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TW202444732A - Ruthenium complexes and process for producing ruthenium film - Google Patents

Ruthenium complexes and process for producing ruthenium film Download PDF

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TW202444732A
TW202444732A TW113111397A TW113111397A TW202444732A TW 202444732 A TW202444732 A TW 202444732A TW 113111397 A TW113111397 A TW 113111397A TW 113111397 A TW113111397 A TW 113111397A TW 202444732 A TW202444732 A TW 202444732A
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ruthenium
complex
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dmopd
dmpd
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庫爾特舍夫 羅曼
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英商強生麥特公司
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    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07FACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F15/00Compounds containing elements of Groups 8, 9, 10 or 18 of the Periodic Table
    • C07F15/0006Compounds containing elements of Groups 8, 9, 10 or 18 of the Periodic Table compounds of the platinum group
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    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/06Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material
    • C23C16/18Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material from metallo-organic compounds

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Abstract

The invention relates to ruthenium complexes of Formula (I) or (II), a process for producing a ruthenium film by a chemical deposition method using the complexes, and a method for preparing the complexes from a ([eta]<SP>5</SP>-2,4-dimethylpentadienyl)(CH3CN)3 ruthenium (II) salt.

Description

釕錯合物及製備釕膜之方法Ruthenium complex and method for preparing ruthenium film

本發明係關於用於製備釕膜之釕錯合物。The present invention relates to ruthenium complexes for preparing ruthenium films.

在下文中,(η 5-2,4-二甲基戊二烯基)縮寫為DMPD,(η 5-2,4-二甲基-1-氧雜-戊二烯基)縮寫為DMOPD且(η 5-3,5-二甲基-1-氧雜-戊二烯基)縮寫為3,5-DMOPD。 Hereinafter, (η 5 -2,4-dimethylpentadienyl) is abbreviated as DMPD, (η 5 -2,4-dimethyl-1-oxa-pentadienyl) is abbreviated as DMOPD and (η 5 -3,5-dimethyl-1-oxa-pentadienyl) is abbreviated as 3,5-DMOPD.

文章「Low-Temperature Preparation of Metallic Ruthenium Films by MOVCD Using Bis(2,4-dimethylpentadienyl) ruthenium」 Electrochemical and Solid-State Letters, 10 (6) D60-D62 (2007)描述藉由MOCVD使用釕錯合物Ru(DMPD) 2使結晶釕膜沉積至熱氧化之Si基板上。據報導該錯合物具有以下特性:熔點為89℃;在82℃下蒸氣壓為0.1托(Torr);分解溫度(DSC)為210℃。 The article "Low-Temperature Preparation of Metallic Ruthenium Films by MOVCD Using Bis(2,4-dimethylpentadienyl) ruthenium" Electrochemical and Solid-State Letters, 10 (6) D60-D62 (2007) describes the deposition of crystalline ruthenium films onto thermally oxidized Si substrates by MOCVD using the ruthenium complex Ru(DMPD) 2. The complex is reported to have the following properties: melting point 89°C; vapor pressure 0.1 Torr at 82°C; decomposition temperature (DSC) 210°C.

亦已知類似錯合物Ru(DMOPD) 2。文章「Bis[η 5-(2,4-dimethyl-1-oxapentadienyl)] ruthenium(II): the First Homoleptic Open Ruthenocenes with Non-hydrocarbon Ligands」 J. Chem. Soc., Chem. Commun., 1991, 1427-1429描述在純乙醇中自RuCl 3·aq及4-甲基丁-3-烯-2-酮製備此錯合物,其中使用鋅粉作為還原劑進行還原。反應產生約1:1比率之異構體混合物。錯合物Ru(DMOPD) 2似乎先前尚未用作製備釕膜之前驅體。 A similar complex Ru(DMOPD) 2 is also known. The article "Bis[η 5 -(2,4-dimethyl-1-oxapentadienyl)] ruthenium(II): the First Homoleptic Open Ruthenocenes with Non-hydrocarbon Ligands" J. Chem. Soc., Chem. Commun. , 1991, 1427-1429 describes the preparation of this complex from RuCl 3 ·aq and 4-methylbut-3-en-2-one in pure ethanol, wherein the reduction is carried out using zinc powder as reducing agent. The reaction produces a mixture of isomers in a ratio of about 1:1. The complex Ru(DMOPD) 2 does not seem to have been used previously as a precursor for the preparation of ruthenium films.

亦已知含有單一DMOPD配位體之混合釕錯合物。Mixed ruthenium complexes containing a single DMOPD ligand are also known.

文章「Half-Open Ruthenocenes Derived from [Ru(C 5Me 5)Cl] 4: Syntheses, Characterizations, and Solid-State Structures」 Organometallics1992, 11, 1686-1692描述錯合物Ru(C 5Me 5)(DMOPD)。藉由在K 2CO 3/THF中[Ru(C 5Me 5)Cl] 4與異亞丙基酮之間的反應製備此錯合物,作為異構體混合物之部分。未研究此等錯合物用於製備釕膜。 The article "Half-Open Ruthenocenes Derived from [Ru(C 5 Me 5 )Cl] 4 : Syntheses, Characterizations, and Solid-State Structures" Organometallics 1992, 11 , 1686-1692 describes the complex Ru(C 5 Me 5 )(DMOPD). This complex was prepared by the reaction between [Ru(C 5 Me 5 )Cl] 4 and isopropylidene ketone in K 2 CO 3 /THF as part of an isomeric mixture. These complexes were not investigated for the preparation of ruthenium films.

US8884044B2描述式Ru(DMPD)(P)之錯合物,其中P為對掌性二磷供體配位體。描述此等錯合物用於催化氫化,但尚未研究其用於製備釕膜。US8884044B2 describes complexes of the formula Ru(DMPD)(P), where P is a chiral diphosphorus donor ligand. These complexes are described for catalytic hydrogenation, but their use for the preparation of ruthenium films has not been investigated.

US9349601B2描述具有多種通用結構之釕錯合物,包括含有經取代或未經取代之Cp配位體及DMOPD型配位體之式(1a)家族。實例包括製備錯合物Ru(C 5H 5)(DMOPD) [實例7]、Ru(C 5H 4Me)(DMOPD) [實例8]、Ru(C 5H 4Et)(DMOPD) [實例9、12、13]、Ru(C 5Me 5)(DMOPD) [實例11]。 US9349601B2 describes ruthenium complexes having a variety of general structures, including the family of formula (1a) containing substituted or unsubstituted Cp ligands and DMOPD-type ligands. Examples include the preparation of the complexes Ru( C5H5 ) ( DMOPD) [Example 7], Ru( C5H4Me )(DMOPD) [Example 8], Ru( C5H4Et )(DMOPD) [Examples 9, 12 , 13 ], Ru( C5Me5 )(DMOPD) [Example 11].

雖然已知Ru(DMPD) 2及Ru(DMOPD) 2兩者,但先前僅探索前者用於製備釕膜。缺乏關於使用Ru(DMOPD) 2製備膜之任何討論可指示此錯合物不合適,可能因為其熱穩定性不足。 Although both Ru(DMPD) 2 and Ru(DMOPD) 2 are known, only the former has been previously explored for use in preparing ruthenium films. The lack of any discussion on the use of Ru(DMOPD) 2 to prepare membranes may indicate that this complex is not suitable, perhaps because of its insufficient thermal stability.

理想地,用於製備釕膜之釕錯合物應符合以下標準中之一些或全部。首先,錯合物應具有高蒸汽壓。其次,錯合物應足夠穩定以汽化且輸送至基板上,而反應性足以與反應物氣體反應以在基板上製備釕膜。第三,錯合物之製造應為簡單的。Ideally, a ruthenium complex used to make ruthenium films should meet some or all of the following criteria. First, the complex should have a high vapor pressure. Second, the complex should be stable enough to be vaporized and transported to a substrate, and reactive enough to react with reactant gases to make a ruthenium film on the substrate. Third, the complex should be simple to manufacture.

本發明提供滿足上述要求之錯合物。The present invention provides a complex that meets the above requirements.

在第一態樣中,本發明係關於式(I)之錯合物: (式I) 其中R 2及R 4各自獨立地選自C 1至C 6烴基; 條件為組合之基團R 2及R 4內之碳原子總數為2-7。 In a first aspect, the present invention relates to complexes of formula (I): (Formula I) wherein R 2 and R 4 are each independently selected from C 1 to C 6 alkyl groups; provided that the total number of carbon atoms in the combined groups R 2 and R 4 is 2-7.

為避免疑問,作為實例,若R 2= R 4= Et,則組合之基團R 2及R 4內之碳原子總數為4。 For the avoidance of doubt, as an example, if R2 = R4 = Et, then the total number of carbon atoms in the combined groups R2 and R4 is 4.

在第二態樣中,本發明係關於式(II)之錯合物: (式II) 其中R 3及R 5各自獨立地選自C 1至C 6烴基; 條件為組合之基團R 3及R 5內之碳原子總數為2-7。 In a second aspect, the present invention relates to a complex of formula (II): (Formula II) wherein R 3 and R 5 are each independently selected from C 1 to C 6 alkyl groups; provided that the total number of carbon atoms in the combined groups R 3 and R 5 is 2-7.

預期含有DMPD配位體及本文所描述之第二種不相同之配位體的式(I)或(II)之混合錯合物具有介於Ru(DMPD) 2與Ru(DMOPD) 2之間的穩定性,且因此,適合製備膜。 Mixed complexes of formula (I) or (II) containing a DMPD ligand and a second, different ligand described herein are expected to have stabilities intermediate between Ru(DMPD) 2 and Ru(DMOPD) 2 and, therefore, are suitable for the preparation of membranes.

熟習此項技術者應瞭解,構形異構體在式(I)或(II)之錯合物中或許有可能,尤其在相關錯合物Ru(DMOPD) 2中給出已知構形異構體(參見 J. Chem. Soc., Chem. Commun.,1991, 1427-1429)。為避免疑問,式(I)及(II)並不意欲指示特定構象異構體,且應在其最廣泛意義上理解。 Those skilled in the art will appreciate that conformational isomers may be possible in the complexes of formula (I) or (II), especially given known conformational isomers in the related complex Ru(DMOPD) 2 (see J. Chem. Soc., Chem. Commun., 1991, 1427-1429). For the avoidance of doubt, formulas (I) and (II) are not intended to indicate specific conformational isomers and should be understood in their broadest sense.

取代基R 2及R 4(在式(I)之情況下)或基團R 3及R 5(在式(II)之情況下)各自獨立地選自C 1至C 6烴基。本文中「烴基」意謂僅含有碳原子及氫原子之基團。各基團可為飽和或不飽和的,較佳為飽和的。較佳基團為Me、Et、n-Pr、i-Pr、n-Bu、i-Bu、sec-Bu、t-Bu、正戊基、環戊基、正己基。 The substituents R2 and R4 (in the case of formula (I)) or the groups R3 and R5 (in the case of formula (II)) are each independently selected from C1 to C6 alkyl groups. "Alkyl" herein means a group containing only carbon atoms and hydrogen atoms. Each group may be saturated or unsaturated, preferably saturated. Preferred groups are Me, Et, n-Pr, i-Pr, n-Bu, i-Bu, sec-Bu, t-Bu, n-pentyl, cyclopentyl, n-hexyl.

應瞭解,基團R 2及R 4(式(I))內或基團R 3及R 5(式(II))內碳原子數愈大,錯合物揮發性愈小且錯合物揮發所需之溫度愈高。較佳地,揮發溫度低,以便將錯合物過早分解之風險降至最低。因此較佳地,組合之基團R 2及R 4內或組合之基團R 3及R 5內之碳原子總數為2至6,較佳為2至5,較佳為2至4,較佳為2至3,最佳為2。 It will be appreciated that the greater the number of carbon atoms in the groups R2 and R4 (formula (I)) or in the groups R3 and R5 (formula (II)), the less volatile the complex is and the higher the temperature required for the complex to volatilize. Preferably, the volatility temperature is low in order to minimize the risk of premature decomposition of the complex. Thus, preferably, the total number of carbon atoms in the combined groups R2 and R4 or in the combined groups R3 and R5 is 2 to 6, preferably 2 to 5, preferably 2 to 4, preferably 2 to 3, and most preferably 2.

尤其較佳之式(I)之錯合物為(η 5-2,4-二甲基戊二烯基)(η 5-2,4-二甲基-1-氧雜-戊二烯基)釕(II) 「Ru(DMPD)(DMOPD)」,亦即其中R 2= R 4= Me。 A particularly preferred complex of formula (I) is (η 5 -2,4-dimethylpentadienyl)(η 5 -2,4-dimethyl-1-oxo-pentadienyl)ruthenium(II) "Ru(DMPD)(DMOPD)", ie wherein R 2 = R 4 = Me.

尤其較佳之式(II)之錯合物為(η 5-2,4-二甲基戊二烯基)(η 5-3,4-二甲基-1-氧雜-戊二烯基)釕(II) 「Ru(DMPD)(3,5-DMOPD)」,亦即其中R 3= R 5= Me。 A particularly preferred complex of formula (II) is (η 5 -2,4-dimethylpentadienyl)(η 5 -3,4-dimethyl-1-oxo-pentadienyl)ruthenium(II) "Ru(DMPD)(3,5-DMOPD)", ie wherein R 3 = R 5 = Me.

在第三態樣中,本發明係關於一種藉由化學沉積法製備釕膜之方法,其中釕前驅體具有式(I)或(II)。較佳方法包括化學氣相沉積(CVD)及原子層沉積(ALD)。In a third aspect, the present invention relates to a method for preparing a ruthenium film by chemical deposition, wherein the ruthenium precursor has formula (I) or (II). Preferred methods include chemical vapor deposition (CVD) and atomic layer deposition (ALD).

在第四態樣中,本發明係關於一種用於製備根據式(I)或(II)之錯合物之方法,其包含使(η 5-2,4-二甲基戊二烯基)(CH 3CN) 3釕(II)鹽在式(I)情況下與式R 2C(=O)CH=CR 4CH 3之α,β-不飽和羰基化合物一起反應,或在式(II)情況下與式CH(=O)CR 3=CHCH 2R 5之α,β-不飽和羰基化合物一起反應的步驟。 In a fourth aspect, the present invention relates to a method for preparing a complex according to formula (I) or (II), comprising the step of reacting (η 5 -2,4-dimethylpentadienyl)(CH 3 CN) 3 ruthenium(II) salt with an α,β-unsaturated carbonyl compound of formula R 2 C(=O)CH=CR 4 CH 3 in the case of formula (I), or with an α,β-unsaturated carbonyl compound of formula CH(=O)CR 3 =CHCH 2 R 5 in the case of formula (II).

在一個較佳實施例中,α,β-不飽和羰基化合物為異亞丙基酮。In a preferred embodiment, the α,β-unsaturated carbonyl compound is isopropylidene ketone.

在一個較佳實施例中,α,β-不飽和羰基化合物為2-甲基-2-戊烯醛。In a preferred embodiment, the α,β-unsaturated carbonyl compound is 2-methyl-2-pentenal.

適合(η 5-2,4-二甲基戊二烯基)(CH 3CN) 3釕(II)鹽包括過氯酸鹽、四氟硼酸鹽、六氟磷酸鹽、三氟甲磺酸鹽、雙(三氟甲磺醯基)亞胺鹽(bistriflimide)等。一種較佳鹽為(η 5-2,4-二甲基戊二烯基)(CH 3CN) 3釕(II)四氟硼酸鹽。 Suitable (η 5 -2,4-dimethylpentadienyl)(CH 3 CN) 3 ruthenium(II) salts include perchlorate, tetrafluoroborate, hexafluorophosphate, trifluoromethanesulfonate, bis(trifluoromethanesulfonyl)imide salt (bistriflimide), etc. A preferred salt is (η 5 -2,4-dimethylpentadienyl)(CH 3 CN) 3 ruthenium(II) tetrafluoroborate.

任何適合之溶劑可用於反應。較佳溶劑為THF,較佳在-78℃下之THF。Any suitable solvent can be used for the reaction. A preferred solvent is THF, preferably THF at -78°C.

根據本發明之第四態樣及第五態樣之反應較佳在鹼存在下進行。鹼較佳含有胺官能基。較佳鹼為三乙胺。The reaction according to the fourth and fifth aspects of the present invention is preferably carried out in the presence of a base. The base preferably contains an amine functional group. A preferred base is triethylamine.

實例藉由[Ru(DMPD)(CH 3CN) 3][BF 4]與異亞丙基酮之間的反應來製備Ru(DMPD)(DMOPD)。[Ru(DMPD)(CH 3CN) 3][BF 4]又遵循改編自US884044B2之程序製備。 Examples Ru(DMPD)(DMOPD) was prepared by the reaction between [Ru(DMPD)(CH 3 CN) 3 ][BF 4 ] and isopropylidene ketone. [Ru(DMPD)(CH 3 CN) 3 ][BF 4 ] was also prepared following a procedure adapted from US884044B2.

[Ru(DMPD)(CH 3CN) 3][BF 4] 之製備在氬氣手套箱中,向100 ml施蘭克燒瓶(Schlenk flask)中裝入0.681 g Ru(DMPD) 2(2.34 mmol),隨後裝入31 mL無水乙醚且攪拌。在10分鐘內,逐滴添加0.32 mL HBF 4-Et 2O (2.33 mmol),引起淺黃色固體沉澱。使用附接至200 mL接受施蘭克燒瓶之無空氣過濾漏斗過濾混合物。短暫對固體進行抽吸以移除乙醚,自過濾漏斗刮下且稱量:0.813 g。將固體置放回100 mL施蘭克燒瓶中且溶解於23 mL無水乙腈中。短暫攪拌溶液,且將燒瓶自手套箱中移出以藉由透過冷阱對攪拌溶液抽吸來移除揮發物。使用溫水浴。當壓力達到0.27毫巴時,分離含有橙色固體之燒瓶且使其返回至手套箱中。 Preparation of [Ru(DMPD)(CH 3 CN) 3 ][BF 4 ] In an argon glove box, a 100 ml Schlenk flask was charged with 0.681 g Ru(DMPD) 2 (2.34 mmol) followed by 31 mL anhydrous ether and stirred. Over 10 minutes, 0.32 mL HBF 4 -Et 2 O (2.33 mmol) was added dropwise, causing a light yellow solid to precipitate. The mixture was filtered using an airless filter funnel attached to a 200 mL receiving Schlenk flask. The solid was briefly pumped to remove the ether, scraped from the filter funnel and weighed: 0.813 g. The solid was placed back in the 100 mL Schlenk flask and dissolved in 23 mL anhydrous acetonitrile. The solution was stirred briefly, and the flask was removed from the glove box to remove volatiles by pumping the stirred solution through a cold trap. A warm water bath was used. When the pressure reached 0.27 mbar, the flask containing the orange solid was separated and returned to the glove box.

[Ru(DMPD)(DMOPD)] 之製備次日,將無水THF (13 mL)添加至剩餘橙色固體。將燒瓶自手套箱中移出且置放於-78℃浴液中。在攪拌下,添加異亞丙基酮(由3Å MS蒸餾;0.60 mL;5.2 mmol),接著添加三乙胺(由3Å MS蒸餾;0.45 mL,3.27 mmol)。在10分鐘後,將燒瓶自冷浴中移出且置於加熱塊中,經1小時加熱至40℃。此區塊溫度維持3小時。在冷卻至環境溫度後,藉由透過冷阱對攪拌溶液進行抽吸來移除揮發物。使用溫水浴。當壓力達到0.18毫巴時,將燒瓶分離且帶入手套箱中。次日,將殘餘物用20 mL無水己烷提取,接著使用附接至200 mL接受施蘭克燒瓶之無空氣過濾漏斗過濾。將燒瓶自手套箱中移出以藉由透過冷阱對攪拌溶液進行抽吸來移除揮發物。使用溫水浴。當壓力達到0.14毫巴時,將燒瓶分離且帶入手套箱中。粗產物藉由在45℃/0.1毫巴下真空昇華來純化。指形冷凍器經水冷卻。在昇華結束時,在指形冷凍器上觀察到黃色晶體。將昇華裝置燒瓶分離且帶入手套箱中,其中自指形冷凍器刮下大部分黃色固體至預稱量小瓶中。質量:0.0654 g。產率:10%。 Preparation of [Ru(DMPD)(DMOPD)] The next day, anhydrous THF (13 mL) was added to the remaining orange solid. The flask was removed from the glove box and placed in a -78 °C bath. Under stirring, isopropylidene ketone (distilled from 3Å MS; 0.60 mL; 5.2 mmol) was added, followed by triethylamine (distilled from 3Å MS; 0.45 mL, 3.27 mmol). After 10 minutes, the flask was removed from the cold bath and placed in a heating block and heated to 40 °C over 1 hour. This block temperature was maintained for 3 hours. After cooling to ambient temperature, volatiles were removed by pumping the stirred solution through a cold trap. A warm water bath was used. When the pressure reaches 0.18 mbar, the flask is separated and brought into the glove box. The next day, the residue is extracted with 20 mL of anhydrous hexane and then filtered using an airless filter funnel attached to a 200 mL receiving Schlenk flask. The flask is removed from the glove box to remove volatiles by suctioning the stirred solution through a cold trap. A warm water bath is used. When the pressure reaches 0.14 mbar, the flask is separated and brought into the glove box. The crude product is purified by vacuum sublimation at 45°C/0.1 mbar. The cryofinger is water-cooled. At the end of sublimation, yellow crystals are observed on the cryofinger. The sublimation apparatus flask was separated and brought into the glove box where most of the yellow solid was scraped from the cryofinger into a pre-weighed vial. Mass: 0.0654 g. Yield: 10%.

錯合物Ru(DMPD)(DMOPD)為一種低熔點固體,熔點為約70℃,且在低於220℃下揮發,不分解。The complex Ru(DMPD)(DMOPD) is a low melting solid with a melting point of about 70°C and is volatile below 220°C without decomposition.

釕膜沉積Ru(DMPD)(DMOPD)及Ru(DMPD) 2兩者用作Beneq TFS-200 ALD工具中釕薄膜沉積之前驅體。在沉積之後,量測膜厚度及其電阻率。使用來自Fischer之FISCHERSCOPE TMX-RAY XDV TM-SDD來量測膜厚度。使用來自Nittoseiko Analytech之Loresta-GX藉由四點探針法量測膜電阻率。下文概述沉積條件。沉積結果展示於表1中。 Ruthenium Film Deposition Ru(DMPD)(DMOPD) and Ru(DMPD) 2 were used as drivers before ruthenium film deposition in a Beneq TFS-200 ALD tool. After deposition, the film thickness and its resistivity were measured. Film thickness was measured using a FISCHERSCOPE X-RAY XDV -SDD from Fischer. Film resistivity was measured by a four-point probe method using a Loresta-GX from Nittoseiko Analytech. Deposition conditions are summarized below. Deposition results are shown in Table 1.

沉積條件: 基板:含原生氧化物之Si 沉積溫度:220℃ 前驅體溫度:75℃ 氧氣壓力:4毫巴 沉積循環:Ru脈衝(5s);氧氣脈衝(20 s) 循環次數:300 膜厚度 (nm) 電阻率 (µΩ .cm) Ru(DMPD)(DMOPD) 22.7 21 Ru(DMPD) 2 12.2 28 表1. Deposition conditions: Substrate: Si with native oxide Deposition temperature: 220°C Precursor temperature: 75°C Oxygen pressure: 4 mbar Deposition cycle: Ru pulse (5s); Oxygen pulse (20s) Cycle number: 300 Film thickness (nm) Resistivity (µΩ . cm) Ru(DMPD)(DMOPD) 22.7 twenty one Ru(DMPD) 2 12.2 28 Table 1.

在相同次數之循環之後,Ru(DMPD)(DMOPD)製備比使用Ru(DMPD) 2製備之膜更小電阻率的更厚膜。 After the same number of cycles, Ru(DMPD)(DMOPD) produced thicker films with lower resistivity than films produced using Ru(DMPD) 2 .

使用Ru(DMPD)(DMOPD),在165至220℃之溫度範圍內沉積釕膜。膜如以上所描述進行分析。沉積結果展示於表2中。 沉積溫度 (℃) 循環次數 膜厚度 (nm) 電阻率 (µΩ .cm) 220 300 22.7 21 200 276 11.6 72 180 300 7.5 77 165 300 6.1 88 表2. Ruthenium films were deposited using Ru(DMPD)(DMOPD) in the temperature range of 165 to 220°C. The films were analyzed as described above. The deposition results are shown in Table 2. Deposition temperature (℃) Cycle times Film thickness (nm) Resistivity (µΩ . cm) 220 300 22.7 twenty one 200 276 11.6 72 180 300 7.5 77 165 300 6.1 88 Table 2.

使用Ru(DMPD)(DMOPD)及氧氣作為共反應物,可在165-220℃溫度範圍內沉積導電釕膜。Conductive ruthenium films can be deposited in the temperature range of 165-220°C using Ru(DMPD)(DMOPD) and oxygen as co-reactants.

Claims (13)

一種式(I)之錯合物, (式I) 其中R 2及R 4各自獨立地選自C 1至C 6烴基; 條件為組合之基團R 2及R 4內之碳原子總數為2至7。 A complex of formula (I), (Formula I) wherein R 2 and R 4 are each independently selected from C 1 to C 6 alkyl groups; provided that the total number of carbon atoms in the combined groups R 2 and R 4 is 2 to 7. 如請求項1之錯合物,其中組合之基團R 2及R 4內之碳原子總數為2或3。 The complex of claim 1, wherein the total number of carbon atoms in the combined groups R 2 and R 4 is 2 or 3. 如請求項1之錯合物,其中R 2= R 4= Me。 The complex of claim 1, wherein R 2 = R 4 = Me. 一種式(II)之錯合物, (式II) 其中R 3及R 5各自獨立地選自C 1至C 6烴基; 條件為組合之基團R 3及R 5內之碳原子總數為2至7。 A complex of formula (II), (Formula II) wherein R 3 and R 5 are each independently selected from C 1 to C 6 alkyl groups; provided that the total number of carbon atoms in the combined groups R 3 and R 5 is 2 to 7. 如請求項4之錯合物,其中組合之基團R 3及R 5內之碳原子總數為2或3。 The complex of claim 4, wherein the total number of carbon atoms in the combined groups R3 and R5 is 2 or 3. 如請求項4之錯合物,其中R 3= R 5= Me。 The complex of claim 4, wherein R 3 = R 5 = Me. 一種藉由化學沉積法使用釕前驅體製備釕膜之方法,其中該釕前驅體為如請求項1至6中任一項之錯合物。A method for preparing a ruthenium film by chemical deposition using a ruthenium precursor, wherein the ruthenium precursor is a complex as described in any one of claims 1 to 6. 如請求項7之方法,其中該化學沉積法為化學氣相沉積法。The method of claim 7, wherein the chemical deposition method is chemical vapor deposition. 如請求項7之方法,其中該化學沉積法為原子層沉積法。The method of claim 7, wherein the chemical deposition method is atomic layer deposition. 一種用於製備如請求項1至6中任一項之錯合物之方法,其包含使(η 5-2,4-二甲基戊二烯基)(CH 3CN) 3釕(II)鹽在式(I)情況下與式R 2C(=O)CH=CR 4CH 3之α,β-不飽和羰基化合物一起反應,或在式(II)情況下與式CH(=O)CR 3=CHCH 2R 5之α,β-不飽和羰基化合物一起反應的步驟。 A method for preparing the complex of any one of claims 1 to 6, comprising the step of reacting (η 5 -2,4-dimethylpentadienyl)(CH 3 CN) 3 ruthenium(II) salt with an α,β-unsaturated carbonyl compound of the formula R 2 C(═O)CH═CR 4 CH 3 in the case of formula (I) or with an α,β-unsaturated carbonyl compound of the formula CH(═O)CR 3 ═CHCH 2 R 5 in the case of formula (II). 如請求項10之方法,其中該(η 5-2,4-二甲基戊二烯基)(CH 3CN) 3釕(II)鹽為(η 5-2,4-二甲基戊二烯基)(CH 3CN) 3釕(II)四氟硼酸鹽。 The method of claim 10, wherein the (η 5 -2,4-dimethylpentadienyl)(CH 3 CN) 3 ruthenium(II) salt is (η 5 -2,4-dimethylpentadienyl)(CH 3 CN) 3 ruthenium(II) tetrafluoroborate. 如請求項10或請求項11之方法,其中該α,β-不飽和羰基化合物為異亞丙基酮。The method of claim 10 or claim 11, wherein the α,β-unsaturated carbonyl compound is isopropyl ketone. 如請求項10或請求項11之方法,其中該α,β-不飽和羰基化合物為2-甲基-2-戊烯醛。The method of claim 10 or claim 11, wherein the α,β-unsaturated carbonyl compound is 2-methyl-2-pentenal.
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