TW282615B - - Google Patents
Info
- Publication number
- TW282615B TW282615B TW084108934A TW84108934A TW282615B TW 282615 B TW282615 B TW 282615B TW 084108934 A TW084108934 A TW 084108934A TW 84108934 A TW84108934 A TW 84108934A TW 282615 B TW282615 B TW 282615B
- Authority
- TW
- Taiwan
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0002—Apparatus or processes for manufacturing printed circuits for manufacturing artworks for printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09381—Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09463—Partial lands, i.e. lands or conductive rings not completely surrounding the hole
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0548—Masks
- H05K2203/056—Using an artwork, i.e. a photomask for exposing photosensitive layers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Adornments (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US08/340,508 US5539156A (en) | 1994-11-16 | 1994-11-16 | Non-annular lands |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW282615B true TW282615B (zh) | 1996-08-01 |
Family
ID=23333677
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW084108934A TW282615B (zh) | 1994-11-16 | 1995-08-28 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US5539156A (zh) |
| JP (1) | JPH08213730A (zh) |
| KR (1) | KR960020629A (zh) |
| CN (2) | CN1051669C (zh) |
| BR (1) | BR9504581A (zh) |
| MY (1) | MY138632A (zh) |
| TW (1) | TW282615B (zh) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6316738B1 (en) * | 1996-01-11 | 2001-11-13 | Ibiden Co., Ltd. | Printed wiring board and manufacturing method thereof |
| US6868615B2 (en) * | 1998-06-08 | 2005-03-22 | Paul Joseph Malley | Telescopic weapon aiming system |
| US20050188600A1 (en) * | 1998-01-29 | 2005-09-01 | Malley Paul J. | Telescopic weapon aiming system |
| JP2000252613A (ja) * | 1999-02-26 | 2000-09-14 | Canon Inc | 電子回路基板及びその半田付け方法 |
| US6268568B1 (en) * | 1999-05-04 | 2001-07-31 | Anam Semiconductor, Inc. | Printed circuit board with oval solder ball lands for BGA semiconductor packages |
| WO2001063991A1 (fr) * | 2000-02-25 | 2001-08-30 | Ibiden Co., Ltd. | Carte a circuits imprimes multicouche et procede de production d'une carte a circuits imprimes multicouche |
| CN1278413C (zh) * | 2000-09-25 | 2006-10-04 | 揖斐电株式会社 | 半导体元件及其制造方法、多层印刷布线板及其制造方法 |
| US7149090B2 (en) * | 2001-09-11 | 2006-12-12 | Brother Kogyo Kabushiki Kaisha | Structure of flexible printed circuit board |
| US6881072B2 (en) * | 2002-10-01 | 2005-04-19 | International Business Machines Corporation | Membrane probe with anchored elements |
| JP2006216711A (ja) * | 2005-02-02 | 2006-08-17 | Ibiden Co Ltd | 多層プリント配線板 |
| CN107799494A (zh) * | 2017-11-03 | 2018-03-13 | 北方电子研究院安徽有限公司 | Ltcc超多层生瓷直通孔版图设计及制造工艺 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3436819A (en) * | 1965-09-22 | 1969-04-08 | Litton Systems Inc | Multilayer laminate |
| US3567849A (en) * | 1966-10-29 | 1971-03-02 | Victor Company Of Japan | Variable bandwidth magnetic recording system |
| US4170819A (en) * | 1978-04-10 | 1979-10-16 | International Business Machines Corporation | Method of making conductive via holes in printed circuit boards |
| US4225900A (en) * | 1978-10-25 | 1980-09-30 | Raytheon Company | Integrated circuit device package interconnect means |
| US4318954A (en) * | 1981-02-09 | 1982-03-09 | Boeing Aerospace Company | Printed wiring board substrates for ceramic chip carriers |
| CH650373A5 (fr) * | 1982-07-16 | 1985-07-15 | Jean Paul Strobel | Circuit imprime et procede de fabrication du circuit. |
| CA1197325A (en) * | 1984-06-04 | 1985-11-26 | Beverley W. Gumb | Masking of holes in circuit patterns on circuit boards prior to flow soldering |
| US4851614A (en) * | 1987-05-22 | 1989-07-25 | Compaq Computer Corporation | Non-occluding mounting hole with solder pad for printed circuit boards |
| JPH0831458B2 (ja) * | 1987-09-08 | 1996-03-27 | 三菱電機株式会社 | 超電導配線集積回路 |
| US4893216A (en) * | 1988-08-09 | 1990-01-09 | Northern Telecom Limited | Circuit board and method of soldering |
| JPH02198154A (ja) * | 1989-01-27 | 1990-08-06 | Hitachi Ltd | 配線の形成方法及びこれを利用した半導体装置 |
| JPH03154341A (ja) * | 1989-11-10 | 1991-07-02 | Toshiba Corp | 半導体装置 |
| GB9006855D0 (en) * | 1990-03-27 | 1990-05-23 | Ferguson Ltd | Method of producing a printed circuit board |
| JPH03283594A (ja) * | 1990-03-30 | 1991-12-13 | Toshiba Lighting & Technol Corp | 回路基板 |
| JPH0437191A (ja) * | 1990-06-01 | 1992-02-07 | Mitsubishi Electric Corp | 多層プリント基板 |
| US5098533A (en) * | 1991-02-06 | 1992-03-24 | International Business Machines Corp. | Electrolytic method for the etch back of encapsulated copper-Invar-copper core structures |
| JP2559977B2 (ja) * | 1992-07-29 | 1996-12-04 | インターナショナル・ビジネス・マシーンズ・コーポレイション | バイアに係るクラックを除去する方法及び構造、並びに、半導体セラミックパッケージ基板。 |
| US5342999A (en) * | 1992-12-21 | 1994-08-30 | Motorola, Inc. | Apparatus for adapting semiconductor die pads and method therefor |
-
1994
- 1994-11-16 US US08/340,508 patent/US5539156A/en not_active Expired - Fee Related
-
1995
- 1995-06-07 US US08/488,259 patent/US5713127A/en not_active Expired - Fee Related
- 1995-08-16 MY MYPI95002407A patent/MY138632A/en unknown
- 1995-08-21 CN CN95115551A patent/CN1051669C/zh not_active Expired - Fee Related
- 1995-08-28 TW TW084108934A patent/TW282615B/zh active
- 1995-10-27 BR BR9504581A patent/BR9504581A/pt not_active IP Right Cessation
- 1995-11-06 JP JP7287611A patent/JPH08213730A/ja active Pending
- 1995-11-15 KR KR1019950041463A patent/KR960020629A/ko not_active Application Discontinuation
-
1999
- 1999-04-14 CN CNB991050029A patent/CN1209949C/zh not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN1128487A (zh) | 1996-08-07 |
| CN1051669C (zh) | 2000-04-19 |
| CN1209949C (zh) | 2005-07-06 |
| US5713127A (en) | 1998-02-03 |
| MY138632A (en) | 2009-07-31 |
| KR960020629A (ko) | 1996-06-17 |
| US5539156A (en) | 1996-07-23 |
| JPH08213730A (ja) | 1996-08-20 |
| BR9504581A (pt) | 1997-10-07 |
| CN1238660A (zh) | 1999-12-15 |