1271141 九、發明說明： 【發明所屡之技術領域】 本發明係有關於-種「散熱器材結構」，尤指一種結合相 異金屬之散熱器結構。 【先前技術】 按，隨著尚科技的蓬勃發展，電子元件（如cpu等）的 體積趨於微小化，而且單位峨±的雜度也越來越高，其效 能更是不斷增強，在這些因素之下，電子元件的總發熱量則幾 乎逐年升南’倘若沒有良好的散熱方式來排除電子元件所產生 的熱，這些過高的溫度將導致電子元件產生電子游離(Thermal Runaway)與熱應力（Thermai Stress)等現象造成整體的穩定 性降低，以及縮短電子元件本身的壽命，因此如何藉助外部冷 卻衣置/系統來排除這些高發熱的電子元件產生的熱量，避免 電子元件過熱一直是不容忽視的的問題。 而一般常見的冷卻方式可分以下四類·· 1·強制空氣冷卻 2·自然冷卻3·相變化法4•液體直接與間接冷卻，而目前最常 使用的都採取強制空氣冷卻，再與散熱器結合以達到冷卻的效 果’以散熱益之鰭片來幫助元件散熱，其原因是因為鰭片的嵌 入可乓加琶子元件的散熱面積，又由於氣冷式鰭片散熱器是以 工氣作為放熱的工作媒介(w〇rkingfflecjium)，取之容易，且又 穩定，不會傷及電子元件，又因散熱器本身材料以紹及銅為 5 1271141 主，造價低廉且熱傳導係數又高，材質本身又容易加工，若在 幾何形狀與最佳化設計配合，將更有利於解決電子元件的散熱 問題。 而以往一般常見的散熱器係由鋁材質掩壓成型，只是鋁材 質其熱傳導性差、散熱快，較電子元件賴生的高溫無 法為紹製散熱ϋ快速熱傳導，對於實際散熱效果相當有限；而 另-種銅材質成型之的散熱H雖可改翻f散熱糾熱傳導 效率，但銅材質的散熱效果不及蹄f，且其製造成本亦較昂 貴’以致整體成本及售價皆高於域散熱器，而較少令使用者 接受。 因此’亦有進者·!s材質散熱快，銅材熱傳導快的性 質，製造-種銘材及銅材的相異材散熱器’如第一圖所示，係 有-銘材部分11及-銅材部分12，馳材部分u係緊鄰該 銅材部分12部分11設有複數凸伸之鰭片13，俾藉 該銅材部分12貼觸—高發熱之電子树14，以快速傳導該^ 子元件14之熱量，經由該姆部分u及其則13散敎’ 又或者如第二圖所示，係有,材部分21及—鋼材部八 22，辦呂材。P刀21中間處設有一挖空之凹槽2ιι，再於 槽211内嵌入相同於該凹槽211之形狀與體積之銅材部分: 魏斷則23，軸銅材部分 22貼觸電件24,以快速傳導該電子元件24之熱量，經 1271141 由呂材部分21及其鰭片23散熱。 邱八t如第三、四騎示，其係具有—崎部分31，脑材 =鬥L係呈的中空柱狀’其體内形成有—貫穿·，而其 内緊迫2複數徑向向外凸伸之鰭片33 ’並於該貫穿孔311 =銅材部分32，俾令鋼材部分32的底端面對應貼 ^電:元件34,以藉由銅材部分32快速傳導該電子元件34 之熱量，經由銘材部分31及其鰭片33快速散熱。 題存_施上都有其共同問 由於該崎部分12、221撕在-預置區塊， 鄰=，才部分12、22、32及與銅材部们2、 w接之少量鋁材部分η ^ 至鰭片仏23、33卢播 導致熱量無法有效的分佈 分佈於整料^ 雜料之熱量無法平均的 布於正體稍^致使絲效果無法有_細。 承上述之鋁材部分u、21、3 者的重量不同，宏尽·, “ 何1刀12、22、32兩 31與銅材部分12m者ΓΓ而使轉部分u、21、 使得使用壽命減短。 、疋皿於上述習用品所衍生的各項缺點 人為增進本案更臻於完盖，、冢 、、’ ”务明 經驗，潛心研究加以：一，以從事該行業多年之 。。材結構」案，實為一具功效增進之發明。 月文熱 7 1271141 【發明内容】 曰羑此，為有效解決上述之問題，本發明之主要目的乃係在 ’、種°亥放熱盗之基座及複數黷片結合有至少一傳導元 件’且該傳導元件係呈局部設置，佈滿整個基座及散熱籍片， 且構成該傳導元件之金屬材料與該基座及散熱鰭片所構成之 金屬材料不同，俾增加散熱效率。 。本發’另—目的乃係在提供—種該料元件係呈條狀 或片狀間隔或呈峨交錯_設置於職座及散熱鰭片，俾達 增加散熱®積及有效的平均料熱量及快速賴之特性。 為了達上述之目的本發明之「散熱器材結構」，至少包含 有-基座’該基座設有複數凸伸縛片，其特徵在於：該基座及 鰭片結合有至少-傳導元件，該傳導元件係呈局部設置於該基 座及鰭片，且該基座及則係由第—種金屬材料形成，該傳導 讀係由第二金屬㈣形成，且其不祕該基座及則之第一 種金屬材料。 本务明之上述目的及其結顯雜上的雜，將依據所附 圖式之較佳實朗，俾得—更深人之瞭解。 L貫施方式】 本發明係提供—種「散絲概構」，_係為本發w 佳實施例，請錢第五、六_示，至少包含有-基座41 該基座41設有複數凸伸‘鰭片411，及至少一傳導元件犯，^ 1271141 傳導元件42係與該基座41及鰭片411結合，在一可行實施例 中該傳導元件42係結合於該基座41及鰭片411體内及或表面 上，且呈局部設置嵌合或埋設於基座41及鰭片411體内及或 表面，亦即該傳導元件42係佈滿該基座41及鰭片411，在一 可行貫施例中該局部設置係呈間隔排列，且該間隔排列係呈平 钱 行或非平行或交錯皆可，而該傳導元件42之構成材料與該基 座41及鰭片411之構成材料相異，即基座41及鰭片411係由 第-種金屬频製成，該傳導元件42係由不同於第—種金屬籲 材料之第二金屬材料製成。 、而所述之傳導元件42係可成片狀（如第七圖示）或條線 、（汝第八圖示）或網狀（如第九圖示）或粒狀（如第十、十 、圖不）或蜂巢狀（如第十二圖示）或點矩陣狀（十三、十四） ，放射狀（如第十五圖示）或螺旋狀（如第十六、十七圖示） ，同、圓狀（如第十人圖示）或蛛網狀（如第十九圖示）或不 率^何，之分布（無圖示）’且該第二金屬材料的熱傳導效 材料:於弟—種金屬材料熱傳導效率，即例如1:當第-金屬 、材日^’飾二金屬材料為金或銀細材或更佳於第一 該第Γί Γ績之傳導材；例如2:當第—金屬材料為銅材時， 屬材為金或銀材’而所述之第一金屬材料及第二金 成。 触於上例列述之材料，亦可由其它金屬材料製 9 1271141 故，當該基座41貼觸於一電子元件43上時，該電子元件 43運作所產生之熱量’大部分藉由該傳導元件&快速的傳 導’少部分藉由該基座41及籍片411傳導，且該傳導元件42 所傳導之熱量亦可被該基座41及鰭片411所傳導，亦即娜 量可被平均的傳導至整體散熱器，再進一利用該散熱器之基座 41及鰭片411產生快速散熱的效果，並藉由外部的装置如風 扇等（無圖示），產生強制對流的作用，以形成冷空氣與 411及傳導元件42產生熱交換的特性，進而將熱量帶走，俾 大大增進散熱效率，又，_傳導元件42的體積係分佈於基 座41及鰭片411體内及或表面上，俾可增加基座及韓片 411之熱傳導及散熱面積，即與空氣接觸的面積，而達增進散 熱效率之特性，藉以改善f知因熱傳導熱量集中在銅材料部 刀致使-亥熱里分配不平均，無法有效傳遞到銘材料部分之链 片。 …、曰 入綜上所述，本發明所提供之一種「散熱器材結構」，確符 合准予專利之要件’纽絲料财請，姆A予專利， 實為感禱。 惟以上所述者，僅係本發明之較佳可行之實施例而已，舉 凡利用本發明上述之方法、雜、構造、裝置所為之變化，皆 應包含於本案之權利範圍内。 【圖式簡單說明】 1271141 第-圓係為第-種習知異材散熱器材結構 第二圖係為第二種習知異材散熱器材結構之 =二圖係為第三種_材— 弟四圖係為第三則知冊散熱蹄結構之 : 第五圖係為本發日膽佳實施例之正視示意圖；不思'， 第六圖係為本發明較佳實施例之側視示意圖；1271141 IX. Description of the Invention: [Technical Fields of the Invention] The present invention relates to a "heat sink material structure", and more particularly to a heat sink structure incorporating a dissimilar metal. [Prior Art] According to the rapid development of the technology, the volume of electronic components (such as cpu, etc.) tends to be miniaturized, and the complexity of the unit 峨± is also getting higher and higher, and its performance is constantly enhanced. Under the factor, the total heat output of the electronic components is almost increasing year by year. 'If there is no good heat dissipation method to eliminate the heat generated by the electronic components, these excessive temperatures will cause the electronic components to generate electrons (Thermal Runaway) and thermal stress. (Thermai Stress) and other phenomena cause the overall stability to decrease, and shorten the life of the electronic components themselves. Therefore, how to eliminate the heat generated by these high-heating electronic components by means of external cooling clothes/systems, and avoiding overheating of electronic components has not been neglected. The problem. The common cooling methods can be divided into the following four categories: ·1 · Forced air cooling 2 · Natural cooling 3 · Phase change method 4 • Liquid direct and indirect cooling, while the most commonly used ones are forced air cooling, and then heat dissipation The combination of the devices to achieve the cooling effect 'to help the heat dissipation of the heat sink fins, because the fins can be embedded in the heat dissipation area of the scorpion components, and the air-cooled fin heat sink is the work air. As an exothermic working medium (w〇rkingfflecjium), it is easy and stable, does not damage electronic components, and because the material of the radiator itself is mainly 5 1271141, the cost is low and the heat transfer coefficient is high. It is easy to process itself. If the geometry is matched with the optimized design, it will be more conducive to solving the heat dissipation problem of electronic components. In the past, the common heat sinks were formed by aluminum material, but aluminum materials have poor thermal conductivity and fast heat dissipation. The high temperature of electronic components cannot be used for heat dissipation and rapid heat conduction. The actual heat dissipation effect is quite limited; - The heat dissipation H formed by the copper material can change the heat dissipation and heat conduction efficiency, but the heat dissipation effect of the copper material is not as good as the hoof, and the manufacturing cost is also expensive. The overall cost and price are higher than the domain heat sink. It is less acceptable to users. Therefore, 'there are also those who enter! s material heat dissipation, copper material heat conduction fast, manufacturing - a variety of materials and copper of the dissimilar radiators' as shown in the first figure, with - Ming material part 11 and - The copper portion 12, the chisel portion u is adjacent to the portion of the copper portion 12, and is provided with a plurality of fins 13 protruding from the copper portion 12 to contact the high-heating electron tree 14 for rapid conduction of the ^ The heat of the element 14 is dissipated through the ram portion u and then 13 or, as shown in the second figure, the material portion 21 and the steel portion 八22. A hollowed out groove 2 ιι is provided in the middle of the P blade 21, and a copper portion similar to the shape and volume of the groove 211 is embedded in the groove 211: Wei is 23, and the shaft copper portion 22 is attached to the electric member 24. In order to quickly conduct heat of the electronic component 24, heat is dissipated from the Lu material portion 21 and its fins 23 through 1271141. Qiu Ba is as the third and fourth riding, and its system has a -Saki part 31, a brain material = a L-shaped hollow column-shaped body, which has a through-through, and its inner pressing 2 plural radial outward The protruding fin 33' is parallel to the through hole 311 = the copper portion 32, and the bottom end surface of the steel portion 32 is correspondingly attached to the element 34 to rapidly conduct heat of the electronic component 34 by the copper portion 32. The heat is quickly dissipated via the name material portion 31 and its fins 33. There are common questions in the _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ η ^ to fins 仏 23, 33 lubricated so that the heat can not be effectively distributed in the whole material ^ The heat of the miscellaneous materials can not be evenly distributed in the body slightly so that the effect of the silk can not be thin. The weight of the above-mentioned aluminum parts u, 21, and 3 is different, and the macro is exhausted, "Which 1 knife 12, 22, 32 31 and the copper part 12m are twisted to make the part u, 21, so that the service life is reduced. Short. The various shortcomings derived from the above-mentioned utensils have made it easier for the case to improve the case, and to learn from the experience, and to study and apply: First, to engage in the industry for many years. . The material structure case is actually an invention with enhanced efficacy. SUMMARY OF THE INVENTION In order to effectively solve the above problems, the main object of the present invention is to combine at least one conductive element with a plurality of pedestals and a plurality of cymbals. The conductive element is partially disposed to cover the entire pedestal and the heat-dissipating film, and the metal material constituting the conductive element is different from the metal material formed by the pedestal and the heat-dissipating fin, thereby increasing heat dissipation efficiency. . The 'other' purpose is to provide a strip or sheet-like spacing or staggered _ in the provision of the seat and heat sink fins, to increase the heat dissipation and the effective average heat of the material. Quickly depends on the features. In order to achieve the above object, the "heat sink material structure" of the present invention comprises at least a pedestal. The pedestal is provided with a plurality of protruding tabs, wherein the pedestal and the fin are combined with at least a conductive element. The conductive element is partially disposed on the base and the fin, and the base and the base are formed of a first metal material, the conductive read system is formed by the second metal (four), and the base is not secreted and then The first metal material. The above-mentioned purposes of this book and its mixed miscellaneous items will be based on the better and better of the attached drawings. The present invention provides a "stitched outline", which is a preferred embodiment of the present invention. Please refer to the fifth and sixth figures, including at least a base 41. a plurality of protruding fins 411, and at least one conductive member, the conductive member 42 is coupled to the base 41 and the fins 411. In a possible embodiment, the conductive member 42 is coupled to the base 41 and The fins 411 are embedded or embedded in the body and or the surface of the 411 and the fins 411, that is, the conductive elements 42 are filled with the pedestal 41 and the fins 411. In a feasible embodiment, the partial arrangement is arranged at intervals, and the spacing arrangement is in the form of a flat money or non-parallel or staggered, and the constituent material of the conductive element 42 and the base 41 and the fin 411 are The constituent materials are different, that is, the susceptor 41 and the fins 411 are made of a first metal, and the conductive member 42 is made of a second metal material different from the first metal absorbing material. And the conductive element 42 can be in the form of a sheet (such as the seventh illustration) or a line, (汝 eighth illustration) or a mesh (such as the ninth illustration) or granular (such as the tenth, tenth , Figure not) or honeycomb (such as the twelfth figure) or dot matrix (thirteen, fourteen), radial (such as the fifteenth icon) or spiral (such as the sixteenth, seventeenth ), the same, round (such as the tenth person icon) or arachnoid (such as the nineteenth icon) or the rate of distribution (not shown) and the heat transfer material of the second metal material: Yu Di—the heat transfer efficiency of a metal material, that is, for example, when the first metal, the material, the metal material is gold or silver, or better than the first conductive material; for example, 2: When the first metal material is a copper material, the metal material is a gold or silver material and the first metal material and the second metal material are formed. The material listed in the above example may also be made of other metal materials, such as 9 1271141. When the susceptor 41 is attached to an electronic component 43, the heat generated by the operation of the electronic component 43 is mostly conducted by the conduction. The component & rapid conduction 'small portion is conducted by the pedestal 41 and the fragment 411, and the heat conducted by the conduction element 42 can also be conducted by the pedestal 41 and the fin 411, that is, the amount can be The average conduction to the overall heat sink, and the use of the base 41 and the fins 411 of the heat sink to generate a rapid heat dissipation effect, and the forced convection is generated by an external device such as a fan (not shown). The cold air is formed to exchange heat with the 411 and the conductive element 42 to further remove the heat, thereby greatly improving the heat dissipation efficiency. Further, the volume of the conductive element 42 is distributed in the body and/or the surface of the base 41 and the fin 411. On the top, 俾 can increase the heat conduction and heat dissipation area of the pedestal and the Korean film 411, that is, the area in contact with the air, and improve the heat dissipation efficiency, thereby improving the heat conduction of the heat conduction in the copper material portion of the knife. Not allocated Are not effectively transmitted to the strand of sheet material portion Ming. ..., 曰 In summary, the "heat sink material structure" provided by the present invention is indeed in compliance with the requirements of the patent, "News materials, money, patents, is a pray." However, the above-mentioned embodiments of the present invention are intended to be included in the scope of the present invention. [Simple description of the schema] 1271141 The first-circle is the first-class conventional radiator material structure. The second diagram is the second-known conventional radiator material structure. The second diagram is the third type. The third embodiment is a front view of the embodiment of the present invention; the fifth figure is a schematic side view of the preferred embodiment of the present invention;
^七圖係為本發明傳導元件之另—設置態樣之示意圖； 第八圖係為本發明傳導元件之另—設置祕之示意圖； 第九圖係為本發明料元件之另—設置祕之示意圖； 第十圖係為本發明傳導元件之另—設置紐之示意圖； 第十一圖係為本發明傳導元件之另一設置態樣之示意圖 第十二圖係為本發明傳導元件之另一設置態樣之示意圖 第十三圖係為本發明傳導元件之另一設置態樣之示意圖 第十四圖係為本發明傳導元件之另一設置態樣之示意圖 第十五圖係為本發明傳導元件之另一設置態樣之示意圖 第十六圖係為本發明傳導元件之另一設置態樣之示意圖 第十七圖係為本發明傳導元件之另一設置態樣之示意圖 第十八圖係為本發明傳導元件之另一設置態樣之示意圖 第十九圖係為本發明傳導元件之另一設置態樣之示意圖。 【主要元件符號說明】 11 · · ·铭材部分 31 · · ·紹材部分 11 1271141 12 · ••銅材部分 13 · ••鰭片 14 · ••電子元件 21 · ••銘材部分 211 · ••凹槽 22 · ••銅材部分 23 · ••鰭片 24 · ••電子元件 311 · ••貫穿孔 32 · · •銅材部分 33 · · •籍片 34 · · •電子元件 41 · · •基座 411 · ••縛片 42 · · •傳導元件 43 · · •電子元件^七图 is a schematic view of another embodiment of the conductive element of the present invention; the eighth figure is a schematic diagram of another set of conductive elements of the present invention; the ninth figure is another set of secret elements of the present invention The tenth figure is a schematic diagram of another arrangement of the conductive elements of the present invention; the eleventh figure is a schematic view of another arrangement of the conductive elements of the present invention. The twelfth figure is another of the conductive elements of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 13 is a schematic view showing another arrangement of the conductive member of the present invention. FIG. 14 is a schematic view showing another arrangement of the conductive member of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 16 is a schematic view showing another arrangement of a conductive element of the present invention. FIG. 17 is a schematic view showing another arrangement of the conductive element of the present invention. FIG. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 19 is a schematic view showing another arrangement of the conductive member of the present invention. [Main component symbol description] 11 · · ·Made material part 31 · · ·Material part 11 1271141 12 · •• Copper part 13 ·••Fin 14 ·••Electronic component 21 ·••Ming material part 211 · • • Groove 22 • • • Copper section 23 • • • Fin 24 • • Electronic component 311 • • • Through hole 32 • • • Copper section 33 • • • Tablet 34 • • • Electronic component 41 • · • Base 411 · •• Baffle 42 · · • Conductive element 43 · · • Electronic components
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