TW350968B - A coating device - Google Patents
A coating deviceInfo
- Publication number
- TW350968B TW350968B TW084110033A TW84110033A TW350968B TW 350968 B TW350968 B TW 350968B TW 084110033 A TW084110033 A TW 084110033A TW 84110033 A TW84110033 A TW 84110033A TW 350968 B TW350968 B TW 350968B
- Authority
- TW
- Taiwan
- Prior art keywords
- fluid
- processing
- processed object
- gas
- processed
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
- B05C11/08—Spreading liquid or other fluent material by manipulating the work, e.g. tilting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1039—Recovery of excess liquid or other fluent material; Controlling means therefor
Landscapes
- Coating Apparatus (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Details Or Accessories Of Spraying Plant Or Apparatus (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP25915494A JP3122868B2 (ja) | 1994-09-29 | 1994-09-29 | 塗布装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW350968B true TW350968B (en) | 1999-01-21 |
Family
ID=17330097
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW084110033A TW350968B (en) | 1994-09-29 | 1995-09-26 | A coating device |
Country Status (4)
Country | Link |
---|---|
US (1) | US5672205A (zh) |
JP (1) | JP3122868B2 (zh) |
KR (1) | KR100312037B1 (zh) |
TW (1) | TW350968B (zh) |
Families Citing this family (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW317644B (zh) * | 1996-01-26 | 1997-10-11 | Tokyo Electron Co Ltd | |
US5769945A (en) | 1996-06-21 | 1998-06-23 | Micron Technology, Inc. | Spin coating bowl exhaust system |
US5985031A (en) | 1996-06-21 | 1999-11-16 | Micron Technology, Inc. | Spin coating spindle and chuck assembly |
JP3566475B2 (ja) * | 1996-12-03 | 2004-09-15 | 東京エレクトロン株式会社 | 処理装置 |
TW419716B (en) * | 1997-04-28 | 2001-01-21 | Tokyo Electron Ltd | Processing apparatus |
JPH113851A (ja) * | 1997-06-11 | 1999-01-06 | Tokyo Electron Ltd | 液処理装置及び液処理方法 |
US6197385B1 (en) * | 1998-02-04 | 2001-03-06 | Tokyo Electron Limited | Film forming apparatus, substrate conveying apparatus, film forming method, and substrate conveying method |
US6221787B1 (en) * | 1998-04-20 | 2001-04-24 | Tokyo Electron Limited | Apparatus and method of forming resist film |
NL1009281C2 (nl) * | 1998-05-29 | 1999-11-30 | Od & Me Bv | Inrichting geschikt voor het aanbrengen van een laklaag op een schijfvormige registratiedrager alsmede een dergelijke werkwijze. |
US6217936B1 (en) | 1999-02-26 | 2001-04-17 | Advanced Micro Devices | Semiconductor fabrication extended particle collection cup |
KR100589914B1 (ko) * | 2000-01-29 | 2006-06-15 | 삼성전자주식회사 | 외부기기와의 동기를 위한 스피너 제어장치 및 그 제어방법 |
JP3587776B2 (ja) * | 2000-10-10 | 2004-11-10 | 東京エレクトロン株式会社 | 塗布装置及び塗布方法 |
US6616762B2 (en) | 2000-10-13 | 2003-09-09 | Tokyo Electron Limited | Treatment solution supply apparatus and treatment solution supply method |
US6752544B2 (en) * | 2002-03-28 | 2004-06-22 | Dainippon Screen Mfg. Co., Ltd. | Developing apparatus and developing method |
US20050026455A1 (en) * | 2003-05-30 | 2005-02-03 | Satomi Hamada | Substrate processing apparatus and substrate processing method |
JP4305750B2 (ja) * | 2003-10-14 | 2009-07-29 | Okiセミコンダクタ株式会社 | スピンコート法 |
JPWO2006038472A1 (ja) * | 2004-10-06 | 2008-05-15 | 株式会社荏原製作所 | 基板処理装置及び基板処理方法 |
US7579044B2 (en) * | 2004-11-08 | 2009-08-25 | Brewer Science Inc. | Process and device for coating the outer edge of a substrate during microelectronics manufacture |
US7798764B2 (en) | 2005-12-22 | 2010-09-21 | Applied Materials, Inc. | Substrate processing sequence in a cartesian robot cluster tool |
US7699021B2 (en) | 2004-12-22 | 2010-04-20 | Sokudo Co., Ltd. | Cluster tool substrate throughput optimization |
US7819079B2 (en) | 2004-12-22 | 2010-10-26 | Applied Materials, Inc. | Cartesian cluster tool configuration for lithography type processes |
US7396412B2 (en) | 2004-12-22 | 2008-07-08 | Sokudo Co., Ltd. | Coat/develop module with shared dispense |
US7651306B2 (en) | 2004-12-22 | 2010-01-26 | Applied Materials, Inc. | Cartesian robot cluster tool architecture |
JP2008000676A (ja) * | 2006-06-22 | 2008-01-10 | Seiko Epson Corp | スピンコート装置および反射防止層用組成物のコーティング方法 |
JP5006122B2 (ja) | 2007-06-29 | 2012-08-22 | 株式会社Sokudo | 基板処理装置 |
JP5133641B2 (ja) * | 2007-09-27 | 2013-01-30 | 東京エレクトロン株式会社 | 塗布処理方法、塗布処理装置及びコンピュータ読み取り可能な記憶媒体 |
JP5128918B2 (ja) | 2007-11-30 | 2013-01-23 | 株式会社Sokudo | 基板処理装置 |
JP5179170B2 (ja) * | 2007-12-28 | 2013-04-10 | 株式会社Sokudo | 基板処理装置 |
JP5001828B2 (ja) | 2007-12-28 | 2012-08-15 | 株式会社Sokudo | 基板処理装置 |
JP5337180B2 (ja) * | 2010-04-08 | 2013-11-06 | 東京エレクトロン株式会社 | 塗布処理方法、プログラム、コンピュータ記憶媒体及び塗布処理装置 |
JP5635452B2 (ja) * | 2010-07-02 | 2014-12-03 | 東京エレクトロン株式会社 | 基板処理システム |
JP5693439B2 (ja) * | 2011-12-16 | 2015-04-01 | 東京エレクトロン株式会社 | 基板処理装置、基板処理方法および記憶媒体 |
US20140087073A1 (en) * | 2012-09-24 | 2014-03-27 | Igor Constantin Ivanov | Equipment and method of manufacturing for liquid processing in a controlled atmospheric ambient |
US9446467B2 (en) * | 2013-03-14 | 2016-09-20 | Taiwan Semiconductor Manufacturing Company, Ltd. | Integrate rinse module in hybrid bonding platform |
JP6237511B2 (ja) * | 2014-07-11 | 2017-11-29 | 東京エレクトロン株式会社 | 薬液排出機構、液処理装置、薬液排出方法、記憶媒体 |
CN105944875B (zh) * | 2016-06-21 | 2018-07-20 | 上海平耐实业有限公司 | 一种自动上漆装置及其上漆方法 |
JP7081979B2 (ja) * | 2018-05-22 | 2022-06-07 | 株式会社Screen Spe テック | 基板処理装置 |
CN109453957A (zh) * | 2018-10-15 | 2019-03-12 | 苏州优达科精密机械有限公司 | 一种自动收料机 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4564280A (en) * | 1982-10-28 | 1986-01-14 | Fujitsu Limited | Method and apparatus for developing resist film including a movable nozzle arm |
US4788043A (en) * | 1985-04-17 | 1988-11-29 | Tokuyama Soda Kabushiki Kaisha | Process for washing semiconductor substrate with organic solvent |
JP2930307B2 (ja) * | 1988-09-20 | 1999-08-03 | 東京エレクトロン株式会社 | 基板処理装置における液排出機構 |
JP2982439B2 (ja) * | 1991-10-29 | 1999-11-22 | 東京エレクトロン株式会社 | 処理液塗布装置及び処理液塗布方法 |
US5211753A (en) * | 1992-06-15 | 1993-05-18 | Swain Danny C | Spin coating apparatus with an independently spinning enclosure |
-
1994
- 1994-09-29 JP JP25915494A patent/JP3122868B2/ja not_active Expired - Lifetime
-
1995
- 1995-09-25 US US08/533,396 patent/US5672205A/en not_active Expired - Lifetime
- 1995-09-26 TW TW084110033A patent/TW350968B/zh not_active IP Right Cessation
- 1995-09-29 KR KR1019950032780A patent/KR100312037B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR960010094A (ko) | 1996-04-20 |
KR100312037B1 (ko) | 2001-12-28 |
US5672205A (en) | 1997-09-30 |
JPH0897134A (ja) | 1996-04-12 |
JP3122868B2 (ja) | 2001-01-09 |
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Legal Events
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MK4A | Expiration of patent term of an invention patent |