JP3083951U - Back plate structure for CPU heat radiation acting on the substrate - Google Patents

Abstract

(57) [Summary] (with correction) [PROBLEMS] To provide a back plate structure for CPU heat radiation acting on a substrate. SOLUTION: Each perforation of a back plate 3 having a fan, a heat sink set, a mounting sheet, a substrate and a CPU fixed to the substrate, having a plurality of perforations 25 and having a convex body 31 on the surface is used for mounting a mounting sheet. The installation sheet 1, the substrate 2, and the back plate 3 are combined and fixed to form a superimposed form corresponding to the perforations 23 of the substrate 2, and the back plate is placed on the bottom surface of the substrate, and the convex body 31 on the back plate surface is provided. Corresponds to the CPU 21 and in a state where the protrusions are closely overlapped with each other.
The U and the heat sink set are brought into flat contact with each other to eliminate the gap and greatly increase the heat radiation efficiency.

Description

[Detailed description of the invention]

[0001]

[Technical field to which the invention belongs]

 The present invention relates to a CPU heat radiation back plate structure acting on a type of substrate, particularly, directly installed on a bottom portion of a substrate which is originally made of a thin and non-hard material and is attached to an installation sheet to form an uneven state. A back plate is provided by providing a means for superimposing and integrally fixing the sheet and the substrate, and a convex body corresponding to the CPU is provided on an adjacent surface portion of the back plate, so that the CPU and the heat sink set can be tightly flattened. It relates to a structure that makes contact and eliminates gaps to greatly improve heat dissipation efficiency.

[0002]

[Prior art]

 Although the processing speed of CPUs is growing faster, the heat energy generated is getting higher and higher. For example, at present, a CPU of 1 G or more cannot process the heat energy generated by an old-type heat radiating component.

For this reason, with the development of CPUs, heat radiating component manufacturers constantly improve the heat radiation efficiency, and a well-known method is to fix a hollow groove-like installation sheet on the surface of a substrate on which the CPU is fixed, On the corresponding side, a convex body that is locked by a locking type fixing tool is provided, the heat sink set between the fixing tool and the installation sheet is tightly held, and one more fan is mounted on the upper side of the heat sink set, and the fan heat sink set Heat is released from the heat sink set adjacent to the CPU.

The absolute relationship with the heat radiation efficiency of the heat sink set is, first, whether the heat sink set is in close contact with the CPU or not, and second, whether there is a gap for preventing heat conduction by air. That is.

[0005] However, manufacturers who have made improvements have all made improvements in how the heat sink set is brought into close contact with the CPU by using a fixing tool. Only correctly, because the heat sink set (the drawing of the well-known technology is not attached, please refer to the installation sheet 1 in the drawing of the present invention. The four corners are fixed parts (the pin 13 and the pin sleeve 131 or the pin sleeve 131 in the drawing). When fixing to the substrate 2 using the screws), the fixing forces of the fixing components of the four fixing components do not match, which causes the substrate 2 which is originally thin and not rigid to be uneven, and the substrate 2 becomes uneven. As a result, a gap is formed between the CPU 21 on the surface and the adjacent surface of the heat sink set, which affects the thermal efficiency. lost.

[0006]

[Problems to be solved by the invention]

 The main object of the present invention is to provide a CPU heat dissipating back plate structure acting on a substrate, in which a back plate having a convex body corresponding to the CPU on the surface fixes an installation sheet to the substrate. It is fixed to the bottom side of the board together with the fixed parts, and the convex generates an upward acting force on the bottom side of the board, forcing the CPU to tightly adhere to the heat sink set, and greatly improving its heat dissipation efficiency It is characterized by increasing.

[0007]

[Means for Solving the Problems]

 The invention of claim 1 is a CPU heat radiation back plate structure acting on a fan, a heat sink set, an installation sheet, a substrate, and a CPU fixed to the substrate, wherein one back plate is provided, and the back plate is provided on the back plate. A plurality of perforations are provided, each perforation corresponding to a perforation of a substrate used for fixing the installation sheet, the installation sheet, the substrate, and the back plate are connected, fixed and in a superimposed form, and the back plate is A convex body corresponding to the CPU is provided on the surface of the back plate, and the convex body generates a pretension against the bottom surface of the substrate, forcing the CPU into close contact with the heat sink set. The CPU has a back plate structure for radiating the CPU acting on the substrate, which is characterized by being brought into contact with the substrate. According to a second aspect of the present invention, there is provided a back plate structure for CPU heat radiation acting on a substrate according to the first embodiment, wherein a rib for reinforcing structural stress is provided on a bottom surface of the back plate. . The invention of claim 3 is characterized in that the ribs are radially formed around the convex body toward four circumferences and a plurality of ribs are formed in an intersecting manner. It has a plate structure. According to a fourth aspect of the present invention, there is provided a CPU heat radiation back plate structure acting on a substrate according to any one of the first to third aspects, wherein the convex body has a type of a convex point. According to a fifth aspect of the present invention, there is provided a CPU heat radiation back plate structure acting on a substrate according to any one of the first to third aspects, wherein the convex body is of a convex ring type. According to a sixth aspect of the present invention, there is provided a CPU heat radiation back plate structure acting on a substrate according to any one of the first to third aspects, wherein the convex body has a model of a convex hill. According to a seventh aspect of the present invention, there is provided a CPU heat radiation back plate structure acting on a substrate according to the sixth aspect, wherein the convex body has a flat top.

[0008]

[Embodiment of the invention]

 The present invention relates to a CPU heat dissipating back plate structure acting on a kind of substrate, as shown by reference numeral 3 in FIGS. Each is provided with a perforation 35, a plurality of intersecting ribs 34 radiating in four directions with the bottom surface centering on the convex body 31, and reinforcing the structural strength of the back plate 3.

The above-mentioned back plate 3 is fixedly placed on the bottom side of the substrate, and the convex body 31 of the back plate 3 generates an upward force on a substrate that is originally thin and not rigid. The application surface of the back plate 3 includes, for example, a fan, a heat sink set, and a heat dissipating component of an installation sheet. Belong. For example, as shown in the use state embodiment of the back plate 3 of the present invention shown in FIGS. 1 to 3. However, FIGS. 1 to 3 do not show a fan and a heat sink set in a known heat radiating component, and the structure shown in FIGS. 1 to 3 of the present invention is not limited to any form and structure. 1 to 3 and is therefore omitted from FIGS. 1-3. The present invention briefly describes the relationship between them. That is, an installation sheet 1 in the form of a hollow groove is provided on the surface of a substrate 2 for fixing the CPU 21, and an upper part of the installation sheet 1 is a fixing tool which can be connected to each other. One heat sink set is fixed, and one more fan is fixed above the heat sink set, and the fan blows air to the heat sink set, thereby releasing heat to the heat sink set adjacent to the CPU 21.

As shown in FIGS. 1 to 3, a CPU sheet 22 for inserting a CPU 21 is provided on the substrate 2, and one perforation 23 is provided at each of four corners of the CPU sheet 22. The hollow concave groove-shaped installation sheet 1 on which the heat sink set is placed has through holes 12 corresponding to the holes 23 of the substrate at its four corners. Corresponds to the perforation 23. A pin 13 having a pin sleeve 131 inserted therein is inserted into each of the through holes 12. Near the end of the pin sleeve 131 is divided to form a plurality of claws, and the pin 13 is inserted into the hollow shaft center of the pin sleeve 131. When the pin 13 is not inserted all the way to the bottom, the above-mentioned claw assumes a fitting shape, and when the pin 13 is inserted all the way to the bottom, the claw splits and assumes an enlarged caliber. When the pin 13 passes through the through hole 12 and the perforations 23 and 35 and is inserted to the bottom of the pin sleeve 131, the pin sleeve 13 having a split and enlarged caliber is tightly closed here by the perforation of the substrate 2 and the back plate 3. Fixed to pins 23 and 35, the upper end is limited by a pin 13 with a cap, whereby the installation sheet 1, the substrate 2 and the back plate 3 are tightly stacked on one another and integrated. Two convex bodies 11 are provided on each of the left and right relative sides of the installation sheet 1.

In FIG. 3, the back plate 3 is already placed on the installation sheet 1 and the substrate 2 so as to be integrated, and the back plate 3 is tightly overlapped with the bottom surface of the substrate 2. The convex body 31 of the convex point type of the back plate 3 exactly corresponds to the CPU 21, and the convex body 31 generates an acting force upward with respect to the bottom surface of the substrate 2, and forcibly closes the CPU 21 and the heat sink set. To achieve a tight, no-gap, high heat dissipation function.

Naturally, the back plate 3 of the present invention is not limited to the convex body 31 of the convex point type shown in FIGS. 1 to 3, but the protrusion as shown in FIGS. 4 to 7. The convex body 32 in the shape of a convex ring or the convex body 33 of a protruding convex hill type shown in FIGS. 8 to 11 can be used. The convex body 33 of the convex hill type has a flat top.

Further, the embodiment of the present invention is described with the pin 13 and the pin sleeve 131, but the present invention is not limited to this, and the installation sheet 1, the base plate 2, and the back plate using screws are used. 3 or an arbitrary system in which the installation sheet 1, the substrate 2 and the back plate 3 are combined and integrated, and in any case, the back plate 3 is attached to the substrate 2. An upward acting force is generated.

[0014]

[Effect of the invention]

 In summary, the heat dissipation backplate structure acting on the board provided by the present invention improves the well-known drawbacks of unevenness of the board itself, disadvantageous proximity to the CPU and poor heat dissipation efficiency, and directly Using the fixed parts (for example, pins or screws), the three members of the installation sheet, the board, and the backboard are merged and tightly overlapped to form an integral body. An upward acting force is formed, whereby the CPU is forcibly bonded to the bottom surface of the heat sink set so as to eliminate the gap, thereby greatly increasing the heat radiation efficiency. That is, the present invention surely achieves the functions of novelty and progressiveness, and meets the requirements for utility model registration. The embodiments described above do not limit the claims of the present invention, and any modification or alteration of details that can be made based on the present invention belongs to the claims of the present invention.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view of the present invention.

FIG. 2 is a perspective view of the combination according to FIG. 1;

FIG. 3 is a bottom view after the combination according to FIG. 1 of the present invention;

FIG. 4 is a front view of another embodiment of the present invention.

FIG. 5 is a rear view of another embodiment of the present invention.

FIG. 6 is a side view of another embodiment of the present invention.

FIG. 7 is a partially enlarged view of another embodiment of the present invention.

FIG. 8 is a front view of still another embodiment of the present invention.

FIG. 9 is a rear view of still another embodiment of the present invention.

FIG. 10 is a side view of still another embodiment of the present invention.

FIG. 11 is a partially enlarged view of still another embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Installation sheet 11 Convex body 111 Lock groove 12 Through hole 13 Pin 131 Pin sleeve 2 Board 21 CPU 22 CPU sheet 23 Perforated 3 Back plate 31-33 Convex body 34 Rib 35 Perforated

Claims (7)

[Utility model registration claims] 1. A CPU heat dissipating back plate structure acting on a fan, a heat sink set, an installation sheet, a substrate and a CPU fixed to the substrate, wherein one back plate is provided, and a plurality of the back plates are provided on the back plate. Perforations are provided, each of which corresponds to a perforation of the substrate used for fixing the installation sheet, the installation sheet, the substrate and the back plate are connected, fixed and superimposed, and the back plate is on the bottom side of the substrate. A convex body corresponding to the CPU is provided on the surface of the back plate.
A CPU heat-dissipating back plate structure acting on a substrate, wherein the CPU is in close contact with a heat sink set. 2. The back plate structure for radiating a CPU acting on a substrate according to claim 1, wherein a rib for reinforcing structural stress is provided on a bottom surface of the back plate. 3. The heat-dissipating back plate structure for a CPU according to claim 2, wherein the ribs are formed radially around the convex body toward four circumferences and a plurality of the ribs cross each other. 4. The back plate structure for radiating a CPU acting on a substrate according to claim 1, wherein the convex body has a type of a convex point. 5. The back plate structure for radiating a CPU acting on a substrate according to claim 1, wherein said convex body is of a convex ring type. 6. The back plate structure for radiating a CPU acting on a substrate according to claim 1, wherein the convex body is of a convex hill type. 7. The CPU heat radiation back plate structure acting on a substrate according to claim 6, wherein the apex of the convex body is flat.