[go: up one dir, main page]

TW383908U - Structure used for increasing heat-dissipation of micro-electronic apparatus - Google Patents

Structure used for increasing heat-dissipation of micro-electronic apparatus

Info

Publication number
TW383908U
TW383908U TW87215690U TW87215690U TW383908U TW 383908 U TW383908 U TW 383908U TW 87215690 U TW87215690 U TW 87215690U TW 87215690 U TW87215690 U TW 87215690U TW 383908 U TW383908 U TW 383908U
Authority
TW
Taiwan
Prior art keywords
dissipation
micro
electronic apparatus
structure used
increasing heat
Prior art date
Application number
TW87215690U
Other languages
Chinese (zh)
Inventor
Ji-Ming Li
Guo-Ming Chen
Original Assignee
Caesar Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Caesar Technology Inc filed Critical Caesar Technology Inc
Priority to TW87215690U priority Critical patent/TW383908U/en
Publication of TW383908U publication Critical patent/TW383908U/en

Links

TW87215690U 1998-09-22 1998-09-22 Structure used for increasing heat-dissipation of micro-electronic apparatus TW383908U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW87215690U TW383908U (en) 1998-09-22 1998-09-22 Structure used for increasing heat-dissipation of micro-electronic apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW87215690U TW383908U (en) 1998-09-22 1998-09-22 Structure used for increasing heat-dissipation of micro-electronic apparatus

Publications (1)

Publication Number Publication Date
TW383908U true TW383908U (en) 2000-03-01

Family

ID=21636322

Family Applications (1)

Application Number Title Priority Date Filing Date
TW87215690U TW383908U (en) 1998-09-22 1998-09-22 Structure used for increasing heat-dissipation of micro-electronic apparatus

Country Status (1)

Country Link
TW (1) TW383908U (en)

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6825108B2 (en) 2002-02-01 2004-11-30 Broadcom Corporation Ball grid array package fabrication with IC die support structures
US6861750B2 (en) 2002-02-01 2005-03-01 Broadcom Corporation Ball grid array package with multiple interposers
US6882042B2 (en) 2000-12-01 2005-04-19 Broadcom Corporation Thermally and electrically enhanced ball grid array packaging
US6887741B2 (en) 2002-03-21 2005-05-03 Broadcom Corporation Method for making an enhanced die-up ball grid array package with two substrates
US6906414B2 (en) 2000-12-22 2005-06-14 Broadcom Corporation Ball grid array package with patterned stiffener layer
US6989593B2 (en) 2000-12-22 2006-01-24 Broadcom Corporation Die-up ball grid array package with patterned stiffener opening
US7132744B2 (en) 2000-12-22 2006-11-07 Broadcom Corporation Enhanced die-up ball grid array packages and method for making the same
US7161239B2 (en) 2000-12-22 2007-01-09 Broadcom Corporation Ball grid array package enhanced with a thermal and electrical connector
US7196415B2 (en) 2002-03-22 2007-03-27 Broadcom Corporation Low voltage drop and high thermal performance ball grid array package
US7245500B2 (en) 2002-02-01 2007-07-17 Broadcom Corporation Ball grid array package with stepped stiffener layer
US7259457B2 (en) 2001-05-07 2007-08-21 Broadcom Corporation Die-up ball grid array package including a substrate capable of mounting an integrated circuit die and method for making the same
US7402906B2 (en) 2001-02-15 2008-07-22 Broadcom Corporation Enhanced die-down ball grid array and method for making the same
US7405145B2 (en) 2001-12-18 2008-07-29 Broadcom Corporation Ball grid array package substrates with a modified central opening and method for making the same
US7411281B2 (en) 2004-06-21 2008-08-12 Broadcom Corporation Integrated circuit device package having both wire bond and flip-chip interconnections and method of making the same
US7432586B2 (en) 2004-06-21 2008-10-07 Broadcom Corporation Apparatus and method for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages
US7482686B2 (en) 2004-06-21 2009-01-27 Braodcom Corporation Multipiece apparatus for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages and method of making the same
US7550845B2 (en) 2002-02-01 2009-06-23 Broadcom Corporation Ball grid array package with separated stiffener layer
US7786591B2 (en) 2004-09-29 2010-08-31 Broadcom Corporation Die down ball grid array package
US8183680B2 (en) 2006-05-16 2012-05-22 Broadcom Corporation No-lead IC packages having integrated heat spreader for electromagnetic interference (EMI) shielding and thermal enhancement

Cited By (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7629681B2 (en) 2000-12-01 2009-12-08 Broadcom Corporation Ball grid array package with patterned stiffener surface and method of assembling the same
US8686558B2 (en) 2000-12-01 2014-04-01 Broadcom Corporation Thermally and electrically enhanced ball grid array package
US6882042B2 (en) 2000-12-01 2005-04-19 Broadcom Corporation Thermally and electrically enhanced ball grid array packaging
US8039949B2 (en) 2000-12-01 2011-10-18 Broadcom Corporation Ball grid array package having one or more stiffeners
US7579217B2 (en) 2000-12-22 2009-08-25 Broadcom Corporation Methods of making a die-up ball grid array package with printed circuit board attachable heat spreader
US6906414B2 (en) 2000-12-22 2005-06-14 Broadcom Corporation Ball grid array package with patterned stiffener layer
US7005737B2 (en) 2000-12-22 2006-02-28 Broadcom Corporation Die-up ball grid array package with enhanced stiffener
US7038312B2 (en) 2000-12-22 2006-05-02 Broadcom Corporation Die-up ball grid array package with attached stiffener ring
US8310067B2 (en) 2000-12-22 2012-11-13 Broadcom Corporation Ball grid array package enhanced with a thermal and electrical connector
US7102225B2 (en) 2000-12-22 2006-09-05 Broadcom Corporation Die-up ball grid array package with printed circuit board attachable heat spreader
US7132744B2 (en) 2000-12-22 2006-11-07 Broadcom Corporation Enhanced die-up ball grid array packages and method for making the same
US7161239B2 (en) 2000-12-22 2007-01-09 Broadcom Corporation Ball grid array package enhanced with a thermal and electrical connector
US7893546B2 (en) 2000-12-22 2011-02-22 Broadcom Corporation Ball grid array package enhanced with a thermal and electrical connector
US7202559B2 (en) 2000-12-22 2007-04-10 Broadcom Corporation Method of assembling a ball grid array package with patterned stiffener layer
US7227256B2 (en) 2000-12-22 2007-06-05 Broadcom Corporation Die-up ball grid array package with printed circuit board attachable heat spreader
US7859101B2 (en) 2000-12-22 2010-12-28 Broadcom Corporation Die-up ball grid array package with die-attached heat spreader
US6989593B2 (en) 2000-12-22 2006-01-24 Broadcom Corporation Die-up ball grid array package with patterned stiffener opening
US7462933B2 (en) 2000-12-22 2008-12-09 Broadcom Corporation Ball grid array package enhanced with a thermal and electrical connector
US7402906B2 (en) 2001-02-15 2008-07-22 Broadcom Corporation Enhanced die-down ball grid array and method for making the same
US7259448B2 (en) 2001-05-07 2007-08-21 Broadcom Corporation Die-up ball grid array package with a heat spreader and method for making the same
US7259457B2 (en) 2001-05-07 2007-08-21 Broadcom Corporation Die-up ball grid array package including a substrate capable of mounting an integrated circuit die and method for making the same
US7405145B2 (en) 2001-12-18 2008-07-29 Broadcom Corporation Ball grid array package substrates with a modified central opening and method for making the same
US6861750B2 (en) 2002-02-01 2005-03-01 Broadcom Corporation Ball grid array package with multiple interposers
US7241645B2 (en) 2002-02-01 2007-07-10 Broadcom Corporation Method for assembling a ball grid array package with multiple interposers
US7078806B2 (en) 2002-02-01 2006-07-18 Broadcom Corporation IC die support structures for ball grid array package fabrication
US7550845B2 (en) 2002-02-01 2009-06-23 Broadcom Corporation Ball grid array package with separated stiffener layer
US6825108B2 (en) 2002-02-01 2004-11-30 Broadcom Corporation Ball grid array package fabrication with IC die support structures
US7245500B2 (en) 2002-02-01 2007-07-17 Broadcom Corporation Ball grid array package with stepped stiffener layer
US7312108B2 (en) 2002-03-21 2007-12-25 Broadcom Corporation Method for assembling a ball grid array package with two substrates
US6887741B2 (en) 2002-03-21 2005-05-03 Broadcom Corporation Method for making an enhanced die-up ball grid array package with two substrates
US7196415B2 (en) 2002-03-22 2007-03-27 Broadcom Corporation Low voltage drop and high thermal performance ball grid array package
US7432586B2 (en) 2004-06-21 2008-10-07 Broadcom Corporation Apparatus and method for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages
US7791189B2 (en) 2004-06-21 2010-09-07 Broadcom Corporation Multipiece apparatus for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages and method of making the same
US7595227B2 (en) 2004-06-21 2009-09-29 Broadcom Corporation Integrated circuit device package having both wire bond and flip-chip interconnections and method of making the same
US7482686B2 (en) 2004-06-21 2009-01-27 Braodcom Corporation Multipiece apparatus for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages and method of making the same
US7411281B2 (en) 2004-06-21 2008-08-12 Broadcom Corporation Integrated circuit device package having both wire bond and flip-chip interconnections and method of making the same
US7786591B2 (en) 2004-09-29 2010-08-31 Broadcom Corporation Die down ball grid array package
US8021927B2 (en) 2004-09-29 2011-09-20 Broadcom Corporation Die down ball grid array packages and method for making same
US8183680B2 (en) 2006-05-16 2012-05-22 Broadcom Corporation No-lead IC packages having integrated heat spreader for electromagnetic interference (EMI) shielding and thermal enhancement

Similar Documents

Publication Publication Date Title
TW383908U (en) Structure used for increasing heat-dissipation of micro-electronic apparatus
GB2345382B (en) Layout method of semiconductor device
TW540987U (en) Heatsink apparatus
EP0901695A4 (en) CONNECTORS FOR MICROELECTRONIC ELEMENTS
TW474456U (en) Semiconductor apparatus
GB2344838B (en) Wellhead apparatus
SG75897A1 (en) Socket apparatus particularly adapted for bga type semiconductor devices
GB9715837D0 (en) Cooling apparatus
TW356712U (en) Testing apparatus of immune
GB2346341B (en) Vehicle-lamp-molding apparatus
PL348712A1 (en) Apparatus for and method of automatically mounting the connectors
SG98455A1 (en) Method and apparatus for the mounting of semiconductor chips
GB2312411B (en) Apparatus for the taking over of sweets
GB2336717B (en) Semiconductor device and method of making the same
TW435736U (en) Carrying apparatus of baseboard
TW387579U (en) Heat dissipation apparatus of chipsets
GB2340135B (en) Trousers-fly-sewing apparatus
GB9808237D0 (en) Mnufacture of field-effect semiconductor devices
SG102529A1 (en) Semiconductor device manufacturing apparatus
GB2341026B (en) Apparatus for the measurement of direction
GB9903559D0 (en) Apparatus
TW446221U (en) Electrical apparatus
GB9905502D0 (en) CXomputer interface apparatus
TW461696U (en) Fixing structure of heat dissipating apparatus
AU2539299A (en) Apparatus for the investigation of surface chemistry

Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MM4K Annulment or lapse of a utility model due to non-payment of fees