TW202500700A - Adhesive Sheet - Google Patents
Adhesive Sheet Download PDFInfo
- Publication number
- TW202500700A TW202500700A TW113115478A TW113115478A TW202500700A TW 202500700 A TW202500700 A TW 202500700A TW 113115478 A TW113115478 A TW 113115478A TW 113115478 A TW113115478 A TW 113115478A TW 202500700 A TW202500700 A TW 202500700A
- Authority
- TW
- Taiwan
- Prior art keywords
- adhesive
- adhesive layer
- meth
- acrylate
- resin
- Prior art date
Links
- 239000000853 adhesive Substances 0.000 title claims abstract description 132
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 132
- 239000012790 adhesive layer Substances 0.000 claims abstract description 123
- 229920005989 resin Polymers 0.000 claims abstract description 78
- 239000011347 resin Substances 0.000 claims abstract description 78
- 229920000103 Expandable microsphere Polymers 0.000 claims abstract description 74
- 229920005601 base polymer Polymers 0.000 claims abstract description 51
- 239000000126 substance Substances 0.000 claims abstract description 8
- 239000000178 monomer Substances 0.000 claims description 65
- 239000000470 constituent Substances 0.000 claims description 26
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 16
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 14
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 12
- 239000010410 layer Substances 0.000 abstract description 45
- 238000010438 heat treatment Methods 0.000 abstract description 22
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 63
- -1 polyethylene terephthalate Polymers 0.000 description 48
- 239000011257 shell material Substances 0.000 description 37
- 239000003431 cross linking reagent Substances 0.000 description 29
- 239000004005 microsphere Substances 0.000 description 28
- 239000000758 substrate Substances 0.000 description 28
- 239000000203 mixture Substances 0.000 description 20
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 17
- 229920006243 acrylic copolymer Polymers 0.000 description 17
- 239000004014 plasticizer Substances 0.000 description 15
- 229920000642 polymer Polymers 0.000 description 15
- 238000000576 coating method Methods 0.000 description 14
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 13
- 238000005187 foaming Methods 0.000 description 13
- 238000000034 method Methods 0.000 description 13
- 239000000243 solution Substances 0.000 description 13
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 12
- 238000002360 preparation method Methods 0.000 description 12
- 239000002390 adhesive tape Substances 0.000 description 11
- 239000002904 solvent Substances 0.000 description 11
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 10
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 10
- 239000003795 chemical substances by application Substances 0.000 description 10
- 239000011248 coating agent Substances 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 10
- 239000003960 organic solvent Substances 0.000 description 10
- 239000012948 isocyanate Substances 0.000 description 9
- 239000002245 particle Substances 0.000 description 9
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 8
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 8
- 239000000654 additive Substances 0.000 description 8
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 7
- 230000000694 effects Effects 0.000 description 7
- 150000002513 isocyanates Chemical class 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 239000004745 nonwoven fabric Substances 0.000 description 7
- 238000003756 stirring Methods 0.000 description 7
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 6
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 6
- GYCMBHHDWRMZGG-UHFFFAOYSA-N Methylacrylonitrile Chemical compound CC(=C)C#N GYCMBHHDWRMZGG-UHFFFAOYSA-N 0.000 description 6
- 239000003522 acrylic cement Substances 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 6
- 229920001577 copolymer Polymers 0.000 description 6
- 238000011156 evaluation Methods 0.000 description 6
- NNPPMTNAJDCUHE-UHFFFAOYSA-N isobutane Chemical compound CC(C)C NNPPMTNAJDCUHE-UHFFFAOYSA-N 0.000 description 6
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 6
- 229920000728 polyester Polymers 0.000 description 6
- 150000003505 terpenes Chemical class 0.000 description 6
- 235000007586 terpenes Nutrition 0.000 description 6
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 5
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 5
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Natural products OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 5
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 5
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 239000011247 coating layer Substances 0.000 description 5
- 238000001035 drying Methods 0.000 description 5
- 229920001519 homopolymer Polymers 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 229920000058 polyacrylate Polymers 0.000 description 5
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 5
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 5
- RGSFGYAAUTVSQA-UHFFFAOYSA-N Cyclopentane Chemical compound C1CCCC1 RGSFGYAAUTVSQA-UHFFFAOYSA-N 0.000 description 4
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 4
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 4
- GTTSNKDQDACYLV-UHFFFAOYSA-N Trihydroxybutane Chemical compound CCCC(O)(O)O GTTSNKDQDACYLV-UHFFFAOYSA-N 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 4
- 125000005907 alkyl ester group Chemical group 0.000 description 4
- ARCGXLSVLAOJQL-UHFFFAOYSA-N anhydrous trimellitic acid Natural products OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 4
- 230000003712 anti-aging effect Effects 0.000 description 4
- 239000006185 dispersion Substances 0.000 description 4
- 239000011888 foil Substances 0.000 description 4
- DMEGYFMYUHOHGS-UHFFFAOYSA-N heptamethylene Natural products C1CCCCCC1 DMEGYFMYUHOHGS-UHFFFAOYSA-N 0.000 description 4
- 238000007373 indentation Methods 0.000 description 4
- 229920002647 polyamide Polymers 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- CYIDZMCFTVVTJO-UHFFFAOYSA-N pyromellityc acid Natural products OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C=C1C(O)=O CYIDZMCFTVVTJO-UHFFFAOYSA-N 0.000 description 4
- 238000002834 transmittance Methods 0.000 description 4
- OEPOKWHJYJXUGD-UHFFFAOYSA-N 2-(3-phenylmethoxyphenyl)-1,3-thiazole-4-carbaldehyde Chemical compound O=CC1=CSC(C=2C=C(OCC=3C=CC=CC=3)C=CC=2)=N1 OEPOKWHJYJXUGD-UHFFFAOYSA-N 0.000 description 3
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- 239000004952 Polyamide Substances 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 3
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 3
- 125000000217 alkyl group Chemical group 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- AFABGHUZZDYHJO-UHFFFAOYSA-N dimethyl butane Natural products CCCC(C)C AFABGHUZZDYHJO-UHFFFAOYSA-N 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 239000011737 fluorine Substances 0.000 description 3
- 229910052731 fluorine Inorganic materials 0.000 description 3
- 239000001530 fumaric acid Substances 0.000 description 3
- 239000001282 iso-butane Substances 0.000 description 3
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- OFBQJSOFQDEBGM-UHFFFAOYSA-N n-pentane Natural products CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 3
- 239000000123 paper Substances 0.000 description 3
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 3
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 3
- 229920001223 polyethylene glycol Polymers 0.000 description 3
- 229920001155 polypropylene Polymers 0.000 description 3
- 239000004800 polyvinyl chloride Substances 0.000 description 3
- 239000005060 rubber Substances 0.000 description 3
- 239000013464 silicone adhesive Substances 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 239000003381 stabilizer Substances 0.000 description 3
- 238000010557 suspension polymerization reaction Methods 0.000 description 3
- 229920003051 synthetic elastomer Polymers 0.000 description 3
- 229920003002 synthetic resin Polymers 0.000 description 3
- 239000000057 synthetic resin Substances 0.000 description 3
- 239000005061 synthetic rubber Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- IANQTJSKSUMEQM-UHFFFAOYSA-N 1-benzofuran Chemical compound C1=CC=C2OC=CC2=C1 IANQTJSKSUMEQM-UHFFFAOYSA-N 0.000 description 2
- SJLLJZNSZJHXQN-UHFFFAOYSA-N 1-dodecylpyrrole-2,5-dione Chemical compound CCCCCCCCCCCCN1C(=O)C=CC1=O SJLLJZNSZJHXQN-UHFFFAOYSA-N 0.000 description 2
- HIDBROSJWZYGSZ-UHFFFAOYSA-N 1-phenylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC=C1 HIDBROSJWZYGSZ-UHFFFAOYSA-N 0.000 description 2
- HNRMPXKDFBEGFZ-UHFFFAOYSA-N 2,2-dimethylbutane Chemical compound CCC(C)(C)C HNRMPXKDFBEGFZ-UHFFFAOYSA-N 0.000 description 2
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 2
- AOBIOSPNXBMOAT-UHFFFAOYSA-N 2-[2-(oxiran-2-ylmethoxy)ethoxymethyl]oxirane Chemical compound C1OC1COCCOCC1CO1 AOBIOSPNXBMOAT-UHFFFAOYSA-N 0.000 description 2
- KANZWHBYRHQMKZ-UHFFFAOYSA-N 2-ethenylpyrazine Chemical compound C=CC1=CN=CC=N1 KANZWHBYRHQMKZ-UHFFFAOYSA-N 0.000 description 2
- CYUZOYPRAQASLN-UHFFFAOYSA-N 3-prop-2-enoyloxypropanoic acid Chemical compound OC(=O)CCOC(=O)C=C CYUZOYPRAQASLN-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
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- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 2
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 2
- 239000013032 Hydrocarbon resin Substances 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
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- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 2
- 239000004696 Poly ether ether ketone Substances 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
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- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
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- 239000001361 adipic acid Substances 0.000 description 2
- 235000011037 adipic acid Nutrition 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 2
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- WYKYCHHWIJXDAO-UHFFFAOYSA-N tert-butyl 2-ethylhexaneperoxoate Chemical compound CCCCC(CC)C(=O)OOC(C)(C)C WYKYCHHWIJXDAO-UHFFFAOYSA-N 0.000 description 2
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 2
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- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 2
- 239000013638 trimer Substances 0.000 description 2
- JNYAEWCLZODPBN-JGWLITMVSA-N (2r,3r,4s)-2-[(1r)-1,2-dihydroxyethyl]oxolane-3,4-diol Chemical compound OC[C@@H](O)[C@H]1OC[C@H](O)[C@H]1O JNYAEWCLZODPBN-JGWLITMVSA-N 0.000 description 1
- 125000003837 (C1-C20) alkyl group Chemical group 0.000 description 1
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 1
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Abstract
本發明提供一種黏著片材,其具備:包含熱膨脹性微球且加熱後之剝離性優異並且透明性優異之含有熱膨脹性微球之層(黏著劑層)。 本發明之實施方式之黏著片材具備:包含黏著劑及熱膨脹性微球之黏著劑層,該黏著劑包含基礎聚合物,該熱膨脹性微球由利用樹脂形成之殼及該殼內包含之揮發性物質構成,該基礎聚合物之折射率與該樹脂之折射率之差的絕對值為0~0.018。 The present invention provides an adhesive sheet, which comprises: a layer (adhesive layer) containing heat-expandable microspheres, which has excellent peelability after heating and excellent transparency. The adhesive sheet of the embodiment of the present invention comprises: an adhesive layer comprising an adhesive and heat-expandable microspheres, the adhesive comprising a base polymer, the heat-expandable microspheres comprising a shell formed by a resin and a volatile substance contained in the shell, and the absolute value of the difference between the refractive index of the base polymer and the refractive index of the resin is 0 to 0.018.
Description
本發明係關於一種黏著片材。The present invention relates to an adhesive sheet.
於製造電子零件之步驟中,作為以臨時固定被加工品為目的而使用之黏著片材,已知有於臨時固定時表現出黏著性、於不需要固定之情況下表現出剝離性之易剝離性之黏著片材。作為此種黏著片材之一,研究了於黏著劑層中含有熱膨脹性微球而構成之黏著片材(例如,專利文獻1)。該黏著片材於常溫下所代表之較低溫度下表現出期望之黏著力,另一方面,熱膨脹性微球因加熱而發生膨脹,於黏著劑層表面產生凹凸,黏著力降低。對於此種黏著片材,亦能夠僅藉由重力之作用將被黏著體剝離。In the process of manufacturing electronic parts, as an adhesive sheet used for the purpose of temporarily fixing the workpiece, there is known an easily peelable adhesive sheet that exhibits adhesiveness when temporarily fixing and exhibits peelability when fixing is not required. As one of such adhesive sheets, an adhesive sheet composed of thermally expandable microspheres in an adhesive layer has been studied (for example, Patent Document 1). The adhesive sheet exhibits the desired adhesive force at a relatively low temperature represented by room temperature. On the other hand, the thermally expandable microspheres expand due to heating, and produce unevenness on the surface of the adhesive layer, thereby reducing the adhesive force. For such an adhesive sheet, the adhered body can also be peeled off by the action of gravity alone.
如上所述之包含熱膨脹性微球之黏著劑層有時要求高透明性。例如,隔著黏著片材進行半導體之圖案面之對準時,存在難以使用透明性差之黏著片材之問題。特別是近年來,存在加工時之環境溫度變高之傾向,利用耐熱性優異之熱膨脹性微球之機會增加,但包含耐熱性優異之熱膨脹性微球之黏著劑層存在透明性降低之傾向。 [先前技術文獻] [專利文獻] The adhesive layer containing the heat-expandable microspheres as described above is sometimes required to have high transparency. For example, when aligning the pattern surface of the semiconductor through the adhesive sheet, there is a problem that it is difficult to use an adhesive sheet with poor transparency. In particular, in recent years, there has been a tendency for the ambient temperature during processing to become higher, and the opportunity to use heat-expandable microspheres with excellent heat resistance has increased, but the adhesive layer containing heat-expandable microspheres with excellent heat resistance has a tendency to reduce transparency. [Prior technical literature] [Patent literature]
專利文獻1:日本專利特開2001-131507號公報Patent document 1: Japanese Patent Publication No. 2001-131507
[發明所欲解決之問題] 本發明係為了解決上述先前之問題而完成者,其目的在於,提供一種黏著片材,其具備:包含熱膨脹性微球並且加熱後之剝離性優異且透明性優異之含熱膨脹性微球之層(黏著劑層)。 [解決問題之技術手段] [Problem to be solved by the invention] The present invention is completed to solve the above-mentioned previous problem, and its purpose is to provide an adhesive sheet, which comprises: a layer (adhesive layer) containing heat-expandable microspheres and having excellent peelability after heating and excellent transparency. [Technical means for solving the problem]
[1]本發明之實施方式之黏著片材具備:包含黏著劑及熱膨脹性微球之黏著劑層,該黏著劑包含基礎聚合物,該熱膨脹性微球由利用樹脂形成之殼及該殼內包含之揮發性物質構成,該基礎聚合物之折射率與該樹脂之折射率之差的絕對值為0~0.018。 [2]如上述[1]記載之黏著片材,其中形成上述殼之樹脂亦可包含源自含羧基單體之構成單元。 [3]如上述[2]記載之黏著片材,其中形成上述殼之樹脂中,相對於該樹脂100 mol,源自含羧基單體之構成單元之含有比例可以為21 mol%~36 mol%。 [4]如上述[1]記載之黏著片材,其中形成上述殼之樹脂亦可包含源自甲基丙烯酸之構成單元。 [5]如上述[1]~[4]中任一項記載之黏著片材,其中上述黏著劑中之基礎聚合物亦可包含源自含羥基單體之構成單元及/或源自含羧基單體之構成單元。 [發明之效果] [1] The adhesive sheet of the embodiment of the present invention comprises: an adhesive layer including an adhesive and heat-expandable microspheres, the adhesive comprising a base polymer, the heat-expandable microspheres comprising a shell formed by a resin and a volatile substance contained in the shell, and the absolute value of the difference between the refractive index of the base polymer and the refractive index of the resin is 0 to 0.018. [2] The adhesive sheet as described in [1] above, wherein the resin forming the shell may also contain constituent units derived from carboxyl-containing monomers. [3] The adhesive sheet as described in [2] above, wherein the content ratio of constituent units derived from carboxyl-containing monomers in the resin forming the shell may be 21 mol% to 36 mol% relative to 100 mol of the resin. [4] The adhesive sheet as described in [1] above, wherein the resin forming the shell may also contain constituent units derived from methacrylic acid. [5] The adhesive sheet as described in any one of [1] to [4] above, wherein the base polymer in the adhesive may also contain constituent units derived from hydroxyl-containing monomers and/or constituent units derived from carboxyl-containing monomers. [Effect of the invention]
根據本發明,可以提供具備包含熱膨脹性微球並且加熱後之剝離性優異且透明性優異之含熱膨脹性微球之層(黏著劑層)之黏著片材。According to the present invention, it is possible to provide an adhesive sheet having a layer (adhesive layer) containing heat-expandable microspheres and having excellent releasability after heating and excellent transparency.
A. 黏著片材之概要圖1(a)係本發明之1個實施方式之黏著片材之概略剖視圖。黏著片材100具備黏著劑層10。本發明之黏著片材可以僅由黏著劑層10構成,還可以除該黏著劑層以外還具備任意適當之層。 A. Overview of Adhesive Sheet Fig. 1(a) is a schematic cross-sectional view of an adhesive sheet according to one embodiment of the present invention. The adhesive sheet 100 has an adhesive layer 10. The adhesive sheet of the present invention may be composed of only the adhesive layer 10, or may have any appropriate layer in addition to the adhesive layer.
圖1(b)係本發明之另一實施方式之黏著片材之概略剖視圖。黏著片材200還具備基材20,於基材20之至少單側配置有黏著劑層10。圖1(c)係本發明之又一實施方式之黏著片材之概略剖視圖。黏著片材300具備黏著劑層10及配置於黏著劑層10之至少單側之其他黏著劑層30。可以如圖示例之方式於黏著劑層10及其他黏著劑層30之間配置基材20,雖未圖示,但亦可以省略基材而由黏著劑層及其他黏著劑層構成黏著片材。又,雖未圖示,但上述黏著片材可以進一步具備能夠對上述黏著片材賦予彈性之彈性層(後述E項)、可剝離地配置於黏著劑層上之剝離襯墊等作為除黏著劑層以外之層。又,亦可以於基材之兩側配置黏著劑層。FIG. 1( b ) is a schematic cross-sectional view of an adhesive sheet of another embodiment of the present invention. The adhesive sheet 200 also includes a substrate 20, and an adhesive layer 10 is disposed on at least one side of the substrate 20. FIG. 1( c ) is a schematic cross-sectional view of an adhesive sheet of another embodiment of the present invention. The adhesive sheet 300 includes an adhesive layer 10 and another adhesive layer 30 disposed on at least one side of the adhesive layer 10. The substrate 20 may be disposed between the adhesive layer 10 and the other adhesive layer 30 as shown in the example shown in the figure. Although not shown, the substrate may be omitted and the adhesive sheet may be composed of the adhesive layer and the other adhesive layers. Although not shown, the adhesive sheet may further include an elastic layer (described later in item E) that can impart elasticity to the adhesive sheet, a peeling pad that can be releasably disposed on the adhesive layer, etc. as layers other than the adhesive layer. In addition, the adhesive layer may be disposed on both sides of the substrate.
上述黏著劑層包含:含有基礎聚合物之黏著劑及熱膨脹性微球。The adhesive layer comprises an adhesive containing a base polymer and thermally expandable microspheres.
上述熱膨脹性微球由利用樹脂形成之殼及該殼內包含之揮發性物質(代表性的為有機溶劑)構成。該熱膨脹性微球可以於規定溫度下藉由揮發性物質之揮發而膨脹。包含此種熱膨脹性微球之黏著劑層中,熱膨脹性微球因加熱而膨脹,藉此於黏著面(即黏著劑層表面)產生凹凸,黏著力降低或消失。將本發明之黏著帶於例如電子零件(例如陶瓷電容器)之加工時用作加工物之臨時固定用片之情形時,於對該加工物實施規定加工時表現出臨時固定所需之黏著性,於加工後將黏著帶從加工物剝離時,黏著力因加熱而降低或消失,從而表現出良好之剝離性。The heat-expandable microspheres are composed of a shell formed by a resin and a volatile substance (typically an organic solvent) contained in the shell. The heat-expandable microspheres can expand at a specified temperature by the volatility of the volatile substance. In the adhesive layer containing such heat-expandable microspheres, the heat-expandable microspheres expand due to heating, thereby generating unevenness on the adhesive surface (i.e., the surface of the adhesive layer), and the adhesive force is reduced or eliminated. When the adhesive tape of the present invention is used as a temporary fixing sheet for a workpiece during processing of electronic parts (e.g., ceramic capacitors), the workpiece exhibits the adhesiveness required for temporary fixing when the workpiece is subjected to a prescribed processing. When the adhesive tape is peeled off from the workpiece after processing, the adhesive force is reduced or disappears due to heating, thereby exhibiting good peeling properties.
上述黏著劑中之上述基礎聚合物之折射率與構成上述殼之樹脂之折射率之差的絕對值為0~0.018。若為此種範圍若為此種範圍,則能夠降低黏著劑層內之可見光之漫反射,形成透明性優異之黏著性層。上述黏著劑中之上述基礎聚合物之折射率與構成上述殼之樹脂之折射率之差的絕對值較佳為0~0.015,更佳為0~0.006,進而較佳為0~0.005。若為此種範圍,則上述效果變得顯著。The absolute value of the difference between the refractive index of the base polymer in the adhesive and the refractive index of the resin constituting the shell is 0 to 0.018. If it is within this range, the diffuse reflection of visible light in the adhesive layer can be reduced, and an adhesive layer with excellent transparency can be formed. The absolute value of the difference between the refractive index of the base polymer in the adhesive and the refractive index of the resin constituting the shell is preferably 0 to 0.015, more preferably 0 to 0.006, and further preferably 0 to 0.005. If it is within this range, the above effect becomes significant.
本說明書中,基礎聚合物之折射率及樹脂之折射率為基於構成基礎聚合物或樹脂之單體組成,對各單體分別算出(構成聚合物之各單體組成之莫耳分數×該單體之折射率值),以算出值之和之形式求出。單體之折射率係20℃下之鈉D線之折射率值。In this specification, the refractive index of the base polymer and the refractive index of the resin are calculated based on the monomer composition constituting the base polymer or the resin, and are obtained as the sum of the calculated values (the molar fraction of each monomer composition constituting the polymer × the refractive index value of the monomer). The refractive index of the monomer is the refractive index value of the sodium D line at 20°C.
將上述黏著片材之黏著劑層貼合於聚對苯二甲酸乙二酯時之23℃下之黏著力(常態黏著力)較佳為0.5 N/20 mm以上,更佳為1 N/20 mm~20 N/20 mm,進而較佳為2 N/20 mm~20 N/20 mm,進而較佳為4 N/20 mm~20 N/mm。若為此種範圍,則例如能夠得到作為電子零件之製造中使用之臨時固定用片有用之黏著片材。本說明書中,黏著力係指未產生由熱膨脹性微球之膨脹導致之黏著力降低之狀態下之黏著力,係指未經過40℃以上之熱歷程之狀態下之黏著力。又,黏著力係指根據JIS Z 0237:2009之方法(貼合條件:2 kg輥往復1次、剝離速度(拉伸速度):300 mm/min、剝離角度180°)測定之黏著力。The adhesion (normal adhesion) at 23°C when the adhesive layer of the adhesive sheet is attached to polyethylene terephthalate is preferably 0.5 N/20 mm or more, more preferably 1 N/20 mm to 20 N/20 mm, further preferably 2 N/20 mm to 20 N/20 mm, further preferably 4 N/20 mm to 20 N/mm. If it is within this range, for example, an adhesive sheet useful as a temporary fixing sheet used in the manufacture of electronic parts can be obtained. In this specification, the adhesion refers to the adhesion in a state where the adhesion is not reduced due to the expansion of the heat-expandable microspheres, and refers to the adhesion in a state where it has not undergone a thermal history of more than 40°C. The adhesive force refers to the adhesive force measured according to the method of JIS Z 0237:2009 (lamination conditions: 2 kg roller reciprocating once, peeling speed (stretching speed): 300 mm/min, peeling angle 180°).
將上述黏著片材之黏著劑層黏貼於聚對苯二甲酸乙二酯時之黏著力較佳為藉由加熱而降低至0.3 N/20 mm以下(較佳為0.2 N/20 mm以下、更佳為0.1 N/20 mm)。該加熱溫度較佳為70℃~300℃,更佳為100℃~280℃。When the adhesive layer of the adhesive sheet is adhered to polyethylene terephthalate, the adhesive force is preferably reduced to 0.3 N/20 mm or less (preferably 0.2 N/20 mm or less, more preferably 0.1 N/20 mm) by heating. The heating temperature is preferably 70°C to 300°C, more preferably 100°C to 280°C.
上述黏著片材可以進一步具備任意適當之其他層。於一個實施方式中,上述黏著片材還具備配置於黏著劑層與基材之間之底塗層。若具備底塗層,則能夠得到對於被黏著體之追隨性優異之黏著片材。又,包含熱膨脹性微球之黏著劑層若被加熱,則隨著熱膨脹性微球之膨脹,產生要於厚度方向上膨脹之變形,但利用底塗層抑制了向基材方向之變形,因此剝離性提高。又,可以於基材之與黏著劑層相反之一側具備其他黏著劑層,即,上述黏著片材可以依次具備黏著劑層、根據需要配置之底塗層、基材及其他黏著劑層。The adhesive sheet may further include any other appropriate layers. In one embodiment, the adhesive sheet also includes a primer layer disposed between the adhesive layer and the substrate. If the primer layer is provided, an adhesive sheet having excellent followability to an adherend can be obtained. Furthermore, if the adhesive layer including the heat-expandable microspheres is heated, the heat-expandable microspheres expand and deform in the thickness direction, but the primer layer suppresses the deformation in the direction of the substrate, thereby improving the releasability. Furthermore, another adhesive layer may be provided on the side of the substrate opposite to the adhesive layer, that is, the adhesive sheet may sequentially include an adhesive layer, a primer layer configured as needed, a substrate, and another adhesive layer.
上述黏著片材之厚度較佳為3 μm~300 μm,更佳為5 μm~150 μm,進而較佳為10 μm~100 μm。The thickness of the adhesive sheet is preferably 3 μm to 300 μm, more preferably 5 μm to 150 μm, and further preferably 10 μm to 100 μm.
上述黏著片材之全光線透過率較佳為70%以上,更佳為80%以上,進而較佳為85%以上,進而較佳為90%以上,特別較佳為95%以上。黏著片材脹之全光線透過率脹之上限例如為98%。上述黏著片材脹之霧度較佳為70%以下,更佳為60%以下,進而較佳為50%以下,特別較佳為40%以下,最佳為30%以下。黏著片材脹之霧度脹之下限例如為10%。The total light transmittance of the adhesive sheet is preferably 70% or more, more preferably 80% or more, further preferably 85% or more, further preferably 90% or more, and particularly preferably 95% or more. The upper limit of the total light transmittance of the adhesive sheet is, for example, 98%. The haze of the adhesive sheet is preferably 70% or less, more preferably 60% or less, further preferably 50% or less, particularly preferably 40% or less, and most preferably 30% or less. The lower limit of the haze of the adhesive sheet is, for example, 10%.
B. 黏著劑層上述黏著劑層包含熱膨脹性微球。實用上,黏著劑層還包含黏著劑。 B. Adhesive layer The adhesive layer includes heat-expandable microspheres. In practice, the adhesive layer also includes an adhesive.
上述黏著劑層之厚度較佳為1 μm~50 μm,更佳為3 μm~30 μm,進而較佳為5 μm~20 μm。若為此種範圍,則能夠得到即使藉由密封步驟時之加壓亦難以埋入半導體晶片之樹脂中之黏著片材。於一個實施方式中,上述黏著劑層之厚度為2 μm~15 μm。若為此種範圍,則可以適度地調整水分從黏著劑層散發,使密封樹脂前體具有良好之流動性。The thickness of the adhesive layer is preferably 1 μm to 50 μm, more preferably 3 μm to 30 μm, and further preferably 5 μm to 20 μm. If it is within this range, an adhesive sheet can be obtained that is difficult to be embedded in the resin of the semiconductor chip even by pressurization during the sealing step. In one embodiment, the thickness of the adhesive layer is 2 μm to 15 μm. If it is within this range, the water emanation from the adhesive layer can be appropriately adjusted to make the sealing resin precursor have good fluidity.
上述黏著劑層之25℃下之基於奈米壓痕法之彈性模數較佳為小於100 MPa,更佳為0.1 MPa~50 MPa,進而較佳為0.1 MPa~10 MPa。若為此種範圍,則能夠得到具有適當之黏著力之黏著片材。基於奈米壓痕法之彈性模數係指,於負載時、卸載時連續地測定將壓頭壓入試樣時對壓頭之負載載荷及壓入深度,由得到之負載載荷-壓入深度曲線求出之彈性模數。於本說明書中,基於奈米壓痕法之彈性模數係指將測定條件設為載荷:1 mN、負載·卸載速度:0.1 mN/s、保持時間:1s而以上述方式測得之彈性模數。The elastic modulus of the adhesive layer at 25°C based on the nanoindentation method is preferably less than 100 MPa, more preferably 0.1 MPa to 50 MPa, and further preferably 0.1 MPa to 10 MPa. If it is within this range, an adhesive sheet with appropriate adhesion can be obtained. The elastic modulus based on the nanoindentation method refers to the elastic modulus obtained from the load-indentation depth curve obtained by continuously measuring the load and the indentation depth of the indentation head when the indentation head is pressed into the sample during loading and unloading. In this specification, the elastic modulus based on the nanoindentation method refers to the elastic modulus measured in the above manner with the measurement conditions set as load: 1 mN, loading/unloading speed: 0.1 mN/s, and holding time: 1 s.
上述黏著劑層之全光線透過率較佳為70%以上,更佳為80%以上,更佳為85%以上,進而較佳為90%以上,特別較佳為95%以上。黏著劑層之全光線透過率之上限例如為98%。上述黏著劑層之霧度較佳為70%以下,更佳為60%以下,進而較佳為50%以下,特別較佳為40%以下,最佳為30%以下。黏著劑層之霧度之下限例如為10%。The total light transmittance of the adhesive layer is preferably 70% or more, more preferably 80% or more, more preferably 85% or more, further preferably 90% or more, and particularly preferably 95% or more. The upper limit of the total light transmittance of the adhesive layer is, for example, 98%. The haze of the adhesive layer is preferably 70% or less, more preferably 60% or less, further preferably 50% or less, particularly preferably 40% or less, and most preferably 30% or less. The lower limit of the haze of the adhesive layer is, for example, 10%.
B-1.熱膨脹性微球 作為上述熱膨脹性微球,只要能夠藉由加熱而膨脹至使黏著劑層表面產生凹凸之程度之微球,就可以使用任意適當之熱膨脹性微球。作為上述熱膨脹性微球,可以使用由殼及該殼內包含之揮發性物質(代表性的為有機溶劑)構成之微球。 B-1. Heat-expandable microspheres As the heat-expandable microspheres, any appropriate heat-expandable microspheres can be used as long as they can expand by heating to the extent that the adhesive layer surface is uneven. As the heat-expandable microspheres, microspheres composed of a shell and a volatile substance (typically an organic solvent) contained in the shell can be used.
上述熱膨脹性微球之發泡起始溫度為80℃以上,較佳為90℃~260℃,更佳為100℃~220℃,特別較佳為120℃~200℃,最佳為120℃~180℃。於一個實施方式中,上述熱膨脹性微球之發泡起始溫度為120℃以上。本發明即使使用發泡溫度高之熱膨脹性微球,於如上所述透明性優異之方面亦較為有利。於本說明書中,熱膨脹性微球開始膨脹之溫度相當於發泡起始溫度。更詳細而言,發泡起始溫度例如可以為黏著劑層之厚度因熱膨脹性微球之膨脹而開始變化之溫度。又,發泡起始溫度例如可以相當於黏著劑層之黏著力相對於該黏著劑層之常態黏著力(23℃下對PET薄膜之黏著力)達到10%以下之最低溫度。此時之黏著力係指根據基於JIS Z 0237:2000之方法(貼合條件:2 kg輥往復1次、剝離速度:300 mm/min、剝離角度180°)測定之黏著力。又,發泡起始溫度(及加熱後之測定樣品)下之黏著力於將測定樣品恢復至常溫(23℃)後進行測定。The foaming starting temperature of the above-mentioned heat-expandable microspheres is above 80°C, preferably 90°C to 260°C, more preferably 100°C to 220°C, particularly preferably 120°C to 200°C, and most preferably 120°C to 180°C. In one embodiment, the foaming starting temperature of the above-mentioned heat-expandable microspheres is above 120°C. Even if the present invention uses heat-expandable microspheres with a high foaming temperature, it is also advantageous in terms of excellent transparency as described above. In this specification, the temperature at which the heat-expandable microspheres begin to expand is equivalent to the foaming starting temperature. In more detail, the foaming starting temperature can be, for example, the temperature at which the thickness of the adhesive layer begins to change due to the expansion of the heat-expandable microspheres. In addition, the foaming start temperature may be, for example, the lowest temperature at which the adhesive force of the adhesive layer reaches 10% or less relative to the normal adhesive force of the adhesive layer (adhesion to PET film at 23°C). The adhesive force at this time refers to the adhesive force measured according to the method based on JIS Z 0237:2000 (lamination conditions: 2 kg roller reciprocating once, peeling speed: 300 mm/min, peeling angle 180°). In addition, the adhesive force at the foaming start temperature (and the measured sample after heating) is measured after the measured sample is restored to room temperature (23°C).
上述殼由樹脂構成。若使用樹脂,則能夠得到容易因加熱而軟化並膨脹之熱膨脹性微球。又,由樹脂形成之殼具有與黏著劑之密度接近之密度,因此對於在黏著劑層中容易以高均勻性分散之方面亦較為有利。於一個實施方式中,使用以(甲基)丙烯酸烷基酯(例如,(甲基)丙烯酸C1-20烷基酯)之一種或兩種以上作為單體成分而構成之丙烯酸系樹脂。The shell is made of resin. If resin is used, heat-expandable microspheres that are easily softened and expanded by heating can be obtained. In addition, the shell formed by the resin has a density close to that of the adhesive, so it is also advantageous in that it is easy to disperse with high uniformity in the adhesive layer. In one embodiment, an acrylic resin composed of one or more (meth) alkyl esters (e.g., (meth) alkyl esters of C1-20) is used as monomer components.
作為形成上述殼之樹脂,例如可使用具有源自可自由基聚合之單體之構成單元之樹脂。作為該單體,例如可以例舉:丙烯腈(折射率:1.391)、甲基丙烯腈(折射率:1.400)、α-氯丙烯腈、α-乙氧基丙烯腈、富馬酸腈等腈單體;丙烯酸(折射率:1.421)、甲基丙烯酸(折射率:1.431)、伊康酸、馬來酸、富馬酸、檸康酸等含羧基單體;偏二氯乙烯(折射率:1.426);乙酸乙烯酯;丙烯酸甲酯、甲基丙烯酸甲酯(折射率:1.414)、丙烯酸乙酯(折射率:1.406)、甲基丙烯酸乙酯、(甲基)丙烯酸正丁酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸第三丁酯,(甲基)丙烯酸異𦯉基酯、(甲基)丙烯酸環己酯、(甲基)丙烯酸苄酯、丙烯酸β-羧基乙酯、丙烯酸2-乙基己酯(折射率:1.436)、丙烯酸2-羥基乙酯(折射率:1.453)等(甲基)丙烯酸酯;苯乙烯、α-甲基苯乙烯、氯苯乙烯等苯乙烯單體;丙烯醯胺、取代丙烯醯胺、甲基丙烯醯胺、取代甲基丙烯醯胺等醯胺單體等。由該等單體構成之聚合物可以為均聚物,亦可以為共聚物。較佳為共聚物。As the resin forming the shell, for example, a resin having a constituent unit derived from a monomer capable of free radical polymerization can be used. Examples of the monomer include: nitrile monomers such as acrylonitrile (refractive index: 1.391), methacrylonitrile (refractive index: 1.400), α-chloroacrylonitrile, α-ethoxyacrylonitrile, and fumaric acid nitrile; carboxyl group-containing monomers such as acrylic acid (refractive index: 1.421), methacrylic acid (refractive index: 1.431), itaconic acid, maleic acid, fumaric acid, and citric acid; vinylidene chloride (refractive index: 1.426); vinyl acetate; methyl acrylate, methyl methacrylate (refractive index: 1.414), ethyl acrylate (refractive index: 1.406), methyl (Meth)acrylates such as ethyl acrylate, n-butyl (meth)acrylate, isobutyl (meth)acrylate, tert-butyl (meth)acrylate, isobutyl (meth)acrylate, cyclohexyl (meth)acrylate, benzyl (meth)acrylate, β-carboxyethyl acrylate, 2-ethylhexyl acrylate (refractive index: 1.436), 2-hydroxyethyl acrylate (refractive index: 1.453); styrene monomers such as styrene, α-methylstyrene, chlorostyrene; amide monomers such as acrylamide, substituted acrylamide, methacrylamide, substituted methacrylamide, etc. The polymer composed of these monomers may be a homopolymer or a copolymer. Preferably, it is a copolymer.
藉由構成樹脂之單體成分之組成,能夠調整形成上述殼之樹脂之折射率。The refractive index of the resin forming the shell can be adjusted by the composition of the monomer components constituting the resin.
構成上述殼之樹脂之折射率較佳為1.30~1.50,更佳為1.35~1.45,進而較佳為1.38~1.42,進而較佳為1.39~1.42,特別較佳為1.40~1.42。若使構成殼之樹脂之折射率為此種範圍並同時調整黏著劑之基礎聚合物之折射率,則能夠降低黏著劑層內之可見光之漫反射,形成透明性優異之黏著性層。The refractive index of the resin constituting the shell is preferably 1.30 to 1.50, more preferably 1.35 to 1.45, further preferably 1.38 to 1.42, further preferably 1.39 to 1.42, and particularly preferably 1.40 to 1.42. If the refractive index of the resin constituting the shell is within this range and the refractive index of the base polymer of the adhesive is adjusted at the same time, the diffuse reflection of visible light in the adhesive layer can be reduced, forming an adhesive layer with excellent transparency.
於一個實施方式中,形成殼之樹脂包含源自含羧基單體之構成單元。若使用包含源自含羧基單體之構成單元之樹脂,則能夠形成具有與黏著劑層中之黏著劑親和性高之殼之熱膨脹性微球。具有與黏著劑親和性高之殼之熱膨脹性微球不易凝聚,可適宜地分散於黏著劑層中。包含此種熱膨脹性微球之黏著劑層之光之漫反射受到抑制,從而透明性優異。又,若使用含羧基單體,則形成殼之樹脂之折射率調整變得容易。又,能夠形成即使於高溫下亦較佳地具有黏彈性之黏著劑層,即耐熱性優異(發泡溫度高)之黏著劑層。In one embodiment, the resin forming the shell includes a constituent unit derived from a carboxyl-containing monomer. If a resin including a constituent unit derived from a carboxyl-containing monomer is used, a heat-expandable microsphere having a shell with high affinity to the adhesive in the adhesive layer can be formed. The heat-expandable microsphere having a shell with high affinity to the adhesive is not easy to agglomerate and can be appropriately dispersed in the adhesive layer. The diffuse reflection of light of the adhesive layer including such heat-expandable microspheres is suppressed, thereby having excellent transparency. In addition, if a carboxyl-containing monomer is used, the refractive index of the resin forming the shell can be easily adjusted. In addition, an adhesive layer having preferably viscoelastic properties even at high temperatures, that is, an adhesive layer having excellent heat resistance (high foaming temperature) can be formed.
形成上述殼之樹脂中,源自含羧基單體之構成單元之含有比例相對於該樹脂100 mol,較佳為10 mol%~50 mol%,更佳為15 mol%~45 mol%,進而較佳為21 mol%~36 mol%。若為此種範圍,則上述效果變得顯著。又,能夠得到具有較佳地調節了折射率之殼之熱膨脹性微球。源自含羧基單體之構成單元之含有比例過多時,有可能難以加熱膨脹。In the resin forming the shell, the content of the constituent unit derived from the carboxyl group-containing monomer is preferably 10 mol% to 50 mol%, more preferably 15 mol% to 45 mol%, and further preferably 21 mol% to 36 mol% relative to 100 mol of the resin. Within this range, the above effect becomes significant. In addition, a heat-expandable microsphere having a shell with a well-adjusted refractive index can be obtained. When the content of the constituent unit derived from the carboxyl group-containing monomer is too high, it may be difficult to expand by heating.
於一個實施方式中,形成殼之樹脂包含源自甲基丙烯酸之構成單元。若使用包含源自甲基丙烯酸之構成單元之樹脂,則能夠形成具有與黏著劑層中之黏著劑親和性高之殼之熱膨脹性微球。又,甲基丙烯酸與構成樹脂之其他單體之反應性優異,因此若使用甲基丙烯酸,則該樹脂之折射率調整變得容易。In one embodiment, the resin forming the shell includes a constituent unit derived from methacrylic acid. If a resin including a constituent unit derived from methacrylic acid is used, a thermally expandable microsphere having a shell with high affinity for the adhesive in the adhesive layer can be formed. In addition, methacrylic acid has excellent reactivity with other monomers constituting the resin, so if methacrylic acid is used, the refractive index of the resin becomes easy to adjust.
形成上述殼之樹脂中,源自甲基丙烯酸之構成單元之含有比例相對於該樹脂100 mol,較佳為10 mol%~50 mol%,更佳為15 mol%~45 mol%,進而較佳為18 mol%~40 mol%。若為此種範圍,則上述效果變得顯著。In the resin forming the shell, the content of the constituent units derived from methacrylic acid is preferably 10 mol% to 50 mol%, more preferably 15 mol% to 45 mol%, and further preferably 18 mol% to 40 mol%, based on 100 mol of the resin. Within this range, the above-mentioned effect becomes remarkable.
形成上述殼之樹脂之sp值較佳為10.0(cal/cm 3) 1/2~15.0(cal/cm 3) 1/2,更佳為12.0(cal/cm 3) 1/2~14.0(cal/cm 3) 1/2,更佳為12.5(cal/cm 3) 1/2~14.0(cal/cm 3) 1/2。若為此種範圍,則能夠使上述熱膨脹性微球較佳地分散於黏著劑層中。結果,能夠形成透明性優異之黏著劑層。sp值藉由Fedors之方法(山本秀樹著,「sp值 基礎·應用與計算方法」,股份有限公司信息機構出版,2006年4月3日發行,66~67頁)求出。具體而言,該sp值由形成聚合物之各原子或原子團於25℃下之蒸發能量Δe(cal)與形成聚合物之各原子或原子團於25℃下之莫耳體積ΔV(cm3)藉由下式算出。於聚合物為共聚物之情形時,其sp值如下算出:算出構成該共聚物之各構成單元各自之均聚物之sp值,將該等sp值分別乘以各構成單元之莫耳分數而得之值相加而算出。 sp值=(ΣΔe/ΣΔv) 1/2 The sp value of the resin forming the shell is preferably 10.0 (cal/cm 3 ) 1/2 to 15.0 (cal/cm 3 ) 1/2 , more preferably 12.0 (cal/cm 3 ) 1/2 to 14.0 (cal/cm 3 ) 1/2 , and even more preferably 12.5 (cal/cm 3 ) 1/2 to 14.0 (cal/cm 3 ) 1/2 . Within this range, the thermally expandable microspheres can be dispersed preferably in the adhesive layer. As a result, an adhesive layer with excellent transparency can be formed. The sp value is determined by the Fedors method (Hideki Yamamoto, "The Fundamentals of sp Value, Applications and Calculation Methods", Information Organization Co., Ltd., published on April 3, 2006, pages 66-67). Specifically, the sp value is calculated from the evaporation energy Δe (cal) of each atom or atomic group forming the polymer at 25°C and the molar volume ΔV (cm3) of each atom or atomic group forming the polymer at 25°C by the following formula. In the case where the polymer is a copolymer, its sp value is calculated as follows: Calculate the sp value of the homopolymer of each constituent unit constituting the copolymer, and add the values obtained by multiplying the sp values by the molar fraction of each constituent unit. sp value = (ΣΔe/ΣΔv) 1/2
上述殼之厚度較佳為15 μm以下,更佳為7 μm以下,進而較佳為5 μm以下,特別較佳為4 μm以下。又,上述殼之厚度之下限較佳為1 μm以上,更佳為2 μm以上。若為此種範圍,則能夠製成不易被意外之外力等破壞之熱膨脹性微球。進而,藉由將殼之厚度之上下限設為上述範圍,能夠降低發泡時之溫度之偏差。The thickness of the shell is preferably 15 μm or less, more preferably 7 μm or less, further preferably 5 μm or less, and particularly preferably 4 μm or less. Furthermore, the lower limit of the thickness of the shell is preferably 1 μm or more, more preferably 2 μm or more. If it is within this range, it is possible to produce thermally expandable microspheres that are not easily destroyed by unexpected external forces. Furthermore, by setting the upper and lower limits of the thickness of the shell to the above range, the deviation of the temperature during foaming can be reduced.
上述殼內包含之揮發性物質代表性的為有機溶劑。作為該有機溶劑,例如可例舉:丙烷、環丙烷、丁烷、環丁烷、異丁烷、戊烷、環戊烷、新戊烷、異戊烷、己烷、環己烷、2-甲基戊烷、2,2-二甲基丁烷、庚烷、環庚烷、辛烷、環辛烷、甲基庚烷類、三甲基戊烷類等僅由氫原子及碳原子構成之烴類;C 3F 7OCH 3、C 4F 9OCH 3、C 4F 9OC 2H 5等氫氟醚類等。該等有機溶劑可以僅使用1種,亦可以組合使用2種以上。 The volatile substance contained in the shell is typically an organic solvent. Examples of the organic solvent include: hydrocarbons consisting only of hydrogen atoms and carbon atoms such as propane, cyclopropane, butane, cyclobutane, isobutane, pentane, cyclopentane, neopentane, isopentane, hexane, cyclohexane, 2-methylpentane, 2,2-dimethylbutane, heptane, cycloheptane, octane, cyclooctane, methylheptanes, trimethylpentanes, etc.; and hydrofluoroethers such as C 3 F 7 OCH 3 , C 4 F 9 OCH 3 , C 4 F 9 OC 2 H 5 , etc. These organic solvents may be used alone or in combination of two or more.
上述有機溶劑之含有比例相對於熱膨脹性微球之加熱前重量,較佳為5重量%~35重量%,更佳為10重量%~30重量%。若為此種範圍,則能夠得到熱膨脹性微球於黏著劑層中以高均勻性分散之黏著帶。含有比例未達5重量%時,由於密度低等理由,於黏著劑層製造中,熱膨脹微性微球容易偏集分佈於黏著劑層表面,加熱後有可能於黏著劑層表面產生過大之凸凹。含有比例超過35重量%時,密度高,從而於黏著劑層內沉降,即使加熱,亦無法於黏著劑層表面形成充分之凹凸,有可能得不到期望之剝離性,又,亦有可能產生殘膠。The content ratio of the above-mentioned organic solvent relative to the weight of the heat-expandable microspheres before heating is preferably 5% by weight to 35% by weight, and more preferably 10% by weight to 30% by weight. If it is within this range, an adhesive tape in which the heat-expandable microspheres are dispersed in the adhesive layer with high uniformity can be obtained. When the content ratio is less than 5% by weight, due to reasons such as low density, the heat-expandable microspheres are easily concentrated and distributed on the surface of the adhesive layer during the manufacture of the adhesive layer, and excessive unevenness may be generated on the surface of the adhesive layer after heating. When the content exceeds 35% by weight, the density is high, so it settles in the adhesive layer. Even if heated, sufficient concavity and convexity cannot be formed on the surface of the adhesive layer, and the desired releasability may not be obtained. In addition, adhesive residue may be generated.
上述熱膨脹性微球之加熱前之粒徑較佳為0.5 μm~80 μm,更佳為5 μm~45 μm,進而較佳為10 μm~20 μm,特別較佳為10 μm~15 μm。因此,上述熱膨脹性微球之加熱前之顆粒尺寸就平均粒徑而言,較佳為6 μm~45 μm,更佳為15 μm~35 μm。上述粒徑與平均粒徑係藉由雷射散射法中之粒度分佈測定法而求出之值。The particle size of the heat-expandable microspheres before heating is preferably 0.5 μm to 80 μm, more preferably 5 μm to 45 μm, further preferably 10 μm to 20 μm, and particularly preferably 10 μm to 15 μm. Therefore, the particle size of the heat-expandable microspheres before heating is preferably 6 μm to 45 μm, more preferably 15 μm to 35 μm in terms of average particle size. The particle size and average particle size are values obtained by the particle size distribution measurement method in the laser scattering method.
上述熱膨脹性微球較佳為具有直至體積膨脹率成為較佳為5倍以上、更佳為7倍以上、進而較佳為10倍以上為止不破裂之適度強度。於使用此種熱膨脹性微球之情形時,可以藉由加熱處理來高效地降低黏著力。The heat-expandable microspheres preferably have a moderate strength that does not break until the volume expansion rate becomes preferably 5 times or more, more preferably 7 times or more, and further preferably 10 times or more. When such heat-expandable microspheres are used, the adhesive force can be effectively reduced by heat treatment.
上述黏著劑層中之熱膨脹性微球之含有比例可以根據期望之黏著力之降低性等進行適當設定。熱膨脹性微球之含有比例相對於形成黏著劑層之基礎聚合物100重量份,例如為1重量份~150重量份,較佳為10重量份~130重量份,進而較佳為25重量份~100重量份。The content of the heat-expandable microspheres in the adhesive layer can be appropriately set according to the desired adhesive force reduction, etc. The content of the heat-expandable microspheres is, for example, 1 to 150 parts by weight, preferably 10 to 130 parts by weight, and further preferably 25 to 100 parts by weight, relative to 100 parts by weight of the base polymer forming the adhesive layer.
熱膨脹性微球膨脹前(即加熱前)之黏著劑層之算術表面粗糙度Ra較佳為500 nm以下,更佳為400 nm以下,進而較佳為300 nm以下。若為此種範圍,則能夠得到對被黏著體之密接性優異之黏著片材。The arithmetic surface roughness Ra of the adhesive layer before the thermally expandable microspheres are expanded (i.e., before being heated) is preferably 500 nm or less, more preferably 400 nm or less, and further preferably 300 nm or less. Within this range, an adhesive sheet having excellent adhesion to an adherend can be obtained.
上述黏著劑層較佳為包含由80℃下之動態儲存模數為5 kPa~1 MPa(更佳為10 kPa~0.8 MPa)之範圍之基礎聚合物構成之黏著劑。若為此種黏著劑層,則可以形成於加熱前具有適度之黏著性、黏著力容易因加熱而降低之黏著片材。再者,動態儲存模數可以使用動態黏彈性測定裝置(例如Rheometrics公司製之商品名「ARES」),於頻率1 Hz、升溫速度10℃/分鐘之測定條件下進行測定。The above-mentioned adhesive layer is preferably an adhesive composed of a base polymer having a dynamic storage modulus at 80°C in the range of 5 kPa to 1 MPa (more preferably 10 kPa to 0.8 MPa). If it is such an adhesive layer, an adhesive sheet having moderate adhesiveness before heating and whose adhesiveness is easily reduced by heating can be formed. Furthermore, the dynamic storage modulus can be measured using a dynamic viscoelasticity measuring device (e.g., the product name "ARES" manufactured by Rheometrics) under the measuring conditions of a frequency of 1 Hz and a heating rate of 10°C/minute.
上述熱膨脹性微球可以藉由任意適當之方法來製造。於一個實施方式中,上述熱膨脹性微球藉由懸浮聚合法得到。懸浮聚合通常如下進行:使單體(殼形成材料)及有機溶劑分散於含有分散劑之水系分散介質中,於有機溶劑之存在下使單體聚合。又,亦可以利用使分散穩定之分散穩定劑。作為水系分散介質中之分散穩定劑,例如可以例舉二氧化矽、氫氧化鎂、磷酸鈣、氫氧化鋁等無機微粒等。又,作為分散穩定助劑,例如可以使用二乙醇胺與脂肪族二羧酸之縮合產物、聚乙烯吡咯啶酮、甲基纖維素、聚環氧乙烷、聚乙烯醇、各種乳化劑等。The above-mentioned heat-expandable microspheres can be manufactured by any appropriate method. In one embodiment, the above-mentioned heat-expandable microspheres are obtained by suspension polymerization. Suspension polymerization is usually carried out as follows: a monomer (shell forming material) and an organic solvent are dispersed in an aqueous dispersion medium containing a dispersant, and the monomer is polymerized in the presence of an organic solvent. In addition, a dispersion stabilizer for stabilizing the dispersion can also be used. Examples of the dispersion stabilizer in the aqueous dispersion medium include inorganic particles such as silicon dioxide, magnesium hydroxide, calcium phosphate, and aluminum hydroxide. Furthermore, as the dispersion stabilizing aid, for example, a condensation product of diethanolamine and aliphatic dicarboxylic acid, polyvinyl pyrrolidone, methyl cellulose, polyethylene oxide, polyvinyl alcohol, various emulsifiers, etc. can be used.
藉由上述懸浮聚合之聚合條件、混合成分之種類、添加量等,可以控制粒徑、有機溶劑之含量等熱膨脹性微球之特性。例如,藉由減少分散劑之添加量、減慢聚合時之攪拌速度等操作,能夠得到大粒徑之熱膨脹性微球。又,若增多單體之調配量、減慢聚合時之攪拌速度,則能夠得到殼之厚度厚之熱膨脹性微球。The properties of the heat-expandable microspheres such as particle size and organic solvent content can be controlled by the above-mentioned suspension polymerization conditions, the types of mixed components, and the amount of addition. For example, by reducing the amount of dispersant added and slowing down the stirring speed during polymerization, heat-expandable microspheres with large particle sizes can be obtained. In addition, if the amount of monomers added is increased and the stirring speed during polymerization is slowed down, heat-expandable microspheres with thick shells can be obtained.
B-2.黏著劑 作為構成上述黏著劑層之黏著劑,只要能夠得到本發明之效果,則可以使用任意適當之黏著劑。作為上述黏著劑,例如可以例舉丙烯酸系黏著劑、聚矽氧系黏著劑、乙烯基烷基醚系黏著劑、聚酯系黏著劑、聚醯胺系黏著劑、胺基甲酸酯系黏著劑、氟系黏著劑、苯乙烯-二烯嵌段共聚物系黏著劑、活性能量射線固化型黏著劑等。其中,較佳為丙烯酸系黏著劑、橡膠系黏著劑或聚矽氧系黏著劑,更佳為丙烯酸系黏著劑。 B-2. Adhesive As the adhesive constituting the above-mentioned adhesive layer, any appropriate adhesive can be used as long as the effect of the present invention can be obtained. As the above-mentioned adhesive, for example, acrylic adhesive, silicone adhesive, vinyl alkyl ether adhesive, polyester adhesive, polyamide adhesive, urethane adhesive, fluorine adhesive, styrene-diene block copolymer adhesive, active energy ray curing adhesive, etc. can be cited. Among them, acrylic adhesive, rubber adhesive or silicone adhesive is preferred, and acrylic adhesive is more preferred.
上述基礎聚合物之折射率較佳為1.30~1.50,更佳為1.35~1.46,進而較佳為1.38~1.43,特別較佳為1.39~1.42。若為此種範圍,則能夠減少黏著劑層內之可見光之漫反射、形成透明性優異之黏著性層。The refractive index of the base polymer is preferably 1.30 to 1.50, more preferably 1.35 to 1.46, further preferably 1.38 to 1.43, and particularly preferably 1.39 to 1.42. Within this range, diffuse reflection of visible light in the adhesive layer can be reduced, and an adhesive layer with excellent transparency can be formed.
於一個實施方式中,黏著劑中之基礎聚合物(較佳為丙烯酸系聚合物)包含源自含羥基單體之構成單元及/或源自含羧基單體之構成單元。若使用此種基礎聚合物,則能夠容易地得到較佳地調整了折射率之黏著劑層。又,若使用此種基礎聚合物,則能夠使上述熱膨脹性微球較佳地分散於黏著劑層中。結果,能夠形成透明性優異之黏著劑層。In one embodiment, the base polymer (preferably an acrylic polymer) in the adhesive contains constituent units derived from hydroxyl-containing monomers and/or constituent units derived from carboxyl-containing monomers. If such a base polymer is used, an adhesive layer with a better adjusted refractive index can be easily obtained. In addition, if such a base polymer is used, the above-mentioned thermal expansion microspheres can be better dispersed in the adhesive layer. As a result, an adhesive layer with excellent transparency can be formed.
上述基礎聚合物中,源自含羥基單體之構成單元之含有比例相對於該基礎聚合物100 mol,較佳為1 mol%~20 mol%,更佳為2 mol%~10 mol%。若為此種範圍,則上述效果變得顯著。又,能夠得到具有較佳地調節了折射率之殼之熱膨脹性微球。In the above base polymer, the content ratio of the constituent unit derived from the hydroxyl group-containing monomer is preferably 1 mol% to 20 mol%, more preferably 2 mol% to 10 mol%, relative to 100 mol of the base polymer. Within this range, the above effect becomes significant. In addition, a thermally expandable microsphere having a shell with a well-adjusted refractive index can be obtained.
上述基礎聚合物中,源自含羧基單體之構成單元之含有比例相對於該基礎聚合物100 mol,較佳為1 mol%~20 mol%,更佳為2 mol%~10 mol%。若為此種範圍,則上述效果變得顯著。又,能夠得到具有較佳地調節了折射率之殼之熱膨脹性微球。In the above-mentioned base polymer, the content ratio of the constituent unit derived from the carboxyl group-containing monomer is preferably 1 mol% to 20 mol%, and more preferably 2 mol% to 10 mol%, relative to 100 mol of the base polymer. Within this range, the above-mentioned effect becomes significant. In addition, a thermally expandable microsphere having a shell with a well-adjusted refractive index can be obtained.
具有羥基之上述基礎聚合物之羥值較佳為0~50,更佳為20~30。又,具有羧基之上述基礎聚合物之酸值較佳為10~100,更佳為20~50。若使用具有此種範圍之羥值、酸值之基礎聚合物,則能夠使上述熱膨脹性微球較佳地分散於黏著劑層中。結果,能夠形成透明性優異之黏著劑層。再者,黏著劑層中聚合物之羥值及酸值能夠藉由提取黏著劑層中之溶劑可溶成分來進行測定。具體而言,可以藉由以下之方法提取溶劑可溶成分。 (i)將黏著劑層投入溶劑中,製備使黏著劑層中之溶劑可溶成分溶解於上述溶劑中之溶液試樣。 作為溶劑,考慮極性等,可以使用選自氯仿(CHCl 3)、二氯甲烷(CH 2Cl 2)、四氫呋喃(THF)、丙酮、二甲基亞碸(DMSO)、N,N-二甲基甲醯胺(DMF)、甲醇、乙醇、甲苯及水等中之任意1種溶劑或以任意比率包含選自其中之2種以上之混合溶劑。 典型的是,於黏著劑層0.2 g左右中加入溶劑30 mL左右,於從室溫到所使用之溶劑之沸點左右之溫度範圍內攪拌30分鐘~12小時左右。根據需要,例如於分析對象成分之提取效率低之情形時等,可以於分取上述溶液後之試樣中重新加入與分取之溶液大致等量之溶劑並攪拌,分取該溶液,將該操作重複1次或多次來製備溶液試樣。 (ii)可以藉由蒸發等方法從上述溶液試樣中除去溶劑,取出溶劑可溶性聚合物。 再者,溶劑可溶性聚合物中有時包含未反應交聯劑之低分子量成分等不成為測定對象之溶劑可溶成分。此時,使用將上述溶液試樣投入僅聚合物成分不溶之溶劑中之方法(再沉澱法)、藉由使用上述溶液試樣之凝膠過濾層析法進行分子量分離(製備液相層析法)等,製備僅由測定對象組成之溶劑可溶性聚合物。 The hydroxyl value of the above-mentioned base polymer having a hydroxyl group is preferably 0 to 50, and more preferably 20 to 30. Furthermore, the acid value of the above-mentioned base polymer having a carboxyl group is preferably 10 to 100, and more preferably 20 to 50. If a base polymer having a hydroxyl value and an acid value within such a range is used, the above-mentioned thermally expandable microspheres can be better dispersed in the adhesive layer. As a result, an adhesive layer having excellent transparency can be formed. Furthermore, the hydroxyl value and acid value of the polymer in the adhesive layer can be measured by extracting the solvent-soluble components in the adhesive layer. Specifically, the solvent-soluble components can be extracted by the following method. (i) The adhesive layer is placed in a solvent to prepare a solution sample in which the solvent-soluble components in the adhesive layer are dissolved in the above solvent. As the solvent, any one solvent selected from chloroform (CHCl 3 ), dichloromethane (CH 2 Cl 2 ), tetrahydrofuran (THF), acetone, dimethyl sulfoxide (DMSO), N,N-dimethylformamide (DMF), methanol, ethanol, toluene and water or a mixed solvent containing two or more selected therefrom in any ratio can be used, taking into account polarity, etc. Typically, about 30 mL of the solvent is added to about 0.2 g of the adhesive layer, and the mixture is stirred at a temperature ranging from room temperature to about the boiling point of the solvent used for about 30 minutes to 12 hours. If necessary, for example, when the extraction efficiency of the component to be analyzed is low, a solvent in an amount substantially equal to that of the aliquoted solution may be added to the sample after the aliquoted solution is aliquoted, stirred, and the solution may be aliquoted. This operation may be repeated once or more to prepare a solution sample. (ii) The solvent may be removed from the solution sample by evaporation or the like to extract a solvent-soluble polymer. In addition, the solvent-soluble polymer may contain solvent-soluble components such as low molecular weight components of the unreacted crosslinking agent that are not the target of the measurement. In this case, a solvent-soluble polymer consisting only of the target of the measurement may be prepared by immersing the solution sample in a solvent in which only the polymer component is insoluble (reprecipitation method), performing molecular weight separation by gel filtration chromatography using the solution sample (preparative liquid chromatography method), or the like.
上述基礎聚合物之sp值較佳為10.0(cal/cm 3) 1/2~15.0(cal/cm 3) 1/2,更佳為10.0(cal/cm 3) 1/2~14.0(cal/cm 3) 1/2,更佳為10.0(cal/cm 3) 1/2~12.0(cal/cm 3) 1/2。若為此種範圍,則能夠使上述熱膨脹性微球較佳地分散於黏著劑層中。結果,能夠形成透明性優異之黏著劑層。 The sp value of the base polymer is preferably 10.0 (cal/cm 3 ) 1/2 to 15.0 (cal/cm 3 ) 1/2 , more preferably 10.0 (cal/cm 3 ) 1/2 to 14.0 (cal/cm 3 ) 1/2 , and even more preferably 10.0 (cal/cm 3 ) 1/2 to 12.0 (cal/cm 3 ) 1/2 . Within this range, the thermally expandable microspheres can be preferably dispersed in the adhesive layer. As a result, an adhesive layer with excellent transparency can be formed.
(丙烯酸系黏著劑) 作為上述丙烯酸系黏著劑,例如可以例舉:將使用1種或2種以上(甲基)丙烯酸烷基酯作為單體成分之丙烯酸系聚合物(均聚物或共聚物)作為基礎聚合物之丙烯酸系黏著劑等。作為(甲基)丙烯酸烷基酯之具體例,可以例舉:(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸丙酯、(甲基)丙烯酸異丙酯、(甲基)丙烯酸丁酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸第二丁酯、(甲基)丙烯酸第三丁酯、(甲基)丙烯酸戊酯、(甲基)丙烯酸己酯、(甲基)丙烯酸庚酯、(甲基)丙烯酸辛酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸異辛酯、(甲基)丙烯酸壬酯、(甲基)丙烯酸異壬酯、(甲基)丙烯酸癸酯、(甲基)丙烯酸異癸酯、(甲基)丙烯酸十一烷基酯、(甲基)丙烯酸十二烷基酯、(甲基)丙烯酸十三烷基酯、(甲基)丙烯酸十四烷基酯、(甲基)丙烯酸十五烷基酯、(甲基)丙烯酸十六烷基酯、(甲基)丙烯酸十七烷基酯、(甲基)丙烯酸十八烷基酯、(甲基)丙烯酸十九烷基酯、(甲基)丙烯酸二十烷基酯等(甲基)丙烯酸C1-20烷基酯。其中,可以較佳地使用具有碳原子數為4~18之直鏈狀或支鏈狀之烷基之(甲基)丙烯酸烷基酯。 (Acrylic adhesive) As the above-mentioned acrylic adhesive, for example, there can be cited: an acrylic adhesive using an acrylic polymer (homopolymer or copolymer) as a base polymer using one or more (meth) alkyl esters of acrylic acid as monomer components. Specific examples of (meth) alkyl esters of acrylic acid include: methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, isopropyl (meth) acrylate, butyl (meth) acrylate, isobutyl (meth) acrylate, sec-butyl (meth) acrylate, tert-butyl (meth) acrylate, pentyl (meth) acrylate, hexyl (meth) acrylate, heptyl (meth) acrylate, octyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, isooctyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, 1-oct ... Nonyl (meth)acrylate, isononyl (meth)acrylate, decyl (meth)acrylate, isodecyl (meth)acrylate, undecyl (meth)acrylate, dodecyl (meth)acrylate, tridecyl (meth)acrylate, tetradecyl (meth)acrylate, pentadecyl (meth)acrylate, hexadecyl (meth)acrylate, heptadecyl (meth)acrylate, octadecyl (meth)acrylate, nonadecyl (meth)acrylate, eicosyl (meth)acrylate and the like C1-20 alkyl (meth)acrylates. Among them, alkyl (meth)acrylates having a linear or branched alkyl group with 4 to 18 carbon atoms can be preferably used.
於一個實施方式中,上述丙烯酸系聚合物包含源自均聚物之玻璃轉移溫度(Tg)為80℃以上(較佳為90℃以上、進而較佳為100℃以上)之單體之構成單元。若使用此種聚合物,則能夠形成具有適度之彈性模數之黏著劑層。作為該單體,例如可以例舉:甲基丙烯酸環己酯(Tg:83℃)、丙烯酸二環戊酯(Tg:120℃)、甲基丙烯酸二環戊酯(Tg:175℃)、丙烯酸異𦯉基酯(Tg:94℃)、甲基丙烯酸異𦯉基酯(Tg:150℃)、甲基丙烯酸第三丁酯(Tg:118℃)、甲基丙烯酸甲酯(Tg:105℃)、三羥甲基丙烷三丙烯酸酯(Tg:>250℃)、苯乙烯(Tg:80℃)、丙烯腈(Tg:97℃)、N-丙烯醯基嗎啉(Tg:145℃)等。其中,較佳為甲基丙烯酸甲酯。相對於基礎聚合物(丙烯酸系聚合物)100重量份,源自均聚物之玻璃轉移溫度(Tg)為80℃以上之單體之構成單元之含有比例較佳為1重量份~20重量份,更佳為1重量份~10重量份。In one embodiment, the acrylic polymer comprises a constituent unit derived from a monomer having a homopolymer glass transition temperature (Tg) of 80° C. or higher (preferably 90° C. or higher, and further preferably 100° C. or higher). When such a polymer is used, an adhesive layer having a moderate elastic modulus can be formed. Examples of the monomer include cyclohexyl methacrylate (Tg: 83°C), dicyclopentyl acrylate (Tg: 120°C), dicyclopentyl methacrylate (Tg: 175°C), isobutyl acrylate (Tg: 94°C), isobutyl methacrylate (Tg: 150°C), tert-butyl methacrylate (Tg: 118°C), methyl methacrylate (Tg: 105°C), trihydroxymethylpropane triacrylate (Tg: >250°C), styrene (Tg: 80°C), acrylonitrile (Tg: 97°C), and N-acryloylmorpholine (Tg: 145°C). Among them, methyl methacrylate is preferred. The content ratio of the constituent units derived from the monomer having a glass transition temperature (Tg) of 80° C. or higher in the homopolymer is preferably 1 to 20 parts by weight, more preferably 1 to 10 parts by weight, relative to 100 parts by weight of the base polymer (acrylic polymer).
出於凝集力、耐熱性、交聯性等之改性之目的,上述丙烯酸系聚合物可以根據需要包含與能夠與上述(甲基)丙烯酸烷基酯共聚之其他單體對應之單元。作為此種單體,例如可以例舉:丙烯酸、甲基丙烯酸、丙烯酸羧基乙酯、丙烯酸羧基戊酯、伊康酸、馬來酸、富馬酸、巴豆酸等含羧基單體;馬來酸酐、伊康酸酐等酸酐單體;(甲基)丙烯酸羥基乙酯、(甲基)丙烯酸羥基丙酯、(甲基)丙烯酸羥基丁酯、(甲基)丙烯酸羥基己酯、(甲基)丙烯酸羥基辛酯、(甲基)丙烯酸羥基癸酯、(甲基)丙烯酸羥基月桂酯、甲基丙烯酸(4-羥基甲基環己基)甲酯等含羥基單體;苯乙烯磺酸、烯丙基磺酸、2-(甲基)丙烯醯胺-2-甲基丙磺酸、(甲基)丙烯醯胺丙磺酸、(甲基)丙烯酸磺丙酯、(甲基)丙烯醯氧基萘磺酸等含磺酸基單體;(甲基)丙烯醯胺、N,N-二甲基(甲基)丙烯醯胺、N-丁基(甲基)丙烯醯胺、N-羥甲基(甲基)丙烯醯胺、N-羥甲基丙烷(甲基)丙烯醯胺等(N-取代)醯胺系單體;(甲基)丙烯酸胺基乙酯、(甲基)丙烯酸N,N-二甲基胺基乙酯、(甲基)丙烯酸第三丁基胺基乙酯等(甲基)丙烯酸胺基烷基酯類單體;(甲基)丙烯酸甲氧基乙酯、(甲基)丙烯酸乙氧基乙酯等(甲基)丙烯酸烷氧基烷基酯類單體;N-環己基馬來醯亞胺、N-異丙基馬來醯亞胺、N-月桂基馬來醯亞胺、N-苯基馬來醯亞胺等馬來醯亞胺系單體;N-甲基伊康醯亞胺、N-乙基伊康醯亞胺、N-丁基伊康醯亞胺、N-辛基伊康醯亞胺、N-2-乙基己基伊康醯亞胺、N-環己基伊康醯亞胺、N-月桂基伊康醯亞胺等伊康醯亞胺系單體;N-(甲基)丙烯醯氧基亞甲基琥珀醯亞胺、N-(甲基)丙烯醯基-6-氧六亞甲基琥珀醯亞胺、N-(甲基)丙烯醯基-8-氧八亞甲基琥珀醯亞胺等琥珀醯亞胺系單體;乙酸乙烯酯、丙酸乙烯酯、N-乙烯基吡咯啶酮、甲基乙烯基吡咯啶酮、乙烯基吡啶、乙烯基哌啶酮、乙烯基嘧啶、乙烯基哌嗪、乙烯基吡嗪、乙烯基吡咯、乙烯基咪唑、乙烯基㗁唑、乙烯基嗎啉、N-乙烯基羧酸醯胺類、苯乙烯、α-甲基苯乙烯、N-乙烯基己內醯胺等乙烯基系單體;丙烯腈、甲基丙烯腈等氰基丙烯酸酯單體;(甲基)丙烯酸縮水甘油酯等含環氧基之丙烯酸系單體;(甲基)丙烯酸聚乙二醇酯、(甲基)丙烯酸聚丙二醇酯、(甲基)丙烯酸甲氧基乙二醇酯、(甲基)丙烯酸甲氧基聚丙二醇酯等二醇系丙烯酸酯單體;(甲基)丙烯酸四氫糠酯、氟(甲基)丙烯酸酯、聚矽氧(甲基)丙烯酸酯等具有雜環、鹵素原子、矽原子等之丙烯酸酯系單體;己二醇二(甲基)丙烯酸酯、(聚)乙二醇二(甲基)丙烯酸酯、(聚)丙二醇二(甲基)丙烯酸酯、新戊二醇二(甲基)丙烯酸酯、季戊四醇二(甲基)丙烯酸酯、三羥甲基丙烷三(甲基)丙烯酸酯、季戊四醇三(甲基)丙烯酸酯、二季戊四醇六(甲基)丙烯酸酯、環氧丙烯酸酯、聚酯丙烯酸酯、胺基甲酸酯丙烯酸酯等多官能單體;異戊二烯、丁二烯、異丁烯等烯烴系單體;乙烯基醚等乙烯基醚系單體等。該等單體可以單獨使用或組合使用2種以上。For the purpose of modifying cohesive force, heat resistance, crosslinking property, etc., the acrylic polymer may contain units corresponding to other monomers copolymerizable with the alkyl (meth)acrylate as required. Examples of such monomers include: carboxyl group-containing monomers such as acrylic acid, methacrylic acid, carboxyethyl acrylate, carboxypentyl acrylate, itaconic acid, maleic acid, fumaric acid, and crotonic acid; acid anhydride monomers such as maleic anhydride and itaconic anhydride; hydroxyethyl (meth)acrylate, hydroxypropyl (meth)acrylate, hydroxybutyl (meth)acrylate, hydroxyhexyl (meth)acrylate, hydroxyoctyl (meth)acrylate, and octyl (meth)acrylate. Monomers containing hydroxyl groups, such as hydroxydecyl acrylate, hydroxylauryl (meth)acrylate, and (4-hydroxymethylcyclohexyl)methyl methacrylate; monomers containing sulfonic acid groups, such as styrene sulfonic acid, allyl sulfonic acid, 2-(meth)acrylamide-2-methylpropanesulfonic acid, (meth)acrylamide propanesulfonic acid, (meth)acrylate sulfopropyl ester, and (meth)acryloyloxynaphthalenesulfonic acid; (meth)acrylamide, N,N-dimethyl (meth)acrylamide (N-substituted) amide monomers such as amine, N-butyl (meth)acrylamide, N-hydroxymethyl (meth)acrylamide, and N-hydroxymethylpropane (meth)acrylamide; (meth)acrylic acid aminoalkyl ester monomers such as (meth)acrylic acid aminoethyl ester, (meth)acrylic acid N,N-dimethylaminoethyl ester, and (meth)acrylic acid tert-butylaminoethyl ester; (meth)acrylic acid methoxyethyl ester, (meth)acrylic acid ethoxyethyl ester, (Meth)acrylic acid alkoxyalkyl ester monomers such as ethyl ester; maleimide monomers such as N-cyclohexylmaleimide, N-isopropylmaleimide, N-laurylmaleimide, and N-phenylmaleimide; N-methyliconimide, N-ethyliconimide, N-butyliconimide, N-octyliconimide, N-2-ethylhexyliconimide, N-cyclohexyliconimide, N-laurylmaleimide, and N-phenylmaleimide; Iconimide monomers such as 1,2-dioxadiazole; succinimide monomers such as N-(meth)acryloyloxymethylenesuccinimide, N-(meth)acryloyl-6-oxyhexamethylenesuccinimide, and N-(meth)acryloyl-8-oxyoctamethylenesuccinimide; vinyl acetate, vinyl propionate, N-vinylpyrrolidone, methylvinylpyrrolidone, vinylpyridine, vinylpiperidone, vinylpyrimidine, etc. Vinyl monomers such as d-pyridine, vinyl piperazine, vinyl pyrazine, vinyl pyrrole, vinyl imidazole, vinyl oxazole, vinyl morpholine, N-vinyl carboxylic acid amides, styrene, α-methylstyrene, N-vinyl caprolactam; cyanoacrylate monomers such as acrylonitrile and methacrylonitrile; acrylic monomers containing epoxy groups such as glycidyl (meth)acrylate; glycol acrylate monomers such as polyethylene glycol (meth)acrylate, polypropylene glycol (meth)acrylate, methoxyethylene glycol (meth)acrylate, methoxypolypropylene glycol (meth)acrylate; acrylate monomers having heterocyclic rings, halogen atoms, silicon atoms, etc. such as tetrahydrofurfuryl (meth)acrylate, fluoro(meth)acrylate, polysilicone (meth)acrylate; hexanediol di(meth)acrylate, (poly)ethylene glycol di(meth)acrylate, (poly)propylene glycol di(meth)acrylate, etc. The present invention can be used as a monomer of the present invention, for example, a polyfunctional monomer such as tri(meth)acrylate, neopentyl glycol di(meth)acrylate, pentaerythritol di(meth)acrylate, trihydroxymethylpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol hexa(meth)acrylate, epoxy acrylate, polyester acrylate, urethane acrylate, or the like; an olefin monomer such as isoprene, butadiene, or isobutylene; or a vinyl ether monomer such as vinyl ether, or the like. Such monomers can be used alone or in combination of two or more.
(添加劑) 上述黏著劑可以根據需要包含任意適當之添加劑。作為該添加劑,例如可以例舉;交聯劑、黏著賦予劑、塑化劑、顏料、染料、填充劑、防老化劑、導電材料、抗靜電劑、紫外線吸收劑、光穩定劑、剝離調節劑、軟化劑、界面活性劑、阻燃劑、抗氧化劑等。 (Additives) The above-mentioned adhesive may contain any appropriate additives as needed. Examples of such additives include crosslinking agents, adhesive imparting agents, plasticizers, pigments, dyes, fillers, anti-aging agents, conductive materials, antistatic agents, ultraviolet absorbers, light stabilizers, stripping regulators, softeners, surfactants, flame retardants, antioxidants, etc.
作為上述黏著賦予劑,可以使用任意適當之黏著賦予劑。作為黏著賦予劑,例如使用黏著賦予樹脂。作為黏著賦予樹脂之具體例,可以例舉:松香系黏著賦予樹脂(例如未改性松香、改性松香、松香酚系樹脂、松香酯系樹脂等)、萜烯系黏著賦予樹脂(例如萜烯系樹脂、萜烯酚系樹脂、苯乙烯改性萜烯系樹脂、芳香族改性萜烯系樹脂、氫化萜烯系樹脂)、烴系黏著賦予樹脂(例如脂肪族系烴樹脂、脂肪族系環狀烴樹脂、芳香族系烴樹脂(例如苯乙烯系樹脂、二甲苯系樹脂等)、脂肪族-芳香族系石油樹脂、脂肪族-脂環族系石油樹脂、氫化烴樹脂、香豆酮系樹脂、香豆酮-茚系樹脂等)、酚系黏著賦予樹脂(例如烷基酚系樹脂、二甲苯甲醛系樹脂、甲階酚醛樹脂、酚醛清漆等)、酮系黏著賦予樹脂、聚醯胺系黏著賦予樹脂、環氧系黏著賦予樹脂、彈性體系黏著賦予樹脂等。As the above-mentioned adhesive-imparting agent, any appropriate adhesive-imparting agent can be used. As the adhesive-imparting agent, for example, an adhesive-imparting resin is used. Specific examples of the adhesive-imparting resin include: rosin-based adhesive-imparting resins (for example, unmodified rosin, modified rosin, rosin phenol-based resins, rosin ester-based resins, etc.), terpene-based adhesive-imparting resins (for example, terpene-based resins, terpene phenol-based resins, styrene-modified terpene-based resins, aromatic-modified terpene-based resins, hydrogenated terpene-based resins), hydrocarbon-based adhesive-imparting resins (for example, aliphatic hydrocarbon resins, aliphatic cyclic hydrocarbon resins, aromatic hydrocarbon resins ( For example, styrene-based resins, xylene-based resins, etc.), aliphatic-aromatic petroleum resins, aliphatic-aliphatic cyclopentane petroleum resins, hydrogenated hydrocarbon resins, coumarone-based resins, coumarone-indene-based resins, etc.), phenol-based adhesive-imparting resins (for example, alkylphenol-based resins, xylene formaldehyde-based resins, cresol-formaldehyde resins, phenol-formaldehyde varnishes, etc.), ketone-based adhesive-imparting resins, polyamide-based adhesive-imparting resins, epoxy-based adhesive-imparting resins, elastic system adhesive-imparting resins, etc.
上述黏著賦予劑之添加量相對於基礎聚合物100重量份,較佳為5重量份~100重量份,更佳為10重量份~50重量份。The amount of the adhesion agent added is preferably 5 to 100 parts by weight, more preferably 10 to 50 parts by weight, relative to 100 parts by weight of the base polymer.
作為上述交聯劑,例如除異氰酸酯系交聯劑、環氧系交聯劑、三聚氰胺系交聯劑、過氧化物系交聯劑以外,還可以例舉:脲系交聯劑、金屬醇鹽系交聯劑、金屬螯合物系交聯劑、金屬鹽系交聯劑、碳二亞胺系交聯劑、㗁唑啉系交聯劑、氮丙啶系交聯劑、胺系交聯劑等。其中,較佳為異氰酸酯系交聯劑或環氧系交聯劑。As the above-mentioned crosslinking agent, for example, in addition to isocyanate crosslinking agents, epoxy crosslinking agents, melamine crosslinking agents, and peroxide crosslinking agents, urea crosslinking agents, metal alkoxide crosslinking agents, metal chelate crosslinking agents, metal salt crosslinking agents, carbodiimide crosslinking agents, oxazoline crosslinking agents, aziridine crosslinking agents, amine crosslinking agents, etc. Among them, preferably an isocyanate crosslinking agent or an epoxy crosslinking agent.
作為上述異氰酸酯系交聯劑之具體例,可以例舉:伸丁基二異氰酸酯、六亞甲基二異氰酸酯等低級脂肪族多異氰酸酯類;伸環戊基二異氰酸酯、伸環己基二異氰酸酯、異佛爾酮二異氰酸酯等脂環族異氰酸酯類;2,4-甲苯二異氰酸酯、4,4'-二苯基甲烷二異氰酸酯、苯二甲基二異氰酸酯等芳香族異氰酸酯類;三羥甲基丙烷/甲苯二異氰酸酯三聚體加成物(日本聚胺酯工業公司製、商品名「CORONATE L」)、三羥甲基丙烷/六亞甲基二異氰酸酯三聚體加成物(日本聚胺酯工業公司製、商品名「CORONATE HL」)、六亞甲基二異氰酸酯之異氰脲酸酯體(日本聚胺酯工業公司製、商品名「CORONATE HX」)等異氰酸酯加成物等。異氰酸酯系交聯劑之含量可以根據期望之黏著力、黏著劑層之彈性等設定為任意適當之量,相對於基礎聚合物100重量份,代表性的為0.1重量份~20重量份,更佳為0.5重量份~10重量份。Specific examples of the isocyanate crosslinking agent include: low-order aliphatic polyisocyanates such as butyl diisocyanate and hexamethylene diisocyanate; alicyclic isocyanates such as cyclopentyl diisocyanate, cyclohexyl diisocyanate, and isophorone diisocyanate; aromatic isocyanates such as 2,4-toluene diisocyanate, 4,4'-diphenylmethane diisocyanate, and xylylene diisocyanate; trihydroxymethylpropane/toluene diisocyanate trimer adduct (manufactured by Nippon Polyurethane Industries, Ltd., trade name "CORONATE L"), trihydroxymethylpropane/hexamethylene diisocyanate trimer adduct (manufactured by Nippon Polyurethane Industries, Ltd., trade name "CORONATE The content of the isocyanate crosslinking agent can be set to any appropriate amount according to the desired adhesion, elasticity of the adhesive layer, etc., and is typically 0.1 to 20 parts by weight, and more preferably 0.5 to 10 parts by weight, relative to 100 parts by weight of the base polymer.
作為前述環氧系交聯劑,例如可以例舉:N,N,N',N'-四縮水甘油基間苯二甲胺、二縮水甘油基苯胺、1,3-雙(N,N-縮水甘油基胺基甲基)環己烷(三菱瓦斯化學公司製、商品名「TETRAD C」),1,6-己二醇二縮水甘油醚(共榮社化學公司製、商品名「Epolight 1600」)、新戊二醇二縮水甘油醚(共榮社化學公司製、商品名「Epolight 1500 NP」)、乙二醇二縮水甘油醚(共榮社化學公司製、商品名「Epolight 40E」)、丙二醇二縮水甘油醚(共榮社化學公司製、商品名「Epolight 70P」)、聚乙二醇二縮水甘油醚(日本油脂公司製、商品名「EPIOL E-400」),聚丙二醇二縮水甘油醚(日本油脂公司製、商品名「EPIOL P-200」)、山梨醇聚縮水甘油醚(Nagase ChemteX公司製、商品名「Denacol EX-611」)、甘油聚縮水甘油醚(Nagase ChemteX公司製、商品名「Denacol EX-314」)、季戊四醇聚縮水甘油醚、聚甘油聚縮水甘油醚(Nagase ChemteX Corporation製、商品名「Denacol EX-512」)、山梨醇酐聚縮水甘油醚、三羥甲基丙烷聚縮水甘油醚、己二酸二縮水甘油酯、鄰苯二甲酸二縮水甘油酯、三縮水甘油基-三(2-羥基乙基)異氰脲酸酯、間苯二酚二縮水甘油醚,雙酚-S-二縮水甘油醚、分子內具有2個以上環氧基之環氧系樹脂等。環氧系交聯劑之含量可以根據期望之黏著力、黏著劑層之彈性等設定為任意適當之量,相對於基礎聚合物100重量份,代表性的為0.01重量份~10重量份,更佳為0.03重量份~5重量份。Examples of the epoxy crosslinking agent include N,N,N',N'-tetraglycidyl-m-xylylenediamine, diglycidylaniline, 1,3-bis(N,N-glycidylaminomethyl)cyclohexane (manufactured by Mitsubishi Gas Chemical Co., Ltd., trade name "TETRAD C"), 1,6-hexanediol diglycidyl ether (manufactured by Kyoeisha Chemical Co., Ltd., trade name "Epolight 1600"), neopentyl glycol diglycidyl ether (manufactured by Kyoeisha Chemical Co., Ltd., trade name "Epolight 1500 NP"), ethylene glycol diglycidyl ether (manufactured by Kyoeisha Chemical Co., Ltd., trade name "Epolight 40E"), propylene glycol diglycidyl ether (manufactured by Kyoeisha Chemical Co., Ltd., trade name "Epolight 1500 NP"), 70P"), polyethylene glycol diglycidyl ether (manufactured by NOF Corporation, trade name "EPIOL E-400"), polypropylene glycol diglycidyl ether (manufactured by NOF Corporation, trade name "EPIOL P-200"), sorbitol polyglycidyl ether (manufactured by Nagase ChemteX Corporation, trade name "Denacol EX-611"), glycerol polyglycidyl ether (manufactured by Nagase ChemteX Corporation, trade name "Denacol EX-314"), pentaerythritol polyglycidyl ether, polyglycerol polyglycidyl ether (manufactured by Nagase ChemteX Corporation, trade name "Denacol EX-512"), sorbitan polyglycidyl ether, trihydroxymethylpropane polyglycidyl ether, diglycidyl adipate, diglycidyl phthalate, triglycidyl-tri(2-hydroxyethyl)isocyanurate, resorcinol diglycidyl ether, bisphenol-S-diglycidyl ether, epoxy resins having two or more epoxy groups in the molecule, etc. The content of the epoxy crosslinking agent can be set to any appropriate amount according to the desired adhesion, elasticity of the adhesive layer, etc., and is typically 0.01 to 10 parts by weight, and more preferably 0.03 to 5 parts by weight, relative to 100 parts by weight of the base polymer.
作為上述塑化劑,可以使用任意適當之塑化劑。作為塑化劑之具體例,例如可以例舉:偏苯三甲酸酯系塑化劑、均苯四甲酸酯系塑化劑、聚酯系塑化劑、己二酸系塑化劑等。其中,較佳為偏苯三甲酸酯系塑化劑(例如,偏苯三甲酸三(正辛基)酯、偏苯三甲酸三(2-乙基己基)酯等)或均苯四甲酸酯系塑化劑(例如,均苯四甲酸四(正辛基)酯、均苯四甲酸四(2-乙基己基)酯等)。塑化劑可以單獨使用或組合使用2種以上。塑化劑之含量相對於基礎聚合物100重量份,較佳為1重量份~20重量份,更佳為1重量份~5重量份。As the above-mentioned plasticizer, any appropriate plasticizer can be used. Specific examples of plasticizers include: trimellitic acid ester plasticizers, pyromellitic acid ester plasticizers, polyester plasticizers, adipic acid plasticizers, etc. Among them, trimellitic acid ester plasticizers (for example, tri(n-octyl) trimellitic acid ester, tri(2-ethylhexyl) trimellitic acid ester, etc.) or pyromellitic acid ester plasticizers (for example, tetra(n-octyl) pyromellitic acid ester, tetra(2-ethylhexyl) pyromellitic acid ester, etc.) are preferred. Plasticizers can be used alone or in combination of two or more. The content of the plasticizer is preferably 1 to 20 parts by weight, and more preferably 1 to 5 parts by weight, relative to 100 parts by weight of the base polymer.
C. 基材作為上述基材,例如可以例舉:樹脂片、不織布、紙、金屬箔、織布、橡膠片、發泡片、其等之積層體(特別是包含樹脂片之積層體)等。作為構成樹脂片之樹脂,例如可以例舉:聚對苯二甲酸乙二酯(PET)、聚萘二甲酸乙二酯(PEN)、聚對苯二甲酸丁二酯(PBT)、聚乙烯(PE)、聚丙烯(PP)、乙烯-丙烯共聚物、乙烯-乙酸乙烯酯共聚物(EVA)、聚醯胺(尼龍)、全芳香族聚醯胺(芳族聚醯胺)、聚醯亞胺(PI)、聚氯乙烯(PVC)、聚苯硫醚(PPS)、氟系樹脂、聚醚醚酮(PEEK)等。作為不織布,可以例舉:包含馬尼拉麻之不織布等由具有耐熱性之天然纖維形成之不織布;聚丙烯樹脂不織布、聚乙烯樹脂不織布、酯系樹脂不織布等合成樹脂不織布等。作為金屬箔,可以例舉:銅箔、不鏽鋼箔、鋁箔等。作為紙,可以例舉:日本紙、牛皮紙等。上述基材可以為單層,亦可以為多層。於上述基材為多層之情形時,各層之構成可以相同,亦可以不同。 C. Substrate Examples of the substrate include resin sheets, nonwoven fabrics, paper, metal foils, woven fabrics, rubber sheets, foam sheets, and laminates thereof (particularly laminates containing resin sheets). Examples of the resin constituting the resin sheet include polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polybutylene terephthalate (PBT), polyethylene (PE), polypropylene (PP), ethylene-propylene copolymer, ethylene-vinyl acetate copolymer (EVA), polyamide (nylon), wholly aromatic polyamide (aromatic polyamide), polyimide (PI), polyvinyl chloride (PVC), polyphenylene sulfide (PPS), fluorine-based resin, polyetheretherketone (PEEK), and the like. Examples of nonwoven fabrics include: nonwoven fabrics made of heat-resistant natural fibers such as Manila hemp; synthetic resin nonwoven fabrics such as polypropylene resin nonwoven fabrics, polyethylene resin nonwoven fabrics, and ester resin nonwoven fabrics. Examples of metal foils include: copper foils, stainless steel foils, and aluminum foils. Examples of paper include: Japanese paper, kraft paper, and the like. The substrate may be a single layer or multiple layers. When the substrate is multiple layers, the composition of each layer may be the same or different.
上述基材之厚度可以根據期望之強度或柔軟性、以及使用目的等設定為任意適當之厚度。基材之厚度較佳為1000 μm以下,更佳為1 μm~1000 μm,進而較佳為1 μm~500 μm,特別較佳為3 μm~300 μm,最佳為5 μm~250 μm。The thickness of the substrate can be set to any appropriate thickness according to the desired strength or flexibility, the purpose of use, etc. The thickness of the substrate is preferably 1000 μm or less, more preferably 1 μm to 1000 μm, further preferably 1 μm to 500 μm, particularly preferably 3 μm to 300 μm, and most preferably 5 μm to 250 μm.
上述基材可以實施表面處理。作為表面處理,例如可以例舉:電暈處理、鉻酸處理、臭氧暴露、火焰暴露、高壓電擊暴露、電離放射線處理、利用底塗劑之塗佈處理等。The substrate may be subjected to surface treatment. Examples of the surface treatment include corona treatment, chromic acid treatment, ozone exposure, flame exposure, high-voltage electric shock exposure, ionizing radiation treatment, and coating treatment using a primer.
作為上述有機塗佈材料,例如可以例舉「塑料硬塗材料II(CMC出版、(2004))」中記載之材料。較佳為使用胺基甲酸酯系聚合物,更佳為使用聚丙烯酸胺基甲酸酯、聚酯胺基甲酸酯或其等之前體。其原因在於,對基材之塗覆、塗佈簡便,且工業上可選擇多種,可廉價地獲得。該胺基甲酸酯系聚合物例如為包含異氰酸酯單體與含有醇性羥基之單體(例如含有羥基之丙烯酸系化合物或含有羥基之酯化合物)之反應混合物之聚合物。有機塗佈材料中,作為任意之添加劑,可以包含多胺等擴鏈劑、防老化劑、氧化穩定劑等。有機塗覆層之厚度並無特別限定,例如為0.1 μm~10 μm左右適宜,較佳為0.1 μm~5 μm左右,更佳為0.5 μm~5 μm左右。As the above-mentioned organic coating material, for example, the materials described in "Plastic Hard Coating Material II (CMC Publishing, (2004))" can be cited. It is preferred to use a urethane polymer, and it is more preferred to use polyacrylic urethane, polyester urethane or their precursors. The reason is that the coating and coating on the substrate are simple, and there are many industrial options and they can be obtained cheaply. The urethane polymer is, for example, a polymer of a reaction mixture containing an isocyanate monomer and a monomer containing an alcoholic hydroxyl group (for example, a hydroxyl-containing acrylic compound or a hydroxyl-containing ester compound). In the organic coating material, as an arbitrary additive, a chain extender such as polyamine, an anti-aging agent, an oxidation stabilizer, etc. can be included. The thickness of the organic coating layer is not particularly limited, and is, for example, appropriately about 0.1 μm to 10 μm, preferably about 0.1 μm to 5 μm, and more preferably about 0.5 μm to 5 μm.
D. 其他黏著劑層作為上述其他黏著劑層,可以形成任意適當之黏著劑層。作為形成其他黏著劑層之黏著劑,例如可以例舉:橡膠系黏著劑、丙烯酸系黏著劑、乙烯基烷基醚系黏著劑、聚矽氧系黏著劑、聚酯系黏著劑、聚醯胺系黏著劑、胺基甲酸酯系黏著劑、氟系黏著劑、苯乙烯-二烯嵌段共聚物系黏著劑等。黏著劑中可以調配例如塑化劑、填充劑、界面活性劑、防老化劑、黏著賦予劑等公知或慣用之添加劑。 D. Other adhesive layer As the above-mentioned other adhesive layer, any appropriate adhesive layer can be formed. As adhesives forming other adhesive layers, for example, there can be cited: rubber adhesives, acrylic adhesives, vinyl alkyl ether adhesives, silicone adhesives, polyester adhesives, polyamide adhesives, urethane adhesives, fluorine adhesives, styrene-diene block copolymer adhesives, etc. The adhesive can be formulated with known or commonly used additives such as plasticizers, fillers, surfactants, anti-aging agents, and adhesion-imparting agents.
其他黏著劑層之厚度較佳為300 μm以下,更佳為1 μm~300 μm、進而較佳為5 μm~100 μm。The thickness of the other adhesive layer is preferably 300 μm or less, more preferably 1 μm to 300 μm, and further preferably 5 μm to 100 μm.
E. 彈性層本發明之黏著片材還可以具備彈性層。彈性層可以配置於黏著劑層之單面。黏著片材具備基材時,彈性層可以配置於黏著劑層與基材之間。藉由具備彈性層,對被黏著體之追隨性提高。又,具備彈性層之黏著片材於剝離時進行加熱時,黏著劑層之面方向之變形(膨脹)受到約束,厚度方向於變形優先。結果,剝離性提高。 E. Elastic layer The adhesive sheet of the present invention may also have an elastic layer. The elastic layer may be disposed on one side of the adhesive layer. When the adhesive sheet has a substrate, the elastic layer may be disposed between the adhesive layer and the substrate. By having an elastic layer, the followability to the adherend is improved. Furthermore, when the adhesive sheet having an elastic layer is heated during peeling, the deformation (expansion) of the adhesive layer in the surface direction is restrained, and the deformation in the thickness direction takes precedence. As a result, the peeling property is improved.
上述彈性層包含基礎聚合物,作為該基礎聚合物,可以使用作為構成上述黏著劑層之基礎聚合物而例示之聚合物。於一個實施方式中,上述彈性層可以包含天然橡膠、合成橡膠、合成樹脂等。作為該合成橡膠及合成樹脂,可以例舉:腈系、二烯系、丙烯酸系之合成橡膠;聚烯烴系、聚酯系等熱塑性彈性體;乙烯-乙酸乙烯酯共聚物;胺基甲酸酯;聚丁二烯;軟質聚氯乙烯等。構成上述彈性層之基礎聚合物可以與形成上述黏著劑層之基礎聚合物相同,亦可以不同。上述彈性層可以為由上述基礎聚合物形成之發泡膜。該發泡膜可以藉由任意適當之方法來得到。再者,彈性層與黏著劑層可以藉由基礎聚合物之不同及/或熱膨脹性微球之有無(彈性層不包含熱膨脹性微球)來進行區別。更詳細而言,於彈性層與黏著劑層由不同之基礎聚合物形成之情形等藉由截面觀察能夠識別彈性層與黏著劑層之界面之情形時,彈性層與黏著劑層之邊界由該界面規定。又,於藉由截面觀察無法識別彈性層與黏著劑層之界面之情形時,藉由截面觀察而觀察到熱膨脹性微球之區域為黏著劑層。The elastic layer includes a base polymer, and as the base polymer, the polymer exemplified as the base polymer constituting the adhesive layer can be used. In one embodiment, the elastic layer can include natural rubber, synthetic rubber, synthetic resin, etc. Examples of the synthetic rubber and synthetic resin include: nitrile-based, diene-based, and acrylic-based synthetic rubbers; thermoplastic elastomers such as polyolefin-based and polyester-based; ethylene-vinyl acetate copolymers; urethane; polybutadiene; soft polyvinyl chloride, etc. The base polymer constituting the elastic layer can be the same as or different from the base polymer forming the adhesive layer. The elastic layer can be a foamed film formed from the base polymer. The foam film can be obtained by any appropriate method. Furthermore, the elastic layer and the adhesive layer can be distinguished by the difference in base polymers and/or the presence or absence of thermally expandable microspheres (the elastic layer does not contain thermally expandable microspheres). More specifically, in the case where the elastic layer and the adhesive layer are formed of different base polymers and the interface between the elastic layer and the adhesive layer can be identified by cross-sectional observation, the boundary between the elastic layer and the adhesive layer is defined by the interface. In addition, when the interface between the elastic layer and the adhesive layer cannot be identified by cross-sectional observation, the region where the thermally expandable microspheres are observed by cross-sectional observation is the adhesive layer.
上述彈性層可以根據需要包含任意適當之添加劑。作為添加劑,例如可以例舉:交聯劑、硫化劑、黏著賦予樹脂、塑化劑、柔軟劑、填充劑、及防老化劑等。使用聚氯乙烯等硬質樹脂作為基礎聚合物時,較佳為組合使用塑化劑及/或柔軟劑來形成具有期望之彈性之彈性層。The elastic layer may contain any appropriate additives as required. Examples of additives include crosslinking agents, vulcanizers, adhesive imparting resins, plasticizers, softeners, fillers, and anti-aging agents. When a hard resin such as polyvinyl chloride is used as the base polymer, it is preferred to use a plasticizer and/or softener in combination to form an elastic layer with desired elasticity.
上述彈性層之厚度較佳為3 μm~200 μm,更佳為5 μm~100 μm。若為此種範圍,則能夠充分發揮彈性層之上述功能。The thickness of the elastic layer is preferably 3 μm to 200 μm, more preferably 5 μm to 100 μm. If it is within this range, the above functions of the elastic layer can be fully exerted.
上述彈性層之25℃下之拉伸彈性模數較佳為0.2 MPa~500 MPa,更佳為0.3 MPa~500 MPa,進而較佳為0.5 MPa~500 MPa。若為此種範圍,則能夠充分發揮彈性層之上述功能。再者,拉伸彈性模數可以根據JIS K 7161:2008進行測定。The tensile modulus of the elastic layer at 25°C is preferably 0.2 MPa to 500 MPa, more preferably 0.3 MPa to 500 MPa, and further preferably 0.5 MPa to 500 MPa. Within this range, the elastic layer can fully exert the above-mentioned function. The tensile modulus can be measured according to JIS K 7161:2008.
F. 黏著片材之製造方法本發明之黏著片材可以藉由任意適當之方法來製造。本發明之黏著片材例如可以例舉:於基材(於得到不含基材之黏著片材之情形時,為任意適當之基體)上直接塗覆包含黏著劑及熱膨脹性微球之組合物之方法、或者將於任意適當之基體上塗覆包含黏著劑及熱膨脹性微球之組合物而形成之塗覆層轉印至基材之方法等。包含黏著劑及熱膨脹性微球之組合物可以包含任意適當之溶劑。又,利用包含黏著劑之組合物形成黏著劑塗覆層後,於該黏著劑塗覆層上撒上熱膨脹性微球後,使用層壓機等將該熱膨脹性微球埋入該塗覆層中,可以形成包含熱膨脹性微球之黏著劑層。 F. Method for producing adhesive sheet The adhesive sheet of the present invention can be produced by any appropriate method. For example, the adhesive sheet of the present invention can be produced by directly coating a composition containing an adhesive and heat-expandable microspheres on a substrate (in the case of obtaining an adhesive sheet without a substrate, any appropriate substrate), or by transferring a coating layer formed by coating a composition containing an adhesive and heat-expandable microspheres on any appropriate substrate to a substrate. The composition containing an adhesive and heat-expandable microspheres can contain any appropriate solvent. Furthermore, after forming an adhesive coating layer using a composition containing an adhesive, heat-expandable microspheres are sprinkled on the adhesive coating layer, and then the heat-expandable microspheres are embedded in the coating layer using a laminating press or the like, thereby forming an adhesive layer containing heat-expandable microspheres.
黏著劑層具有上述彈性層時,彈性層例如可以藉由於基材上或黏著劑層上塗覆用於形成彈性層之組合物而形成。When the adhesive layer has the elastic layer, the elastic layer can be formed by, for example, coating a composition for forming the elastic layer on the substrate or the adhesive layer.
作為上述各組合物之塗覆方法,可以採用任意適當之塗覆方法。例如,可以於塗佈後進行乾燥而形成各層。作為塗佈方法,例如可以例舉:使用多層塗佈機(Multi coater)、模塗機、凹版塗佈機、塗抹器等之塗佈方法。作為乾燥方法,例如可以例舉:自然乾燥、加熱乾燥等。加熱乾燥時之加熱溫度可根據成為乾燥對象之物質之特性而設定為任意適當之溫度。 實施例 As a coating method for each of the above-mentioned compositions, any appropriate coating method can be adopted. For example, each layer can be formed by drying after coating. As a coating method, for example, coating methods using a multi-layer coater, a die coater, a gravure coater, a coater, etc. can be cited. As a drying method, for example, natural drying, heat drying, etc. can be cited. The heating temperature during heat drying can be set to any appropriate temperature according to the characteristics of the substance to be dried. Example
以下,藉由實施例對本發明進行具體說明,但本發明並不限定於該等實施例。實施例中之評價方法如下所述。再者,下述評價中,使用剝離了剝離襯墊之黏著片材。又,於實施例中,只要無特別說明,「份」及「%」為重量基準。The present invention is specifically described below by way of examples, but the present invention is not limited to the examples. The evaluation method in the examples is as follows. Furthermore, in the following evaluation, an adhesive sheet from which a peeling pad is peeled off is used. In addition, in the examples, "parts" and "%" are based on weight unless otherwise specified.
<評價方法> (1)透明性評價 製作A4尺寸之黏著片材,將該黏著片材分別放置於相同之報紙上,根據隔著黏著片材之該報紙之文字之可視性,進行透明性之評價。若於A4尺寸內讀取全部文字則記為優(○),若無法讀取之文字未達10%則記為良(Δ),若無法讀取10%以上則記為不合格(×)。 (2)發泡起始溫度 將黏著帶(20 mm×50 mm)以黏著劑層為熱板側之方式配置於熱板(AS ONE公司製、數位熱板PC-400D),於黏著帶上設置玻璃板而製成熱板/黏著帶/玻璃板之夾層結構。 使熱板之溫度於50℃~300℃之範圍內變化,將黏著劑層膨脹率(於規定溫度下加熱1分鐘後之帶厚度/未加熱之黏著帶於室溫下之厚度)為105%以上之熱板之最低溫度作為發泡起始溫度。 <Evaluation method> (1) Transparency evaluation A4-sized adhesive sheets were prepared and placed on the same newspapers. The transparency was evaluated based on the visibility of the text on the newspapers through the adhesive sheets. If all the text in the A4 size could be read, it was rated as excellent (○); if less than 10% of the text could not be read, it was rated as good (Δ); if more than 10% could not be read, it was rated as unacceptable (×). (2) Foaming start temperature An adhesive tape (20 mm × 50 mm) was placed on a hot plate (digital hot plate PC-400D manufactured by AS ONE) with the adhesive layer on the hot plate side. A glass plate was placed on the adhesive tape to produce a hot plate/adhesive tape/glass plate sandwich structure. The temperature of the hot plate is varied within the range of 50℃ to 300℃, and the lowest temperature of the hot plate at which the expansion rate of the adhesive layer (the thickness of the adhesive tape after heating at the specified temperature for 1 minute/the thickness of the unheated adhesive tape at room temperature) is above 105% is taken as the foaming starting temperature.
[製造例1]熱膨脹性微球A之製作 將氯化鈉150 g、二氧化矽有效成分20重量%之膠體二氧化矽(日產化學公司製、商品名「SNOWTEX」)70 g、聚乙烯吡咯啶酮1 g、二乙醇胺與己二酸之縮合物0.5 g加入蒸餾水600 g中後,將得到之混合物之pH調整為2.8~3.2,得到水性溶液。 於上述水性溶液中加入丙烯腈36 g、甲基丙烯酸甲酯36 g及甲基丙烯酸28 g作為成為殼之材料之油系添加劑。進而,加入作為交聯劑之乙二醇二甲基丙烯酸酯1 g,得到反應溶液。 將上述反應溶液加入到帶有均質混合器(特殊機化工業公司製、商品名「TK均質混合器」)之耐壓反應容器中,進而,將作為意圖內包於殼之有機溶劑之異丁烷(沸點:-11.7℃)70 g及起始劑(二異丙氧基二碳酸酯)5 g加入到耐壓反應容器中。 使均質混合器於規定之初始攪拌條件(攪拌速度:6000 rpm、攪拌時間:2分鐘)下旋轉,攪拌上述混合物後,邊以80 rpm攪拌邊加熱至60℃,進行24小時反應。將藉由過濾反應後之反應溶液而得到之固體成分於氮氣氣流下室溫放置1週,藉此得到熱膨脹性微球。 再者,得到之熱膨脹性微球利用島津製作所製之商品名「SALD-2000J」進行測量,結果平均粒徑為14 μm。又,藉由X射線CT(ZEISS公司製Xradia 520versa(測定條件:管電壓60 KV管電流83 μA、像素尺寸0.20 μm/像素))可知,熱膨脹性微球內之異丁烷溶劑相對於熱膨脹性微球之重量包含12重量%。又,利用上述X射線CT進行測定,結果熱膨脹性微球之殼之厚度為2 μm。 [Production Example 1] Preparation of Thermally Expandable Microspheres A 150 g of sodium chloride, 70 g of colloidal silica containing 20% by weight of silica active ingredient (manufactured by Nissan Chemical Co., Ltd., trade name "SNOWTEX"), 1 g of polyvinyl pyrrolidone, and 0.5 g of a condensate of diethanolamine and adipic acid were added to 600 g of distilled water, and the pH of the obtained mixture was adjusted to 2.8-3.2 to obtain an aqueous solution. 36 g of acrylonitrile, 36 g of methyl methacrylate, and 28 g of methacrylic acid were added to the above aqueous solution as an oil-based additive to form a shell material. Furthermore, 1 g of ethylene glycol dimethacrylate was added as a crosslinking agent to obtain a reaction solution. The reaction solution was added to a pressure-resistant reaction vessel equipped with a homomixer (manufactured by Tokushiki Kagaku Kogyo Co., Ltd., trade name "TK Homomixer"), and 70 g of isobutane (boiling point: -11.7°C) and 5 g of initiator (diisopropoxydicarbonate) as an organic solvent intended to be enclosed in the shell were added to the pressure-resistant reaction vessel. The homomixer was rotated under the specified initial stirring conditions (stirring speed: 6000 rpm, stirring time: 2 minutes), and after stirring the above mixture, it was heated to 60°C while stirring at 80 rpm and reacted for 24 hours. The solid component obtained by filtering the reaction solution after the reaction was placed at room temperature under a nitrogen flow for 1 week to obtain thermally expandable microspheres. Furthermore, the obtained thermal expansion microspheres were measured using the trade name "SALD-2000J" manufactured by Shimadzu Corporation, and the average particle size was 14 μm. In addition, by X-ray CT (Xradia 520versa manufactured by ZEISS (measurement conditions: tube voltage 60 KV tube current 83 μA, pixel size 0.20 μm/pixel)), it was found that the isobutane solvent in the thermal expansion microspheres contained 12% by weight relative to the weight of the thermal expansion microspheres. In addition, the above-mentioned X-ray CT was used for measurement, and the thickness of the shell of the thermal expansion microspheres was 2 μm.
[製造例2~7]熱膨脹性微球B~G之製作 將單體成分設為如同表1中記載,除此以外,與製造例1同樣地得到熱膨脹性微球。 [Production Examples 2 to 7] Production of Heat-Expandable Microspheres B to G Heat-expandable microspheres were obtained in the same manner as in Production Example 1 except that the monomer components were set as shown in Table 1.
[表1]
[製造例8] 丙烯酸系共聚物I之製作 於甲苯溶劑中加入丙烯酸2-乙基己酯(EHA)、丙烯酸乙酯(EA)、甲基丙烯酸甲酯(MMA)、丙烯酸2-羥基乙酯(HEA)30:70:5:4(重量比),進而加入過氧化-2-乙基己酸第三丁酯(日本油脂公司製、商品名:PERBUTYL O(註冊商標))0.5重量份作為聚合起始劑,於80℃~90℃下攪拌12小時,得到固體成分濃度為40%之丙烯酸系共聚物I之甲苯溶液。 再者,丙烯酸系共聚物I之折射率(計算折射率)為1.413,SP值為10.1。 [Production Example 8] Preparation of acrylic copolymer I 2-ethylhexyl acrylate (EHA), ethyl acrylate (EA), methyl methacrylate (MMA), and 2-hydroxyethyl acrylate (HEA) were added to a toluene solvent in a weight ratio of 30:70:5:4, and 0.5 parts by weight of tert-butyl peroxy-2-ethylhexanoate (manufactured by NOF Corporation, trade name: PERBUTYL O (registered trademark)) was added as a polymerization initiator. The mixture was stirred at 80°C to 90°C for 12 hours to obtain a toluene solution of acrylic copolymer I having a solid content concentration of 40%. The refractive index (calculated refractive index) of acrylic copolymer I was 1.413, and the SP value was 10.1.
[製造例9]丙烯酸系共聚物II之製作 於甲苯溶劑中加入丙烯酸2-乙基己酯(EHA)、丙烯酸乙酯(EA)、甲基丙烯酸甲酯(MMA)、丙烯酸(AA)30:70:5:5.5(重量比),進而加入過氧化-2-乙基己酸第三丁酯(日本油脂公司製、商品名:PERBUTYL O(註冊商標))0.5重量份作為聚合起始劑,於80℃~90℃下攪拌12小時,得到固體成分濃度為40%之丙烯酸系共聚物II之甲苯溶液。 再者,丙烯酸系共聚物II之折射率(計算折射率)為1.413,SP值為10.1。 [Production Example 9] Preparation of acrylic copolymer II 2-Ethylhexyl acrylate (EHA), ethyl acrylate (EA), methyl methacrylate (MMA), and acrylic acid (AA) were added to a toluene solvent in a ratio of 30:70:5:5.5 (weight ratio), and 0.5 parts by weight of tert-butyl peroxy-2-ethylhexanoate (manufactured by NOF Corporation, trade name: PERBUTYL O (registered trademark)) was added as a polymerization initiator, and stirred at 80°C to 90°C for 12 hours to obtain a toluene solution of acrylic copolymer II having a solid content concentration of 40%. In addition, the refractive index (calculated refractive index) of acrylic copolymer II was 1.413, and the SP value was 10.1.
[實施例1] 將作為基礎聚合物之丙烯酸系共聚物I 100重量份、異氰酸酯系交聯劑(東曹公司製、商品名「CORONATE L」)2重量份、熱膨脹性微球A 35重量份及甲苯210重量份混合,製備黏著劑層形成用組合物。 將丙烯酸系共聚物I 100重量份、異氰酸酯系交聯劑(東曹公司製、商品名「CORONATE L」)2重量份及甲苯210重量份混合,製備彈性層形成用組合物。 於作為基材之PET薄膜(厚度:38 μm)上塗佈彈性層形成用組合物,進行乾燥,形成厚度20 μm之彈性層。進而,於彈性層上塗佈上述黏著劑層形成用組合物,進行乾燥,得到黏著片材(黏著劑層(厚度:30 μm)/彈性層(20微米)/基材)。進而,於基材之與彈性層相反之一側形成其他黏著劑層。 將得到之黏著帶供於上述評價。將結果示於表2。 [Example 1] 100 parts by weight of acrylic copolymer I as a base polymer, 2 parts by weight of an isocyanate crosslinking agent (manufactured by Tosoh Corporation, trade name "CORONATE L"), 35 parts by weight of thermally expandable microspheres A, and 210 parts by weight of toluene were mixed to prepare a composition for forming an adhesive layer. 100 parts by weight of acrylic copolymer I, 2 parts by weight of an isocyanate crosslinking agent (manufactured by Tosoh Corporation, trade name "CORONATE L"), and 210 parts by weight of toluene were mixed to prepare a composition for forming an elastic layer. The composition for forming an elastic layer was applied to a PET film (thickness: 38 μm) as a substrate and dried to form an elastic layer with a thickness of 20 μm. Furthermore, the adhesive layer-forming composition is applied on the elastic layer and dried to obtain an adhesive sheet (adhesive layer (thickness: 30 μm)/elastic layer (20 microns)/substrate). Furthermore, another adhesive layer is formed on the side of the substrate opposite to the elastic layer. The obtained adhesive tape is provided for the above evaluation. The results are shown in Table 2.
[實施例2~7、比較例1~2] 除將黏著劑層中之基礎聚合物及熱膨脹性微球之種類設為表2所示之組成以外,與實施例1同樣地得到黏著帶。將得到之黏著帶供於上述評價。將結果示於表2。 [Examples 2 to 7, Comparative Examples 1 to 2] Except that the types of base polymer and heat-expandable microspheres in the adhesive layer were set to the composition shown in Table 2, an adhesive tape was obtained in the same manner as in Example 1. The obtained adhesive tape was subjected to the above evaluation. The results are shown in Table 2.
[表2]
10:黏著劑層 20:基材 30:其他黏著劑層 100,200,300:黏著片材 10: Adhesive layer 20: Base material 30: Other adhesive layers 100, 200, 300: Adhesive sheet
圖1(a)~(c)係本發明之一個實施方式之黏著片材之概略剖視圖。FIG. 1( a ) to ( c ) are schematic cross-sectional views of an adhesive sheet according to an embodiment of the present invention.
10:黏著劑層 10: Adhesive layer
20:基材 20: Base material
30:其他黏著劑層 30: Other adhesive layers
100,200,300:黏著片材 100,200,300: Adhesive sheet
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