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TW351017B - Method of manufacturing of the structure forming DRAM capacitors - Google Patents

Method of manufacturing of the structure forming DRAM capacitors

Info

Publication number
TW351017B
TW351017B TW086119309A TW86119309A TW351017B TW 351017 B TW351017 B TW 351017B TW 086119309 A TW086119309 A TW 086119309A TW 86119309 A TW86119309 A TW 86119309A TW 351017 B TW351017 B TW 351017B
Authority
TW
Taiwan
Prior art keywords
conductor
layer
forming
gate
conductor layer
Prior art date
Application number
TW086119309A
Other languages
Chinese (zh)
Inventor
Jr-Shiang Jeng
Shan-Jie Jian
Original Assignee
United Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by United Microelectronics Corp filed Critical United Microelectronics Corp
Priority to TW086119309A priority Critical patent/TW351017B/en
Application granted granted Critical
Publication of TW351017B publication Critical patent/TW351017B/en

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Abstract

A sort of method of manufacturing of the structure forming DRAM capacitors, including the following steps: provision of a transfer transistor having a gate and a source/drain zone and one conductor for isolation from the gate; settling a first conductor layer in the gate, onto said source/drain region and the conductor, in connection with the source/drain polarity and isolated from the gate and the conductor; settling an insulation layer on the first conductor layer for flattening for a flat insulation layer, in thickness to extend onto the first conductor layer on top of the gate; defining the flat insulation layer figure for forming an opening exposed onto the first conductor layer; forming a second conductor layer for stuffing the opening and coating onto the flat insulation layer; forming a screen to etch the second conductor layer, forming the second conductor figure with the edge on the flat insulation layer; removing the flat insulation layer from the second conductor figure edge; defining the first conductor layer figure; forming a dielectric layer for coating the exposed part in the first conductor layer and the second conductor layer; and forming an upper capacitor electrode.
TW086119309A 1997-12-19 1997-12-19 Method of manufacturing of the structure forming DRAM capacitors TW351017B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW086119309A TW351017B (en) 1997-12-19 1997-12-19 Method of manufacturing of the structure forming DRAM capacitors

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW086119309A TW351017B (en) 1997-12-19 1997-12-19 Method of manufacturing of the structure forming DRAM capacitors

Publications (1)

Publication Number Publication Date
TW351017B true TW351017B (en) 1999-01-21

Family

ID=57939972

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086119309A TW351017B (en) 1997-12-19 1997-12-19 Method of manufacturing of the structure forming DRAM capacitors

Country Status (1)

Country Link
TW (1) TW351017B (en)

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