[go: up one dir, main page]

TW501863U - Backboard structure for CPU heat dissipation acting on circuit board - Google Patents

Backboard structure for CPU heat dissipation acting on circuit board

Info

Publication number
TW501863U
TW501863U TW90211678U TW90211678U TW501863U TW 501863 U TW501863 U TW 501863U TW 90211678 U TW90211678 U TW 90211678U TW 90211678 U TW90211678 U TW 90211678U TW 501863 U TW501863 U TW 501863U
Authority
TW
Taiwan
Prior art keywords
circuit board
heat dissipation
cpu heat
backboard structure
acting
Prior art date
Application number
TW90211678U
Other languages
Chinese (zh)
Inventor
Jia-He Chen
Original Assignee
Jia-He Chen
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jia-He Chen filed Critical Jia-He Chen
Priority to TW90211678U priority Critical patent/TW501863U/en
Priority to JP2001005224U priority patent/JP3083951U/en
Publication of TW501863U publication Critical patent/TW501863U/en

Links

TW90211678U 2001-07-11 2001-07-11 Backboard structure for CPU heat dissipation acting on circuit board TW501863U (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW90211678U TW501863U (en) 2001-07-11 2001-07-11 Backboard structure for CPU heat dissipation acting on circuit board
JP2001005224U JP3083951U (en) 2001-07-11 2001-08-08 Back plate structure for CPU heat radiation acting on the substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW90211678U TW501863U (en) 2001-07-11 2001-07-11 Backboard structure for CPU heat dissipation acting on circuit board

Publications (1)

Publication Number Publication Date
TW501863U true TW501863U (en) 2002-09-01

Family

ID=21685167

Family Applications (1)

Application Number Title Priority Date Filing Date
TW90211678U TW501863U (en) 2001-07-11 2001-07-11 Backboard structure for CPU heat dissipation acting on circuit board

Country Status (2)

Country Link
JP (1) JP3083951U (en)
TW (1) TW501863U (en)

Also Published As

Publication number Publication date
JP3083951U (en) 2002-02-22

Similar Documents

Publication Publication Date Title
EP1393369A4 (en) High performance heat sink for printed circuit boards
TW545875U (en) Heat dissipating device of circuit board
TW530935U (en) Heat dissipation apparatus for lower-connect type integrated circuit
GB2387974B (en) Wrap-around cooling arrangement for printed circuit board
AU2003228876A8 (en) Thermal dissipating printed circuit board and methods
TW534371U (en) CPU heat dissipation assembly part device
GB0111267D0 (en) Electronic circuit
TW520144U (en) Display circuit board of a heat dissipation system
DE60204745D1 (en) Connecting device between printed circuit boards
TW587901U (en) Heat dissipation structure for electronic component
GB2371411B (en) Circuit board mount
GB0115221D0 (en) Electronic circuit
GB2377080B (en) Integrated circuit package and printed circuit board arrangement
TW559461U (en) Heat conducting structure for circuit board
IL148041A0 (en) Printed circuit board arrangement
TW501863U (en) Backboard structure for CPU heat dissipation acting on circuit board
GB0124220D0 (en) Thermal circuit
TW540966U (en) Fixing device of printed circuit board
TW509346U (en) Heat dissipation apparatus for integrated circuit
AU2002309785A1 (en) High performance heat sink for printed circuit boards
TW515488U (en) Retaining structure for circuit board of heat dissipation fan
GB0105655D0 (en) An electronic circuit
TW534370U (en) CPU heat dissipation device
TW453629U (en) Circuit board with heat dissipation effect
TW501860U (en) Structure for fixing circuit board