TWI845858B - Adhesive Sheet - Google Patents

Abstract

The present invention provides an adhesive sheet having moderate adhesion to a sealing resin and a semiconductor chip constituting a semiconductor package, and can be easily peeled off from the sealing resin and the semiconductor chip, and can prevent the residue of the adhesive during peeling. The adhesive sheet of the present invention is an adhesive sheet having an adhesive layer, and the contact angle of the adhesive layer surface relative to 4-tert-butylphenyl glycidyl ether is 15° or more, and the adhesive force of the adhesive sheet to polyethylene terephthalate at 23°C is 0.5 N/20 mm or more.

Description

Adhesive Sheet

The present invention relates to an adhesive sheet.

In recent years, as semiconductor devices are being miniaturized, CSP (Chip Size/Scale Package), which forms a semiconductor package body of the same size as the built-in semiconductor element, has attracted attention as a semiconductor packaging technology. Among CSP, WLP (Wafer Level Package) is known as a semiconductor packaging technology that forms a small and highly integrated package body. WLP is a technology that does not use a substrate, but uses a sealing resin to seal a plurality of semiconductor chips in batches, and then cuts and separates each semiconductor chip to obtain a semiconductor package body. Generally speaking, when semiconductor chips are sealed in batches, in order to prevent the semiconductor chips from moving, a specific temporary fixing material is used to temporarily fix the plurality of semiconductor chips, and the plurality of semiconductor chips are sealed in batches on the temporary fixing material. Afterwards, when each semiconductor chip is cut and separated (after batch sealing and before cutting and separation, or after cutting and separation), the temporary fixing material is peeled off from the structure containing the sealing resin and the semiconductor chip. As a temporary fixing material used in this way, a low-adhesion adhesive sheet is often used. However, if the previous adhesive sheet is used, there is a problem that when the structure containing the sealing resin and the semiconductor chip is peeled off, there is a problem that the paste residue is generated in the structure. In particular, the paste residue becomes significant in the peripheral part of the semiconductor chip, and the paste residue becomes a cause of reduced yield. [Prior technical literature] [Patent literature] [Patent literature 1] Japanese Patent Publication No. 2001-308116 [Patent literature 2] Japanese Patent Publication No. 2001-313350

[Problem to be solved by the invention] The present invention is made to solve the above-mentioned previous problems, and its purpose is to provide an adhesive sheet that has appropriate adhesion to the sealing resin and semiconductor chip that constitute the semiconductor package body, can be easily peeled off from the sealing resin and the semiconductor chip, and is not easy to produce adhesive residues during peeling. [Technical means for solving the problem] The adhesive sheet of the present invention is an adhesive sheet having an adhesive layer, and the contact angle of the surface of the adhesive layer relative to 4-tert-butylphenyl glycidyl ether is greater than 15°, and the adhesive force of the adhesive sheet to polyethylene terephthalate at 23°C is greater than 0.5 N/20 mm. In one embodiment, the material constituting the adhesive in the adhesive layer has an sp value of 7 (cal/cm ³ ) ^1/2 to 10 (cal/cm ³ ) ^1/2 . In one embodiment, the probe viscosity of the adhesive layer is 50 N/5 mm or more. In one embodiment, the adhesive layer comprises an acrylic adhesive. In one embodiment, the acrylic adhesive comprises an acrylic polymer having an alkyl ester with a carbon number of 4 or more in the side chain as a base polymer. In one embodiment, in the acrylic polymer, the content ratio of the structural unit having an alkyl ester with a carbon number of 4 or more in the side chain is 30 weight % or more relative to the total structural units constituting the acrylic polymer. In one embodiment, the adhesive layer comprises a rubber adhesive. In one embodiment, the adhesive layer comprises a silicone adhesive. In one embodiment, the silicone adhesive comprises silicone rubber and silicone resin as base polymers, and the weight ratio of the silicone rubber to the silicone resin (rubber: resin) is 100:0 to 100:220. In one embodiment, the adhesive layer further comprises thermally expandable microspheres. In one embodiment, the arithmetic surface roughness Ra of the adhesive layer before heating the thermally expandable microspheres is less than 500 nm. In one embodiment, the adhesive sheet of the present invention is entirely bonded to a Bakelite board on the outer surface of the adhesive layer at an ambient temperature of 23°C, and aged at an ambient temperature of 40°C for 30 minutes, and then a load of 1.96 N is applied and maintained for 2 hours, at which time the offset of the adhesive sheet of the present invention relative to the Bakelite board is less than 0.5 mm. In one embodiment, the adhesive sheet of the present invention further has a substrate layer, and the adhesive layer is arranged on one side or both sides of the substrate layer. In one embodiment, the gripping force of the substrate layer and the adhesive layer is greater than 6.0 N/19 mm. [Effect of the invention] According to the present invention, by having an adhesive layer having a contact angle of 15° or more relative to 4-tert-butylphenyl glycidyl ether, an adhesive sheet can be obtained, which has moderate adhesion to a sealing resin and a semiconductor chip constituting a semiconductor package body, can be easily peeled off from the sealing resin and the semiconductor chip, and is not likely to produce paste residues during peeling.

A. Overview of Adhesive Sheet The adhesive sheet of the present invention has an adhesive layer. The adhesive sheet of the present invention may be composed of only the adhesive layer, or may have any appropriate layer in addition to the adhesive layer. Examples of layers other than the adhesive layer include: a substrate layer that can function as a support, a separator that can be releasably arranged on the adhesive layer, etc. Furthermore, in addition to the above-mentioned adhesive layer, other adhesive layers may be provided. Other adhesive layers may have any known structure. The adhesive sheet of the present invention preferably has an adhesive force of 0.5 N/20 mm or more, more preferably 0.5 N/20 mm to 20 N/20 mm, and further preferably 0.5 N/20 mm to 15 N/20 mm at 23°C to polyethylene terephthalate. In one embodiment, the adhesive layer of the adhesive sheet of the present invention has its adhesive force reduced by heating or light irradiation. In this case, the adhesive force before the adhesive force is reduced is 2.5 N/20 mm to 20 N/20 mm. Furthermore, in this specification, the so-called "adhesion to polyethylene terephthalate" refers to the adhesion obtained by laminating an adhesive layer of an adhesive sheet (width 20 mm × length 100 mm) on a polyethylene terephthalate film (thickness 25 μm) (lamination conditions: 2 kg roller, 1 round trip), placing the sample at an ambient temperature of 23°C for 30 minutes, and then subjecting the sample to a tensile test (peeling speed: 300 mm/min, peeling angle 180°). The adhesive strength of the adhesive sheet of the present invention to a silicon wafer (thickness 500 μm) at 23°C is preferably 0.1 N/20 mm to 4 N/20 mm, more preferably 0.15 N/20 mm to 3 N/20 mm, and further preferably 0.2 N/20 mm to 2 N/20 mm. Within this range, an adhesive sheet having both adhesive strength to semiconductor chips and peeling properties can be obtained. The adhesive strength to a silicon wafer can also be measured using the same method as the above-mentioned "adhesion to polyethylene terephthalate". The adhesive sheet of the present invention preferably has an adhesion to the epoxy resin sheet at 23°C of 0.1 N/20 mm to 5 N/20 mm, more preferably 0.3 N/20 mm to 4 N/20 mm, and further preferably 0.5 N/20 mm to 3 /20 mm. Within this range, the paste residue left when the sealing resin (details will be described later) is peeled off can be suppressed. The adhesion to the epoxy resin film can also be measured using the same method as the above-mentioned "adhesion to polyethylene terephthalate". Furthermore, as the above-mentioned epoxy resin film, for example, a film composed of the sealing resin described in the evaluation of the "stand off suppression effect" of the embodiment can be used. The adhesive layer outer surface of the adhesive sheet of the present invention (width 10 mm × length 150 mm) is entirely attached to a bakelite board (width 10 mm × length 125 mm) at an ambient temperature of 23°C, and aged at an ambient temperature of 40°C for 30 minutes, and then a load of 1.96 N is applied and maintained for 2 hours. At this time, the offset of the adhesive sheet relative to the bakelite board is preferably less than 0.5 mm, and more preferably less than 0.4 mm. Furthermore, the "offset of the adhesive sheet relative to the bakelite board" here refers to the amount of movement of the adhesive sheet from the initial state based on the state before the above-mentioned aging (initial state). The adhesive sheet with a small offset is an adhesive sheet that is not easy to produce coagulation damage of the adhesive layer. This adhesive sheet is an adhesive sheet that is not easy to produce paste residues in essence. If it is such an adhesive sheet, the effect of the present invention becomes significant. The adhesive layer that is not easy to produce coagulation damage can be formed by using the above-mentioned acrylic adhesive (preferably an adhesive containing a cross-linked acrylic polymer as a base polymer) as an adhesive for forming the adhesive layer. Furthermore, as an adhesive, a rubber adhesive is used. More specifically, a rubber adhesive (Rub1) comprising a base polymer (rubber) constituting the rubber adhesive, a polyolefin containing a hydroxyl group, and a crosslinking agent that can react with the hydroxyl group of the hydroxyl polyolefin is used, and the amount of the polyolefin containing a hydroxyl group and the crosslinking agent is appropriately adjusted, thereby forming an adhesive layer that is not easily damaged by coagulation. The details are described later. The thickness of the adhesive sheet of the present invention is preferably 3 μm to 300 μm, more preferably 5 μm to 150 μm, and further preferably 10 μm to 100 μm. B. Adhesive layer The contact angle of the surface of the adhesive layer with respect to 4-tert-butylphenyl glycidyl ether is 15° or more, preferably 20° or more, further preferably 30° to 100°, and particularly preferably 40° to 60°. The adhesive layer of the adhesive sheet of the present invention has an adjusted affinity for a sealing resin (e.g., epoxy resin) used when sealing a semiconductor chip, and a monomer component constituting the sealing resin. Specifically, the affinity of the adhesive layer is adjusted in a manner that reduces the affinity within a range that can show appropriate adhesion to the sealing resin (and the semiconductor chip). The contact angle of the adhesive layer with appropriately adjusted affinity with respect to 4-tert-butylphenyl glycidyl ether shows the above range. By adjusting the affinity for the sealing resin and the monomer components constituting the sealing resin in this way, an adhesive sheet with less paste residue can be obtained. More specifically, the following adhesive sheet can be obtained: when the adhesive sheet is peeled off after being bonded to a structure including a semiconductor and a resin sealing the semiconductor (or a previous driving monomer of the resin) (Figure 1), the adhesive layer components attached to the structure can be reduced. The mechanism of reducing paste residue by using the adhesive sheet of the present invention can be considered as follows. Figure 1(a) shows an example of using a previous adhesive sheet 10' for the manufacture of a semiconductor package. The adhesive sheet 10' has an adhesive layer, and the outer surface of the adhesive layer serves as a bonding surface. Previously, in the manufacture of a semiconductor package (CSP), first, a semiconductor chip 1 is bonded to an adhesive sheet 10' (ai). Thereafter, the semiconductor chip 1 is sealed by applying a composition 2' containing a monomer that becomes a previous driver of the sealing resin 2 (a-ii), and then the composition 2' is cured (a-iii). Furthermore, as the above-mentioned composition, for example, a composition containing a naphthalene-type bifunctional epoxy resin (epoxy equivalent: 144) can be used. Subsequently, before or after the semiconductor chips are cut and separated (before cutting and separating in the example shown in the figure), the adhesive sheet 10' is peeled off from the structure 20 containing the semiconductor chip 1 and the sealing resin 2 (a-iv). When using the previous adhesive sheet, it is easy to produce paste residues during peeling. In particular, the paste residues can be significantly observed around the semiconductor chip 1. The inventors of the present invention have found that when using the previous adhesive sheet 10', the adhesive layer of the adhesive sheet 10' during peeling bulges in a manner surrounding the bottom of the semiconductor chip 1, and a step (hereinafter also referred to as the gap height) is generated in the adhesive layer of the adhesive sheet 10' during peeling due to the bottom edge of the semiconductor chip 1. It can be considered that since the stress from the semiconductor chip 1 is concentrated on the gap height portion, the cohesion and destruction of the adhesive layer occurs, resulting in the above-mentioned paste residues. FIG. 1( b ) shows an example of using the adhesive sheet 10 of the present invention in the manufacture of a semiconductor package. The adhesive sheet 10 has an adhesive layer, and the outer surface of the adhesive layer is used as a bonding surface. In FIG. 1( b ), except for changing the adhesive sheet, a structure 20 including a semiconductor chip 1 and a sealing resin 2 is formed on the adhesive sheet 10 by the same operation as shown in FIG. 1( a ), and then the adhesive sheet 10 is peeled off. When the adhesive sheet 10 of the present invention is used, the height of the gap generated in the adhesive sheet 10 is extremely small (or not generated), and the paste residue is suppressed. It is considered that in the previous adhesive sheet 10', the adhesive layer components are transferred to the composition containing the monomers of the previous driving agent that becomes the sealing resin 2, or the sealing resin, and as a result, the resin layer of the adhesive sheet 10' is raised in a manner to surround the bottom of the semiconductor chip 1, thereby generating a gap height. Furthermore, the presence or absence of component transfer can be confirmed by spectral analysis using FT-IR or the like. On the other hand, it is considered that in the present invention, the affinity of the adhesive layer to the sealing resin used when sealing the semiconductor chip and the monomer components constituting the sealing resin is adjusted, so that the component transfer as described above is suppressed, the gap height becomes extremely small (or does not occur), and as a result, the paste residue is suppressed. Furthermore, hereinafter, in this specification, the sealing resin used when sealing the semiconductor chip and the monomer components constituting the sealing resin are collectively referred to as sealing materials. The above-mentioned adhesive layer contains an adhesive. The sp value of the material (polymer) constituting the adhesive is preferably 7 (cal/cm ³ ) ^1/2 to 10 (cal/cm ³ ) ^1/2 , more preferably 7 (cal/cm ³ ) ^1/2 to 9.1 (cal/cm ³ ) ^1/2 , and further preferably 7 (cal/cm ³ ) ^1/2 to 8 (cal/cm ³ ) ^1/2 . If it is within this range, it is possible to form an adhesive layer with appropriate adhesion, low affinity with the sealing material, and less likely to produce a gap height. The adhesive sheet with such an adhesive layer is not easy to produce adhesive residue. Furthermore, the material constituting the adhesive herein refers to polymers such as the base polymer (the base polymer after crosslinking in the case of crosslinking), rubber (the rubber after crosslinking in the case of crosslinking), and adhesive imparting agent contained in the adhesive. In the present invention, it is preferred that the sp value of the base polymer (the base polymer after crosslinking in the case of crosslinking) or rubber (the rubber after crosslinking in the case of crosslinking) as at least the main component of the adhesive is within the above range. In one embodiment, the surface of the adhesive layer is contacted with 1,3-bis(N,N-diglycerylaminomethyl)cyclohexane and placed in an environment of 50°C for 2 hours. When the absorbance of the peak derived from glycidyl groups is measured by FT-IR measurement on the adhesive surface, the absorbance of the peak derived from glycidyl groups is preferably 1.3 or less, more preferably 1.1 or less, and even more preferably 1.05 or less relative to the absorbance of the peak derived from glycidyl groups of the initial adhesive layer. Furthermore, the so-called "initial adhesive layer" refers to the adhesive layer before contacting with 1,3-bis(N,N-diglycerylaminomethyl)cyclohexane. In another embodiment, the surface of the adhesive layer is contacted with 1,3-bis(N,N-diglycidylaminomethyl)cyclohexane and placed in an environment of 50°C for 2 hours. When the adhesive surface is subjected to FT-IR measurement (e.g., attenuated total reflectance method (ATR method)), the increase in absorbance at the wave number (near 850 cm ^-1 ) of the peak originating from the glycidyl group is preferably 0.3 or less, more preferably 0.1 or less from the initial adhesive layer. Here, 1,3-bis(N,N-diglycidylaminomethyl)cyclohexane is an epoxy compound that can be used as a resin material for sealing semiconductor chips. By forming an adhesive layer that is not easy to transfer the epoxy compound even when in contact with the epoxy compound, an adhesive sheet that is not easy to produce a gap height and has little paste residue even when used in the manufacture of semiconductor packages can be obtained. The thickness of the adhesive layer is preferably 1 μm to 300 μm, more preferably 3 μm to 300 μm, further preferably 5 μm to 150 μm, further preferably 10 μm to 100 μm, further preferably 10 μm to 50 μm. When the adhesive layer contains heat-expandable microspheres as described below, the thickness of the adhesive layer is preferably 3 μm to 300 μm, more preferably 5 μm to 150 μm, and further preferably 10 μm to 100 μm. Within this range, an adhesive layer having excellent surface smoothness and excellent adhesion can be formed. When the adhesive layer does not contain heat-expandable microspheres, the thickness of the adhesive layer is preferably 50 μm or less, more preferably 1 μm to 50 μm, and further preferably 5 μm to 30 μm. The elastic modulus of the adhesive layer measured by the nanoindentation method at 25°C is preferably less than 100 MPa, more preferably 0.1 MPa to 50 MPa, and further preferably 0.1 MPa to 10 MPa. If it is within this range, an adhesive sheet having an appropriate adhesive force that can be used for the manufacture of semiconductor packages can be obtained. The elastic modulus measured by the nanoindentation method refers to the elastic modulus obtained from the load-indentation depth curve obtained by continuously measuring the load and the indentation depth of the indentation head when the indentation head is pressed into the sample during loading and unloading. In this specification, the elastic modulus measured by the nanoindentation method refers to the elastic modulus measured as described above under the measurement conditions of load: 1 mN, loading/unloading speed: 0.1 mN/s, and holding time: 1 s. The tensile elastic modulus of the adhesive layer at 25°C is preferably less than 100 MPa, more preferably 0.1 MPa to 50 MPa, and further preferably 0.1 MPa to 10 MPa. If it is within this range, an adhesive sheet having an appropriate adhesive force that can be used as an adhesive sheet for the manufacture of semiconductor packages can be obtained. Furthermore, the tensile elastic modulus can be measured in accordance with JIS K 7161:2008. The probe viscosity of the above adhesive layer is preferably 50 N/5 mm Above, preferably 75 N/5 mm Above, preferably 100 N/5 mm or above. If it is within this range, the retention of the adherend is excellent, for example, when the semiconductor chip is temporarily fixed, unnecessary positional displacement of the semiconductor chip can be prevented. The method for measuring the probe viscosity value is described as follows. <Adhesive> As an adhesive constituting the above-mentioned adhesive layer, any suitable adhesive can be used as long as the effect of the present invention can be obtained. It is preferred to use an adhesive containing a base polymer having an sp value in the above-mentioned range. As the adhesive, for example: acrylic adhesive, rubber adhesive, silicone adhesive, etc. can be listed. Among them, acrylic adhesive can be preferably used. In addition, active energy ray curing adhesive can also be used as the adhesive. (Acrylic adhesive) Examples of the acrylic adhesive include acrylic adhesives using one or more (meth)acrylic acid alkyl esters as monomer components and acrylic polymers (homopolymers or copolymers) as base polymers. The acrylic polymer is preferably an alkyl ester having 4 or more carbon atoms in the side chain, more preferably an alkyl ester having 6 or more carbon atoms in the side chain, further preferably an alkyl ester having 8 or more carbon atoms in the side chain, particularly preferably an alkyl ester having 8 to 20 carbon atoms in the side chain, and most preferably an alkyl ester having 8 to 18 carbon atoms in the side chain. If an acrylic polymer having a long side chain is used, an adhesive layer having low affinity with the sealing material can be formed. In the acrylic polymer, the content ratio of the structural unit having an alkyl ester with a carbon number of 4 or more in the side chain is preferably 30% by weight or more, more preferably 50% by weight or more, further preferably 70% by weight to 100% by weight, and particularly preferably 80% by weight to 100% by weight relative to the total structural units constituting the acrylic polymer. Within this range, an adhesive layer having low affinity with the sealing material can be formed. The acrylic adhesive may include a plurality of acrylic polymers, and the content ratio of the acrylic polymer having an alkyl ester with a carbon number of 4 or more in the side chain is preferably 30% by weight to 100% by weight, and more preferably 70% by weight to 100% by weight relative to 100% by weight of all acrylic polymers. Specific examples of the alkyl (meth)acrylates include methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, isopropyl (meth)acrylate, butyl (meth)acrylate, isobutyl (meth)acrylate, sec-butyl (meth)acrylate, tert-butyl (meth)acrylate, pentyl (meth)acrylate, hexyl (meth)acrylate, heptyl (meth)acrylate, octyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, isooctyl (meth)acrylate, octyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, octyl (meth)acrylate, 2- ... C1-20 alkyl (meth)acrylates such as nonyl (meth)acrylate, isononyl (meth)acrylate, decyl (meth)acrylate, isodecyl (meth)acrylate, undecyl (meth)acrylate, dodecyl (meth)acrylate, tridecyl (meth)acrylate, tetradecyl (meth)acrylate, pentadecyl (meth)acrylate, hexadecyl (meth)acrylate, heptadecyl (meth)acrylate, octadecyl (meth)acrylate, nonadecyl (meth)acrylate, eicosyl (meth)acrylate, etc. Among them, alkyl (meth)acrylates having a linear or branched alkyl group with 4 to 20 carbon atoms (more preferably 6 to 20, and particularly preferably 8 to 18 carbon atoms) are preferred, and 2-ethylhexyl (meth)acrylate is more preferred. The acrylic polymers described above may also contain units corresponding to other monomer components copolymerizable with the alkyl (meth)acrylates described above as necessary for the purpose of improving cohesiveness, heat resistance, crosslinking, etc. Examples of such monomer components include: monomers containing a carboxyl group such as acrylic acid, methacrylic acid, carboxyethyl acrylate, carboxypentyl acrylate, itaconic acid, maleic acid, fumaric acid, and butenoic acid; acid anhydride monomers such as maleic anhydride and itaconic anhydride; hydroxyethyl (meth)acrylate, hydroxypropyl (meth)acrylate, hydroxybutyl (meth)acrylate, hydroxyhexyl (meth)acrylate, hydroxyoctyl (meth)acrylate, hydroxydecyl (meth)acrylate, hydroxylauryl (meth)acrylate, methacrylic acid (4-hydroxymethylcyclohexyl) acrylate, and the like. Monomers containing hydroxyl groups, such as styrenesulfonic acid, allylsulfonic acid, 2-(meth)acrylamide-2-methylpropanesulfonic acid, (meth)acrylamidepropanesulfonic acid, (meth)acrylatesulfopropyl, (meth)acryloxynaphthalenesulfonic acid, etc.; (N-substituted)amide monomers, such as (meth)acrylamide, N,N-dimethyl(meth)acrylamide, N-butyl(meth)acrylamide, N-hydroxymethyl(meth)acrylamide, N-hydroxymethylpropane(meth)acrylamide, etc.; (meth)acrylamideethyl, (meth) (Meth)acrylic acid aminoalkyl ester monomers such as N,N-dimethylaminoethyl acrylate and tert-butylaminoethyl (meth)acrylate; (meth)acrylic acid alkoxyalkyl ester monomers such as methoxyethyl (meth)acrylate and ethoxyethyl (meth)acrylate; (meth)acrylic acid diimide monomers such as N-cyclohexyl diimide, N-isopropyl diimide, N-lauryl diimide, and N-phenyl diimide; N-methyliconimide, N-ethyliconimide, N-butyliconimide, N-octyl Iconimide monomers such as iconimide, N-2-ethylhexyl iconimide, N-cyclohexyl iconimide, and N-lauryl iconimide; succinimide monomers such as N-(meth)acryloxymethylenesuccinimide, N-(meth)acryl-6-oxyhexamethylenesuccinimide, and N-(meth)acryl-8-oxyoctamethylenesuccinimide; vinyl acetate, vinyl propionate, N-vinylpyrrolidone, methylvinylpyrrolidone, vinylpyridine, vinylpiperidone, vinylpyrimidine, vinylpiperidone, , vinyl pyridine , vinylpyrrole, vinylimidazole, vinyl Azole, Vinyl Vinyl monomers such as phenoxyethylene, N-vinyl carboxylic acid amides, styrene, α-methylstyrene, N-vinyl caprolactam, etc.; cyanoacrylate monomers such as acrylonitrile and methacrylonitrile; acrylic monomers containing epoxy groups such as glycidyl (meth)acrylate; glycol acrylate monomers such as polyethylene glycol (meth)acrylate, polypropylene glycol (meth)acrylate, methoxy polyethylene glycol (meth)acrylate, methoxy polypropylene glycol (meth)acrylate; tetrahydrofurfuryl (meth)acrylate, fluoro (meth)acrylate, polysiloxane (meth)acrylate, etc. Acrylate monomers containing hexanediol di(meth)acrylate, (poly)ethylene glycol di(meth)acrylate, (poly)propylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate, pentaerythritol di(meth)acrylate, trihydroxymethylpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol hexa(meth)acrylate, epoxy acrylate, polyester acrylate, urethane acrylate and other polyfunctional monomers; olefin monomers such as isoprene, butadiene, isobutylene; vinyl ether monomers such as vinyl ether, etc. These monomer components can be used alone or in combination of two or more. Among the above, more preferred are monomers containing a carboxyl group (especially acrylic acid) or monomers containing a hydroxyl group (especially hydroxyethyl (meth)acrylate). The content of the structural unit derived from the monomer containing a carboxyl group is preferably 0.1 wt% to 10 wt%, more preferably 0.5 wt% to 5 wt%, and particularly preferably 1 wt% to 4 wt% relative to the total structural unit constituting the acrylic polymer. In addition, the content of the structural unit derived from the monomer containing a hydroxyl group is preferably 0.1 wt% to 20 wt%, more preferably 0.5 wt% to 10 wt%, and particularly preferably 1 wt% to 7 wt% relative to the total structural unit constituting the acrylic polymer. The acrylic adhesive may contain any appropriate additive as needed. Examples of such additives include: crosslinking agents, adhesion promoters, plasticizers (e.g., trimellitic acid ester plasticizers, pyromellitic acid ester plasticizers, etc.), pigments, dyes, fillers, anti-aging agents, conductive materials, antistatic agents, ultraviolet absorbers, light stabilizers, stripping modifiers, softeners, surfactants, flame retardants, antioxidants, etc. Examples of the crosslinking agent included in the acrylic adhesive include isocyanate crosslinking agents, epoxy crosslinking agents, melamine crosslinking agents, and peroxide crosslinking agents. Examples of the crosslinking agent include urea crosslinking agents, metal alkoxide crosslinking agents, metal chelate crosslinking agents, metal salt crosslinking agents, carbodiimide crosslinking agents, Oxazoline crosslinking agents, aziridine crosslinking agents, amine crosslinking agents, etc. Among them, isocyanate crosslinking agents or epoxy crosslinking agents are preferred. Specific examples of the isocyanate crosslinking agent contained in the acrylic adhesive include: low-order aliphatic polyisocyanates such as butyl diisocyanate and hexamethylene diisocyanate; alicyclic isocyanates such as cyclopentyl diisocyanate, cyclohexyl diisocyanate, and isophorone diisocyanate; aromatic isocyanates such as 2,4-toluene diisocyanate, 4,4'-diphenylmethane diisocyanate, and xylylene diisocyanate; trihydroxymethylpropane/toluene diisocyanate trimer adduct (manufactured by Nippon Polyurethane Industry Co., Ltd., trade name "CORONATE L"), trihydroxymethylpropane/hexamethylene diisocyanate trimer adduct (Nippon Polyurethane Industry Co., Ltd., trade name "CORONATE L"), and trihydroxymethylpropane/hexamethylene diisocyanate trimer adduct (Nippon Polyurethane Industry Co., Ltd., trade name "CORONATE L"). Industry, trade name "CORONATE HL"), isocyanurate of hexamethylene diisocyanate (Nippon Polyurethane Industry, trade name "CORONATE HX"), etc. The content of the isocyanate crosslinking agent can be set to any appropriate amount according to the desired adhesion, and is typically 0.1 to 20 parts by weight, more preferably 0.5 to 10 parts by weight, relative to 100 parts by weight of the base polymer. Examples of the epoxy crosslinking agent included in the acrylic adhesive include N,N,N',N'-tetraglycidyl-m-xylylenediamine, diglycidylaniline, 1,3-bis(N,N-glycidylaminomethyl)cyclohexane (manufactured by Mitsubishi Gas Chemical Co., Ltd., trade name "TETRAD-C"), 1,6-hexanediol diglycidyl ether (manufactured by Kyoeisha Chemical Co., Ltd., trade name "EPOLIGHT 1600"), neopentyl glycol diglycidyl ether (manufactured by Kyoeisha Chemical Co., Ltd., trade name "EPOLIGHT 1500NP"), ethylene glycol diglycidyl ether (manufactured by Kyoeisha Chemical Co., Ltd., trade name "EPOLIGHT 40E"), propylene glycol diglycidyl ether (manufactured by Kyoeisha Chemical Co., Ltd., trade name "EPOLIGHT 70P"), polyethylene glycol diglycidyl ether (manufactured by NOF Corporation, trade name "EPIOL E-400"), polypropylene glycol diglycidyl ether (manufactured by NOF Corporation, trade name "EPIOL P-200"), sorbitol polyglycidyl ether (manufactured by Nagase ChemteX, trade name "DENACOL EX-611"), glycerol polyglycidyl ether (manufactured by Nagase ChemteX, trade name "DENACOL EX-314"), pentaerythritol polyglycidyl ether, polyglycerol polyglycidyl ether (manufactured by Nagase ChemteX, trade name "DENACOL EX-512"), sorbitan polyglycidyl ether, trihydroxymethylpropane polyglycidyl ether, diglycidyl adipate, diglycidyl phthalate, triglycidyl-tri(2-hydroxyethyl)isocyanurate, resorcinol diglycidyl ether, bisphenol-S-diglycidyl ether, epoxy resins having two or more epoxy groups in the molecule, etc. The content of the epoxy crosslinking agent can be set to any appropriate amount according to the desired adhesion, and is typically 0.01 to 10 parts by weight, and more preferably 0.03 to 5 parts by weight, relative to 100 parts by weight of the base polymer. Any appropriate tackifier may be used as the tackifier included in the acrylic adhesive. For example, a tackifier resin may be used as the tackifier. Specific examples of the tackifier resin include rosin-based tackifier resins (e.g., unmodified rosin, modified rosin, rosin phenol-based resins, rosin ester-based resins, etc.), terpene-based tackifier resins (e.g., terpene-based resins, terpene phenol-based resins, styrene-modified terpene-based resins, aromatic-modified terpene-based resins, hydrogenated terpene-based resins), hydrocarbon-based tackifier resins (e.g., aliphatic hydrocarbon resins, aliphatic cyclic hydrocarbon resins, aromatic hydrocarbon resins, etc.), For example, styrene-based resins, xylene-based resins, etc.), aliphatic/aromatic petroleum resins, aliphatic/aliphatic cyclopentane petroleum resins, hydrogenated hydrocarbon resins, coumarone-based resins, coumarone-indene-based resins, etc.), phenol-based adhesive-imparting resins (for example, alkylphenol-based resins, xylene formaldehyde-based resins, soluble phenolic resins, phenolic varnishes, etc.), ketone-based adhesive-imparting resins, polyamide-based adhesive-imparting resins, epoxy-based adhesive-imparting resins, elastic system adhesive-imparting resins, etc. Among them, rosin-based adhesive-imparting resins, terpene-based adhesive-imparting resins or hydrocarbon-based adhesive-imparting resins (styrene-based resins, etc.) are preferred. Adhesive-imparting agents can be used alone or in combination of two or more. The amount of the above-mentioned adhesive-imparting agent added is preferably 5 to 100 parts by weight, more preferably 10 to 50 parts by weight, relative to 100 parts by weight of the base polymer. It is preferred to use a resin with a high softening point or glass transition temperature (Tg) as the above-mentioned adhesive-imparting resin. If a resin with a high softening point or glass transition temperature (Tg) is used, an adhesive layer that can exhibit high adhesion can be formed even in a high temperature environment (for example, in a high temperature environment during processing when sealing a semiconductor chip). The softening point of the adhesion-imparting agent is preferably 100°C to 180°C, more preferably 110°C to 180°C, and further preferably 120°C to 180°C. The glass transition temperature (Tg) of the adhesion-imparting agent is preferably 100°C to 180°C, more preferably 110°C to 180°C, and further preferably 120°C to 180°C. It is preferred to use a low-polarity adhesion-imparting resin as the above-mentioned adhesion-imparting resin. If a low-polarity tackifier resin is used, an adhesive layer with low affinity to the sealing material can be formed. Examples of low-polarity tackifier resins include aliphatic hydrocarbon resins, aliphatic cyclic hydrocarbon resins, aromatic hydrocarbon resins (e.g., styrene resins, xylene resins, etc.), aliphatic and aromatic petroleum resins, aliphatic and alicyclic petroleum resins, and hydrocarbon tackifier resins such as hydrogenated hydrocarbon resins. Among them, tackifiers with 5 to 9 carbon atoms are preferred. This type of adhesion-imparting agent has low polarity and excellent compatibility with acrylic polymers. It does not phase separate in a wide temperature range and can form an adhesion-imparting agent layer with excellent stability. The acid value of the adhesion-imparting resin is preferably 40 or less, more preferably 20 or less, and further preferably 10 or less. Within this range, an adhesion-imparting agent layer with low affinity to the sealing material can be formed. The hydroxyl value of the adhesion-imparting resin is preferably 60 or less, more preferably 40 or less, and further preferably 20 or less. Within this range, an adhesion-imparting agent layer with low affinity to the sealing material can be formed. (Rubber-based Adhesive) As the rubber-based adhesive, any appropriate adhesive may be used as long as the effects of the present invention can be obtained. As the above-mentioned rubber adhesive, for example, it is preferable to use a rubber adhesive using the following as a base polymer: natural rubber; polyisoprene rubber, butadiene rubber, styrene-butadiene (SB) rubber, styrene-isoprene (SI) rubber, styrene-isoprene-styrene block copolymer (SIS) rubber, styrene-butadiene-styrene block copolymer (SBS) rubber, styrene-ethylene-butylene-styrene block copolymer (SEBS) rubber, styrene-ethylene-propylene-styrene block copolymer (SEPS) rubber, styrene-ethylene-propylene block copolymer (SEP) rubber, recycled rubber, butyl rubber, polyisobutylene rubber, or synthetic rubbers such as modified products thereof. The sp value of the base polymer (rubber) is low. If the base polymer is used, an adhesive layer with low affinity to the sealing material can be formed. As the base polymer constituting the above-mentioned rubber-based adhesive, it is particularly preferred to use polyisobutylene rubber, polyisoprene rubber or butyl rubber. If these rubbers are used, an adhesive layer with excellent semiconductor chip retention at room temperature and excellent peeling properties can be formed. In addition, an adhesive layer with low affinity to the sealing material can be formed. As the base polymer constituting the above-mentioned rubber-based adhesive, styrene-ethylene-propylene block copolymer (SEP) rubber, styrene-ethylene-butylene-styrene block copolymer (SEBS) rubber, styrene-isoprene-styrene block copolymer (SIS) rubber, styrene-butadiene-styrene block copolymer (SBS) rubber, and propylene rubber can also be preferably used. If these rubbers are used, an adhesive layer that can exhibit high adhesion can be formed even in a high temperature environment (for example, in a high temperature environment during processing during semiconductor chip sealing). In the base polymer (rubber) having a structural unit derived from styrene, the content ratio of the structural unit derived from styrene relative to the total structural unit in the base polymer is preferably 15% by weight or more. The rubber adhesive may contain any appropriate additives as required. Examples of the additives include: crosslinking agents, vulcanizers, adhesives, plasticizers, pigments, dyes, fillers, anti-aging agents, conductive materials, antistatic agents, ultraviolet absorbers, light stabilizers, stripping modifiers, softeners, surfactants, flame retardants, antioxidants, etc. Any appropriate adhesive can be used as the adhesive contained in the rubber adhesive. For example, adhesive resin can be used as the adhesive. Specific examples of the adhesive imparting resin include: rosin-based adhesive imparting resin, rosin derivative resin, petroleum-based resin, terpene-based resin, ketone-based resin, etc. The amount of the above-mentioned adhesive imparting agent added is preferably 5 to 100 parts by weight, and more preferably 10 to 50 parts by weight, relative to 100 parts by weight of the base polymer. Examples of the rosin-based resin contained in the above-mentioned rubber-based adhesive include: gum rosin, wood rosin, tall rosin, etc. As the rosin-based resin, stabilized rosin obtained by disproportionation or hydrogenation of any appropriate rosin can also be used. Furthermore, as the rosin-based resin, a polymerized rosin which is a polymer (representatively a dimer) of any appropriate rosin, or a modified rosin obtained by modifying any appropriate rosin (for example, by modifying it with an unsaturated acid) can also be used. Examples of the rosin derivative resin contained in the rubber-based adhesive include: esters of the rosin-based resin, phenol-modified rosin-based resins, esters of phenol-modified rosin-based resins, etc. Examples of the petroleum-based resin contained in the rubber-based adhesive include: aliphatic petroleum resins, aromatic petroleum resins, copolymerized petroleum resins, alicyclic petroleum resins, and hydrogenated products thereof. Examples of the terpene resin included in the rubber adhesive include α-pinene resin, β-pinene resin, aromatic modified terpene resin, terpene phenol resin, etc. Examples of the ketone resin included in the rubber adhesive include ketone resins obtained by condensing ketones (e.g., aliphatic ketones, alicyclic ketones) with formaldehyde. Examples of the crosslinking agent included in the rubber adhesive include isocyanate crosslinking agents, etc. Examples of the vulcanizing agent included in the rubber adhesive include thiuram vulcanizing agents, quinone vulcanizing agents, quinone dioxime vulcanizing agents, etc. If the rubber adhesive contains a crosslinking agent and/or a vulcanizing agent, an adhesive layer with high cohesion and less paste residue can be formed. The total content of the crosslinking agent and the vulcanizing agent is typically 0.1 to 20 parts by weight, and more preferably 0.1 to 10 parts by weight, relative to 100 parts by weight of the base polymer. In one embodiment, a rubber adhesive (Rub1) is used, which includes the above-mentioned base polymer (rubber), a polyolefin containing a hydroxyl group, and a crosslinking agent a that can react with the hydroxyl group of the hydroxyl polyolefin. In the rubber adhesive, the base polymer is not directly crosslinked, but the base polymer and the crosslinked hydroxyl-containing polyolefin are entangled with each other, so-called pseudo-crosslinking is performed. As a result, an adhesive layer with high cohesion and less prone to paste residue can be formed. As the base polymer (rubber) used in the embodiment, it is preferably the above-mentioned synthetic rubber. In addition, as the crosslinking agent used in the embodiment, it is preferably an isocyanate crosslinking agent. The amount of the polyolefin containing a hydroxyl group is preferably 0.5 parts by weight or more, and more preferably 1.0 parts by weight or more, relative to 100 parts by weight of the base polymer (rubber), the polyolefin containing a hydroxyl group, and the crosslinking agent a in total. If it is within this range, an adhesive layer with high cohesion can be formed. In addition, when the adhesive sheet has a substrate layer, the adhesion (grip) between the substrate layer and the adhesive layer can be improved. That is, if the amount of the polyolefin containing a hydroxyl group is within the above range, an adhesive sheet with less paste residue can be obtained. The amount of the crosslinking agent a is preferably 0.5 parts by weight or more, and more preferably 1.0 parts by weight or more, relative to 100 parts by weight of the total of the base polymer (rubber), the polyolefin containing a hydroxyl group, and the crosslinking agent a. If it is within this range, an adhesive layer with high cohesion can be formed. In addition, when the adhesive sheet has a substrate layer, the adhesion (gripping force) between the substrate layer and the adhesive layer can be improved. That is, if the amount of the crosslinking agent a is within the above range, an adhesive sheet with less paste residue can be obtained. As the polyolefin containing a hydroxyl group, it is preferred to use a resin that has excellent compatibility with the synthetic rubber. Examples of polyolefins containing hydroxyl groups include polyethylene polyols, polypropylene polyols, polybutadiene polyols, hydrogenated polybutadiene polyols, polyisoprene polyols, and hydrogenated polyisoprene polyols. In terms of compatibility with the synthetic rubber, hydrogenated polyisoprene polyols, polyisoprene polyols, and polybutadiene polyols are preferred. The number average molecular weight (Mn) of the polyolefins containing hydroxyl groups is preferably 500 to 500,000, more preferably 1,000 to 200,000, and further preferably 1,200 to 150,000. The number average molecular weight can be measured according to ASTM D2503. The hydroxyl value (mgKOH/g) of the above-mentioned polyolefin containing a hydroxyl group is preferably 5 to 95, more preferably 10 to 80. The hydroxyl value can be measured according to JIS K1557:1970. (Polysilicone adhesive) As the above-mentioned polysilicone adhesive, any appropriate adhesive can be used as long as the effect of the present invention can be obtained. As the above-mentioned polysilicone adhesive, for example, a polysilicone adhesive containing a polysilicone rubber or a polysilicone resin as a base polymer can be preferably used. As the base polymer constituting the polysilicone adhesive, a base polymer obtained by crosslinking the above-mentioned polysilicone rubber or polysilicone resin can also be used. Furthermore, in this specification, the so-called "polysilicone rubber" refers to a polymer in which two organic siloxanes (D units) as the main components are connected in a straight chain (for example, a viscosity of 1000 Pa·s); the so-called "polysilicone resin" refers to a polymer composed of three organic semi-siloxanes (M units) and silicates (Q units) as the main components ("Material Design and Functionalization of Adhesives (Films and Tapes)", Association for Technical Information, published on September 30, 2009). As the above-mentioned polysiloxane rubber, for example, an organic polysiloxane containing dimethylsiloxane as a structural unit can be listed. A functional group (for example, vinyl group) can also be introduced into the organic polysiloxane as needed. The weight average molecular weight of the organic polysiloxane is preferably 100,000 to 1,000,000, more preferably 150,000 to 500,000. The weight average molecular weight can be measured by GPC (solvent: THF). As the above-mentioned polysilicone resin, for example, there can be cited organic polysiloxane (R is a monovalent hydrocarbon group or a hydroxyl group) containing at least one structural unit selected from the group consisting of R ₃ SiO _1/2 structural unit, SiO ₂ structural unit, RSiO _3/2 structural unit and R ₂ SiO structural unit. The above-mentioned polysilicone rubber and polysilicone resin can be used together. The weight ratio of the polysilicone rubber to the polysilicone resin in the polysilicone adhesive (rubber: resin) is preferably 100:0 to 100:220, more preferably 100:0 to 100:180, and further preferably 100:10 to 100:100. The silicone rubber and the silicone resin may be contained in the silicone adhesive as a simple mixture or in a partially condensed form. The rubber:resin ratio may also be obtained by measuring the composition of the silicone adhesive using ²⁹ Si-NMR to determine the ratio of Q unit (resin) to D unit (rubber). The silicone adhesive may contain any appropriate additives as required. Examples of the additive include: crosslinking agent, vulcanizing agent, adhesion agent, plasticizer, pigment, dye, filler, anti-aging agent, conductive material, antistatic agent, ultraviolet absorber, light stabilizer, stripping modifier, softener, surfactant, flame retardant, antioxidant, etc. Preferably, the polysilicone adhesive includes a crosslinking agent. Examples of the crosslinking agent include siloxane crosslinking agent, peroxide crosslinking agent, etc. As the peroxide crosslinking agent, any appropriate crosslinking agent can be used. Examples of peroxide crosslinking agents include benzoyl peroxide, tert-butyl perbenzoate, diisopropylbenzene peroxide, and the like. Examples of siloxane crosslinking agents include polyorganohydrosiloxanes, and the like. The polyorganohydrosiloxanes preferably have two or more hydrogen atoms bonded to silicon atoms. Furthermore, the polyorganohydrosiloxanes preferably have alkyl, phenyl, or halogenated alkyl groups as functional groups bonded to silicon atoms. (Active energy ray-curing adhesive) As the above-mentioned adhesive, an active energy ray-curing adhesive that can be cured (high elastic modulus) by irradiation with active energy rays can also be used. If an active energy ray-curing adhesive is used, the following adhesive sheet can be obtained: it is low in elasticity and highly flexible when attached, and has excellent handling properties. When peeling is required, the adhesive force can be reduced by irradiating the active energy ray. Examples of active energy rays include: gamma rays, ultraviolet rays, visible light, infrared rays (heat rays), radio frequency waves, alpha rays, beta rays, electron beams, plasma currents, ionizing rays, particle beams, etc. Furthermore, when the term "adhesive layer" is used in this specification, it refers to the adhesive layer before the adhesive is cured and the adhesive force is reduced. Examples of the resin material constituting the active energy ray-curing adhesive include the resin materials described in Ultraviolet Curing System (Kato Kiyoshi, published by the Center for Integrated Technology (1989)), Photocuring Technology (Technical Information Association (2000)), Japanese Patent Publication No. 2003-292916, Japanese Patent No. 4151850, etc. More specifically, the resin material (R1) includes a polymer serving as a masterbatch and an active energy ray-reactive compound (monomer or oligomer), and the resin material (R2) includes an active energy ray-reactive polymer. Examples of the polymer used as the masterbatch include natural rubber, polyisobutylene rubber, styrene-butadiene rubber, styrene-isoprene-styrene block copolymer rubber, recycled rubber, butyl rubber, polyisobutylene rubber, nitrile rubber (NBR) and other rubber-based polymers; silicone-based polymers; acrylic polymers, etc. These polymers can be used alone or in combination of two or more. From the viewpoint of affinity with the sealing material, the polymer used as the base polymer of the acrylic adhesive, rubber adhesive or silicone adhesive is preferably used. Examples of the active energy ray-reactive compound include photoreactive monomers or oligomers having a functional group having a carbon-carbon multiple bond such as an acryloyl group, a methacryloyl group, a vinyl group, an allyl group, an ethynyl group, etc. Specific examples of the photoreactive monomer or oligomer include compounds containing a (meth)acryloyl group such as trihydroxymethylpropane tri(meth)acrylate, tetrahydroxymethylmethane tetra(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol monohydroxy penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, 1,4-butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, polyethylene glycol di(meth)acrylate, etc.; dimers to pentamers of the compounds containing a (meth)acryloyl group, etc. In addition, as the above-mentioned active energy ray-reactive compound, monomers such as butylene oxide, methacrylate, acrylamide, vinyl siloxane, etc., or oligomers composed of the monomers can also be used. The resin material (R1) containing these compounds can be cured by high-energy radiation such as ultraviolet rays and electron beams. Furthermore, as the above-mentioned active energy ray-reactive compound, a mixture of organic salts such as onium salts and compounds having multiple heterocycles in the molecule can also be used. The mixture can be irradiated with active energy rays (for example, ultraviolet rays, electron beams) to cause the organic salt to decompose and generate ions, which are used as starting species to cause a ring-opening reaction of the heterocycle to obtain a three-dimensional network structure. Examples of the organic salts include iodonium salts, phosphonium salts, antimony salts, cobalt salts, and boric acid salts. Examples of the heterocyclic rings in the compound having a plurality of heterocyclic rings in the molecule include ethylene oxide, cyclohexane, cyclopentane, cyclosulfide, and aziridine. In the resin material (R1) comprising the polymer serving as a matrix and the active energy ray-reactive compound, the content of the active energy ray-reactive compound is preferably 0.1 to 500 parts by weight, more preferably 1 to 300 parts by weight, and further preferably 10 to 200 parts by weight, relative to 100 parts by weight of the polymer serving as a matrix. If it is within this range, an adhesive layer with low affinity for the sealing material can be formed. The above-mentioned resin material (R1) containing a polymer serving as a masterbatch and an active energy ray reactive compound may contain any appropriate additive as needed. As additives, for example, there can be listed: active energy ray polymerization initiators, active energy ray polymerization accelerators, crosslinking agents, plasticizers, vulcanizers, etc. As active energy ray polymerization initiators, any appropriate initiator can be used depending on the type of active energy ray used. Active energy ray polymerization initiators can be used alone or in combination of two or more. In the resin material (R1) comprising a polymer serving as a masterbatch and an active energy ray-reactive compound, the content ratio of the active energy ray polymerization initiator is preferably 0.1 to 10 parts by weight, and more preferably 1 to 5 parts by weight, relative to 100 parts by weight of the polymer serving as a masterbatch. Examples of the active energy ray-reactive polymer include polymers having functional groups having carbon-carbon multiple bonds such as acryl, methacryl, vinyl, allyl, and ethynyl. Specific examples of polymers having active energy ray-reactive functional groups include polymers composed of multifunctional (meth)acrylates. The polymer composed of multifunctional (meth)acrylate is preferably an alkyl ester having a carbon number of 4 or more, more preferably an alkyl ester having a carbon number of 6 or more, further preferably an alkyl ester having a carbon number of 8 or more, particularly preferably an alkyl ester having a carbon number of 8 to 20, and most preferably an alkyl ester having a carbon number of 8 to 18. If a polymer having a long side chain is used, an adhesive layer having a low affinity with the sealing material can be formed. In the polymer, the content ratio of the structural unit having an alkyl ester having a carbon number of 4 or more in the side chain is preferably 30% by weight or more, more preferably 50% by weight or more, further preferably 70% by weight to 100% by weight, and particularly preferably 80% by weight to 100% by weight relative to the total structural units constituting the polymer. If it is within this range, it is possible to form an adhesive layer with low affinity for the sealing material. The above-mentioned resin material (R2) containing the active energy ray reactive polymer may further contain the above-mentioned active energy ray reactive compound (monomer or oligomer). In addition, the above-mentioned resin material (R2) containing the active energy ray reactive polymer may contain any appropriate additive as needed. Specific examples of additives are the same as the additives that can be contained in the resin material (R1) containing the polymer that becomes the masterbatch and the active energy ray reactive compound. In the resin material (R2) containing the active energy ray reactive polymer, the content ratio of the active energy ray polymerization initiator is preferably 0.1 weight part to 10 weight parts, and more preferably 1 weight part to 5 weight parts relative to 100 weight parts of the active energy ray reactive polymer. <Thermal Expandable Microspheres> In one embodiment, the adhesive layer further includes thermal expandable microspheres. When the adhesive sheet having the adhesive layer including the thermal expandable microspheres is heated, the thermal expandable microspheres expand or foam to produce irregularities on the adhesive surface, and as a result, the adhesive force decreases or disappears. Such an adhesive sheet can be easily peeled off by heating. As the thermal expandable microspheres, any appropriate thermal expandable microspheres can be used as long as they are microspheres that can expand or foam by heating. As the thermal expandable microspheres, for example, microspheres in which a substance that easily expands by heating is enclosed in an elastic shell can be used. Such heat-expandable microspheres can be produced by any appropriate method, such as coacervation, interfacial polymerization, etc. Examples of substances that easily expand by heating include: propane, propylene, butene, n-butane, isobutane, isopentane, neopentane, n-pentane, n-hexane, isohexane, heptane, octane, petroleum ether, methane halides, tetraalkylsilane and other low-boiling point liquids; azodicarboxamides that vaporize by thermal decomposition, etc. As the material constituting the shell, for example, there can be cited polymers composed of the following materials: nitrile monomers such as acrylonitrile, methacrylonitrile, α-chloroacrylonitrile, α-ethoxyacrylonitrile, and fumaric dinitrile; carboxylic acid monomers such as acrylic acid, methacrylic acid, itaconic acid, maleic acid, fumaric acid, and citric acid; vinylidene chloride; vinyl acetate; methyl (meth)acrylate, ethyl (meth)acrylate, n-butyl (meth)acrylate, isobutyl (meth)acrylate, tert-butyl (meth)acrylate, isobutyl (meth)acrylate, Ester, (meth)acrylate ester, cyclohexyl (meth)acrylate, benzyl (meth)acrylate, β-carboxyethyl acrylate and other (meth)acrylates; styrene monomers such as styrene, α-methylstyrene, chlorostyrene and other styrene monomers; acrylamide, substituted acrylamide, methacrylamide, substituted methacrylamide and other amide monomers. The polymer composed of these monomers may be a homopolymer or a copolymer. As the copolymer, for example: vinylidene chloride-methyl methacrylate-acrylonitrile copolymer, methyl methacrylate-acrylonitrile-methacrylonitrile copolymer, methyl methacrylate-acrylonitrile copolymer, acrylonitrile-methacrylonitrile-itaconic acid copolymer, etc. can be listed. As the above-mentioned thermally expandable microspheres, inorganic foaming agents or organic foaming agents can also be used. Examples of inorganic foaming agents include ammonium carbonate, ammonium bicarbonate, sodium bicarbonate, ammonium nitrite, sodium borohydride, and various azides. Examples of organic foaming agents include chlorofluorinated alkane compounds such as trichloromonofluoromethane and dichloromonofluoromethane; azo compounds such as azobisisobutyronitrile, azodicarboxamide, and barium azodicarboxylate; hydrazine compounds such as p-toluenesulfonylhydrazine, diphenylsulfonium-3,3'-disulfonylhydrazine, 4,4'-oxybis(benzenesulfonylhydrazine), and allylbis(sulfonylhydrazine); aminourea compounds such as p-toluenesulfonylaminourea and 4,4'-oxybis(benzenesulfonylaminourea); and 5- Triazole compounds such as 1,2,3,4-thiatriazole, etc.; N-nitroso compounds such as N,N'-dinitrosopentamethylenetetramine, N,N'-dimethyl-N,N'-dinitrosoterephthalamide, etc. The above-mentioned heat-expandable microspheres can also be commercially available. Specific examples of commercially available heat-expandable microspheres include: Matsumoto Oil & Pharmaceutical Co., Ltd.'s trade name "Matsumoto Microsphere" (grades: F-30, F-30D, F-36D, F-36LV, F-50, F-50D, F-65, F-65D, FN-100SS, FN-100SSD, FN-180SS, FN-180SSD, F-190D, F-260D, F-2800D), Japan "EXPANCEL" manufactured by Fillite (grades: 053-40, 031-40, 920-40, 909-80, 930-120), "DAIFOAM" manufactured by Wu Yu Chemical Industry Co., Ltd. (grades: H750, H850, H1100, S2320D, S2640D, M330, M430, M520), "ADVANCELL" manufactured by Sekisui Chemical Industry Co., Ltd. (grades: EML101, EMH204, EHM301, EHM302, EHM303, EM304, EHM401, EM403, EM501), etc. The particle size of the heat-expandable microspheres before heating is preferably 0.5 μm to 80 μm, more preferably 5 μm to 45 μm, further preferably 10 μm to 20 μm, and particularly preferably 10 μm to 15 μm. Therefore, when the particle size of the heat-expandable microspheres before heating is referred to as the average particle size, it is preferably 6 μm to 45 μm, and further preferably 15 μm to 35 μm. The particle size and the average particle size are values obtained by the particle size distribution measurement method in the laser scattering method. The heat-expandable microspheres preferably have an appropriate strength that does not break before the volume expansion rate reaches preferably 5 times or more, more preferably 7 times or more, and further preferably 10 times or more. When such heat-expandable microspheres are used, the adhesive force can be effectively reduced by heat treatment. The content ratio of the heat-expandable microspheres in the adhesive layer can be appropriately set according to the desired reduction of the adhesive force, etc. The content ratio of the heat-expandable microspheres is, for example, 1 to 150 parts by weight, preferably 10 to 130 parts by weight, and further preferably 25 to 100 parts by weight relative to 100 parts by weight of the base polymer forming the adhesive layer. When the adhesive layer includes heat-expandable microspheres, the arithmetic surface roughness Ra of the adhesive layer before the heat-expandable microspheres expand (i.e., before heating) is preferably 500 nm or less, more preferably 400 nm or less, and further preferably 300 nm or less. If it is within this range, an adhesive sheet having excellent adhesion to an adherend can be obtained. Such an adhesive layer having excellent surface smoothness can be obtained, for example, by setting the thickness of the adhesive layer to the above range, and applying and transferring the adhesive layer to a separator when another adhesive layer is provided. Furthermore, when the adhesive sheet of the present invention further has other adhesive layers as described in the above-mentioned item A, the other adhesive layers may also contain heat-expandable microspheres. When the other adhesive layers contain heat-expandable microspheres, the arithmetic surface roughness Ra of the adhesive layers is also preferably within the above-mentioned range. When the above-mentioned adhesive layer contains heat-expandable microspheres, the above-mentioned adhesive layer is preferably an adhesive composed of a base polymer having a dynamic storage elastic modulus at 80°C in the range of 5 kPa to 1 MPa (more preferably 10 kPa to 0.8 MPa). If it is such an adhesive layer, an adhesive sheet having appropriate adhesiveness before heating and whose adhesiveness is easily reduced by heating can be formed. Furthermore, the dynamic storage elastic modulus can be measured using a dynamic viscoelasticity measuring device (for example, the product name "ARES" manufactured by Rheometrics) under the measuring conditions of a frequency of 1 Hz and a heating rate of 10°C/min. C. Substrate layer In one embodiment, the adhesive sheet of the present invention has an adhesive layer and a substrate layer. Figure 2(a) is a schematic cross-sectional view of an adhesive sheet of one embodiment of the present invention. The adhesive sheet 100 includes an adhesive layer 10 and a substrate layer 30 disposed on one side of the adhesive layer 10. FIG2(b) is a schematic cross-sectional view of an adhesive sheet of another embodiment of the present invention. The adhesive sheet 200 includes an adhesive layer 10 and a substrate layer 30, and the adhesive layer 10 is arranged on both sides of the substrate layer 30. The two adhesive layers may be adhesive layers of the same composition or adhesive layers of different compositions. Furthermore, the adhesive layer may be provided on one side of the substrate layer and other adhesive layers may be provided on the other side. When the adhesive sheet of the present invention has a substrate layer, the gripping force of the substrate layer and the adhesive layer is preferably 6.0 N/19 mm or more, and more preferably 15 N/19 mm or more. The above-mentioned holding force can be measured as follows. The above-mentioned holding force can be obtained as follows: (i) a SUS plate is bonded to the entire surface of an adhesive sheet having a width of 20 mm and a length of 150 mm on the side opposite to the adhesive layer (for example, in the case of an adhesive sheet composed of a substrate layer/adhesive layer, the outer surface of the substrate layer) via a specific double-sided adhesive tape; (ii) a sheet for evaluating adhesion having a size of 19 mm in width and 150 mm in length and comprising a polyester resin (a sheet having a peeling adhesion of 10 N/20 mm to 20 N/20 mm to polyethylene terephthalate, such as the product name "No. 315 (iii) measuring the peeling force between the base material layer and the adhesive layer of the adhesive sheet by a tensile test. Furthermore, the above (i) to (iii) are carried out at an ambient temperature of 23°C. The conditions of the tensile test when measuring the peeling force are: a peeling speed of 50 mm/min and a peeling angle of 180°. As described above, an adhesive sheet with a high gripping force between the base material layer and the adhesive layer is essentially an adhesive sheet that is not easy to produce paste residues. If it is such an adhesive sheet, the effect of the present invention becomes significant. When the evaluation is performed by the above method, it is more preferable that the interface between the substrate layer and the adhesive layer does not peel off, for example, an adhesive sheet that peels off between a SUS plate and a substrate layer. An adhesive sheet with high gripping power can be obtained, for example, by using the above-mentioned rubber-based adhesive (Rub1) as an adhesive and adding an isocyanate-based crosslinking agent to the adhesive. Examples of the above-mentioned substrate layer include: resin sheets, nonwoven fabrics, paper, metal foils, woven fabrics, rubber sheets, foam sheets, laminates thereof (especially laminates containing resin sheets), etc. Examples of the resin constituting the resin sheet include polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polybutylene terephthalate (PBT), polyethylene (PE), polypropylene (PP), ethylene-propylene copolymer, ethylene-vinyl acetate copolymer (EVA), polyamide (nylon), wholly aromatic polyamide (aromatic polyamide), polyimide (PI), polyvinyl chloride (PVC), polyphenylene sulfide (PPS), fluorine resin, polyether ether ketone (PEEK), etc. Examples of the nonwoven fabric include nonwoven fabrics made of heat-resistant natural fibers such as abaca nonwoven fabrics, and synthetic resin nonwoven fabrics such as polypropylene resin nonwoven fabrics, polyethylene resin nonwoven fabrics, and ester resin nonwoven fabrics. Examples of metal foil include copper foil, stainless steel foil, and aluminum foil. Examples of paper include Japanese paper and kraft paper. The thickness of the substrate layer can be set to any appropriate thickness according to the desired strength or flexibility and the purpose of use. The thickness of the substrate layer is preferably 1000 μm or less, more preferably 1 μm to 1000 μm, further preferably 1 μm to 500 μm, particularly preferably 3 μm to 300 μm, and most preferably 5 μm to 250 μm. The substrate layer may also be surface treated. As surface treatment, for example, there can be listed: corona treatment, chromic acid treatment, ozone exposure, flame exposure, high-voltage electric shock exposure, ionizing radiation treatment, coating treatment using a primer, etc. As the above-mentioned organic coating material, for example, there can be listed the materials described in Plastic Hard Coating Material II (CMC Publishing, (2004)). It is preferred to use urethane polymers, more preferably polyacrylic urethane, polyester urethane or such precursors. The reason is that coating and coating on the substrate is simple, and a variety of materials can be selected industrially and can be obtained at a low price. The urethane polymer is, for example, a polymer formed by a reaction mixture of an isocyanate monomer and a monomer containing an alcoholic hydroxyl group (for example, an acrylic compound containing a hydroxyl group or an ester compound containing a hydroxyl group). The organic coating material may also contain chain extenders such as polyamines, anti-aging agents, oxidation stabilizers, etc. as arbitrary additives. The thickness of the organic coating layer is not particularly limited, for example, it is suitable to be about 0.1 μm to 10 μm, preferably about 0.1 μm to 5 μm, and more preferably about 0.5 μm to 5 μm. D. Elastic layer The adhesive sheet of the present invention may further have an elastic layer. Figure 3 is a schematic cross-sectional view of an adhesive sheet of one embodiment of the present invention. The adhesive sheet 300 further includes an elastic layer 40. The elastic layer 40 can be preferably arranged when the adhesive layer 10 includes the above-mentioned thermally expandable microspheres. Moreover, when the adhesive sheet 300 includes a substrate layer 30, the elastic layer 40 can be arranged between the adhesive layer 10 and the substrate layer 30 as shown in the example shown in the figure, or can be arranged on the side of the substrate layer opposite to the adhesive layer. The elastic layer 40 can also be arranged in two or more layers. Furthermore, FIG. 3 shows an example in which there is one elastic layer 40, and the elastic layer 40 is arranged between the adhesive layer 10 and the substrate layer 30. By having the elastic layer 40, the followability to the adherend is improved. In addition, when the adhesive sheet having the elastic layer 40 is heated during peeling, the deformation (expansion) of the adhesive layer in the surface direction is restrained, and the deformation in the thickness direction is given priority. As a result, the peeling property is improved. The elastic layer includes a base polymer, and as the base polymer, the polymer exemplified as the base polymer constituting the adhesive layer can be used. In addition, the elastic layer may also include natural rubber, synthetic rubber, synthetic resin, etc. As the synthetic rubber and synthetic resin, there can be cited: nitrile-based, diene-based, acrylic-based synthetic rubbers; thermoplastic elastomers such as polyolefin-based and polyester-based; ethylene-vinyl acetate copolymers; polyurethanes; polybutadiene; soft polyvinyl chloride, etc. The base polymer constituting the elastic layer may be the same as or different from the base polymer forming the adhesive layer. The elastic layer may also be a foam film formed from the base polymer. The foam film may be obtained by any appropriate method. Furthermore, the elastic layer and the adhesive layer may be distinguished by the difference in base polymers and/or the presence or absence of heat-expandable microspheres (the elastic layer does not contain heat-expandable microspheres). The elastic layer may contain any appropriate additives as required. Examples of such additives include: crosslinking agents, vulcanizers, adhesive imparting agents, plasticizers, softeners, fillers, anti-aging agents, etc. When a hard resin such as polyvinyl chloride is used as a base polymer, it is preferred to use a plasticizer and/or softener to form an elastic layer with the desired elasticity. The thickness of the elastic layer is preferably 3 μm to 200 μm, more preferably 5 μm to 100 μm. If it is within this range, the elastic layer can fully exert the above functions. The tensile modulus of the elastic layer at 25°C is preferably less than 100 MPa, more preferably 0.1 MPa to 50 MPa, and further preferably 0.1 MPa to 10 MPa. If it is within this range, the elastic layer can fully exert the above function. E. Isolation piece The adhesive sheet of the present invention can further have an isolation piece as needed. At least one side of the isolation piece becomes a peeling surface, which can be provided to protect the above adhesive layer. The isolation piece can be made of any appropriate material. F. Manufacturing method of adhesive sheet The adhesive sheet of the present invention can be manufactured using any appropriate method. Regarding the adhesive sheet of the present invention, for example, there can be listed: a method of directly coating a composition containing an adhesive on a substrate layer (any appropriate substrate when an adhesive sheet without a substrate layer is obtained), or a method of transferring a coating layer formed by coating a composition containing an adhesive on any appropriate substrate to a substrate layer, etc. The composition containing an adhesive can contain any appropriate solvent. When forming an adhesive layer containing thermally expandable microspheres, a composition containing thermally expandable microspheres, an adhesive, and any appropriate solvent can be coated on a substrate layer to form the adhesive layer. Alternatively, after the heat-expandable microspheres are sprinkled on the adhesive coating layer, the heat-expandable microspheres can be embedded in the adhesive using a laminating press or the like to form an adhesive layer containing the heat-expandable microspheres. When the adhesive layer has the above-mentioned elastic layer, the elastic layer can be formed by, for example, coating a composition for forming the elastic layer on the substrate layer or the adhesive layer. As a coating method for the above-mentioned adhesive and each composition, any appropriate coating method can be adopted. For example, each layer can be formed by drying after coating. As coating methods, for example, coating methods using a multi-coater, a die-mouth coater, a gravure coater, an applicator, etc. can be cited. As drying methods, for example, natural drying, heat drying, etc. can be cited. The heating temperature during heat drying can be set to any appropriate temperature according to the characteristics of the substance to be dried. [Example] The present invention is specifically described below by way of examples, but the present invention is not limited to these examples. The evaluation method in the examples is described as follows. In addition, in the examples, unless otherwise specified, "parts" and "%" are based on weight. (1) Contact angle The adhesive sheet was placed on a glass slide with the adhesive layer facing upward, and the contact angle of the adhesive layer surface relative to 4-tert-butylphenyl glycidyl ether was measured. 2 μl of 4-tert-butylphenyl glycidyl ether was dropped onto the adhesive layer surface, and the contact angle was measured after 5 seconds (N=5). The contact angle was measured using a contact angle meter (manufactured by Kyowa Interface Co., Ltd., trade name "CX-A model") at 23°C and 50% RH. (2) sp value The sp value of the polymer in the adhesive layer after the adhesive sheet is formed is calculated according to the Fedors method (Hideki Yamamoto, "Sp Value Fundamentals, Applications and Calculation Methods", Information Organization Co., Ltd., published on April 3, 2006, pages 66-67). Specifically, the sp value is calculated from the evaporation energy Δe (cal) at 25°C of each atom or atomic group forming the polymer and the molar volume ΔV (cm ³ ) at 25°C of each atom or atomic group forming the polymer according to the following formula. Sp value = (ΣΔe/ΣΔV) ^1/2 In addition, when the polymer is a copolymer, the Sp value is calculated as follows: the Sp value of each homopolymer of each structural unit constituting the copolymer is calculated, and the Sp values are multiplied by the molar fraction of each structural unit, and the obtained values are summed. In the above case, the analysis method of each structural unit (polymer composition analysis) can be obtained by appropriately taking only the adhesive layer from the adhesive sheet, immersing it in an organic solvent such as dimethylformamide (DMF), acetone, methanol, tetrahydrofuran (THF), etc., and recovering the solvent-soluble part, and obtaining it by gel filtration chromatography (GPC), nuclear magnetic resonance spectroscopy (NMR), infrared spectroscopy (IR), and mass analysis. (3) Adhesion The entire surface of the adhesive sheet (width 20 mm × length 140 mm) on the opposite side of the adhesive layer was bonded to a SUS304 plate using a 2 kg hand pressure roller via a double-sided adhesive tape (manufactured by Nitto Denko Corporation, trade name "No.531"). Then, a polyethylene terephthalate film (manufactured by Toray Industries, trade name "Lumirror S-10", thickness: 25 μm, width: 30 mm) was bonded to the entire surface of the adhesive layer (temperature: 23°C, humidity: 65%, 2 kg roller reciprocated once). The evaluation specimens obtained in the above manner were subjected to a tensile test. As a tensile testing machine, a Shimadzu Autograph AG-120kN manufactured by Shimadzu Corporation was used. After setting the evaluation sample in the tensile testing machine, place it in an ambient temperature of 23°C for 30 minutes, and then start the tensile test. The conditions of the tensile test are set as peeling angle: 180°, peeling speed (tensile speed): 300 mm/min. The load when peeling the adhesive sheet from the above-mentioned PET film is measured, and the maximum load at this time is taken as the adhesion of the adhesive sheet. (4) Grip force The entire surface of the adhesive sheet (width 20 mm × length 140 mm) on the opposite side of the adhesive layer is bonded to a SUS304 plate (width 40 mm × length 120 mm) using a double-sided adhesive tape (manufactured by Nitto Denko Co., Ltd., trade name "No.531") using a 2 kg hand pressure roller. Next, a sheet for evaluation (manufactured by Nitto Denko Co., Ltd., trade name "No.315 Tape", width 19 mm × length 150 mm) is attached (temperature: 23°C, humidity: 65%, 2 kg roller reciprocated once). The evaluation sample obtained in the above manner is subjected to a tensile test. As a tensile testing machine, a "Shimadzu Autograph AG-120kN" manufactured by Shimadzu Corporation is used. The conditions for the tensile test are set as peeling angle: 180°, peeling speed (tensile speed): 50 mm/min. The above-mentioned evaluation sheet is gripped, and the load when the substrate layer of the self-adhesive sheet is peeled off from the adhesive layer is measured, and the maximum load at this time is taken as the gripping force between the substrate layer and the adhesive layer. (5) Adhesion Value The entire surface of the adhesive sheet (width 20 mm × length 50 mm) opposite to the adhesive layer was bonded to a glass slide (manufactured by Matsunami Glass Industries, Ltd., 26 mm × 76 mm) using a 2 kg hand roller via a double-sided adhesive tape (manufactured by Nitto Denko Co., Ltd., trade name "No.531"). The probe viscosity value of the outer surface of the adhesive layer in the evaluation sample obtained in the above manner was measured using a probe viscosity tester (manufactured by RHESCA, trade name "TACKINESS Model TAC-II"). The measurement conditions are as follows: immersion speed: 30 mm/min, test speed: 30 mm/min, preload: 100 gf, press time: 1 second, probe area: 5 mm SUS. (6) Holding force test At an ambient temperature of 23°C, the entire outer surface of the adhesive layer of the adhesive sheet (width 10 mm × length 150 mm) was bonded to the central portion of a bakelite board (manufactured by Futamura Chemical Co., Ltd., trade name "TAIKOLITE FL-102", width 25 mm × length 125 mm × thickness 2 mm) using a 2 kg hand roller. The evaluation sample obtained in the above manner was left to mature at an ambient temperature of 40°C for 30 minutes, and then a load of 1.96 N was applied using a tape creep tester (manufactured by Imada Seisakusho Co., Ltd., model/number "12-link heavy hammer type/041"), and this state was maintained for 2 hours. The position before pressure application on the bakelite is used as a reference to measure the movement distance (offset) of the adhesive sheet caused by pressure application. The shorter the movement distance, the higher the holding force. (7) Surface roughness The arithmetic surface roughness Ra of the adhesive layer surface of the adhesive sheet is measured in accordance with JIS B0601. The measuring machine is an optical surface roughness meter (manufactured by Veeco Metrogy Group, trade name "Wyko NT9100"). (8) Gap Height Suppression Effect 100 parts by weight of a naphthalene-based bifunctional epoxy resin (manufactured by DIC Corporation, trade name "HP4032D", epoxy equivalent: 144), 40 parts by weight of a phenoxy resin (manufactured by Mitsui Chemicals, trade name "EP4250"), 129 parts by weight of a phenolic resin (manufactured by Meiwa Chemicals, trade name "MEH-8000"), 1137 parts by weight of spherical silica (manufactured by Admatechs, trade name "SO-25R"), 14 parts by weight of a dye (manufactured by Orient Chemical Industries, trade name "OIL BLACK BS"), 1 part by weight of a curing catalyst (manufactured by Shikoku Chemicals, trade name "2PHZ-PW"), and 30 parts by weight of methyl ethyl ketone were mixed to prepare a resin solution A (solid content concentration: 23.6% by weight). A Si wafer (1 cm×1 cm, 500 μm thick) is placed on the adhesive layer of the adhesive sheet, and then the above-mentioned resin solution A (coating size: 3 cm×3 cm) is applied on the adhesive layer in a manner to cover and seal the Si wafer. The resin solution is heated at 170°C for 10 minutes to harden it, and a structure including the Si wafer and the sealing resin is formed on the adhesive layer of the adhesive sheet. After cooling, the adhesive sheet is peeled off from the structure. For the peeled adhesive sheet, the difference between the thickness of the adhesive layer of the part not in contact with the Si wafer and the thickness of the adhesive layer of the part in contact with the Si wafer is used as the gap height measurement. (9) Paste Residue As in (8) above, a structure including a Si wafer and a sealing resin is formed on an adhesive sheet, and after cooling, the adhesive sheet is peeled off from the structure. After peeling, the bonding surface of the above structure is observed using a microscope (manufactured by KEYENCE, trade name "VHX-100", magnification: 150 times) to confirm whether there are adhesive layer components attached to the structure. In Table 1, the case where there are less than 5 attached objects with a particle size of 100 μm (in the case of amorphous, the length of the longest side is 100 μm) is marked as ○, and the case where there are more than 5 attached objects is marked as ×. [Example 1] An adhesive layer-forming composition was prepared by mixing 100 parts by weight of an acrylic copolymer (a copolymer of 2-ethylhexyl acrylate and hydroxyethyl acrylate, with 2-ethylhexyl acrylate structural unit:hydroxyethyl acrylate structural unit=100:5 (weight ratio)) as a base polymer, 1.5 parts by weight of an isocyanate crosslinking agent (manufactured by Nippon Polyurethane Industry, trade name "CORONATE L"), 10 parts by weight of a terpene phenol adhesive imparting resin (manufactured by Yasuhara Chemical, trade name "YS POLYSTAR S145"), and 100 parts by weight of toluene. The adhesive layer-forming composition was applied to one side of a polytetrafluoroethylene film (manufactured by Toray Industries, trade name "Lumirror S10", thickness 38 μm) as a base layer to obtain an adhesive sheet consisting of a base layer and an adhesive layer (thickness 10 μm). [Example 2] An adhesive layer-forming composition was prepared by mixing 100 parts by weight of an acrylic copolymer (a copolymer of 2-ethylhexyl acrylate, acrylic acid and trihydroxymethylpropane acrylate, with 2-ethylhexyl acrylate structural unit: acrylic acid structural unit: trihydroxymethylpropane acrylate structural unit = 100:3:0.03 (weight ratio)) as a base polymer, 0.5 parts by weight of an epoxy crosslinking agent (manufactured by Mitsubishi Gas Chemical Co., Ltd., trade name "TETRAD-C"), 10 parts by weight of a terpene phenol adhesive imparting resin (manufactured by Yasuhara Chemical Co., Ltd., trade name "YS POLYSTAR S145"), and 100 parts by weight of toluene. The adhesive layer-forming composition was applied to one side of a polytetrafluoroethylene film (manufactured by Toray Industries, trade name "Lumirror S10", thickness 38 μm) as a substrate layer, thereby obtaining an adhesive sheet consisting of a substrate layer and an adhesive layer (thickness 10 μm). [Example 3] 100 parts by weight of an addition reaction type silicone adhesive (manufactured by Toray Industries, trade name "Silicone Rubber SD-4580L", with silicone rubber: silicone resin = 60:40 (weight ratio)), 0.5 parts by weight of a platinum catalyst (manufactured by Toray Industries, trade name "SRX-212"), and 100 parts by weight of toluene were mixed to prepare an adhesive layer-forming composition. The adhesive layer-forming composition was applied to one side of a polyimide film (manufactured by DuPont Toray, trade name "KAPTON 200H", thickness 50 μm) as a substrate layer to obtain an adhesive sheet consisting of a substrate layer and an adhesive layer (10 μm). [Example 4] 100 parts by weight of polyisobutylene rubber (manufactured by BASF JAPAN, trade name "Oppanol B80"), 1.5 parts by weight of a hydroxyl-containing polyolefin (manufactured by Idemitsu Kosan, trade name "EPOL"), 4 parts by weight of an isocyanate crosslinking agent (manufactured by Nippon Polyurethane Industry, trade name "CORONATE L"), and 200 parts by weight of toluene were mixed to prepare an adhesive layer-forming composition. The adhesive layer-forming composition was coated on one side of a polytetrafluoroethylene film (manufactured by Toray Industries, trade name "Lumirror S10", thickness 38 μm) as a substrate layer, thereby obtaining an adhesive sheet consisting of a substrate layer and an adhesive layer (thickness 10 μm). [Example 5] 30 parts by weight of heat-expandable microspheres (manufactured by Matsumoto Oil & Pharmaceutical Co., Ltd., trade name "Matsumoto Microsphere F-50") were further added to the adhesive layer-forming composition, and the thickness of the adhesive layer was set to 40 μm. An adhesive sheet was obtained in the same manner as in Example 1 except that the adhesive layer was formed to have a thickness of 40 μm. [Example 6] 30 parts by weight of heat-expandable microspheres (Matsumoto Oil & Pharmaceutical Co., Ltd., trade name "Matsumoto Microsphere F-50") were further added to the adhesive layer-forming composition, and the thickness of the adhesive layer was set to 40 μm, and an adhesive sheet was obtained in the same manner as in Example 2. [Example 7] 30 parts by weight of heat-expandable microspheres (Matsumoto Oil & Pharmaceutical Co., Ltd., trade name "Matsumoto Microsphere F-50") were further added to the adhesive layer-forming composition, and the thickness of the adhesive layer was set to 40 μm, and an adhesive sheet was obtained in the same manner as in Example 3. [Example 8] An adhesive sheet was obtained in the same manner as in Example 4 except that 30 parts by weight of heat-expandable microspheres (Matsumoto Oil & Pharmaceutical Co., Ltd., trade name "Matsumoto Microsphere F-50") were further added to the adhesive layer-forming composition and the thickness of the adhesive layer was set to 40 μm. [Example 9] An adhesive layer-forming composition was prepared in the same manner as in Example 1. An elastic layer-forming composition was prepared by mixing 100 parts by weight of an acrylic copolymer (a copolymer of ethyl acrylate, 2-ethylhexyl acrylate and hydroxyethyl acrylate, with ethyl acrylate structural unit: 2-ethylhexyl acrylate structural unit: hydroxyethyl acrylate structural unit = 70:30:5:6 (weight ratio)), 2 parts by weight of an isocyanate crosslinking agent (manufactured by Nippon Polyurethane Industry Co., Ltd., trade name "CORONATE L"), and 100 parts by weight of toluene. Another adhesive layer-forming composition was prepared by mixing 100 parts by weight of an acrylic copolymer (a copolymer of ethyl acrylate, 2-ethylhexyl acrylate and hydroxyethyl acrylate, with ethyl acrylate structural unit: 2-ethylhexyl acrylate structural unit: hydroxyethyl acrylate structural unit = 70:30:5:6 (weight ratio)), 2 parts by weight of an isocyanate crosslinking agent (manufactured by Nippon Polyurethane Industry Co., Ltd., trade name "CORONATE L"), 15 parts by weight of a rosin phenol-based adhesive-imparting resin (manufactured by Sumitomo Bakelite Co., Ltd., trade name "Sumilite Resin PR-12603"), 35 parts by weight of thermally expandable microspheres (manufactured by Matsumoto Oil & Pharmaceutical Co., Ltd., trade name "Matsumoto Microsphere F-50"), and 100 parts by weight of toluene. The adhesive layer-forming composition is applied to one side of a PET film (manufactured by Toray Industries, trade name "Lumirror S10", thickness 38 μm) as a substrate layer to form an adhesive layer (thickness 10 μm) on the substrate layer. In addition, the elastic layer-forming composition is applied to the other side of the PET film to form an elastic layer (thickness 10 μm) on the substrate layer. In addition, the other adhesive layer-forming composition is applied to another PET film to form another adhesive layer (thickness 35 μm). The other adhesive layer is transferred to the elastic layer to obtain an adhesive sheet consisting of adhesive layer/substrate layer/elastic layer/other adhesive layer. [Example 10] An adhesive sheet was obtained in the same manner as in Example 9 except that the adhesive layer-forming composition obtained in Example 2 was used as the adhesive layer-forming composition. [Example 11] An adhesive sheet was obtained in the same manner as in Example 9 except that the adhesive layer-forming composition obtained in Example 3 was used as the adhesive layer-forming composition. [Example 12] An adhesive sheet was obtained in the same manner as in Example 9 except that the adhesive layer-forming composition obtained in Example 4 was used as the adhesive layer-forming composition. [Comparative Example 1] An adhesive layer-forming composition was prepared by mixing 100 parts by weight of an acrylic copolymer (a copolymer of methyl acrylate, 2-ethylhexyl acrylate and acrylic acid, with methyl acrylate structural unit: 2-ethylhexyl acrylate structural unit: acrylic acid structural unit = 15:85:8 (weight ratio)), 3 parts by weight of an epoxy crosslinking agent (manufactured by Mitsubishi Gas Chemical Co., Ltd., trade name "TETRAD-C"), 10 parts by weight of a terpene phenol adhesive imparting resin (manufactured by Yasuhara Chemical Co., Ltd., trade name "YS POLYSTAR S145"), and 100 parts by weight of toluene. The adhesive layer-forming composition was applied to one side of a polytetrafluoroethylene film (manufactured by Toray Industries, trade name "Lumirror S10", thickness 38 μm) as a base layer to obtain an adhesive sheet consisting of a base layer and an adhesive layer (thickness 10 μm). [Table 1] Embodiment 1 Embodiment 2 Embodiment 3 Embodiment 4 Embodiment 5 Embodiment 6 Embodiment 7 Embodiment 8 Embodiment 9 Embodiment 10 Embodiment 11 Embodiment 12 Comparison Example 1 Contact angle ⸰ 40.5 35.4 47.9 16 40 34.5 46.7 15.8 40.5 35.4 47.9 16 12 Adhesion N/20 mm 1.5 4.5 0.6 3.9 1.2 4 0.55 3.7 1.5 4.5 0.6 3.9 2 Grip N/19 mm 7.2 7.2 and above 7.2 and above 7.2 and above 6.9 7.2 and above 7.2 and above 7.2 and above 7.2 7.2 and above 7.2 and above 7.2 and above 5.9 Holding force (movement) Mm 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 Viscosity value N/5 mmφ 100 205 195 180 85 190 171 162 100 205 195 180 70 Sp value (cal/cm ³ ) ^1/2 9.1 9.02 7.3 7.1 9.2 9.1 7.4 7.2 9.1 9.02 7.3 7.1 10.5 Surface roughness μm 0.15 0.14 0.12 0.11 0.25 0.23 0.28 0.23 0.35 0.37 0.39 0.34 0.45 Gap height suppression effect μm 0.25 0.5 0.1 0.1 0.3 0.55 0.1 0.1 0.25 0.5 0.1 0.1 4 Paste Residue ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ × As can be seen from Table 1, the adhesive sheet of the present invention has an adhesive layer with a contact angle of 15° or more relative to 4-tert-butylphenyl glycidyl ether, that is, an adhesive layer with low affinity for the sealing resin, so that an adhesive sheet with less gap height and less likely to produce paste residue can be obtained.

1: semiconductor chip 2: sealing resin 2': composition 10: adhesive layer 10': adhesive sheet 20: structure 30: base layer 40: elastic layer 100,200,300: adhesive sheet

FIG. 1(a) is a diagram illustrating an example of using a conventional adhesive sheet for manufacturing a semiconductor package, and FIG. 1(b) is a diagram illustrating an example of using the adhesive sheet of the present invention for manufacturing a semiconductor package. FIG. 2(a) and (b) are schematic cross-sectional views of an adhesive sheet of an embodiment of the present invention. FIG. 3 is a schematic cross-sectional view of an adhesive sheet of an embodiment of the present invention.

1: Semiconductor chip

2: Sealing resin

2': Composition

10: Adhesive layer

10': Adhesive sheet

20:Structure

Claims (11)

An adhesive sheet having a substrate layer, an adhesive layer disposed on one surface of the substrate layer, and another adhesive layer disposed on the other surface of the substrate layer, wherein the adhesive layer comprises an acrylic adhesive, the contact angle of the adhesive layer surface relative to 4-tert-butylphenyl glycidyl ether is greater than 15°, and the other adhesive layer comprises a thermal expansion micro- The heat-expandable microspheres are provided with an arithmetic surface roughness Ra of the adhesive layer before heating the heat-expandable microspheres, which is less than 500 nm, and the adhesive sheet has an adhesion to polyethylene terephthalate of more than 0.5 N/20 mm at 23° C. An elastic layer is disposed between the adhesive layer and the substrate layer, and the elastic modulus of the elastic layer under tension at 25° C. is less than 100 MPa. The adhesive sheet of claim 1, wherein the sp value of the material constituting the adhesive in the adhesive layer is 7 (cal/cm ³ ) ^1/2 ~10 (cal/cm ³ ) ^1/2 . Adhesive sheet material as claimed in claim 1 or 2, wherein the probe viscosity value of the adhesive layer is 50N/5mm

above. As in claim 1, the adhesive sheet, wherein the acrylic adhesive comprises an acrylic polymer having an alkyl ester with a carbon number of 4 or more in the side chain as a base polymer. As in claim 4, the adhesive sheet, wherein in the acrylic polymer, the content ratio of the structural unit having an alkyl ester with a carbon number of 4 or more in the side chain is 30% by weight or more relative to the total structural units constituting the acrylic polymer. As in claim 4 or 5, the adhesive sheet, wherein the acrylic polymer comprises structural units derived from monomers containing hydroxyl groups. As in claim 6, the adhesive sheet, wherein the content ratio of the structural units derived from the monomers containing hydroxyl groups is 0.1 wt% to 20 wt% relative to the total structural units constituting the acrylic polymer. For example, the adhesive sheet of claim 1 or 2, wherein the outer surface of the adhesive layer is entirely bonded to a bakelite board at an ambient temperature of 23°C, and cured at an ambient temperature of 40°C for 30 minutes, and then a load of 1.96N is applied and maintained for 2 hours, at which time the displacement relative to the bakelite board is less than 0.5mm. For the adhesive sheet of claim 1 or 2, the gripping force of the substrate layer and the adhesive layer is 6.0N/19mm or more. As in claim 1, the adhesive sheet, wherein the elastic layer comprises an acrylic polymer as a base polymer. As in claim 1, the thickness of the elastic layer is 3μm~200μm.

Images