TW267247B - - Google Patents

Info

Publication number: TW267247B
Authority: TW; Taiwan

Application number

TW083111812A

Original Assignee

Toshiba Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1993-12-09

Filing date

1994-12-17

Publication date

1996-01-01

1994-12-17 Application filed by Toshiba Co Ltd filed Critical Toshiba Co Ltd

1996-01-01 Application granted granted Critical

1996-01-01 Publication of TW267247B publication Critical patent/TW267247B/zh

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T436/00—Chemistry: analytical and immunological testing
- Y10T436/25—Chemistry: analytical and immunological testing including sample preparation
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T436/00—Chemistry: analytical and immunological testing
- Y10T436/25—Chemistry: analytical and immunological testing including sample preparation
- Y10T436/25375—Liberation or purification of sample or separation of material from a sample [e.g., filtering, centrifuging, etc.]

Landscapes

Engineering & Computer Science (AREA)
Manufacturing & Machinery (AREA)
Computer Hardware Design (AREA)
Microelectronics & Electronic Packaging (AREA)
Power Engineering (AREA)
Sampling And Sample Adjustment (AREA)
Testing Or Measuring Of Semiconductors Or The Like (AREA)

TW083111812A 1993-12-09 1994-12-17 TW267247B (zh)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP30899793A JP3278513B2 (ja)	1993-12-09	1993-12-09	半導体基板の不純物分析方法

Publications (1)

Publication Number	Publication Date
TW267247B true TW267247B (zh)	1996-01-01

Family

ID=17987683

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW083111812A TW267247B (zh)	1993-12-09	1994-12-17

Country Status (6)

Country	Link
US (1)	US5633172A (zh)
EP (1)	EP0657924B1 (zh)
JP (1)	JP3278513B2 (zh)
KR (1)	KR100254015B1 (zh)
DE (1)	DE69431148T2 (zh)
TW (1)	TW267247B (zh)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US5709744A (en) *	1996-03-01	1998-01-20	Motorola	Masking methods during semiconductor device fabrication
JP2882377B2 (ja) *	1996-08-23	1999-04-12	日本電気株式会社	金属の回収容器及び金属の回収方法
US5965446A (en) *	1996-10-24	1999-10-12	Hamamatsu Photonics K.K.	Method for placing fluorescent single molecules on surface of substrate and method for visualizing structural defect of surface of substrate
KR100230990B1 (en) *	1996-12-18	1999-11-15	Samsung Electronics Co Ltd	Analysis method of aluminum layer for semiconductor wafer
JP3336898B2 (ja)	1997-02-28	2002-10-21	三菱電機株式会社	シリコンウエハ表面の不純物回収方法およびその装置
US5922606A (en) *	1997-09-16	1999-07-13	Nalco Chemical Company	Fluorometric method for increasing the efficiency of the rinsing and water recovery process in the manufacture of semiconductor chips
US6210640B1 (en)	1998-06-08	2001-04-03	Memc Electronic Materials, Inc.	Collector for an automated on-line bath analysis system
US6420275B1 (en) *	1999-08-30	2002-07-16	Micron Technology, Inc.	System and method for analyzing a semiconductor surface
JP4664818B2 (ja) *	2004-01-29	2011-04-06	有限会社Ｎａｓ技研	基板検査装置と基板検査方法と回収治具
JP4772610B2 (ja)	2006-07-19	2011-09-14	東京エレクトロン株式会社	分析方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3660250A (en) *	1967-12-22	1972-05-02	Ibm	Method of determining impurity profile of a semiconductor body
US4168212A (en) *	1974-05-16	1979-09-18	The Post Office	Determining semiconductor characteristic
US4180439A (en) *	1976-03-15	1979-12-25	International Business Machines Corporation	Anodic etching method for the detection of electrically active defects in silicon
JPH0658927B2 (ja) *	1983-09-26	1994-08-03	株式会社東芝	半導体薄膜の分析方法および分析用試料の回収装置
JPS617639A (ja) *	1984-06-22	1986-01-14	Toshiba Corp	半導体薄膜の分解装置
US4990459A (en) *	1988-04-25	1991-02-05	Kabushiki Kaisha Toshiba	Impurity measuring method
JPH0625717B2 (ja) *	1988-04-25	1994-04-06	株式会社東芝	不純物の測定方法
JP2604037B2 (ja) *	1988-07-11	1997-04-23	株式会社東芝	半導体処理装置
JP2772035B2 (ja) *	1989-05-31	1998-07-02	東芝セラミックス株式会社	ウエハ表面の不純物量の測定方法
JPH03239343A (ja) *	1990-02-17	1991-10-24	Sharp Corp	ウエハ表面液滴回収装置
JPH04110653A (ja) *	1990-08-31	1992-04-13	Hitachi Ltd	プラズマを用いた気体試料の分析方法
GB9022003D0 (en) *	1990-10-10	1990-11-21	Interox Chemicals Ltd	Purification of hydrogen peroxide
JP2568756B2 (ja) *	1990-12-27	1997-01-08	松下電器産業株式会社	半導体基板表面の不純物回収装置
JPH05343494A (ja) *	1992-06-09	1993-12-24	Nec Corp	半導体装置の製造工程における汚染物の分析法
US5385629A (en) *	1993-10-14	1995-01-31	Micron Semiconductor, Inc.	After etch test method and apparatus

1993
- 1993-12-09 JP JP30899793A patent/JP3278513B2/ja not_active Expired - Fee Related
1994
- 1994-12-03 KR KR1019940032708A patent/KR100254015B1/ko not_active IP Right Cessation
- 1994-12-07 US US08/350,618 patent/US5633172A/en not_active Expired - Fee Related
- 1994-12-07 DE DE69431148T patent/DE69431148T2/de not_active Expired - Fee Related
- 1994-12-07 EP EP94119316A patent/EP0657924B1/en not_active Expired - Lifetime
- 1994-12-17 TW TW083111812A patent/TW267247B/zh active

Also Published As

Publication number	Publication date
JPH07161791A (ja)	1995-06-23
DE69431148D1 (de)	2002-09-12
EP0657924A2 (en)	1995-06-14
EP0657924B1 (en)	2002-08-07
JP3278513B2 (ja)	2002-04-30
US5633172A (en)	1997-05-27
EP0657924A3 (en)	1996-07-10
DE69431148T2 (de)	2003-03-27
KR100254015B1 (ko)	2000-05-01

Publication	Publication Date	Title
FR2703947B1 (zh)	1997-02-21
FR09C0038I2 (zh)	2010-06-11
FR2706813B1 (zh)	1995-09-08
FR2704266B1 (zh)	1997-02-28
FR2707051B1 (zh)	1996-03-08
FR2707024B1 (zh)	1995-09-01
FR09C0007I1 (zh)	2009-04-17
EP0757573A4 (zh)	1997-03-26
EP0714291A4 (zh)	1996-07-17
FR2702922B1 (zh)	1997-02-28
FR2709800B1 (zh)	1997-02-14
FR2705586B1 (zh)	1997-02-28
EP0725461A3 (zh)	1996-09-18
FR2703789B1 (zh)	1997-02-21
TW267247B (zh)	1996-01-01
FR2706165B1 (zh)	1997-03-07
FR2701428B1 (zh)	1997-02-21
FR2706827B1 (zh)	1995-09-01
FR2706807B1 (zh)	1995-10-06
FR2706983B1 (zh)	1995-09-08
FR2713409B1 (zh)	1997-02-07
TW269627B (zh)	1996-02-01
FR2706832B1 (zh)	1995-08-04
IN178016B (zh)	1997-03-01
IN178972B (zh)	1997-08-02