A TW 088108316A TW 88108316 A TW88108316 A TW 88108316A TW 508609 B TW508609 B TW 508609B
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- electromagnetic shielding
- layer
- transparent substrate
- shielding member
- conductive layer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25H—WORKSHOP EQUIPMENT, e.g. FOR MARKING-OUT WORK; STORAGE MEANS FOR WORKSHOPS
- B25H3/00—Storage means or arrangements for workshops facilitating access to, or handling of, work tools or instruments
- B25H3/02—Boxes
- B25H3/021—Boxes comprising a number of connected storage elements
- B25H3/023—Boxes comprising a number of connected storage elements movable relative to one another for access to their interiors
- B25H3/028—Boxes comprising a number of connected storage elements movable relative to one another for access to their interiors by sliding extraction from within a common frame
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- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47B—TABLES; DESKS; OFFICE FURNITURE; CABINETS; DRAWERS; GENERAL DETAILS OF FURNITURE
- A47B47/00—Cabinets, racks or shelf units, characterised by features related to dismountability or building-up from elements
- A47B47/0091—Modular arrangements of similar assemblies of elements
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Details Of Measuring And Other Instruments (AREA)
- Gas-Filled Discharge Tubes (AREA)
Abstract
Description
508609 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明(1 ) 發明之背景 發明之頜域 本發明係有關於電磁遮蔽構件,對例如遮蔽電磁波係 爲有用的,且特別係有關於供顯示裝置用的電磁遮蔽構件 ’該構件被使用以放置在例如爲一等離子顯示板之顯示板 的前方面上,以供遮蔽電磁波及防止外部光線反射之目的 之用。 習知技術之說明 在例如爲供顯示之用的電子管之那些電子裝置中,其 係經常在人們身側使用,且傳統地均考慮到電磁波對人體 之有害影響,而要求自這些裝置發射出之電磁波必須降至 規定範圍內。 等離子顯示板(於後亦稱之爲'' P D P s 〃 )均具有 小的尺寸及輕的重量,因此,近年來已被廣泛使用爲顯示 裝置。但是,P D P s使用等離子區放電以供發射光線之 用,且傾向於洩漏出頻率在3 0至1 3 Ο Μ Η z之不必要 的電磁波。爲此理由,於P D P s中,特別需要儘可能地 抑制電磁波,以使不會干擾到其他裝置(例如,資訊處理 器,等)。 進一步的,在例如爲P D P s之顯示板中,一般需要 防止外部光線之反射,以避免影像對比之下降。在使用 P D P s之影像裝置中,其螢幕均爲平坦的。因而,當外 部光線進入該螢幕且寬廣地反射時之情況中,該反射光亦 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) -----·--I 4 — I I i I I — I I 1 ^ · I I---丨丨-線. (請先閱讀背面之注意事項再填寫本頁) -4- 經濟部智慧財產局員工消費合作社印製 508609 A7 B7 五、發明說明(2 ) 可進入觀看者之眼睛內’使得螢幕上之影像成爲看不淸楚 的。爲此理由,於該種裝置中特別需要防止外部光線之反 射。 此外’於P D P s中,亦需要抑制當p d P s發射光 線時所發射之近紅外線。此種抑制之理由如下:近紅外線 之波長係接近於遙控設備、光學通訊裝置、及類似物所使 用之紅外線,因此,當這些設備及裝置鄰近於P D P s操 作時,其正常操作會被干擾到。 此外,於P D P s中,亦需要傳送於預定透射比之可 視光線,以達到良好之影像顯示。 爲達成這些需求,在P D P s中傳統上採用下述方法 :經由將具有遮蔽電磁波或截止紅外線之功能的一薄膜嵌 入二玻璃板之間,而準備一板狀構件,且將板狀構件置於 一 P D P s之前方面上,以作爲遮蔽電磁波或截止紅外線 之機構。 被置於例如爲P D P s之顯示板的前方面上之此種形 態的板狀構件,一般均被稱爲顯示板前方板或電磁遮蔽構 件。 發明之槪要說明 但是,前述之傳統顯不板前方板具有該前方板之重量 非常重之問題。此外,其具有另一問題,即爲,該前方板 不能滿足有關於遮蔽電磁波、截止紅外線、防止外部光線 之反射、可視光線之傳送與接收、及類似物之所有需要。 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) -----T---ri#裝--------訂--------- (請先閱讀背面之注意事項再填寫本頁) -5- 經濟部智慧財產局員工消費合作社印製 508609 A7 ---- B7 五、發明說明(3 ) 此外,除了前述功能之外,顯示板前方板亦需要可被輕易 地淸潔,且由大量生產、成本、及類似物之觀點,顯示板 前方板亦需要具有方便製造之結構。 近年來,亦使用在透明玻璃或塑膠基底之表面上形成 由金屬薄膜製造之一網的顯示板前方板。經由使用此一前 方板,可獲致遮蔽電磁波、良好之光線傳送、及類似物。 但是,即使該種顯示板前方板可達成所有前述之需求,但 自大量生產、成本、及類似物之觀點而言,其未具有可方 便製造之結構。 本發明可達成前述之相關需求。因而,本發明之一目 的係提供一種電磁遮蔽構件,可滿足有關於遮蔽電磁波、 截止紅外線、防止外部光線之反射、光傳送、及類似物之 所有需要,且其具有輕的重量,當考慮到大量生產、成本 及類似物時,其亦具有方便製造之結構;供製造該構件之 製程;及使用該構件之顯示裝置。 本發明之第一電磁遮蔽構件,包括一透明基底;及被 提供在該透明基底之至少一表面上的一電磁遮蔽層,其中 ,該電磁遮蔽層包括具有包含一或更多組之平行直線的圖 型之一導電層,及以被塡入呈現在該導電層圖型內之空間 中的方式形成之一透明樹脂層;且該導電層係由一導電墨 水所製成。' 本發明之第二電磁遮蔽構件,包括一透明基底;及被 提供在該透明基底之至少一表面上的一電磁遮蔽層,其中 ,該電磁遮蔽層包括具有包含一或更多組之平行直線的圖 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) --------^---裝·丨^— (請先閱讀背面之注意事項再填寫本頁) tr------丨! -6 - 508609 A7 ____B7 _ 五、發明說明u ) (請先閱讀背面之注意事項再填寫本頁) 型之一導電層’及以被塡入呈現在該導電層圖型內之空間 中的方式形成之一透明樹脂層;且該導電層係由一金屬薄 膜所製成。 可使用透明樹脂薄膜、透明樹脂板、透明樹脂片、透 明玻璃、及類似物以供透明基底之用。但是,自生產性的 觀點而言,較佳爲樹脂薄膜。聚乙烯對鈦酸鹽(P E T ) 薄膜可被使用爲樹脂薄膜;但是,該樹脂薄膜並不侷限於 P E T薄膜。 被使用供形成該導電層之導電墨水,可使用例如爲丙 烯酸樹脂粘合劑或溶劑與金屬粉末之混合物。精確言之, 例如爲鎳粉末、銀粉末、或銀-銅複合粉末與丙烯酸樹脂 粘合劑之混合物,亦可使用金粉末或銀粉末與溶劑之混合 物。可使用任何之金屬粉末,只要其可授與預定之導電性 至該導電層。進一步的,使用供形成導電墨水之樹脂粘合 劑或溶劑,可依據穩定性及處理能力加以妥適之選擇,且 不侷限於前面所述。 、 經濟部智慧財產局員工消費合作社印製 較佳的使用電離-輻射-可硬化樹脂、供形成該透明 樹脂層之用。 進一步的,較佳的疊層-近紅外線截止層至由導電層 與透明樹脂層構成之電磁遮蔽層,且更佳的疊層一抗反射 層至電磁遮蔽層或該近紅外線截止層。 本發明之一顯示裝置包括本發明之一電磁遮蔽構件, 其中,該電磁遮蔽構件係被疊層至該顯示裝置之前方面。 供製造一電fe遮敝構件之一第一製程,包括下列步驟 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) 嫌 經濟部智慧財產局員工消費合作社印製 508609 A7 B7 五、發明說明(5 ) :(a )準備一板,該板設有相對應於包含一或更多組平 行直線之圖型空間之形態的凹處,且以一樹脂塡入凹處內 ;(b )將一透明基底之一表面攜至與該板接觸,而在透 明基底與該板維持於互相緊密接觸下,硬化該樹脂;(c )自該板分離透明基底,以自該板轉移已硬化樹脂至透明 基底,因而在透明基底之一表面上形成一透明樹脂層;( d )在已形成該透明樹脂層之透明基底的一表面上,塗層 一導電墨水;及(e )移除在透明樹脂層頂部上既存之任 何過剩導電墨水,且以該墨水塡入呈現在該透明樹脂層內 之空間中而形成導電層。 供製造一電磁遮蔽構件之一第二製程,包括下列步驟 :(a )準備一板,該板設有相對應於包含一或更多組平 行直線之圖型的凹處,且以導電墨水塡入該凹處;(b ) 將一透明基底之一表面攜至與該板接觸,而在該透明基底 與該板維持於互相緊密接觸下,硬化該導電墨水;(c ) 自該板分離透明基底,以自該板轉移已硬化之導電墨水至 透明基底,因而在透明基底之一表面上形成一導電層;及 (d )將一樹脂注入呈現在導電層之圖型內的空間,其中 ,暴露出透明基底之一表面,因而形成一透明樹脂層。 供製造一電磁遮蔽構件之一第三製程,包括下列步驟 :(a )準備一板,該板設有相對應於包含一或更多組平 行直線之圖型內的空間中之形態的凹處,且以一樹脂塡入 凹處內;(b)將一透明基底之一表面攜至與該板接觸, 而在透明基底與該板維持於互相緊密接觸下,硬化該樹脂 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) -----1----:---裝--------訂---------線· (請先閱讀背面之注意事項再填寫本頁) -8- 508609 A7 ^ B7 五、發明說明(6 ) ;(c )自該板分離該透明基底,以自該板轉移已硬化樹 月曰至透明基底’因而在該透明基底之一'表面上形成一'透明 樹脂層;(d )在已形成透明樹脂層之透明基底的一表面 上,形成一金屬薄膜;及(d )移除在該透明樹脂層頂部 上既存之任何金屬薄膜,且以該金屬薄膜塡入呈現在該透 明樹脂層內之空間中,以形成一導電層。 經由允許本發明之電磁遮蔽構件成爲前述之構造,以 使得該構件之結構可合適供大量生產之用,其中,相當容 易製成電磁遮蔽層。進一步的,因爲相當容易添加一近紅 外線截止層與一抗反射層至該電磁遮蔽層,可以輕易地製 造出除了電磁電磁波之功能以外,亦具有截止近紅外線且 防止反射外部光線之功能的電磁遮蔽構件。 換言之,本發明之電磁遮蔽構件具有一簡單之結構, 使得可分離製成之一電磁遮蔽層、一近紅外線截止層、及 一抗反射層,均直接地或經由一粘劑層而互相地粘附。因 而,由生產性及功能的觀點而言,可以說此一結構係非常 優異的。 特別的,經由允許一電磁遮蔽構件包括一透明基底, 及被設於透明基底之至少一表面上之一電磁遮蔽層,且經 由允許該電磁遮蔽層包括具有由一或更多組平行直線之圖 型的一導電層,及以被塡入呈現在該導電層圖型內之空間 中的方式形成之一透明樹脂層,且經由使用一導電墨水形 成一導電層,該電磁遮蔽構件之結構可成爲適合供大量生 產之用,其中,相當易於製成該電磁遮蔽層。進一步的, 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) (請先閱讀背面之注意事項再填寫本頁) --I ί II I 訂------ί·. 經濟部智慧財產局員工消費合作社印製 -9 - 經濟部智慧財產局員工消費合作社印製 508609 A7 __B7_ 五、發明說明(7 ) 經由使用一樹脂薄膜作爲透明基底,其可獲致一可撓的、 輕重量之電磁遮蔽構件,且亦可成功地達成大量製造。 此外,經由疊層一近紅外線截止層至導電層及透明樹 脂層構成之電磁遮蔽層,且經由進一步的疊層一抗反射層 至電磁遮蔽層與近紅外線截止層,所因而產生之電磁遮蔽 構件可具有改良之功能。 較佳的,形成在該透明基底之一表面上之導電層,具 有二組互相交叉之平行直線形成之網狀圖型。較佳的,使 具有一網狀圖型之導電層的薄片電阻率成爲1 0 Ω/口( 亦以Ω / s Q r表示)或更少,更佳爲5 Ω / □或更少, 且最佳爲1Ω/ □或更少。可輕易地形成具有20dB ( 分貝)或更多內之2 0至1 0 0 0 ΟΜΗ z頻率之衰減電 磁波之網狀圖型。經由使用該種網狀圖型,可防止在等離 子顯示板(P D P )中之由等離子區放電所發射之例如在 3 0至1 3 0 Μ Η z中之不必要電磁波的洩漏,且其因此 可避免千擾其他裝置(例如資訊處理器,等)。 近紅外線截止層之材料上並無特殊限制,且可使用以 一近紅外線截止層塗層之商用聚乙烯對鈦酸鹽(P E T ) 薄膜以形成該層。日本Toyobo Co.,Ltd.,所製造之''號碼 • 2 8 3 2 〃 ,係最通用之已知的以一近紅外線截止層塗 層之商用ΡΈΤ薄膜。 有關於近紅外線截止薄膜,當供那些波長在8 0 0至 1 〇 〇 0 n m範圍內之波長的近紅外線用之透射比爲2 0 %或更少時,被使用供遙控設備、光學通訊裝置、及類似 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) <請先閱讀背面之注意事項再填寫本頁) ----訂---------- 10- 508609 A7 B7_____ 五、發明說明(8 ) (請先閱讀背面之注意事項再填寫本頁) 物所使用之紅外線的波長範圍可被儘可能的減少,因此, 即使當這些設備與裝置鄰近於P D P s操作時,亦可能不 會干擾到這些設備與裝置之正常作業。 抗反射層(A R層)係有用於供防止可視光線之反射 。由結構之觀點而言,已知有多種單層形態與多層形態之 抗反射層。在多層形態之抗反射層中,通常交互地疊層高 折射率層與低折射率層。 抗反射層之材料並無特殊限制。但是,在交互地疊層 高折射率層與低折射率層之抗反射層的情況中,較佳的使 用鈦氧化物、銷、及類似物形成高折射率層,及較佳的使 用矽氧化物形成低折射率層。進一步的,例如爲濺射或澱 積之乾成型製程(乾製程),或例如爲塗層之濕成型製程 (濕製程),均可應用以作爲供形成抗反射層之製程;可 使用任何製程,只要可以獲致所需要之效果。 經濟部智慧財產局員工消費合作社印製 有關於抗反射薄膜,當供具有4 5 0至6 5 0 n m範 圍內之波長的可視光之反射比被製爲2 %或更少,且當供 具有4 5 0至6 5 0 n m範圍內之波長的可視光之吸收比 被製成2 8 %或更少時,在近紅外線截止層與抗反射層均 被疊層至電磁遮蔽層之條件下,因而產生之電磁遮蔽構件 顯示出優異的可視性,而可防止由於外部光線或類似物之 反射造成之影像品質(對比)之降低,因此,不只可使用 在顯示板前方板,本發明亦可使用供多種目的之用。 經由允許供製造一電磁遮蔽構件用的本發明之製程成 爲前述之構造,其可高度的適用於大量製造。 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) -11 - 508609 A7 B7 五、發明說明(9 ) 特別的’當一樹脂薄膜被使用爲透明基底時,一底座 供形成導電層於其上,經由將於後描述之製程實施例,可 連續地製造一電磁遮蔽構件。因而,使用樹脂薄膜可使得 製造製程適合用於大量製造。 即爲’依據本發明,可提供被放置在例如爲P D P之 顯示裝置的前方面上使用之電磁遮蔽構件,該構件具有優 異之大量製造性,且可相當容易地授予截止近紅外線之功 能、防止外部光線之反射、及類似物。 進一步的,依據本發明,可以提供一製程,而以優異 之大量製造來製造電磁遮蔽構件,其中,分別地準備一電 磁遮蔽層、一抗反射層、及一近紅外線截止層,且然後互 相的疊層。 圖形之簡要說明 於圖形中, 圖1 A係一槪略橫剖面圖·,顯示依據本發明之一電磁 遮蔽構件之第一實施例的基本部份; 圖1 B係一平面圖,顯示自圖1 A中之側邊I B觀看 時,示於圖1 A中之電磁遮蔽構件的整體結構; 圖1 C係圖18中之該部份1(:的放大平面圖; 圖1 D係一槪略橫剖面圖,顯示圖1 A中所示之該電 磁遮蔽構件之一變更實施例的基本部份; 圖2係一槪略橫剖面圖’顯示依據本發明之一電磁遮 蔽構件之第二實施例的基本部份; 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) {請先閲讀背面之注意事項再填寫本頁) 一· ϋ n ϋ n 1 ϋ n · 經濟部智慧財產局員工消費合作社印制取 -12- 經濟部智慧財產局員工消費合作社印製 5〇86?^ 第謝〇8316號專利申請案 民画9·ί年7后11日^正 中文說明書修正頁 Α7 -:: -- '·" Ί 五、發明説明(10) 圖3係一槪略橫剖面圖,顯示依據本發明之一電磁遮 蔽構件之第三實施例的基本部份; 圖4係一槪略橫剖面圖,顯示依據本發明之一電磁遮 蔽構件之第四實施例的基本部份; 圖5係一橫剖面圖,顯示一顯示裝置之一實施例,該 顯示裝置含有被置於前方面上之一電磁遮蔽構件; 圖6係一槪略橫剖面圖,顯不圖5之顯示裝置之基本 部份; 圖7係一槪略圖,顯示使用供製造示於圖1 A中之電 磁遮蔽構件之一製造系統之一範例; 圖8 A、8 B、及8 C均爲槪略橫剖面圖,用以解釋 供製造示於圖1 A之電磁遮蔽構件之一製程的第一實施例 9 圖9 A與9 B均爲槪略橫剖面圖,用以解釋供製造示 於圖1 A中之電磁遮蔽構件之一製程的第二實施例;及 圖10A、 10B、 10C與10D均爲槪略橫剖面 圖,用以解釋供製造示於圖4中之電磁遮蔽構件之一製程 的一實施例。 主要元件對照表 110 透明基底, 115 電磁遮蔽層 120 導電層 121 導電層 本紙張尺度適用中.國國家標準(CNS ) A4規格(210X297公釐) (請先閲讀背面之注意事項再填寫本頁)508609 Printed by A7 B7, Consumer Cooperatives, Intellectual Property Bureau, Ministry of Economic Affairs 5. Description of the invention (1) Background of the invention The jaw field of the invention The invention relates to electromagnetic shielding members, and is useful for shielding electromagnetic wave systems, for example. Electromagnetic shielding member for display device 'This member is used to be placed on the front side of a display panel such as a plasma display panel for the purpose of shielding electromagnetic waves and preventing reflection of external light. Description of the Related Art Among electronic devices such as electronic tubes for display, which are often used on the side of people, and traditionally consider the harmful effects of electromagnetic waves on the human body, they are required to be emitted from these devices. Electromagnetic waves must fall within the specified range. Plasma display panels (hereinafter also referred to as "PDPS") have small size and light weight. Therefore, they have been widely used as display devices in recent years. However, P D P s uses a plasma area discharge for emitting light, and tends to leak out unnecessary electromagnetic waves with a frequency of 30 to 130 MHz. For this reason, in P D P s, it is particularly necessary to suppress electromagnetic waves as much as possible so as not to interfere with other devices (for example, information processors, etc.). Further, in a display panel such as P D P s, it is generally necessary to prevent reflection of external light, so as to avoid a drop in image contrast. In the imaging device using P D P s, the screen is flat. Therefore, when external light enters the screen and is widely reflected, the reflected light also conforms to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) on this paper scale ----- · --I 4 — II i II — II 1 ^ · I I --- 丨 丨 -line. (Please read the precautions on the back before filling out this page) -4- Printed by the Intellectual Property Bureau Employee Consumer Cooperative of the Ministry of Economic Affairs 508609 A7 B7 V. Description of the invention (2) Can enter into the eyes of the viewer 'makes the image on the screen inconspicuous. For this reason, it is particularly necessary to prevent reflection of external light in such a device. In addition, in P D P s, it is also necessary to suppress near-infrared rays emitted when p d P s emits light. The reason for this suppression is as follows: The wavelength of near-infrared is close to that used by remote control equipment, optical communication devices, and the like. Therefore, when these devices and devices are operated near PDPs, their normal operation will be disturbed. . In addition, in P D P s, it is also necessary to transmit visible light with a predetermined transmittance to achieve a good image display. To meet these requirements, the following methods have traditionally been adopted in PDPs: a plate-like member is prepared by inserting a thin film having a function of shielding electromagnetic waves or cutting off infrared rays between two glass plates, and the plate-like member is placed on A PDP s has previously been used as a mechanism to shield electromagnetic waves or cut off infrared rays. A plate-shaped member placed on the front side of a display panel such as P D P s is generally referred to as a front panel of a display panel or an electromagnetic shielding member. SUMMARY OF THE INVENTION However, the aforementioned conventional display panel has a problem that the front panel has a very heavy weight. In addition, it has another problem, that is, the front panel cannot satisfy all the requirements regarding shielding electromagnetic waves, cutting off infrared rays, preventing reflection of external light, transmission and reception of visible light, and the like. This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) ----- T --- ri # packing -------- order --------- ( Please read the precautions on the back before filling this page) -5- Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 508609 A7 ---- B7 V. Description of the invention (3) In addition to the aforementioned functions, the front of the display panel The panel also needs to be easily cleanable, and from the viewpoint of mass production, cost, and the like, the front panel of the display panel also needs to have a structure that is convenient to manufacture. In recent years, a display panel front plate in which a net made of a metal film is formed on the surface of a transparent glass or plastic substrate has also been used. By using this front panel, electromagnetic shielding, good light transmission, and the like can be obtained. However, even though such a display panel front panel can fulfill all of the aforementioned requirements, from the viewpoint of mass production, cost, and the like, it does not have a structure that can be easily manufactured. The present invention can fulfill the aforementioned related needs. Accordingly, it is an object of the present invention to provide an electromagnetic shielding member that can meet all the needs related to shielding electromagnetic waves, cutting off infrared rays, preventing reflection of external light, light transmission, and the like, and which has a light weight. In mass production, cost, and the like, it also has a structure that is convenient to manufacture; a process for manufacturing the component; and a display device using the component. The first electromagnetic shielding member of the present invention includes a transparent substrate; and an electromagnetic shielding layer provided on at least one surface of the transparent substrate, wherein the electromagnetic shielding layer includes a substrate having parallel straight lines including one or more groups. A conductive layer of the pattern, and a transparent resin layer formed in a manner of being inserted into the space present in the pattern of the conductive layer; and the conductive layer is made of a conductive ink. '' The second electromagnetic shielding member of the present invention includes a transparent substrate; and an electromagnetic shielding layer provided on at least one surface of the transparent substrate, wherein the electromagnetic shielding layer includes a parallel straight line including one or more groups The paper size of the illustrated book applies to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) -------- ^ --- installation · 丨 ^ — (Please read the precautions on the back before filling this page ) tr ------ 丨! -6-508609 A7 ____B7 _ V. Description of the invention u) (Please read the precautions on the back before filling this page) One of the conductive layers of the type 'and the way it is inserted into the space presented in the pattern of the conductive layer Forming a transparent resin layer; and the conductive layer is made of a metal thin film. Transparent resin films, transparent resin plates, transparent resin sheets, transparent glass, and the like can be used for transparent substrates. However, from the viewpoint of productivity, a resin film is preferred. Polyethylene-titanate (PET) film can be used as a resin film; however, the resin film is not limited to PET film. The conductive ink used for forming the conductive layer may be, for example, an acrylic resin binder or a mixture of a solvent and a metal powder. Specifically, for example, a nickel powder, a silver powder, or a mixture of a silver-copper composite powder and an acrylic resin binder, or a mixture of gold powder or silver powder and a solvent may be used. Any metal powder may be used as long as it can impart a predetermined conductivity to the conductive layer. Further, the resin adhesive or solvent used to form the conductive ink can be appropriately selected according to stability and processing ability, and is not limited to the foregoing. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. It is better to use ionizing-radiating-hardenable resin for forming the transparent resin layer. Further, it is preferable to laminate a near-infrared cut-off layer to an electromagnetic shielding layer composed of a conductive layer and a transparent resin layer, and more preferably to laminate an anti-reflection layer to the electromagnetic shielding layer or the near-infrared cut-off layer. A display device of the present invention includes an electromagnetic shielding member of the present invention, wherein the electromagnetic shielding member is laminated to a previous aspect of the display device. One of the first processes for manufacturing an electrical shielding member, including the following steps. This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm). Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. 508609 A7 B7 Fifth, the invention description (5): (a) prepare a plate provided with a recess corresponding to the shape of the pattern space containing one or more sets of parallel straight lines, and the resin is inserted into the recess; (b) carrying a surface of a transparent substrate into contact with the plate, and curing the resin while the transparent substrate and the plate are maintained in close contact with each other; (c) separating the transparent substrate from the plate to transfer from the plate The resin has been hardened to the transparent substrate, thereby forming a transparent resin layer on one surface of the transparent substrate; (d) coating a conductive ink on a surface of the transparent substrate on which the transparent resin layer has been formed; and (e) shifting Except for any excess conductive ink existing on top of the transparent resin layer, the conductive layer is formed by injecting the ink into the space present in the transparent resin layer. A second process for manufacturing an electromagnetic shielding member, including the following steps: (a) preparing a plate provided with a recess corresponding to a pattern containing one or more sets of parallel straight lines, and using conductive ink; Into the recess; (b) carrying a surface of a transparent substrate into contact with the plate, and hardening the conductive ink while the transparent substrate and the plate are maintained in close contact with each other; (c) separating and transparent from the plate A substrate to transfer the hardened conductive ink from the plate to the transparent substrate, thereby forming a conductive layer on one surface of the transparent substrate; and (d) injecting a resin into the space presented in the pattern of the conductive layer, wherein, A surface of the transparent substrate is exposed, thereby forming a transparent resin layer. A third process for manufacturing an electromagnetic shielding member, including the following steps: (a) preparing a plate provided with a recess corresponding to a shape in a space within a pattern containing one or more sets of parallel straight lines (B) Carry one surface of a transparent substrate into contact with the board, and harden the resin while the transparent substrate and the board are kept in close contact with each other. This paper is suitable for China National Standard (CNS) A4 Specification (210 X 297 mm) ----- 1 ----: ------------------------------- Please read the precautions on the back before filling this page) -8- 508609 A7 ^ B7 V. Description of the invention (6); (c) Separate the transparent substrate from the board to transfer the hardened tree from the board to the transparent The substrate 'thus forms a' transparent resin layer 'on one of the surfaces of the transparent substrate; (d) forming a metal thin film on a surface of the transparent substrate on which the transparent resin layer has been formed; and (d) removing on the transparent substrate Any metal thin film existing on top of the resin layer, and the metal thin film is inserted into the space present in the transparent resin layer to form a conductive layer . By allowing the electromagnetic shielding member of the present invention to have the aforementioned structure, the structure of the member can be suitably used for mass production, and among them, it is relatively easy to make the electromagnetic shielding layer. Further, because it is relatively easy to add a near-infrared cut-off layer and an anti-reflection layer to the electromagnetic shielding layer, in addition to the function of electromagnetic waves, it can easily produce an electromagnetic shielding that has the function of blocking near-infrared rays and preventing reflection of external light. member. In other words, the electromagnetic shielding member of the present invention has a simple structure, so that an electromagnetic shielding layer, a near-infrared cut-off layer, and an anti-reflection layer can be separated and made to adhere to each other directly or via an adhesive layer. Attached. Therefore, from the viewpoint of productivity and function, it can be said that this structure is very excellent. Specifically, by allowing an electromagnetic shielding member to include a transparent substrate and an electromagnetic shielding layer disposed on at least one surface of the transparent substrate, and by allowing the electromagnetic shielding layer to include a graph having one or more sets of parallel straight lines A conductive layer of the type, and a transparent resin layer formed in a manner of being impregnated into a space present in the pattern of the conductive layer, and by using a conductive ink to form a conductive layer, the structure of the electromagnetic shielding member can become It is suitable for mass production, in which the electromagnetic shielding layer is relatively easy to make. Further, this paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) (Please read the precautions on the back before filling this page) --I ί II I Order ------ ί · Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs-9-Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 508609 A7 __B7_ V. Description of the Invention (7) By using a resin film as a transparent substrate, it can obtain a flexible Light-weight electromagnetic shielding member, and can also successfully achieve mass production. In addition, an electromagnetic shielding layer is formed by laminating a near-infrared cut-off layer to an electromagnetic shielding layer composed of a conductive layer and a transparent resin layer, and further laminating an anti-reflection layer to an electromagnetic shielding layer and a near-infrared cut-off layer. May have improved functions. Preferably, the conductive layer formed on one surface of the transparent substrate has a network pattern formed by two sets of parallel straight lines crossing each other. Preferably, the sheet resistivity of the conductive layer having a mesh pattern is 10 Ω / mouth (also expressed as Ω / s Q r) or less, more preferably 5 Ω / □ or less, and It is preferably 1Ω / □ or less. It is easy to form a net pattern of attenuated electromagnetic waves with a frequency of 20 to 100 Η ΜΜ z at 20 dB (decibel) or more. By using such a mesh pattern, leakage of unnecessary electromagnetic waves, such as in 30 to 130 M Η z, emitted by a plasma zone discharge in a plasma display panel (PDP) can be prevented, and thus it can prevent Avoid disturbing other devices (such as information processors, etc.). The material of the near-infrared cut-off layer is not particularly limited, and a commercial polyethylene-titanate (PET) film coated with a near-infrared cut-off layer can be used to form the layer. The "No. 2 8 3 2" manufactured by Japan's Toyobo Co., Ltd. is the most commonly known commercial PT film coated with a near-infrared cut-off layer. Regarding the near-infrared cut-off film, when the transmittance of near-infrared for those wavelengths in the range of 800 to 1,000 nm is 20% or less, it is used for remote control equipment, optical communication devices , And similar to this paper size applies Chinese National Standard (CNS) A4 specifications (210 X 297 mm) < Please read the precautions on the back before filling this page) ---- Order --------- -10- 508609 A7 B7_____ V. Description of the invention (8) (Please read the precautions on the back before filling out this page) The infrared wavelength range used by the object can be reduced as much as possible. Therefore, even when these devices are close to the device During the operation of the PDP, it may not interfere with the normal operation of these devices and devices. The anti-reflection layer (AR layer) is used to prevent reflection of visible light. From the viewpoint of the structure, there are known antireflection layers in a variety of single-layer and multilayer forms. In a multilayer antireflection layer, a high refractive index layer and a low refractive index layer are usually alternately laminated. The material of the anti-reflection layer is not particularly limited. However, in the case of an antireflection layer in which a high refractive index layer and a low refractive index layer are alternately stacked, titanium oxide, pins, and the like are preferably used to form a high refractive index layer, and silicon oxide is preferably used. The object forms a low refractive index layer. Further, for example, a dry forming process (dry process) such as sputtering or deposition, or a wet forming process (wet process) such as coating, can be applied as a process for forming an antireflection layer; any process may be used , As long as the desired effect can be achieved. The Anti-Reflection Film is printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. When the reflection ratio of visible light having a wavelength in the range of 450 to 65 nm is 2% or less, and when When the absorption ratio of visible light having a wavelength in the range of 450 to 650 nm is made to 28% or less, under conditions that both the near-infrared cut-off layer and the anti-reflection layer are laminated to the electromagnetic shielding layer, The electromagnetic shielding member thus produced exhibits excellent visibility, and can prevent degradation of image quality (contrast) due to reflection of external light or the like. Therefore, the invention can be used not only on the front panel of the display panel, but also on the display panel. For multiple purposes. The process of the present invention, which allows manufacturing of an electromagnetic shielding member, is constructed as described above, which is highly suitable for mass production. This paper size is in accordance with Chinese National Standard (CNS) A4 (210 X 297 mm) -11-508609 A7 B7 V. Description of the invention (9) Special 'When a resin film is used as a transparent substrate, a base is formed On the conductive layer, an electromagnetic shielding member can be continuously manufactured through a process embodiment described later. Therefore, the use of a resin film makes the manufacturing process suitable for mass production. That is, according to the present invention, it is possible to provide an electromagnetic shielding member used on the front side of a display device such as a PDP. The member has excellent mass manufacturability, and can easily grant a function to cut off near infrared rays and prevent Reflection of external light, and the like. Further, according to the present invention, it is possible to provide a process for manufacturing an electromagnetic shielding member with excellent mass manufacturing, wherein an electromagnetic shielding layer, an anti-reflection layer, and a near-infrared cut-off layer are separately prepared, and then mutually Stacked. A brief description of the figure is shown in the figure. Fig. 1 is a schematic cross-sectional view showing the essential part of the first embodiment of an electromagnetic shielding member according to the present invention. Fig. 1 is a plan view showing from Fig. 1 When the side IB in A is viewed, the overall structure of the electromagnetic shielding member shown in FIG. 1A is shown in FIG. 1; FIG. 1C is an enlarged plan view of the part 1 (: in FIG. 18; FIG. 1 is a schematic cross section FIG. 2 shows a basic part of a modified embodiment of the electromagnetic shielding member shown in FIG. 1A; FIG. 2 is a schematic cross-sectional view showing a basic embodiment of a second embodiment of an electromagnetic shielding member according to the present invention Partial; This paper size is in accordance with Chinese National Standard (CNS) A4 (210 X 297 mm) {Please read the notes on the back before filling out this page) I · ϋ n ϋ n 1 ϋ n · Intellectual Property Bureau of the Ministry of Economic Affairs Printed by Employee Consumer Cooperatives -12- Printed by Employee Consumption Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5〇86? ^ Xie 〇8316 Patent Application Civil Paintings 9 · 11 Years After 7 ^^ Chinese Manual Revised Page Α7- ::-'· " Ί V. Description of the invention (10) Figure 3 is a little horizontal A plan view showing the essential parts of a third embodiment of an electromagnetic shielding member according to the present invention; FIG. 4 is a schematic cross-sectional view showing the essential parts of a fourth embodiment of an electromagnetic shielding member according to the present invention 5 is a cross-sectional view showing an embodiment of a display device including an electromagnetic shielding member placed on the front side; FIG. 6 is a schematic cross-sectional view showing the display of FIG. 5 The basic part of the device; Figure 7 is a schematic diagram showing an example of a manufacturing system for manufacturing the electromagnetic shielding member shown in Figure 1 A; Figures 8 A, 8 B, and 8 C are schematic A cross-sectional view for explaining a first embodiment of a process for manufacturing one of the electromagnetic shielding members shown in FIG. 1A. FIG. 9A and 9B are schematic cross-sectional views for explaining the manufacturing and shown in FIG. 1A. A second embodiment of a process of one of the electromagnetic shielding members in FIG. 2; and FIGS. 10A, 10B, 10C, and 10D are schematic cross-sectional views for explaining a process of manufacturing one of the electromagnetic shielding members shown in FIG. 4. Examples. Main component comparison table 110 transparent substrate, 115 electromagnetic shielding layer 120 conductive layer 121 conductive layer The paper size is applicable. National National Standard (CNS) A4 specification (210X297 mm) (Please read the precautions on the back before filling this page)
-13- 508609 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明(11 ) 123 電磁遮蔽區域 12 5 接地框架區域 1 3 0 透明樹脂層 13 5 凹處 14 0 近紅外線截止層 15 0 抗反射層 160 粘著層 4 0 0 電磁遮蔽構件 410 等離子顯示板 4 2 0 底座 4 3 0 箱形本體 431 前方部份 4 3 3 後方部份 4 4 0 托架 4 5 1 軸套 4 5 3 螺栓 6 2 0 樹脂 630 糊漿狀導電墨水 6 5 0 滾筒 6 5 1 凹處 3 噴嘴塗料器 4,6 5 4 A 壓輥 5 支撐滾筒 6 電離輻射照射器 6 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) <請先閱讀背面之注意事項再填寫本頁) 裝----- 訂----------- -14- 508609 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明(12 ) 6 5 6 A 電離輻射 659 校正器 較佳實施例之詳細說明 經由參照所附圖形,於下說明本發明之實施例。 電磁遮蔽構件 首先,說明依據本發明之電磁遮蔽構件 圖ΙΑ、 1B及1C係顯示依據本發明之一電磁遮蔽 構件之第一實施例的圖。圖1 A係沿著圖1 C之線I A -I A取得之該電磁遮蔽構件之一橫剖面圖;圖1 B係顯示 該電磁遮蔽構件之全體結構之平面圖;及圖1 C係圖1 B 中之部份I C之放大平面圖。 如示於圖1 B,依據本發明之第一實施例的電磁遮蔽 構件具有一電磁遮蔽區域1 2 3,及被設於環繞電磁遮蔽 區域1 2 3之一接地框架區域1 2 5。如示於圖1 A,電 磁遮蔽區域1 2 3含有一透明基底1 1 0,且一電磁遮蔽 層1 1 5被設於透明基底1 1 0之一表面上;且電磁遮蔽 層1 1 5含有一導電層1 2 0及一透明樹脂層1 3 0。必 須注意,於此實施例中之導電層1 2 0係由導電墨水所製 成。進一步的,接地框架區域1 2 5係由供導電層1 2 〇 用之相同導電墨水所製成。 如示於圖1C,導電層120具有網狀圖型,由二相 互相交叉之平行直線所形成。進一步的,在導電層1 2 〇 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) ----丨^-------*11^ 裳--------訂--------線. (請先閱讀背面之注意事項再填寫本頁) -15- 508609 Α7-13- 508609 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention (11) 123 Electromagnetic shielding area 12 5 Ground frame area 1 3 0 Transparent resin layer 13 5 Recess 14 0 Near infrared cut-off layer 15 0 Anti-reflection layer 160 Adhesive layer 4 0 0 Electromagnetic shielding member 410 Plasma display board 4 2 0 Base 4 3 0 Box body 431 Front part 4 3 3 Rear part 4 4 0 Bracket 4 5 1 Bushing 4 5 3 Bolt 6 2 0 Resin 630 Paste-like conductive ink 6 5 0 Roller 6 5 1 Recess 3 Nozzle applicator 4, 6 5 4 A Press roller 5 Support roller 6 Ionizing radiation irradiator 6 This paper size applies to Chinese national standards (CNS ) A4 size (210 X 297 mm) < Please read the precautions on the back before filling out this page) Pack ----- Order ----------- -14609 508609 Intellectual Property of the Ministry of Economic Affairs Printed by the Consumer Cooperative of the Bureau A7 B7 V. Description of the invention (12) 6 5 6 A detailed description of the preferred embodiment of the ionizing radiation 659 calibrator The embodiment of the present invention will be described below with reference to the attached drawings. Electromagnetic shielding member First, an electromagnetic shielding member according to the present invention will be described. FIGS. 1A, 1B, and 1C are diagrams showing a first embodiment of an electromagnetic shielding member according to the present invention. Figure 1 A is a cross-sectional view of the electromagnetic shielding member taken along line IA-IA of Figure 1 C; Figure 1 B is a plan view showing the overall structure of the electromagnetic shielding member; and Figure 1 C is in Figure 1 B An enlarged plan view of part of the IC. As shown in FIG. 1B, the electromagnetic shielding member according to the first embodiment of the present invention has an electromagnetic shielding area 1 2 3 and a ground frame area 1 2 5 disposed in one of the surrounding electromagnetic shielding areas 1 2 3. As shown in FIG. 1A, the electromagnetic shielding area 1 2 3 contains a transparent substrate 1 1 0, and an electromagnetic shielding layer 1 1 5 is disposed on a surface of the transparent substrate 1 1 0; and the electromagnetic shielding layer 1 1 5 contains A conductive layer 120 and a transparent resin layer 130. It must be noted that the conductive layer 120 in this embodiment is made of a conductive ink. Further, the ground frame region 1 2 5 is made of the same conductive ink used for the conductive layer 1 2 0. As shown in FIG. 1C, the conductive layer 120 has a mesh pattern and is formed by two parallel parallel lines crossing each other. Further, the paper size of the conductive layer 1 2 0 applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) ---- 丨 ^ ----- * 11 ^ --- Order -------- line. (Please read the precautions on the back before filling this page) -15- 508609 Α7
經濟部智慧財產局員工消費合作社印製 五、發明說明(13 ) 之圖型內所壬現之空間中,即爲,在每一組平行直線內之 直線之間的那些空間中,除了在那些相對應於另一組平行 直線之直線的那些部份以外,形成一*透明樹脂層1 3 0。 可使用薄膜、玻璃之底座或類似物、聚丙烯酸樹脂、 聚碳酸酯樹脂,等,以供透明基底1 1 〇之用。但是,由 生產力之觀點來看,較佳爲樹脂薄膜。當考慮到光傳送時 ,高度透明薄膜係較佳的使用爲該樹脂薄膜,且那些具有 韋刃性之薄膜係爲特別更佳的。精確言之,可使用聚乙烯對 鈦酸鹽(P E T )薄膜;但是’該樹脂薄膜並不侷限於 P E T薄膜。有用之薄膜底座包含了三乙醯纖維素薄膜、 二乙醯纖維素薄膜、醋酸•丁酸纖維素薄膜、聚醚嗍碾薄 膜、聚丙烯樹脂薄膜、聚氨基甲酸酯樹脂薄膜、聚酯薄膜 、聚碳酸酯樹脂薄膜、聚砸類薄膜、聚醚薄膜、三甲基戊 烯薄膜、聚醚酮薄膜、(異)丙烯腈薄膜、及類似物。特 別的,由於具有優異之透明性與耐用性,較佳的使用雙軸 定向聚酯薄膜。一般而言,較適合使用那些厚度大約爲5 0至1 Ο Ο Ο μιη之薄膜。 被使用供形成該導電層1 2 0之導電墨水,可使用例 如爲丙烯酸樹脂粘合劑或溶劑與金屬粉末之混合物。精確 言之,例如爲鎳粉末、銀粉末、或銀-銅複合粉末與丙烯 酸樹脂粘合劑之混合物,且亦可使用金粉末或銀粉末與溶 劑之混合物。可使用任何之金屬粉末,只要其可授給預先 指示之導電性至該導電層。進一步的,使用供形成該導電 墨水之樹脂粘合劑或溶劑,可依據穩定性及處理能力加以 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) -----Ί---;----裝---I----訂---------^^_wl. (請先閱讀背面之注意事項再填寫本頁) -16- 508609 A7 _____B7 五、發明說明(14 ) 妥適的選擇,且不侷限於前面所述。 可使用電離-輻射-可硬化樹脂、熱塑性樹脂、及類 似物,以供透明樹脂層1 3 0之用;且特別的較佳爲電離 -輻射-可硬化樹脂。 於前述之第一實施例中,導電層1 2 0並未以透明樹 脂層覆蓋(參照圖1 A )。但是,如示於圖1 D,導電層 1 2 0可被透明樹脂層1 3 0覆蓋而成爲一變更實施例。 進一步的,在前述之第一實施例中,接地框架區域 1 2 5係由供導電層1 2 0用之相同導電墨水所製成,且 與導電層1 2 0整體地形成。但是,接地框架區域1 2 5 與導電層1 2 0亦可經由使用不同材料所製成。例如,在 形成網狀導電層1 2 0之後,可經由應用一導電糊漿,或 經由濺射法或類似物之機構形成一金屬薄膜,形成具有導 電性之接地框架區域1 2 5。 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) ----I.----^----裝--------訂---------. (請先閱讀背面之注意事項再填寫本頁) 層圖爲表背 構示。A 電該成一與 蔽顯份 1 導,形每面 遮,部圖 之是被之表 磁形本由 型但可 ο 之 電圖基於 圖;線 1 底fio之之之同 狀線直 1 基3M明態件相 網直之底該^CH發形構全 有行份基在m本同蔽完 具平部明成 S 據相遮乎 ,之 一透形 ^ 依 A 磁幾 中叉,在合彡明 1 電例 例交如由組 f 說圖一施 施相例經且II將與的實 實互。可,El, 係例二 一 組此,線行 2 2 施第 第二於的直¥ί圖圖實之 述有限擇行組照 。·二明 前具侷選平二參例第發 於中不可組此,施之本 , 其並。I 之來實明 , 外,態的供上下二發意 此 ο 形續提面接第本注 2 之連上表 之據須 1 型不面部 件依必 經濟部智慧財產局員工消費合作社印製 -17- 508609 A7 B7 五、發明說明(15 ) (請先閱讀背面之注意事項再填寫本頁) 、1 B與1 C所示之第一實施例,除了一近紅外線截止層 係被疊層至該電磁遮蔽層。於本發明之第二實施例中,相 同於由圖1 A、 1 B與1 C所示之第一實施例的那些部份 ’均以相同於第一實施例之相同參考號碼指示,且省略這 些部份之詳細說明' 如示於圖2,依據本發明之第二實施例之電磁遮蔽構 件,係可經由將一近紅外線截止層1 4 0,疊層至由圖 1 A、1 B與1 C所示之第一實施例之電磁遮蔽構件 1 2 3中之電磁遮蔽層1 1 5上而獲致。此一電磁遮蔽構 件除了遮蔽電磁波之功能以外,亦具有截止近紅外線之功 能。 近紅外線截止層1 4 0之材料上並無特殊限制,且可 使用以一近紅外線截止層塗覆之商用聚乙烯對鈦酸鹽( P E T )薄膜以形成該層。日本Toyobo Co·,Ltd.,所製造 之 號碼· 2 8 3 2 〃 ,係最通用之已知的以一'近紅外線 截止層塗覆之商用PET薄膜。. 經濟部智慧財產局員工消費合作社印製 當然,示於圖1 D中之變更第一實施例中,近紅外線 截止層1 4 0可被疊層至電磁遮蔽層1 1 5。 接下來,參照圖3,將說明依據本發明之電磁遮蔽構 件之第三實施例。_ 3係與圖1 A相同形態之圖形,顯示 依據本發明之第三實施例的一電磁遮蔽構件之基本部份。 必須注意,本發明之第三實施例幾乎完全相同於由圖2所 示之第二實施例,除了 一抗反射層係被疊層至近紅外線截 止層。於本發明之第三實施例中,相同於由圖2所示之第 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) -18- 508609 A7 B7____ 五、發明說明(16) 二實施例的那些部份,均以相同於第二實施例之參考號碼 所指示,且省略這些部份之詳細說明。 (請先閱讀背面之注意事項再填寫本頁) 如示於圖3 ,依據本發明之第三實施例之電磁遮蔽構 件,係可經由將一抗反射層(A R層)1 5 0,形成於由 圖2所示之第二實施例之電磁遮蔽構件1 2 3中之近紅外 線截止層1 4 0而獲致。此一電磁遮蔽構件除了遮蔽電磁 波之功能以外,亦具有截止近紅外線且防止反射外部光線 之功能。 抗反射層1 5 0係作用以防止反射可視光線。由結構 之觀點而言,已知有多種單層形態及多層形態之抗反射層 。在多層形態之抗反射層中,通常交互地疊層高折射率層 與低折射率層。 . 經濟部智慧財產局員Η消費合作社印製 抗反射層1 5 0之材料並無特殊限制。但是,在交互 地疊層高折射率層與低折射率層之抗反射層的情況中,較 佳的使用鈦氧化物、鉻、及類似物形成高折射率層,及較 佳的使用矽氧化物形成低折射率層。進一步的,例如爲濺 射或澱積之乾成型製程(乾製程),或例如爲塗覆之濕成 型製程(濕製程),均可應用以作爲供形成抗反射層 1 5 0之製程;可使用任何製程,只要可以獲致所需要之 效果。 當然,在示於圖1 D中之變更第一實施例中,近紅外 線截止層1 4 0及抗反射層1 5 0可次序地被疊層至電磁 遮蔽層1 1 5。 此外,於示於圖1 A之第一實施例與示於圖1 D之變 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) -19- 508609 ' A7 —______ B7 五、發明說明(17 ) 更第一實施例中,抗反射層1 5 0可直接疊層至電磁遮蔽 層 1 1 5。 於前述之第一至第三實施例中,可依需要而將一防髒 污層疊層至電磁遮蔽層1 1 5、近紅外線截止層1 4 〇、 或抗反射層1 5 0。可使用設有水或油-拒斥塗層之層’ 例如爲矽氧烷基塗層,或例如爲甲矽烷基氟化複合物塗層 之氟基塗層,以供該防髒污層之用。 接下來’參照圖4,將說明依據本發明之電磁遮蔽構 件之第四實施例。圖4係與圖1 A相同形態之圖形,顯示 依據本發明之第四實施例的一電磁遮蔽構件之基本部份。 必須注意,本發明之第四實施例幾乎完全相同於由圖1 A 、1B與1C所示之第一實施例,除了導電層係由一金屬 層所製成。於本發明之第四實施例中,相同於由圖1 A、 1 B及1 C所示之第一實施例的那些部份,均以相同於第 一實施例之參考號碼所指示,且省略這些部份之詳細說明 〇 如示於圖4,依據本發明之第四實施例之電磁遮蔽構 件,類似於由圖1 A、 1 B與1 C所示之第一實施例之電 磁遮敝構件,僅具有遮蔽電磁波之功能,且其電磁遮蔽區 域1 23包括一透明基底1 1〇,及一電磁遮蔽層1 1 5 被設於透明基底1 1 0之一表面上。電磁遮蔽層1 1 5具 有一導電層1 2 1與一透明樹脂層1 3 0。於此實施例中 ,導電層1 2 1係由金屬薄膜製成。進一步的,一接地框 架區域(示於圖1 B中之參考號碼1 2 5 )係由供該導電 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) (請先閱讀背面之注意事項再填寫本頁)Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. The spaces in the diagram of the invention description (13) are the spaces between the straight lines in each group of parallel straight lines, except in those Except for those parts corresponding to another set of parallel straight lines, a * transparent resin layer 130 is formed. Films, glass substrates or the like, polyacrylic resins, polycarbonate resins, etc. can be used for the transparent substrate 1 110. However, from the viewpoint of productivity, a resin film is preferred. When light transmission is considered, the highly transparent film system is preferably used as the resin film, and those having a sharp edge property are particularly preferable. Specifically, a polyethylene-titanate (PET) film may be used; however, the resin film is not limited to a PET film. Useful film bases include triethyl cellulose film, diethyl cellulose film, cellulose acetate butyrate film, polyether film, polypropylene resin film, polyurethane resin film, polyester film , Polycarbonate resin film, polyimide film, polyether film, trimethylpentene film, polyetherketone film, (iso) acrylonitrile film, and the like. In particular, because of its excellent transparency and durability, a biaxially oriented polyester film is preferably used. Generally speaking, those films with a thickness of about 50 to 100 μm are more suitable. The conductive ink used to form the conductive layer 120 can be, for example, an acrylic resin binder or a mixture of a solvent and a metal powder. Specifically, it is, for example, a nickel powder, a silver powder, or a mixture of a silver-copper composite powder and an acrylic resin binder, and a gold powder or a mixture of silver powder and a solvent may also be used. Any metal powder can be used as long as it can impart the conductivity indicated in advance to the conductive layer. Further, the resin binder or solvent used to form the conductive ink can be added to the paper size according to the stability and handling capacity. The Chinese National Standard (CNS) A4 specification (210 X 297 mm) is applicable ----- Ί ---; ---- install --- I ---- order --------- ^^ _ wl. (Please read the precautions on the back before filling this page) -16- 508609 A7 _____B7 5. Description of the invention (14) The appropriate choice is not limited to the foregoing. Ionizing-radiating-hardenable resins, thermoplastic resins, and the like can be used for the transparent resin layer 130; and particularly preferred are ionizing-radiating-hardenable resins. In the aforementioned first embodiment, the conductive layer 120 is not covered with a transparent resin layer (refer to FIG. 1A). However, as shown in FIG. 1D, the conductive layer 120 may be covered with the transparent resin layer 130, which is a modified embodiment. Further, in the aforementioned first embodiment, the ground frame region 1 2 5 is made of the same conductive ink for the conductive layer 1 2 0 and is formed integrally with the conductive layer 12 2. However, the ground frame region 1 2 5 and the conductive layer 1 2 0 can also be made by using different materials. For example, after forming the mesh-like conductive layer 120, a metal thin film may be formed by applying a conductive paste, or by a mechanism such as a sputtering method or the like, to form a conductive ground frame region 125. This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) ---- I .---- ^ ---- installation -------- order ------ ---. (Please read the notes on the back before filling out this page) The floor plan is shown on the front and back. A electricity should be integrated with the visible part, and the shape should be covered on each side. The figure of the part is covered by the magnetic form. The electric diagram is based on the diagram; line 1 is the same as the line of fio. The base of the 3M bright state phase network is straight. The ^ CH hair shape has all the bases in the m base and the flat part. It is covered by the phase. It is transparent. ^ According to the magnetic fork of A, Ming 1 The example of electric power is given by group f. Figure 1 shows the example of application and II will interact with reality. But, El, it is the second group of cases, and the second line of the second line is a straightforward picture of the limited choice group. · The second case of Erming's previously selected rounds was issued in China. It is not possible to organize this, Shi Zhiben, and both. The origin of I is clear. In addition, the top and bottom states are aware of this. Continued to mention the data from the second table and the above table. The type 1 non-face parts are printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. 17- 508609 A7 B7 V. Description of the invention (15) (Please read the precautions on the back before filling this page), the first embodiment shown in 1 B and 1 C, except that a near infrared cut-off layer is laminated to The electromagnetic shielding layer. In the second embodiment of the present invention, those portions that are the same as those of the first embodiment shown in FIGS. 1A, 1B, and 1C are designated by the same reference numbers as those of the first embodiment, and are omitted. A detailed description of these parts' is shown in Fig. 2. The electromagnetic shielding member according to the second embodiment of the present invention can be laminated by a near-infrared cut-off layer 1 40 to Fig. 1 A, 1 B and The electromagnetic shielding member 1 2 3 of the first embodiment shown in FIG. 1C is obtained on the electromagnetic shielding layer 1 15. In addition to shielding electromagnetic waves, this electromagnetic shielding member also has a function of cutting off near-infrared rays. The material of the near-infrared cut-off layer 140 is not particularly limited, and a commercial polyethylene paratitanate (PET) film coated with a near-infrared cut-off layer can be used to form the layer. Japan's Toyobo Co., Ltd., manufactured by No. 2 8 3 2 〃, is the most commonly known commercial PET film coated with a near-infrared cut-off layer. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs Of course, in the first embodiment of the modification shown in FIG. 1D, the near-infrared cut-off layer 140 can be laminated to the electromagnetic shielding layer 115. Next, referring to Fig. 3, a third embodiment of the electromagnetic shielding member according to the present invention will be described. _ 3 is a figure in the same form as in Fig. 1A, showing a basic part of an electromagnetic shielding member according to a third embodiment of the present invention. It must be noted that the third embodiment of the present invention is almost identical to the second embodiment shown in Fig. 2 except that an anti-reflection layer is laminated to a near-infrared blocking layer. In the third embodiment of the present invention, it is the same as the first paper size shown in FIG. 2 which applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) -18- 508609 A7 B7____ 5. Description of the invention (16 Those parts of the second embodiment are indicated by the same reference numbers as the second embodiment, and detailed descriptions of these parts are omitted. (Please read the notes on the back before filling this page) As shown in Figure 3, the electromagnetic shielding member according to the third embodiment of the present invention can be formed by forming an anti-reflection layer (AR layer) 1 50 on It is obtained by the near-infrared cutoff layer 1 40 in the electromagnetic shielding member 1 2 3 of the second embodiment shown in FIG. 2. In addition to the function of shielding electromagnetic waves, this electromagnetic shielding member also has a function of blocking near-infrared rays and preventing reflection of external light. The anti-reflection layer 150 serves to prevent reflection of visible light. From a structural point of view, there are known antireflection layers in a variety of single-layer and multilayer forms. In a multilayer antireflection layer, a high refractive index layer and a low refractive index layer are usually alternately laminated. There is no special restriction on the materials printed by the anti-reflection layer 150 of the Intellectual Property Bureau of the Ministry of Economic Affairs and Consumer Cooperatives. However, in the case of an antireflection layer in which a high refractive index layer and a low refractive index layer are alternately stacked, titanium oxide, chromium, and the like are preferably used to form a high refractive index layer, and silicon oxide is preferably used. The object forms a low refractive index layer. Further, a dry forming process (dry process), such as sputtering or deposition, or a wet forming process (wet process), such as coating, can be applied as a process for forming the antireflection layer 150; Use any process as long as the desired effect is achieved. Of course, in the modified first embodiment shown in FIG. 1D, the near-infrared cut-off layer 140 and the anti-reflection layer 150 may be sequentially laminated to the electromagnetic shielding layer 115. In addition, in the first embodiment shown in FIG. 1A and the modified paper size shown in FIG. 1D, the Chinese National Standard (CNS) A4 specification (210 X 297 mm) is applicable. -19- 508609 'A7 —______ B7 5 (17) In the first embodiment, the anti-reflection layer 150 can be directly laminated to the electromagnetic shielding layer 1 15. In the foregoing first to third embodiments, an anti-dirt layer may be laminated to the electromagnetic shielding layer 1 15, the near-infrared cut-off layer 14 0, or the anti-reflection layer 150 according to need. A layer provided with a water or oil-repellent coating, such as a siloxane-based coating, or a fluorine-based coating such as a silyl fluorinated composite coating can be used for the antifouling layer. use. Next, referring to Fig. 4, a fourth embodiment of the electromagnetic shielding member according to the present invention will be described. Fig. 4 is a diagram in the same form as Fig. 1A, showing a basic part of an electromagnetic shielding member according to a fourth embodiment of the present invention. It must be noted that the fourth embodiment of the present invention is almost identical to the first embodiment shown in Figs. 1A, 1B and 1C, except that the conductive layer is made of a metal layer. In the fourth embodiment of the present invention, those parts that are the same as those of the first embodiment shown in FIGS. 1A, 1B, and 1C are designated by the same reference numbers as the first embodiment, and are omitted. A detailed description of these parts. As shown in FIG. 4, the electromagnetic shielding member according to the fourth embodiment of the present invention is similar to the electromagnetic shielding member of the first embodiment shown in FIGS. 1A, 1B, and 1C. It only has a function of shielding electromagnetic waves, and its electromagnetic shielding area 1 23 includes a transparent substrate 1 10 and an electromagnetic shielding layer 1 15 is disposed on one surface of the transparent substrate 1 10. The electromagnetic shielding layer 1 1 5 has a conductive layer 1 2 1 and a transparent resin layer 1 3 0. In this embodiment, the conductive layer 1 2 1 is made of a metal thin film. Further, a ground frame area (reference number 1 2 5 shown in FIG. 1B) is provided for the conductive paper. The size of the paper applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) (please read the back first) (Notes for filling in this page)
I ϋ n n 一oiT a ϋ n n §1 n ϋ ϋ I 經濟部智慧財產局員工消費合作社印製 -20- 經濟部智慧財產局員工消費合作社印製 508609 A7 B7 五、發明說明(18 ) 層1 2 0用之相同金屬薄膜製成。 於前述之第四實施例中’接地框架區域(示於圖1 B 中之參考號碼1 2 5 )係由供導電層1 2 1用之相同金屬 薄膜製成,且與導電層1 2 1整體地形成。但是,接地框 架區域1 2 5與導電層1 2 1可經由使用不同材料所形成 。例如,在形成網狀導電層1 2 1之後,經由應用一導電 糊漿,或經由濺射法或類似物之機構形成一金屬薄膜,而 形成接地框架區域1 2 5。 進一步的,於前述第四實施例中,具有網狀圖型之導 電層1 2 1 ,其中具有二相互相交之平行直線。但是,該 圖型之形態並不侷限於此。例如,一部份之直線可被形成 爲不連續的。進一步的,可經由在透明基底之每一表面上 提供一組平行直線,且組合形成在基底之表面與背部表面 上之此二組平行直線,以形成該網狀圖型。 此外,於前述之第四實施例中,可如前述之第二或第 三實施例之相同方式,將一近紅外線截止層、一抗反射層 、一防髒污層、及類似物疊層至電磁遮蔽層1 1 5。 顯示裝置 於後將說明包含有依據本發明之一電磁遮蔽構件之一 顯示裝置之實施例。 圖5及圖6中係一顯示裝置之一實施例,該裝置含有 依據述第一至第四實施例之電磁遮蔽構件的其中之一, 且該構件被置於顯示裝置之前方面。必須注意,雖然於此 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公髮) -----^--I Ji--裝--------訂----------線- <請先閱讀背面之注意事項再填寫本頁) -21 - 508609 A7 _____________ —____ B7 五、發明說明(19 ) 以等離子顯不板(P D P )作爲顯示裝置之一範例,但顯 示裝置並不侷限於此一 PDP。 (請先閱讀背面之注意事項再填寫本頁) 如示於圖5 ,在依據本實施例之顯示裝置中,一電磁 遮蔽構件40 0被置於一 PDP 4 1 0之前方面上,即 爲在觀看者側上。在電磁遮蔽構件4 0 0具有一抗反射層 的情況中’該構件係被放置與抗反射層面向觀看者側。於 圖5中,參考號碼4 0 0代表一電磁遮蔽構件,參考號碼 4 1 0代表該PDP,參考號碼4 2 0代表一底座,參考 號碼4 3 0代表一箱形本體,參考號碼4 3 1代表箱形本 體之前方部份,參考號碼4 3 3代表箱形本體之後方部份 ,參考號碼4 4 0代表一托架,參考號碼4 5 1代表一軸 套,且參考號碼4 5 3代表一螺栓。 如示於圖6 ,一槪略橫剖面圖顯示圖5中之顯示裝置 經濟部智慧財產局員工消費合作社印製 的基本部份。此一圖顯示依據示於圖3之實施例的電磁遮 蔽構件被置於P D P 4 1 0之前方面上的情況。如示於 圖6,經由一粘著層1 6 0之機構,將電磁遮蔽構件 400粘附至PDP 410之前方板的表面。由此,自 P D P 4 1 0之內側所發射出之那些電磁波與近紅外線 ,可個別的由電磁遮蔽層1 1 5及近紅外線截止層1 4 0 所切斷,且於此時,經由抗反射層1 5 0防止自P D P 4 1 0之外側進入之外部光線反射’而可防止影像品質( 對比)之降低。 供製造電磁遮蔽構件用之製程_ 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) -22- 經濟部智慧財產局員工消費合作社印製 508609 A7 _ B7 五、發明說明(20 ) 接下來,將說明供製造依據本發明之電磁遮蔽構件之 製程的實施例。 圖7、 8A、 8B及8C均爲用以說明製造示於圖 1 A中之電磁遮蔽構件之製程的第一實施例之圖形。圖7 係顯示一製造系統之一範例的圖形;且圖8 A、8 B與 8 C均爲槪略橫剖面圖,顯示在製造示於圖1 A之電磁遮 蔽構件中之個別步驟。 簡言之,此一實施例係一種製程,其中,一透明樹脂 層1 3 0被形成在一透明薄膜製成之一透明基底1 1 〇之 一表面上,且經由使用一導電墨水形成一導電層1 2 0, 以製造示於圖1 A中的電磁遮蔽構件。 具有所需要之形態的透明樹脂層1 3 0,首先被形成 在一透明基底1 1 0之一表面上(參照圖8A)。 如示於圖7,由一樹脂薄膜製成之透明基底1 1 〇, 係經由一對支撐滾筒6 5 5所輸送,因此,一樹脂6 2 0 可被傳送至該透明基底1 1 0之表面。 因此而被輸送之透明基底110被饋入於具有凹處之 一滾筒(圓筒)6 5 0與一壓輥6 5 4之間,並以將形成 電磁遮蔽層之基底的該表面朝向具有凹處之滾筒(圓筒) 650,且然後,允許在通過一壓輥654A與具有凹處 之滾筒6 5 0之間後被抽出。於此步驟中,透明基底 1 1 0經由壓輥6 54與6 54A,而與具有凹處之滾筒 6 5 0之表面形成壓力接觸。必須注意,具有凹處之滾筒 6 5 0係設有相對應於透明樹脂層1 3 0之形態的凹處 本紙張尺度適用中國國家標準(CNS)A4規格(210x297公釐) (請先閱讀背面之注意事項再填寫本頁)I ϋ nn oiT a ϋ nn §1 n ϋ ϋ I Printed by the Employees 'Cooperatives of the Intellectual Property Bureau of the Ministry of Economy -20- Printed by the Employees' Cooperatives of the Intellectual Property Bureau of the Ministry of Economy 508609 A7 B7 V. Description of the Invention (18) Level 1 2 0 Made of the same metal film. In the aforementioned fourth embodiment, the 'ground frame area (reference number 1 2 5 shown in FIG. 1 B) is made of the same metal film for the conductive layer 1 2 1 and is integral with the conductive layer 1 2 1地 Forming. However, the ground frame region 1 2 5 and the conductive layer 1 2 1 may be formed by using different materials. For example, after forming the mesh-like conductive layer 1 2 1, the ground frame region 1 2 5 is formed by applying a conductive paste or forming a metal thin film by a sputtering method or the like. Further, in the foregoing fourth embodiment, the conductive layer 1 2 1 having a mesh pattern has two parallel straight lines intersecting with each other. However, the shape of the pattern is not limited to this. For example, a part of a straight line can be formed as discontinuous. Further, a set of parallel straight lines may be provided on each surface of the transparent substrate, and the two sets of parallel straight lines formed on the surface of the substrate and the back surface may be combined to form the mesh pattern. In addition, in the aforementioned fourth embodiment, a near-infrared cut-off layer, an anti-reflection layer, an anti-fouling layer, and the like may be laminated to the same manner as in the aforementioned second or third embodiment. Electromagnetic shielding layer 1 1 5. Display Device An embodiment of a display device including an electromagnetic shielding member according to the present invention will be described later. 5 and 6 show an embodiment of a display device including one of the electromagnetic shielding members according to the first to fourth embodiments, and the member is placed in front of the display device. It must be noted that although this paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297), ----- ^-I Ji--installation -------- order --- ------- Line- < Please read the notes on the back before filling this page) -21-508609 A7 _____________ —____ B7 V. Description of the invention (19) Plasma display panel (PDP) is used as the display device An example, but the display device is not limited to this PDP. (Please read the precautions on the back before filling this page.) As shown in Figure 5, in the display device according to this embodiment, an electromagnetic shielding member 40 0 is placed before a PDP 4 1 0, which is in Viewer side. In the case where the electromagnetic shielding member 400 has an antireflection layer, the member is placed with the antireflection layer facing the viewer side. In FIG. 5, reference number 4 0 0 represents an electromagnetic shielding member, reference number 4 1 0 represents the PDP, reference number 4 2 0 represents a base, reference number 4 3 0 represents a box-shaped body, and reference number 4 3 1 Represents the front part of the box body, reference number 4 3 3 represents the back part of the box body, reference number 4 4 0 represents a bracket, reference number 4 5 1 represents a shaft sleeve, and reference number 4 5 3 represents a bolt. As shown in Fig. 6, a schematic cross-sectional view shows the display device in Fig. 5. The basic parts printed by the staff consumer cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. This figure shows a case where the electromagnetic shielding member according to the embodiment shown in Fig. 3 is placed before P D P 4 10. As shown in Fig. 6, the electromagnetic shielding member 400 is adhered to the surface of the front panel of the PDP 410 through a mechanism of an adhesive layer 160. Therefore, those electromagnetic waves and near-infrared rays emitted from the inside of the PDP 4 1 0 can be individually cut by the electromagnetic shielding layer 1 15 and the near-infrared cut-off layer 1 4 0, and at this time, through anti-reflection Layer 1 50 prevents reflection of external light entering from outside the PDP 4 1 0 and prevents degradation of image quality (contrast). Manufacturing process for manufacturing electromagnetic shielding members _ This paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm) -22- Printed by the Employees ’Cooperative of the Intellectual Property Bureau of the Ministry of Economy 508609 A7 _ B7 V. Description of the invention ( 20) Next, an embodiment of a process for manufacturing an electromagnetic shielding member according to the present invention will be described. Figs. 7, 8A, 8B, and 8C are diagrams for explaining the first embodiment of the manufacturing process of the electromagnetic shielding member shown in Fig. 1A. FIG. 7 is a diagram showing an example of a manufacturing system; and FIGS. 8A, 8B, and 8C are schematic cross-sectional views showing individual steps in manufacturing the electromagnetic shielding member shown in FIG. 1A. In short, this embodiment is a process in which a transparent resin layer 130 is formed on a surface of a transparent substrate 1 110 made of a transparent film, and a conductive layer is formed by using a conductive ink. Layer 1 2 0 to manufacture the electromagnetic shielding member shown in FIG. 1A. A transparent resin layer 130 having a desired form is first formed on a surface of a transparent substrate 110 (see FIG. 8A). As shown in FIG. 7, a transparent substrate 1 1 0 made of a resin film is transported through a pair of supporting rollers 6 5 5, so a resin 6 2 0 can be transferred to the surface of the transparent substrate 1 1 0 . The transparent substrate 110 thus conveyed is fed between a roller (cylinder) 6 50 having a recess and a pressure roller 6 54, and the surface of the substrate forming the electromagnetic shielding layer is directed toward the recess The roller (cylinder) 650 is then allowed to be drawn out after passing between a pressure roller 654A and a roller 6 500 with a recess. In this step, the transparent substrate 110 passes through the pressure rollers 6 54 and 6 54A and comes into pressure contact with the surface of the roller 6 50 having a recess. It must be noted that the roller 6 5 0 with a recess is provided with a recess corresponding to the shape of the transparent resin layer 1 3 0. This paper size is applicable to China National Standard (CNS) A4 (210x297 mm) (Please read the back first (Notes for filling in this page)
-23- 經濟部智慧財產局員工消費合作社印製 508609 A7 B7___ 五、發明說明(21 ) 6 5 1 〇 另一方面’經由一噴嘴塗層器6 5 3將樹脂6 2 0塗 層至具有凹處之滾筒6 5 0上,因此,樹脂6 2 0被塡入 凹處6 5 1中。於此步驟中,具有凹處之滾筒6 5 0以圖 7中之箭頭所示之方向中旋轉,且澱積在凹處6 5 1以外 之那些部份上之樹脂6 2 0,係經由一校正器6 5 9所移 除。具有凹處之滾筒6 50在僅有凹處6 5 1被塡入樹脂 之情況下朝向壓輥6 5 4旋轉。 當具有凹處之滾筒6 5 0旋轉時,透明基底1 1 0被 維持於壓輥6 5 4與具有凹處之滾筒6 5 0間,並以透明 基底1 1 0與具有凹處之滾筒6 5 0互相緊密接觸的情況 ,輸送至壓輥6 5 4 A側。於此步驟中,經由一電離輻射 照射器6 5 6 (例如紫外線照射器),自透明基底1 1 0 側施加電離輻射6 5 6 A (例如爲紫外線)至壓輥6 5 4 與6 5 4 A之間的區域,因此而硬化該樹脂6 2 0。因爲 樹脂6 2 0已硬化,其可被轉移至透明基底1 1 0。 而後,透明基底1 1 0通過壓輥6 5 4 A側,且自具 有凹處之滾筒6 5 0分離。由此,硬化樹脂6 2 0自具有 凹處之滾筒6 5 0轉移至透明基底1 1 〇,且如示於圖 8A,因而在透明基底1 1 0之一表面上形成一透明樹脂 層1 3 0。於此情況,透明樹脂層1 3 0具有凹處1 3 5 (空間),該凹處1 3 5將被使用供形成具有網狀圖形之 一導電層1 2 0。 接下來,如示於圖8 A中之已形成透明樹脂層1 3 0 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) ί -------I 1 I I I il — ΙΙΙΙ ^· —----丨! (請先閱讀背面之注意事項再填寫本頁) -24- 經濟部智慧財產局員工消費合作社印製 508609-23- Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 508609 A7 B7___ V. Description of the invention (21) 6 5 1 〇 On the other hand, the resin 6 2 0 is coated to a concave shape via a nozzle coater 6 5 3 The resin roller 6 5 0 is placed thereon, so that the resin 6 2 0 is pushed into the recess 6 5 1. In this step, the roller 6 5 0 having the recess is rotated in the direction indicated by the arrow in FIG. 7, and the resin 6 2 0 deposited on those portions other than the recess 6 5 1 is passed through a Corrector 6 5 9 is removed. The roller 6 50 having a recess is rotated toward the pressure roller 6 5 4 with only the recess 6 5 1 being poured into the resin. When the roller 6 5 0 having a recess is rotated, the transparent substrate 1 1 0 is maintained between the pressure roller 6 5 4 and the roller 6 5 0 having a recess, and the transparent substrate 1 1 0 and the roller 6 having a recess When 50 is in close contact with each other, it is conveyed to the pressure roller 6 5 4 A side. In this step, an ionizing radiation irradiator 6 5 6 (for example, an ultraviolet irradiator) is used to apply ionizing radiation 6 5 6 A (for example, ultraviolet rays) from the transparent substrate 1 1 0 side to the pressing rollers 6 5 4 and 6 5 4 The area between A and therefore the resin 6 2 0 is hardened. Since the resin 6 2 0 is hardened, it can be transferred to the transparent substrate 1 1 0. Then, the transparent substrate 110 passes through the pressure roller 6 5 4 A side and is separated from the roller 6 50 with a recess. Thereby, the hardened resin 6 2 0 is transferred from the roller 6 50 with the recess to the transparent substrate 1 1 0, and as shown in FIG. 8A, a transparent resin layer 1 3 is formed on one surface of the transparent substrate 1 1 0 0. In this case, the transparent resin layer 130 has a recess 1 3 5 (space), and the recess 1 3 5 will be used for forming a conductive layer 1 2 0 having a network pattern. Next, as shown in Figure 8A, the transparent resin layer has been formed. 1 3 0 This paper size is in accordance with the Chinese National Standard (CNS) A4 specification (210 X 297 mm) ί ------- I 1 III il — ΙΙΙΙ ^ · —---- 丨! (Please read the notes on the back before filling out this page) -24- Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 508609
五、發明說明(22 ) 之側上,以糊漿狀導電墨水6 3 0塗層至透明基底1 1 Q 之全體表面上。(參照圖8B)。 在透明樹脂層1 3 0上澱積之過多導電墨水6 3 〇 ’ 然後係由一橡膠製成之淸潔器所移除(未示於圖中)’I 執行一乾燥處理。因此,在透明基底1 1 〇之一表面上’ 與透明樹脂層1 3 0 —起形成一導電層1 2 0 (參照® 8 C )。 經由前述步驟,可製造示於圖1中之電磁遮蔽構件° 依據本實施例,製成示於圖8 A中之部份製作之項g 的步驟,可由如示於圖7中的製造系統連續地進行’ @ # ,此一步驟可使得整體生產製程適合用於大量生產。進^ 步的,製成示於圖8 B與圖8 .C中之部份製作項目的步驟 ,亦可依需要經由使用一帶狀透明基底1 1 〇連續地進行 ,因此,這些步驟可使得整體生產製程適合用於大量生產 〇 接下來,經由參照圖9 A與9 B,將說明用以製造示 於圖1 A中之電磁遮蔽構件的製程之第二實施例。圖9 A 與9 B均爲槪略橫剖面圖,顯示在製造圖1 a之電磁遮蔽 構件中之個別步驟。 簡言之,此一實施例係一種製程,其中,導電層 1 2 0被形成在由一樹脂薄膜製成之一透明基底1 1 〇之 一表面上,且然後形成一透明樹脂層1 3 0以獲致示於圖 1 A之電磁遮蔽構件。 具有所需要之形態的導電層1 2 0,首先被形成在一 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公爱) (請先閱讀背面之注意事項再填寫本頁)5. On the side of the invention description (22), a paste-like conductive ink 6 3 0 is coated on the entire surface of the transparent substrate 1 1 Q. (Refer to FIG. 8B). The excessive conductive ink 6 3 0 'deposited on the transparent resin layer 130 is then removed by a rubber cleaner (not shown in the figure)' I performs a drying process. Therefore, on one of the surfaces of the transparent substrate 110, a conductive layer 12 is formed together with the transparent resin layer 130 (refer to 8C). Through the foregoing steps, the electromagnetic shielding member shown in FIG. 1 can be manufactured. According to this embodiment, the steps of making part g of the part shown in FIG. 8A can be continuously performed by the manufacturing system shown in FIG. 7. '@ #, This step can make the overall production process suitable for mass production. Further, the steps of making some of the production items shown in Figs. 8B and 8C can also be performed continuously by using a strip-shaped transparent substrate 1 10 as required. Therefore, these steps can make The entire production process is suitable for mass production. Next, a second embodiment of a process for manufacturing the electromagnetic shielding member shown in FIG. 1A will be described with reference to FIGS. 9A and 9B. 9A and 9B are schematic cross-sectional views showing individual steps in manufacturing the electromagnetic shielding member of Fig. 1a. In short, this embodiment is a process in which a conductive layer 12 is formed on a surface of a transparent substrate 1 1 0 made of a resin film, and then a transparent resin layer 1 3 0 is formed. In order to obtain the electromagnetic shielding member shown in Figure 1A. The conductive layer 1 2 0 with the required form is first formed on a paper size that applies the Chinese National Standard (CNS) A4 (210 X 297 public love) (Please read the precautions on the back before filling this page)
-25- 508609 A7 B7 五、發明說明(23 ) 透明基底1 1 0之一表面上(參照圖9人)。當示於圖7 中之製造系統內之滾筒6 5 0上之凹處6 5 1均被製成相 對應於導電層1 2 0之形態,且塡入一糊漿狀導電墨水時 ,經由前述實施例之相同方法,可將導電層1 2 0形成在 透明基底1 1 0之一表面上。即爲,硬化之導電墨水 6 3 0可自具有凹處之滾筒6 5 0轉移至透明基底1 1 0 ,且導電層1 2 0如示於圖9 A的形成在透明基底1 1 0 之一表面上。必須注意,於此情況中,導電層1 2 0具有 凹處(空間)1 2 5 ,該凹處1 2 5將被使用供形成相反 於一網狀圖型之透明樹脂層1 3 0。 接下來,一樹脂被注入於如圖9 A所示之已形成導電 層1 2 0之側的透明基底1 1 〇之該表面上,且執行乾燥 處理。因此,在透明基底1 1 0之一表面上,一透明樹脂 層130與該導電層120 —起形成(參照圖9B)。 經由前述步驟,製造示於圖1 A之電磁遮蔽構件。 即使在此一實施例中,製成示於圖9 A中之部份製作 項目的步驟,可由示於圖7中的製造系統連續地進行,因 此,此一步驟可使得整體生產製程適合用於大量生產。依 據此一實施例,需要用以形成該導電墨水層之步驟。但是 ’本實施例之有利之處在於前述第一實施例中所需要之將 任何過剩導·電墨水移除之步驟,在本實施例中不需要。 經由參照圖1 〇 A、 1 0 B、 1 0 C與1 〇 D,將說 明用以製造示於圖4中之電磁遮蔽構件之製程的實施例。 圖1 0 A、 1 〇 B、· 1 〇 C及1 0 D均爲槪略橫剖面圖, 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) (請先閱讀背面之注意事項再填寫本頁) 裝! —訂·!---25- 508609 A7 B7 V. Description of the invention (23) One of the transparent substrates 1 1 0 (see Fig. 9). When the recesses 6 5 1 on the roller 6 5 0 in the manufacturing system shown in FIG. 7 are made into a shape corresponding to the conductive layer 1 2 0 and a paste-like conductive ink is poured in, through the foregoing In the same manner as in the embodiment, the conductive layer 120 can be formed on one surface of the transparent substrate 110. That is, the hardened conductive ink 6 3 0 can be transferred from the roller 6 50 with a recess to the transparent substrate 1 1 0, and the conductive layer 1 2 0 is formed on one of the transparent substrates 1 1 0 as shown in FIG. 9A On the surface. It must be noted that in this case, the conductive layer 12 has a recess (space) 1 2 5 which will be used for forming a transparent resin layer 1 3 0 opposite to a mesh pattern. Next, a resin is injected on the surface of the transparent substrate 1 10 on the side where the conductive layer 12 has been formed as shown in FIG. 9A, and a drying process is performed. Therefore, on one surface of the transparent substrate 110, a transparent resin layer 130 is formed together with the conductive layer 120 (see FIG. 9B). Through the foregoing steps, the electromagnetic shielding member shown in FIG. 1A is manufactured. Even in this embodiment, the steps of making a part of the production items shown in FIG. 9A can be continuously performed by the manufacturing system shown in FIG. 7. Therefore, this step can make the overall production process suitable for Mass production. According to this embodiment, a step for forming the conductive ink layer is required. However, this embodiment is advantageous in that the step of removing any excess conductivity and electrical ink required in the foregoing first embodiment is not required in this embodiment. With reference to FIGS. 10A, 10B, 10C, and 10D, an embodiment of a process for manufacturing the electromagnetic shielding member shown in FIG. 4 will be explained. Figures 10 A, 10 B, · 10 C, and 10 D are schematic cross-sectional views. The dimensions of this paper are applicable to China National Standard (CNS) A4 (210 X 297 mm). (Please read the back Please fill in this page again) —Order! -
經濟部智慧財產局員工消費合作社印製 -26- 508609 A7 ------ B7 五、發明說明(24 ) 顯示製造示於圖4中之電磁遮蔽構件時的個別步驟。 簡围之,此一實施例係一製程,其中,一透明樹脂層 1 3 0被形成在由一樹脂薄膜製造之一透明基底1 1 〇之 一表面上,且然後,形成由金屬薄膜製造之一導電層 1 1 0 ’以製造示於圖4中之電磁遮蔽構件。 具有所需要之形態的一透明樹脂層1 3 0,首先被形 成在一透明基底1 1 0之一表面上(參照圖1 〇A)。經 由使用示於圖7之製造系統,以如前述之相同方法,透明 樹脂層1 3 0可被形成在透明基底1 1 〇之一表面上。即 爲,硬化樹脂6 2 0自具有凹處之滾筒6 5 〇轉移至透明 基底1 1 0,且透明樹脂層1 30因而如示於圖1 0B中 的形成在透明基底1 1 0之一表面上。於此情況,透明樹 脂層1 3 0具有凹處(空間)1 3 5 ,該凹處1 3 5係將 被使用供形成具有網狀圖型之一導電層1 2 0。 接下來,形成由金屬薄膜製成之一導電層121 ,因 此,如示於圖1 0 B中之已具有透明樹脂層1 3 0形成在 一側上之透明基底1 1 0的整體該表面上,均以導電層 1 2 1覆蓋(參照圖1 0 C )。可使用真空澱積、無電鍍( electroless plating )、真空澱積或無電鑛與電鍍之組合、 或類似物,來作爲供形成金屬薄膜用之方法,且由製造之 觀點而言,較佳爲真空澱積。 而後,在透明樹脂層1 3 0頂部上形成之導電層 1 2 1 ,經由拋光而移除,因而在透明基底1 1 0之一表 面上形成導電層1 2 1 (參照圖1 〇 D )。較佳的,經由 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) (請先閱讀背面之注意事項再填寫本頁) 【裝--------訂·--------* 經濟部智慧財產局員工消費合作社印製 -27- 508609 A7 _ B7 五、發明說明(25 ) 使用拋光帶或類似物執行拋光處理。 經由前述步驟,可獲致示於圖4中之電磁遮蔽構件。 即使於此實施例中,製成示於圖1 〇 B中之部份製作 項目的步驟,亦可由示於圖7之製造系統連續地進行,因 此此一步驟可使得整體製程適合用於大量生產。 範例 於下將特定地說明前述電磁遮蔽構件之範例。 (範例1 ) 範例1係經由以示於圖7、8 A、8 B及8 C (第一 實施例)之供製造一電磁遮蔽構件之製程,來製造示於圖 1 A (第一實施例)中之電磁遮蔽構件。於此範例中,由 曰本Toyobo Co.,Ltd·,所生產之'' A 4 3 0 0 〃 (厚度 1 2 5 β m )之聚乙烯對鈦酸鹽(P E T )薄膜,被使用 爲透明基底;日本Dainippon Ink & Chemical Inc.,所生產 之'' R C 1 7 — 2 3 6 〃之紫外線可硬化樹脂,被使用以 形成透明樹脂層;及日本Fujikura Kasei Co.,Ltd.,生產之 '' Dothe D-5 00 〃導電糊漿,被使用爲導電墨水。 (範例2 ) ' 範例2係相同於範例1,除了使用'' Dotite FN-101 〃 取代、、Dotite D-500 〃爲導電墨水。 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) (請先閱讀背面之注意事項再填寫本頁) · I! I 丨 1 訂 i I I I II !Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs -26- 508609 A7 ------ B7 V. Description of Invention (24) Shows the individual steps when manufacturing the electromagnetic shielding member shown in Figure 4. In brief, this embodiment is a process in which a transparent resin layer 130 is formed on a surface of a transparent substrate 1 110 made of a resin film, and then, a metal film is formed. A conductive layer 1 1 0 ′ is used to manufacture the electromagnetic shielding member shown in FIG. 4. A transparent resin layer 130 having a desired shape is first formed on a surface of a transparent substrate 110 (refer to FIG. 10A). By using the manufacturing system shown in Fig. 7, a transparent resin layer 130 can be formed on one of the surfaces of the transparent substrate 110 in the same manner as before. That is, the hardened resin 6 2 0 is transferred from the roller 6 5 0 having a recess to the transparent substrate 1 1 0, and the transparent resin layer 1 30 is thus formed on one surface of the transparent substrate 1 1 0 as shown in FIG. 10B on. In this case, the transparent resin layer 1 3 0 has a recess (space) 1 3 5 which will be used for forming a conductive layer 1 2 0 having a network pattern. Next, a conductive layer 121 made of a metal thin film is formed, and thus, as shown in FIG. 10B, a transparent resin layer 1 3 0 is formed on the entire surface of the transparent substrate 1 1 0 on one side. Are all covered with a conductive layer 1 2 1 (refer to FIG. 10C). Vacuum deposition, electroless plating, vacuum deposition, or a combination of electroless ore and electroplating, or the like may be used as a method for forming a metal thin film, and from the viewpoint of manufacturing, vacuum is preferred Deposition. Then, the conductive layer 1 2 1 formed on the top of the transparent resin layer 130 is removed by polishing, so that a conductive layer 12 1 is formed on one surface of the transparent substrate 1 10 (refer to FIG. 10D). It is better to apply the Chinese National Standard (CNS) A4 specification (210 X 297 mm) through this paper size (please read the precautions on the back before filling this page) [Packing -------- Order ·- ------- * Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs -27- 508609 A7 _ B7 V. Description of the invention (25) Use a polishing tape or the like to perform polishing. Through the foregoing steps, the electromagnetic shielding member shown in FIG. 4 can be obtained. Even in this embodiment, the steps of making some of the production items shown in FIG. 10B can be continuously performed by the manufacturing system shown in FIG. 7, so this step can make the overall process suitable for mass production. . Examples The following will specifically describe examples of the aforementioned electromagnetic shielding member. (Example 1) Example 1 is shown in FIG. 1A (first embodiment) through a process for manufacturing an electromagnetic shielding member shown in FIGS. 7, 8 A, 8 B, and 8 C (first embodiment) ) Electromagnetic shielding member. In this example, a polyethylene-titanate (PET) film of `` A 4 3 0 0 〃 (thickness 12 5 β m) produced by Toyobo Co., Ltd., Japan, is used as transparent Substrate; Japan's Dainippon Ink & Chemical Inc., `` RC 1 7-2 3 6 '' UV-curable resin used to form a transparent resin layer; and Fujikura Kasei Co., Ltd., Japan '' Dothe D-5 00 〃 conductive paste, used as conductive ink. (Example 2) 'Example 2 is the same as Example 1, except that Dotite FN-101 〃 is used instead of Dotite D-500 〃 as conductive ink. This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) (Please read the precautions on the back before filling this page) · I! I 丨 1 Order i I I I II!
經濟部智慧財產局員工消費合作社印製 -28- A7 ___E_ — 五、發明說明(26 ) (範例3 ) 範例3係相同於範例1 ’除了使用'' Dotite FE-107 〃 取代'、Dotite D-500 〃爲導電墨水。 (範例1至範例3的測量結果) 範例1至3的電磁遮蔽構件中的導電層之表面電阻係 數(Ω / □),及電磁遮蔽構件之全體光透射比(% ), 均示於表1。 表1 導電墨水 成份 表面電阻係數 (〇/□) 全體光透射比 (%) 實施例1 Dotite D-500 銀粉末—丙烯酸樹脂 0 . 5 70 實施例2 Dotite FN-101 鎳—丙烯酸樹脂 5 . 0 72 _實施例3 Dotite FE-107 銀銅複合粉末-丙烯酸樹月旨 0 . 6 7 1 使用日本 Mitsubishi Petrochemical Co.,Ltd.,所生產之 '' Hiresta IP 〃之表面電阻係數計,執行表面電阻係數(Ω /□)之測量;且使用日本Toyo Seiki Co·,Ltd·,之能見度 儀執行全體光透射比(% )之測量。 (範例4 ) ' 範例4係用以製造示於圖2中之電磁遮蔽構件(第二 實施例),以日本Toyobo Co., Ltd.,生產之'、N 〇 · 2 8 3 2 〃作爲近紅外線截止層,疊層至範例1中之電磁 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) 垂 -29- ------------裝 (請先閱讀背面之注意事項再填寫本頁) 訂---------線 經濟部智慧財產局員工消費合作社印製 508609 A7 1__B7___ 五、發明說明(27 ) 遮蔽構件之電磁遮蔽層(導電層及透明樹脂層)。 (請先閱讀背面之注意事項再填寫本頁) (範例5 ) 範例5係用以製造示於圖2中之電磁遮蔽構件(第二 實施例),以日本Toyobo Co·,Ltd·,生產之'' N 〇 · 2 8 3 2 〃作爲近紅外線截止層,疊層至範例2中之電磁 遮蔽構件之電磁遮蔽層(導電層及透明樹脂層)。 (範例6 ) 範例6係用以製造示於圖2中之電磁遮蔽構件(第二 實施例),以曰本Toyobo Co.,Ltd·,生產之N 〇 . 2 8 3 2 〃作爲近紅外線截止層,疊層至範例3中之電磁 遮蔽構件之電磁遮蔽層(導電層及透明樹脂層)。 (範例4至6之測量結果) 經濟部智慧財產局員工消費合作社印製 發現所有之範例4至6的電磁遮蔽構件,於8 0 0至 1 0 0 0 nm之波長範圍中均具有2 0%或更少之光譜透 射比。該測量係使用日本Shimazu Corp.,生產之'' U V — 3100PC〃之分光光度計進行。 (範例7 ) 範例7係經由磁控管濺射製程在範例1之電磁遮蔽構 件中之電磁遮蔽層(導電層及透明樹脂層)上,自透明基 底側形成S 1〇2、' T i 0 2及S 1〇2層之順序的抗反射 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) -30- 508609 A7 ____________ B7 五、發明說明(28 ) 層,以製造示於圖3中之電磁遮蔽構件(第三實施例), 因此,個別的該層之厚度爲1 2 4 n m、 1 4 2 n m、及 8 8 n m 〇 (範例8 ) 範例8係經由磁控管濺射製程在範例2之電磁遮蔽構 件中之電磁遮蔽層(導電層及透明樹脂層)上,自透明基 底側形成S 1 0 2、T 1〇2及s i〇2層之順序的抗反射 層,以製造示於圖3中之電磁遮蔽構件(第三實施例), 因此,個別的該層之厚度爲124nm、 142nm、及 8 8 n m 〇 (範例9 ) 範例9係經由磁控管濺射製程在範例3之電磁遮蔽構 件中之電磁遮蔽層(導電層及透明樹脂層)上,自透明基 底側形成S 1〇2、T i 0 2及S 1〇2層之順序的抗反射 層,以製造示於圖3中之電磁遮蔽構件(第三實施例), 因此,個別的該層之厚度爲124nm、 142nm、及 8 8 n m。 (範例7至~ 9之測量結果) 發現所有之範例7至9的抗反射層’均具有1 · 5 % 或更少之表面反射比。該測量係使用日本Shimazu C〇rP·,生 產之、、UV — 3 1 CTO PC 〃之分光光度計進行。 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) (請先閱讀背面之注意事項再填寫本頁) -* ϋ n n I n n n 一-eJ· < MBB IHB · a··· I 垂 * 經濟部智慧財產局員工消費合作社印製 經濟部智慧財產局員工消費合作社印製 508609 A7 B7 五、發明說明(29) 依據範例1至9,由電磁遮蔽性能、近紅外線截止性 能、及防止反射性能之觀點,可以知道可以製造適合實際 使用之電磁遮蔽構件。 (範例1 0 ) 範例1 0係經由以示於圖7、1 0 A、1 〇 B、 1 0 C與1 0 D之供製造一電磁遮蔽構件之製程,來製造 示於圖4 (第四實施例)中之電磁遮蔽構件。於此範例中 ,由日本丁(^〇1)〇(:〇.,1^(1.,所生產之'、八4 3 0 0//(厚 度1 2 5//m)之聚乙烯對鈦酸鹽(PET)薄膜,被使 用爲透明基底;且曰本 Dainippon Kasei Kabushiki Kaisha 所生產之'' X D — 8 0 8 〃紫外線可硬化樹脂,被使用以 形成透明樹脂層。導電層以下列方式形成:在已形成透明 樹脂層之側上的透明基底之整體該表面上,以真空澱積方 法形成一鋁薄膜(厚度1 μ m ),且然後使用一拋光帶移 除澱積在透明樹脂層頂部上之導.電層。 (範例1 1 ) 範例1 1係相同於範例1 0,除了以一銀薄膜(厚度 1 β m )取代形成於範例1 〇中之鋁薄膜,以製成導電層 (範例1 0與1 1之測量結果) 範例1 0之電磁遮蔽構件中之導電層的表面電阻係數 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) — — — ΙΊΙΙ-Γ· — — — I I 1 I I I — I — — — — — — — . (請先閱讀背面之注意事項再填寫本頁) -32- 508609 A7 ___ B7 -五、發明說明(30 ) (Ω/口) ’已發現爲0.2Ω/□,且在範例之電 磁遮蔽構件中之導電層爲〇 · 1 5 2 Ω /□。該測量係使 用日本 Mitsubishi Petrochemical Co.,Ltd.,生產之、、Hiresta IP 〃之表面電阻係數計所進行。 範例1 0與1 1之電磁遮蔽構件之全體光透射比,已 發現均爲7 2 %。該測量係使用日本T 〇 y 〇 S e i k i C 〇.,L t d., 之能見度儀所進行。 •----5---丨丨I 裝------丨—訂---------· (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 本纸張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) -33-Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs -28- A7 ___E_ — V. Description of the Invention (26) (Example 3) Example 3 is the same as Example 1 'Except for the use of Dotite FE-107 取代 instead of', Dotite D- 500〃 is conductive ink. (Measurement results of Examples 1 to 3) The surface resistivity (Ω / □) of the conductive layer in the electromagnetic shielding member of Examples 1 to 3 and the overall light transmittance (%) of the electromagnetic shielding member are shown in Table 1. . Table 1 Surface resistivity of conductive ink components (0 / □) Overall light transmittance (%) Example 1 Dotite D-500 silver powder—acrylic resin 0.5 5 70 Example 2 Dotite FN-101 nickel—acrylic resin 5.0 72 _ Example 3 Dotite FE-107 silver-copper composite powder-acrylic tree month 0. 6 7 1 The surface resistivity meter `` Hiresta IP '' produced by Mitsubishi Petrochemical Co., Ltd., Japan was used to perform the surface resistance The measurement of the coefficient (Ω / □); and the measurement of the total light transmittance (%) was performed using a visibility meter of Toyo Seiki Co., Ltd., Japan. (Example 4) 'Example 4 is used to manufacture the electromagnetic shielding member shown in FIG. 2 (second embodiment), and it is produced by Japan's Toyobo Co., Ltd., and N 〇 2 8 3 2 〃 as near Infrared cut-off layer, laminated to the electromagnetic paper in Example 1. The paper size is in accordance with Chinese National Standard (CNS) A4 (210 X 297 mm). Vertical -29- ------------ installed (please Read the precautions on the back before filling this page) Order --------- Printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 508609 A7 1__B7___ V. Description of the invention (27) The electromagnetic shielding layer of the shielding member (conductive Layer and transparent resin layer). (Please read the precautions on the back before filling this page) (Example 5) Example 5 is used to manufacture the electromagnetic shielding member shown in Figure 2 (second embodiment), manufactured by Japan's Toyobo Co., Ltd. '' N 〇 · 2 8 3 2 〃 As a near-infrared cut-off layer, laminated to the electromagnetic shielding layer (conductive layer and transparent resin layer) of the electromagnetic shielding member in Example 2. (Example 6) Example 6 is used to manufacture the electromagnetic shielding member shown in FIG. 2 (second embodiment), and N. 0.2 8 3 2 〃 produced by Toyobo Co., Ltd., Japan is used as the near-infrared cutoff Layer, laminated to the electromagnetic shielding layer (conductive layer and transparent resin layer) of the electromagnetic shielding member in Example 3. (Measurement results of Examples 4 to 6) The employees' cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs printed and found that all the electromagnetic shielding members of Examples 4 to 6 had 20% in the wavelength range of 800 to 100 nm. Or less spectral transmittance. The measurement was performed using a "U V-3100PC" spectrophotometer manufactured by Shimazu Corp. of Japan. (Example 7) Example 7 is formed on the electromagnetic shielding layer (conductive layer and transparent resin layer) in the electromagnetic shielding member of Example 1 through a magnetron sputtering process, and S 102, 'T i 0 is formed from the transparent substrate side. The order of anti-reflection of layers 2 and S 102 is applicable to the Chinese national standard (CNS) A4 specification (210 X 297 mm) -30- 508609 A7 ____________ B7 V. Description of the invention (28) The electromagnetic shielding member (third embodiment) in FIG. 3, therefore, the thickness of the individual layers is 12 4 nm, 14 2 nm, and 8 8 nm 〇 (Example 8) Example 8 is via a magnetron The sputtering process forms an anti-reflection layer in the order of S 1 0, T 1 02, and SiO 2 layers on the electromagnetic shielding layer (conductive layer and transparent resin layer) in the electromagnetic shielding member of Example 2 from the transparent substrate side. In order to manufacture the electromagnetic shielding member (third embodiment) shown in FIG. 3, the thickness of each of the layers is 124 nm, 142 nm, and 88 nm. (Example 9) Example 9 is sputtered by a magnetron The manufacturing process is on the electromagnetic shielding layer (conductive layer and transparent resin layer) in the electromagnetic shielding member of Example 3. An anti-reflection layer in the order of S 102, Ti 102, and S 102 is formed from the transparent substrate side to manufacture the electromagnetic shielding member shown in FIG. 3 (third embodiment). Therefore, the individual The thickness of this layer is 124 nm, 142 nm, and 88 nm. (Measurement results of Examples 7 to 9) It was found that all the antireflection layers' of Examples 7 to 9 had a surface reflectance of 1.5% or less. This measurement was performed using a UV-31 CTO PC 〃 spectrophotometer manufactured by Shimazu CoPr, Japan. This paper size is in accordance with China National Standard (CNS) A4 (210 X 297 mm) (Please read the notes on the back before filling out this page)-* ϋ nn I nnn I-eJ · < MBB IHB · a ·· · * Printed by the Employees' Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs and printed by the Consumers ’Cooperatives of the Ministry of Economic Affairs and Intellectual Property Bureau printed by 508609 A7 B7 V. Invention Description (29) According to Examples 1 to 9, electromagnetic shielding performance, near infrared cut-off performance, From the viewpoint of anti-reflection performance, it is known that an electromagnetic shielding member suitable for practical use can be manufactured. (Example 10) Example 10 is shown in FIG. 4 (fourth through a process for manufacturing an electromagnetic shielding member shown in FIG. 7, 10 A, 100B, 10 C, and 1 D). The electromagnetic shielding member in the embodiment). In this example, a polyethylene pair made from Japanese Ding (^ 〇1) 〇 (: 〇., 1 ^ (1., Produced by 、, 8 4 3 0 0 // (thickness 12 5 // m)) Titanate (PET) film is used as a transparent substrate; and `` XD — 8 0 8 〃 UV hardening resin produced by Dainippon Kasei Kabushiki Kaisha, Japan, is used to form a transparent resin layer. The conductive layer is in the following manner Forming: On the entire surface of the transparent substrate on the side where the transparent resin layer has been formed, an aluminum thin film (thickness 1 μm) is formed by a vacuum deposition method, and then the deposition on the transparent resin layer is removed using a polishing tape The conductive layer on the top (Example 1 1) Example 11 is the same as Example 10, except that a silver film (thickness 1 β m) is used instead of the aluminum film formed in Example 10 to make a conductive layer. (Measurement results of Examples 10 and 11) The surface resistivity of the conductive layer in the electromagnetic shielding member of Example 10 This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) — — — ΙΊΙΙ- Γ · — — — II 1 III — I — — — — — — — (Please read the back one first (Please fill in this page if you want to fill in the matter) -32- 508609 A7 ___ B7 -V. Description of the invention (30) (Ω / mouth) 'It has been found to be 0.2Ω / □, and the conductive layer in the electromagnetic shielding member of the example is 0 · 1 5 2 Ω / □. This measurement was performed using a surface resistivity meter manufactured by Japan Mitsubishi Petrochemical Co., Ltd., Hiresta IP 。. Example 1 Overall light transmittance of electromagnetic shielding members of 1 and 11 It has been found that both are 72%. This measurement is made using a Japanese T 〇y 〇S eiki C 〇., L t d., The visibility meter. • ---- 5 --- 丨 丨 I- ---- 丨 —Order --------- · (Please read the notes on the back before filling out this page) The paper size printed by the Employees' Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs applies to Chinese national standards (CNS ) A4 size (210 X 297 mm) -33-
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JP10156886A JPH11340681A (en) | 1998-05-22 | 1998-05-22 | Electromagnetic wave shielding member, manufacture thereof and display device |
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KR100334938B1 (en) * | 2000-07-19 | 2002-05-03 | 박호군 | Transluscent and conductive film for electric field shielding and fabrication method thereof |
JP4540883B2 (en) * | 2000-10-19 | 2010-09-08 | パナソニック電工株式会社 | Translucent electromagnetic wave shield, near-infrared cut material, and manufacturing method thereof |
KR20020076899A (en) * | 2001-03-31 | 2002-10-11 | 아이티엠 주식회사 | Method for forming of EMI filter |
KR100429282B1 (en) * | 2001-07-12 | 2004-04-29 | 주식회사 상삼 | The tape of shielding electromagnetic wave |
KR100728217B1 (en) * | 2006-02-17 | 2007-06-13 | 삼성에스디아이 주식회사 | Electromagnetic shielding film and plasma display panel having same |
WO2007102393A1 (en) * | 2006-03-06 | 2007-09-13 | Konica Minolta Holdings, Inc. | Method for manufacturing electromagnetic wave shielding film and electromagnetic wave shielding film |
KR100867265B1 (en) * | 2006-05-02 | 2008-11-06 | 주식회사 엘지화학 | Method of manufacturing electromagnetic shielding film and electromagnetic shielding film produced by the same |
KR101047946B1 (en) * | 2006-10-25 | 2011-07-12 | 주식회사 엘지화학 | Electromagnetic shielding film having a transparent function and a near infrared ray absorption function, an optical filter comprising the same, and a plasma display panel comprising the same |
KR100785992B1 (en) * | 2007-03-02 | 2007-12-14 | 에스케이씨하스디스플레이필름(주) | Plasma Display Panel Apparatus and Front Glass Substrate Used in the Same |
KR100911008B1 (en) * | 2007-05-31 | 2009-08-05 | 삼성에스디아이 주식회사 | Film filter and plasma display device having same |
KR100965376B1 (en) * | 2007-08-24 | 2010-06-22 | 삼성코닝정밀소재 주식회사 | Electromagnetic shielding member for display device |
JP6749907B2 (en) * | 2015-07-30 | 2020-09-02 | 富士フイルム株式会社 | Laminated body, solid-state imaging device, laminated body manufacturing method, and kit |
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JPH07212078A (en) * | 1994-01-25 | 1995-08-11 | Dainippon Printing Co Ltd | Transfer film |
TW446637B (en) * | 1996-05-28 | 2001-07-21 | Mitsui Chemicals Inc | Transparent laminates and optical filters for displays using the same |
JPH1079594A (en) * | 1996-07-08 | 1998-03-24 | Nissha Printing Co Ltd | Transparent electromagnetic shielding material and manufacture thereof |
TW557248B (en) * | 1996-10-28 | 2003-10-11 | Nissha Printing | Transparent shielding material for electromagnetic interference |
JPH10341094A (en) * | 1997-06-09 | 1998-12-22 | Nissha Printing Co Ltd | Light transmission electromagnetic wave shielding material and its manufacture |
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