498191 五、發明說明（l) --— 本發明係有關於一種CPU散熱器之製造方法，特別是 指二種方便，簡單而可將散熱鰭片製作成圓柱形之狀態， 以增加整體散熱鰭片之散熱面積的電腦主機板之CPU散埶 器者。 按，與本發明相關之習知電腦散熱器構造如第四圖所 不，該散熱器10包括有：一基座u，在該基座11@定有複 數個散熱鰭片1 2，該散熱鰭片〗2係由金屬薄 作=，使用時係藉基座U底部之中央接觸面；主=土 將CPU 30在運作時所產生的熱能傳導散去 : = 外圍或可另設有-框架13固丄= 吹風散Π ΪΓ強 扇2°’，^ 體丄::2:=:=2的整體形狀均為-矩形 在散熱W頂片擠型）製成時， 且其中之散熱鳍片12呈平排、面“形成一阻擋面121 , 所吹出來的幅射狀$ % i 1之型態，而與圓形風扇20 風扇2。將散熱對稱；㉗當在該散熱鰭片上方之 於該等之阻擋面121人"' 百先會有一半的風道面積受阻 噪音;另外，該其散熱效率及會產生極大的 ^白知構造在固定— 整體散熱縛片12的摺疊片數較少寸之上座^能固定的 面積較少，因此其自然無法 二：：到之有效散熱 習知構造實有再改良的必要。啟乜的政熱效果，故對該498191 V. Description of the invention (l) --- The present invention relates to a method for manufacturing a CPU heat sink, in particular to two convenient, simple, and heat-dissipating fins that can be made into a cylindrical shape to increase the overall heat-dissipating fins. Heat sink area of the computer motherboard CPU cooler. According to the structure of the conventional computer heat sink related to the present invention, as shown in the fourth figure, the heat sink 10 includes a base u, and a plurality of cooling fins 12 are fixed on the base 11 @. The fins 2 are made of thin metal. When in use, they are borrowed from the central contact surface at the bottom of the base U; the main = soil dissipates the heat energy generated by the CPU 30 during operation: = the periphery or an additional frame can be provided 13 固 丄 = Blowing fan Π ΓΓ Strong fan 2 ° ', ^ Body 丄 :: 2: =: = 2 The overall shape is-rectangular when the top plate is extruded, and the fins are included 12 is a flat row, the surface "forms a blocking surface 121, and the radiated $% i 1 is blown out, and it is the same as the circular fan 20 and the fan 2. It will be symmetrical to the heat dissipation; it should be above the heat dissipation fins. There are 121 people on such blocking surfaces. "Bai Xian will have half of the air duct area blocked by noise; in addition, its heat dissipation efficiency and will produce a great ^ Baizhi structure in the fixed-the number of folded pieces of the overall heat sink 12 The smaller the upper seat ^ can fix the less area, so it is naturally impossible: the effective structure of the heat sink is necessary to improve it. Qi Kai Political heat effect
第4頁 498191 五、發明說明（2) , Π Ϊ Γ ^明人有鑑上述習知電腦散熱器構造，其具有高 二 f噪音與降低散熱效能，以及在製作時較費i等 製心少玍f釦〜研究，並積其個人從事該項產品之設計歲 熱器製造方法。 出—種勒新的圓形散熱續片之散 ^=之主要目的，即在於提供一種cpu散熱器之 降低風阻嚼音，幻:加製成具低製造成本且可 散熱效率的圓形心.鰭；該散熱器- 本發明C P U散熱器之fj袢t、、土 ,,. 弯摺而成，而每一摺的散：。法，J先以金屬薄片連續 -連接面與相鄰的韓片相接了成"v:字形’底部有 端沿-中心轴線而環繞丄以之尖 製有開口；其次於基座上設有在各連接面衡 凹槽内塗佈錫膏(或導電膠）；接著ς :二凹槽j而於該 壓合於基座之凹槽：上^壓再熱鰭片另-端 柱散熱鰭片與基座連結成一體。…、錫q熔化而使圓形 如上述之方法’其中在基座上 於圓柱形散熱續片之底面的内外缘直：”内外徑恰對應 有-圓形凹槽，該凹槽之内外以：：，具上亦具 頂面的内外緣直徑者；因此，本發明。，散熱韓片之 片的結合與組裝=錫nr更、快速的完成趙 五、發明說明（3) 合更為密 為使 有更深一 實，提昇 貴審查 層的認識 細說明如 片與基座連結成 '體，以使基座至散熱鰭片間的接觸與結 该，熱器之散熱效益者。 〇 f貝對本發明之構造、製法及其特徵能 合圖式詳 【較佳實 請參 裝於電腦 熱器4 0主 接觸之基 散熱器4 0 者’另於 (如第三 人瞭解，兹舉一較佳之可行實施例並配 下： 施例】 閱第一圖 主機板上 要至少包 座4 1，及 中之複數 基座4 1上 圖）。 所示’本案所述之CPU散熱器構造係組 2於對微處理器（CPU)作散熱者，該散 t有一底部可與微處理器（CPU)頂面相 :又於基座4 1頂面之複數散熱鰭片4 2，該 $熱轉片4 2係以金屬薄片連續彎摺而成 必要時亦可設有固定風扇之框架43者 本發明之製造方、 所示，步驟a :首先、去，請芩閱第二圖之製造流程示意圖 波浪狀之散熱鰭片4以長條形金屬薄片42a連續彎摺而成大 來均摺成具” 字步b ’而每一摺的散熱鰭片由其端面看 V ’，字形鰭片相接；^之,狀態，底部有一連接面與相鄰的，， 之尖端沿一中心車由少驟$ ·將摺疊後之鰭片以各散熱鰭片 且在各連接面衝製有而環繞成圓柱形幅射狀散熱鰭片42， 適當大小之凹槽4丨}開〇42(：;步驟c :於基座41上設有一 f 膠）5 0 ;步驟d :將^、而於5玄凹槽4 11内塗佈錫膏（或導電 製具60上定型；步Z述圓柱形散熱鰭片42 —端套於一圓形 於基座4 1之凹槽上〜、使圓柱形散熱鰭片4 2另一端壓合 ’並加壓、加熱使基座41上的錫膏熔Page 4 498191 V. Description of the invention (2), Π Ϊ Γ ^ Mingren has learned from the above-mentioned conventional computer heat sink structure, which has a high second noise and reduced heat dissipation efficiency, and it requires less time and effort to produce it. F buckle ~ research, and accumulate personally engaged in the design of this product. The main purpose of the new type of circular cooling sequel ^ = is to provide a cpu radiator to reduce the chewing noise of the wind. Magic: Add a circular heart with low manufacturing cost and heat dissipation efficiency. Fin; the heat sink-the CPU heat sink of the present invention is fj.t ,,,,,, and is bent, and each fold is scattered:. Method, J first connected the adjacent Korean film with a continuous and connecting surface of the metal sheet to form a " v: glyph 'with an end along the center axis and a circle around the center to make an opening; followed by an opening on the base It is provided to apply solder paste (or conductive glue) in the grooves of each connection surface; then: two grooves j and the grooves pressed on the base: press the reheating fins on the other end The radiating fins are integrated with the base. …, Tin q melts to make the circle as described above. 'The inner and outer edges of the bottom surface of the cylindrical heat sink on the base are straight: "The inner and outer diameters correspond to-circular grooves. ：: The diameter of the inner and outer edges of the top surface is also included; therefore, the present invention. The combination and assembly of heat sinking Korean sheets = tin nr can be completed more quickly and quickly. In order to have a deeper and more realistic understanding of your review layer, it is explained in detail that if the sheet is connected to the base into a body, the contact and connection between the base and the heat dissipation fins are the heat dissipation benefits of the heater. 〇f 贝The structure, manufacturing method and characteristics of the present invention can be combined with drawings in detail [preferably, please refer to the base heat sink 4 0 installed in the main contact of the computer heater 4 0 '(otherwise, if a third person understands, The best feasible embodiment is equipped with the following: Example] Please read the first picture of the motherboard to have at least the seat 4 1 and the middle of the multiple bases 4 1). The CPU heat sink structure system group 2 described in this case is shown. For cooling the microprocessor (CPU), the fan has a bottom that can be connected to the microprocessor (CPU). Phase: There are a plurality of heat dissipation fins 4 2 on the top surface of the base 41. The $ heat transfer fin 4 2 is formed by continuous bending of a metal sheet. If necessary, a frame 43 for a fixed fan can also be provided. Square, shown, step a: First, go, please read the schematic diagram of the manufacturing process in the second figure. The wavy heat dissipation fins 4 are continuously folded with a long metal sheet 42a, and they are all folded into a shape. " b 'while each folded heat sink fin is seen from its end face V', the zigzag fins are connected; in the state, there is a connecting surface at the bottom and the adjacent one, and the tip along a center car is reduced by $ The folded fins are formed by each radiating fin and punched on each connection surface to surround a cylindrical radiation radiating fin 42, and a groove 4 of an appropriate size is opened 42 (:; step c: 于 基The base 41 is provided with a glue (f glue) 5 0; Step d: ^, and apply a solder paste (or conductive mold 60 on the shape of 5 Xuan groove 4 11); Step Z describes the cylindrical heat dissipation fin 42-end Put on a circular groove on the base 41 ~, press the other end of the cylindrical heat sink fin 4 2 and pressurize and heat to melt the solder paste on the base 41
第6頁 498191 、發明說明（4)Page 6 498191, description of the invention (4)
此，本發明 真圓度，而 可利用塗佈 鰭片與基座 觸與結合更 綜上所 能達到降低 其散熱效率 之「實用性 及其組織型 用或見於刊 法規定向 便。 之製造 可方便 於基座 連結成 為密實 述，本 風阻， 之功能 」與「 態，於 物，而 鈞局提 ί匕，而使圓形柱散熱鰭片4 2與基座4 1連結成一體。 如上述之方法，請再配合第一及第三圖所示，其中在 基座41上之凹槽41 1的内外徑恰分別對應於圓柱形散熱轉 片42之底面421的内外緣直徑；另如第二圖中所示，其^ 製具60上亦具有一圓形凹槽601，該凹槽6〇1之内外徑恰對 應於圓柱形散熱鰭片42之頂面422的内外緣直徑者；因° 、 方法得簡便的維持 、快速的完成鰭片 凹槽411之錫膏（或 一體，以使基座4 1 ，提昇該散熱器4 0 發明之方法所製造 增加鰭片之摺疊片 與目的；是以本案 進步性」要件；又 本案提出申請前未 具發明之「新穎性 起專利申請，並懇 圓柱形散熱鰭片4 2之 的結合與組裝；又， 導熱膠）將圓形散熱 至散熱鰭片42間的接 之散熱效益者。 成之散熱器構造確實 數與散熱面積，提昇 能符合專利法所規定 ’本發明所述之構造 有相同之構造公開使 」。申請人袭依專利 請賜准專利，實感德Therefore, according to the present invention, the roundness of the invention can be reduced by using the combination of the coating fin and the base to achieve a reduction in its heat dissipation efficiency. It is convenient for the connection of the base to become a compact description, the function of the wind resistance "and" state, to the object, and Jun Bureau mentions the dagger, so that the circular column heat dissipation fin 4 2 and the base 41 1 are integrated into one. As mentioned above For the method, please match the first and third figures, in which the inner and outer diameters of the grooves 41 1 on the base 41 respectively correspond to the inner and outer edge diameters of the bottom surface 421 of the cylindrical heat sink 42; As shown in the two figures, the fixture 60 also has a circular groove 601, and the inner and outer diameter of the groove 601 corresponds to the diameter of the inner and outer edges of the top surface 422 of the cylindrical heat sink fin 42; ° The method is simple to maintain and quickly complete the solder paste of the fin groove 411 (or integrated to make the base 4 1 and enhance the heat sink 40. The method of the invention invented by the method of adding fins and folding fins; "Progressiveness in this case"; and no invention was made before the application was filed in this case "The novelty is filed for patent application, and the combination and assembly of cylindrical heat dissipation fins 42; and, heat conductive glue) The heat dissipation effect of circular heat dissipation to the connection between the heat dissipation fins 42. The exact number and heat dissipation area can be improved according to the provisions of the Patent Law. Applicant relies on patents
第7頁 498191 圖式簡單說明 第一圖是一CPU構造之立體圖。 第二圖是本發明之製造流程圖。 第三圖是另一實施例構造立體圖。 第四圖是習知電腦散熱器之平面組合實施例圖。 【主要元件符號】Page 7 498191 Brief description of the diagram The first diagram is a perspective view of the structure of a CPU. The second figure is a manufacturing flowchart of the present invention. The third figure is a perspective view of the structure of another embodiment. The fourth figure is a plan view of an embodiment of a conventional computer radiator. [Symbol of main component]
第8頁 散熱器 10 > 40 基 座 11、41 散熱鰭片 12、42 框 架 13 ' 43 風 扇 20 微處理器 30 錫 膏 50 製 具 60 凹 槽 411 、 601 底 面 421 頂 面 422 阻擋面 121 金屬薄片 42a 大波浪狀散熱鰭片42b 開 口 42cPage 8 Radiator 10 > 40 Base 11, 41 Cooling fins 12, 42 Frame 13 '43 Fan 20 Microprocessor 30 Solder paste 50 Tooling 60 Groove 411, 601 Bottom surface 421 Top surface 422 Blocking surface 121 Metal Sheet 42a Large wavy fins 42b Opening 42c