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TW202444854A - Optical adhesive sheet - Google Patents

Optical adhesive sheet Download PDF

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Publication number
TW202444854A
TW202444854A TW113110768A TW113110768A TW202444854A TW 202444854 A TW202444854 A TW 202444854A TW 113110768 A TW113110768 A TW 113110768A TW 113110768 A TW113110768 A TW 113110768A TW 202444854 A TW202444854 A TW 202444854A
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Taiwan
Prior art keywords
mass
adhesive sheet
acrylate
meth
oligomer
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TW113110768A
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Chinese (zh)
Inventor
古賀蒼一朗
岩田智史
形見普史
永田拓也
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日商日東電工股份有限公司
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Priority claimed from JP2024042767A external-priority patent/JP2024137836A/en
Application filed by 日商日東電工股份有限公司 filed Critical 日商日東電工股份有限公司
Publication of TW202444854A publication Critical patent/TW202444854A/en

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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08Macromolecular additives
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00Adhesives based on unspecified macromolecular compounds
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38Pressure-sensitive adhesives [PSA]

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Polarising Elements (AREA)
  • Polyesters Or Polycarbonates (AREA)
  • Adhesive Tapes (AREA)

Abstract

An adhesive sheet (10) (optical adhesive sheet) comprises a base polymer and an oligomer having a glass transition temperature of 40 DEG C or higher, and has a shear storage elastic modulus of 100 kPa or less at -10 DEG C. In the adhesive sheet (10), the hydrogen bond term [delta]H1 of the Hansen solubility parameter of the base polymer and the hydrogen bond term [delta]H2 of the Hansen solubility parameter of the oligomer satisfy the formula: 0.1 ≤ [delta]H2 - [delta]H1 ≤ 1.3.

Description

光學黏著片材Optical adhesive sheet

本發明係關於一種光學黏著片材。The present invention relates to an optical adhesive sheet.

顯示面板例如具有包含像素面板、偏光膜、觸控面板及覆蓋膜等元件之積層構造。於此種顯示面板之製造過程中,為了將積層構造中所含之元件彼此接合,例如使用透明之黏著片材(光學黏著片材)。The display panel, for example, has a laminated structure including components such as a pixel panel, a polarizing film, a touch panel, and a cover film. In the manufacturing process of such a display panel, in order to bond the components included in the laminated structure to each other, for example, a transparent adhesive sheet (optical adhesive sheet) is used.

另一方面,正在開發可反覆彎折(可摺疊)之顯示面板以用於例如智慧型手機及平板終端。具體而言,可摺疊顯示面板能夠於彎曲形狀與平坦之非彎曲形狀之間反覆變形。此種可摺疊顯示面板之積層構造中之各元件被製作成能夠反覆彎折,並使用較薄之光學黏著片材來將此種元件彼此接合。關於用於可摺疊顯示面板等軟性器件之光學黏著片材,例如於下述專利文獻1中有所記載。 [先前技術文獻] [專利文獻] On the other hand, a display panel that can be bent repeatedly (foldable) is being developed for use in, for example, smart phones and tablet terminals. Specifically, a foldable display panel can be repeatedly deformed between a curved shape and a flat non-curved shape. Each element in the laminated structure of such a foldable display panel is made to be able to be bent repeatedly, and a thinner optical adhesive sheet is used to bond such elements to each other. Optical adhesive sheets for flexible devices such as foldable display panels are described, for example, in the following patent document 1. [Prior art document] [Patent document]

[專利文獻1]日本專利特開2018-111754號公報[Patent Document 1] Japanese Patent Publication No. 2018-111754

[發明所欲解決之問題][The problem the invention is trying to solve]

對於用於軟性器件之光學黏著片材,要求其高度軟質以具有器件變形時對被黏著體之充分之追隨性、及優異之應力緩和性。然而,先前之光學黏著片材越軟質,則黏著力越低。For optical adhesive sheets used in soft devices, they are required to be highly soft so that they can fully follow the adherend when the device is deformed, and have excellent stress relaxation properties. However, the softer the previous optical adhesive sheet, the lower the adhesive force.

於可摺疊顯示面板之彎折部位,先前,光學黏著片材容易自作為被黏著體之元件剝離。其原因在於,於顯示面板發生彎折時,在光學黏著片材之彎折部分,於沿著被黏著體之方向施加有相對較大之剪力。光學黏著片材發生剝離會導致顯示器之功能不良,故欠佳。對於用於可摺疊顯示面板之光學黏著片材,以較高之水平要求於顯示器彎曲時不易自元件(被黏著體)剝離。In the past, optical adhesive sheets were easily peeled off from the components as adherends at the bends of foldable display panels. The reason is that when the display panel is bent, a relatively large shear force is applied to the bend of the optical adhesive sheet in the direction of the adherend. The peeling of the optical adhesive sheet will cause the display to malfunction, so it is not desirable. For optical adhesive sheets used in foldable display panels, it is required at a higher level that they are not easily peeled off from the components (adherends) when the display is bent.

作為軟性器件,可捲取(可捲曲)顯示面板之開發亦不斷推進。可捲曲顯示面板例如能夠於整體或部分被捲取後之捲繞形狀與整體被捲出後之平坦形狀之間反覆變形。此種可捲曲顯示面板之積層構造中之各元件被製作成能夠反覆變形,並使用較薄之光學黏著片材來將此種元件彼此接合。於可捲曲顯示面板處於捲繞形狀時,與捲繞形狀之元件接合之光學黏著片材持續受到沿著被黏著體之方向之剪力。對於此種光學黏著片材,以非常高之水平要求於顯示器處於捲繞形狀時不易自元件(被黏著體)剝離。As a flexible device, the development of rollable (curled) display panels is also advancing. For example, a rollable display panel can be repeatedly deformed between a rolled-up shape after being rolled up in whole or in part and a flat shape after being rolled out in whole. Each element in the layered structure of such a rollable display panel is made to be able to be repeatedly deformed, and a thinner optical adhesive sheet is used to bond such elements to each other. When the rollable display panel is in a rolled-up shape, the optical adhesive sheet bonded to the rolled-up element is continuously subjected to shear force in the direction of the adherend. Such optical adhesive sheets are required to be not easily peeled off from a device (adherend) when the display is in a rolled-up state at a very high level.

本發明提供一種適於軟性器件用途之光學黏著片材。 [解決問題之技術手段] The present invention provides an optical adhesive sheet suitable for use in flexible devices. [Technical means for solving the problem]

本發明[1]包含一種光學黏著片材,其包含基礎聚合物、及玻璃轉移溫度為40℃以上之低聚物,且於-10℃下具有100 kPa以下之剪切儲存模數,上述基礎聚合物之漢森溶解度參數之氫鍵項δH 1與上述低聚物之漢森溶解度參數之氫鍵項δH 2滿足0.1≦δH 2-δH 1≦1.3。 The present invention [1] comprises an optical adhesive sheet comprising a base polymer and an oligomer having a glass transition temperature of 40°C or higher, and having a shear storage modulus of 100 kPa or lower at -10°C, wherein the hydrogen bonding term δH1 of the Hansen solubility parameter of the base polymer and the hydrogen bonding term δH2 of the Hansen solubility parameter of the oligomer satisfy 0.1≦ δH2 - δH1 ≦1.3.

本發明[2]包含如上述[1]所記載之光學黏著片材,其具有1%以下之霧度。The present invention [2] comprises the optical adhesive sheet as described in the above-mentioned [1], which has a haze of less than 1%.

本發明[3]包含如上述[1]或[2]所記載之光學黏著片材,其於以25℃、剝離角度180°及拉伸速度300 mm/分鐘之條件進行之剝離試驗中之黏著力為7.6 N/20 mm以上。The present invention [3] comprises an optical adhesive sheet as described in the above [1] or [2], wherein the adhesive force of the optical adhesive sheet in a peeling test conducted at 25°C, a peeling angle of 180° and a tensile speed of 300 mm/min is 7.6 N/20 mm or more.

本發明[4]包含如上述[1]至[3]中任一項所記載之光學黏著片材,其於以25℃、剝離角度180°及拉伸速度300 mm/分鐘之條件進行之剝離試驗中具有黏著力F1,於以25℃、剝離角度180°及拉伸速度60 mm/分鐘之條件進行之剝離試驗中具有黏著力F2,且黏著力F2相對於黏著力F1之比率為0.5以上1.1以下。The present invention [4] comprises an optical adhesive sheet as described in any one of the above [1] to [3], which has an adhesion force F1 in a peeling test conducted at 25°C, a peeling angle of 180° and a tensile speed of 300 mm/min, and has an adhesion force F2 in a peeling test conducted at 25°C, a peeling angle of 180° and a tensile speed of 60 mm/min, and the ratio of the adhesion force F2 to the adhesion force F1 is greater than 0.5 and less than 1.1.

本發明[5]包含如上述[1]至[4]中任一項所記載之光學黏著片材,其於60℃下之剪切儲存模數相對於於-10℃下之剪切儲存模數之比率為0.2以上1.0以下。The present invention [5] comprises the optical adhesive sheet as described in any one of the above [1] to [4], wherein the ratio of the shear storage modulus at 60°C to the shear storage modulus at -10°C is 0.2 or more and 1.0 or less.

本發明[6]包含如上述[1]至[5]中任一項所記載之光學黏著片材,其具有60質量%以上87質量%以下之凝膠分率。 [發明之效果] The present invention [6] comprises an optical adhesive sheet as described in any one of the above [1] to [5], which has a gel fraction of 60 mass % or more and 87 mass % or less. [Effect of the invention]

如上所述,本發明之光學黏著片材於-10℃下具有100 kPa以下之剪切儲存模數。如此,軟質之光學黏著片材適於在貼合有該黏著片材之被黏著體發生變形時,緩和由光學黏著片材及被黏著體產生之應力(應力緩和功能)。光學黏著片材中之應力緩和適於確保光學黏著片材對被黏著體之追隨性。被黏著體中之應力緩和適於抑制被黏著體之破裂等破損。此外,如上所述,本發明之光學黏著片材包含基礎聚合物、及玻璃轉移溫度(Tg)為40℃以上之低聚物,且基礎聚合物之漢森溶解度參數(HSP)之氫鍵項δH 1與低聚物之HSP之氫鍵項δH 2滿足0.1≦δH 2-δH 1≦1.3。此種構成適於確保光學黏著片材之整體之柔軟度,並且會使Tg為40℃以上之低聚物偏集存在於光學黏著片材之表面(黏著面)及其附近,而實現該黏著片材之良好之黏著力。光學黏著片材之高黏著力適於抑制光學黏著片材自反覆變形之被黏著體剝離。如上所述之光學黏著片材適於軟性器件用途。 As described above, the optical adhesive sheet of the present invention has a shear storage modulus of 100 kPa or less at -10°C. Thus, the soft optical adhesive sheet is suitable for relieving the stress generated by the optical adhesive sheet and the adherend when the adherend to which the adhesive sheet is attached is deformed (stress relieving function). Stress relieving in the optical adhesive sheet is suitable for ensuring the tracking property of the optical adhesive sheet to the adherend. Stress relieving in the adherend is suitable for suppressing damage such as cracking of the adherend. In addition, as described above, the optical adhesive sheet of the present invention includes a base polymer and an oligomer having a glass transition temperature (Tg) of 40°C or higher, and the hydrogen bonding term δH1 of the Hansen solubility parameter (HSP) of the base polymer and the hydrogen bonding term δH2 of the HSP of the oligomer satisfy 0.1≦ δH2 - δH1 ≦1.3. This structure is suitable for ensuring the overall softness of the optical adhesive sheet, and will make the oligomer with a Tg of 40°C or higher segregate on the surface (adhesive surface) of the optical adhesive sheet and its vicinity, thereby achieving good adhesion of the adhesive sheet. The high adhesion of the optical adhesive sheet is suitable for suppressing the peeling of the optical adhesive sheet from the repeatedly deformed adherend. The optical adhesive sheet as described above is suitable for flexible device applications.

如圖1所示,作為本發明之光學黏著片材之一實施方式之黏著片材10具有特定厚度之片材形狀,且在與厚度方向正交之方向(面方向)上擴展。黏著片材10具有黏著面11、及該黏著面11之相反側之黏著面12。圖1以例示之方式示出於黏著片材10之黏著面11、12貼合有剝離襯墊L1、L2之狀態。剝離襯墊L1配置於黏著面11上。剝離襯墊L2配置於黏著面12上。又,黏著片材10係配置於軟性器件中之光通過部位之透明之黏著片材(光學黏著片材)。作為軟性器件,例如可例舉軟性顯示面板。作為軟性顯示面板,例如可例舉可摺疊顯示面板及可捲曲顯示面板。軟性顯示面板例如具有包含像素面板、偏光膜、觸控面板及覆蓋膜等元件之積層構造。黏著片材10例如於軟性顯示面板之製造過程中,用於將積層構造中所含之元件彼此接合。剝離襯墊L1、L2分別於使用黏著片材10時在特定之時點剝離。As shown in FIG1 , an adhesive sheet 10 as an embodiment of the optical adhesive sheet of the present invention has a sheet shape with a specific thickness and expands in a direction (surface direction) orthogonal to the thickness direction. The adhesive sheet 10 has an adhesive surface 11 and an adhesive surface 12 on the opposite side of the adhesive surface 11. FIG1 shows, by way of example, a state in which peel-off pads L1 and L2 are attached to the adhesive surfaces 11 and 12 of the adhesive sheet 10. The peel-off pad L1 is arranged on the adhesive surface 11. The peel-off pad L2 is arranged on the adhesive surface 12. In addition, the adhesive sheet 10 is a transparent adhesive sheet (optical adhesive sheet) arranged in a light-passing portion of a flexible device. As a flexible device, for example, a flexible display panel can be cited. As a flexible display panel, for example, a foldable display panel and a rollable display panel can be cited. The flexible display panel, for example, has a laminated structure including components such as a pixel panel, a polarizing film, a touch panel, and a cover film. The adhesive sheet 10 is used to bond the components contained in the laminated structure to each other during the manufacturing process of the flexible display panel. The peeling pads L1 and L2 are peeled off at specific points in time when the adhesive sheet 10 is used.

黏著片材10係由黏著劑組合物形成。黏著劑組合物包含基礎聚合物、及玻璃轉移溫度(Tg)為40℃以上之低聚物。即,黏著片材10包含基礎聚合物、及Tg為40℃以上之低聚物。黏著片材10於-10℃下具有100 kPa以下之剪切儲存模數。又,黏著片材10中,基礎聚合物之漢森溶解度參數(HSP)之氫鍵項δH 1與低聚物之HSP之氫鍵項δH 2滿足下述式(1)。 The adhesive sheet 10 is formed of an adhesive composition. The adhesive composition includes a base polymer and an oligomer having a glass transition temperature (Tg) of 40°C or higher. That is, the adhesive sheet 10 includes a base polymer and an oligomer having a Tg of 40°C or higher. The adhesive sheet 10 has a shear storage modulus of 100 kPa or less at -10°C. In addition, in the adhesive sheet 10, the hydrogen bonding term δH1 of the Hansen solubility parameter (HSP) of the base polymer and the hydrogen bonding term δH2 of the HSP of the oligomer satisfy the following formula (1).

0.1≦δH 2-δH 1≦1.3           (1) 0.1≦δH 2 -δH 1 ≦1.3 (1)

如上所述,黏著片材10於-10℃下具有100 kPa以下之剪切儲存模數。如此,軟質之黏著片材10適於在貼合有黏著片材10之被黏著體發生變形時,緩和由黏著片材10及被黏著體產生之應力(應力緩和功能)。黏著片材10中之應力緩和適於確保黏著片材10對被黏著體之追隨性。被黏著體中之應力緩和適於抑制被黏著體之破裂等破損。因此,黏著片材10適於實現使用黏著片材10之軟性器件之良好之反覆變形。As described above, the adhesive sheet 10 has a shear storage modulus of less than 100 kPa at -10°C. Thus, the soft adhesive sheet 10 is suitable for relieving the stress generated by the adhesive sheet 10 and the adherend when the adherend to which the adhesive sheet 10 is attached is deformed (stress relief function). The stress relief in the adhesive sheet 10 is suitable for ensuring the tracking property of the adhesive sheet 10 to the adherend. The stress relief in the adherend is suitable for suppressing damage such as rupture of the adherend. Therefore, the adhesive sheet 10 is suitable for achieving good repeated deformation of the soft device using the adhesive sheet 10.

此外,如上所述,黏著片材10包含基礎聚合物、及Tg為40℃以上之低聚物,且基礎聚合物之HSP之氫鍵項δH 1與低聚物之HSP之氫鍵項δH 2滿足0.1≦δH 2-δH 1≦1.3。基礎聚合物之HSP之氫鍵項δH 1與低聚物之HSP之氫鍵項δH 2的差ΔH(=δH 2-δH 1)係黏著片材10中之基礎聚合物與低聚物之相容性之指標。此種差ΔH為0.1以上1.3以下,則適於實現基礎聚合物與低聚物之適度地較低之相容性,使低聚物偏集存在於黏著片材10之表面(黏著面11、12)及其附近。因此,於差ΔH為0.1以上1.3以下之情形時,適於確保黏著片材10之上述之總體之柔軟度,並且會使Tg為40℃以上之低聚物偏集存在於黏著片材10之表面(黏著面11、12)及其附近,而於黏著片材10中實現高黏著力。黏著片材10之高黏著力適於抑制黏著片材10自反覆變形之被黏著體剝離。 Furthermore, as described above, the adhesive sheet 10 includes a base polymer and an oligomer having a Tg of 40° C. or higher, and the hydrogen bonding term δH 1 of the HSP of the base polymer and the hydrogen bonding term δH 2 of the HSP of the oligomer satisfy 0.1≦δH 2 −δH 1 ≦1.3. The difference ΔH (=δH 2 −δH 1 ) between the hydrogen bonding term δH 1 of the HSP of the base polymer and the hydrogen bonding term δH 2 of the HSP of the oligomer is an indicator of the compatibility of the base polymer and the oligomer in the adhesive sheet 10. When the difference ΔH is 0.1 or more and 1.3 or less, it is suitable to realize moderately low compatibility between the base polymer and the oligomer, so that the oligomer is concentrated on the surface (adhesive surface 11, 12) and its vicinity of the adhesive sheet 10. Therefore, when the difference ΔH is 0.1 or more and 1.3 or less, it is suitable to ensure the above-mentioned overall softness of the adhesive sheet 10, and oligomers with a Tg of 40°C or more are concentrated on the surface (adhesive surface 11, 12) and its vicinity of the adhesive sheet 10, thereby realizing high adhesion in the adhesive sheet 10. The high adhesion of the adhesive sheet 10 is suitable for suppressing the peeling of the adhesive sheet 10 from the repeatedly deformed adherend.

如上所述之黏著片材10適於軟性器件用途。即,黏著片材10適於實現使用黏著片材10之軟性器件之良好之反覆變形。The adhesive sheet 10 as described above is suitable for the use of flexible devices. That is, the adhesive sheet 10 is suitable for realizing good repeated deformation of the flexible device using the adhesive sheet 10.

就黏著片材10發生變形(撓曲及彎曲等)之情形時之該變形部位之應力緩和之觀點而言,黏著片材10於-10℃下之剪切儲存模數G1較佳為90 kPa以下,更佳為85 kPa以下,進而較佳為80 kPa以下。就確保黏著片材10於低溫區域內之凝集力之觀點而言,剪切儲存模數G1(-10℃)較佳為30 kPa以上,更佳為40 kPa以上,進而較佳為50 kPa以上,進而較佳為60 kPa以上。剪切儲存模數G1係藉由下文關於實施例所敍述之動態黏彈性測定而求出(下述剪切儲存模數G2、G3亦同樣如此)。作為黏著片材10之剪切儲存模數之調整方法,例如可例舉:黏著片材10中之基礎聚合物之種類之選擇、分子量之調整、及調配量之調整、以及交聯劑之種類之選擇及調配量之調整(下述剪切儲存模數G2、G3亦同樣如此)。From the perspective of stress relief at the deformed portion when the adhesive sheet 10 is deformed (bending and bending, etc.), the shear storage modulus G1 of the adhesive sheet 10 at -10°C is preferably 90 kPa or less, more preferably 85 kPa or less, and further preferably 80 kPa or less. From the perspective of ensuring the cohesive force of the adhesive sheet 10 in the low temperature area, the shear storage modulus G1 (-10°C) is preferably 30 kPa or more, more preferably 40 kPa or more, further preferably 50 kPa or more, and further preferably 60 kPa or more. The shear storage modulus G1 is obtained by the dynamic viscoelasticity measurement described below in the embodiment (the same applies to the shear storage moduli G2 and G3 described below). As a method for adjusting the shear storage modulus of the adhesive sheet 10, for example, there can be cited: selection of the type of base polymer in the adhesive sheet 10, adjustment of the molecular weight, and adjustment of the blending amount, and selection of the type of crosslinking agent and adjustment of the blending amount (the same applies to the shear storage moduli G2 and G3 described below).

就黏著片材10中之上述應力緩和之觀點而言,黏著片材10於60℃下之剪切儲存模數G2較佳為35 kPa以下,更佳為32 kPa以下,進而較佳為27 kPa以下。就確保黏著片材10於高溫區域內之凝集力之觀點而言,剪切儲存模數G2(60℃)較佳為10 kPa以上,更佳為15 kPa以上,進而較佳為20 kPa以上,進而較佳為22 kPa以上。From the viewpoint of the above stress relaxation in the adhesive sheet 10, the shear storage modulus G2 of the adhesive sheet 10 at 60°C is preferably 35 kPa or less, more preferably 32 kPa or less, and further preferably 27 kPa or less. From the viewpoint of ensuring the cohesive force of the adhesive sheet 10 in the high temperature region, the shear storage modulus G2 (60°C) is preferably 10 kPa or more, more preferably 15 kPa or more, further preferably 20 kPa or more, and further preferably 22 kPa or more.

就於較廣之溫度範圍內確保黏著片材10之穩定之應力緩和功能之觀點而言,剪切儲存模數G2相對於剪切儲存模數G1之比率(G2/G1)較佳為0.2以上,更佳為0.25以上,進而較佳為0.3以上,又,較佳為1.0以下,更佳為0.5以下,進而較佳為未達0.4。From the perspective of ensuring the stable stress relief function of the adhesive sheet 10 within a wider temperature range, the ratio of the shear storage modulus G2 to the shear storage modulus G1 (G2/G1) is preferably greater than 0.2, more preferably greater than 0.25, and further preferably greater than 0.3, and further preferably less than 1.0, more preferably less than 0.5, and further preferably less than 0.4.

就黏著片材10中之上述應力緩和之觀點而言,黏著片材10於-20℃下之剪切儲存模數G3較佳為150 kPa以下,更佳為130 kPa以下,進而較佳為120 kPa以下。就確保黏著片材10於低溫區域內之凝集力之觀點而言,剪切儲存模數G3(-20℃)較佳為40 kPa以上,更佳為50 kPa以上,更佳為70 kPa以上,進而較佳為90 kPa以上。From the viewpoint of stress relaxation in the adhesive sheet 10, the shear storage modulus G3 of the adhesive sheet 10 at -20°C is preferably 150 kPa or less, more preferably 130 kPa or less, and further preferably 120 kPa or less. From the viewpoint of ensuring the cohesive force of the adhesive sheet 10 in the low temperature region, the shear storage modulus G3 (-20°C) is preferably 40 kPa or more, more preferably 50 kPa or more, more preferably 70 kPa or more, and further preferably 90 kPa or more.

就適度降低基礎聚合物與低聚物之相容性,使低聚物充分地偏集存在於黏著面11、12及其附近之觀點而言,基礎聚合物之HSP之氫鍵項δH 1與低聚物之HSP之氫鍵項δH 2的差ΔH(δH 2-δH 1)較佳為0.2以上,更佳為0.3以上。就防止基礎聚合物與低聚物之相容性變得過低之觀點而言,差ΔH(δH 2-δH 1)較佳為1.26以下。藉由確保基礎聚合物與低聚物之相容性,有助於在黏著片材10中實現低霧度。作為基礎聚合物之δH 1之調整方法,例如可例舉該基礎聚合物之單體組成之調整。作為低聚物之δH 2之調整方法,例如可例舉該低聚物之單體組成之調整。 From the viewpoint of appropriately reducing the compatibility between the base polymer and the oligomer so that the oligomer is sufficiently segregated on the adhesive surfaces 11 and 12 and their vicinities, the difference ΔH (δH 2 - δH 1 ) between the hydrogen bonding term δH 1 of the HSP of the base polymer and the hydrogen bonding term δH 2 of the HSP of the oligomer is preferably 0.2 or more, more preferably 0.3 or more. From the viewpoint of preventing the compatibility between the base polymer and the oligomer from becoming too low, the difference ΔH (δH 2 - δH 1 ) is preferably 1.26 or less. By ensuring the compatibility between the base polymer and the oligomer, it is helpful to achieve low haze in the adhesive sheet 10. As a method for adjusting δH1 of a base polymer, for example, adjustment of the monomer composition of the base polymer can be cited. As a method for adjusting δH2 of an oligomer, for example, adjustment of the monomer composition of the oligomer can be cited.

就適度降低基礎聚合物與低聚物之相容性,使低聚物充分地偏集存在於黏著面11、12及其附近之觀點而言,低聚物之HSP之氫鍵項δH 2相對於基礎聚合物之HSP之氫鍵項δH 1的比率(δH 2/δH 1)較佳為1.04以上,更佳為1.06以上,進而較佳為1.08以上,進而較佳為1.10以上。就防止基礎聚合物與低聚物之相容性變得過低之觀點而言,比率(δH 2/δH 1)較佳為1.28以下,更佳為1.25以下,進而較佳為1.22以下。比率(δH 2/δH 1)亦為黏著片材10中之基礎聚合物與低聚物之相容性之指標。 From the viewpoint of appropriately reducing the compatibility between the base polymer and the oligomer so that the oligomer is sufficiently segregated on the adhesive surfaces 11 and 12 and their vicinities, the ratio of the hydrogen bond term δH 2 of the HSP of the oligomer to the hydrogen bond term δH 1 of the HSP of the base polymer (δH 2 /δH 1 ) is preferably 1.04 or more, more preferably 1.06 or more, further preferably 1.08 or more, further preferably 1.10 or more. From the viewpoint of preventing the compatibility between the base polymer and the oligomer from becoming too low, the ratio (δH 2 /δH 1 ) is preferably 1.28 or less, more preferably 1.25 or less, further preferably 1.22 or less. The ratio (δH 2 /δH 1 ) is also an indicator of the compatibility of the base polymer and the oligomer in the adhesive sheet 10 .

漢森溶解度參數(HSP)係由下述式(2)表示,其δH係表示源自分子間之氫鍵力之能量的氫鍵項。又,δD係表示源自分子間之分散力之能量的分散項。δP係表示源自分子間之極性力之能量的極化項。The Hansen Solubility Parameter (HSP) is represented by the following formula (2), where δH is a hydrogen bonding term representing the energy derived from hydrogen bonding forces between molecules, δD is a dispersion term representing the energy derived from dispersion forces between molecules, and δP is a polarization term representing the energy derived from polar forces between molecules.

HSP=(δD 2+δP 2+δH 2) 1/2(2) HSP=(δD 2 +δP 2 +δH 2 ) 1/2 (2)

聚合物之δH係根據形成該聚合物之單體m i之莫耳分率x i及該單體m i之氫鍵項δh i,並藉由下述式(3)而求出。低聚物之δH亦以同樣之方式求出。單體之氫鍵項δh例如可藉由電腦軟體HSPiP(Hansen Solubility Parameters in Practice)進行計算。具體而言,δH之求出方法如下文關於實施例所述。 The δH of a polymer is determined by the following formula (3) based on the molar fraction xi of the monomer mi forming the polymer and the hydrogen bonding term δhi of the monomer mi . The δH of an oligomer is determined in the same manner. The hydrogen bonding term δh of a monomer can be calculated, for example, by computer software HSPiP (Hansen Solubility Parameters in Practice). Specifically, the method for determining δH is described below in connection with the Examples.

δH=Σ x i×δh i(3) δH= Σxi × δhi (3)

至於低聚物之Tg,如上所述,就使軟質之黏著片材10之表面高黏著化之觀點而言,較佳為50℃以上,更佳為60℃以上,進而較佳為70℃以上,又,較佳為145℃以下,更佳為135℃以下,進而較佳為130℃以下。低聚物之Tg較佳為高於基礎聚合物之Tg。作為低聚物之Tg之調整方法,可例舉低聚物之單體組成之調整及分子量之調整。具體而言,低聚物之Tg之測定方法如下文關於實施例所述。As for the Tg of the oligomer, as described above, from the viewpoint of making the surface of the soft adhesive sheet 10 highly adhesive, it is preferably 50°C or more, more preferably 60°C or more, and further preferably 70°C or more, and further, preferably 145°C or less, more preferably 135°C or less, and further preferably 130°C or less. The Tg of the oligomer is preferably higher than the Tg of the base polymer. As a method for adjusting the Tg of the oligomer, the adjustment of the monomer composition of the oligomer and the adjustment of the molecular weight can be cited. Specifically, the method for measuring the Tg of the oligomer is described below in relation to the embodiment.

關於低聚物之玻璃轉移溫度Tg,可使用基於下述Fox公式求出之玻璃轉移溫度(理論值)。Fox公式為聚合物之玻璃轉移溫度Tg與構成該聚合物之單體之均聚物之玻璃轉移溫度Tg i的關係式。於下述Fox公式中,Tg表示低聚物之玻璃轉移溫度(℃),W i表示構成該聚合物之單體m i之重量分率,Tg i表示由單體m i所形成之均聚物之玻璃轉移溫度(℃)。關於均聚物之玻璃轉移溫度,可使用文獻值。例如於「聚合物手冊(Polymer Handbook)」(第4版,John Wiley & Sons, Inc., 1999年)中例舉有各種均聚物之玻璃轉移溫度。另一方面,關於單體之均聚物之玻璃轉移溫度,亦可藉由日本專利特開2007-51271號公報中具體記載之方法而求出。 Regarding the glass transition temperature Tg of the oligomer, the glass transition temperature (theoretical value) calculated based on the following Fox formula can be used. The Fox formula is a relationship between the glass transition temperature Tg of a polymer and the glass transition temperature Tgi of a homopolymer of a monomer constituting the polymer. In the following Fox formula, Tg represents the glass transition temperature of the oligomer (°C), Wi represents the weight fraction of the monomer mi constituting the polymer, and Tgi represents the glass transition temperature of the homopolymer formed by the monomer mi (°C). Regarding the glass transition temperature of a homopolymer, a literature value can be used. For example, the glass transition temperatures of various homopolymers are listed in the "Polymer Handbook" (4th edition, John Wiley & Sons, Inc., 1999). On the other hand, the glass transition temperature of the homopolymer of the monomer can also be obtained by the method specifically described in Japanese Patent Application Laid-Open No. 2007-51271.

Fox公式       1/(273+Tg)=Σ[W i/(273+Tg i)] Fox formula 1/(273+Tg)=Σ[W i /(273+Tg i )]

黏著片材10之霧度較佳為1%以下,更佳為0.8%以下,進而較佳為0.7%以下,進而較佳為0.5%以下。霧度例如為0.01%以上。黏著片材10之霧度可依據JIS K7136(2000年),使用霧度計進行測定。作為霧度計,例如可例舉日本電色工業公司製造之「NDH2000」、及村上色彩技術研究所公司製造之「HM-150」。具體而言,霧度之測定方法如下文關於實施例所述。The haze of the adhesive sheet 10 is preferably less than 1%, more preferably less than 0.8%, further preferably less than 0.7%, and further preferably less than 0.5%. The haze is, for example, greater than 0.01%. The haze of the adhesive sheet 10 can be measured using a haze meter in accordance with JIS K7136 (2000). Examples of the haze meter include "NDH2000" manufactured by Nippon Denshoku Industries, Ltd., and "HM-150" manufactured by Murakami Color Technology Laboratory, Inc. Specifically, the method for measuring the haze is described below in connection with the embodiments.

黏著片材10之全光線透過率較佳為60%以上,更佳為80%以上,進而較佳為85%以上。黏著片材10之全光線透過率例如為100%以下。黏著片材10之全光線透過率可依據JIS K 7375(2008年)進行測定。The total light transmittance of the adhesive sheet 10 is preferably 60% or more, more preferably 80% or more, and further preferably 85% or more. The total light transmittance of the adhesive sheet 10 is, for example, 100% or less. The total light transmittance of the adhesive sheet 10 can be measured according to JIS K 7375 (2008).

就確保黏著片材10於高溫區域內之凝集力之觀點而言,黏著片材10之凝膠分率較佳為60質量%以上,更佳為70質量%以上,進而較佳為73質量%以上。就確保黏著片材10之柔軟性之觀點而言,黏著片材10之凝膠分率較佳為87質量%以下,更佳為85質量%以下,進而較佳為83質量%以下。作為黏著片材10之凝膠分率之調整方法,例如可例舉:黏著片材10中之基礎聚合物之種類之選擇、分子量之調整、及調配量之調整。作為凝膠分率之調整方法,亦可例舉交聯劑之種類之選擇及調配量之調整。又,凝膠分率之測定方法如下文關於實施例所述。From the viewpoint of ensuring the cohesive force of the adhesive sheet 10 in the high temperature region, the gel fraction of the adhesive sheet 10 is preferably 60% by mass or more, more preferably 70% by mass or more, and further preferably 73% by mass or more. From the viewpoint of ensuring the softness of the adhesive sheet 10, the gel fraction of the adhesive sheet 10 is preferably 87% by mass or less, more preferably 85% by mass or less, and further preferably 83% by mass or less. As a method for adjusting the gel fraction of the adhesive sheet 10, for example, the selection of the type of base polymer in the adhesive sheet 10, the adjustment of the molecular weight, and the adjustment of the blending amount can be cited. As a method for adjusting the gel fraction, the selection of the type of crosslinking agent and the adjustment of the blending amount can also be cited. In addition, the method for measuring the gel fraction is described below in connection with the examples.

就抑制黏著片材10自被黏著體剝離之觀點而言,黏著片材10於以25℃、剝離角度180°及拉伸速度300 mm/分鐘之條件進行之剝離試驗(第1剝離試驗)中之黏著力F1較佳為7.6 N/20 mm以上,更佳為7.8 N/20 mm以上,進而較佳為8.0 N/20 mm以上,進而較佳為8.2 N/20 mm以上,進而更佳為8.4 N/20 mm以上,進而更佳為8.6 N/20 mm以上,尤佳為8.8 N/20 mm以上。黏著力F1例如為15 N/20 mm以下。具體而言,黏著力F1之測定方法如下文關於實施例所述。作為黏著力F1之調整方法,例如可例舉:黏著片材10中之基礎聚合物之種類之選擇、分子量之調整、及調配量之調整。基礎聚合物之種類之選擇包括形成基礎聚合物之單體之組成之調整。作為黏著力F1之調整方法,亦可例舉黏著片材10中之除基礎聚合物以外之成分之種類之選擇、及該成分之調配量之調整。作為該成分,可例舉交聯劑、矽烷偶合劑、及低聚物。如上所述之黏著力調整方法亦適用於下述黏著力F2。From the viewpoint of inhibiting the adhesive sheet 10 from peeling off from the adherend, the adhesive force F1 of the adhesive sheet 10 in the peeling test (the first peeling test) conducted at 25°C, a peeling angle of 180° and a tensile speed of 300 mm/minute is preferably 7.6 N/20 mm or more, more preferably 7.8 N/20 mm or more, further preferably 8.0 N/20 mm or more, further preferably 8.2 N/20 mm or more, further preferably 8.4 N/20 mm or more, further preferably 8.6 N/20 mm or more, and particularly preferably 8.8 N/20 mm or more. The adhesive force F1 is, for example, 15 N/20 mm or less. Specifically, the method for measuring the adhesive force F1 is as described below in connection with the embodiments. As a method for adjusting the adhesion F1, for example, there can be cited: selection of the type of base polymer in the adhesive sheet 10, adjustment of the molecular weight, and adjustment of the blending amount. The selection of the type of base polymer includes adjustment of the composition of the monomers forming the base polymer. As a method for adjusting the adhesion F1, there can also be cited the selection of the type of components other than the base polymer in the adhesive sheet 10, and adjustment of the blending amount of the components. As such components, there can be cited crosslinking agents, silane coupling agents, and oligomers. The above-mentioned method for adjusting the adhesion is also applicable to the following adhesion F2.

就抑制黏著片材10自被黏著體剝離之觀點而言,黏著片材10於以25℃、剝離角度180°及拉伸速度60 mm/分鐘之條件進行之剝離試驗(第2剝離試驗)中之黏著力F2較佳為4.1 N/20 mm以上,更佳為6.0 N/20 mm以上,進而較佳為6.4 N/20 mm以上,進而較佳為6.8 N/20 mm以上,進而更佳為7.2 N/20 mm以上,進而更佳為7.6 N/20 mm以上,尤佳為8.0 N/20 mm以上。黏著力F2例如為12 N/20 mm以下。From the viewpoint of suppressing the peeling of the adhesive sheet 10 from the adherend, the adhesive force F2 of the adhesive sheet 10 in the peeling test (the second peeling test) conducted under the conditions of 25°C, a peeling angle of 180° and a tensile speed of 60 mm/min is preferably 4.1 N/20 mm or more, more preferably 6.0 N/20 mm or more, further preferably 6.4 N/20 mm or more, further preferably 6.8 N/20 mm or more, further preferably 7.2 N/20 mm or more, further preferably 7.6 N/20 mm or more, and particularly preferably 8.0 N/20 mm or more. The adhesive force F2 is, for example, 12 N/20 mm or less.

就於黏著片材10中確保穩定之黏著力之觀點而言,黏著力F2相對於黏著力F1之比率(F2/F1)較佳為0.5以上,更佳為0.6以上,較佳為0.7以上,更佳為0.75以上,進而較佳為0.8以上,又,較佳為1.1以下,更佳為1.0以下。From the perspective of ensuring stable adhesion in the adhesive sheet 10, the ratio of the adhesion F2 to the adhesion F1 (F2/F1) is preferably greater than 0.5, more preferably greater than 0.6, more preferably greater than 0.7, more preferably greater than 0.75, further preferably greater than 0.8, and preferably less than 1.1, more preferably less than 1.0.

基礎聚合物係於黏著片材10中表現出黏著性之黏著成分。作為基礎聚合物,例如可例舉:丙烯酸聚合物、矽酮聚合物、聚酯聚合物、聚胺基甲酸酯聚合物、聚醯胺聚合物、聚乙烯醚聚合物、乙酸乙烯酯/氯乙烯共聚物、改性聚烯烴聚合物、環氧聚合物、氟聚合物、及橡膠聚合物。基礎聚合物可單獨使用,亦可併用兩種以上。就確保黏著片材10中之良好之透明性及黏著性之觀點而言,作為基礎聚合物,較佳為丙烯酸聚合物。The base polymer is an adhesive component that exhibits adhesiveness in the adhesive sheet 10. Examples of the base polymer include acrylic polymers, silicone polymers, polyester polymers, polyurethane polymers, polyamide polymers, polyvinyl ether polymers, vinyl acetate/vinyl chloride copolymers, modified polyolefin polymers, epoxy polymers, fluoropolymers, and rubber polymers. The base polymer may be used alone or in combination of two or more. From the perspective of ensuring good transparency and adhesiveness in the adhesive sheet 10, an acrylic polymer is preferred as the base polymer.

丙烯酸聚合物係以50質量%以上之比率包含(甲基)丙烯酸烷基酯之單體成分(第1單體成分)之聚合物。「(甲基)丙烯酸」意指丙烯酸及/或甲基丙烯酸。The acrylic polymer is a polymer containing a monomer component (first monomer component) of an alkyl (meth)acrylate at a ratio of 50 mass % or more. "(Meth)acrylic acid" means acrylic acid and/or methacrylic acid.

作為(甲基)丙烯酸烷基酯,較佳為使用烷基之碳數為1~20之(甲基)丙烯酸烷基酯。作為(甲基)丙烯酸烷基酯,例如可例舉:具有鏈狀烷基之(甲基)丙烯酸烷基酯((甲基)丙烯酸鏈狀烷基酯)、及具有脂環式烷基之(甲基)丙烯酸烷基酯((甲基)丙烯酸脂環式烷基酯)。As the alkyl (meth)acrylate, it is preferred to use an alkyl (meth)acrylate having an alkyl group with a carbon number of 1 to 20. Examples of the alkyl (meth)acrylate include alkyl (meth)acrylates having a chain alkyl group (chain alkyl (meth)acrylates) and alkyl (meth)acrylates having an alicyclic alkyl group (alicyclic alkyl (meth)acrylates).

作為(甲基)丙烯酸鏈狀烷基酯,例如可例舉:(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸正丁酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸第二丁酯、(甲基)丙烯酸第三丁酯、(甲基)丙烯酸戊酯、(甲基)丙烯酸異戊酯、(甲基)丙烯酸新戊酯、(甲基)丙烯酸正己酯、(甲基)丙烯酸庚酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸正辛酯、(甲基)丙烯酸異辛酯、(甲基)丙烯酸壬酯、(甲基)丙烯酸異壬酯、(甲基)丙烯酸癸酯、(甲基)丙烯酸異癸酯、(甲基)丙烯酸十一烷基酯、(甲基)丙烯酸十二烷基酯、(甲基)丙烯酸異十三烷基酯、(甲基)丙烯酸十四烷基酯、(甲基)丙烯酸異十四烷基酯、(甲基)丙烯酸十五烷基酯、(甲基)丙烯酸鯨蠟酯、(甲基)丙烯酸十七烷基酯、(甲基)丙烯酸十八烷基酯、(甲基)丙烯酸異十八烷基酯、及(甲基)丙烯酸十九烷基酯。Examples of the chain alkyl (meth)acrylate include methyl (meth)acrylate, ethyl (meth)acrylate, n-butyl (meth)acrylate, isobutyl (meth)acrylate, sec-butyl (meth)acrylate, t-butyl (meth)acrylate, pentyl (meth)acrylate, iso-pentyl (meth)acrylate, neopentyl (meth)acrylate, n-hexyl (meth)acrylate, heptyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, n-octyl (meth)acrylate, iso-octyl (meth)acrylate, 2 ... The present invention also includes the following: nonyl (meth)acrylate, isononyl (meth)acrylate, decyl (meth)acrylate, isodecyl (meth)acrylate, undecyl (meth)acrylate, dodecyl (meth)acrylate, isotridecyl (meth)acrylate, tetradecyl (meth)acrylate, isotetradecyl (meth)acrylate, pentadecyl (meth)acrylate, cetyl (meth)acrylate, heptadecyl (meth)acrylate, octadecyl (meth)acrylate, isooctadecyl (meth)acrylate, and nonadecyl (meth)acrylate.

作為(甲基)丙烯酸脂環式烷基酯,例如可例舉:(甲基)丙烯酸環烷基酯、具有二環式脂肪族烴環之(甲基)丙烯酸酯、及具有三環以上之脂肪族烴環之(甲基)丙烯酸酯。作為(甲基)丙烯酸環烷基酯,例如可例舉:(甲基)丙烯酸環戊酯、(甲基)丙烯酸環己酯、(甲基)丙烯酸甲基環己酯、(甲基)丙烯酸第三丁基環己酯、(甲基)丙烯酸環庚酯、(甲基)丙烯酸環辛酯、(甲基)丙烯酸環十二烷基酯。作為具有二環式脂肪族烴環之(甲基)丙烯酸酯,例如可例舉(甲基)丙烯酸異𦯉基酯。作為具有三環以上之脂肪族烴環之(甲基)丙烯酸酯,例如可例舉:(甲基)丙烯酸二環戊酯、(甲基)丙烯酸二環戊烯酯、(甲基)丙烯酸二環戊氧基乙酯、(甲基)丙烯酸三環戊酯、(甲基)丙烯酸1-金剛烷基酯、(甲基)丙烯酸2-甲基-2-金剛烷基酯、及(甲基)丙烯酸2-乙基-2-金剛烷基酯。Examples of the cycloalkyl (meth)acrylate include cycloalkyl (meth)acrylate, (meth)acrylate having a dicyclic aliphatic hydrocarbon ring, and (meth)acrylate having a tricyclic or higher aliphatic hydrocarbon ring. Examples of the cycloalkyl (meth)acrylate include cyclopentyl (meth)acrylate, cyclohexyl (meth)acrylate, methylcyclohexyl (meth)acrylate, tert-butylcyclohexyl (meth)acrylate, cycloheptyl (meth)acrylate, cyclooctyl (meth)acrylate, and cyclododecyl (meth)acrylate. Examples of the (meth)acrylate having a dicyclic aliphatic hydrocarbon ring include isobutyl (meth)acrylate. Examples of the (meth)acrylate having a tricyclic or more aliphatic hydrocarbon ring include dicyclopentanyl (meth)acrylate, dicyclopentenyl (meth)acrylate, dicyclopentyloxyethyl (meth)acrylate, tricyclopentanyl (meth)acrylate, 1-adamantyl (meth)acrylate, 2-methyl-2-adamantyl (meth)acrylate, and 2-ethyl-2-adamantyl (meth)acrylate.

作為(甲基)丙烯酸烷基酯,就於黏著片材10中取得軟性器件用黏著片材所要求之軟質性與黏著力之平衡之觀點而言,較佳為使用選自具有碳數8~12之第1烷基之(甲基)丙烯酸烷基酯之至少一種,或者使用選自具有碳數8~12之第1烷基之(甲基)丙烯酸烷基酯之至少一種、及選自具有碳數1~4之烷基之第2(甲基)丙烯酸烷基酯之至少一種。第1(甲基)丙烯酸烷基酯較佳為選自由丙烯酸2-乙基己酯(2EHA)、丙烯酸正辛酯(NOAA)、丙烯酸異壬酯(INAA)、及丙烯酸月桂酯(LA)所組成之群中之至少一種。第2(甲基)丙烯酸烷基酯較佳為丙烯酸正丁酯(BA)。As the alkyl (meth)acrylate, from the viewpoint of achieving a balance between softness and adhesiveness required for an adhesive sheet for a flexible device in the adhesive sheet 10, it is preferred to use at least one selected from the group consisting of alkyl (meth)acrylates having a first alkyl group with a carbon number of 8 to 12, or at least one selected from the group consisting of alkyl (meth)acrylates having a first alkyl group with a carbon number of 8 to 12 and at least one selected from the group consisting of alkyl (meth)acrylates having an alkyl group with a carbon number of 1 to 4. The first alkyl (meth)acrylate is preferably at least one selected from the group consisting of 2-ethylhexyl acrylate (2EHA), n-octyl acrylate (NOAA), isononyl acrylate (INAA), and lauryl acrylate (LA). The second alkyl (meth)acrylate is preferably n-butyl acrylate (BA).

就於黏著片材10中適當地表現出軟質性及黏著力之觀點而言,第1單體成分中之(甲基)丙烯酸烷基酯之比率較佳為80質量%以上,更佳為85質量%以上,進而較佳為88質量%以上,尤佳為90質量%以上。該比率例如為99.9質量%以下、99.5質量%以下或99質量%以下。於將選自具有碳數8~12之烷基之(甲基)丙烯酸烷基酯之第1(甲基)丙烯酸烷基酯與選自具有碳數1~4之烷基之(甲基)丙烯酸烷基酯之另一第2(甲基)丙烯酸烷基酯加以併用之情形時,單體成分中之第1(甲基)丙烯酸烷基酯之比率較佳為60質量%以上,更佳為65質量%以上,進而較佳為70質量%以上,又,較佳為85質量%以下,更佳為80質量%以下,進而較佳為75質量%以下,單體成分中之第2(甲基)丙烯酸烷基酯之比率較佳為10質量%以上,更佳為15質量%以上,進而較佳為20質量%以上,又,較佳為35質量%以下,更佳為30質量%以下,進而較佳為25質量%以下。From the viewpoint of appropriately showing softness and adhesiveness in the adhesive sheet 10, the ratio of the alkyl (meth)acrylate in the first monomer component is preferably 80 mass % or more, more preferably 85 mass % or more, further preferably 88 mass % or more, and particularly preferably 90 mass % or more. The ratio is, for example, 99.9 mass % or less, 99.5 mass % or less, or 99 mass % or less. When a first alkyl (meth)acrylate selected from alkyl (meth)acrylates having an alkyl group with 8 to 12 carbon atoms and another second alkyl (meth)acrylate selected from alkyl (meth)acrylates having an alkyl group with 1 to 4 carbon atoms are used in combination, the ratio of the first alkyl (meth)acrylate in the monomer component is preferably 60 mass% or more, more preferably 65 mass% or more, further preferably 70 mass% or more, further preferably 85 mass% or less, further preferably 80 mass% or less, further preferably 75 mass% or less, and the ratio of the second alkyl (meth)acrylate in the monomer component is preferably 10 mass% or more, more preferably 15 mass% or more, further preferably 20 mass% or more, further preferably 35 mass% or less, further preferably 30 mass% or less, further preferably 25 mass% or less.

第1單體成分亦可包含能夠與(甲基)丙烯酸烷基酯共聚之共聚性單體。作為共聚性單體,例如可例舉具有極性基之單體。作為含極性基單體,例如可例舉:含羥基單體、具有含氮原子之環之單體、及含羧基單體。含極性基單體有助於向丙烯酸聚合物中導入交聯點、確保丙烯酸聚合物之凝集力等丙烯酸聚合物之改質。共聚性單體可單獨使用,亦可併用兩種以上。The first monomer component may also include a copolymerizable monomer that can copolymerize with the (meth)acrylic acid alkyl ester. Examples of the copolymerizable monomer include monomers having a polar group. Examples of the polar group-containing monomer include: hydroxyl group-containing monomers, monomers having a ring containing a nitrogen atom, and carboxyl group-containing monomers. The polar group-containing monomer helps to introduce crosslinking points into the acrylic polymer, ensure the cohesive force of the acrylic polymer, and other modifications of the acrylic polymer. The copolymerizable monomers may be used alone or in combination of two or more.

作為含羥基單體,例如可例舉:(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸2-羥基丙酯、(甲基)丙烯酸2-羥基丁酯、(甲基)丙烯酸3-羥基丙酯、(甲基)丙烯酸4-羥基丁酯、(甲基)丙烯酸6-羥基己酯、(甲基)丙烯酸8-羥基辛酯、(甲基)丙烯酸10-羥基癸酯、(甲基)丙烯酸12-羥基月桂酯、及(甲基)丙烯酸(4-羥甲基環己基)甲酯。作為含羥基單體,較佳為選自由丙烯酸2-羥基乙酯(2HEA)及丙烯酸4-羥基丁酯(4HBA)所組成之群中之至少一種。Examples of the hydroxyl-containing monomer include 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, 3-hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, 6-hydroxyhexyl (meth)acrylate, 8-hydroxyoctyl (meth)acrylate, 10-hydroxydecyl (meth)acrylate, 12-hydroxylauryl (meth)acrylate, and (4-hydroxymethylcyclohexyl)methyl (meth)acrylate. The hydroxyl-containing monomer is preferably at least one selected from the group consisting of 2-hydroxyethyl acrylate (2HEA) and 4-hydroxybutyl acrylate (4HBA).

就向丙烯酸聚合物中導入交聯結構、以及確保黏著片材10中之凝集力之觀點而言,第1單體成分中之含羥基單體之比率較佳為1質量%以上,更佳為3質量%以上,進而較佳為5質量%以上。就調整丙烯酸聚合物之極性(與黏著片材10中之各種添加劑成分與丙烯酸聚合物之相容性相關)之觀點而言,該比率較佳為12質量%以下,更佳為10質量%以下,進而較佳為9質量%以下。From the viewpoint of introducing a cross-linked structure into the acrylic polymer and ensuring the cohesive force in the adhesive sheet 10, the ratio of the hydroxyl-containing monomer in the first monomer component is preferably 1% by mass or more, more preferably 3% by mass or more, and further preferably 5% by mass or more. From the viewpoint of adjusting the polarity of the acrylic polymer (related to the compatibility of various additive components in the adhesive sheet 10 with the acrylic polymer), the ratio is preferably 12% by mass or less, more preferably 10% by mass or less, and further preferably 9% by mass or less.

作為具有含氮原子之環之單體,例如可例舉:N-乙烯基-2-吡咯啶酮、N-甲基乙烯基吡咯啶酮、N-乙烯基吡啶、N-乙烯基哌啶酮、N-乙烯基嘧啶、N-乙烯基哌𠯤、N-乙烯基吡𠯤、N-乙烯基吡咯、N-乙烯基咪唑、N-乙烯基㗁唑、4-丙烯醯𠰌啉、N-乙烯基-2-己內醯胺、N-乙烯基-1,3-㗁𠯤-2-酮、N-乙烯基-3,5-𠰌啉二酮、N-乙烯基吡唑、N-乙烯基異㗁唑、N-乙烯基噻唑、及N-乙烯基異噻唑。具有含氮原子之環之單體較佳為N-乙烯基-2-吡咯啶酮(NVP)。Examples of the monomer having a ring containing a nitrogen atom include N-vinyl-2-pyrrolidone, N-methylvinylpyrrolidone, N-vinylpyridine, N-vinylpiperidone, N-vinylpyrimidine, N-vinylpiperidone, N-vinylpyrrolidone, N-vinylpyrrole, N-vinylimidazole, N-vinyloxazole, 4-acryloyloxazolidine, N-vinyl-2-caprolactam, N-vinyl-1,3-oxazol-2-one, N-vinyl-3,5-oxazolidinedione, N-vinylpyrazole, N-vinylisooxazolone, N-vinylthiazole, and N-vinylisothiazole. The monomer having a ring containing a nitrogen atom is preferably N-vinyl-2-pyrrolidone (NVP).

於使用具有含氮原子之環之單體之情形時,就確保黏著片材10中之凝集力、以及確保黏著片材10對被黏著體之密接力之觀點而言,第1單體成分中之具有含氮原子之環之單體的比率較佳為0.5質量%以上,更佳為1質量%以上,進而較佳為1.5質量%以上。就調整丙烯酸聚合物之玻璃轉移溫度、以及調整丙烯酸聚合物之極性(與黏著片材10中之各種添加劑成分與丙烯酸聚合物之相容性相關)之觀點而言,該比率較佳為10質量%以下,更佳為6質量%以下,進而較佳為4質量%以下。When a monomer having a ring containing a nitrogen atom is used, the ratio of the monomer having a ring containing a nitrogen atom in the first monomer component is preferably 0.5 mass % or more, more preferably 1 mass % or more, and further preferably 1.5 mass % or more, from the viewpoint of ensuring the cohesive force in the adhesive sheet 10 and the close contact of the adhesive sheet 10 to the adherend. From the viewpoint of adjusting the glass transition temperature of the acrylic polymer and adjusting the polarity of the acrylic polymer (related to the compatibility of various additive components in the adhesive sheet 10 and the acrylic polymer), the ratio is preferably 10 mass % or less, more preferably 6 mass % or less, and further preferably 4 mass % or less.

作為含羧基單體,例如可例舉:丙烯酸、甲基丙烯酸、丙烯酸羧基乙酯、丙烯酸羧基戊酯、伊康酸、馬來酸、富馬酸、丁烯酸、及異丁烯酸。Examples of the carboxyl group-containing monomer include acrylic acid, methacrylic acid, carboxyethyl acrylate, carboxypentyl acrylate, itaconic acid, maleic acid, fumaric acid, crotonic acid, and methacrylonic acid.

於使用含羧基單體之情形時,就向丙烯酸聚合物中導入交聯結構、確保黏著片材10中之凝集力、以及確保黏著片材10對被黏著體之密接力之觀點而言,單體成分中之含羧基單體之比率較佳為0.1質量%以上,更佳為0.5質量%以上,進而較佳為0.8質量%以上。就調整丙烯酸聚合物之玻璃轉移溫度、以及避免由酸引起之被黏著體之腐蝕風險之觀點而言,該比率較佳為3質量%以下,更佳為1質量%以下。When a carboxyl group-containing monomer is used, the ratio of the carboxyl group-containing monomer in the monomer component is preferably 0.1 mass % or more, more preferably 0.5 mass % or more, and further preferably 0.8 mass % or more, from the viewpoint of introducing a cross-linked structure into the acrylic polymer, ensuring the cohesive force in the adhesive sheet 10, and ensuring the close contact of the adhesive sheet 10 to the adherend. From the viewpoint of adjusting the glass transition temperature of the acrylic polymer and avoiding the risk of corrosion of the adherend caused by acid, the ratio is preferably 3 mass % or less, and more preferably 1 mass % or less.

第1單體成分亦可包含其他共聚性單體。作為其他共聚性單體,例如可例舉:酸酐單體、含磺酸基單體、含磷酸基單體、含環氧基單體、含氰基單體、含烷氧基單體、及芳香族乙烯基化合物。該等其他共聚性單體可單獨使用,亦可併用兩種以上。The first monomer component may also contain other copolymerizable monomers. Examples of other copolymerizable monomers include acid anhydride monomers, sulfonic acid group-containing monomers, phosphoric acid group-containing monomers, epoxy group-containing monomers, cyano group-containing monomers, alkoxy group-containing monomers, and aromatic vinyl compounds. These other copolymerizable monomers may be used alone or in combination of two or more.

第1單體成分較佳為包含:具有碳數8~12之烷基之第1(甲基)丙烯酸烷基酯、具有碳數1~4之烷基之第2(甲基)丙烯酸烷基酯、含羥基單體、具有含氮原子之環之單體。第1單體成分更佳為包含NOAA、BA、NVP、及4HBA。The first monomer component preferably includes: a first alkyl (meth)acrylate having an alkyl group with 8 to 12 carbon atoms, a second alkyl (meth)acrylate having an alkyl group with 1 to 4 carbon atoms, a hydroxyl group-containing monomer, and a monomer having a ring containing a nitrogen atom. The first monomer component more preferably includes NOAA, BA, NVP, and 4HBA.

基礎聚合物較佳為具有交聯結構。作為向基礎聚合物中導入交聯結構之方法,例如可例舉以下之第1方法及第2方法。於第1方法中,將具有能夠與交聯劑反應之官能基之基礎聚合物及交聯劑調配至黏著劑組合物中,使基礎聚合物與交聯劑於黏著片材中進行反應;於第2方法中,於形成基礎聚合物之第1單體成分中包含作為交聯劑之多官能化合物,藉由該第1單體成分之聚合,而形成聚合物鏈中導入有分枝結構(交聯結構)之基礎聚合物。該等方法亦可併用。The base polymer preferably has a crosslinking structure. As a method for introducing a crosslinking structure into the base polymer, for example, the following first method and second method can be cited. In the first method, a base polymer having a functional group capable of reacting with a crosslinking agent and a crosslinking agent are mixed into an adhesive composition, and the base polymer and the crosslinking agent react in an adhesive sheet; in the second method, a multifunctional compound as a crosslinking agent is included in the first monomer component forming the base polymer, and a base polymer having a branched structure (crosslinking structure) introduced into the polymer chain is formed by polymerization of the first monomer component. These methods can also be used in combination.

作為上述第1方法中使用之交聯劑,例如可例舉與基礎聚合物中所含之官能基(羥基及羧基等)反應之化合物。作為此種交聯劑,例如可例舉:異氰酸酯交聯劑、過氧化物交聯劑、環氧交聯劑、㗁唑啉交聯劑、氮丙啶交聯劑、及碳二醯亞胺交聯劑。第1方法中之交聯劑可單獨使用,亦可併用兩種以上。作為第1方法中之交聯劑,就與基礎聚合物中之羥基及羧基之反應性較高而容易導入交聯結構之方面而言,較佳為使用異氰酸酯交聯劑。As the crosslinking agent used in the above-mentioned first method, for example, a compound that reacts with the functional groups (hydroxyl and carboxyl groups, etc.) contained in the base polymer can be cited. As such a crosslinking agent, for example, isocyanate crosslinking agents, peroxide crosslinking agents, epoxy crosslinking agents, oxazoline crosslinking agents, aziridine crosslinking agents, and carbodiimide crosslinking agents can be cited. The crosslinking agent in the first method can be used alone or in combination of two or more. As the crosslinking agent in the first method, it is preferred to use an isocyanate crosslinking agent in terms of its high reactivity with the hydroxyl and carboxyl groups in the base polymer and its ease of introduction into a crosslinked structure.

作為異氰酸酯交聯劑,例如可例舉:甲苯二異氰酸酯、六亞甲基二異氰酸酯、異佛爾酮二異氰酸酯、苯二甲基二異氰酸酯、氫化苯二甲基二異氰酸酯、二苯基甲烷二異氰酸酯、氫化二苯基甲烷二異氰酸酯、四甲基苯二甲基二異氰酸酯、萘二異氰酸酯、三苯甲烷三異氰酸酯、及多亞甲基多苯基異氰酸酯。又,作為異氰酸酯交聯劑,亦可例舉該等異氰酸酯之衍生物。作為該異氰酸酯衍生物,例如可例舉異氰尿酸酯改性體及多元醇改性體。作為異氰酸酯交聯劑之市售品,例如可例舉:Coronate L(甲苯二異氰酸酯之三羥甲基丙烷加成物,東曹製造)、Coronate HL(六亞甲基二異氰酸酯之三羥甲基丙烷加成物,東曹製造)、Coronate HX(六亞甲基二異氰酸酯之異氰尿酸酯體,東曹製造)、Takenate D110 N(苯二甲基二異氰酸酯之三羥甲基丙烷加成物,三井化學製造)、及Takenate 600(1,3-雙(異氰酸基甲基)環己烷,三井化學製造)。As the isocyanate crosslinking agent, for example, toluene diisocyanate, hexamethylene diisocyanate, isophorone diisocyanate, xylylene diisocyanate, hydrogenated xylylene diisocyanate, diphenylmethane diisocyanate, hydrogenated diphenylmethane diisocyanate, tetramethylxylylene diisocyanate, naphthalene diisocyanate, triphenylmethane triisocyanate, and polymethylene polyphenyl isocyanate can be cited. In addition, as the isocyanate crosslinking agent, derivatives of the isocyanates can also be cited. As the isocyanate derivative, for example, isocyanurate modified bodies and polyol modified bodies can be cited. Examples of commercially available isocyanate crosslinking agents include Coronate L (trihydroxymethylpropane adduct of toluene diisocyanate, manufactured by Tosoh Corporation), Coronate HL (trihydroxymethylpropane adduct of hexamethylene diisocyanate, manufactured by Tosoh Corporation), Coronate HX (isocyanurate of hexamethylene diisocyanate, manufactured by Tosoh Corporation), Takenate D110 N (trihydroxymethylpropane adduct of xylylenediisocyanate, manufactured by Mitsui Chemicals Co., Ltd.), and Takenate 600 (1,3-bis(isocyanatomethyl)cyclohexane, manufactured by Mitsui Chemicals Co., Ltd.).

作為過氧化物交聯劑,可例舉:過氧化二苯甲醯、過氧化二碳酸二(2-乙基己基)酯、過氧化二碳酸二(4-第三丁基環己基)酯、過氧化二碳酸二第二丁酯、過氧化新癸酸第三丁酯、過氧化特戊酸第三己酯、及過氧化特戊酸第三丁酯。Examples of the peroxide crosslinking agent include dibenzoyl peroxide, di(2-ethylhexyl) peroxydicarbonate, di(4-t-butylcyclohexyl) peroxydicarbonate, di-t-butyl peroxydicarbonate, t-butyl peroxyneodecanoate, t-butyl peroxypivalate, and t-butyl peroxypivalate.

作為環氧交聯劑,可例舉:雙酚A、表氯醇型環氧樹脂、乙二醇二縮水甘油醚、聚乙二醇二縮水甘油醚、甘油二縮水甘油醚、甘油三縮水甘油醚、1,6-己二醇縮水甘油醚、三羥甲基丙烷三縮水甘油醚、二縮水甘油基苯胺、二胺縮水甘油胺、N,N,N',N'-四縮水甘油基間苯二甲胺、及1,3-雙(N,N-二縮水甘油胺甲基)環己烷。Examples of the epoxy crosslinking agent include bisphenol A, epichlorohydrin type epoxy resin, ethylene glycol diglycidyl ether, polyethylene glycol diglycidyl ether, glycerol diglycidyl ether, glycerol triglycidyl ether, 1,6-hexanediol glycidyl ether, trihydroxymethylpropane triglycidyl ether, diglycidyl aniline, diamine glycidylamine, N,N,N',N'-tetraglycidyl-m-xylylenediamine, and 1,3-bis(N,N-diglycidylaminomethyl)cyclohexane.

至於第1方法中之交聯劑之調配量,就確保黏著片材10之凝集力之觀點而言,基礎聚合物每100質量份,例如為0.01質量份以上,較佳為0.05質量份以上,更佳為0.1質量份以上。就於黏著片材10中確保良好之黏性之觀點而言,相對於基礎聚合物100質量份之交聯劑之調配量例如為5質量份以下,較佳為1質量份以下,更佳為0.2質量份以下。As for the amount of the crosslinking agent in the first method, from the viewpoint of ensuring the cohesive force of the adhesive sheet 10, the amount is, for example, 0.01 parts by mass or more, preferably 0.05 parts by mass or more, and more preferably 0.1 parts by mass or more per 100 parts by mass of the base polymer. From the viewpoint of ensuring good adhesion in the adhesive sheet 10, the amount of the crosslinking agent is, for example, 5 parts by mass or less, preferably 1 part by mass or less, and more preferably 0.2 parts by mass or less per 100 parts by mass of the base polymer.

於上述第2方法中,第1單體成分(包含用以導入交聯結構之多官能化合物及單官能化合物)可一次聚合,亦可分多階段聚合。於多階段聚合之方法中,首先,使用以形成基礎聚合物之單官能單體聚合(預聚合),藉此製備含有部分聚合物(低聚合度之聚合物與未反應之單官能單體之混合物)之預聚物組合物。繼而,於向預聚物組合物中添加作為交聯劑之多官能化合物後,於包含部分聚合物及多官能化合物之反應系中進行聚合反應(正式聚合)。In the above-mentioned second method, the first monomer component (including the multifunctional compound and the monofunctional compound for introducing the crosslinking structure) can be polymerized at once or in multiple stages. In the multistage polymerization method, first, the monofunctional monomer used to form the base polymer is polymerized (prepolymerization) to prepare a prepolymer composition containing a partial polymer (a mixture of a polymer with a low degree of polymerization and unreacted monofunctional monomer). Then, after adding the multifunctional compound as a crosslinking agent to the prepolymer composition, a polymerization reaction (main polymerization) is carried out in a reaction system containing the partial polymer and the multifunctional compound.

作為多官能化合物,例如可例舉於1分子中含有2個以上之乙烯性不飽和雙鍵之多官能單體及多官能低聚物。作為多官能單體,可例舉多官能(甲基)丙烯酸酯。Examples of the polyfunctional compound include polyfunctional monomers and polyfunctional oligomers having two or more ethylenically unsaturated double bonds in one molecule. Examples of the polyfunctional monomer include polyfunctional (meth)acrylates.

作為多官能(甲基)丙烯酸酯,可例舉:二官能(甲基)丙烯酸酯、三官能(甲基)丙烯酸酯、及四官能以上之多官能(甲基)丙烯酸酯。Examples of the polyfunctional (meth)acrylate include difunctional (meth)acrylate, trifunctional (meth)acrylate, and tetrafunctional or higher polyfunctional (meth)acrylate.

作為二官能(甲基)丙烯酸酯,例如可例舉:乙二醇二(甲基)丙烯酸酯、二乙二醇二(甲基)丙烯酸酯、三乙二醇二(甲基)丙烯酸酯、四乙二醇二(甲基)丙烯酸酯、1,6-己二醇二(甲基)丙烯酸酯、1,9-壬二醇二(甲基)丙烯酸酯、甘油二(甲基)丙烯酸酯、乙氧化雙酚A二丙烯酸酯(BPAEODE)、及新戊二醇二(甲基)丙烯酸酯。Examples of the difunctional (meth)acrylate include ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, tetraethylene glycol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, 1,9-nonanediol di(meth)acrylate, glycerol di(meth)acrylate, ethoxylated bisphenol A diacrylate (BPAEODE), and neopentyl glycol di(meth)acrylate.

作為三官能(甲基)丙烯酸酯,例如可例舉:三羥甲基丙烷三(甲基)丙烯酸酯、季戊四醇三(甲基)丙烯酸酯、及異氰尿酸三(丙烯醯氧基乙基)酯。Examples of the trifunctional (meth)acrylate include trihydroxymethylpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, and tri(acryloxyethyl)isocyanurate.

作為四官能以上之多官能(甲基)丙烯酸酯,例如可例舉:二-三羥甲基丙烷四(甲基)丙烯酸酯、季戊四醇四(甲基)丙烯酸酯、二季戊四醇單羥基五(甲基)丙烯酸酯、烷基改性二季戊四醇五(甲基)丙烯酸酯、及二季戊四醇六(甲基)丙烯酸酯。Examples of the tetrafunctional or higher polyfunctional (meth)acrylate include di-trihydroxymethylpropane tetra(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol monohydroxy penta(meth)acrylate, alkyl-modified dipentaerythritol penta(meth)acrylate, and dipentaerythritol hexa(meth)acrylate.

作為多官能低聚物,例如可例舉:胺基甲酸酯(甲基)丙烯酸系低聚物、聚酯(甲基)丙烯酸系低聚物、聚醚(甲基)丙烯酸系低聚物、多元醇(甲基)丙烯酸系低聚物、環氧(甲基)丙烯酸系低聚物、聚乙二醇二(甲基)丙烯酸酯、及聚丙二醇二(甲基)丙烯酸酯。Examples of the polyfunctional oligomer include urethane (meth)acrylic oligomers, polyester (meth)acrylic oligomers, polyether (meth)acrylic oligomers, polyol (meth)acrylic oligomers, epoxy (meth)acrylic oligomers, polyethylene glycol di(meth)acrylate, and polypropylene glycol di(meth)acrylate.

第2方法中之作為交聯劑之多官能化合物可單獨使用,亦可併用兩種以上。作為多官能化合物,較佳為使用多官能單體,更佳為使用選自由1,9-壬二醇二丙烯酸酯、二季戊四醇六丙烯酸酯、1,6-己二醇二丙烯酸酯、及三羥甲基丙烷三丙烯酸酯所組成之群中之至少一種。The multifunctional compound used as a crosslinking agent in the second method may be used alone or in combination of two or more. As the multifunctional compound, it is preferred to use a multifunctional monomer, and it is more preferred to use at least one selected from the group consisting of 1,9-nonanediol diacrylate, dipentaerythritol hexaacrylate, 1,6-hexanediol diacrylate, and trihydroxymethylpropane triacrylate.

至於第1單體成分中之作為交聯劑之多官能化合物之調配量,就確保黏著片材10之凝集力之觀點而言,單官能單體每100質量份,較佳為0.02質量份以上,更佳為0.05質量份以上,進而較佳為0.07質量份以上。至於多官能化合物之調配量,就於黏著片材10中確保良好之黏性之觀點而言,單官能單體每100質量份,較佳為3質量份以下,更佳為2質量份以下,進而較佳為1質量份以下。As for the amount of the multifunctional compound as a crosslinking agent in the first monomer component, from the viewpoint of ensuring the cohesive force of the adhesive sheet 10, it is preferably 0.02 mass parts or more, more preferably 0.05 mass parts or more, and further preferably 0.07 mass parts or more per 100 mass parts of the monofunctional monomer. As for the amount of the multifunctional compound, from the viewpoint of ensuring good adhesion in the adhesive sheet 10, it is preferably 3 mass parts or less, more preferably 2 mass parts or less, and further preferably 1 mass part or less per 100 mass parts of the monofunctional monomer.

丙烯酸聚合物(基礎聚合物)可藉由使上述第1單體成分聚合而形成。作為聚合方法,例如可例舉溶液聚合、乳化聚合、及無溶劑下之光聚合(例如紫外線聚合)。作為溶液聚合之溶劑,例如可使用乙酸乙酯及甲苯。於聚合中,亦可使用鏈轉移劑。又,作為聚合之起始劑,例如可使用熱聚合起始劑及光聚合起始劑。聚合起始劑可單獨使用,亦可併用兩種以上。至於聚合起始劑之使用量,第1單體成分每100質量份,較佳為0.03質量份以上,更佳為0.05質量份以上,進而較佳為0.07質量份以上,又,較佳為1質量份以下,更佳為0.5質量份以下,進而較佳為0.3質量份以下。The acrylic polymer (base polymer) can be formed by polymerizing the first monomer component. Examples of the polymerization method include solution polymerization, emulsion polymerization, and photopolymerization without a solvent (e.g., ultraviolet polymerization). Examples of solvents for solution polymerization include ethyl acetate and toluene. In the polymerization, a chain transfer agent can also be used. In addition, examples of polymerization initiators include thermal polymerization initiators and photopolymerization initiators. The polymerization initiators can be used alone or in combination of two or more. The amount of the polymerization initiator used is preferably 0.03 parts by mass or more, more preferably 0.05 parts by mass or more, and further preferably 0.07 parts by mass or more per 100 parts by mass of the first monomer component, and is preferably 1 part by mass or less, more preferably 0.5 parts by mass or less, and further preferably 0.3 parts by mass or less.

作為熱聚合起始劑,例如可例舉偶氮聚合起始劑及過氧化物聚合起始劑。作為偶氮聚合起始劑,例如可例舉:2,2'-偶氮二異丁腈、2,2'-偶氮雙-2-甲基丁腈、2,2'-偶氮雙(2-甲基丙酸)二甲酯、4,4'-偶氮雙-4-氰基戊酸、偶氮二異戊腈、2,2'-偶氮雙(2-脒基丙烷)二鹽酸鹽。作為過氧化物聚合起始劑,例如可例舉:過氧化二苯甲醯、過氧化順丁烯二酸第三丁酯、及過氧化月桂醯。Examples of the thermal polymerization initiator include azo polymerization initiators and peroxide polymerization initiators. Examples of the azo polymerization initiator include 2,2'-azobisisobutyronitrile, 2,2'-azobis-2-methylbutyronitrile, 2,2'-azobis(2-methylpropionic acid) dimethyl ester, 4,4'-azobis-4-cyanovaleric acid, azobisisovaleronitrile, and 2,2'-azobis(2-amidinopropane) dihydrochloride. Examples of the peroxide polymerization initiator include dibenzoyl peroxide, tert-butyl peroxymaleate, and lauryl peroxide.

作為光聚合起始劑,例如可例舉:自由基系光聚合起始劑、陽離子系光聚合起始劑、及陰離子系光聚合起始劑。Examples of the photopolymerization initiator include radical photopolymerization initiators, cationic photopolymerization initiators, and anionic photopolymerization initiators.

作為自由基系光聚合起始劑,例如可例舉:醯基氧化膦系光聚合起始劑、安息香醚系光聚合起始劑、及苯乙酮系光聚合起始劑。Examples of the radical photopolymerization initiator include acylphosphine oxide photopolymerization initiators, benzoin ether photopolymerization initiators, and acetophenone photopolymerization initiators.

作為醯基氧化膦系光聚合起始劑,例如包含雙(2,4,6-三甲基苯甲醯基)苯基氧化膦、雙(2,4,6-三甲基苯甲醯基)-2,4-二正丁氧基苯基氧化膦、2,4,6-三甲基苯甲醯基二苯基氧化膦、及雙(2,6-二甲氧基苯甲醯基)-2,4,4-三甲基戊基氧化膦。作為安息香醚系光聚合起始劑,例如可例舉:安息香甲醚、安息香乙醚、安息香丙醚、安息香異丙醚、安息香異丁醚、及2,2-二甲氧基-1,2-二苯乙烷-1-酮。作為苯乙酮系光聚合起始劑,例如可例舉:2,2-二乙氧基苯乙酮、2,2-二甲氧基-2-苯基苯乙酮、1-羥基環己基苯基酮、4-苯氧基二氯苯乙酮、及4-(第三丁基)二氯苯乙酮。Examples of the acylphosphine oxide-based photopolymerization initiator include bis(2,4,6-trimethylbenzyl)phenylphosphine oxide, bis(2,4,6-trimethylbenzyl)-2,4-di-n-butoxyphenylphosphine oxide, 2,4,6-trimethylbenzyldiphenylphosphine oxide, and bis(2,6-dimethoxybenzyl)-2,4,4-trimethylpentylphosphine oxide. Examples of the benzoin ether-based photopolymerization initiator include benzoin methyl ether, benzoin ethyl ether, benzoin propyl ether, benzoin isopropyl ether, benzoin isobutyl ether, and 2,2-dimethoxy-1,2-diphenylethane-1-one. Examples of the acetophenone-based photopolymerization initiator include 2,2-diethoxyacetophenone, 2,2-dimethoxy-2-phenylacetophenone, 1-hydroxycyclohexyl phenyl ketone, 4-phenoxydichloroacetophenone, and 4-(tert-butyl)dichloroacetophenone.

就確保黏著片材10中之凝集力之觀點而言,基礎聚合物之重量平均分子量較佳為10萬以上,更佳為30萬以上,進而較佳為50萬以上。基礎聚合物之重量平均分子量係利用凝膠滲透層析法(GPC)進行測定並藉由聚苯乙烯換算而算出。From the viewpoint of ensuring the cohesive force in the adhesive sheet 10, the weight average molecular weight of the base polymer is preferably 100,000 or more, more preferably 300,000 or more, and further preferably 500,000 or more. The weight average molecular weight of the base polymer is measured by gel permeation chromatography (GPC) and calculated by polystyrene conversion.

基礎聚合物之玻璃轉移溫度(Tg)較佳為0℃以下,更佳為-10℃以下,進而較佳為-20℃以下。該玻璃轉移溫度例如為-80℃以上。關於基礎聚合物之玻璃轉移溫度(Tg),可使用基於上述Fox公式求出之玻璃轉移溫度(理論值)。The glass transition temperature (Tg) of the base polymer is preferably 0°C or lower, more preferably -10°C or lower, and further preferably -20°C or lower. The glass transition temperature is, for example, -80°C or higher. The glass transition temperature (theoretical value) obtained based on the above-mentioned Fox equation can be used for the glass transition temperature (Tg) of the base polymer.

於使用丙烯酸聚合物作為基礎聚合物之情形時,作為低聚物,較佳為丙烯酸系低聚物。丙烯酸系低聚物係以50質量%以上之比率包含(甲基)丙烯酸烷基酯之單體成分(第2單體成分)之共聚物,重量平均分子量例如為1000以上30000以下。低聚物可單獨使用,亦可併用兩種以上。When an acrylic polymer is used as the base polymer, an acrylic oligomer is preferably used as the oligomer. The acrylic oligomer is a copolymer containing a monomer component (second monomer component) of an alkyl (meth)acrylate at a ratio of 50 mass % or more, and has a weight average molecular weight of, for example, 1000 or more and 30000 or less. The oligomer may be used alone or in combination of two or more.

於併用兩種以上之低聚物之情形時,至少一種低聚物滿足規定之參數(例如玻璃轉移溫度、基礎聚合物之HSP之氫鍵項δH 1與低聚物之HSP之氫鍵項δH 2的差ΔH(=δH 2-δH 1)、重量平均分子量)即可。即,於併用兩種以上之低聚物之情形時,在無損本發明之效果之範圍內,亦可包含不滿足規定之參數(例如玻璃轉移溫度、基礎聚合物之HSP之氫鍵項δH 1與低聚物之HSP之氫鍵項δH 2的差ΔH(=δH 2-δH 1)、重量平均分子量)之低聚物。較佳為併用之全部低聚物滿足規定之參數。 When two or more oligomers are used in combination, at least one oligomer satisfies the specified parameters (e.g., glass transition temperature, difference ΔH (= δH 2 - δH 1 ) between hydrogen bonding term δH 1 of HSP of base polymer and hydrogen bonding term δH 2 of HSP of oligomer), weight average molecular weight). That is, when two or more oligomers are used in combination, oligomers that do not satisfy the specified parameters (e.g., glass transition temperature, difference ΔH (= δH 2 - δH 1 ) between hydrogen bonding term δH 1 of HSP of base polymer and hydrogen bonding term δH 2 of HSP of oligomer ), weight average molecular weight) may be included within the scope that does not impair the effect of the present invention. It is preferred that all oligomers used in combination meet the specified parameters.

作為第2單體成分中之(甲基)丙烯酸烷基酯,例如可例舉(甲基)丙烯酸脂環式烷基酯及(甲基)丙烯酸鏈狀烷基酯。Examples of the alkyl (meth)acrylate in the second monomer component include cyclic alkyl (meth)acrylate and chain alkyl (meth)acrylate.

作為第2單體成分中之(甲基)丙烯酸脂環式烷基酯,例如可例舉上文關於第1單體成分所述之(甲基)丙烯酸脂環式烷基酯。第2單體成分中之(甲基)丙烯酸脂環式烷基酯較佳為選自由甲基丙烯酸環己酯(CHMA)、甲基丙烯酸甲基環己酯、甲基丙烯酸第三丁基環己酯、甲基丙烯酸環十二烷基酯、甲基丙烯酸異𦯉基酯(IBXMA)、甲基丙烯酸二環戊酯(DCPMA)、甲基丙烯酸二環戊烯酯、及甲基丙烯酸1-金剛烷基酯(ADMA)所組成之群中之至少一種,更佳為選自由DCPMA、CHMA、IBXMA、及ADMA所組成之群中之至少一種。As the (meth) cycloalkyl acrylate in the second monomer component, for example, the (meth) cycloalkyl acrylate described above for the first monomer component can be cited. The (meth) cycloalkyl acrylate in the second monomer component is preferably at least one selected from the group consisting of cyclohexyl methacrylate (CHMA), methyl cyclohexyl methacrylate, tert-butyl cyclohexyl methacrylate, cyclododecyl methacrylate, isoindigoyl methacrylate (IBXMA), dicyclopentyl methacrylate (DCPMA), dicyclopentenyl methacrylate, and 1-adamantyl methacrylate (ADMA), and more preferably at least one selected from the group consisting of DCPMA, CHMA, IBXMA, and ADMA.

就低聚物之高Tg化之觀點而言,第2單體成分中之(甲基)丙烯酸脂環式烷基酯之比率較佳為30質量%以上,更佳為35質量%以上,進而較佳為40質量%以上。就第2單體成分之聚合性之觀點而言,第2單體成分中之(甲基)丙烯酸脂環式烷基酯之比率較佳為80質量%以下,更佳為75質量%以下,進而較佳為65質量%以下。From the viewpoint of increasing the Tg of the oligomer, the ratio of the (meth) cycloalkyl acrylate in the second monomer component is preferably 30% by mass or more, more preferably 35% by mass or more, and further preferably 40% by mass or more. From the viewpoint of the polymerizability of the second monomer component, the ratio of the (meth) cycloalkyl acrylate in the second monomer component is preferably 80% by mass or less, more preferably 75% by mass or less, and further preferably 65% by mass or less.

作為第2單體成分中之(甲基)丙烯酸鏈狀烷基酯,例如可例舉上文關於第1單體成分所述之(甲基)丙烯酸鏈狀烷基酯。第2單體成分中之(甲基)丙烯酸鏈狀烷基酯較佳為具有碳數1~6之烷基之(甲基)丙烯酸烷基酯,更佳為甲基丙烯酸甲酯(MMA)。MMA由於均聚物之玻璃轉移溫度高,且與基礎聚合物之相容性較高,故而較佳。As the chain alkyl (meth)acrylate in the second monomer component, for example, the chain alkyl (meth)acrylate described above for the first monomer component can be cited. The chain alkyl (meth)acrylate in the second monomer component is preferably an alkyl (meth)acrylate having an alkyl group with 1 to 6 carbon atoms, more preferably methyl methacrylate (MMA). MMA is preferred because the glass transition temperature of the homopolymer is high and the compatibility with the base polymer is high.

就確保低聚物之高Tg、以及調整低聚物對基礎聚合物之相容性之觀點而言,第2單體成分中之(甲基)丙烯酸鏈狀烷基酯之比率較佳為15質量%以上,更佳為20質量%以上,進而較佳為25質量%以上,進而較佳為30質量%以上,又,較佳為60質量%以下,更佳為55質量%以下,進而較佳為50質量%以下。From the viewpoint of ensuring a high Tg of the oligomer and adjusting the compatibility of the oligomer with the base polymer, the ratio of the chain alkyl (meth)acrylate in the second monomer component is preferably 15 mass % or more, more preferably 20 mass % or more, further preferably 25 mass % or more, further preferably 30 mass % or more, and further preferably 60 mass % or less, more preferably 55 mass % or less, further preferably 50 mass % or less.

就低聚物之高Tg化、以及調整低聚物對基礎聚合物之相容性之觀點而言,第2單體成分中之(甲基)丙烯酸脂環式烷基酯相對於(甲基)丙烯酸鏈狀烷基酯之質量比率較佳為0.6以上,更佳為0.8以上,又,較佳為9.0以下,更佳為5.0以下,進而較佳為2.0以下。From the viewpoint of increasing the Tg of the oligomer and adjusting the compatibility of the oligomer with the base polymer, the mass ratio of the cyclic alkyl (meth)acrylate to the chain alkyl (meth)acrylate in the second monomer component is preferably 0.6 or more, more preferably 0.8 or more, and preferably 9.0 or less, more preferably 5.0 or less, and further preferably 2.0 or less.

第2單體成分亦可包含能夠與(甲基)丙烯酸烷基酯共聚之共聚性單體。作為共聚性單體,例如可例舉親水性單體。作為親水性單體,例如可例舉含羥基單體、具有含氮原子之環之單體、含羧基單體、及含醚基單體,較佳為選自由含羥基單體、具有含氮原子之環之單體、含羧基單體、及含醚基單體所組成之群中之至少一種。親水性單體可單獨使用,亦可併用兩種以上。The second monomer component may also include a copolymerizable monomer that can copolymerize with the (meth) alkyl acrylate. Examples of the copolymerizable monomer include hydrophilic monomers. Examples of the hydrophilic monomer include hydroxyl-containing monomers, monomers having a ring containing a nitrogen atom, carboxyl-containing monomers, and ether-containing monomers. Preferably, the hydrophilic monomer is at least one selected from the group consisting of hydroxyl-containing monomers, monomers having a ring containing a nitrogen atom, carboxyl-containing monomers, and ether-containing monomers. The hydrophilic monomer may be used alone or in combination of two or more.

作為第2單體成分中之含羥基單體,例如可例舉上文關於第1單體成分所述之含羥基單體。第2單體成分中之含羥基單體較佳為選自由甲基丙烯酸2-羥基乙酯(HEMA)、甲基丙烯酸2-羥基丙酯(HPMA)、及丙烯酸4-羥基丁酯(4HBA)所組成之群中之至少一種。As the hydroxyl-containing monomer in the second monomer component, for example, the hydroxyl-containing monomers described above for the first monomer component can be cited. The hydroxyl-containing monomer in the second monomer component is preferably at least one selected from the group consisting of 2-hydroxyethyl methacrylate (HEMA), 2-hydroxypropyl methacrylate (HPMA), and 4-hydroxybutyl acrylate (4HBA).

就調整低聚物對基礎聚合物之相容性之觀點而言,第2單體成分中之含羥基單體之比率較佳為1質量%以上,更佳為3質量%以上,進而較佳為5質量%以上,又,較佳為18質量%以下,更佳為15質量%以下,進而較佳為12質量%以下。From the viewpoint of adjusting the compatibility of the oligomer with the base polymer, the ratio of the hydroxyl group-containing monomer in the second monomer component is preferably 1 mass % or more, more preferably 3 mass % or more, further preferably 5 mass % or more, and preferably 18 mass % or less, more preferably 15 mass % or less, further preferably 12 mass % or less.

作為第2單體成分中之具有含氮原子之環之單體,例如可例舉上文關於第1單體成分所述之具有含氮原子之環之單體。第2單體成分中之具有含氮原子之環之單體較佳為4-丙烯醯𠰌啉(ACMO)。Examples of the monomer having a nitrogen atom-containing ring in the second monomer component include the monomer having a nitrogen atom-containing ring described above with respect to the first monomer component. The monomer having a nitrogen atom-containing ring in the second monomer component is preferably 4-acryloylmoline (ACMO).

就調整低聚物對基礎聚合物之相容性之觀點而言,第2單體成分中之具有含氮原子之環之單體之比率較佳為5質量%以上,更佳為10質量%以上,進而較佳為15質量%以上。就控制低聚物之分子量之觀點而言,第2單體成分中之具有含氮原子之環之單體之比率較佳為30質量%以下,更佳為25質量%以下,進而較佳為22質量%以下。From the viewpoint of adjusting the compatibility of the oligomer with the base polymer, the ratio of the monomer having a ring containing a nitrogen atom in the second monomer component is preferably 5 mass % or more, more preferably 10 mass % or more, and further preferably 15 mass % or more. From the viewpoint of controlling the molecular weight of the oligomer, the ratio of the monomer having a ring containing a nitrogen atom in the second monomer component is preferably 30 mass % or less, more preferably 25 mass % or less, and further preferably 22 mass % or less.

作為第2單體成分中之含羧基單體,例如可例舉上文關於第1單體成分所述之含羧基單體。第2單體成分中之含羧基單體較佳為丙烯酸(AA)。Examples of the carboxyl group-containing monomer in the second monomer component include the carboxyl group-containing monomers described above for the first monomer component. The carboxyl group-containing monomer in the second monomer component is preferably acrylic acid (AA).

就調整低聚物對基礎聚合物之相容性之觀點而言,第2單體成分中之含羧基單體之比率較佳為1質量%以上,更佳為3質量%以上,進而較佳為5質量%以上,又,較佳為18質量%以下,更佳為15質量%以下,進而較佳為12質量%以下。From the viewpoint of adjusting the compatibility of the oligomer with the base polymer, the ratio of the carboxyl group-containing monomer in the second monomer component is preferably 1 mass % or more, more preferably 3 mass % or more, further preferably 5 mass % or more, and further preferably 18 mass % or less, more preferably 15 mass % or less, further preferably 12 mass % or less.

作為含醚基單體,例如可例舉:(甲基)丙烯酸乙基卡必醇酯、(甲基)丙烯酸2-甲氧基乙酯、(甲基)丙烯酸乙氧基乙酯、(甲基)丙烯酸四氫糠酯、(甲基)丙烯酸2-苯氧基乙酯、(甲基)丙烯酸苯氧基乙酯、及(甲基)丙烯酸乙烯氧基乙氧基乙酯。含醚基單體較佳為丙烯酸乙基卡必醇酯(CBA)。Examples of the ether group-containing monomer include ethyl carbitol (meth)acrylate, 2-methoxyethyl (meth)acrylate, ethoxyethyl (meth)acrylate, tetrahydrofurfuryl (meth)acrylate, 2-phenoxyethyl (meth)acrylate, phenoxyethyl (meth)acrylate, and vinyloxyethoxyethyl (meth)acrylate. The ether group-containing monomer is preferably ethyl carbitol acrylate (CBA).

就調整低聚物對基礎聚合物之相容性之觀點而言,第2單體成分中之含醚基單體之比率較佳為3質量%以上,更佳為5質量%以上,進而較佳為7質量%以上,又,較佳為40質量%以下,更佳為35質量%以下,進而較佳為32質量%以下。From the viewpoint of adjusting the compatibility of the oligomer with the base polymer, the ratio of the ether group-containing monomer in the second monomer component is preferably 3 mass % or more, more preferably 5 mass % or more, further preferably 7 mass % or more, and further preferably 40 mass % or less, more preferably 35 mass % or less, further preferably 32 mass % or less.

第2單體成分較佳為包含(甲基)丙烯酸脂環式烷基酯、(甲基)丙烯酸鏈狀烷基酯、及親水性單體。即,丙烯酸系低聚物較佳為包含(甲基)丙烯酸脂環式烷基酯、(甲基)丙烯酸鏈狀烷基酯、及親水性單體之第2單體成分之共聚物。The second monomer component preferably includes a cyclic alkyl (meth)acrylate, a chain alkyl (meth)acrylate, and a hydrophilic monomer. That is, the acrylic oligomer is preferably a copolymer of the second monomer component including a cyclic alkyl (meth)acrylate, a chain alkyl (meth)acrylate, and a hydrophilic monomer.

就低聚物之高Tg化、以及調整低聚物對基礎聚合物之相容性之觀點而言,第2單體成分中之親水性單體之比率較佳為1質量%以上,更佳為3質量%以上,進而較佳為5質量%以上,又,較佳為40質量%以下,更佳為35質量%以下,進而較佳為32質量%以下。From the viewpoint of increasing the Tg of the oligomer and adjusting the compatibility of the oligomer with the base polymer, the ratio of the hydrophilic monomer in the second monomer component is preferably 1 mass % or more, more preferably 3 mass % or more, further preferably 5 mass % or more, and further preferably 40 mass % or less, more preferably 35 mass % or less, further preferably 32 mass % or less.

如上所述,丙烯酸系低聚物可單獨使用,亦可併用兩種以上。於併用兩種以上之丙烯酸系低聚物之情形時,較佳為至少一種以上之低聚物為包含(甲基)丙烯酸脂環式烷基酯、(甲基)丙烯酸鏈狀烷基酯、及親水性單體之第2單體成分之共聚物。具體而言,可例舉包含(甲基)丙烯酸脂環式烷基酯及(甲基)丙烯酸鏈狀烷基酯之第2單體成分之共聚物、及包含(甲基)丙烯酸脂環式烷基酯、(甲基)丙烯酸鏈狀烷基酯、及親水性單體之第2單體成分之共聚物之併用。As described above, the acrylic oligomer may be used alone or in combination of two or more. When two or more acrylic oligomers are used in combination, it is preferred that at least one or more of the oligomers is a copolymer of a second monomer component comprising a (meth)acrylate cyclic alkyl ester, a (meth)acrylate chain alkyl ester, and a hydrophilic monomer. Specifically, examples include a copolymer of a second monomer component comprising a (meth)acrylate cyclic alkyl ester and a (meth)acrylate chain alkyl ester, and a copolymer of a second monomer component comprising a (meth)acrylate cyclic alkyl ester, a (meth)acrylate chain alkyl ester, and a hydrophilic monomer.

於併用兩種以上之丙烯酸系低聚物之情形時,丙烯酸系低聚物之總量中之各共聚物(各丙烯酸系低聚物)之含有比率並無特別限定,於併用兩種以上之丙烯酸系低聚物滿足規定之參數之範圍內適當調整。具體而言,丙烯酸系低聚物之總量中的包含(甲基)丙烯酸脂環式烷基酯、(甲基)丙烯酸鏈狀烷基酯、及親水性單體之第2單體成分之共聚物(1個丙烯酸系低聚物)之含有比率較佳為50質量%以上,更佳為55質量%以上,進而較佳為58質量%以上。When two or more acrylic oligomers are used in combination, the content ratio of each copolymer (each acrylic oligomer) in the total amount of acrylic oligomers is not particularly limited, and is appropriately adjusted within the range where the two or more acrylic oligomers used in combination meet the specified parameters. Specifically, the content ratio of the copolymer (one acrylic oligomer) containing a second monomer component of a (meth)acrylate cyclic alkyl ester, a (meth)acrylate chain alkyl ester, and a hydrophilic monomer in the total amount of acrylic oligomers is preferably 50% by mass or more, more preferably 55% by mass or more, and further preferably 58% by mass or more.

丙烯酸系低聚物係藉由使該丙烯酸系低聚物之第2單體成分聚合而獲得。作為聚合方法,例如可例舉溶液聚合、乳化聚合、及無溶劑下之光聚合(例如紫外線聚合)。作為溶液聚合之溶劑,例如可使用乙酸乙酯及甲苯。於聚合中,亦可使用鏈轉移劑以調整分子量。又,作為聚合之起始劑,例如可使用熱聚合起始劑及光聚合起始劑。聚合起始劑可單獨使用,亦可併用兩種以上。至於聚合起始劑之使用量,第2單體成分每100質量份,較佳為0.03質量份以上,更佳為0.05質量份以上,進而較佳為0.07質量份以上,又,較佳為1質量份以下,更佳為0.5質量份以下,進而較佳為0.3質量份以下。The acrylic oligomer is obtained by polymerizing the second monomer component of the acrylic oligomer. Examples of the polymerization method include solution polymerization, emulsion polymerization, and photopolymerization without a solvent (e.g., ultraviolet polymerization). Examples of solvents for solution polymerization include ethyl acetate and toluene. During the polymerization, a chain transfer agent may be used to adjust the molecular weight. Furthermore, examples of polymerization initiators include thermal polymerization initiators and photopolymerization initiators. The polymerization initiators may be used alone or in combination of two or more. The amount of the polymerization initiator used is preferably 0.03 parts by mass or more, more preferably 0.05 parts by mass or more, and further preferably 0.07 parts by mass or more per 100 parts by mass of the second monomer component, and is preferably 1 part by mass or less, more preferably 0.5 parts by mass or less, and further preferably 0.3 parts by mass or less.

就黏著片材10之表面(黏著面11、12)之高黏著化之觀點而言,低聚物之重量平均分子量Mw較佳為4300以上,更佳為4500以上,進而較佳為4700以上。就低聚物在黏著片材10之表面及其附近之偏集存在化(向表面移動之特性)之觀點而言,低聚物之重量平均分子量Mw較佳為10000以下,更佳為8000以下,進而較佳為6000以下。具體而言,低聚物之重量平均分子量Mw之測定方法如下文關於實施例所述。From the viewpoint of high adhesion of the surface (adhesive surfaces 11, 12) of the adhesive sheet 10, the weight average molecular weight Mw of the oligomer is preferably 4300 or more, more preferably 4500 or more, and further preferably 4700 or more. From the viewpoint of the oligomer's segregation on the surface and vicinity of the adhesive sheet 10 (property of migration to the surface), the weight average molecular weight Mw of the oligomer is preferably 10000 or less, more preferably 8000 or less, and further preferably 6000 or less. Specifically, the method for determining the weight average molecular weight Mw of the oligomer is as described below in connection with the embodiments.

為了充分提高黏著片材10之黏著力,相對於基礎聚合物100質量份,黏著片材10中之丙烯酸系低聚物之含量較佳為0.2質量份以上,更佳為0.3質量份以上,進而較佳為0.5質量份以上。就確保黏著片材10之透明性之觀點而言,相對於基礎聚合物100質量份,黏著片材10中之丙烯酸系低聚物之含量較佳為5質量份以下,更佳為4質量份以下,進而較佳為3質量份以下。於黏著片材10中之丙烯酸系低聚物之含量過大之情形時,有因該丙烯酸系低聚物之相容性下降而導致霧度上升從而使透明性下降之傾向。In order to fully improve the adhesive force of the adhesive sheet 10, the content of the acrylic oligomer in the adhesive sheet 10 is preferably 0.2 parts by mass or more, more preferably 0.3 parts by mass or more, and further preferably 0.5 parts by mass or more, relative to 100 parts by mass of the base polymer. From the viewpoint of ensuring the transparency of the adhesive sheet 10, the content of the acrylic oligomer in the adhesive sheet 10 is preferably 5 parts by mass or less, more preferably 4 parts by mass or less, and further preferably 3 parts by mass or less, relative to 100 parts by mass of the base polymer. When the content of the acrylic oligomer in the adhesive sheet 10 is too large, there is a tendency that the compatibility of the acrylic oligomer decreases, resulting in an increase in haze and a decrease in transparency.

黏著劑組合物亦可含有矽烷偶合劑。相對於基礎聚合物100質量份,黏著劑組合物中之矽烷偶合劑之含量較佳為0.1質量份以上,更佳為0.2質量份以上。該含量較佳為5質量份以下,更佳為3質量份以下。The adhesive composition may also contain a silane coupling agent. The content of the silane coupling agent in the adhesive composition is preferably 0.1 parts by mass or more, more preferably 0.2 parts by mass or more, relative to 100 parts by mass of the base polymer. The content is preferably 5 parts by mass or less, more preferably 3 parts by mass or less.

黏著劑組合物亦可視需要含有其他成分。作為其他成分,例如可例舉:溶劑、黏著賦予劑、塑化劑、軟化劑、抗氧化劑、填充劑、著色劑、紫外線吸收劑、抗氧化劑、界面活性劑、及抗靜電劑。作為溶劑,例如可例舉:於使丙烯酸聚合物聚合時視需要使用之聚合溶劑、及聚合後添加至聚合反應溶液中之溶劑。作為該溶劑,例如可使用乙酸乙酯及甲苯。The adhesive composition may also contain other components as needed. Examples of other components include solvents, adhesive agents, plasticizers, softeners, antioxidants, fillers, colorants, ultraviolet absorbers, antioxidants, surfactants, and antistatic agents. Examples of solvents include polymerization solvents used as needed when polymerizing acrylic polymers and solvents added to the polymerization reaction solution after polymerization. Examples of the solvent include ethyl acetate and toluene.

黏著片材10例如可藉由如下方式來製造:將上述黏著劑組合物塗佈於剝離襯墊L1(第1剝離襯墊)上而形成塗膜後,對該塗膜照射紫外線,或者使該塗膜乾燥。黏著片材10亦可藉由如下方式來製造:將上述黏著劑組合物塗佈於剝離襯墊L1(第1剝離襯墊)上而形成塗膜,於該塗膜上積層剝離襯墊L2(第2剝離襯墊)後,對剝離襯墊間之塗膜照射紫外線,或者使該塗膜乾燥。The adhesive sheet 10 can be manufactured, for example, by applying the adhesive composition on the peeling pad L1 (first peeling pad) to form a coating, and then irradiating the coating with ultraviolet rays or drying the coating. The adhesive sheet 10 can also be manufactured by applying the adhesive composition on the peeling pad L1 (first peeling pad) to form a coating, laminating the peeling pad L2 (second peeling pad) on the coating, and then irradiating the coating between the peeling pads with ultraviolet rays or drying the coating.

作為剝離襯墊L1,例如可例舉具有可撓性之塑膠膜。作為該塑膠膜,例如可例舉:聚對苯二甲酸乙二酯膜等聚酯膜、聚乙烯膜、及聚丙烯膜。剝離襯墊L1之厚度例如為3 μm以上,又,例如為200 μm以下。剝離襯墊L1之表面較佳為經剝離處理。As the release liner L1, for example, a flexible plastic film can be cited. As the plastic film, for example, polyester films such as polyethylene terephthalate films, polyethylene films, and polypropylene films can be cited. The thickness of the release liner L1 is, for example, not less than 3 μm, and, for example, not more than 200 μm. The surface of the release liner L1 is preferably subjected to a release treatment.

作為黏著劑組合物之塗佈方法,例如可例舉:輥式塗佈、接觸輥式塗佈、凹版塗佈、反向塗佈、輥式刷塗、噴塗、浸漬輥塗佈、棒式塗佈、刮塗、氣刀塗佈、淋幕式塗佈、模唇塗佈、及模嘴塗佈。塗膜之乾燥溫度例如為50℃~200℃。乾燥時間例如為5秒~20分鐘。Examples of the coating method of the adhesive composition include roller coating, contact roller coating, gravure coating, reverse coating, roller brush coating, spray coating, dip roller coating, rod coating, scraper coating, air knife coating, curtain coating, die lip coating, and die nozzle coating. The drying temperature of the coating film is, for example, 50° C. to 200° C. The drying time is, for example, 5 seconds to 20 minutes.

剝離襯墊L2較佳為表面經剝離處理之可撓性塑膠膜。作為剝離襯墊L2,可使用上文關於剝離襯墊L1所述之塑膠膜。The peeling pad L2 is preferably a flexible plastic film with a peeling treatment on the surface. As the peeling pad L2, the plastic film described above for the peeling pad L1 can be used.

可以如上方式製造黏著片材10,該黏著片材10係利用剝離襯墊L1、L2被覆保護黏著面11、12而成。The adhesive sheet 10 can be manufactured in the above manner. The adhesive sheet 10 is formed by covering and protecting the adhesive surfaces 11 and 12 with the release pads L1 and L2.

圖2A至圖2C係表示黏著片材10之使用方法之一例。2A to 2C show an example of a method of using the adhesive sheet 10. FIG.

於本方法中,首先,如圖2A所示,將黏著片材10貼合於第1構件21(被黏著體)之厚度方向H之一面。第1構件21例如為軟性顯示面板所具有之積層構造中之一元件。作為該元件,例如可例舉:像素面板、偏光膜、觸控面板及覆蓋膜(下述第2構件22亦同樣如此)。藉由本步驟,於第1構件21上設置有用以與其他構件接合之黏著片材10。In this method, first, as shown in FIG. 2A , an adhesive sheet 10 is attached to one surface of the first component 21 (adhered body) in the thickness direction H. The first component 21 is, for example, a component in a laminated structure of a flexible display panel. Examples of such components include: a pixel panel, a polarizing film, a touch panel, and a cover film (the same applies to the second component 22 described below). By this step, an adhesive sheet 10 is provided on the first component 21 for bonding with other components.

繼而,如圖2B所示,介隔第1構件21上之黏著片材10,將第1構件21之厚度方向H之一面側與第2構件22之厚度方向H之另一面側接合。第2構件22例如為軟性顯示面板所具有之積層構造中之其他元件。2B, one side of the first member 21 in the thickness direction H is bonded to the other side of the second member 22 in the thickness direction H via the adhesive sheet 10 on the first member 21. The second member 22 is, for example, another element in the laminated structure of the flexible display panel.

繼而,如圖2C所示,使第1構件21與第2構件22之間之黏著片材10熟化。藉由熟化,黏著片材10與構件21、22之間之接合力提高。熟化溫度例如為20℃~160℃。熟化時間例如為1分鐘至21天。於進行高壓釜處理(加熱加壓處理)作為熟化之情形時,溫度例如為30℃~80℃,壓力例如為0.1~0.8 MPa,處理時間例如為15分鐘以上。 [實施例] Next, as shown in FIG. 2C , the adhesive sheet 10 between the first component 21 and the second component 22 is aged. By the aging, the bonding force between the adhesive sheet 10 and the components 21 and 22 is improved. The aging temperature is, for example, 20°C to 160°C. The aging time is, for example, 1 minute to 21 days. When the aging is performed by autoclave treatment (heating and pressure treatment), the temperature is, for example, 30°C to 80°C, the pressure is, for example, 0.1 to 0.8 MPa, and the treatment time is, for example, more than 15 minutes. [Example]

以下,示出實施例對本發明具體地進行說明。但是,本發明並不限定於實施例。又,以下所記載之調配量(含量)、物性值、參數等具體數值可替換為上述「實施方式」中所記載之與其等相對應之調配量(含量)、物性值、參數等之上限(定義為「以下」或「未達」之數值)或下限(定義為「「以上」或「超過」之數值)。The following examples are given to specifically illustrate the present invention. However, the present invention is not limited to the examples. In addition, the specific numerical values of the blending amounts (contents), physical property values, parameters, etc. described below can be replaced by the upper limits (defined as values "below" or "less than") or lower limits (defined as values "above" or "exceeding") of the corresponding blending amounts (contents), physical property values, parameters, etc. described in the above-mentioned "Implementation Method".

<第1預聚物組合物之製備> 於具備攪拌機、溫度計、回流冷凝器、及氮氣導入管之反應容器內,向丙烯酸正辛酯(NOAA)70質量份、丙烯酸正丁酯(BA)20質量份、丙烯酸4-羥基丁酯(4HBA)8質量份、及N-乙烯基-2-吡咯啶酮(NVP)2質量份之單體混合物中加入第1光聚合起始劑(產品名「Omnirad 184」,1-羥基環己基苯基酮,IGM Resins公司製造)0.05質量份及第2光聚合起始劑(產品名「Omnirad 651」,2,2-二甲氧基-1,2-二苯乙烷-1-酮,IGM Resins公司製造)0.05質量份後,於氮氣氛圍下對該混合物照射紫外線,藉此使混合物中之單體成分之一部分聚合而獲得第1預聚物組合物。於進行紫外線照射時,使用黑光燈。紫外線照射持續至組合物之黏度成為10~20 Pa・s為止。該黏度係利用B型黏度計(產品名「TVB-10M」,東機產業公司製造),於轉子No.22、轉子轉速6 rpm、及溫度30℃之條件下所測得之值(下述黏度亦同樣如此)。所獲得之第1預聚物組合物係含有丙烯酸聚合物P1及未經過聚合反應之單體成分(殘存單體)之部分聚合物。第1預聚物組合物中之丙烯酸聚合物P1之重量平均分子量約為430萬。 <Preparation of the first prepolymer composition> In a reaction vessel equipped with a stirrer, a thermometer, a reflux condenser, and a nitrogen inlet tube, 0.05 parts by weight of the first photopolymerization initiator (product name "Omnirad 184", 1-hydroxycyclohexyl phenyl ketone, manufactured by IGM Resins) and 0.05 parts by weight of the second photopolymerization initiator (product name "Omnirad 651", 2,2-dimethoxy-1,2-diphenylethane-1-one, manufactured by IGM Resins) were added to a monomer mixture of 70 parts by weight of n-octyl acrylate (NOAA), 20 parts by weight of n-butyl acrylate (BA), 8 parts by weight of 4-hydroxybutyl acrylate (4HBA), and 2 parts by weight of N-vinyl-2-pyrrolidone (NVP). Resins Co., Ltd.) was added, and then the mixture was irradiated with ultraviolet rays in a nitrogen atmosphere, thereby polymerizing a portion of the monomer components in the mixture to obtain the first prepolymer composition. A black light was used for ultraviolet irradiation. The ultraviolet irradiation was continued until the viscosity of the composition reached 10-20 Pa·s. The viscosity was measured using a B-type viscometer (product name "TVB-10M", manufactured by Toki Sangyo Co., Ltd.) under the conditions of rotor No. 22, rotor speed 6 rpm, and temperature 30°C (the same applies to the viscosity described below). The first prepolymer composition obtained contains a partial polymer of acrylic polymer P1 and monomer components (residual monomers) that have not undergone polymerization reaction. The weight average molecular weight of acrylic polymer P1 in the first prepolymer composition is approximately 4.3 million.

<第2預聚物組合物之製備> 於具備攪拌機、溫度計、回流冷凝器、及氮氣導入管之反應容器內,向丙烯酸月桂酯(LA)48質量份、丙烯酸2-乙基己酯(2EHA)51質量份、及丙烯酸4-羥基丁酯(4HBA)1質量份之單體混合物中加入第1光聚合起始劑(Omnirad 184)0.05質量份及第2光聚合起始劑(Omnirad 651)0.05質量份後,於氮氣氛圍下對該混合物照射紫外線,藉此使混合物中之單體成分之一部分聚合而獲得第2預聚物組合物。於進行紫外線照射時,使用黑光燈。紫外線照射持續至組合物之黏度成為10~20 Pa・s為止。所獲得之第2預聚物組合物係含有丙烯酸聚合物P2及未經過聚合反應之單體成分(殘存單體)之部分聚合物。第2預聚物組合物中之丙烯酸聚合物P2之重量平均分子量約為480萬。 <Preparation of the second prepolymer composition> In a reaction vessel equipped with a stirrer, a thermometer, a reflux condenser, and a nitrogen inlet tube, 0.05 parts by mass of the first photopolymerization initiator (Omnirad 184) and 0.05 parts by mass of the second photopolymerization initiator (Omnirad 651) were added to a monomer mixture of 48 parts by mass of lauryl acrylate (LA), 51 parts by mass of 2-ethylhexyl acrylate (2EHA), and 1 part by mass of 4-hydroxybutyl acrylate (4HBA), and then the mixture was irradiated with ultraviolet light in a nitrogen atmosphere to polymerize part of the monomer components in the mixture to obtain the second prepolymer composition. A black light was used for ultraviolet irradiation. Ultraviolet irradiation was continued until the viscosity of the composition reached 10 to 20 Pa·s. The obtained second prepolymer composition contains acrylic polymer P2 and a partial polymer of monomer components that have not undergone polymerization reaction (residual monomers). The weight average molecular weight of acrylic polymer P2 in the second prepolymer composition is about 4.8 million.

<第3預聚物組合物之製備> 於具備攪拌機、溫度計、回流冷凝器、及氮氣導入管之反應容器內,向丙烯酸正辛酯(NOAA)70質量份、丙烯酸正丁酯(BA)20質量份、丙烯酸月桂酯(LA)30質量份、丙烯酸4-羥基丁酯(4HBA)8質量份、及N-乙烯基-2-吡咯啶酮(NVP)2質量份之單體混合物中加入第1光聚合起始劑(Omnirad 184)0.05質量份及第2光聚合起始劑(Omnirad 651)0.05質量份後,於氮氣氛圍下對該混合物照射紫外線,藉此使混合物中之單體成分之一部分聚合而獲得第3預聚物組合物。於進行紫外線照射時,使用黑光燈。紫外線照射持續至組合物之黏度成為10~20 Pa・s為止。所獲得之第3預聚物組合物係含有丙烯酸聚合物P3及未經過聚合反應之單體成分(殘存單體)之部分聚合物。第3預聚物組合物中之丙烯酸聚合物P3之重量平均分子量約為500萬。 <Preparation of the third prepolymer composition> In a reaction vessel equipped with a stirrer, a thermometer, a reflux condenser, and a nitrogen inlet tube, 0.05 parts by mass of the first photopolymerization initiator (Omnirad 184) and 0.05 parts by mass of the second photopolymerization initiator (Omnirad 651) were added to a monomer mixture of 70 parts by mass of n-octyl acrylate (NOAA), 20 parts by mass of n-butyl acrylate (BA), 30 parts by mass of lauryl acrylate (LA), 8 parts by mass of 4-hydroxybutyl acrylate (4HBA), and 2 parts by mass of N-vinyl-2-pyrrolidone (NVP), and then the mixture was irradiated with ultraviolet light in a nitrogen atmosphere to polymerize part of the monomer components in the mixture to obtain the third prepolymer composition. A black light was used for ultraviolet irradiation. The ultraviolet irradiation is continued until the viscosity of the composition reaches 10-20 Pa·s. The third prepolymer composition obtained contains acrylic polymer P3 and a partial polymer of monomer components that have not undergone polymerization reaction (residual monomers). The weight average molecular weight of acrylic polymer P3 in the third prepolymer composition is about 5 million.

<丙烯酸系低聚物M1之製備> 首先,於具備攪拌機、溫度計、回流冷凝器、及氮氣導入管之反應容器內,使包含甲基丙烯酸異𦯉基酯(IBXMA)45質量份、甲基丙烯酸甲酯(MMA)45質量份、丙烯酸卡必醇酯(CBA)10質量份、作為鏈轉移劑之α-硫代甘油3質量份、作為熱聚合起始劑之2,2'-偶氮二異丁腈(AIBN)0.3質量份、及作為溶劑之乙酸乙酯之混合物(固形物成分濃度26質量%)於氮氣氛圍下以72℃~74℃反應6小時(聚合反應)。繼而,將反應溶液於90℃下加熱12小時,藉此使乙酸乙酯、鏈轉移劑及未反應單體揮發而加以去除。藉此,獲得固形狀之丙烯酸系低聚物M1。丙烯酸系低聚物M1之重量平均分子量(Mw)為4880。丙烯酸系低聚物M1之玻璃轉移溫度(Tg)為98.5℃。 <Preparation of acrylic oligomer M1> First, in a reaction vessel equipped with a stirrer, a thermometer, a reflux condenser, and a nitrogen inlet tube, a mixture containing 45 parts by mass of isobutyl methacrylate (IBXMA), 45 parts by mass of methyl methacrylate (MMA), 10 parts by mass of carbitol acrylate (CBA), 3 parts by mass of α-thioglycerol as a chain transfer agent, 0.3 parts by mass of 2,2'-azobisisobutyronitrile (AIBN) as a thermal polymerization initiator, and ethyl acetate as a solvent (solid content concentration 26% by mass) was reacted at 72°C to 74°C for 6 hours under a nitrogen atmosphere (polymerization reaction). Then, the reaction solution was heated at 90°C for 12 hours to volatilize and remove ethyl acetate, chain transfer agent and unreacted monomers. Thus, a solid acrylic oligomer M1 was obtained. The weight average molecular weight (Mw) of the acrylic oligomer M1 was 4880. The glass transition temperature (Tg) of the acrylic oligomer M1 was 98.5°C.

<丙烯酸系低聚物M2之製備> IBXMA之調配量設為35質量份,將MMA之調配量設為35質量份,且將CBA之調配量設為30質量份,除此以外,以與丙烯酸系低聚物M1相同之方式獲得固形狀之丙烯酸系低聚物M2。丙烯酸系低聚物M2之Mw為5400。丙烯酸系低聚物M2之Tg為50.9℃。 <Preparation of acrylic oligomer M2> A solid acrylic oligomer M2 was obtained in the same manner as acrylic oligomer M1 except that the blending amount of IBXMA was 35 parts by mass, the blending amount of MMA was 35 parts by mass, and the blending amount of CBA was 30 parts by mass. The Mw of acrylic oligomer M2 was 5400. The Tg of acrylic oligomer M2 was 50.9°C.

<丙烯酸系低聚物M3之製備> 首先,於具備攪拌機、溫度計、回流冷凝器、及氮氣導入管之反應容器內,使包含甲基丙烯酸二環戊酯(DCPMA)45質量份、MMA 45質量份、CBA 10質量份、作為鏈轉移劑之α-硫代甘油3質量份、作為熱聚合起始劑之AIBN 0.3質量份、及作為溶劑之乙酸乙酯之混合物(固形物成分濃度26質量%)於氮氣氛圍下以72℃~74℃反應6小時(聚合反應)。繼而,將反應溶液於90℃下加熱12小時,藉此使乙酸乙酯、鏈轉移劑及未反應單體揮發而加以去除。藉此,獲得固形狀之丙烯酸系低聚物M3。丙烯酸系低聚物M3之Mw為5230。丙烯酸系低聚物M3之Tg為97.7℃。 <Preparation of acrylic oligomer M3> First, in a reaction vessel equipped with a stirrer, a thermometer, a reflux condenser, and a nitrogen inlet tube, a mixture containing 45 parts by mass of dicyclopentyl methacrylate (DCPMA), 45 parts by mass of MMA, 10 parts by mass of CBA, 3 parts by mass of α-thioglycerol as a chain transfer agent, 0.3 parts by mass of AIBN as a thermal polymerization initiator, and ethyl acetate as a solvent (solid content concentration 26% by mass) was reacted at 72°C to 74°C for 6 hours under a nitrogen atmosphere (polymerization reaction). Then, the reaction solution was heated at 90°C for 12 hours to volatilize and remove ethyl acetate, chain transfer agent, and unreacted monomers. In this way, a solid acrylic oligomer M3 was obtained. The Mw of acrylic oligomer M3 is 5230. The Tg of acrylic oligomer M3 is 97.7℃.

<丙烯酸系低聚物M4之製備> 將IBXMA之調配量設為40質量份,將MMA之調配量設為40質量份,且使用4-丙烯醯𠰌啉(ACMO)20質量份來代替CBA 10質量份,除此以外,以與丙烯酸系低聚物M1相同之方式獲得固形狀之丙烯酸系低聚物M4。丙烯酸系低聚物M4之Mw為4940。丙烯酸系低聚物M4之Tg為129.2℃。 <Preparation of acrylic oligomer M4> The acrylic oligomer M4 was obtained in a solid form in the same manner as the acrylic oligomer M1, except that the amount of IBXMA was set to 40 parts by mass, the amount of MMA was set to 40 parts by mass, and 20 parts by mass of 4-acryloyl methoxyphene (ACMO) was used instead of 10 parts by mass of CBA. The Mw of the acrylic oligomer M4 was 4940. The Tg of the acrylic oligomer M4 was 129.2°C.

<丙烯酸系低聚物M5之製備> 將DCPMA之調配量設為40質量份,將MMA之調配量設為40質量份,且使用ACMO 20質量份來代替CBA 10質量份,除此以外,以與丙烯酸系低聚物M3相同之方式獲得固形狀之丙烯酸系低聚物M5。丙烯酸系低聚物M5之Mw為5110。丙烯酸系低聚物M5之Tg為128.3℃。 <Preparation of acrylic oligomer M5> Solid acrylic oligomer M5 was obtained in the same manner as acrylic oligomer M3 except that the amount of DCPMA was set to 40 parts by mass, the amount of MMA was set to 40 parts by mass, and 20 parts by mass of ACMO was used instead of 10 parts by mass of CBA. The Mw of acrylic oligomer M5 was 5110. The Tg of acrylic oligomer M5 was 128.3°C.

<丙烯酸系低聚物M6之製備> 除了使用丙烯酸(AA)10質量份來代替CBA 10質量份以外,以與丙烯酸系低聚物M1相同之方式獲得固形狀之丙烯酸系低聚物M6。丙烯酸系低聚物M6之Mw為5670。丙烯酸系低聚物M6之Tg為121.9℃。 <Preparation of acrylic oligomer M6> Solid acrylic oligomer M6 was obtained in the same manner as acrylic oligomer M1 except that 10 parts by mass of acrylic acid (AA) was used instead of 10 parts by mass of CBA. The Mw of acrylic oligomer M6 was 5670. The Tg of acrylic oligomer M6 was 121.9°C.

<丙烯酸系低聚物M7之製備> 除了使用甲基丙烯酸2-羥基乙酯(HEMA)10質量份來代替CBA 10質量份以外,以與丙烯酸系低聚物M3相同之方式獲得固形狀之丙烯酸系低聚物M7。丙烯酸系低聚物M7之Mw為5600。丙烯酸系低聚物M7之Tg為115.8℃。 <Preparation of acrylic oligomer M7> Solid acrylic oligomer M7 was obtained in the same manner as acrylic oligomer M3 except that 10 parts by mass of 2-hydroxyethyl methacrylate (HEMA) was used instead of 10 parts by mass of CBA. The Mw of acrylic oligomer M7 was 5600. The Tg of acrylic oligomer M7 was 115.8°C.

<丙烯酸系低聚物M8之製備> 將DCPMA之調配量設為60質量份,將MMA之調配量設為30質量份,且使用HEMA 10質量份來代替CBA 10質量份,除此以外,以與丙烯酸系低聚物M3相同之方式獲得固形狀之丙烯酸系低聚物M8。丙烯酸系低聚物M8之Mw為5570。丙烯酸系低聚物M8之Tg為123.9℃。 <Preparation of acrylic oligomer M8> Solid acrylic oligomer M8 was obtained in the same manner as acrylic oligomer M3 except that the amount of DCPMA was set to 60 parts by mass, the amount of MMA was set to 30 parts by mass, and 10 parts by mass of HEMA was used instead of 10 parts by mass of CBA. The Mw of acrylic oligomer M8 was 5570. The Tg of acrylic oligomer M8 was 123.9°C.

<丙烯酸系低聚物M9之製備> 首先,於具備攪拌機、溫度計、回流冷凝器、及氮氣導入管之反應容器內,使包含甲基丙烯酸環己酯(CHMA)45質量份、MMA 45質量份、HEMA 10質量份、作為鏈轉移劑之α-硫代甘油3質量份、作為熱聚合起始劑之AIBN 0.3質量份、作為溶劑之乙酸乙酯之混合物(固形物成分濃度26質量%)於氮氣氛圍下以72℃~74℃反應6小時(聚合反應)。繼而,將反應溶液於90℃下加熱12小時,藉此使乙酸乙酯、鏈轉移劑及未反應單體揮發而加以去除。藉此,獲得固形狀之丙烯酸系低聚物M9。丙烯酸系低聚物M9之Mw為5920。丙烯酸系低聚物M9之Tg為85.4℃。 <Preparation of acrylic oligomer M9> First, in a reaction vessel equipped with a stirrer, a thermometer, a reflux condenser, and a nitrogen inlet tube, a mixture containing 45 parts by mass of cyclohexyl methacrylate (CHMA), 45 parts by mass of MMA, 10 parts by mass of HEMA, 3 parts by mass of α-thioglycerol as a chain transfer agent, 0.3 parts by mass of AIBN as a thermal polymerization initiator, and ethyl acetate as a solvent (solid content concentration 26% by mass) was reacted at 72°C to 74°C for 6 hours under a nitrogen atmosphere (polymerization reaction). Then, the reaction solution was heated at 90°C for 12 hours to volatilize and remove ethyl acetate, chain transfer agents, and unreacted monomers. In this way, a solid acrylic oligomer M9 was obtained. The Mw of acrylic oligomer M9 is 5920. The Tg of acrylic oligomer M9 is 85.4℃.

<丙烯酸系低聚物M10之製備> 除了使用4HBA 10質量份來代替HEMA 10質量份以外,以與丙烯酸系低聚物M9相同之方式獲得固形狀之丙烯酸系低聚物M10。丙烯酸系低聚物M10之Mw為5740。丙烯酸系低聚物M10之Tg為72.2℃。 <Preparation of acrylic oligomer M10> Solid acrylic oligomer M10 was obtained in the same manner as acrylic oligomer M9 except that 10 parts by mass of 4HBA was used instead of 10 parts by mass of HEMA. The Mw of acrylic oligomer M10 was 5740. The Tg of acrylic oligomer M10 was 72.2°C.

<丙烯酸系低聚物M11之製備> 除了使用甲基丙烯酸2-羥基丙酯(HPMA)10質量份來代替HEMA 10質量份以外,以與丙烯酸系低聚物M9相同之方式獲得固形狀之丙烯酸系低聚物M11。丙烯酸系低聚物M11之Mw為5840。丙烯酸系低聚物M11之Tg為82.4℃。 <Preparation of acrylic oligomer M11> Solid acrylic oligomer M11 was obtained in the same manner as acrylic oligomer M9 except that 10 parts by mass of 2-hydroxypropyl methacrylate (HPMA) was used instead of 10 parts by mass of HEMA. The Mw of acrylic oligomer M11 was 5840. The Tg of acrylic oligomer M11 was 82.4°C.

<丙烯酸系低聚物M12之製備> 除了使用4HBA 10質量份來代替CBA 10質量份以外,以與丙烯酸系低聚物M1相同之方式獲得丙烯酸系低聚物M12。丙烯酸系低聚物M12之Mw為5320。丙烯酸系低聚物M12之Tg為99.2℃。 <Preparation of acrylic oligomer M12> Acrylic oligomer M12 was obtained in the same manner as acrylic oligomer M1, except that 10 parts by mass of 4HBA was used instead of 10 parts by mass of CBA. The Mw of acrylic oligomer M12 was 5320. The Tg of acrylic oligomer M12 was 99.2°C.

<丙烯酸系低聚物M13之製備> 首先,於具備攪拌機、溫度計、回流冷凝器、及氮氣導入管之反應容器內,使包含IBXMA 50質量份、NVP 50質量份、作為鏈轉移劑之α-硫代甘油3質量份、作為熱聚合起始劑之AIBN 0.3質量份、作為溶劑之乙酸乙酯之混合物(固形物成分濃度26質量%)於氮氣氛圍下以72℃~74℃反應6小時(聚合反應)。繼而,將反應溶液於90℃下加熱12小時,藉此使乙酸乙酯、鏈轉移劑及未反應單體揮發而加以去除。藉此,獲得固形狀之丙烯酸系低聚物M13。丙烯酸系低聚物M13之Mw為10200。丙烯酸系低聚物M13之Tg為193℃。 <Preparation of acrylic oligomer M13> First, in a reaction vessel equipped with a stirrer, a thermometer, a reflux condenser, and a nitrogen inlet tube, a mixture containing 50 parts by mass of IBXMA, 50 parts by mass of NVP, 3 parts by mass of α-thioglycerol as a chain transfer agent, 0.3 parts by mass of AIBN as a thermal polymerization initiator, and ethyl acetate as a solvent (solid content concentration 26% by mass) was reacted at 72°C to 74°C for 6 hours under a nitrogen atmosphere (polymerization reaction). Then, the reaction solution was heated at 90°C for 12 hours to volatilize and remove ethyl acetate, chain transfer agent, and unreacted monomers. In this way, a solid acrylic oligomer M13 was obtained. The Mw of acrylic oligomer M13 is 10200. The Tg of acrylic oligomer M13 is 193℃.

<丙烯酸系低聚物M14之製備> 首先,於具備攪拌機、溫度計、回流冷凝器、及氮氣導入管之反應容器內,使包含丙烯酸正戊酯(NPA)(產品名「LIMA」,大阪有機化學工業製造)50質量份、MMA 50質量份、作為鏈轉移劑之α-硫代甘油3質量份、作為熱聚合起始劑之AIBN 0.3質量份、作為溶劑之乙酸乙酯之混合物(固形物成分濃度26質量%)於氮氣氛圍下以72℃~74℃反應6小時(聚合反應)。繼而,將反應溶液於90℃下加熱12小時,藉此使乙酸乙酯、鏈轉移劑及未反應單體揮發而加以去除。藉此,獲得固形狀之丙烯酸系低聚物M14。丙烯酸系低聚物M14之Mw為5220。丙烯酸系低聚物M14之Tg為20.6℃。 <Preparation of acrylic oligomer M14> First, in a reaction vessel equipped with a stirrer, a thermometer, a reflux condenser, and a nitrogen inlet tube, a mixture containing 50 parts by mass of n-pentyl acrylate (NPA) (product name "LIMA", manufactured by Osaka Organic Chemical Industry Co., Ltd.), 50 parts by mass of MMA, 3 parts by mass of α-thioglycerol as a chain transfer agent, 0.3 parts by mass of AIBN as a thermal polymerization initiator, and ethyl acetate as a solvent (solid content concentration 26% by mass) was reacted at 72°C to 74°C for 6 hours under a nitrogen atmosphere (polymerization reaction). Then, the reaction solution was heated at 90°C for 12 hours to volatilize and remove ethyl acetate, the chain transfer agent, and unreacted monomers. In this way, a solid acrylic oligomer M14 was obtained. The Mw of the acrylic oligomer M14 was 5220. The Tg of the acrylic oligomer M14 was 20.6°C.

<丙烯酸系低聚物M15之製備> 將IBXMA之調配量設為90質量份,且不調配MMA,除此以外,以與丙烯酸系低聚物M1相同之方式獲得固形狀之丙烯酸系低聚物M15。丙烯酸系低聚物M15之Mw為4230。丙烯酸系低聚物M15之Tg為123.4℃。 <Preparation of acrylic oligomer M15> Solid acrylic oligomer M15 was obtained in the same manner as acrylic oligomer M1, except that the amount of IBXMA was set to 90 parts by mass and MMA was not added. The Mw of acrylic oligomer M15 was 4230. The Tg of acrylic oligomer M15 was 123.4°C.

<丙烯酸系低聚物M16之製備> 將DCPMA之調配量設為40質量份,將MMA之調配量設為40質量份,且使用4HBA 20質量份來代替CBA 10質量份,除此以外,以與丙烯酸系低聚物M3相同之方式獲得固形狀之丙烯酸系低聚物M16。丙烯酸系低聚物M16之Mw為5350。丙烯酸系低聚物M16之Tg為76.8℃。 <Preparation of acrylic oligomer M16> A solid acrylic oligomer M16 was obtained in the same manner as acrylic oligomer M3 except that the amount of DCPMA was set to 40 parts by mass, the amount of MMA was set to 40 parts by mass, and 20 parts by mass of 4HBA was used instead of 10 parts by mass of CBA. The Mw of acrylic oligomer M16 was 5350. The Tg of acrylic oligomer M16 was 76.8°C.

<丙烯酸系低聚物M17之製備> 除了使用甲基丙烯酸月桂酯(LMA)10質量份來代替CBA 10質量份以外,以與丙烯酸系低聚物M1相同之方式獲得丙烯酸系低聚物M17。丙烯酸系低聚物M17之Mw為5780。丙烯酸系低聚物M17之Tg為125.5℃。 <Preparation of acrylic oligomer M17> Acrylic oligomer M17 was obtained in the same manner as acrylic oligomer M1, except that 10 parts by mass of lauryl methacrylate (LMA) was used instead of 10 parts by mass of CBA. The Mw of acrylic oligomer M17 was 5780. The Tg of acrylic oligomer M17 was 125.5°C.

<丙烯酸系低聚物M18之製備> 將IBXMA之調配量設為75質量份,將MMA之調配量設為20質量份,且使用HEMA 5質量份來代替CBA 10質量份,除此以外,以與丙烯酸系低聚物M1相同之方式獲得固形狀之丙烯酸系低聚物M18。丙烯酸系低聚物M18之Mw為4610。丙烯酸系低聚物M18之Tg為141.0℃。 <Preparation of acrylic oligomer M18> Solid acrylic oligomer M18 was obtained in the same manner as acrylic oligomer M1, except that the amount of IBXMA was set to 75 parts by mass, the amount of MMA was set to 20 parts by mass, and 5 parts by mass of HEMA was used instead of 10 parts by mass of CBA. The Mw of acrylic oligomer M18 was 4610. The Tg of acrylic oligomer M18 was 141.0℃.

<丙烯酸系低聚物M19之製備> 除了使用4HBA 10質量份來代替HEMA 10質量份以外,以與丙烯酸系低聚物M7相同之方式獲得固形狀之丙烯酸系低聚物M19。丙烯酸系低聚物M19之Mw為5430。丙烯酸系低聚物M19之Tg為99.2℃。 <Preparation of acrylic oligomer M19> Solid acrylic oligomer M19 was obtained in the same manner as acrylic oligomer M7 except that 10 parts by mass of 4HBA was used instead of 10 parts by mass of HEMA. The Mw of acrylic oligomer M19 was 5430. The Tg of acrylic oligomer M19 was 99.2°C.

<丙烯酸系低聚物M20之製備> 將IBXMA之調配量設為80質量份,將CMA之調配量設為20質量份,且不調配MMA,除此以外,以與丙烯酸系低聚物M1相同之方式獲得固形狀之丙烯酸系低聚物M20。丙烯酸系低聚物M20之Mw為3820。丙烯酸系低聚物M20之Tg為80.8℃。 <Preparation of acrylic oligomer M20> A solid acrylic oligomer M20 was obtained in the same manner as acrylic oligomer M1 except that the amount of IBXMA was set to 80 parts by mass, the amount of CMA was set to 20 parts by mass, and MMA was not added. The Mw of acrylic oligomer M20 was 3820. The Tg of acrylic oligomer M20 was 80.8°C.

<丙烯酸系低聚物M21之製備> 將IBXMA之調配量設為70質量份,將MMA之調配量設為20質量份,且將CBA之調配量設為10質量份,除此以外,以與丙烯酸系低聚物M1相同之方式獲得固形狀之丙烯酸系低聚物M21。丙烯酸系低聚物M21之Mw為4060。丙烯酸系低聚物M21之Tg為109.3℃。 <Preparation of acrylic oligomer M21> Except that the amount of IBXMA was 70 parts by mass, the amount of MMA was 20 parts by mass, and the amount of CBA was 10 parts by mass, a solid acrylic oligomer M21 was obtained in the same manner as the acrylic oligomer M1. The Mw of the acrylic oligomer M21 was 4060. The Tg of the acrylic oligomer M21 was 109.3°C.

<丙烯酸系低聚物M22之製備> 將DCPMA之調配量設為47.5質量份,將MMA之調配量設為47.5質量份,且將HEMA之調配量設為5質量份,除此以外,以與丙烯酸系低聚物M8相同之方式獲得固形狀之丙烯酸系低聚物M22。丙烯酸系低聚物M22之Mw為5150。丙烯酸系低聚物M22之Tg為120.0℃。 <Preparation of acrylic oligomer M22> Except that the amount of DCPMA was set to 47.5 parts by mass, the amount of MMA was set to 47.5 parts by mass, and the amount of HEMA was set to 5 parts by mass, a solid acrylic oligomer M22 was obtained in the same manner as the acrylic oligomer M8. The Mw of the acrylic oligomer M22 was 5150. The Tg of the acrylic oligomer M22 was 120.0°C.

<丙烯酸系低聚物M23之製備> 將DCPMA之調配量設為70質量份,將MMA之調配量設為20質量份,且將HEMA之調配量設為10質量份,除此以外,以與丙烯酸系低聚物M8相同之方式獲得固形狀之丙烯酸系低聚物M23。丙烯酸系低聚物M23之Mw為5840。丙烯酸系低聚物M23之Tg為130.8℃。 <Preparation of acrylic oligomer M23> Except that the amount of DCPMA was set to 70 parts by mass, the amount of MMA was set to 20 parts by mass, and the amount of HEMA was set to 10 parts by mass, a solid acrylic oligomer M23 was obtained in the same manner as the acrylic oligomer M8. The Mw of the acrylic oligomer M23 was 5840. The Tg of the acrylic oligomer M23 was 130.8°C.

<丙烯酸系低聚物M24之製備> 除了使用甲基丙烯酸1-金剛烷基酯(ADMA)70質量份來代替DCPMA 70質量份以外,以與丙烯酸系低聚物M23相同之方式獲得固形狀之丙烯酸系低聚物M24。丙烯酸系低聚物M24之Mw為5150。丙烯酸系低聚物M24之Tg為160.7℃。 <Preparation of acrylic oligomer M24> Solid acrylic oligomer M24 was obtained in the same manner as acrylic oligomer M23 except that 70 parts by mass of 1-adamantyl methacrylate (ADMA) was used instead of 70 parts by mass of DCPMA. The Mw of acrylic oligomer M24 was 5150. The Tg of acrylic oligomer M24 was 160.7°C.

<丙烯酸系低聚物M25之製備> 將DCPMA之調配量設為60質量份,將MMA之調配量設為40質量份,且不使用HEMA,除此以外,以與丙烯酸系低聚物M8相同之方式獲得固形狀之丙烯酸系低聚物M25。丙烯酸系低聚物M25之Mw為4940。丙烯酸系低聚物M25之Tg為130.6℃。 <Preparation of acrylic oligomer M25> A solid acrylic oligomer M25 was obtained in the same manner as acrylic oligomer M8 except that the amount of DCPMA was 60 parts by mass, the amount of MMA was 40 parts by mass, and HEMA was not used. The Mw of acrylic oligomer M25 was 4940. The Tg of acrylic oligomer M25 was 130.6°C.

[實施例1] <黏著劑組合物之製備> 向第1預聚物組合物中加入相對於該組合物中之單體成分(形成本實施例中之下述黏著劑層中之基礎聚合物之單體成分)每100質量份為3.0質量份之丙烯酸系低聚物M1及0.07質量份之交聯劑(產品名「Viscoat#260」,1,9-壬二醇二丙烯酸酯,大阪有機化學工業製造)並加以混合,而製備第1黏著劑組合物。將本實施例中之下述黏著劑層中之基礎聚合物每100質量份之丙烯酸系低聚物之相對份數設為「份數」示於表1、2中。 [Example 1] <Preparation of adhesive composition> 3.0 parts by mass of acrylic oligomer M1 and 0.07 parts by mass of crosslinking agent (product name "Viscoat #260", 1,9-nonanediol diacrylate, manufactured by Osaka Organic Chemical Industry Co., Ltd.) were added to the first prepolymer composition for every 100 parts by mass of monomer components (monomer components forming the base polymer in the adhesive layer described below in this example) in the composition and mixed to prepare the first adhesive composition. The relative parts of the acrylic oligomer per 100 parts by mass of the base polymer in the adhesive layer described below in this example are set as "parts" and shown in Tables 1 and 2.

<黏著劑層之形成> 繼而,於單面經矽酮剝離處理之第1剝離襯墊之剝離處理面上,塗佈第1黏著劑組合物而形成塗膜。第1剝離襯墊係單面經矽酮剝離處理之聚對苯二甲酸乙二酯(PET)膜(產品名「DIAFOIL MRE#75」,厚度75 μm,Mitsubishi Chemical公司製造)。繼而,將單面經矽酮剝離處理之第2剝離襯墊之剝離處理面貼合於第1剝離襯墊上之塗膜。第2剝離襯墊係單面經矽酮剝離處理之PET膜(產品名「DIAFOIL MRF#75」,厚度75 μm,Mitsubishi Chemical公司製造)。繼而,對剝離襯墊間之塗膜照射紫外線,使該塗膜光硬化而形成黏著劑層(厚度50 μm)。於照射紫外線時,使用黑光燈作為照射光源,將照射強度設為約2.5 mW/cm 2,將照射時間設為16分鐘。以如上方式製作附剝離襯墊之實施例1之黏著片材(厚度50 μm)。 <Formation of Adhesive Layer> Next, the first adhesive composition is applied to the release-treated surface of the first release liner treated with silicone release on one side to form a coating film. The first release liner is a polyethylene terephthalate (PET) film treated with silicone release on one side (product name "DIAFOIL MRE#75", thickness 75 μm, manufactured by Mitsubishi Chemical Co., Ltd.). Next, the release-treated surface of the second release liner treated with silicone release on one side is attached to the coating film on the first release liner. The second release pad is a PET film (product name "DIAFOIL MRF#75", thickness 75 μm, manufactured by Mitsubishi Chemical Co., Ltd.) with silicone release treatment on one side. Then, the coating between the release pads is irradiated with ultraviolet light to photoharden the coating to form an adhesive layer (thickness 50 μm). When irradiating with ultraviolet light, a black light is used as the irradiation light source, the irradiation intensity is set to about 2.5 mW/cm 2 , and the irradiation time is set to 16 minutes. The adhesive sheet (thickness 50 μm) of Example 1 with a release pad is prepared in the above manner.

[實施例2~12] 於製備黏著劑組合物時,如表1、2所示改變所調配之丙烯酸系低聚物之種類及量,除此以外,以與實施例1之附剝離襯墊之黏著片材相同之方式製作實施例2~12之各附剝離襯墊之黏著片材。 [Examples 2 to 12] When preparing the adhesive composition, the type and amount of the acrylic oligomer to be prepared were changed as shown in Tables 1 and 2. In addition, the adhesive sheets with peel-off pads of Examples 2 to 12 were prepared in the same manner as the adhesive sheets with peel-off pads of Example 1.

[比較例1] 於製備黏著劑組合物時,不調配丙烯酸系低聚物,除此以外,以與實施例1之附剝離襯墊之黏著片材相同之方式製作比較例1之附剝離襯墊之黏著片材。 [Comparative Example 1] The adhesive sheet with a peel-off liner of Comparative Example 1 was prepared in the same manner as the adhesive sheet with a peel-off liner of Example 1 except that no acrylic oligomer was added when preparing the adhesive composition.

[比較例2~6] 於製備黏著劑組合物時,如表2所示改變所調配之丙烯酸系低聚物之種類及量,除此以外,以與實施例1之附剝離襯墊之黏著片材相同之方式製作比較例2~6之各附剝離襯墊之黏著片材。 [Comparative Examples 2 to 6] When preparing the adhesive composition, the type and amount of the acrylic oligomer to be formulated were changed as shown in Table 2. In addition, the adhesive sheets with peel-off pads of Comparative Examples 2 to 6 were prepared in the same manner as the adhesive sheets with peel-off pads of Example 1.

[實施例13] <黏著劑組合物之製備> 向第2預聚物組合物中加入相對於該組合物中之單體成分(形成本實施例中之下述黏著劑層中之基礎聚合物之單體成分)每100質量份為1.0質量份之丙烯酸系低聚物M18及0.07質量份之交聯劑(產品名「Viscoat#260」,1,9-壬二醇二丙烯酸酯,大阪有機化學工業製造)並加以混合,而製備第2黏著劑組合物。將本實施例中之下述黏著劑層中之基礎聚合物每100質量份之丙烯酸系低聚物之相對份數設為「份數」示於表3。 [Example 13] <Preparation of adhesive composition> 1.0 mass part of acrylic oligomer M18 and 0.07 mass part of crosslinking agent (product name "Viscoat #260", 1,9-nonanediol diacrylate, manufactured by Osaka Organic Chemical Industry Co., Ltd.) were added to the second prepolymer composition for every 100 mass parts of monomer components (monomer components forming the base polymer in the adhesive layer described below in this example) in the composition and mixed to prepare the second adhesive composition. The relative parts of the acrylic oligomer per 100 mass parts of the base polymer in the adhesive layer described below in this example are set as "parts" and are shown in Table 3.

<黏著劑層之形成> 除了使用第2黏著劑組合物來代替第1黏著劑組合物以外,以與上文關於實施例1所述之黏著劑層之形成相同之方式,於剝離襯墊間形成厚度50 μm之黏著劑層。以如上方式製作附剝離襯墊之實施例13之黏著片材(厚度50 μm)。 <Formation of adhesive layer> In addition to using the second adhesive composition instead of the first adhesive composition, an adhesive layer with a thickness of 50 μm is formed between the peeling pads in the same manner as the formation of the adhesive layer described above in Example 1. The adhesive sheet (thickness 50 μm) of Example 13 with a peeling pad is prepared in the above manner.

[比較例7] 於製備黏著劑組合物時,不調配丙烯酸系低聚物,除此以外,以與實施例13之附剝離襯墊之黏著片材相同之方式製作比較例7之附剝離襯墊之黏著片材。 [Comparative Example 7] The adhesive sheet with a peel-off liner of Comparative Example 7 was prepared in the same manner as the adhesive sheet with a peel-off liner of Example 13 except that no acrylic oligomer was added when preparing the adhesive composition.

[比較例8、9] 於製備黏著劑組合物時,如表3所示改變所調配之丙烯酸系低聚物之種類,除此以外,以與實施例13之附剝離襯墊之黏著片材相同之方式製作比較例8、9之各附剝離襯墊之黏著片材。 [Comparative Examples 8 and 9] When preparing the adhesive composition, the type of the acrylic oligomer to be formulated was changed as shown in Table 3. Except for this, the adhesive sheets with peel-off pads of Comparative Examples 8 and 9 were prepared in the same manner as the adhesive sheet with peel-off pads of Example 13.

[實施例14] <黏著劑組合物之製備> 向第3預聚物組合物中加入相對於該組合物中之單體成分(形成本實施例中之下述黏著劑層中之基礎聚合物之單體成分)每100質量份為1.0質量份之丙烯酸系低聚物M8及0.07質量份之交聯劑(產品名「Viscoat#260」,1,9-壬二醇二丙烯酸酯,大阪有機化學工業製造)並加以混合,而製備第3黏著劑組合物。將本實施例中之下述黏著劑層中之基礎聚合物每100質量份之丙烯酸系低聚物之相對份數設為「份數」示於表4。 [Example 14] <Preparation of adhesive composition> 1.0 mass part of acrylic oligomer M8 and 0.07 mass part of crosslinking agent (product name "Viscoat #260", 1,9-nonanediol diacrylate, manufactured by Osaka Organic Chemical Industry Co., Ltd.) were added to the third prepolymer composition for every 100 mass parts of monomer components (monomer components forming the base polymer in the adhesive layer described below in this example) in the composition and mixed to prepare the third adhesive composition. The relative parts of the acrylic oligomer per 100 mass parts of the base polymer in the adhesive layer described below in this example are set as "parts" and shown in Table 4.

<黏著劑層之形成> 除了使用第3黏著劑組合物來代替第1黏著劑組合物以外,以與上文關於實施例1所述之黏著劑層之形成相同之方式,於剝離襯墊間形成厚度50 μm之黏著劑層。以如上方式製作附剝離襯墊之實施例14之黏著片材(厚度50 μm)。 <Formation of adhesive layer> In addition to using the third adhesive composition instead of the first adhesive composition, an adhesive layer with a thickness of 50 μm is formed between the peeling pads in the same manner as the formation of the adhesive layer described above in Example 1. The adhesive sheet (thickness 50 μm) of Example 14 with a peeling pad is prepared in the above manner.

[實施例15] 於製備黏著劑組合物時,如表4所示改變所調配之丙烯酸系低聚物之種類,除此以外,以與實施例15之附剝離襯墊之黏著片材相同之方式製作實施例15之附剝離襯墊之黏著片材。 [Example 15] When preparing the adhesive composition, the type of the acrylic oligomer to be formulated was changed as shown in Table 4. Except for this, the adhesive sheet with a peel-off liner of Example 15 was prepared in the same manner as the adhesive sheet with a peel-off liner of Example 15.

[比較例10] 於製備黏著劑組合物時,不調配丙烯酸系低聚物,除此以外,以與實施例14之附剝離襯墊之黏著片材相同之方式製作比較例10之附剝離襯墊之黏著片材。 [Comparative Example 10] The adhesive sheet with a peel-off liner of Comparative Example 10 was prepared in the same manner as the adhesive sheet with a peel-off liner of Example 14 except that no acrylic oligomer was added when preparing the adhesive composition.

[比較例11、12] 於製備黏著劑組合物時,如表4所示改變所調配之丙烯酸系低聚物之種類,除此以外,以與實施例14之附剝離襯墊之黏著片材相同之方式製作比較例11、12之各附剝離襯墊之黏著片材。 [Comparative Examples 11 and 12] When preparing the adhesive composition, the type of acrylic oligomer to be formulated was changed as shown in Table 4. Except for this, the adhesive sheets with peel-off pads of Comparative Examples 11 and 12 were prepared in the same manner as the adhesive sheets with peel-off pads of Example 14.

[實施例16] <黏著劑組合物之製備> 向第1預聚物組合物中加入相對於該組合物中之單體成分(形成本實施例中之下述黏著劑層中之基礎聚合物之單體成分)每100質量份為1.5質量份之丙烯酸系低聚物M22、0.11質量份之二季戊四醇六丙烯酸酯(DPHA)、0.02質量份之追加之光聚合起始劑(產品名「Omnirad 819」,雙(2,4,6-三甲基苯甲醯基)苯基氧化膦,IGM Resins公司製造)、0.02質量份之矽烷偶合劑(產品名「KBM-403」,3-甘油氧丙基三甲氧基矽烷,信越化學工業公司製造)0.5質量份並加以混合,而製備第4黏著劑組合物。將本實施例中之下述黏著劑層中之基礎聚合物每100質量份之丙烯酸系低聚物之相對份數設為「份數」示於表5。 [Example 16] <Preparation of adhesive composition> To the first prepolymer composition, 1.5 parts by weight of acrylic oligomer M22, 0.11 parts by weight of dipentaerythritol hexaacrylate (DPHA), 0.02 parts by weight of additional photopolymerization initiator (product name "Omnirad 819", bis(2,4,6-trimethylbenzyl)phenylphosphine oxide, IGM were added per 100 parts by weight of the monomer components in the composition (monomer components forming the base polymer in the adhesive layer described below in this example). Resins Co., Ltd.), 0.02 mass parts of silane coupling agent (product name "KBM-403", 3-glyceryloxypropyltrimethoxysilane, manufactured by Shin-Etsu Chemical Co., Ltd.) and 0.5 mass parts are mixed to prepare the fourth adhesive composition. The relative proportion of the acrylic oligomer per 100 mass parts of the base polymer in the following adhesive layer in this embodiment is set as "parts" and shown in Table 5.

<黏著劑層之形成> 除了使用第4黏著劑組合物來代替第1黏著劑組合物以外,以與上文關於實施例1所述之黏著劑層之形成相同之方式,於剝離襯墊間形成厚度50 μm之黏著劑層。以如上方式製作附剝離襯墊之實施例16之黏著片材(厚度50 μm)。 <Formation of adhesive layer> In addition to using the fourth adhesive composition instead of the first adhesive composition, an adhesive layer with a thickness of 50 μm is formed between the peeling pads in the same manner as the formation of the adhesive layer described above in Example 1. The adhesive sheet (thickness 50 μm) of Example 16 with a peeling pad is prepared in the above manner.

[實施例17~19] 於製備黏著劑組合物時,如表5所示改變所調配之丙烯酸系低聚物之種類,除此以外,以與實施例16之附剝離襯墊之黏著片材相同之方式製作實施例17~19之各附剝離襯墊之黏著片材。再者,於實施例19中,調配兩種丙烯酸系低聚物(向第1預聚物組合物中加入相對於該組合物中之單體成分每100質量份為0.5質量份之丙烯酸系低聚物M25及1.0質量份之丙烯酸系低聚物M22)。 [Examples 17 to 19] When preparing the adhesive composition, the type of acrylic oligomer to be prepared was changed as shown in Table 5. Except for this, each peel-off liner-attached adhesive sheet of Examples 17 to 19 was prepared in the same manner as the peel-off liner-attached adhesive sheet of Example 16. Furthermore, in Example 19, two types of acrylic oligomers were prepared (0.5 parts by mass of acrylic oligomer M25 and 1.0 parts by mass of acrylic oligomer M22 were added to the first prepolymer composition per 100 parts by mass of the monomer component in the composition).

<重量平均分子量之第1測定方法> 於下述第1測定條件下,藉由凝膠滲透層析法(GPC)測定不含有含氮單體之上述丙烯酸聚合物及丙烯酸系低聚物之各重量平均分子量(Mw),並以聚苯乙烯換算值求出。測定時,使用GPC測定裝置(產品名「HLC-8120GPC」,東曹製造)。試樣溶液係以如下方式準備。首先,以不含有含氮單體之上述丙烯酸聚合物或丙烯酸系低聚物作為試樣,製備試樣濃度0.20質量%之四氫呋喃(THF)溶液(含有10 mM之磷酸)後,將該THF溶液放置20小時。繼而,利用平均孔徑0.45 μm之膜濾器對該THF溶液進行過濾,獲得作為分子量測定用試樣溶液之濾液。 <First measurement method of weight average molecular weight> Under the following first measurement conditions, the weight average molecular weight (Mw) of each of the acrylic polymers and acrylic oligomers not containing nitrogen-containing monomers is measured by gel permeation chromatography (GPC) and is calculated as a polystyrene conversion value. For the measurement, a GPC measurement device (product name "HLC-8120GPC", manufactured by Tosoh) is used. The sample solution is prepared as follows. First, the above-mentioned acrylic polymer or acrylic oligomer not containing nitrogen-containing monomers is used as a sample, and a tetrahydrofuran (THF) solution (containing 10 mM phosphoric acid) with a sample concentration of 0.20 mass% is prepared, and the THF solution is left to stand for 20 hours. Then, the THF solution was filtered using a membrane filter with an average pore size of 0.45 μm to obtain the filtrate as the sample solution for molecular weight determination.

[GPC之第1測定條件] 管柱:G7000H XL+GMH XL+GMH XL,各TSKgel(東曹製造) 管柱溫度:40℃ 溶離液:THF溶液(磷酸濃度10 mM) 流速:0.8 mL/分鐘 試樣注入量:100 μL 標準試樣:聚苯乙烯(Agilent製造) 檢測器:示差折射儀(RI) [GPC 1st measurement condition] Column: G7000H XL + GMH XL + GMH XL , each TSKgel (Tosoh) Column temperature: 40°C Eluent: THF solution (phosphoric acid concentration 10 mM) Flow rate: 0.8 mL/min Sample injection volume: 100 μL Standard sample: Polystyrene (Agilent) Detector: Differential refractometer (RI)

<重量平均分子量之第2測定方法> 於下述第2測定條件下,藉由凝膠滲透層析法(GPC)測定含有含氮單體之上述丙烯酸聚合物及丙烯酸系低聚物之各重量平均分子量(Mw),並以聚苯乙烯換算值求出。測定時,使用GPC測定裝置(產品名「HLC-8120GPC」,東曹製造)。試樣溶液係以如下方式準備。首先,以含有含氮單體之上述丙烯酸聚合物或丙烯酸系低聚物作為試樣,製備試樣濃度0.20質量%之二甲基甲醯胺(DMF)溶液(添加鹽)後,將該DMF溶液放置20小時。繼而,利用平均孔徑0.45 μm之膜濾器對該DMF溶液進行過濾而獲得濾液,將該濾液作為分子量測定用試樣溶液。 <Second measurement method of weight average molecular weight> Under the following second measurement conditions, the weight average molecular weight (Mw) of each of the acrylic polymers and acrylic oligomers containing nitrogen-containing monomers is measured by gel permeation chromatography (GPC) and is calculated as a polystyrene conversion value. For the measurement, a GPC measurement device (product name "HLC-8120GPC", manufactured by Tosoh) is used. The sample solution is prepared as follows. First, the above-mentioned acrylic polymer or acrylic oligomer containing nitrogen-containing monomer is used as a sample, and a dimethylformamide (DMF) solution (salt added) with a sample concentration of 0.20 mass% is prepared, and the DMF solution is allowed to stand for 20 hours. Next, the DMF solution was filtered using a membrane filter with an average pore size of 0.45 μm to obtain a filtrate, which was used as a sample solution for molecular weight determination.

[GPC之第2測定條件] 管柱:SuperAWM-H+SuperAW4000+SuperAW2500,各TSKgel(東曹製造) 管柱溫度:40℃ 溶離液:DMF溶液(添加鹽) 流速:0.4 mL/分鐘 試樣注入量:40 μL 標準試樣:聚苯乙烯(Agilent製造) 檢測器:示差折射儀(RI) [GPC second measurement condition] Column: SuperAWM-H + SuperAW4000 + SuperAW2500, each TSKgel (Tosoh) Column temperature: 40°C Solvent: DMF solution (with added salt) Flow rate: 0.4 mL/min Sample injection volume: 40 μL Standard sample: Polystyrene (Agilent) Detector: Differential refractometer (RI)

<低聚物之Tg> 基於上述Fox公式求出丙烯酸系低聚物M1~M25之玻璃轉移溫度(Tg)。將其值示於表1~5中。 <Tg of oligomer> Based on the above-mentioned Fox formula, the glass transition temperature (Tg) of acrylic oligomers M1 to M25 was calculated. The values are shown in Tables 1 to 5.

<HSP之氫鍵項> 求出丙烯酸系低聚物M1~M25各者之漢森溶解度參數(HSP)之氫鍵項。具體而言,如下所述。 <Hydrogen bonding term of HSP> The hydrogen bonding term of the Hansen solubility parameter (HSP) of each of the acrylic oligomers M1 to M25 was determined. Specifically, it is as follows.

首先,藉由電腦軟體HSPiP(Hansen Solubility Parameters in Practice)計算形成丙烯酸系低聚物之各單體m i之HSP之氫鍵項(δh i)。繼而,根據丙烯酸系低聚物中之單體m i之莫耳分率x i及該單體m i之氫鍵項δh i,藉由下述式求出丙烯酸系低聚物之氫鍵項(δH)。例如,根據IBXMA(分子量220.0)之莫耳分率0.289及氫鍵項2.4 MPa 1/2、MMA(分子量100.1)之莫耳分率0.636及氫鍵項6.6 MPa 1/2、CBA(分子量188.2)之莫耳分率0.075及氫鍵項6.5 MPa 1/2,藉由下述式求出之丙烯酸系低聚物M1之氫鍵項為5.39 MPa 1/2。將丙烯酸系低聚物M1~M25之氫鍵項作為δH 2示於表1~5中。 First, the hydrogen bonding term ( δhi ) of each monomer mi forming the acrylic oligomer is calculated by the computer software HSPiP (Hansen Solubility Parameters in Practice). Then, the hydrogen bonding term (δH) of the acrylic oligomer is calculated by the following formula based on the molar fraction xi of the monomer mi in the acrylic oligomer and the hydrogen bonding term δhi of the monomer mi . For example, the hydrogen bonding term of acrylic oligomer M1 is 5.39 MPa 1/2 as calculated from the molar fraction of 0.289 and hydrogen bonding term of 2.4 MPa 1/2 of IBXMA (molecular weight 220.0), the molar fraction of 0.636 and hydrogen bonding term of 6.6 MPa 1/2 of MMA (molecular weight 100.1), and the molar fraction of 0.075 and hydrogen bonding term of 6.5 MPa 1/2 of CBA (molecular weight 188.2). The hydrogen bonding term of acrylic oligomers M1 to M25 is shown as δH 2 in Tables 1 to 5.

δH=Σ x i×δh i δH= Σxi × δhi

同樣地,求出上述丙烯酸聚合物之HSP之氫鍵項(δH 1)。例如,於包含第1預聚物組合物之丙烯酸聚合物中,其值為5.07 MPa 1/2。亦將黏著片材中之丙烯酸系低聚物之δH 2相對於丙烯酸聚合物之δH 1之比率(δH 2/δH 1)、及δH 2與δH 1之差ΔH(=δH 2-δH 1)示於表1~5中。 Similarly, the hydrogen bonding term (δH 1 ) of the HSP of the acrylic polymer was determined. For example, in the acrylic polymer comprising the first prepolymer composition, the value was 5.07 MPa 1/2 . The ratio of δH 2 of the acrylic oligomer to δH 1 of the acrylic polymer in the adhesive sheet (δH 2 /δH 1 ) and the difference ΔH between δH 2 and δH 1 (=δH 2 -δH 1 ) are also shown in Tables 1 to 5.

<凝膠分率> 對於實施例1~19及比較例1~12之各黏著片材,以如下方式測定凝膠分率。 <Gel fraction> For each adhesive sheet of Examples 1 to 19 and Comparative Examples 1 to 12, the gel fraction was measured as follows.

首先,自剝離襯墊間之黏著片材採取約500 mg之黏著劑樣品。繼而,測定黏著劑樣品之質量(W 1)。繼而,將黏著劑樣品浸漬於容器內之乙酸乙酯40 g中7天。繼而,將不溶解於乙酸乙酯之成分(不溶解部分)全部回收。繼而,將不溶解部分於130℃下乾燥2小時(去除乙酸乙酯)。繼而,測定不溶解部分之質量(W 2)。然後,基於下述式,算出光硬化後之黏著片材之凝膠分率(質量%)。將其值示於表1~5中。 First, take about 500 mg of adhesive sample from the adhesive sheet between the peeling pads. Then, measure the mass of the adhesive sample (W 1 ). Then, immerse the adhesive sample in 40 g of ethyl acetate in a container for 7 days. Then, recover all the components that are insoluble in ethyl acetate (insoluble part). Then, dry the insoluble part at 130°C for 2 hours (to remove ethyl acetate). Then, measure the mass of the insoluble part (W 2 ). Then, calculate the gel fraction (mass %) of the adhesive sheet after light curing based on the following formula. The values are shown in Tables 1 to 5.

凝膠分率(質量%)=(W 2/W 1)×100 Gel fraction (mass %) = (W 2 /W 1 ) × 100

<霧度> 以如下方式測定實施例1~19及比較例1~12之各黏著片材之霧度。 <Fog> The fog of each adhesive sheet of Examples 1 to 19 and Comparative Examples 1 to 12 was measured as follows.

首先,製作測定用樣品。具體而言,將第1剝離襯墊自黏著片材剝離後,將該片材貼合於鹼玻璃(厚度1.0 mm、全光線透過率92%、霧度0.4%、松浪硝子公司製造)。繼而,自玻璃上之黏著片材將第1剝離襯墊剝離。藉此,製作測定用樣品。繼而,使用霧度計(產品名「HM-150」,村上色彩技術研究所製造),測定樣品中之各黏著片材之霧度。測定係依據JIS K7136(2000年)。於本測定中,將樣品以自其鹼玻璃側照射光之方式設置於裝置內。將所測得之黏著片材之霧度示於表1~5中。First, prepare a sample for measurement. Specifically, after peeling the first peelable liner from the adhesive sheet, adhere the sheet to alkaline glass (thickness 1.0 mm, total light transmittance 92%, haze 0.4%, manufactured by Matsunami Glass Co., Ltd.). Next, peel the first peelable liner from the adhesive sheet on the glass. In this way, a sample for measurement is prepared. Next, use a haze meter (product name "HM-150", manufactured by Murakami Color Technology Laboratory) to measure the haze of each adhesive sheet in the sample. The measurement is based on JIS K7136 (2000). In this measurement, the sample is placed in the device in a manner such that light is irradiated from its alkaline glass side. The measured haze values of the adhesive sheets are shown in Tables 1-5.

<剪切儲存模數> 對實施例1~19及比較例1~12之各黏著片材測定動態黏彈性(第1測定)。 <Shear storage modulus> Dynamic viscoelasticity was measured for each adhesive sheet of Examples 1 to 19 and Comparative Examples 1 to 12 (first measurement).

對各個黏著片材均製作所需數量之測定用樣品。具體而言,首先,將自黏著片材切出之複數個黏著片材段進行貼合,而製作厚度約為1.0 mm之樣品片材。繼而,對該片材進行衝壓,獲得作為測定用樣品之圓柱狀顆粒(直徑7.9 mm)。The required number of samples for measurement were prepared for each adhesive sheet. Specifically, first, a plurality of adhesive sheet sections cut from the adhesive sheet were bonded together to prepare a sample sheet with a thickness of about 1.0 mm. Then, the sheet was punched to obtain cylindrical particles (diameter 7.9 mm) as the sample for measurement.

然後,使用動態黏彈性測定裝置(產品名「Advanced Rheometric Expansion System (ARES)」,Rheometric Scientific公司製造),將測定用樣品固定於直徑7.9 mm之平行板之治具後,進行動態黏彈性測定。於本測定中,將測定模式設為剪切模式,將測定溫度範圍設為-65℃~200℃,將升溫速度設為5℃/分鐘,將頻率設為1 Hz。自測定結果讀取特定溫度(-20℃、-10℃、60℃)下之剪切儲存模數。將-10℃下之剪切儲存模數G1(kPa)、60℃下之剪切儲存模數G2(kPa)、-20℃下之剪切儲存模數G3(kPa)、剪切儲存模數G2相對於剪切儲存模數G1之比率(G2/G1)示於表1~5中。Then, using a dynamic viscoelasticity measuring device (product name "Advanced Rheometric Expansion System (ARES)", manufactured by Rheometric Scientific), the sample for measurement was fixed to a parallel plate jig with a diameter of 7.9 mm, and then the dynamic viscoelasticity measurement was performed. In this measurement, the measurement mode was set to shear mode, the measurement temperature range was set to -65℃ to 200℃, the heating rate was set to 5℃/min, and the frequency was set to 1 Hz. The shear storage modulus at specific temperatures (-20℃, -10℃, 60℃) was read from the measurement results. The shear storage modulus G1 (kPa) at -10°C, the shear storage modulus G2 (kPa) at 60°C, the shear storage modulus G3 (kPa) at -20°C, and the ratio of the shear storage modulus G2 to the shear storage modulus G1 (G2/G1) are shown in Tables 1 to 5.

<剝離試驗> 對於實施例1~19及比較例1~12之各黏著片材,藉由剝離試驗調查對被黏著體之黏著力。 <Peeling test> For each adhesive sheet of Examples 1 to 19 and Comparative Examples 1 to 12, the adhesive force to the adherend was investigated by a peeling test.

具體而言,首先,對各個黏著片材均製作所需數量之測定用試樣。於製作測定用試樣之過程中,首先,將第1剝離襯墊自黏著片材剝離,將藉此露出之露出面貼合於表面經電漿處理之聚對苯二甲酸乙二酯(PET)膜(產品名「Lumirror S10」,厚度25 μm,東麗製造),獲得積層體。於電漿處理中,使用電漿照射裝置(產品名「AP-TO5」,積水工業公司製造),將電壓設為160 V,將頻率設為10 kHz,將處理速度設為5000 mm/分鐘(下述電漿處理中亦同樣如此)。繼而,自積層體(PET膜/黏著片材/第2剝離襯墊)切出試片(寬20 mm×長100 mm)。繼而,將第2剝離襯墊自該試片中之黏著片材剝離,將藉此露出之露出面貼合於玻璃基板(松波硝子公司製造之丙烯酸玻璃)。繼而,於溫度50℃、壓力0.5 MPa及15分鐘之條件下對附黏著片材(試片)之玻璃基板進行加溫加壓處理。藉此,使試片壓接於玻璃基板。以如上方式製作測定用試樣。Specifically, first, the required number of test samples were prepared for each adhesive sheet. In the process of preparing the test samples, first, the first peeling pad was peeled off from the adhesive sheet, and the exposed surface was bonded to a polyethylene terephthalate (PET) film (product name "Lumirror S10", thickness 25 μm, manufactured by Toray) whose surface was plasma-treated to obtain a laminate. In the plasma treatment, a plasma irradiation device (product name "AP-TO5", manufactured by Sekisui Industries) was used, and the voltage was set to 160 V, the frequency was set to 10 kHz, and the treatment speed was set to 5000 mm/min (the same applies to the plasma treatment described below). Next, a test piece (20 mm wide x 100 mm long) is cut out from the laminate (PET film/adhesive sheet/second peeling pad). Next, the second peeling pad is peeled off from the adhesive sheet in the test piece, and the exposed surface is bonded to a glass substrate (acrylic glass manufactured by Matsunami Glass Co., Ltd.). Next, the glass substrate with the adhesive sheet (test piece) attached is heated and pressurized at a temperature of 50°C and a pressure of 0.5 MPa for 15 minutes. In this way, the test piece is pressed against the glass substrate. The test sample is prepared in the above manner.

繼而,將測定用試樣於室溫下靜置30分鐘後,實施將試片自測定用試樣中之玻璃基板剝離之180°剝離試驗,測定剝離所需之力(剝離強度)(第1剝離試驗)。於本測定中,使用拉伸試驗機(產品名「Autograph AG-50NX plus)」,島津製作所製造)。於本測定中,將測定溫度設為25℃,將相對濕度設為55%,將自玻璃基板將試片剝離之角度設為180°,將試片之拉伸速度設為300 mm/分鐘,將剝離長度設為50 mm。將所測得之剝離強度之平均值作為黏著力F1(N/20 mm)示於表1~5中。Next, after the test sample was left at room temperature for 30 minutes, a 180° peeling test was performed to peel the test piece from the glass substrate in the test sample, and the force required for peeling (peeling strength) was measured (first peeling test). In this test, a tensile testing machine (product name "Autograph AG-50NX plus" manufactured by Shimadzu Corporation) was used. In this test, the measuring temperature was set to 25°C, the relative humidity was set to 55%, the angle of peeling the test piece from the glass substrate was set to 180°, the tensile speed of the test piece was set to 300 mm/min, and the peeling length was set to 50 mm. The average value of the measured peel strength is shown in Tables 1 to 5 as adhesion force F1 (N/20 mm).

另一方面,除了將拉伸速度變為60 mm/分鐘以外,於與第1剝離試驗相同之條件下實施剝離試驗(第2剝離試驗)。將其測定結果作為黏著力F2(N/20 mm)示於表1~5中。又,亦將上述黏著力F2相對於黏著力F1之比率(F2/F1)示於表1~5中。On the other hand, a peeling test (second peeling test) was performed under the same conditions as the first peeling test except that the tensile speed was changed to 60 mm/min. The measurement results are shown in Tables 1 to 5 as adhesion F2 (N/20 mm). In addition, the ratio of the above-mentioned adhesion F2 to the adhesion F1 (F2/F1) is also shown in Tables 1 to 5.

[評估] 比較例1之黏著片材係-10℃下之剪切儲存模數G1為100 kPa以下之軟質之黏著片材,但不含Tg為40℃以上之低聚物,黏著力F1、F2較小。 [Evaluation] The adhesive sheet of Comparative Example 1 is a soft adhesive sheet with a shear storage modulus G1 of less than 100 kPa at -10°C, but does not contain oligomers with a Tg of more than 40°C, and the adhesion forces F1 and F2 are relatively small.

比較例2之黏著片材包含Tg為40℃以上之低聚物(丙烯酸系低聚物M13),但差ΔH(=δH 2-δH 1)未達0.1,黏著力F1、F2較小。比較例2之黏著片材中,丙烯酸系低聚物M13未偏集存在於黏著面及其附近。 The adhesive sheet of Comparative Example 2 contains an oligomer (acrylic oligomer M13) having a Tg of 40°C or higher, but the difference ΔH (=δH 2 -δH 1 ) is less than 0.1, and the adhesive forces F1 and F2 are small. In the adhesive sheet of Comparative Example 2, the acrylic oligomer M13 is not segregated on the adhesive surface and its vicinity.

比較例3之黏著片材不含Tg為40℃以上之低聚物,黏著力F1、F2較小。The adhesive sheet of Comparative Example 3 does not contain an oligomer having a Tg of 40° C. or higher, and the adhesive forces F1 and F2 are relatively small.

比較例4之黏著片材包含Tg為40℃以上之低聚物(丙烯酸系低聚物M15),但差ΔH(=δH 2-δH 1)未達0.1,黏著力F1、F2較小。比較例4之黏著片材中,丙烯酸系低聚物M15未偏集存在於黏著面及其附近。 The adhesive sheet of Comparative Example 4 contains an oligomer (acrylic oligomer M15) having a Tg of 40°C or higher, but the difference ΔH (=δH 2 -δH 1 ) is less than 0.1, and the adhesive forces F1 and F2 are small. In the adhesive sheet of Comparative Example 4, the acrylic oligomer M15 is not segregated on the adhesive surface and its vicinity.

比較例5之黏著片材包含Tg為40℃以上之低聚物(丙烯酸系低聚物M16),但差ΔH(=δH 2-δH 1)超過1.3,霧度過大。比較例5之黏著片材中,丙烯酸系低聚物M16與基礎聚合物之相容性較低,會形成晶疇而產生光散射。 The adhesive sheet of Comparative Example 5 contains an oligomer (acrylic oligomer M16) with a Tg of 40°C or higher, but the difference ΔH (=δH 2 -δH 1 ) exceeds 1.3, and the haze is too large. In the adhesive sheet of Comparative Example 5, the compatibility of acrylic oligomer M16 with the base polymer is low, and crystal nuclei are formed to generate light scattering.

比較例6之黏著片材包含Tg為40℃以上之低聚物(丙烯酸系低聚物M17),但差ΔH(=δH 2-δH 1)未達0.1,黏著力F1、F2較小。比較例6之黏著片材中,丙烯酸系低聚物M17未充分偏集存在於黏著面及其附近。 The adhesive sheet of Comparative Example 6 contains an oligomer (acrylic oligomer M17) having a Tg of 40°C or higher, but the difference ΔH (=δH 2 -δH 1 ) is less than 0.1, and the adhesive forces F1 and F2 are small. In the adhesive sheet of Comparative Example 6, the acrylic oligomer M17 is not sufficiently segregated on the adhesive surface and its vicinity.

與此相對,實施例1~12之各黏著片材於-10℃下之剪切儲存模數G1為100 kPa以下,較為柔軟,且包含Tg為40℃以上之低聚物,並且基礎聚合物之HSP之δH 1與低聚物之HSP之δH 2滿足0.1≦δH 2-δH 1≦1.3。此種實施例1~12之黏著片材之黏著力F1為8.0 N/20 mm以上,較大。實施例1~12之各黏著片材中,Tg為40℃以上之低聚物充分地偏集存在於黏著面及其附近。 In contrast, the shear storage modulus G1 of each adhesive sheet of Examples 1 to 12 at -10°C is less than 100 kPa, which is relatively soft, and contains oligomers with a Tg of 40°C or more, and the δH 1 of the HSP of the base polymer and the δH 2 of the HSP of the oligomer satisfy 0.1≦δH 2 -δH 1 ≦1.3. The adhesive force F1 of such adhesive sheets of Examples 1 to 12 is greater than 8.0 N/20 mm. In each adhesive sheet of Examples 1 to 12, the oligomers with a Tg of 40°C or more are sufficiently segregated on the adhesive surface and its vicinity.

比較例7之黏著片材係-10℃下之剪切儲存模數G1為100 kPa以下之軟質之黏著片材,但不含Tg為40℃以上之低聚物,黏著力F1、F2較小。比較例8之黏著片材包含Tg為40℃以上之低聚物(丙烯酸系低聚物M19),但差ΔH(=δH 2-δH 1)超過1.3,霧度過大,又,黏著力F1、F2以較小。比較例9之黏著片材包含Tg為40℃以上之低聚物(丙烯酸系低聚物M20),但差ΔH(=δH 2-δH 1)未達0.1,黏著力F1、F2較小。比較例9之黏著片材中,丙烯酸系低聚物M20未偏集存在於黏著面及其附近。相對於比較例7~9之黏著片材,實施例13之黏著片材於-10℃下之剪切儲存模數G1為100 kPa以下,較為柔軟,且包含Tg為40℃以上之低聚物,基礎聚合物之HSP之δH 1與低聚物之HSP之δH 2滿足0.1≦δH 2-δH 1≦1.3。此種實施例13之黏著片材之黏著力F1為7.7 N/20 mm,大於比較例7~9之黏著片材(基礎聚合物與實施例13相同)之黏著力F1。實施例13之各黏著片材中,Tg為40℃以上之低聚物充分地偏集存在於黏著面及其附近。實施例13之黏著片材於-10℃下之剪切儲存模數G1為40 kPa以下,非常柔軟,兼具柔軟性及黏著力。 The adhesive sheet of Comparative Example 7 is a soft adhesive sheet with a shear storage modulus G1 of 100 kPa or less at -10°C, but does not contain an oligomer with a Tg of 40°C or more, and the adhesive forces F1 and F2 are small. The adhesive sheet of Comparative Example 8 contains an oligomer with a Tg of 40°C or more (acrylic oligomer M19), but the difference ΔH (= δH 2 - δH 1 ) exceeds 1.3, the haze is too large, and the adhesive forces F1 and F2 are small. The adhesive sheet of Comparative Example 9 contains an oligomer with a Tg of 40°C or more (acrylic oligomer M20), but the difference ΔH (= δH 2 - δH 1 ) is less than 0.1, and the adhesive forces F1 and F2 are small. In the adhesive sheet of Comparative Example 9, the acrylic oligomer M20 is not concentrated on the adhesive surface and its vicinity. Compared with the adhesive sheets of Comparative Examples 7 to 9, the adhesive sheet of Example 13 has a shear storage modulus G1 of 100 kPa or less at -10°C, is softer, and contains an oligomer with a Tg of 40°C or more, and the δH 1 of the HSP of the base polymer and the δH 2 of the HSP of the oligomer satisfy 0.1≦δH 2 -δH 1 ≦1.3. The adhesive force F1 of the adhesive sheet of Example 13 is 7.7 N/20 mm, which is greater than the adhesive force F1 of the adhesive sheets of Comparative Examples 7 to 9 (the base polymer is the same as that of Example 13). In each adhesive sheet of Example 13, the oligomers with a Tg of 40°C or higher are sufficiently segregated on the adhesive surface and its vicinity. The shear storage modulus G1 of the adhesive sheet of Example 13 at -10°C is 40 kPa or less, and is very soft, having both softness and adhesiveness.

比較例10之黏著片材係-10℃下之剪切儲存模數G1為100 kPa以下之軟質之黏著片材,但不含Tg為40℃以上之低聚物,黏著力F1、F2較小。比較例11之黏著片材包含Tg為40℃以上之低聚物(丙烯酸系低聚物M19),但差ΔH(=δH 2-δH 1)超過1.3,黏著力F1、F2較小。比較例12之黏著片材包含Tg為40℃以上之低聚物(丙烯酸系低聚物M21),但差ΔH(=δH 2-δH 1)未達0.1,黏著力F1、F2較小。比較例12之黏著片材中,丙烯酸系低聚物M21未偏集存在於黏著面及其附近。相對於比較例10~12之黏著片材,實施例14、15之黏著片材於-10℃下之剪切儲存模數G1為100 kPa以下,較為柔軟,且包含Tg為40℃以上之低聚物,基礎聚合物之HSP之δH 1與低聚物之HSP之δH 2滿足0.1≦δH 2-δH 1≦1.3。此種實施例14、15之黏著片材之黏著力F1為7.6 N/20 mm以上,大於比較例10~12之黏著片材(基礎聚合物與實施例14、15相同)之黏著力F1。實施例14、15之各黏著片材中,Tg為40℃以上之低聚物充分地偏集存在於黏著面及其附近。 The adhesive sheet of Comparative Example 10 is a soft adhesive sheet with a shear storage modulus G1 of 100 kPa or less at -10°C, but does not contain an oligomer with a Tg of 40°C or more, and the adhesive forces F1 and F2 are small. The adhesive sheet of Comparative Example 11 contains an oligomer with a Tg of 40°C or more (acrylic oligomer M19), but the difference ΔH (=δH 2 -δH 1 ) exceeds 1.3, and the adhesive forces F1 and F2 are small. The adhesive sheet of Comparative Example 12 contains an oligomer with a Tg of 40°C or more (acrylic oligomer M21), but the difference ΔH (=δH 2 -δH 1 ) is less than 0.1, and the adhesive forces F1 and F2 are small. In the adhesive sheet of Comparative Example 12, the acrylic oligomer M21 is not concentrated on the adhesive surface and its vicinity. Compared with the adhesive sheets of Comparative Examples 10 to 12, the adhesive sheets of Examples 14 and 15 have a shear storage modulus G1 of 100 kPa or less at -10°C, are softer, and contain oligomers with a Tg of 40°C or more, and the δH 1 of the HSP of the base polymer and the δH 2 of the HSP of the oligomer satisfy 0.1≦δH 2 -δH 1 ≦1.3. The adhesive force F1 of such adhesive sheets of Examples 14 and 15 is 7.6 N/20 mm or more, which is greater than the adhesive force F1 of the adhesive sheets of Comparative Examples 10 to 12 (the base polymer is the same as that of Examples 14 and 15). In each of the adhesive sheets of Examples 14 and 15, oligomers having a Tg of 40° C. or higher are sufficiently segregated on the adhesive surface and its vicinity.

又,實施例16~19之各黏著片材於-10℃下之剪切儲存模數G1為100 kPa以下,較為柔軟,且包含Tg為40℃以上之低聚物,基礎聚合物之HSP之δH 1與低聚物之HSP之δH 2滿足0.1≦δH 2-δH 1≦1.3。此種實施例16~19之黏著片材之黏著力F1為7.9 N/20 mm以上,較大。實施例16~19之各黏著片材中,Tg為40℃以上之低聚物充分地偏集存在於黏著面及其附近。再者,實施例19之黏著片材包含兩種低聚物,各低聚物之Tg為40℃以上,且基礎聚合物之HSP之δH 1與各低聚物之HSP之δH 2滿足0.1≦δH 2-δH 1≦1.3。 In addition, the shear storage modulus G1 of each adhesive sheet of Examples 16 to 19 at -10°C is less than 100 kPa, which is relatively soft, and contains oligomers with a Tg of 40°C or more, and the δH 1 of the HSP of the base polymer and the δH 2 of the HSP of the oligomer satisfy 0.1≦δH 2 -δH 1 ≦1.3. The adhesive force F1 of such adhesive sheets of Examples 16 to 19 is greater than 7.9 N/20 mm. In each adhesive sheet of Examples 16 to 19, the oligomers with a Tg of 40°C or more are sufficiently segregated on the adhesive surface and its vicinity. Furthermore, the adhesive sheet of Example 19 includes two oligomers, each oligomer has a Tg of 40° C. or higher, and δH 1 of the HSP of the base polymer and δH 2 of the HSP of each oligomer satisfy 0.1≦δH 2 -δH 1 ≦1.3.

[表1] 表1 丙烯酸系低聚物 ∆H 凝膠分率(質量%) 霧度 (%) 剪切儲存模數(kPa) 黏著力(N/20 mm) 種類 份數 Mw Tg (℃) δH 2 G3 G1 G2 F1 F2 實施例1 M1:IBXMA/MMA/CBA (45/45/10) 3 4880 98.5 5.39 1.06 0.32 76.1 0.20 110 70 22 0.32 11.2 8.5 0.76 實施例2 M2:IBXMA/MMA/CBA (35/35/30) 3 5400 50.9 5.58 1.10 0.51 78.5 0.22 97 63 22 0.35 8.0 6.5 0.81 實施例3 M3:DCPMA/MMA/CBA (45/45/10) 3 5230 97.7 5.64 1.11 0.57 74.0 0.26 119 73 23 0.31 11.3 8.5 0.76 實施例4 M4:IBXMA/MMA/ACMO (40/40/20) 3 4940 129.2 5.39 1.06 0.32 77.8 0.20 125 78 27 0.32 10.4 7.9 0.76 實施例5 M5:DCPMA/MMA/ACMO (40/40/20) 3 5110 128.3 5.61 1.11 0.54 78.5 0.73 123 76 27 0.35 11.3 8.7 0.77 實施例6 M6:IBXMA/MMA/AA (45/45/10) 3 5670 121.9 5.86 1.16 0.79 76.7 0.31 144 85 26 0.36 11.8 9.1 0.77 實施例7 M7:DCPMA/MMA/HEMA (45/45/10) 1 5600 115.8 6.19 1.22 1.12 82.3 0.24 110 72 26 0.33 8.6 6.9 0.80 實施例8 M8:DCPMA/MMA/HEMA (60/30/10) 1 5570 123.9 5.80 1.14 0.73 80.0 0.24 104 69 25 0.30 8.5 7.4 0.87 實施例9 M9:CHMA/MMA/HEMA (45/45/10) 1 5920 85.4 6.33 1.25 1.26 82.1 0.28 123 82 31 0.36 8.6 6.9 0.80 [Table 1] Table 1 Acrylic oligomer ∆H Gel fraction (mass %) Fog(%) Shear storage modulus (kPa) Adhesion force (N/20 mm) Type Number of copies M Tg (℃) δH 2 G3 G1 G2 F1 F2 Embodiment 1 M1: IBXMA/MMA/CBA (45/45/10) 3 4880 98.5 5.39 1.06 0.32 76.1 0.20 110 70 twenty two 0.32 11.2 8.5 0.76 Embodiment 2 M2: IBXMA/MMA/CBA (35/35/30) 3 5400 50.9 5.58 1.10 0.51 78.5 0.22 97 63 twenty two 0.35 8.0 6.5 0.81 Embodiment 3 M3: DCPMA/MMA/CBA (45/45/10) 3 5230 97.7 5.64 1.11 0.57 74.0 0.26 119 73 twenty three 0.31 11.3 8.5 0.76 Embodiment 4 M4: IBXMA/MMA/ACMO (40/40/20) 3 4940 129.2 5.39 1.06 0.32 77.8 0.20 125 78 27 0.32 10.4 7.9 0.76 Embodiment 5 M5: DCPMA/MMA/ACMO (40/40/20) 3 5110 128.3 5.61 1.11 0.54 78.5 0.73 123 76 27 0.35 11.3 8.7 0.77 Embodiment 6 M6: IBXMA/MMA/AA (45/45/10) 3 5670 121.9 5.86 1.16 0.79 76.7 0.31 144 85 26 0.36 11.8 9.1 0.77 Embodiment 7 M7: DCPMA/MMA/HEMA (45/45/10) 1 5600 115.8 6.19 1.22 1.12 82.3 0.24 110 72 26 0.33 8.6 6.9 0.80 Embodiment 8 M8: DCPMA/MMA/HEMA (60/30/10) 1 5570 123.9 5.80 1.14 0.73 80.0 0.24 104 69 25 0.30 8.5 7.4 0.87 Embodiment 9 M9: CHMA/MMA/HEMA (45/45/10) 1 5920 85.4 6.33 1.25 1.26 82.1 0.28 123 82 31 0.36 8.6 6.9 0.80

[表2] 表2 丙烯酸系低聚物 ∆H 凝膠分率(質量%) 霧度 (%) 剪切儲存模數(kPa) 黏著力 (N/20 mm) 種類 份數 Mw Tg (℃) δH 2 G3 G1 G2 F1 F2 實施例10 M10:CHMA/MMA/4HBA (45/45/10) 1 5740 72.2 6.22 1.23 1.15 83.8 0.28 110 72 28 0.36 8.4 6.4 0.76 實施例11 M11:CHMA/MMA/HPMA (45/45/10) 1 5840 82.4 6.25 1.23 1.18 76.4 0.27 126 83 30 0.38 8.7 6.8 0.78 實施例12 M12:IBXMA/MMA/4HBA (45/45/10) 1 5320 99.2 5.82 1.15 0.75 80.9 0.28 98 64 23 0.39 8.2 7.5 0.91 比較例1 - - - - - - - 83.5 0.20 102 69 27 0.40 3.7 2.8 0.76 比較例2 M13:IBXMA/NVP (50/50) 3 10200 193 5.00 0.99 -0.07 87.1 2.2 223 112 37 0.36 5.2 3.4 0.65 比較例3 M14:NPA/MMA (50/50) 3 5220 20.6 6.02 1.19 0.95 77.0 0.30 122 80 27 0.36 5.2 3.9 0.75 比較例4 M15:IBXMA/CBA (90/10) 3 4230 123.4 2.88 0.57 -2.19 78.4 0.23 95 61 22 0.34 4.8 3.7 0.77 比較例5 M16:DCPMA/MMA/4HBA (40/40/20) 3 5350 76.8 6.58 1.30 1.51 78.6 6.36 119 80 27 0.24 9.3 8.8 0.95 比較例6 M17:IBXMA/MMA/LMA (45/45/10) 3 5780 125.5 5.16 1.02 0.09 76.7 0.23 130 79 25 0.36 7.5 6.6 0.87 [Table 2] Table 2 Acrylic oligomers ∆H Gel fraction (mass %) Fog(%) Shear storage modulus (kPa) Adhesion force (N/20 mm) Type Number of copies M Tg (℃) δH 2 G3 G1 G2 F1 F2 Embodiment 10 M10: CHMA/MMA/4HBA (45/45/10) 1 5740 72.2 6.22 1.23 1.15 83.8 0.28 110 72 28 0.36 8.4 6.4 0.76 Embodiment 11 M11: CHMA/MMA/HPMA (45/45/10) 1 5840 82.4 6.25 1.23 1.18 76.4 0.27 126 83 30 0.38 8.7 6.8 0.78 Embodiment 12 M12: IBXMA/MMA/4HBA (45/45/10) 1 5320 99.2 5.82 1.15 0.75 80.9 0.28 98 64 twenty three 0.39 8.2 7.5 0.91 Comparison Example 1 - - - - - - - 83.5 0.20 102 69 27 0.40 3.7 2.8 0.76 Comparison Example 2 M13: IBXMA/NVP (50/50) 3 10200 193 5.00 0.99 -0.07 87.1 2.2 223 112 37 0.36 5.2 3.4 0.65 Comparison Example 3 M14: NPA/MMA (50/50) 3 5220 20.6 6.02 1.19 0.95 77.0 0.30 122 80 27 0.36 5.2 3.9 0.75 Comparison Example 4 M15: IBXMA/CBA (90/10) 3 4230 123.4 2.88 0.57 -2.19 78.4 0.23 95 61 twenty two 0.34 4.8 3.7 0.77 Comparison Example 5 M16: DCPMA/MMA/4HBA (40/40/20) 3 5350 76.8 6.58 1.30 1.51 78.6 6.36 119 80 27 0.24 9.3 8.8 0.95 Comparative Example 6 M17: IBXMA/MMA/LMA (45/45/10) 3 5780 125.5 5.16 1.02 0.09 76.7 0.23 130 79 25 0.36 7.5 6.6 0.87

[表3] 表3 丙烯酸系低聚物 ∆H 凝膠分率(質量%) 霧度 (%) 剪切儲存模數(kPa) 黏著力(N/20 mm) 種類 份數 Mw Tg (℃) δH 2 G3 G1 G2 F1 F2 實施例13 M18:IBXMA/MMA/HEMA (75/20/5) 1 4610 141.0 4.46 1.18 0.69 73.6 0.16 47 34 11 0.33 7.7 4.1 0.53 比較例7 - - - - - - - 79.7 0.22 52 39 16 0.41 3.0 2.1 0.70 比較例8 M19:DCPMA/MMA/4HBA (45/45/10) 1 5430 99.2 6.07 1.61 2.3 76.9 1.97 50 37 14 0.36 4.0 2.0 0.50 比較例9 M20:IBXMA/CBA (80/20) 1 3820 80.8 3.33 0.88 -0.44 74.7 0.2 48 35 12 0.33 4.0 2.1 0.53 [Table 3] Table 3 Acrylic oligomers ∆H Gel fraction (mass %) Fog(%) Shear storage modulus (kPa) Adhesion force (N/20 mm) Type Number of copies M Tg (℃) δH 2 G3 G1 G2 F1 F2 Embodiment 13 M18: IBXMA/MMA/HEMA (75/20/5) 1 4610 141.0 4.46 1.18 0.69 73.6 0.16 47 34 11 0.33 7.7 4.1 0.53 Comparative Example 7 - - - - - - - 79.7 0.22 52 39 16 0.41 3.0 2.1 0.70 Comparative Example 8 M19: DCPMA/MMA/4HBA (45/45/10) 1 5430 99.2 6.07 1.61 2.3 76.9 1.97 50 37 14 0.36 4.0 2.0 0.50 Comparative Example 9 M20: IBXMA/CBA (80/20) 1 3820 80.8 3.33 0.88 -0.44 74.7 0.2 48 35 12 0.33 4.0 2.1 0.53

[表4] 表4 丙烯酸系低聚物 ∆H 凝膠分率(質量%) 霧度 (%) 剪切儲存模數(kPa) 黏著力(N/20 mm) 種類 份數 Mw Tg (℃) δH 2 G3 G1 G2 F1 F2 實施例14 M8:DCPMA/MMA/HEMA (60/30/10) 1 5570 123.9 5.80 1.22 1.05 84.0 0.23 87 61 24 0.40 7.6 5.9 0.77 實施例15 M3:DCPMA/MMA/CBA (45/45/10) 1 5230 97.7 5.64 1.19 0.89 83.4 0.27 86 59 24 0.41 8.1 6.2 0.77 比較例10 - - - - - - - 86.4 0.29 78 55 25 0.46 5.1 4.1 0.79 比較例11 M19:DCPMA/MMA/4HBA (45/45/10) 1 5430 99.2 6.07 1.39 1.83 84.3 0.40 89 62 26 0.42 6.4 6.0 0.93 比較例12 M21:IBXMA/MMA/CBA (70/20/10) 1 4060 109.3 4.26 0.90 -0.49 84.4 0.19 88 61 24 0.40 5.0 3.9 0.77 [Table 4] Table 4 Acrylic oligomer ∆H Gel fraction (mass %) Fog(%) Shear storage modulus (kPa) Adhesion force (N/20 mm) Type Number of copies M Tg (℃) δH 2 G3 G1 G2 F1 F2 Embodiment 14 M8: DCPMA/MMA/HEMA (60/30/10) 1 5570 123.9 5.80 1.22 1.05 84.0 0.23 87 61 twenty four 0.40 7.6 5.9 0.77 Embodiment 15 M3: DCPMA/MMA/CBA (45/45/10) 1 5230 97.7 5.64 1.19 0.89 83.4 0.27 86 59 twenty four 0.41 8.1 6.2 0.77 Comparative Example 10 - - - - - - - 86.4 0.29 78 55 25 0.46 5.1 4.1 0.79 Comparative Example 11 M19: DCPMA/MMA/4HBA (45/45/10) 1 5430 99.2 6.07 1.39 1.83 84.3 0.40 89 62 26 0.42 6.4 6.0 0.93 Comparative Example 12 M21: IBXMA/MMA/CBA (70/20/10) 1 4060 109.3 4.26 0.90 -0.49 84.4 0.19 88 61 twenty four 0.40 5.0 3.9 0.77

[表5] 表5 丙烯酸系低聚物 ∆H 凝膠分率(質量%) 霧度 (%) 剪切儲存模數(kPa) 黏著力(N/20 mm) 種類 份數 Mw Tg (℃) δH 2 G3 G1 G2 F1 F2 實施例16 M22:DCPMA/MMA/HEMA (47.5/47.5/5) 1.5 5150 120.0 5.88 1.16 0.81 77.6 0.27 123 84 23 0.27 8.4 6.3 0.75 實施例17 M23:DCPMA/MMA/HEMA (70/20/10) 1.5 5840 130.8 5.52 1.08 0.40 78.8 0.30 118 80 24 0.30 7.9 5.4 0.68 實施例18 M24:ADMA/MMA/HEMA (70/20/10) 1.5 5150 160.7 5.52 1.09 0.45 79.2 0.31 120 81 24 0.30 8.3 5.4 0.65 實施例19 M25:DCPMA/MMA (60/40) 0.5 4940 130.6 5.26 1.04 0.19 81.7 0.25 107 70 24 0.34 8.4 6.1 0.73 M22:DCPMA/MMA/HEMA (47.5/47.5/5) 1.0 5150 120.0 5.88 1.16 0.81 [Table 5] Table 5 Acrylic oligomers ∆H Gel fraction (mass %) Fog(%) Shear storage modulus (kPa) Adhesion force (N/20 mm) Type Number of copies M Tg (℃) δH 2 G3 G1 G2 F1 F2 Embodiment 16 M22: DCPMA/MMA/HEMA (47.5/47.5/5) 1.5 5150 120.0 5.88 1.16 0.81 77.6 0.27 123 84 twenty three 0.27 8.4 6.3 0.75 Embodiment 17 M23: DCPMA/MMA/HEMA (70/20/10) 1.5 5840 130.8 5.52 1.08 0.40 78.8 0.30 118 80 twenty four 0.30 7.9 5.4 0.68 Embodiment 18 M24: ADMA/MMA/HEMA (70/20/10) 1.5 5150 160.7 5.52 1.09 0.45 79.2 0.31 120 81 twenty four 0.30 8.3 5.4 0.65 Embodiment 19 M25: DCPMA/MMA (60/40) 0.5 4940 130.6 5.26 1.04 0.19 81.7 0.25 107 70 twenty four 0.34 8.4 6.1 0.73 M22: DCPMA/MMA/HEMA (47.5/47.5/5) 1.0 5150 120.0 5.88 1.16 0.81

再者,上述發明雖然以本發明所例示之實施方式之方式提供,但其僅為單純之例示,並不可限定性地解釋。由該技術領域之業者所明確之本發明之變化例包含於後述之發明申請專利範圍內。 [產業上之可利用性] Furthermore, although the above invention is provided in the form of the embodiment illustrated by the present invention, it is only a simple example and cannot be interpreted in a limiting sense. Variations of the present invention identified by the industry in the field of technology are included in the scope of the invention patent application described below. [Industrial Applicability]

本發明之光學黏著片材適宜用於軟性器件(例如可摺疊顯示面板及可捲曲顯示面板等軟性顯示面板)中之光通過部位。The optical adhesive sheet of the present invention is suitable for use in the light-transmitting portion of a flexible device (such as a foldable display panel and a rollable display panel).

10:黏著片材(光學黏著片材) 11:第1面 12:第2面 21:第1構件 22:第2構件 H:厚度方向 L1:剝離襯墊 L2:剝離襯墊 10: Adhesive sheet (optical adhesive sheet) 11: 1st surface 12: 2nd surface 21: 1st component 22: 2nd component H: Thickness direction L1: Peel-off pad L2: Peel-off pad

圖1係本發明之光學黏著片材之一實施方式之剖面模式圖。 圖2係表示本發明之光學黏著片材之使用方法之一例。圖2A係表示將光學黏著片材貼合於第1被黏著體之步驟,圖2B係表示介隔光學黏著片材將第1被黏著體與第2被黏著體接合之步驟,圖2C係表示熟化步驟。 FIG1 is a cross-sectional schematic diagram of an embodiment of the optical adhesive sheet of the present invention. FIG2 shows an example of a method of using the optical adhesive sheet of the present invention. FIG2A shows a step of attaching the optical adhesive sheet to the first adherend, FIG2B shows a step of joining the first adherend to the second adherend via the optical adhesive sheet, and FIG2C shows a aging step.

10:黏著片材(光學黏著片材) 10: Adhesive sheet (optical adhesive sheet)

11:第1面 11: Page 1

12:第2面 12: Page 2

H:厚度方向 H: thickness direction

L1:剝離襯墊 L1: Peel off the liner

L2:剝離襯墊 L2: Peel off the liner

Claims (6)

一種光學黏著片材,其包含 基礎聚合物、及玻璃轉移溫度為40℃以上之低聚物,且 於-10℃下具有100 kPa以下之剪切儲存模數, 上述基礎聚合物之漢森溶解度參數之氫鍵項δH 1與上述低聚物之漢森溶解度參數之氫鍵項δH 2滿足 0.1≦δH 2-δH 1≦1.3。 An optical adhesive sheet comprises a base polymer and an oligomer having a glass transition temperature of 40°C or higher and having a shear storage modulus of 100 kPa or lower at -10°C. The hydrogen bonding term δH1 of the Hansen solubility parameter of the base polymer and the hydrogen bonding term δH2 of the Hansen solubility parameter of the oligomer satisfy 0.1≦ δH2 - δH1 ≦1.3. 如請求項1之光學黏著片材,其具有1%以下之霧度。The optical adhesive sheet of claim 1 has a haze of less than 1%. 如請求項1之光學黏著片材,其於以25℃、剝離角度180°及拉伸速度300 mm/分鐘之條件進行之剝離試驗中之黏著力為7.6 N/20 mm以上。The optical adhesive sheet of claim 1 has an adhesive force of 7.6 N/20 mm or more in a peeling test conducted at 25° C., a peeling angle of 180°, and a tensile speed of 300 mm/min. 如請求項1之光學黏著片材,其於以25℃、剝離角度180°及拉伸速度300 mm/分鐘之條件進行之剝離試驗中具有黏著力F1, 於以25℃、剝離角度180°及拉伸速度60 mm/分鐘之條件進行之剝離試驗中具有黏著力F2,且 黏著力F2相對於黏著力F1之比率為0.5以上1.1以下。 The optical adhesive sheet of claim 1 has an adhesive force F1 in a peeling test conducted at 25°C, a peeling angle of 180°, and a tensile speed of 300 mm/min, and has an adhesive force F2 in a peeling test conducted at 25°C, a peeling angle of 180°, and a tensile speed of 60 mm/min, and the ratio of the adhesive force F2 to the adhesive force F1 is 0.5 or more and 1.1 or less. 如請求項1之光學黏著片材,其於60℃下之剪切儲存模數相對於於-10℃下之剪切儲存模數之比率為0.2以上1.0以下。In the optical adhesive sheet of claim 1, a ratio of a shear storage modulus at 60°C to a shear storage modulus at -10°C is greater than 0.2 and less than 1.0. 如請求項1至5中任一項之光學黏著片材,其具有60質量%以上87質量%以下之凝膠分率。The optical adhesive sheet according to any one of claims 1 to 5 has a gel fraction of 60 mass % to 87 mass %.
TW113110768A 2023-03-23 2024-03-22 Optical adhesive sheet TW202444854A (en)

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JP7166762B2 (en) * 2018-01-30 2022-11-08 日東電工株式会社 PSA SHEET, MANUFACTURING METHOD THEREOF, AND IMAGE DISPLAY DEVICE
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