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TW350968B - A coating device - Google Patents

A coating device

Info

Publication number
TW350968B
TW350968B TW084110033A TW84110033A TW350968B TW 350968 B TW350968 B TW 350968B TW 084110033 A TW084110033 A TW 084110033A TW 84110033 A TW84110033 A TW 84110033A TW 350968 B TW350968 B TW 350968B
Authority
TW
Taiwan
Prior art keywords
fluid
processing
processed object
gas
processed
Prior art date
Application number
TW084110033A
Other languages
English (en)
Inventor
Akihiro Fujimoto
Yasuhiro Sakamoto
Original Assignee
Tokyo Electron Kyushu Ltd
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Kyushu Ltd, Tokyo Electron Ltd filed Critical Tokyo Electron Kyushu Ltd
Application granted granted Critical
Publication of TW350968B publication Critical patent/TW350968B/zh

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/02Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
    • B05C11/08Spreading liquid or other fluent material by manipulating the work, e.g. tilting
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1039Recovery of excess liquid or other fluent material; Controlling means therefor

Landscapes

  • Coating Apparatus (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Details Or Accessories Of Spraying Plant Or Apparatus (AREA)
TW084110033A 1994-09-29 1995-09-26 A coating device TW350968B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP25915494A JP3122868B2 (ja) 1994-09-29 1994-09-29 塗布装置

Publications (1)

Publication Number Publication Date
TW350968B true TW350968B (en) 1999-01-21

Family

ID=17330097

Family Applications (1)

Application Number Title Priority Date Filing Date
TW084110033A TW350968B (en) 1994-09-29 1995-09-26 A coating device

Country Status (4)

Country Link
US (1) US5672205A (zh)
JP (1) JP3122868B2 (zh)
KR (1) KR100312037B1 (zh)
TW (1) TW350968B (zh)

Families Citing this family (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW317644B (zh) * 1996-01-26 1997-10-11 Tokyo Electron Co Ltd
US5769945A (en) 1996-06-21 1998-06-23 Micron Technology, Inc. Spin coating bowl exhaust system
US5985031A (en) 1996-06-21 1999-11-16 Micron Technology, Inc. Spin coating spindle and chuck assembly
JP3566475B2 (ja) * 1996-12-03 2004-09-15 東京エレクトロン株式会社 処理装置
TW419716B (en) * 1997-04-28 2001-01-21 Tokyo Electron Ltd Processing apparatus
JPH113851A (ja) * 1997-06-11 1999-01-06 Tokyo Electron Ltd 液処理装置及び液処理方法
US6197385B1 (en) * 1998-02-04 2001-03-06 Tokyo Electron Limited Film forming apparatus, substrate conveying apparatus, film forming method, and substrate conveying method
US6221787B1 (en) * 1998-04-20 2001-04-24 Tokyo Electron Limited Apparatus and method of forming resist film
NL1009281C2 (nl) * 1998-05-29 1999-11-30 Od & Me Bv Inrichting geschikt voor het aanbrengen van een laklaag op een schijfvormige registratiedrager alsmede een dergelijke werkwijze.
US6217936B1 (en) 1999-02-26 2001-04-17 Advanced Micro Devices Semiconductor fabrication extended particle collection cup
KR100589914B1 (ko) * 2000-01-29 2006-06-15 삼성전자주식회사 외부기기와의 동기를 위한 스피너 제어장치 및 그 제어방법
JP3587776B2 (ja) * 2000-10-10 2004-11-10 東京エレクトロン株式会社 塗布装置及び塗布方法
US6616762B2 (en) 2000-10-13 2003-09-09 Tokyo Electron Limited Treatment solution supply apparatus and treatment solution supply method
US6752544B2 (en) * 2002-03-28 2004-06-22 Dainippon Screen Mfg. Co., Ltd. Developing apparatus and developing method
US20050026455A1 (en) * 2003-05-30 2005-02-03 Satomi Hamada Substrate processing apparatus and substrate processing method
JP4305750B2 (ja) * 2003-10-14 2009-07-29 Okiセミコンダクタ株式会社 スピンコート法
JPWO2006038472A1 (ja) * 2004-10-06 2008-05-15 株式会社荏原製作所 基板処理装置及び基板処理方法
US7579044B2 (en) * 2004-11-08 2009-08-25 Brewer Science Inc. Process and device for coating the outer edge of a substrate during microelectronics manufacture
US7798764B2 (en) 2005-12-22 2010-09-21 Applied Materials, Inc. Substrate processing sequence in a cartesian robot cluster tool
US7699021B2 (en) 2004-12-22 2010-04-20 Sokudo Co., Ltd. Cluster tool substrate throughput optimization
US7819079B2 (en) 2004-12-22 2010-10-26 Applied Materials, Inc. Cartesian cluster tool configuration for lithography type processes
US7396412B2 (en) 2004-12-22 2008-07-08 Sokudo Co., Ltd. Coat/develop module with shared dispense
US7651306B2 (en) 2004-12-22 2010-01-26 Applied Materials, Inc. Cartesian robot cluster tool architecture
JP2008000676A (ja) * 2006-06-22 2008-01-10 Seiko Epson Corp スピンコート装置および反射防止層用組成物のコーティング方法
JP5006122B2 (ja) 2007-06-29 2012-08-22 株式会社Sokudo 基板処理装置
JP5133641B2 (ja) * 2007-09-27 2013-01-30 東京エレクトロン株式会社 塗布処理方法、塗布処理装置及びコンピュータ読み取り可能な記憶媒体
JP5128918B2 (ja) 2007-11-30 2013-01-23 株式会社Sokudo 基板処理装置
JP5179170B2 (ja) * 2007-12-28 2013-04-10 株式会社Sokudo 基板処理装置
JP5001828B2 (ja) 2007-12-28 2012-08-15 株式会社Sokudo 基板処理装置
JP5337180B2 (ja) * 2010-04-08 2013-11-06 東京エレクトロン株式会社 塗布処理方法、プログラム、コンピュータ記憶媒体及び塗布処理装置
JP5635452B2 (ja) * 2010-07-02 2014-12-03 東京エレクトロン株式会社 基板処理システム
JP5693439B2 (ja) * 2011-12-16 2015-04-01 東京エレクトロン株式会社 基板処理装置、基板処理方法および記憶媒体
US20140087073A1 (en) * 2012-09-24 2014-03-27 Igor Constantin Ivanov Equipment and method of manufacturing for liquid processing in a controlled atmospheric ambient
US9446467B2 (en) * 2013-03-14 2016-09-20 Taiwan Semiconductor Manufacturing Company, Ltd. Integrate rinse module in hybrid bonding platform
JP6237511B2 (ja) * 2014-07-11 2017-11-29 東京エレクトロン株式会社 薬液排出機構、液処理装置、薬液排出方法、記憶媒体
CN105944875B (zh) * 2016-06-21 2018-07-20 上海平耐实业有限公司 一种自动上漆装置及其上漆方法
JP7081979B2 (ja) * 2018-05-22 2022-06-07 株式会社Screen Spe テック 基板処理装置
CN109453957A (zh) * 2018-10-15 2019-03-12 苏州优达科精密机械有限公司 一种自动收料机

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4564280A (en) * 1982-10-28 1986-01-14 Fujitsu Limited Method and apparatus for developing resist film including a movable nozzle arm
US4788043A (en) * 1985-04-17 1988-11-29 Tokuyama Soda Kabushiki Kaisha Process for washing semiconductor substrate with organic solvent
JP2930307B2 (ja) * 1988-09-20 1999-08-03 東京エレクトロン株式会社 基板処理装置における液排出機構
JP2982439B2 (ja) * 1991-10-29 1999-11-22 東京エレクトロン株式会社 処理液塗布装置及び処理液塗布方法
US5211753A (en) * 1992-06-15 1993-05-18 Swain Danny C Spin coating apparatus with an independently spinning enclosure

Also Published As

Publication number Publication date
KR960010094A (ko) 1996-04-20
KR100312037B1 (ko) 2001-12-28
US5672205A (en) 1997-09-30
JPH0897134A (ja) 1996-04-12
JP3122868B2 (ja) 2001-01-09

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Legal Events

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