TW387579U - Heat dissipation apparatus of chipsets - Google Patents

Heat dissipation apparatus of chipsets

Info

Publication number: TW387579U
Authority: TW; Taiwan
Prior art keywords: chipsets; heat dissipation; dissipation apparatus; heat; dissipation
Prior art date: 1998-09-25

Application number

TW87215957U

Other languages

Chinese (zh)

Inventor

Mau-Chin Chen

Original Assignee

Aavid Taiwan Inc

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1998-09-25

Filing date

1998-09-25

Publication date

2000-04-11

1998-09-25 Application filed by Aavid Taiwan Inc filed Critical Aavid Taiwan Inc

1998-09-25 Priority to TW87215957U priority Critical patent/TW387579U/en

1998-11-30 Priority to JP1998009427U priority patent/JP3060218U/en

2000-04-11 Publication of TW387579U publication Critical patent/TW387579U/en

Links

TW87215957U 1998-09-25 1998-09-25 Heat dissipation apparatus of chipsets TW387579U (en)

Priority Applications (2)

Application Number	Priority Date	Filing Date	Title
TW87215957U TW387579U (en)	1998-09-25	1998-09-25	Heat dissipation apparatus of chipsets
JP1998009427U JP3060218U (en)	1998-09-25	1998-11-30	Heat dissipation device for chip module

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
TW87215957U TW387579U (en)	1998-09-25	1998-09-25	Heat dissipation apparatus of chipsets

Publications (1)

Publication Number	Publication Date
TW387579U true TW387579U (en)	2000-04-11

Family

ID=21636417

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW87215957U TW387579U (en)	1998-09-25	1998-09-25	Heat dissipation apparatus of chipsets

Country Status (2)

Country	Link
JP (1)	JP3060218U (en)
TW (1)	TW387579U (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP4680816B2 (en) *	2006-03-31	2011-05-11	三菱電機株式会社	Semiconductor device
JP5719566B2 (en) *	2010-11-04	2015-05-20	新光電気工業株式会社	IC package heat sink and IC package connection device having heat sink
KR101421919B1 (en) *	2014-04-01	2014-08-06	(주)코리아반도체조명	LED lighting fixture circuit board a fixture
JP5915721B1 (en) *	2014-11-25	2016-05-11	日本電気株式会社	Cooling system
JP6811551B2 (en) *	2016-05-27	2021-01-13	日産自動車株式会社	Manufacturing method and cooling structure of power converter
US11901261B2 (en) *	2019-02-22	2024-02-13	Illinois Tool Works Inc.	Reusable holding component for heatsink

1998
- 1998-09-25 TW TW87215957U patent/TW387579U/en not_active IP Right Cessation
- 1998-11-30 JP JP1998009427U patent/JP3060218U/en not_active Expired - Lifetime

Also Published As

Publication number	Publication date
JP3060218U (en)	1999-08-17

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Legal Events

Date	Code	Title	Description
2000-08-01	GD4K	Issue of patent certificate for granted utility model filed before june 30, 2004
2004-04-11	MM4K	Annulment or lapse of a utility model due to non-payment of fees