471022 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明（1 ) 【發明之背景】 本發明係有關於由熱機測試板及支持此熱機測試板之 框體所成之熱機測試板單元，特別是關於適用於JgLiL加....熱 凰.熱.機測.Ji姐.之屬—形..而造成之膨麗之省..效技術。於完成 半導體之生產爲止，製造過程係非常複雜且敏感，在各種 地方存在有產生故障之要因。包括有設計上之問題，檢查 場的問題，交給使用者後，包含環境及電路構成等使用上 之問題。另外，在製造上矽基板擴散鈍化作用、配線電極 、構架、封裝、膜片結合、引線接合器、封止等各種發生 故障之要因。 而且，主要之故障模式，爲表面缺陷（離子污染）、 氧化膜缺陷（氣孔）、金屬配線缺陷、入出力電路缺陷等 。爲成爲了去除以這些固有缺陷及製造上之不安定爲起因 ;依存於時間與壓力熱機裝置而引起故障之半積體電路裝 置之檢查裝置，形成有熱機裝置。 在此熱機裝置中，以去除初期故障爲目的，以半導體 積體電路裝置爲例，於1 251程度之加熱下，以定格或者 較定格高1〜2成之電壓來加壓，使它動作一定之時間進行測 試工作。 在如此之熱機測試裝置中裝上半導體積體電路裝置時 ，常使用熱機測試板（測試板）。 熱機測試板係由形成有配線層之玻璃環氧樹脂之積層 板所構成’半導體積體電路裝置係藉著插孔在熱機測試板 之預定位置上複數地被搭載。在熱機測試板之一邊上，爲 ----------I I--- --------訂---- -----線 Ϊ (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -4-471022 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention (1) [Background of the invention] The present invention relates to a thermomechanical test board unit composed of a thermomechanical test board and a frame supporting the thermomechanical test board. In particular, it is applicable to JgLiL plus .... Heat Phoenix.Heat.Machine test.Ji sister.The genus-shape..and the magnificent province..efficiency technology. Until the completion of semiconductor production, the manufacturing process is very complex and sensitive, and there are factors that cause failures in various places. Including design problems, inspection field problems, and after handing them over to the user, they include environmental and circuit configuration problems. In addition, there are various causes of failures such as diffusion passivation of silicon substrates, wiring electrodes, frames, packages, film bonding, wire bonding, and sealing. Moreover, the main failure modes are surface defects (ion contamination), oxide film defects (porosity), metal wiring defects, and input and output circuit defects. In order to become an inspection device for removing the semi-integrated circuit device which causes the inherent defects and manufacturing instability, and causes malfunctions depending on the time and pressure of the heat engine device, a heat engine device is formed. In this thermo-mechanical device, for the purpose of removing the initial failure, taking a semiconductor integrated circuit device as an example, under a heating of 1 251 degrees, pressurizing with a voltage of 1 or 20% higher than the fixed frame to make it operate steadily Time for testing. When a semiconductor integrated circuit device is mounted in such a thermomechanical test device, a thermomechanical test board (test board) is often used. The thermomechanical test board is composed of a laminated glass epoxy resin formed with a wiring layer. The semiconductor integrated circuit device is mounted in plural at predetermined positions of the thermomechanical test board through a socket. On one side of the heat engine test board, it is ---------- I I --- -------- Order ---- ----- line (Please read the Note: Please fill in this page again) This paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm) -4-
471022 五、發明說明（2) 了使熱機測試裝置側之邊緣連接器與熱機測試板作電氣性 連接而設置有邊緣端子，藉由將搭載於半導體積體電路裝 置之熱機測試板安裝到熱機測試裝置，而邊緣端子與邊綠 連接器相嵌合，從熱機測試裝置中，將對半導體積體電路 裝置印加預定程度之電壓。 在熱機測試板中，以補強及使用上之簡單等爲目的， 例如用由鋁等所製成的金屬製框體之架構，沿著外周而來 固定。並且’以熱機測試板與構架來形成熱機測試板單元 在此因爲於熱機測試裝置·中將熱應力加於半導體積體 電路裝置中，所以熱機測試單元也被放置於與半導體積體 電路裝置同樣之加熱狀態下。因此，熱機測試板極與構架 也會產生熱膨脹之情形。 因爲由玻璃環氧樹脂所成之熱機測試板與鋁製之構架 之間具有不同之線膨脹係數，當如此之2個構件在相互固定 之狀態被加熱時，熱機測試單元將向線膨脹係數較小之熱 機測試板的方向彎曲。 而且，因爲如此之熱機測試單元彎曲邊緣端子對於邊 緣連接器之嵌合狀態將產生變化，而發生接觸不良之情形 〇 如此，因爲會使來自於熱機測試裝置，藉著連接器邊 緣端子之預定強度電壓無加印加於半導體積體電路裝置之 上，因而不能進行半導體積體電路裝置之撿測工作。 本發明者係爲了防止於以上所說明之熱機測試單元之 --------------,^-----,---訂-------—線 t (請先閱讀背面之注咅心事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 @張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -5 - 471022 A7 _________B7 經濟部智慧財產局員工消費合作社印製 五、發明說明（3 ) 彎曲作了以下3種之嚐試。 第1個嚐試爲將熱機測試板與構架用線膨脹係數相近之 構件來形成。但是，具有構成之種類將極端地受到限制， 而使特定有效構件變成非常困難。 第2個嚐試爲用兩個構架來夾住熱機測試板（或者用兩 片熱機測試板來夾住構架）強制地押住彎曲。但是，因長 久時間效應而產生應力使得產生彎曲。 第3個嚐試爲對於構成框體之構架的各支撐部固定其一 邊之端部，而其他位置別安裝成對於熱機測試板具有活動 空間，而用這個活動空間來吸收兩者之熱膨脹量。但是因 爲熱變形而延伸之支撐部之延長全體係在鄰接支撐部之固 定部位作用，所以還是不能完全排除彎曲之情形。 此時，雖然檢討了將構架之全位置安裝成對於熱機測 試板具有活動空間，但是不只在設有固定於構架之熱機測 試板在向熱機測試裝置安裝時或操作時，因晃動而難於使 用，也容易成爲發生不良之原因。 但是，若能使構架不採用框體而採用板狀體，如此將 板狀體之構架之中心固定在熱機測試板之中心，藉由安裝 成在其他位置對於熱機測試板具有活動空間，而能在空間 之部分吸收兩者熱膨脹量的差。 但是，在熱機測試板的兩面上，因爲安裝有爲了固定 安裝半導體積體電路裝置，或者爲了拔除電路性連接器之 插孔、端子、連接器、金屬配線等，採用板狀體之構架使 有相當之困難。另外，就算假設可能採用板狀體之構架， (請先閱讀背面之注意事項再填寫本頁) 裝--------訂" I------線 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -6- 471022 A7 B7 五、發明說明（4 ) 而因只有固定中央部分，因爲構架與熱機測試機板將產生 晃動，還是會使在向熱機測試裝置安裝或操作時因產生晃 動而難於使用，成爲發生不良之原因。 因此，如同以上所說明之問題，不侷限於熱機測試裝 置與構架所成之熱機測試板單元，也適用於有關因熱膨脹 而彎曲之種種熱機測試單元。 【發明之槪要】 在此，本發明係以提供能夠控制互相固定之不同線膨 脹係數之測試板與框體之構架，於加熱時所產生的彎曲情 形爲目的。 爲了解決上述課題，有關於本發明之熱機測試板單元 係由具有預定功能之測試板，與4支支撐部所形成之四邊形 構架；與設置在個別之支撐部之略爲中央部形成沿著測試 扳外周而固定構架之固定部之第一安裝構件；與在第1安裝 構件與支撐部的端部之間的位置，且固定於支撐部極而在 測試板形成對於締結孔具有空隙之同時，貫通締結孔且從 測試板突出，且在突出部形成阻止容許向支撐部之長方向 連續移動時，測試板上浮情形之凸緣，而形成有抑制滑動 部之第2安裝構件等所構成，有測試板之im皇.中 麟羼麵之狐ai之 根據如此之發明，卩省五.祖里复茗王.麗蓋麗 攀之測試板與麗體，〜之農袈里加羞座.嚴生....之I.血麗.# 〇 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注咅似事項再填寫本頁) 裝·-------:訂--I I I I---線 經濟部智慧財產局員工消費合作社印製 471022 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明（5) 【圖面之簡單說明】 第1圖 係爲顯示本發明實施形態1中，熱機測試板單 元之平面圖。 第2圖係爲顯示第1圖之熱機測試板單元中之第2安裝 構件及其周邊之平面圖。 第3圖係爲顯示第1圖之熱機測試板單元中於不產生 熱變形狀態之第2安裝構件及其周邊之斷面圖。 第4圖係爲顯示第1圖之熱機測試板單元於產生熱變 形狀態時之弟2女裝構件及其周邊之斷面圖。 第5圖係爲不產生熱變形狀態之第1圖的熱機測試板 單元及產生熱變形狀態之第1圖的熱機測試板單元之比較說 明圖。 第6圖係爲顯示本發明實施形態1中，熱機測試板單 元之變形例中第2安裝構件及其周邊之平面圖。 第7圖係爲顯示本發明實施形態1中，於熱機測試板 單元之其他變形例中第2安裝構件及其周邊之平面圖。 第8圖係爲顯示本發明實施形態1中，於熱機測試板 單元之其他變形例中第2安裝構件及其周邊之斷面圖。 第9圖係爲顯示本發明實施形態1中，熱機測試板單 元之更屬於其他變形例中重要部分之斷面圖。 第1 0圖係爲顯示本發明實施形態1中，熱機測試板單 元之更屬於其他變形例中重要部分之斷面圖。 第1 1圖係爲顯示本發明實施形態2中之熱機測試板單 元之平面圖。 (請先閱讀背面之注意事項再填寫本頁)471022 V. Description of the invention (2) The edge connector on the heat engine test device side is electrically connected to the heat engine test board and edge terminals are provided. The heat engine test board mounted on the semiconductor integrated circuit device is installed to the heat engine test Device, and the edge terminal is fitted with the edge green connector, and a predetermined voltage is applied to the semiconductor integrated circuit device from the thermomechanical test device. In a thermomechanical test board, for the purpose of reinforcement and ease of use, for example, a metal frame structure made of aluminum or the like is fixed along the outer periphery. In addition, 'the thermomechanical test board unit is formed by the thermomechanical test board and the framework. Since the thermal stress is applied to the semiconductor integrated circuit device in the thermomechanical test device, the thermomechanical test unit is also placed in the same manner as the semiconductor integrated circuit device Under heating. Therefore, thermal engine test plate and frame will also generate thermal expansion. Because the thermomechanical test board made of glass epoxy resin and the aluminum frame have different linear expansion coefficients, when such two components are heated in a fixed state, the thermomechanical test unit will have a higher linear expansion coefficient. The direction of the small hot engine test board is bent. In addition, because such a thermomechanical test unit bends the edge terminal to the mating state of the edge connector, and a poor contact occurs. This is because it will come from the thermomechanical test device, by the predetermined strength of the connector edge terminal. The voltage is not applied to the semiconductor integrated circuit device, so the semiconductor integrated circuit device cannot be tested. The inventor is in order to prevent the --------------, ^ -----, --- order --------- line of the heat engine test unit described above. t (Please read the note on the back before filling out this page) Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs' Employee Co-operative Society @ 张 标 Applies to China National Standard (CNS) A4 (210 X 297 mm) -5-471022 A7 _________B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. Description of Invention (3) Bending made the following three attempts. The first attempt was to form a thermomechanical test board and a member having a similar coefficient of linear expansion to the frame. However, the types of constituents are extremely limited, and it becomes very difficult to make certain effective components. The second attempt is to force the bend by clamping the thermomechanical test panel with two frames (or the two thermomechanical test panels to clamp the frame). However, the stress caused by the long-term effect causes bending. The third attempt is to fix one end of each side of each support part constituting the frame of the frame, and install other positions so as to have a movable space for the thermomechanical test board, and use this movable space to absorb the thermal expansion of the two. However, since the entire extension of the support portion extended due to thermal deformation acts on a fixed portion adjacent to the support portion, bending cannot be completely ruled out. At this time, although it was reviewed that the full-frame installation of the frame has a space for the heat engine test board, it is not only difficult to use the heat engine test board fixed to the frame when it is installed or operated during the heat engine test device, It is also likely to be a cause of failure. However, if the frame can be made into a plate-shaped body instead of a frame, the center of the plate-shaped frame can be fixed to the center of the thermomechanical test board, and it can be installed in other positions to have a space for the thermomechanical test board. The difference in thermal expansion between the two is absorbed in the space. However, on both sides of the thermomechanical test board, a plate-like structure is used because the semiconductor integrated circuit device is fixedly installed or the plug, terminal, connector, metal wiring, etc. of the circuit connector is removed. Quite difficult. In addition, even if it is assumed that a plate-like structure may be used, (please read the precautions on the back before filling out this page). -------- Order " I ------ The size of the paper is suitable for China National Standard (CNS) A4 Specification (210 X 297 mm) -6- 471022 A7 B7 V. Description of Invention (4) Because there is only a fixed central part, because the frame and the heat engine test machine board will shake, it will still cause The heat engine test device is difficult to use due to shaking during installation or operation, which is a cause of failure. Therefore, as described above, the problem is not limited to the thermomechanical test plate unit formed by the thermomechanical test device and the frame, but also applicable to various thermomechanical test units that are bent due to thermal expansion. [Summary of the invention] Here, the present invention aims at providing a bending condition of a test plate and a frame structure capable of controlling mutually fixed different linear expansion coefficients when heated. In order to solve the above problems, the heat engine test board unit of the present invention is a quadrangular frame formed by a test board having a predetermined function and four support portions; and a slightly central portion provided along the individual support portions is formed along the test The first mounting member that fixes the fixed portion of the frame by pulling the outer periphery; and the position between the first mounting member and the end portion of the support portion, and fixed to the support portion pole while the test board is formed with a gap for the connection hole, When the test hole penetrates the connection hole and protrudes from the test board, and when the protruding part is formed to prevent continuous movement in the long direction of the support part, a flange on the test board floats, and a second mounting member for suppressing the sliding part is formed. The test board of the emperor. Zhonglin, the face of the fox ai is based on such an invention, the provincial five. Zuli Fuwangwang. Li Gaolipan ’s test board and body, ~ the agricultural rig Riga shame seat. Yan Sheng .... 的 I. 血 丽. # 〇 This paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm) (Please read the notes on the back before filling in this page) Packing --- -----: Order--III I --- Ministry of Economics Printed by the Consumer Property Cooperative of the Intellectual Property Bureau 471022 A7 B7 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention (5) [Simplified description of the drawing] Figure 1 shows the thermal engine test in Embodiment 1 of the present invention Plan view of the board unit. Fig. 2 is a plan view showing the second mounting member and its periphery in the thermomechanical test board unit of Fig. 1. Fig. 3 is a cross-sectional view showing the second mounting member and its surroundings in the heat engine test panel unit of Fig. 1 in a state where no thermal deformation occurs. Fig. 4 is a cross-sectional view showing the components of the second lady's dress and its surroundings when the thermomechanical test panel unit of Fig. 1 is in a thermally deformed state. Fig. 5 is a comparative explanatory diagram of the thermomechanical test plate unit of Fig. 1 in a state where no thermal deformation occurs and the thermomechanical test plate unit of Fig. 1 in a state where thermal deformation occurs. Fig. 6 is a plan view showing a second mounting member and its surroundings in a modification of the thermomechanical test board unit according to the first embodiment of the present invention. Fig. 7 is a plan view showing a second mounting member and its surroundings in another modification of the thermomechanical test plate unit in the first embodiment of the present invention. Fig. 8 is a sectional view showing the second mounting member and its surroundings in another modification of the thermomechanical test panel unit according to the first embodiment of the present invention. Fig. 9 is a cross-sectional view showing that the thermomechanical test panel unit is an important part of other modified examples in the first embodiment of the present invention. Fig. 10 is a cross-sectional view showing that in the first embodiment of the present invention, the thermomechanical test panel unit is an important part of other modified examples. Fig. 11 is a plan view showing a thermomechanical test board unit in Embodiment 2 of the present invention. (Please read the notes on the back before filling this page)
裝---I I---訂---------線 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -8- 4?1〇22 A7 〜^^ ____B7__ 五、發明說明（6 ) 第1 2圖係爲顯示第1 1圖之熱機測試板單元於不產生 熱變形狀態時’角落部之周邊的平面圖。 第13圖係爲顯示第1 1圖之熱機測試板單元於已)奎生 熱變形狀態時’角落部之周邊的平面圖。 第14圖係爲顯示本發明實施形態3中之熱機測試板單 元之平面圖。 第15圖 係爲顯示第14圖之熱機測試板單元於不產生 熱變形狀態時，角落部之周邊的平面圖。 第1 6圖係爲顯示第1 4圖之熱機測試板單元於已產生 熱變形狀態時，角落部之周邊的平面圖。 (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 主要元件對照表 10 熱 機 測 試 板 單 元 11 熱 機 測 試 板 13 ；•自 邊 緣 端 子 14 半 導 體 積 體 電 路裝置 15 支 撐 部 16 把 手 17 第 1 安 裝 構 件 18 第 2 安裝 構 件 19 締 結 孔 ( 連 結 孔） 20 凸 緣 21 壓 縮 線 圈 彈 黃 25 空 間 墊 片 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -9- 471022 A7 _ B7 五、發明說明（7 ) 22 溝部 23 部分 12 構架 24 支持腳 【適切之實施瓊形態的說明】 以下將本發明之實施形態參照圖而具體加以說明。在 此，於所添附之圖面中在同一構件附上相同之符號，並且 省略重複之說明。但是，發明之實施形態係爲了實施本發 明特別有用的形態，而本發明並不限定於其實施形態。 (實施形態1 ) 第1圖顯示本發明實施形態1中，熱機測試板單元之平 面圖，第2圖顯示第1圖之熱機測試板單元中之第2安裝構件 及其周邊之平面圖，第3圖顯示第1圖之熱機測試板單元於 不產生熱變形狀態時之第2安裝構件及其周邊之斷面圖，第 4圖顯示第1圖之熱機測試板單元於產生熱變形狀態時之第2 安裝構件及其周邊之斷面圖，第5圖顯示在不產生熱變形狀 態之第1圖的熱機測試板單元及產生熱變形狀態之第1圖的 熱機測試板單元之比較說明圖。第6圖顯示本發明實施形態 1中，熱機測試板單元之變形例中第2安裝構件及其周邊之 平面圖。第7圖顯示本發明實施形態1中，於熱機測試板單 元之其他變形例中第2安裝構件及其周邊之平面圖。第8圖 顯示本發明實施形態丨中，於熱機測試板單元之其他變形例 本紙張尺度適用中國國家標準（CNS)A4规格（210 X 297公釐） 請先閱讀背面之注意事項再填寫本頁) 裝---------訂---------線 經濟部智慧財產局員工消費合作社印製 -10- 471022 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明（8 ) 中第2安裝構件及其周邊之斷面圖。第9圖顯示本發明實施 形態1中’熱機測試板單元之更屬於其他變形例中重要部分 之斷面圖◦第1 0圖顯示本發明實施形態1中，熱機測試板單 元之更屬於其他變形例中重要部分之斷面圖。 如同第1圖所示’本實施形態之熱機測試板單元1 〇係由 熱機測試板11 ’與沿著此測試板11之外周被固定之構架所 構成。 熱機測試板11係被使用於熱機測試裝置，利如用形成 有銅之配線層之玻璃環氧樹脂之積層板所構成。但是，在 本發明中關於測試板並不限定於熱機測試板，而適用於具 有預定功能之各程測試板。另外，熱機測試板11也可以由 玻璃環氧樹脂以外之素材來構成，並且配線層也可以用銅 以外之素材來構成。 在熱機測試板11之一邊端部，設置有爲了使熱機測試 裝置側之邊緣連接器（圖上未顯示），與熱機測試板1 1作 電氣性連接之邊緣端子1 3，藉著插孔將搭載半導體積體電 路裝置14之熱機測熱板11安裝於熱機測試裝置上，而藉由 邊緣端子1 3與邊緣連接之嵌合，從熱機測試裝置，將對半 導體積體電路裝置1 4預定印加預定程度之電壓。而且，對 於半導體積體電路裝置1 4在經過預定時間之加熱下，因連 續進行如此之電氣應之印加，能去除害怕引起初期故障之 製品。 構架1 2係例如由鋁製之4支支撐部1 5所形成之四邊形狀 ，固定於熱機測試板11外同來補強如前述之熱機測試板11 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -11 - ----I----I! ^----! I 訂--------..線 i (請先閱讀背面之注意事項再填寫本頁) 471022 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明（9 ) 。另外，在邊緣端子13之反對側端部的位置設置有把手16 ，使得可以得到便利之使用性。 但是，構架12並不限定爲鋁製，也可以用其他各種金 屬，甚至塑膠等其他各種素材來形成。另外，也可以不設 置把手1 6。 在各支撐部15之略中央位置，.設置有爲了形成將構架 12固定於沿著熱機測試板1 1之外周之固定部之第1安裝構件 17。此第1安裝構件17，例如爲螺絲在第1圖中係（個別地 被設置）在左右位置之支撐部15中爲在略中央之2地方，上 下位置之支撐部1 5爲在略中央之1個地方。 但是，固定構架12與熱機測試板11之第1安裝構件17嚴 密地說並沒有必要設置在支撐部1 5之中央，只要設置於支 撐部1 5接近中央之位置上就是夠了。另外，如圖所示雖然 第1安裝構件17能夠設置在支撐部15之1個地方或者2個地方 ，也可以設置在3個以上之位置。並且，第1安裝構件17也 沒有必要要有螺絲，例如能用鉚釘等將構架1 2與熱機測試 板11固定等種種之締結用具。 在如此第1安裝構件17與支撐部15端部之間的位置，設 置有第2安裝構件18。 第2安裝構件18也同樣爲螺絲，如同第2圖及第3圖之詳 細顯示，，對於形成在熱機測試板1 1之締結孔19具有間隙（ 例如0.3-0.5臟程度），且貫通此締結孔19固定於支撐部15 上。 第2安裝構件1 8係突出於熱機測試板1 1，在此突出部形 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -12- -------------- 裝--------訂--------鼠 (請先閱讀背面之注咅？事項再填寫本頁) 471022 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明（10) 成有阻止因容許向支撐部1 5之長方向持續滑動而使得熱機 測試板1 1上得之凸線20。因此，第2安裝構件1 8形成有滑動 抑制部，並不是將構架1 2及熱機測試板1 1兩者固定成不能 動之狀態。 在此，於本實施形態中凸線20係位於插入本體螺絲頭 部與熱機測試板11之締結孔19之間，雖然有比締結孔19更 大直徑之墊片，但是只要具有比締結孔1 9更大直徑之螺絲 頭部等，能防止熱機測試板1 1脫離之構件即可。另外，爲 了容許向支撐部1 5之長方向移動，在螺絲本體將插入有將 凸緣20與支撐部15保持有預定間隔之空間墊片25，藉此凸 緣2 0與熱機測試板1 1之間形成有若干之隔離槽（例如〇. 〇 5〜 0.25imn程度）。但是，第2安裝構件1 8也不一定有爲螺絲 之必要’例如也可使用鉚釘或有段差螺絲等種種力締結具 〇 將如此之熱機測試板單元1 〇裝設於熱機測試裝置並放 置於加熱之情況下’比較由玻璃環氧樹脂所形成之熱機測 s式板11 ’因爲銀製之構架11之線膨脹係數大，所以支撐部 1 5將向其長方向延伸。 在此’如同前述第2安裝構件1 8係容許向支撐部1 5之長 方向移動般固定於支撐部15，另外對於形成在熱機測試板 1 1之締結孔1 9有間隙存在。 因此’形成滑動抑制部之第2安裝構件丨8，如第4圖所 示隨著延伸之支撐部15移動締結孔19之間隙。並且，因爲 形成固疋部之第1安裝構件1 7係設置在支撐部1 5之略中央的 (請先閱讀背面之注意事項再填寫本頁) ΐ ^ I------訂---------線 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -13- 471022 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明（11) 位置，支邰1 5將均等均向2個長方向延伸，因爲單方向之 延伸量變成爲支撐部11全體延伸量之一半，不會抵觸到締 結孔1 9，所以不會使熱機測試板變形。 因此’如第5圖（a )所示，藉由構架1 2之第1安裝構件 1 7 ’沿著熱機測試板之外周被固定的狀態，裝置於熱機測 試裝置且被加熱之支撐部1 5向長方向延伸時，如第5圖（b )所示，構架1 2之4個角落將向熱機測試板11之外方擠出一 般產生熱變形。也就是，熱機測試板1 1之熱變形係集中在 此熱機測試板11之四個角落。 但是，因爲第2安裝構件1 8係使熱機測試板1 1不變形， 因此構架1 2能獨立於熱機測試板11而產生熱變形，可以.抑 制相互固定之不同線膨脹係數之熱機測試板1 1與框體之構 架12因加熱所產生之彎曲情形。 但是，於以上之說明，雖然締結孔1 9係圖形地被形成 (參照第2圖），也可以形成例如第6圖所不之長圖或第7圖 所示之缺口形甚至爲多角形、橢圓形等種種形狀。 另外，如第8圖所示’在凸緣2 0與熱機測試板1 1之間’ 也可以安裝壓縮線圈彈簧2 1。使用如此之壓縮線圈彈簧2 1 ，就可不用爲了容許向支撐部15之長方向移動之空間墊片 25 ° 甚至，取代前述第2安裝構件1 8，如第9圖所示’也可 以在支撐部15形成，因挾持容許向支撐部15之長方向持續 移動之熱機測試板11的外緣部而形成之滑動抑制部之溝部 22 ° (請先閲讀背面之注意事項再填寫本頁) 裝-----,---訂---------線 本紙張尺度適用中國國家標準（CNS)A4規格（210 x 297公釐） -14 - 471022 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明（12) 在此’於第9圖中，雖然溝部22係與支撐部15.—體地被 形成’但是如第1〇圖所示，也可以藉由在形成有段差之支 撐部1 5安裝其他零件來形成溝部22。 (實施形態2 ) 第Π圖顯示本發明實施形態2中之熱機測試板單元之平 面圖。第12圖顯示第11圖之熱機測試板單元於不產生熱變 形狀態時，角落部之周邊的平面圖。第1 3圖顯示第11圖之 熱機測試板單元於已產生熱變形狀態時，角落部之周邊的 平面圖。 在本實施形態中，設置有於構架12之角落，把持熱機 測試板11之角落而支持此熱機測試板Π之同時，可以向外 側方向變位之部分23。但是，在本實施形態中，因爲構架 12之線膨脹係數要較熱機測試板11要來得大，雖然部分23 係被設置於構架12側，但是在熱機測試板1 1之熱膨脹係數 較大之場合，部分23將設置在熱機測試板1 1側。 如此之熱機測試板10放置於加熱情況下，構成構架之 支撐部15將向其長方向延伸。 此時，如同上述般，因爲設置於構架12之角落把持熱 機測試板11之角落之部分23變成可以向外側方向變位，因 此從第12圖所示熱變位前之位置開始，如第13圖所示，如 同離開熱機測試板丨1般產生變位。 因此，熱機測試板11之熱變形將集中於熱機測試板11 之四個角落，所以可以抑制互相固定之不同線膨脹係數之 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） _ 15 - - ------------ 裝-----———訂---------線 . (請先閱讀背面之注意事項再填寫本頁) 471022 A7 B7 五、發明說明（13) 熱機測試板11與框體之構架12因加熱所產生之彎曲。 (實施形態3 ) ^ 第14圖顯示本發明實施形態3中之熱機測試板單元之平 面圖。第1 5圖顯不第1 4圖之熱機測試板單元於不產生熱變 形狀態時，角落部之周邊的平面圖。第16圖顯示第14圖之 熱機測試板單元於已產生熱變形狀態時，角落部之周邊的 平面圖。 在本實施形態中，於熱機測試板11之角落部設置將框 體之構架1 2的角落從內側擠壓使它如同打開般來支持此構 架1 2之支持腳24。但是，在本實施形態中，因爲熱機測試 板11之線膨脹係數要較構架12要小，所以雖然支持腳24係 設置於熱機測試板11側，但是當構架12之線膨脹係數較小 時，將把支持腳24設置在構架12側。而且，當支持腳24設 置在構架1 2側時，在熱機測試板11的外周將形成框，而這 個框如同以支持腳24支持。 如此熱機測試板單元10被放置於加熱之情況下，當由 構架12所構成之支撐部15向其長方向延伸時，從第15圖所 示，熱變形前之位置開始如第16圖所示，構架12將如從支 持腳24分離般變寬。 因此，熱機測試板11之熱變形將變成集中於熱機測試 板11之四個角落，而可以抑制互相固定之不同線膨脹係數 之熱機測試板11與框體之構架12因加熱所產生之彎曲。 由此上之說明可以明瞭，根攄本發明可得到以下效果 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐〉 (請先閱讀背面之注咅？事項再填寫本頁) 裝-----I--訂---------線 經濟部智慧財產局員工消費合作社印製 -16- 471022 A7 B7 五、發明說明（14) 〇 第1因爲測試板之熱變形係集中在該測試板之四個角落 ,變成可以抑制互相固定之不同線膨脹係數之測試板與框 體之構架因加熱而產生之彎曲。 第2藉此作爲測試板而適用於熱機測試板時，因爲在加 熱之情況下，也不會造成熱機測試板之彎曲，所以邊緣端 子與邊緣連接器將能安定地嵌合，使半導體積體電路裝置 之檢測能夠確實地被進行。 (請先閱讀背面之注意事項再填寫本頁) 裝—— 訂---------線 經濟部智慧財產局員工消費合作社印製 -17- 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐〉Packing --- I I --- Order ---------- The paper size of the paper is applicable to China National Standard (CNS) A4 (210 X 297 mm) -8- 4-1022 A7 ~ ^ ^ ____B7__ 5. Description of the invention (6) Figure 12 is a plan view showing the periphery of the corner of the thermomechanical test board unit shown in Figure 11 when it does not cause thermal deformation. Fig. 13 is a plan view showing the periphery of the corner portion of the thermomechanical test panel unit shown in Fig. 11 when it has been thermally deformed. Fig. 14 is a plan view showing a thermomechanical test panel unit in Embodiment 3 of the present invention. Fig. 15 is a plan view showing the periphery of the corner portion of the thermomechanical test panel unit of Fig. 14 when no thermal deformation occurs. Fig. 16 is a plan view showing the periphery of the corner portion of the thermomechanical test panel unit of Fig. 14 when a thermal deformation state has occurred. (Please read the precautions on the back before filling out this page.) The comparison table of the main components printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 10 Thermal machine test board unit 11 Thermal machine test board 13; • Self-edge terminals 14 Semiconductor integrated circuit device 15 Support Part 16 Handle 17 First mounting member 18 Second mounting member 19 Ending hole (connection hole) 20 Flange 21 Compression coil spring yellow 25 Space gasket This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) ) -9- 471022 A7 _ B7 V. Description of the invention (7) 22 Ditch 23 Part 12 Frame 24 Supporting foot [Explanation of appropriate implementation of Joan form] The following describes the embodiment of the present invention with reference to the drawings. Here, the same symbols are attached to the same components in the attached drawings, and repeated descriptions are omitted. However, the embodiments of the invention are particularly useful for implementing the invention, and the invention is not limited to the embodiments. (Embodiment 1) FIG. 1 shows a plan view of a thermomechanical test board unit in Embodiment 1 of the present invention, and FIG. 2 shows a plan view of a second mounting member and its surroundings in the thermomechanical test board unit of FIG. 1, and FIG. 3 Figure 2 shows the sectional view of the second mounting member and its surroundings when the thermomechanical test board unit of Fig. 1 is not thermally deformed. Figure 4 shows the second diagram of the thermomechanical test board unit of Fig. 1 when it is thermally deformed. A cross-sectional view of the mounting member and its surroundings. Fig. 5 shows a comparative explanatory diagram of the thermomechanical test board unit of Fig. 1 in a state where no thermal deformation occurs and the thermomechanical test board unit of Fig. 1 in a state where thermal deformation occurs. Fig. 6 is a plan view showing a second mounting member and its surroundings in a modified example of the thermomechanical test plate unit according to the first embodiment of the present invention. Fig. 7 is a plan view of the second mounting member and its surroundings in another modification of the thermomechanical test board unit according to the first embodiment of the present invention. Figure 8 shows other variants of the thermal test board unit in the embodiment of the present invention. The paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm). Please read the precautions on the back before filling out this page. ) Pack --------- Order --------- Printed by the Consumers 'Cooperatives of the Intellectual Property Bureau of the Ministry of Economy-10-471022 Printed by the Consumers' Cooperatives of the Intellectual Property Bureau of the Ministry of Economy A7 B7 V. A sectional view of the second mounting member and its periphery in the description of the invention (8). Fig. 9 shows a cross-sectional view of the 'heat engine test board unit which belongs to other modifications in the first embodiment of the present invention. Fig. 10 shows the heat engine test board unit which belongs to other modifications in the first embodiment of the present invention. A sectional view of the important part of the example. As shown in FIG. 1, 'the heat engine test board unit 10 of this embodiment is composed of a heat engine test board 11' and a frame fixed along the outer periphery of this test board 11. The thermo-mechanical test board 11 is used in a thermo-mechanical test device, such as a glass epoxy resin laminated board formed with a copper wiring layer. However, in the present invention, the test board is not limited to the thermal engine test board, but is applicable to each test board having a predetermined function. The thermomechanical test board 11 may be made of a material other than glass epoxy, and the wiring layer may be made of a material other than copper. An edge connector (not shown) on the side of one side of the thermomechanical test board 11 is provided for the thermomechanical test device side edge connector (not shown in the figure). The thermomechanical heat measuring plate 11 equipped with the semiconductor integrated circuit device 14 is mounted on the thermomechanical test device, and the edge terminals 13 and the edge are fitted. From the thermomechanical test device, the semiconductor integrated circuit device 14 is scheduled to be printed. A predetermined degree of voltage. In addition, the semiconductor integrated circuit device 14 is continuously heated in such a manner under a predetermined period of time, so that it is possible to remove a product that is likely to cause an initial failure by continuously performing such electrical application. The frame 1 2 is a four-sided shape formed by, for example, four support portions 15 made of aluminum, and fixed on the outside of the heat engine test plate 11 to reinforce the heat engine test plate 11 as described above. This paper size applies to the Chinese National Standard (CNS) A4 specification. (210 X 297 mm) -11----- I ---- I! ^ ----! I order -------- .. line i (Please read the precautions on the back before (Fill in this page) 471022 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Invention Description (9). In addition, a handle 16 is provided at a position of the opposite side end portion of the edge terminal 13, so that convenient usability can be obtained. However, the frame 12 is not limited to aluminum, and may be formed of various other metals and even other materials such as plastic. Alternatively, the handle 16 may not be provided. A first mounting member 17 is provided at a position near the center of each support portion 15 to form a fixing portion that fixes the frame 12 to the outer periphery of the thermomechanical test plate 11. The first mounting member 17 is, for example, the screws in the first figure (individually provided) in the left and right positions of the support portion 15 at the slightly centered position, and the up and down position of the support portion 15 at the slightly centered position. 1 place. However, the fixed frame 12 and the first mounting member 17 of the thermomechanical test board 11 are not strictly required to be provided at the center of the support portion 15 and may be provided only at a position near the center of the support portion 15. In addition, although the first mounting member 17 can be installed at one or two places of the support portion 15 as shown in the figure, it can also be provided at three or more places. In addition, the first mounting member 17 does not need to be provided with screws. For example, various attachment tools such as fixing the frame 12 to the thermomechanical test plate 11 with rivets or the like can be used. The second mounting member 18 is provided between the first mounting member 17 and the end of the support portion 15 in this manner. The second mounting member 18 is also a screw. As shown in detail in Figures 2 and 3, there is a gap (for example, 0.3-0.5 dirty) in the connection hole 19 formed in the thermomechanical test board 11 and penetrates the connection. The hole 19 is fixed to the support portion 15. The second mounting member 18 is projected from the thermomechanical test board 11. The size of the projection is adapted to the Chinese National Standard (CNS) A4 (210 X 297 mm) -12- -------- ------ Install -------- Order -------- Rat (please read the note on the back? Matters before filling out this page) 471022 A7 B7 Staff Consumption of Intellectual Property Bureau, Ministry of Economic Affairs Printed by the cooperative V. Description of the invention (10) There is a convex line 20 for preventing the thermomechanical test plate 11 from being caused to continue to slide in the long direction of the support part 15. Therefore, the second mounting member 18 is formed with a slip suppressing portion, and it is not necessary to fix both the frame 12 and the thermomechanical test board 1 1 in an immovable state. Here, in this embodiment, the convex wire 20 is located between the screw head of the insertion body and the connecting hole 19 of the thermomechanical test plate 11. Although there is a gasket with a larger diameter than the connecting hole 19, as long as it has a larger diameter than the connecting hole 1 9 Screw heads with larger diameters can prevent the heat engine test board 1 1 from detaching. In addition, in order to allow movement in the long direction of the support portion 15, a space washer 25 that maintains the flange 20 and the support portion 15 at a predetermined interval is inserted into the screw body, whereby the flange 20 and the thermomechanical test plate 1 1 Several isolation grooves are formed between them (for example, about 0.05 to 0.25 imn). However, the second mounting member 18 is not necessarily necessary for the screw. For example, various types of forces such as rivets or stepped screws can be used. ○ Such a thermomechanical test board unit 10 is installed in a thermomechanical test device and placed in In the case of heating, 'compared to the thermomechanical s-type plate 11 formed of glass epoxy resin', because the linear expansion coefficient of the silver frame 11 is large, the support portion 15 will extend in its longitudinal direction. Here, 'is fixed to the support portion 15 as the second mounting member 18 is allowed to move in the longitudinal direction of the support portion 15 and there is a gap for the connection hole 19 formed in the thermomechanical test plate 11. Therefore, the second mounting member 8 forming the slip suppressing portion moves the gap of the connecting hole 19 with the extended support portion 15 as shown in Fig. 4. And, because the first mounting member 17 forming the fixing part is located at the slightly center of the supporting part 15 (please read the precautions on the back before filling this page) ΐ ^ I ------ order-- ------- The paper size of the paper is applicable to the Chinese National Standard (CNS) A4 (210 X 297 mm) -13- 471022 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention (11) Position, the support 15 will extend equally in the two long directions, because the amount of extension in one direction becomes half of the total extension of the support portion 11 and will not abut the connection hole 19, so the thermomechanical test plate will not be deformed. Therefore, as shown in FIG. 5 (a), the first mounting member 1 7 of the frame 12 is fixed along the outer periphery of the thermomechanical test plate, and is installed in the thermomechanical test device and the heated support portion 1 5 When extending in the long direction, as shown in FIG. 5 (b), the four corners of the frame 12 will be extruded outside the thermomechanical test plate 11 and generally cause thermal deformation. That is, the thermal deformation system of the thermomechanical test board 11 is concentrated at the four corners of the thermomechanical test board 11. However, since the second mounting member 18 prevents the thermomechanical test board 11 from being deformed, the frame 12 can be thermally deformed independently of the thermomechanical test board 11 and can suppress the thermomechanical test board 1 with different linear expansion coefficients that are fixed to each other. 1 and the frame of the frame 12 bending caused by heating. However, as described above, although the connection holes 19 are formed in a pattern (refer to FIG. 2), for example, the long shape shown in FIG. 6 or the notch shape shown in FIG. 7 or even a polygonal shape may be formed. Various shapes such as oval. In addition, as shown in Fig. 8, "between the flange 20 and the thermomechanical test board 11", a compression coil spring 21 may be mounted. By using such a compression coil spring 2 1, it is not necessary to use a space washer 25 ° in order to allow movement in the long direction of the support portion 15. Instead of the second mounting member 18 described above, as shown in FIG. The part 15 is formed by holding the outer edge of the thermomechanical test plate 11 that allows continuous movement in the long direction of the support part 15. The groove part 22 formed by the slip suppression part 22 (Please read the precautions on the back before filling this page). ----, --- Order --------- The paper size of the paper is applicable to the Chinese National Standard (CNS) A4 specification (210 x 297 mm) -14-471022 Employee Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs Print A7 B7 V. Description of the invention (12) Here, in the ninth figure, although the groove portion 22 and the supporting portion 15. are formed integrally, but as shown in FIG. 10, it can also be formed by The stepped support portion 15 is fitted with other parts to form the groove portion 22. (Embodiment 2) Figure Π shows a plan view of a heat engine test board unit in Embodiment 2 of the present invention. Fig. 12 shows a plan view of the periphery of the corner portion of the thermomechanical test panel unit of Fig. 11 when no thermal deformation occurs. Fig. 13 shows a plan view of the periphery of the corner portion of the thermomechanical test panel unit of Fig. 11 when it has been thermally deformed. In this embodiment, a portion 23 is provided at a corner of the frame 12 and holding the corner of the heat engine test board 11 to support the heat engine test board Π, and can be displaced outward. However, in this embodiment, because the linear expansion coefficient of the frame 12 is larger than that of the thermomechanical test plate 11, although the portion 23 is provided on the frame 12 side, when the thermal expansion coefficient of the thermomechanical test plate 11 is large Section 23 will be placed on the heat engine test board 11 side. When the thermomechanical test plate 10 is placed under heating, the supporting portion 15 constituting the frame will extend in its longitudinal direction. At this time, as described above, because the portion 23 provided at the corner of the frame 12 holding the corner of the heat engine test plate 11 can be displaced outward, it starts from the position before the thermal displacement shown in FIG. 12, as shown in FIG. As shown in the figure, the displacement occurs as if leaving the thermal engine test board. Therefore, the thermal deformation of the thermomechanical test board 11 will be concentrated in the four corners of the thermomechanical test board 11, so the paper size that can restrain the different linear expansion coefficients fixed to each other is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) ) _ 15-------------- Install --------- Order --------- line. (Please read the precautions on the back before filling this page ) 471022 A7 B7 V. Description of the invention (13) Bending caused by heating machine test plate 11 and frame 12 of the frame due to heating. (Embodiment 3) ^ Figure 14 shows a plan view of a thermomechanical test panel unit in Embodiment 3 of the present invention. Figure 15 shows the plan view of the corner of the heat engine test board unit shown in Figure 14 when no thermal deformation occurs. Fig. 16 shows a plan view of the periphery of the corner portion of the thermomechanical test panel unit of Fig. 14 when a thermal deformation state has occurred. In this embodiment, the corners of the heat engine test board 11 are provided with support legs 24 that press the corners of the frame 12 of the frame from the inside to support the frame 12 as if it were opened. However, in this embodiment, since the linear expansion coefficient of the thermomechanical test plate 11 is smaller than that of the frame 12, although the support leg 24 is provided on the thermomechanical test plate 11 side, when the linear expansion coefficient of the frame 12 is small, The support leg 24 will be provided on the frame 12 side. Furthermore, when the support leg 24 is provided on the frame 12 side, a frame will be formed on the periphery of the heat engine test board 11, and this frame is supported by the support leg 24. In the case where the thermomechanical test board unit 10 is placed under heating in this way, when the support portion 15 constituted by the frame 12 extends in the longitudinal direction, the position before thermal deformation is shown in FIG. 16 as shown in FIG. 15 The frame 12 will become wider as it is separated from the support leg 24. Therefore, the thermal deformation of the thermo-mechanical test plate 11 will become concentrated on the four corners of the thermo-mechanical test plate 11, and the bending of the thermo-mechanical test plate 11 and the frame 12 of the frame which are fixed to each other with different linear expansion coefficients can be suppressed. From the above description, it is clear that the following effects can be obtained based on the present invention. The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) (Please read the note on the back? Matters before filling out this page) Packing ----- I--Order --------- Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs-16- 471022 A7 B7 V. Description of the invention (14) 〇 1st because of the test board The thermal deformation is concentrated in the four corners of the test board, and it can suppress the bending of the test board and the frame of the frame that are fixed to each other with different linear expansion coefficients due to heating. The second is used as a test board for thermal machine testing. When the board is heated, it will not cause bending of the thermomechanical test board, so the edge terminal and the edge connector can be fitted securely, so that the inspection of the semiconductor integrated circuit device can be performed reliably. (Please (Please read the notes on the back before filling this page) Packing-Order ---------- Printed by the Consumers' Cooperatives of the Intellectual Property Bureau of the Ministry of Economics-17- This paper size applies to China National Standard (CNS) A4 (210 X 297 mm>