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TW328623B - The method for preventing precipitate of conductive line remained on barrier - Google Patents

The method for preventing precipitate of conductive line remained on barrier

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Publication number
TW328623B
TW328623B TW086112622A TW86112622A TW328623B TW 328623 B TW328623 B TW 328623B TW 086112622 A TW086112622 A TW 086112622A TW 86112622 A TW86112622 A TW 86112622A TW 328623 B TW328623 B TW 328623B
Authority
TW
Taiwan
Prior art keywords
conductive line
barrier
precipitate
layer
barrier layer
Prior art date
Application number
TW086112622A
Other languages
Chinese (zh)
Inventor
Yun-Horng Shen
Sheng-Liang Pan
Original Assignee
Taiwan Semiconductor Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiwan Semiconductor Mfg Co Ltd filed Critical Taiwan Semiconductor Mfg Co Ltd
Priority to TW086112622A priority Critical patent/TW328623B/en
Application granted granted Critical
Publication of TW328623B publication Critical patent/TW328623B/en

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Abstract

A method for preventing precipitate of conductive line remained on barrier includes the following steps. - Provide semiconductor substrate that is at least covered by dielectric with contact opening; - Form barrier layer on dielectric layer; - Form metal layer on barrier layer, in which, it is naturally to produce precipitate on the interface of barrier and metal; - Selectively etch metal layer to define conductive line pattern; - Use isotropic etching procedure to etch the surface of barrier layer that is the region uncovered by conductive line pattern and clean the precipitate; - Etch the residual barrier layer that is the region uncovered by conductive line pattern to finish the manufacturing of conductive line.
TW086112622A 1997-09-02 1997-09-02 The method for preventing precipitate of conductive line remained on barrier TW328623B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW086112622A TW328623B (en) 1997-09-02 1997-09-02 The method for preventing precipitate of conductive line remained on barrier

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW086112622A TW328623B (en) 1997-09-02 1997-09-02 The method for preventing precipitate of conductive line remained on barrier

Publications (1)

Publication Number Publication Date
TW328623B true TW328623B (en) 1998-03-21

Family

ID=58262440

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086112622A TW328623B (en) 1997-09-02 1997-09-02 The method for preventing precipitate of conductive line remained on barrier

Country Status (1)

Country Link
TW (1) TW328623B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI669994B (en) * 2017-12-04 2019-08-21 希華晶體科技股份有限公司 Method for manufacturing miniaturized circuit and its products

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI669994B (en) * 2017-12-04 2019-08-21 希華晶體科技股份有限公司 Method for manufacturing miniaturized circuit and its products

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