TW202319475A - Resin composition comprising epoxy resin, inorganic filler material and elastomer - Google Patents

Abstract

The present invention provides a resin composition, comprising (A) epoxy resin, (B) inorganic filler material and (C) elastomer, wherein the (A) epoxy resin comprises: (A-1) epoxy resin that contains epoxy group and has a structure with chelate forming ability.

Description

resin composition

The present invention relates to a resin composition, a cured product using the resin composition, a resin sheet, a circuit board, a semiconductor chip package, and a semiconductor device.

In recent years, the demand for small and high-function electronic devices such as smartphones and tablet devices has increased, and accordingly, sealing materials for semiconductor chip packages used in such small electronic devices have been required to be further enhanced in functionality. As such a sealing material, a sealing material formed by curing a resin composition is known. On the other hand, there are technologies in Patent Documents 1 and 2 as technologies for applications other than sealing materials. prior art literature patent documents

Patent Document 1: Japanese Patent Laid-Open No. 2018-80221 Patent Document 2: Japanese Patent No. 5491276

The problem to be solved by the invention

A resin composition used for a sealing material generally contains an inorganic filler for the purpose of improving insulation and sealing properties. The cured product of the resin composition containing the inorganic filler tends to be largely warped.

Assuming that the cured product contains the fiber base material like a prepreg, the rigidity of the entire cured product can be increased by the action of the fiber base material, or thermal expansion can be reduced, so it is considered that warpage can be suppressed. However, sealing materials generally do not contain a fibrous base material, so it is difficult to suppress warpage.

Then, the present inventors attempted to suppress warpage by reducing the modulus of elasticity of the cured product of the resin composition. Specifically, attempts have been made to suppress warpage by reducing the modulus of elasticity of cured products by using resin compositions containing elastomers. As a result, suppression of warping can be achieved. However, the adhesiveness between the cured product of the resin composition containing the elastomer and the conductor layer deteriorates.

Then, the present inventors further studied and attempted to improve the adhesiveness by using an adhesiveness-imparting agent in combination with an elastomer. However, if an adhesiveness-imparting agent is used, although adhesiveness improves, warpage increases. Therefore, it is difficult for existing sealing materials to simultaneously suppress warpage and improve adhesion.

The present invention is made in view of the above-mentioned problems, and an object of the present invention is to provide a resin composition capable of obtaining a cured product capable of suppressing warpage and excellent in adhesion to a conductor layer, a cured product of the resin composition, and a resin using the resin composition. Sheets, circuit substrates, semiconductor chip packages, and semiconductor devices. means of solving problems

The inventors of the present invention have earnestly studied to solve the aforementioned problems. As a result, the present inventors found that if (A) epoxy resin, (B) inorganic filler and (C) elastomer are included, and (A) epoxy resin includes (A-1) containing epoxy group and A resin composition of an epoxy resin having a structure capable of forming a chelate can solve the above-mentioned problems, and the present invention has been further completed. That is, the present invention includes the following matters.

[1] A resin composition comprising (A) epoxy resin, (B) inorganic filler and (C) elastomer, (A) epoxy resin comprising (A-1) epoxy group-containing and chelate-containing Structured epoxy resins with complex forming capabilities; [2] The composition according to [1], wherein the modified amount of the chelate compound of the component (A-1) is 0.3% by mass to 10% by mass; [3] The resin composition according to [1] or [2], wherein the ratio W(A-1) of the mass W(A-1) of the component (A-1) to the mass W(C) of the component (C) )/W(C) is 0.01～1.0; [4] The resin composition according to any one of [1] to [3], wherein the amount of the component (B) is 40% by mass or more with respect to 100% by mass of non-volatile components of the resin composition; [5] The resin composition according to any one of [1] to [4], wherein the component (C) has a number average molecular weight of 1000 or more; [6] The resin composition according to any one of [1] to [5], further comprising (D) a curing agent; [7] The resin composition according to any one of [1] to [6], further comprising (E) a hardening accelerator; [8] The resin composition according to any one of [1] to [7], which is used for the sealing layer of the composition; [9] A cured product of the resin composition according to any one of [1] to [8]; [10] A resin sheet comprising a support and a resin composition layer formed on the support and comprising the resin composition according to any one of [1] to [8]; [11] A circuit board comprising a cured product of the resin composition according to any one of [1] to [8]; [12] A semiconductor chip package comprising a cured product of the resin composition according to any one of [1] to [8]; [13] A semiconductor device comprising the circuit board described in [11] or the semiconductor chip package described in [12]. Invention effect

According to the present invention, it is possible to provide a resin composition capable of obtaining a cured product that suppresses warpage and has excellent adhesion to a conductor layer, a cured product of the resin composition, and a resin sheet, a circuit board, and a semiconductor wafer using the resin composition. packaging and semiconductor devices.

Hereinafter, embodiments and examples of the present invention will be described. However, the present invention is not limited to the embodiments and examples shown below, and can be implemented with arbitrary modifications within a range not exceeding the scope of the claims and their equivalents. [1. Outline of resin composition]

The resin composition related to one embodiment of the present invention contains (A) epoxy resin, (B) inorganic filler, and (C) elastomer in combination. And (A) epoxy resin contains (A-1) the epoxy resin which has the structure which has an epoxy group and the ability to form a chelate. In the following description, "(A-1) the epoxy resin which has the structure which has an epoxy group and the ability to form a chelate" may be referred to as "(A-1) chelate type epoxy resin". In addition, in the following description, "a structure having the ability to form a chelate" may be referred to as a "structure capable of chelating".

The resin composition related to this embodiment can obtain a cured product by thermally curing it. In addition, the obtained cured product can suppress warping and has excellent adhesiveness with the conductor layer. In addition, the cured product of the resin composition according to the present embodiment can usually achieve excellent adhesion to silicon. In addition, the resin composition related to this embodiment preferably has a lower minimum melt viscosity, and it is preferable to obtain a hardened product with a small tensile modulus.

The resin composition according to the present embodiment may further contain optional components in combination with the above-mentioned components. For example, the resin composition may contain (D) a curing agent, (E) a curing accelerator, and the like. [2. (A) Epoxy resin]

The resin composition related to this embodiment contains (A) epoxy resin as (A) component. (A) The epoxy resin is a curable resin having an epoxy group.

(A) Epoxy resin related to this embodiment contains (A-1) chelate type epoxy resin as (A-1) component. (A-1) A chelate type epoxy resin contains an epoxy group and a chelate capable structure.

A chelate capable construct means a construct having chelate forming ability. The chelate-capable structure usually contains at least one atom selected from oxygen and nitrogen. In the following description, an atom selected from oxygen and nitrogen may be referred to as a "specific atom". A chelate-capable structure usually contains multiple specific atoms. A plurality of specific atoms are generally not directly bonded, so there is a molecular chain between the specific atoms that connects the specific atoms to each other. That is, specific atoms are usually linked to each other by molecular chains. Here, oxygen atoms and nitrogen atoms are not included in the atoms contained in the aforementioned molecular chains. The number of atoms in the aforementioned molecular chain is usually 1 or more, preferably 2 or more, and preferably 6 or less. Here, the number of atoms of the aforementioned molecular chain linking specific atoms together means the minimum number of atoms present between specific atoms linked via molecular chains. Therefore, even when a branch chain branched from the molecular chain is bonded to the molecular chain, the number of atoms contained in the branch chain is not included in the number of atoms of the molecular chain. Therefore, the chelate-capable structure can be a structure containing specific atoms adjacent to each other via preferably 1 or more and 6 or less atoms, more preferably 2 or more and 6 or less atoms. In this chelate structure, a part or all of the specific atoms can function as coordinating atoms.

The chelate-capable structure preferably contains an oxygen atom as a specific atom. Still more preferably, at least one of the oxygen atoms as the specific atoms is derived from a hydroxyl group. That is, it is more preferable that the chelate-capable structure contains a hydroxyl group, and the oxygen atom contained in the hydroxyl group is a specific atom of the chelate-capable structure. Furthermore, it is more preferable that at least one of the oxygen atoms as the specific atoms is derived from a carbonyl group. That is, it is more preferable that the chelate-capable structure contains a carbonyl group, and the oxygen atom contained in the carbonyl group is a specific atom of the chelate-capable structure.

When the chelate-capable structure contains a plurality of oxygen atoms, it is preferable that oxygen atoms linked by molecular chains having two atoms are included among the oxygen atoms. That is, it is preferable that certain two oxygen atoms contained in the chelate-capable structure are adjacent to each other via two atoms. The chelate ability structure may contain a group of two adjacent oxygen atoms separated by two atoms as described above, and may also contain two or more groups of two adjacent oxygen atoms separated by two atoms as described above. group of atoms.

A carbon atom and a hydrogen atom are usually contained in a chelate structure in combination with a specific atom. In addition, the chelate-capable structure may further include any heteroatoms other than oxygen atoms and nitrogen atoms. A phosphorus atom and a sulfur atom are mentioned as a preferable arbitrary heteroatom contained in a chelate-capable structure. The type of arbitrary heteroatoms may be 1 type, or 2 or more types. In addition, the number of arbitrary heteroatoms may be one, or two or more.

Specific examples of a preferable chelating ability structure include a carboxyl group and a phosphoric acid group. Among them, a phosphoric acid group is more preferable. A chelate-capable structure may exist in any of the basic skeleton, side chain, or terminal of (A-1) chelate-type epoxy resin. (A-1) The chelate ability structure contained in a chelate type epoxy resin may be 1 type, or 2 or more types. Moreover, the number of the chelate ability structure contained in 1 molecule of (A-1) chelate type epoxy resin may be 1, or may be 2 or more.

(A-1) The number of the epoxy groups contained in 1 molecule of a chelate type epoxy resin may be 1, or 2 or more.

(A-1) It is preferable that a chelate type epoxy resin contains an aromatic structure in the molecule. The aromatic structure means a chemical structure generally defined as aromatic, and includes polycyclic aromatic and aromatic heterocyclic rings. When the (A-1) chelate type epoxy resin containing an aromatic ring structure is used, the heat resistance of the hardened|cured material of a resin composition can be improved.

(A-1) A chelate-type epoxy resin may include a structure obtained by reacting an epoxy resin not containing a chelate-capable structure and a compound having a chelate-capable structure. For example, the phosphoric acid group-containing (A-1) chelate-type epoxy resin may include a structure obtained by reacting an epoxy resin having no chelate-capable structure with phosphoric acid. Examples of phosphoric acid include phosphoric acid (H ₃ PO ₄ ), phosphonic acid (H ₃ PO ₃ ), hypophosphorous acid (H ₃ PO ₂ ), pyrophosphoric acid (H ₄ P ₂ O ₇ ), and tripolyphosphoric acid. polyphosphoric acid.

(A-1) Chelate-type epoxy resins can be produced by, for example, a method including glycidyl etherification of a hydroxyl group of a compound having a phenolic or alcoholic hydroxyl group and a chelate-capable structure. And (A-1) chelate type epoxy resin can be manufactured by the method including making the epoxy resin which does not have a chelate ability structure, and the compound containing a chelate ability structure react, for example. If specific examples are given, phosphoric acid group-containing (A-1) chelate type epoxy resins can be produced by the method described in International Publication No. 2021/039380.

In the production method of (A-1) chelate-type epoxy resin comprising reacting an epoxy resin without a chelate-capable structure with a compound containing a chelate-capable structure, the compound generally contains a chelate-capable structure React with the epoxy group of epoxy resin to obtain (A-1) chelate type epoxy resin. At this time, the reaction amount of the compound containing the chelate-capable structure is expressed as the chelate-modified amount. Specifically, the amount of chelate modification is represented by the ratio of the compound having a chelate-capable structure that reacts with the epoxy resin relative to 100% by mass of the epoxy resin not containing the chelate-capable structure. The quality of the aforementioned chelate compound is preferably more than 0.3% by mass, more preferably more than 0.5% by mass, particularly preferably more than 0.8% by mass, preferably less than 10% by mass, more preferably less than 5.0% by mass, especially preferably 3.0% by mass or less. When the modified amount of the chelate compound is within the aforementioned range, the adhesiveness of the cured product of the resin composition can be effectively improved.

As (A-1) chelate type epoxy resin, a commercial item can be used. Commercially available (A-1) chelate type epoxy resins include "EP-49-10P" and "EP-49-10P2" manufactured by ADEKA Co., Ltd. (both are bisphenol A type epoxy resins) reaction product with phosphoric acid), "EP-49-23" manufactured by ADEKA Co., Ltd.

(A-1) A chelate type epoxy resin may be used individually by 1 type, and may use it in combination of 2 or more types.

Epoxy resins include epoxy resins that are liquid at a temperature of 20°C (hereinafter also referred to as "liquid epoxy resins") and epoxy resins that are solid at a temperature of 20°C (hereinafter also referred to as "solid epoxy resins"). The (A-1) chelate type epoxy resin contained in the resin composition may be liquid epoxy resin only, solid epoxy resin only, or a combination of liquid epoxy resin and solid epoxy resin. (A-1) The chelate type epoxy resin preferably contains a liquid epoxy resin, and more preferably contains only a liquid epoxy resin.

(A-1) The epoxy equivalent of the chelate type epoxy resin is preferably 50g/eq.～5000g/eq., more preferably 60g/eq.～3000g/eq., further preferably 80g/eq. eq.～2000g/eq., particularly preferably 110g/eq.～1000g/eq. The epoxy equivalent represents the mass of the resin per 1 equivalent of epoxy groups. This epoxy equivalent can be measured in accordance with JIS K7236.

(A-1) The weight average molecular weight (Mw) of a chelate type epoxy resin becomes like this. Preferably it is 100-5000, More preferably, it is 250-3000, More preferably, it is 400-1500. Moreover, the number average molecular weight of (A-1) chelate type epoxy resin is less than 5000 normally, Preferably it is less than 3000. The weight average molecular weight and number average molecular weight of resin can be measured as the value of polystyrene conversion by the gel permeation chromatography (GPC) method.

The amount of the (A-1) chelate type epoxy resin in the resin composition is preferably 0.01 mass % or more, more preferably 0.1 mass % or more, especially 100 mass % of the non-volatile components of the resin composition. It is preferably at least 0.5% by mass, more preferably at most 20% by mass, still more preferably at most 10% by mass, particularly preferably at most 5% by mass. (A-1) When the quantity of a chelate type epoxy resin exists in the said range, it can effectively improve adhesiveness, suppressing warpage, and can effectively lower minimum melt viscosity normally.

The amount of the (A-1) chelate type epoxy resin in the resin composition is preferably at least 0.1% by mass, more preferably at least 1% by mass, particularly preferably at least 1% by mass relative to 100% by mass of the resin component of the resin composition. It is 2% by mass or more, preferably 40% by mass or less, more preferably 30% by mass or less, particularly preferably 20% by mass or less. Unless otherwise specified, the resin component of the resin composition refers to components other than the (B) inorganic filler among the non-volatile components of the resin composition. (A-1) When the quantity of a chelate type epoxy resin exists in the said range, it can effectively improve adhesiveness, suppressing warpage, and can effectively lower minimum melt viscosity normally.

The mass of (A-1) chelate type epoxy resin is preferably 1 mass % or more with respect to the total amount of (A) epoxy resin 100 mass %, more preferably 3 mass % or more, especially preferably 5 mass % or more. Mass % or more, preferably 80 mass % or less, more preferably 60 mass % or less, particularly preferably 40 mass % or less. (A-1) When the quantity of a chelate type epoxy resin exists in the said range, it can effectively improve adhesiveness, suppressing warpage, and can effectively lower minimum melt viscosity normally.

Ratio W(A-1)/W(C) of mass W(A-1) of (A-1) chelate-type epoxy resin to mass W(C) of (C) elastomer in the resin composition It is preferably within a specific range. Specifically, the aforementioned ratio W(A-1)/W(C) is preferably not less than 0.01, more preferably not less than 0.02, particularly preferably not less than 0.04, preferably not more than 1.0, and more preferably not more than 0.8, Especially preferably, it is 0.7 or less. When the ratio W(A-1)/W(C) is within the aforementioned range, the adhesiveness can be effectively improved while suppressing warpage, and generally the minimum melt viscosity can be effectively reduced.

(A) Epoxy resins may be combined with (A-1) chelate type epoxy resins, including: (A-2) epoxy resins other than (A-1) chelate type epoxy resins As (A-2) component. In the description below, "(A-2) Epoxy resins other than (A-1) chelate type epoxy resins" are also referred to as "(A-2) any epoxy resin".

Examples of any epoxy resins in (A-2) include bixylenol epoxy resins, bisphenol A epoxy resins, bisphenol F epoxy resins, and bisphenol S epoxy resins. Oxygen resin, bisphenol AF type epoxy resin, dicyclopentadiene type epoxy resin, triphenol type epoxy resin, naphthol novolac (naphthol novolac) type epoxy resin, phenol novolac (phenolnovolac) type epoxy resin , tert-butyl catechol type epoxy resin, naphthalene type epoxy resin, naphthol type epoxy resin, anthracene type epoxy resin, glycidylamine type epoxy resin, cresol novolac (cresol novolac) type epoxy Resin, phenol aralkyl type epoxy resin, biphenyl type epoxy resin, linear aliphatic epoxy resin, epoxy resin with butadiene structure, alicyclic epoxy resin, heterocyclic epoxy resin, containing Spiral ring epoxy resin, cyclohexane-type epoxy resin, cyclohexanedimethanol-type epoxy resin, naphthylene ether-type epoxy resin, trimethylol-type epoxy resin, tetraphenylethane-type ring Oxygen resin, isocyanurate type epoxy resin, phenol phthalimidine type epoxy resin, etc. (A-2) Arbitrary epoxy resins may be used alone or in combination of two or more.

(A-2) Any epoxy resin preferably includes an epoxy resin containing an aromatic structure from the viewpoint of obtaining a cured product having good heat resistance. Examples of optional epoxy resins (A-2) containing an aromatic structure include bisphenol A epoxy resins, bisphenol F epoxy resins, bisphenol S epoxy resins, and bisphenol AF epoxy resins. Oxygen resin, dicyclopentadiene type epoxy resin, triphenol type epoxy resin, naphthol novolak type epoxy resin, phenol novolak type epoxy resin, tert-butylcatechol type epoxy resin, naphthalene type ring Oxygen resin, naphthol type epoxy resin, anthracene type epoxy resin, bixylenol type epoxy resin, glycidylamine type epoxy resin with aromatic structure, cresol novolak type epoxy resin, biphenyl type Epoxy resin, linear aliphatic epoxy resin with aromatic structure, epoxy resin with butadiene structure with aromatic structure, cycloaliphatic epoxy resin with aromatic structure, heterocyclic epoxy resin, Spiral ring-containing epoxy resin with aromatic structure, cyclohexanedimethanol type epoxy resin with aromatic structure, naphthylene ether type epoxy resin, trimethylol type epoxy resin with aromatic structure , Tetraphenylethane type epoxy resin with aromatic structure, etc.

(A-2) Any epoxy resin preferably includes an epoxy resin having two or more epoxy groups in one molecule. The proportion of the epoxy resin having two or more epoxy groups in one molecule is preferably at least 50 mass %, more preferably 60 mass %, relative to 100 mass % of the non-volatile components of any epoxy resin in (A-2). % by mass or more, particularly preferably more than 70% by mass.

(A-2) Any epoxy resin may be only a liquid epoxy resin, may be only a solid epoxy resin, or may be a combination of a liquid epoxy resin and a solid epoxy resin.

The liquid epoxy resin is preferably a liquid epoxy resin having two or more epoxy groups in one molecule. Preferred liquid epoxy resins that can be used as any epoxy resin in (A-2) include, for example, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol AF type epoxy resin, Naphthalene-type epoxy resins, glycidylamine-type epoxy resins, phenol novolac-type epoxy resins, cyclohexane-type epoxy resins, cyclohexanedimethanol-type epoxy resins, and epoxy resins having a butadiene structure.

Specific examples of liquid epoxy resins that can be used as any epoxy resin in (A-2) include "HP4032", "HP4032D", and "HP4032SS" (naphthalene-type epoxy resins) manufactured by DIC Corporation. "828US", "828EL", "jER828EL", "825", "EPIKOTE828EL" (bisphenol A type epoxy resin) manufactured by Mitsubishi Chemical Corporation, "jER807" and "1750" (bisphenol A type epoxy resin) manufactured by Mitsubishi Chemical Corporation Phenol F type epoxy resin), "jER152" (phenol novolak type epoxy resin) manufactured by Mitsubishi Chemical Co., Ltd., "630", "630LSD", "604" (glycidylamine type epoxy resin) manufactured by Mitsubishi Chemical Co., Ltd. epoxy resin), "ED-523T" (Glycirol type epoxy resin) manufactured by ADEKA Co., Ltd., "EP-3950L" and "EP-3980S" (glycidylamine type epoxy resin) manufactured by ADEKA Co., Ltd., ADEKA Co., Ltd. "EP-4088S" (dicyclopentadiene type epoxy resin) manufactured by the company, "ZX-1059" (mixed bisphenol A type epoxy resin and bisphenol F type epoxy resin) manufactured by Nippon Steel Chemical Materials Co., Ltd. products), "PB-3600" manufactured by Daicel Co., Ltd., "JP-100" and "JP-200" manufactured by Nippon Soda Co., Ltd. (epoxy resin with a butadiene structure), Nippon Steel Chemical Materials Co., Ltd. "ZX1658", "ZX1658GS" (liquid 1,4-glycidylcyclohexane type epoxy resin), etc. These resins may be used alone or in combination of two or more.

The solid epoxy resin is preferably a solid epoxy resin having three or more epoxy groups in one molecule, and more preferably an aromatic solid epoxy resin having three or more epoxy groups in one molecule. Preferred solid epoxy resins that can be used as any epoxy resin in (A-2) are, for example, bixylenol-type epoxy resins, naphthalene-type epoxy resins, naphthalene-type tetrafunctional epoxy resins, naphthalene-type epoxy resins, and naphthalene-type epoxy resins. Phenol novolak type epoxy resin, cresol novolak type epoxy resin, dicyclopentadiene type epoxy resin, triphenol type epoxy resin, naphthol type epoxy resin, biphenyl type epoxy resin, naphthylene Ether type epoxy resin, anthracene type epoxy resin, bisphenol A type epoxy resin, bisphenol AF type epoxy resin, phenol aralkyl type epoxy resin, tetraphenylethane type epoxy resin, phenol benzo Pyrrolone type epoxy resin.

Specific examples of solid epoxy resins that can be used as any epoxy resin in (A-2) include "HP4032H" (naphthalene-type epoxy resin) manufactured by DIC Corporation, "HP- 4700", "HP-4710" (naphthalene-type tetrafunctional epoxy resin), "N-690" (cresol novolak-type epoxy resin) manufactured by DIC Corporation, "N-695" ( cresol novolak type epoxy resin), "HP-7200", "HP-7200HH", "HP-7200H", "HP-7200L" manufactured by DIC Co., Ltd. (dicyclopentadiene type epoxy resin), DIC Joint-stock "EXA-7311", "EXA-7311-G3", "EXA-7311-G4", "EXA-7311-G4S", "HP6000" , "HP6000L" (naphthylene ether type epoxy resin), "EPPN-502H" (triphenol type epoxy resin) manufactured by Nippon Kayaku Co., Ltd., "NC7000L" (naphthol novolac resin) manufactured by Nippon Kayaku Co., Ltd. Varnish type epoxy resin), "NC3000H", "NC3000", "NC3000L", "NC3000FH", "NC3100" (biphenyl type epoxy resin) manufactured by Nippon Kayaku Co., Ltd., manufactured by Nippon Steel Chemical Materials Co., Ltd. "ESN475V", "ESN4100V" (naphthalene-type epoxy resin), "ESN485" (naphthol-type epoxy resin) manufactured by Nippon Steel Chemical Materials Co., Ltd., "ESN375" (dihydroxynaphthalene-type epoxy resin) manufactured by Nippon Steel Chemical Materials Co., Ltd. type epoxy resin), "YX4000H", "YX4000", "YX4000HK", "YL7890" (bixylenol type epoxy resin) manufactured by Mitsubishi Chemical Co., Ltd., "YL6121" (biphenyl type epoxy resin), "YX8800" (anthracene type epoxy resin) manufactured by Mitsubishi Chemical Co., Ltd., "YX7700" (phenol aralkyl type epoxy resin) manufactured by Mitsubishi Chemical Co., Ltd., manufactured by Osaka Gas Chemical Co., Ltd. "PG-100", "CG-500", "YL7760" (bisphenol AF type epoxy resin) manufactured by Mitsubishi Chemical Co., Ltd., "YL7800" (fluorene type epoxy resin) manufactured by Mitsubishi Chemical Co., Ltd., Mitsubishi Chemical Co., Ltd. "jER1031S" (tetraphenylethane-type epoxy resin) manufactured by Chemical Co., Ltd., "WHR991S" (phenol-benzopyrrolidone-type epoxy resin) manufactured by Nippon Kayaku Co., Ltd., and the like. These resins may be used alone or in combination of two or more.

(A-2) The range of the epoxy equivalent of arbitrary epoxy resins may be the same as the range of the epoxy equivalent of (A-1) chelate type epoxy resin.

(A-2) The range of the weight average molecular weight and the number average molecular weight of arbitrary epoxy resins may be the same as the range of the weight average molecular weight of (A-1) chelate type epoxy resin, and the number average molecular weight.

As (A) epoxy resin, when liquid epoxy resin and solid epoxy resin are used in combination, their mass ratio (liquid epoxy resin: solid epoxy resin) is preferably 20:1 to 1:5, and then Preferably it is 10:1-1:2, especially preferably it is 5:1-1:1.

The amount of (A) epoxy resin in the resin composition is preferably at least 1% by mass, more preferably at least 2% by mass, particularly preferably at least 5% by mass, based on 100% by mass of the non-volatile components of the resin composition. , preferably 40% by mass or less, more preferably 30% by mass or less, particularly preferably 20% by mass or less. (A) When the quantity of an epoxy resin exists in the said range, the effect of suppressing a warpage and improving an adhesiveness can be remarkably acquired, and it can effectively lower minimum melt viscosity normally.

The amount of (A) epoxy resin in the resin composition is preferably at least 10 mass %, more preferably at least 20 mass %, particularly preferably at least 30 mass %, based on 100 mass % of the resin component of the resin composition, Preferably it is 70 mass % or less, More preferably, it is 60 mass % or less, Especially preferably, it is 50 mass % or less. (A) When the quantity of an epoxy resin exists in the said range, the effect of suppressing a warpage and improving an adhesiveness can be remarkably acquired, and it can effectively lower minimum melt viscosity normally. [3. (B) Inorganic filler material]

The resin composition related to this embodiment contains (B) inorganic filler as (B) component. (B) The inorganic filler is usually contained in the resin composition in the state of particles.

As a material of (B) the inorganic filler, an inorganic compound is used. Examples of materials for the (B) inorganic filler include silica, alumina, glass, cordierite, silicon oxide, barium sulfate, barium carbonate, talc, clay, mica powder, zinc oxide, hydrotalcite, water Aluminum stone, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, magnesium oxide, boron nitride, aluminum nitride, manganese nitride, aluminum borate, strontium carbonate, strontium titanate, calcium titanate, magnesium titanate, Bismuth titanate, titanium oxide, zirconium oxide, barium titanate, barium titanate zirconate, barium zirconate, calcium zirconate, zirconium phosphate and zirconium tungstate, etc. Among them, silica and alumina are more suitable, and silica is particularly suitable. Examples of silica include amorphous silica, fused silica, crystalline silica, synthetic silica, and hollow silica. Moreover, as silica, spherical silica is preferable. (B) The inorganic fillers may be used alone or in combination of two or more.

(B) Commercially available inorganic fillers include, for example, "UFP-30" manufactured by Denka Kagaku Kogyo Co., Ltd., "SP60-05" and "SP507-05" manufactured by Nippon Steel & Sumikin Materials Co., Ltd., "YC100C", "YA050C", "YA050C-MJE", "YA010C" manufactured by Yaduma Co., Ltd. , "UFP-30" made by DENKA Co., Ltd., "SILFIL NSS-3N", "SILFIL NSS-4N", "SILFIL NSS-5N" made by Tokuyama Co., Ltd., "SC2500SQ" made by Yaduma Co., Ltd., "SO-C4", "SO-C2", "SO-C1", "SC2050-SXF", etc.

From the viewpoint of remarkably obtaining the desired effect of the present invention, the average particle diameter of the (B) inorganic filler is preferably at least 0.01 μm, more preferably at least 0.05 μm, particularly preferably at least 0.1 μm, and more preferably at least 0.01 μm. 10 μm or less, more preferably 7 μm or less, more preferably 5 μm or less.

(B) The average particle size of the inorganic filler can be measured by a laser diffraction scattering method based on the Mie scattering theory. Specifically, the particle size distribution of the inorganic filler can be produced on a volume basis with a laser diffraction scattering type particle size distribution measuring device, and the median particle size can be measured as the average particle size. As a measurement sample, a sample obtained by weighing 100 mg of the inorganic filler and 10 g of methyl ethyl ketone into a vial and dispersing it by ultrasonic waves for 10 minutes can be used. For the measurement sample, laser diffraction particle size distribution measuring device can be used to measure the volume-based particle size distribution of inorganic filler materials by flow cell method using blue and red light source wavelengths, and the obtained particle size distribution can be used as the median particle size. Calculate the average particle size. As a laser-diffraction type particle size distribution measuring apparatus, "LA-960" by Horiba Seisakusho Co., Ltd. etc. is mentioned, for example.

From the viewpoint of remarkably obtaining the desired effect of the present invention, the specific surface area of the (B) inorganic filler is preferably at least 1 m ² /g, more preferably at least 2 m ² /g, particularly preferably at least 3 m ² /g above. There is no particular limitation on the upper limit, but it is preferably not more than 60 m ² /g, not more than 50 m ² /g or not more than 40 m ² /g. The specific surface area can be measured by adsorbing nitrogen gas on the sample surface using a specific surface area measuring device (Macsorb HM-1210 manufactured by Mountech Co., Ltd.) according to the BET method, and calculating the specific surface area by the BET multipoint method.

From the viewpoint of improving moisture resistance and dispersibility, the (B) inorganic filler is preferably treated with a surface treatment agent. Examples of surface treatment agents include fluorine-containing silane coupling agents, aminosilane coupling agents, epoxysilane coupling agents, mercaptosilane coupling agents, silane coupling agents, alkoxysilanes, and organosilazane compounds. , Titanate coupling agent, etc. The surface treating agent may be used alone or in any combination of two or more.

Commercially available surface treatment agents include, for example, Shin-Etsu Chemical Co., Ltd. "KBM403" (3-glycidoxypropyltrimethoxysilane), Shin-Etsu Chemical Co., Ltd. "KBM803" (3- mercaptopropyltrimethoxysilane), Shin-Etsu Chemical Co., Ltd. "KBE903" (3-aminopropyltriethoxysilane), Shin-Etsu Chemical Co., Ltd. "KBM573" (N-phenyl-3-aminopropyl phenyltrimethoxysilane), Shin-Etsu Chemical Co., Ltd. "SZ-31" (hexamethyldisilazane), Shin-Etsu Chemical Co., Ltd. "KBM103" (phenyltrimethoxysilane), Shin-Etsu Chemical Co., Ltd. "KBM-4803" (long-chain epoxy-type silane coupling agent) manufactured by the company, "KBM-7103" (3,3,3-trifluoropropyltrimethoxysilane) manufactured by Shin-Etsu Chemical Co., Ltd., etc.

From the viewpoint of (B) improvement in the dispersibility of the inorganic filler, the degree of surface treatment with the surface treatment agent is preferably within a specific range. Specifically, 100% by mass of the inorganic filler is preferably surface-treated with a surface treatment agent of 0.2% to 5% by mass, and more preferably surface-treated with a surface treatment agent of 0.2% to 3% by mass. Preferably, the surface is treated with 0.3% by mass to 2% by mass of a surface treatment agent.

The degree of surface treatment by the surface treatment agent can be evaluated by the amount of carbon per unit surface area of the inorganic filler. From the viewpoint of improving the dispersibility of the inorganic filler, the amount of carbon per unit surface area of the inorganic filler is preferably at least 0.02 mg/m ² , more preferably at least 0.1 mg/m ² , still more preferably 0.2 mg / ^m2 or more. On the other hand, from the viewpoint of suppressing the increase in the melt viscosity of the resin composition, it is preferably 1.0 mg/m ² or less, more preferably 0.8 mg/m ² or less, and still more preferably 0.5 mg/m ² or less .

(B) The amount of carbon per unit surface area of the inorganic filler can be measured after cleaning the surface-treated inorganic filler with a solvent (eg, methyl ethyl ketone (MEK)). Specifically, a sufficient amount of MEK was added as a solvent to the surface-treated inorganic filler material, and ultrasonic cleaning was performed at 25° C. for 5 minutes. After removing the supernatant and drying the solid content, the amount of carbon per unit surface area of the inorganic filler can be measured using a carbon analyzer. As a carbon analyzer, "EMIA-320V" manufactured by Horiba Seisakusho Co., Ltd., etc. can be used.

The amount of the (B) inorganic filler in the resin composition is preferably at least 40% by mass, more preferably at least 50% by mass, and still more preferably 60% by mass, based on 100% by mass of the non-volatile components of the resin composition. Above, particularly preferably at least 70% by mass, preferably at most 95% by mass, still more preferably at most 90% by mass, even more preferably at most 85% by mass, particularly preferably at most 80% by mass. In general, when the amount of the inorganic filler is as large as described above, the problems that the minimum melt viscosity of the resin composition increases and the adhesiveness of the cured product of the resin composition decreases tend to occur. On the other hand, according to the resin composition related to this embodiment, even when there are many inorganic fillers as described above, the adhesiveness of the cured product can be improved, and the minimum melt viscosity can be lowered more preferably. Therefore, when many (B) inorganic fillers more than the said lower limit are contained, the advantage of the resin composition concerning this embodiment can be exhibited effectively especially. Moreover, when the quantity of (B) inorganic filler is below the said upper limit, the effects of warpage suppression and adhesive improvement are remarkably acquired, and the minimum melt viscosity can be effectively lowered normally. [4. (C) Elastomer]

The resin composition related to this embodiment contains (C) elastomer as (C)component. This (C) elastomer does not contain the thing belonging to the above-mentioned (A)-(B) component. (C) The elastomer means a flexible resin, preferably a resin having rubber elasticity or a resin expressing rubber elasticity by being polymerized with other components. Examples of rubber elasticity include resins that exhibit an elastic modulus of 1 GPa or less when a tensile test is performed at a temperature of 25° C. and a humidity of 40% RH in accordance with Japanese Industrial Standards (JIS K7161). (C) The elastomer is generally an amorphous resin component soluble in an organic solvent. (C) Elastomers may be used alone or in combination of two or more at any ratio. If the (C) elastomer is used, the modulus of elasticity of the cured product of the resin composition can be lowered.

(C) The elastomer is preferably high molecular weight. (C) The number average molecular weight (Mn) of the elastomer is preferably at least 1000, more preferably at least 1500, still more preferably at least 2000, still more preferably at least 3000, particularly preferably at least 5000. (C) When the elastomer has a high molecular weight as described above, the effect of suppressing warpage and improving the adhesiveness can be remarkably obtained, and in general, the minimum melt viscosity can be effectively lowered. The upper limit of the number average molecular weight is not particularly limited, but is preferably at most 1,000,000, and more preferably at most 900,000. The number average molecular weight (Mn) is the polystyrene equivalent number average molecular weight measured using GPC (gel permeation chromatography).

(C) The elastomer is preferably one or more types selected from resins having a glass transition temperature (Tg) of 25°C or lower and resins that are liquid at 25°C or lower. The glass transition temperature of the resin having a glass transition temperature (Tg) of 25°C or lower is preferably 20°C or lower, more preferably 15°C or lower. The lower limit of the glass transition temperature is not particularly limited, but usually -15°C or higher. Furthermore, the resin that is liquid at 25°C is preferably a resin that is liquid at a temperature below 20°C, and more preferably a resin that is liquid at a temperature below 15°C. The glass transition temperature can be measured by DSC (differential scanning calorimetry) at a heating rate of 5°C/min.

(C) The elastomer preferably has a polybutadiene structure, a polysiloxane structure, a poly(meth)acrylate structure, a polyalkylene structure, a polyalkylene oxide structure, a poly A resin having at least one structure among isoprene structure, polyisobutylene structure, polycarbonate structure, and polystyrene structure. "(Meth)acrylate" is a term including methacrylate, acrylate, and combinations thereof. These structures may be contained in the molecular main chain of (C) elastomer, and may be contained in a side chain.

As (C) elastomer, the resin containing a polybutadiene structure is mentioned, for example. The polybutadiene structure may be contained in the main chain or in the side chain. Also, the polybutadiene structure may be partially or fully hydrogenated. Resins containing a polybutadiene structure are sometimes referred to as "polybutadiene resins". Specific examples of polybutadiene resins include "Ricon130MA8", "Ricon130MA13", "Ricon130MA20", "Ricon131MA5", "Ricon131MA10", "Ricon131MA17", "Ricon131MA20" manufactured by Cray Valley Co., Ltd. ", "Ricon184MA6" (polybutadiene containing acid anhydride groups), "GQ-1000" (polybutadiene with hydroxyl and carboxyl groups introduced), "G-1000", "G-2000" manufactured by Nippon Soda Co., Ltd. ", "G-3000" (polybutadiene with hydroxyl groups at both ends), "GI-1000", "GI-2000", "GI-3000" (hydrogenated polybutadiene with hydroxyl groups at both ends), manufactured by Nagase ChemteX Co., Ltd. "FCA-061L" (hydrogenated polybutadiene skeleton epoxy resin) and so on. In addition, specific examples of polybutadiene resins include butadiene resins containing phenolic hydroxyl groups, polyimides having a polybutadiene structure, a urethane structure, and an imide structure in the molecule. resin. For this polyimide resin, a linear polyimide resin can be produced by using hydroxyl-terminated polybutadiene, a diisocyanate compound, and a tetrabasic acid anhydride as raw materials (Japanese Patent Laid-Open No. 2006-37083, International Publication No. 2008/153208 The polyimides described in the gazette). The content rate of the butadiene structure of this polyimide resin becomes like this. Preferably it is 60 mass % - 95 mass %, More preferably, it is 75 mass % - 85 mass %. For details of the polyimide resin, refer to Japanese Patent Laying-Open No. 2006-37083, International Publication No. No. 2008/153208, the content is incorporated herein.

As (C) elastomer, the resin containing a poly(meth)acrylate structure is mentioned, for example. Resins containing a poly(meth)acrylate structure are sometimes referred to as "poly(meth)acrylic resins". Specific examples of poly(meth)acrylic resins include TEISANRESIN manufactured by Nagase ChemteX Co., Ltd., "ME-2000", "W-116.3", "W-197C", "KG- 25", "KG-3000", "ARUFON UH-2000" manufactured by Toago Gosei Co., Ltd., etc.

As (C) elastomer, the resin containing a polycarbonate structure is mentioned, for example. Resins having a polycarbonate structure are sometimes referred to as "polycarbonate resins". Specific examples of polycarbonate resins include "FPC0220" and "FPC2136" manufactured by Mitsubishi Gas Chemical Co., Ltd., "T6002" and "T6001" (polycarbonate diol) manufactured by Asahi Kasei Chemicals Co., Ltd. "C-1090", "C-2090", "C-3090" (polycarbonate diol) manufactured by the company's Kuraray. In addition, specific examples of the polycarbonate resin include polyimide resins having an imide structure, a urethane structure, and a polycarbonate structure in the molecule. For this polyimide resin, a linear polyimide resin can be produced from a hydroxyl-terminated polycarbonate, a diisocyanate compound, and a tetrabasic acid anhydride as raw materials. The content rate of the carbonate structure of this polyimide resin becomes like this. Preferably it is 60 mass % - 95 mass %, More preferably, it is 75 mass % - 85 mass %. The details of this polyimide resin can refer to International Publication No. No. 2016/129541, the content is incorporated in this specification.

As (C) elastomer, resin containing a polysiloxane structure is mentioned, for example. Resins containing polysiloxane structures are sometimes referred to as "silicone resins". Specific examples of silicone resins include "SMP-2006", "SMP-2003PGMEA", and "SMP-5005PGMEA" manufactured by Shin-Etsu Silicone Co., Ltd. Linear polyimide as a raw material (International Publication No. 2010/053185, JP-A 2002-12667 and Japanese Patent Application Laid-Open No. 2000-319386, etc.), etc.

Examples of the (C) elastomer include resins containing a polyalkylene structure and a polyalkyleneoxy structure. A resin containing a polyalkylene structure is sometimes referred to as an "alkylene resin". And, resin containing a polyalkyleneoxy structure may be called "alkyleneoxy resin". The polyalkyleneoxy structure is preferably a polyalkyleneoxy structure having 2 to 15 carbon atoms, more preferably a polyalkyleneoxy structure having 3 to 10 carbon atoms, and particularly preferably a carbon number of 5-6 polyalkylene oxide structure. Specific examples of the alkylene resin and the alkyleneoxy resin include "PTXG-1000" and "PTXG-1800" manufactured by Asahi Kasei Fibers Co., Ltd., and the like.

As (C) elastomer, the resin containing a polyisoprene structure is mentioned, for example. Resins containing a polyisoprene structure are sometimes referred to as "isoprene resins". Specific examples of the isoprene resin include "KL-610" and "KL613" manufactured by Kuraray Co., Ltd., etc.

As (C) elastomer, the resin containing a polyisobutylene structure is mentioned, for example. Resins containing a polyisobutylene structure are sometimes referred to as "isobutylene resins". Specific examples of isobutylene resins include "SIBSTAR-073T" (styrene-isobutylene-styrene triblock copolymer) and "SIBSTAR-042D" (styrene-isobutylene diblock copolymer) manufactured by Kaneka Co., Ltd. )wait.

As (C) elastomer, the resin containing a polystyrene structure is mentioned, for example. Resins having a polystyrene structure are sometimes referred to as "polystyrene resins". The polystyrene resin may be a copolymer containing arbitrary repeating units different from the aforementioned styrene units in combination with a styrene unit, or may be a hydrogenated polystyrene resin. Examples of polystyrene resins include styrene-butadiene-styrene block copolymer (SBS), styrene-isoprene-styrene block copolymer (SIS), styrene-ethylene- Butylene-styrene block copolymer (SEBS), styrene-ethylene-propylene-styrene block copolymer (SEPS), styrene-ethylene-ethylene-propylene-styrene block copolymer (SEEPS), benzene Ethylene-butadiene-butylene-styrene block copolymer (SBBS), styrene-butadiene diblock copolymer, hydrogenated styrene-butadiene block copolymer, hydrogenated styrene-isoprene Alkene block copolymer, hydrogenated styrene-butadiene random copolymer, styrene-maleic anhydride copolymer, etc. Specific examples of polystyrene resins include hydrogenated styrene-based thermoplastic elastomers "H1041", "Tuftec H1043", "Tuftec P2000", "Tuftec MP10" (manufactured by Asahi Kasei Co., Ltd.), epoxidized styrene-butylene Diene thermoplastic elastomer "EPOFRIENDAT501", "CT310" (manufactured by Daicel Co., Ltd.), modified styrene-based elastomer with hydroxyl group "SEPTON HG252" (manufactured by Kuraray Co., Ltd.), modified styrene-based elastomer with carboxyl group Elastomer "Tuftec N503M", amino group-modified styrene-based elastomer "Tuftec N501", acid-anhydride group-modified styrene-based elastomer "Tuftec M1913" (manufactured by Asahi Kasei Chemicals Co., Ltd.), unmodified styrene Elastomer "SEPTONS8104" (manufactured by Kuraray Co., Ltd.), styrene-ethylene/butylene-styrene block copolymer "FG1924" (manufactured by Kraton Co., Ltd.), "EF-40" (manufactured by Crayville Co., Ltd.) .

Among the above, the (C) elastomer is more preferably a resin having at least one structure selected from a polybutadiene structure, a polycarbonate structure, and a poly(meth)acrylate structure in the molecule. Moreover, as (C) elastomer, resin which has a polybutadiene structure or a polycarbonate structure in a molecule|numerator is especially preferable. The (C) elastomer having a polybutadiene structure or a polycarbonate structure generally has low compatibility with the (A-1) chelate type epoxy resin. Therefore, these (C) elastomers are phase-separated microscopically from (A-1) chelate type epoxy resin, and can form a fine domain (domain) favorable in flexibility. In the cured product of the resin composition, since the flexibility of this region is exerted, the modulus of elasticity of the cured product can be effectively reduced, so that warpage can be suppressed particularly effectively without impairing the adhesiveness.

The (C) elastomer may have a functional group capable of reacting with the (A) epoxy resin. When the (C) elastomer reacts with the (A) epoxy resin, the mechanical strength of the cured product of the resin composition can be improved. The functional group which can react with (A) epoxy resin contains the functional group which generate|occur|produces by heating. The functional group capable of reacting with (A) epoxy resin may be one or more functional groups selected from hydroxyl group, carboxyl group, acid anhydride group, phenolic hydroxyl group, epoxy group, isocyanate group and urethane group. Among them, as the functional group, preferably hydroxyl group, acid anhydride group, phenolic hydroxyl group, epoxy group, isocyanate group and carbamate group, more preferably hydroxyl group, acid anhydride group, phenolic hydroxyl group and epoxy group, especially Preferably it is a phenolic hydroxyl group. The number average molecular weight (Mn) of the functional group-containing (C) elastomer is preferably 5,000 or more.

The amount of the (C) elastomer in the resin composition is preferably at least 1% by mass, more preferably at least 2% by mass, and still more preferably at least 3% by mass, based on 100% by mass of the non-volatile components of the resin composition. , preferably less than 20% by mass, more preferably less than 15% by mass, more preferably less than 10% by mass. (C) When the amount of the elastomer is within the above range, the effect of suppressing warpage and improving the adhesiveness can be remarkably obtained, and in general, the minimum melt viscosity can be effectively lowered.

The amount of the (C) elastomer in the resin composition is preferably at least 5% by mass, more preferably at least 10% by mass, more preferably at least 20% by mass, based on 100% by mass of the resin component of the resin composition, Preferably it is 80 mass % or less, More preferably, it is 60 mass % or less, More preferably, it is 50 mass % or less. (C) When the amount of the elastomer is within the above range, the effect of suppressing warpage and improving the adhesiveness can be remarkably obtained, and in general, the minimum melt viscosity can be effectively lowered. [5. (D) Hardener]

In the resin composition related to this embodiment, it can combine with the above-mentioned (A)-(C) component, and can further contain (D) hardening|curing agent as an optional component. Those corresponding to the above-mentioned (A) to (C) components are not included in the (D) curing agent which is the (D) component. (D) The curing agent may have a function of reacting with the (A) epoxy resin to harden the resin composition.

Examples of (D) curing agents include phenol-based curing agents (phenol-based curing agents), naphthol-based curing agents, active ester-based curing agents, amine-based curing agents, acid anhydride-based curing agents, and benzoxazine-based curing agents. cyanate-based hardeners, carbodiimide-based hardeners, mercaptan-based hardeners, etc. Among them, phenolic hardeners, naphthol-based hardeners, and active ester-based hardeners are preferred, and phenolic hardeners are particularly preferred. Hardeners and active ester hardeners. (D) The curing agent may be used alone or in combination of two or more.

As the phenol-based curing agent and the naphthol-based curing agent, those having a novolac structure are preferable from the viewpoint of heat resistance and water resistance. Furthermore, from the viewpoint of adhesiveness, nitrogen-containing phenolic curing agents are preferred, and triazine skeleton-containing phenolic curing agents are further preferred.

Specific examples of phenol-based hardeners and naphthol-based hardeners include "MEH-7700", "MEH-7810", "MEH-7851", and "MEH-8000H" manufactured by Meiji Kasei Co., Ltd. "NHN", "CBN", and "GPH" manufactured by Nippon Kayaku Co., Ltd., "SN-170", "SN-180", "SN-190", and "SN-475" manufactured by Nippon Steel Chemical Materials Co., Ltd. , "SN-485", "SN-495", "SN-495V", "SN-375", "SN-395" , "TD-2090", "TD-2090-60M", "LA-7052", "LA-7054", "LA-1356", "LA-3018", "LA-3018-50P" manufactured by DIC Corporation ", "EXB-9500", "HPC-9500", "KA-1160", "KA-1163", "KA-1165", "GDP-6115L" manufactured by Qunyei Chemical Co., Ltd. , "GDP-6115H", "ELPC75" and so on.

As the active ester curing agent, a compound having one or more active ester groups in one molecule can be used. Among them, as active ester hardeners, phenolic esters, thiophenolic esters, N-hydroxylamine esters, esters of heterocyclic hydroxy compounds, etc. have two or more highly reactive ester groups in one molecule. compound of. The active ester hardener is preferably a compound obtained by condensation reaction of carboxylic acid compound and/or thiocarboxylic acid compound with hydroxyl compound and/or thiol compound. In particular, from the viewpoint of improving heat resistance, active ester compounds obtained from carboxylic acid compounds and hydroxy compounds are preferred, and active ester compounds obtained from carboxylic acid compounds and phenol compounds and/or naphthol compounds are more preferred. hardener. Examples of the carboxylic acid compound include benzoic acid, acetic acid, succinic acid, maleic acid, itaconic acid, phthalic acid, isophthalic acid, terephthalic acid, and pyromellitic acid. Examples of the phenol compound or naphthol compound include hydroquinone, resorcinol, bisphenol A, bisphenol F, bisphenol S, phenolphthalein, methylated bisphenol A, methylated bisphenol F, methylated bisphenol Hydroxylated bisphenol S, phenol, o-cresol, m-cresol, p-cresol, catechol, α-naphthol, β-naphthol, 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 2,6-dihydroxynaphthalene, dihydroxybenzophenone, trihydroxybenzophenone, tetrahydroxybenzophenone, phloroglucinol, glucinol, dicyclopentadiene type diphenol compound, novolac resin (phenol novolac )wait. Here, the "dicyclopentadiene-type diphenol compound" means the diphenol compound obtained by condensing 1 molecule of dicyclopentadiene and 2 molecules of phenol.

Preferred specific examples of active ester hardeners are active ester hardeners containing dicyclopentadiene-type diphenol structures, active ester hardeners containing naphthalene structures, and acetylated compounds containing novolac resins. Active ester hardeners, active ester hardeners containing benzoyl compounds of novolac resins. Among them, active ester hardeners containing a naphthalene structure and active ester hardeners containing a dicyclopentadiene-type diphenol structure are more preferable. The "dicyclopentadiene-type diphenol structure" means a divalent structural unit composed of phenylene-dicyclopentylene-phenylene.

Commercially available active ester hardeners include "EXB9451", "EXB9460", "EXB9460S", "HPC-8000-65T", " HPC-8000H-65TM", "EXB-8000L-65TM" (manufactured by DIC Co., Ltd.), etc., examples of active ester hardeners containing a naphthalene structure include "EXB-8100L-65T", "EXB-8150L-65T" (manufactured by DIC Co., Ltd.), etc., "DC808" (manufactured by Mitsubishi Chemical Co., Ltd.) ), etc., the active ester hardener containing benzoyl compounds of novolak resins includes “YLH1026” (manufactured by Mitsubishi Chemical Co., Ltd.), and the active ester hardeners of acetyl compounds of novolak resins include Examples include "DC808" (manufactured by Mitsubishi Chemical Co., Ltd.), and "YLH1026" (manufactured by Mitsubishi Chemical Co., Ltd.), "YLH1030" (manufactured by Mitsubishi Chemical Co., Ltd.) joint-stock company), "YLH1048" (Mitsubishi Chemical Co., Ltd.), etc.

Examples of the amine curing agent include those having one or more amino groups in one molecule, and examples thereof include aliphatic amines, polyether amines, alicyclic amines, and aromatic amines. Among them, aromatic amines are preferred. The amine hardener is preferably a primary amine or a secondary amine, and is more preferably a primary amine. Specific examples of amine hardeners include 4,4'-methylenebis(2,6-dimethylaniline), diphenyldiaminophen, 4,4'-diaminodiphenylmethane , 4,4'-diaminodiphenylene, 3,3'-diaminodiphenylene, m-phenylenediamine, m-xylylenediamine, diethyltoluenediamine, 4,4'-diamino Diphenyl ether, 3,3'-dimethyl-4,4'-diaminobiphenyl, 2,2'-dimethyl-4,4'-diaminobiphenyl, 3,3'-dihydroxy Benzidine, 2,2-bis(3-amino-4-hydroxyphenyl)propane, 3,3-dimethyl-5,5-diethyl-4,4-diphenylmethanediamine, 2, 2-bis(4-aminophenyl)propane, 2,2-bis(4-(4-aminophenoxy)phenyl)propane, 1,3-bis(3-aminophenoxy)benzene, 1, 3-bis(4-aminophenoxy)benzene, 1,4-bis(4-aminophenoxy)benzene, 4,4'-bis(4-aminophenoxy)biphenyl, bis(4-( 4-aminophenoxy)phenyl)pyridine, bis(4-(3-aminophenoxy)phenyl)pyridine, etc. Commercially available amine curing agents can be used, and examples thereof include "KAYABOND C-200S", "KAYABOND C-100" manufactured by Nippon Kayaku Co., Ltd., "KAYAHARDA-A", "KAYAHARDA-B", "KAYAHARDA-S", "EPICUREW" manufactured by Mitsubishi Chemical Corporation, etc.

Examples of the acid anhydride curing agent include those having one or more acid anhydride groups in one molecule. Specific examples of acid anhydride hardeners include, for example, phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, Phthalic anhydride, methylfluoroantimonysulfonic anhydride, hydrogenated methylfluoroantimonysulfonic anhydride, trialkyltetrahydrophthalic anhydride, dodecenylsuccinic anhydride, 5-(2,5-dioxotetra Hydrogen-3-furyl)-3-methyl-3-cyclohexene-1,2-dicarboxylic anhydride, trimellitic anhydride, pyromellitic anhydride, benzophenone tetracarboxylic dianhydride, biphenyl tetra Formic dianhydride, naphthalene tetracarboxylic dianhydride, oxydiphthalic dianhydride, 3,3'-4,4'-diphenyl tetracarboxylic dianhydride, 1,3,3a,4,5,9b- Hexahydro-5-(tetrahydro-2,5-dioxo-3-furyl)-naphtho[1,2-c]furan-1,3-dione, ethylene glycol bis(trimellitic anhydride ester), polymer-type acid anhydrides such as styrene-maleic acid resin obtained by copolymerization of styrene and maleic acid, and the like. As a commercial item of an acid anhydride type curing agent, "MH-700" by Nippon Chemical Co., Ltd. etc. are mentioned, for example.

Specific examples of benzoxazine-based hardeners include "JBZ-OD100" (benzoxazine ring equivalent weight 218 g/eq.), "JBZ-OP100D" (benzoxazine ring equivalent) manufactured by JFE Chemical Co., Ltd. Ring equivalent weight 218 g/eq.), "ODA-BOZ" (benzoxazine ring equivalent weight 218 g/eq.), "P-d" (benzoxazine ring equivalent weight 217 g/eq.) manufactured by Shikoku Chemical Industry Co., Ltd. .), "F-a" (benzoxazine ring equivalent 217 g/eq.), Showa Polymer Co., Ltd. "HFB2006M" (benzoxazine ring equivalent 432 g/eq.), etc.

Examples of cyanate hardeners include bisphenol A dicyanate, polyphenol cyanate, oligo(3-methylene-1,5-phenylene cyanate), 4,4 '-Methylene bis(2,6-dimethylphenyl cyanate), 4,4'-ethylene diphenyl dicyanate, hexafluorobisphenol A dicyanate, 2,2 -Bis(4-cyanato)phenylpropane, 1,1-bis(4-cyanatophenylmethane), bis(4-cyanato-3,5-dimethylphenyl) Methane, 1,3-bis(4-cyanatophenyl-1-(methylethylene))benzene, bis(4-cyanatophenyl)sulfide and bis(4-cyanate Difunctional cyanate ester resins such as phenyl) ether; multifunctional cyanate ester resins derived from phenol novolac resins and cresol novolak resins; prepolymerization obtained by partially triazinating these cyanate ester resins things; etc. Specific examples of cyanate resins include "PT30" and "PT60" (phenol novolak type polyfunctional cyanate resins), "ULL-950S" (polyfunctional cyanate resins) manufactured by Lonza Japan Co., Ltd. Resin), "BA230", "BA230S75" (a prepolymer obtained by triazinating part or all of bisphenol A dicyanate to form a trimer), etc.

Specific examples of carbodiimide curing agents include CARBODILITE (registered trademark) V-03 (carbodiimide group equivalent: 216 g/eq.), V-05 (carbodiimide Amino group equivalent: 262 g/eq.), V-07 (carbodiimide group equivalent: 200 g/eq.), V-09 (carbodiimide group equivalent: 200 g/eq.), Stabaxol manufactured by Rhein Chemie (registered trademark) P (carbodiimide group equivalent: 302 g/eq.).

Specific examples of mercaptan hardeners include trimethylolpropane tris(3-mercaptopropionate), pentaerythritol tetrakis(3-mercaptobutyrate), tris(3-mercaptopropyl)isocyanurate Etc.

(D) The active group equivalent weight of the hardener is preferably 50g/eq.-3000g/eq., more preferably 100g/eq.-1000g/eq., more preferably 100g/eq.-500g/eq., Particularly preferably, it is 100g/eq. to 300g/eq. The active group equivalent is the mass of hardener corresponding to one equivalent of active group.

When the number of epoxy groups in (A) epoxy resin is 1, the number of active groups in (D) curing agent is preferably 0.1 or more, more preferably 0.2 or more, still more preferably 0.3 or more, more preferably 5.0 or less, more preferably 2.0 or less, particularly preferably 1.0 or less. "Number of epoxy groups of (A) epoxy resin" represents the value obtained by dividing the mass of the non-volatile matter of (A) epoxy resin present in the resin composition by the epoxy equivalent. In addition, "the active group number of (D) curing agent" shows the value obtained by dividing the mass of the non-volatile component of (D) hardening|curing agent present in a resin composition by active group equivalent total.

The amount of the (D) curing agent in the resin composition is preferably at least 1% by mass, more preferably at least 2% by mass, particularly preferably at least 4% by mass, based on 100% by mass of the non-volatile components of the resin composition, Preferably it is 30 mass % or less, More preferably, it is 20 mass % or less, Especially preferably, it is 10 mass % or less.

The amount of the (D) curing agent in the resin composition is preferably at least 5% by mass, more preferably at least 10% by mass, particularly preferably at least 15% by mass, with respect to 100% by mass of the resin component of the resin composition. It is preferably at most 50% by mass, more preferably at most 40% by mass, and particularly preferably at most 30% by mass. [6. (E) Hardening Accelerator]

In the resin composition related to this embodiment, (E) hardening accelerator can be contained further as an arbitrary component in combination with said (A)-(D) component. Those belonging to the above-mentioned (A) to (D) components are not included in the (E) hardening accelerator which is this (E) component. (E) The hardening accelerator has a function as a hardening catalyst which accelerates hardening of (A) epoxy resin.

Examples of (E) curing accelerators include phosphorus-based curing accelerators, urea-based curing accelerators, guanidine-based curing accelerators, imidazole-based curing accelerators, metal-based curing accelerators, and amine-based curing accelerators. Among these, imidazole-based hardening accelerators are preferred. (E) The hardening accelerator may be used individually by 1 type, and may use it in combination of 2 or more types.

As the phosphorus-based hardening accelerator, for example, tetrabutylphosphonium bromide, tetrabutylphosphonium chloride, tetrabutylphosphonium acetate, tetrabutylphosphonium caprate, tetrabutylphosphonium laurate, bis( Tetrabutylphosphonium) pyromellitic acid salt, tetrabutylphosphonium hexahydrophthalate hydrogen salt, tetrabutylphosphonium 2,6-bis[(2-hydroxy-5-methylphenyl)methyl] - Aliphatic phosphonium salts such as 4-methylphenolate and di-tert-butyldimethylphosphonium tetraphenylborate; methyltriphenylphosphonium bromide, ethyltriphenylphosphonium bromide, propyltriphenyl Phosphonium bromide, butyltriphenylphosphonium bromide, benzyltriphenylphosphonium chloride, tetraphenylphosphonium bromide, p-tolyltriphenylphosphonium tetra-p-tolyl borate, tetraphenylphosphonium tetraphenyl Borate, tetraphenylphosphonium tetra-p-tolylborate, triphenylethylphosphonium tetraphenylborate, tris(3-methylphenyl)ethylphosphonium tetraphenylborate, tris(2-methoxy phenyl)ethylphosphonium tetraphenylborate, (4-methylphenyl)triphenylphosphonium thiocyanate, tetraphenylphosphonium thiocyanate, butyltriphenylphosphonium thiocyanate, etc. Aromatic phosphonium salts; aromatic phosphine-borane complexes such as triphenylphosphine-triphenylborane; aromatic phosphine-quinone addition reactants such as triphenylphosphine-p-benzoquinone addition reactants; tributyl Base phosphine, tri-tert-butyl phosphine, trioctyl phosphine, di-tert-butyl (2-butenyl) phosphine, di-tert-butyl (3-methyl-2-butenyl) phosphine, tricyclohexyl phosphine, etc. Aliphatic phosphine; dibutylphenylphosphine, di-tert-butylphenylphosphine, methyldiphenylphosphine, ethyldiphenylphosphine, butyldiphenylphosphine, diphenylcyclohexylphosphine, triphenylphosphine Phosphine, tri-o-tolylphosphine, tri-m-tolylphosphine, tri-p-tolylphosphine, tris(4-ethylphenyl)phosphine, tris(4-propylphenyl)phosphine, tris(4-isopropylphenyl)phosphine )phosphine, tri(4-butylphenyl)phosphine, tri(4-tert-butylphenyl)phosphine, tri(2,4-dimethylphenyl)phosphine, tri(2,5-dimethylphenyl)phosphine base) phosphine, tris(2,6-dimethylphenyl)phosphine, tris(3,5-dimethylphenyl)phosphine, tris(2,4,6-trimethylphenyl)phosphine, tri( 2,6-Dimethyl-4-ethoxyphenyl)phosphine, tris(2-methoxyphenyl)phosphine, tris(4-methoxyphenyl)phosphine, tris(4-ethoxyphenyl)phosphine yl)phosphine, tris(4-tert-butoxyphenyl)phosphine, diphenyl-2-pyridylphosphine, 1,2-bis(diphenylphosphino)ethane, 1,3-bis(diphenyl phosphino)propane, 1,4-bis(diphenylphosphino)butane, 1,2-bis(diphenylphosphino)acetylene, 2,2'-bis(diphenylphosphino)diphenyl Aromatic phosphines such as base ethers, etc.

Examples of urea hardening accelerators include 1,1-dimethylurea; 1,1,3-trimethylurea, 3-ethyl-1,1-dimethylurea, 3-cyclohexyl- 1,1-dimethylurea, 3-cyclooctyl-1,1-dimethylurea and other aliphatic dimethylureas; 3-phenyl-1,1-dimethylurea, 3-(4- Chlorophenyl)-1,1-dimethylurea, 3-(3,4-dichlorophenyl)-1,1-dimethylurea, 3-(3-chloro-4-methylphenyl) -1,1-dimethylurea, 3-(2-methylphenyl)-1,1-dimethylurea, 3-(4-methylphenyl)-1,1-dimethylurea, 3-(3,4-Dimethylphenyl)-1,1-dimethylurea, 3-(4-isopropylphenyl)-1,1-dimethylurea, 3-(4-methylurea oxyphenyl)-1,1-dimethylurea, 3-(4-nitrophenyl)-1,1-dimethylurea, 3-[4-(4-methoxyphenoxy) Phenyl]-1,1-dimethylurea, 3-[4-(4-chlorophenoxy)phenyl]-1,1-dimethylurea, 3-[3-(trifluoromethyl) Phenyl]-1,1-dimethylurea, N,N-(1,4-phenylene)bis(N',N'-dimethylurea), N,N-(4-methyl- 1,3-phenylene)bis(N',N'-dimethylurea)[toluene bisdimethylurea] and other aromatic dimethylureas, etc.

Examples of guanidine hardening accelerators include dicyandiamide, 1-methylguanidine, 1-ethylguanidine, 1-cyclohexylguanidine, 1-phenylguanidine, 1-(o-tolyl)guanidine, dimethyl guanidine, diphenylguanidine, trimethylguanidine, tetramethylguanidine, pentamethylguanidine, 1,5,7-triazabicyclo[4.4.0]dec-5-ene, 7-methyl-1 ,5,7-Triazabicyclo[4.4.0]dec-5-ene, 1-methylbiguanide, 1-ethylbiguanide, 1-n-butylbiguanide, 1-n-octadecylbiguanide, 1, 1-Dimethylbiguanide, 1,1-diethylbiguanide, 1-cyclohexylbiguanide, 1-allylbiguanide, 1-phenylbiguanide, 1-(o-tolyl)biguanide, etc.

Examples of imidazole hardening accelerators include 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 1,2-dimethylimidazole, 2-ethyl-4-methanol Imidazole, 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-methylimidazole , 1-benzyl-2-phenylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-ethyl Base-4-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazolium trimellitate, 1-cyanoethyl-2 -Phenylimidazolium trimellitate, 2,4-diamino-6-[2'-methylimidazolyl-(1')]-ethyl-s-triazine, 2,4-diamino-6 -[2'-undecylimidazolyl-(1')]-ethyl-s-triazine, 2,4-diamino-6-[2'-ethyl-4'-methylimidazolyl-( 1')]-ethyl-s-triazine, 2,4-diamino-6-[2'-methylimidazolyl-(1')]-ethyl-s-triazine isocyanurate adduct, 2-phenylimidazole isocyanuric acid adduct, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2,3-dihydroxymethylimidazole Hydrogen-1H-pyrrolo[1,2-a]benzimidazole, 1-dodecyl-2-methyl-3-benzylimidazolium chloride, 2-methylimidazoline, 2-phenylimidazole imidazole compounds such as line, and adducts of imidazole compounds and epoxy resins. Examples of commercially available imidazole hardening accelerators include "1B2PZ", "2E4MZ", "2MZA-PW", "2MZ-OK", "2MA-OK", " 2MA-OK-PW", "2PHZ", "2PHZ-PW", "C11Z", "C11Z-CN", "C11Z-CNS", "C11Z-A", "P200-H50" manufactured by Mitsubishi Chemical Corporation wait.

Examples of metal-based hardening accelerators include organometallic complexes or organometallic salts of metals such as cobalt, copper, zinc, iron, nickel, manganese, and tin. Specific examples of organometallic complexes include organocobalt complexes such as cobalt (II) acetylacetonate and cobalt (III) acetylacetonate, organocopper complexes such as copper (II) acetylacetonate, and Organic zinc complexes such as zinc (II) acetylacetonate, organic iron complexes such as iron (III) acetylacetonate, organic nickel complexes such as nickel (II) acetylacetonate, organic manganese (II) acetylacetonate, etc. Manganese complexes, etc. Examples of organic metal salts include zinc octylate, tin octylate, zinc naphthenate, cobalt naphthenate, tin stearate, zinc stearate, and the like.

Examples of the amine hardening accelerator include trialkylamines such as triethylamine and tributylamine, 4-dimethylaminopyridine, benzyldimethylamine, 2,4,6-tris(di Methylaminomethyl)phenol, 1,8-diazabicyclo(5,4,0)-undecene, etc. A commercial item can be used as an amine hardening accelerator, For example, "MY-25" by Ajinomoto Fine Chemicals Co., Ltd. etc. are mentioned.

The amount of the (E) hardening accelerator in the resin composition is preferably at least 0.01% by mass, more preferably at least 0.02% by mass, and particularly preferably at least 0.03% by mass, based on 100% by mass of the non-volatile components of the resin composition. , preferably 1.0% by mass or less, more preferably 0.5% by mass or less, particularly preferably 0.1% by mass or less.

The amount of the (E) hardening accelerator in the resin composition is preferably at least 0.01 mass %, more preferably at least 0.05 mass %, particularly preferably at least 0.10 mass %, based on 100 mass % of the resin component of the resin composition. Preferably it is 2.0 mass % or less, More preferably, it is 1.0 mass % or less, Especially preferably, it is 0.5 mass % or less. [7. (F) Optional additives]

In the resin composition related to this embodiment, it can combine with said (A)-(E) component, and can further contain (F) arbitrary additives as an arbitrary non-volatile component. As (F) optional additives, for example, organometallic compounds such as organocopper compounds, organozinc compounds, and organocobalt compounds, organosilicon leveling agents, acrylic polymer leveling agents, etc., bentonite, montmorillonite, etc. Viscosifiers such as stone, organosilicon defoamers, acrylic defoamers, fluorine defoamers, vinyl resin defoamers and other defoamers, benzotriazole UV absorbers and other UV absorbers, Adhesion enhancers such as urea silane, adhesion imparting agents such as triazole-based adhesion-imparting agents, tetrazole-based adhesion-imparting agents, triazine-based adhesion-imparting agents, and antioxidants such as hindered phenolic antioxidants , Fluorescent brighteners such as stilbene derivatives, surfactants such as fluorine-based surfactants, silicone-based surfactants, phosphorus-based flame retardants (such as phosphoric acid ester compounds, phosphazene compounds, phosphonic acid compounds, red phosphorus) , nitrogen flame retardants (such as melamine sulfate), halogen flame retardants, inorganic flame retardants (antimony trioxide) and other flame retardants, phosphate ester dispersants, polyoxyalkylene dispersants, acetylene ) dispersants, organosilicon dispersants, anionic dispersants, cationic dispersants and other dispersants, borate stabilizers, titanate stabilizers, aluminate stabilizers, zirconate stabilizers , Isocyanate stabilizers, carboxylic acid stabilizers, carboxylic anhydride stabilizers and other stabilizers. (F) Arbitrary additives may be used alone or in combination of two or more. [8. (G) Solvent]

In the resin composition related to this embodiment, the (G) solvent may be contained as an optional volatile component in combination with non-volatile components such as the above-mentioned (A) to (F) components. As the (G) solvent, an organic solvent is usually used. Examples of organic solvents include ketone solvents such as acetone, methyl ethyl ketone, methyl isobutyl ketone, and cyclohexanone; methyl acetate, ethyl acetate, butyl acetate, isobutyl acetate, and isobutyl acetate; Pentyl ester, methyl propionate, ethyl propionate, γ-butyrolactone and other ester solvents; tetrahydropyran, tetrahydrofuran, 1,4-dioxane, diethyl ether, diisopropyl ether, dibutyl Ether solvents such as ether, diphenyl ether, and anisole; alcohol solvents such as methanol, ethanol, propanol, butanol, and ethylene glycol; 2-ethoxyethyl acetate, propylene glycol monomethyl ether acetate , diethylene glycol monoethyl ether acetate, ethyl diglycol acetate, γ-butyrolactone, methyl methoxypropionate and other ether ester solvents; methyl lactate, ethyl lactate , 2-hydroxyisobutyrate methyl ester and other ester alcohol solvents; 2-methoxypropanol, 2-methoxyethanol, 2-ethoxyethanol, propylene glycol monomethyl ether, diethylene glycol monobutyl Ether alcohol solvents such as ether (butyl carbitol); N,N-dimethylformamide, N,N-dimethylacetamide, N-methyl-2-pyrrolidone and other amide solvents; Athylene solvents such as dimethylsulfene; nitrile solvents such as acetonitrile and propionitrile; aliphatic hydrocarbon solvents such as hexane, cyclopentane, cyclohexane, and methylcyclohexane; benzene, toluene, xylene, Aromatic solvents such as ethylbenzene and trimethylbenzene, etc. (G) The solvent may be used alone or in combination of two or more.

(G) The amount of the solvent is not particularly limited, and when all the components in the resin composition are taken as 100% by mass, it can be, for example, 60% by mass or less, 40% by mass or less, 30% by mass or less, 20% by mass or less, or 15% by mass or less. % or less, 10 mass % or less, etc., may be 0 mass %. [9. Manufacturing method of resin composition]

The resin composition related to this embodiment can be manufactured by mixing the above-mentioned components, for example. The above-mentioned components may be mixed partly or all at the same time, or may be mixed sequentially. In the process of mixing the components, the temperature can be set appropriately, so heating and/or cooling can be performed temporarily or continuously. In addition, in the process of mixing each component, stirring or shaking may be performed. [10. Properties of resin composition and its cured product]

With the resin composition according to this embodiment, a cured product capable of suppressing warpage can be obtained. Therefore, when a laminate is obtained by forming a cured layer of the resin composition (hereinafter also referred to as "cured layer") on a substrate such as a silicon wafer, the amount of warpage of the laminate can be reduced. For example, when a laminate is produced by the method described in the section [Evaluation of Warp] in Examples described later and the amount of warpage is measured, the amount of warpage can be set to 1.5 mm or less.

According to the resin composition according to this embodiment, a cured product having excellent adhesion to the conductor layer can be obtained. Therefore, when the hardened|cured material layer of a resin composition is formed so that it may contact a conductor layer, peeling of a conductor layer and a hardened|cured material layer can be suppressed. For example, when the copper foil adhesion strength is measured by the method described in the item [Evaluation of Copper Foil Adhesion Strength] in the Examples described later, it is preferably 0.53 kgf/cm or more, and more preferably 0.57 kgf/cm cm or more, particularly preferably a copper foil adhesion strength of 0.60 kgf/cm or more.

Usually, a cured product having excellent adhesion to silicon can be obtained by the resin composition according to this embodiment. Therefore, when the cured material layer of the resin composition is formed in contact with a member made of silicon, peeling of the member and the cured material layer can be suppressed. For example, when the Si adhesion strength is measured by the method described in the section of [Evaluation of Si adhesion strength] in the examples described later, it is preferably 550 kgf/cm ² or more, more preferably 570 kgf/cm ² or more , particularly preferably a Si adhesion strength of 590 kgf/cm ² or more.

Usually, a cured product having a low modulus of elasticity can be obtained by the resin composition related to this embodiment. The inventors of the present invention believe that such a small modulus of elasticity of the cured product is one of the reasons why the aforementioned excellent adhesion and warpage suppression effects are obtained. For example, when the tensile modulus of the cured product of the resin composition is measured by the method described in the item [Measurement of the modulus of elasticity] in the following examples, it is preferably 16 GPa or less, more preferably 15 GPa or less, Particularly preferred is a tensile modulus of 14.5 GPa or less. The lower limit is not particularly limited, and may be, for example, 5 GPa or more.

The resin composition related to this embodiment usually has a lower minimum melt viscosity. Therefore, in the case of sealing with the resin composition, the formation of gaps not filled with the resin composition can be suppressed. For example, when the minimum melt viscosity of the resin composition is measured by the method described in the item [Measurement of Melt Viscosity] in the examples described later, it can be obtained preferably below 9000 poise, more preferably below 8000 poise, and particularly preferably The lowest melt viscosity below 7500poise. The lower limit value is not particularly limited, and may be preferably at least 500 poise, more preferably at least 1000 poise, particularly preferably at least 2000 poise.

The composition has the above-mentioned characteristics, so it can be suitably used as a resin composition for a sealing layer, especially as a resin composition for sealing a semiconductor (resin composition for sealing a semiconductor), and is preferably used for It is used as a resin composition for sealing a semiconductor wafer (resin composition for semiconductor wafer sealing). In addition, the resin composition can also be used as a resin composition for an insulating layer in addition to the sealing application. For example, the aforementioned resin composition can be suitably used as a resin composition for forming an insulating layer of a semiconductor chip package (resin composition for an insulating layer of a semiconductor chip package) and as a resin composition for forming a circuit board (including a printed wiring board). The resin composition for the insulating layer (the resin composition for the insulating layer of the circuit board) is used.

Semiconductor chip packages include, for example, FC-CSP, MIS-BGA package, ETS-BGA package, fan-out WLP (wafer level package, Wafer Level Package), fan-in WLP, fan-out PLP (panel level package, PanelLevel Package), fan-in PLP.

Moreover, the aforementioned resin composition can also be used as an underfill material, for example, it can be used as a material for MUF (Molding UnderFilling) used after connecting a semiconductor chip to a substrate.

Furthermore, the aforementioned resin composition can also be used in a wide range of applications using the resin composition, such as sheet-like laminate materials such as resin sheets and prepregs, solder resists, die bonding materials, hole filling resins, and parts embedding resins. [11. Resin flakes]

A resin sheet according to an embodiment of the present invention has a support and a resin composition layer formed on the support. The resin composition layer is a layer formed of a resin composition, and therefore usually contains the above-mentioned resin composition, and preferably contains only the above-mentioned resin composition.

From the viewpoint of thinning, the thickness of the resin composition layer is preferably 600 μm or less, more preferably 550 μm or less, still more preferably 500 μm or less, 400 μm or less, 350 μm or less, 300 μm or less, or 200 μm or less. The lower limit of the thickness of the resin composition layer is not particularly limited, and may be, for example, 1 μm or more, 5 μm or more, 10 μm or more, and the like.

Examples of the support include films made of plastic materials, metal foils, and release paper, preferably films made of plastic materials and metal foils.

When using a film formed of a plastic material as a support, examples of the plastic material include polyethylene terephthalate (hereinafter also simply referred to as "PET"), polyethylene naphthalate ( Polyesters such as "PEN" hereinafter), acrylic polymers such as polycarbonate (hereinafter also abbreviated as "PC"), polymethyl methacrylate (hereinafter also abbreviated as "PMMA"), and cyclic polyolefins , triacetyl cellulose (hereinafter also abbreviated as "TAC"), polyether sulfide (hereinafter also abbreviated as "PES"), polyether ketone, polyimide, and the like. Among them, polyethylene terephthalate and polyethylene naphthalate are preferred, and low-priced polyethylene terephthalate is particularly preferred.

When using metal foil as a support body, copper foil, aluminum foil, etc. are mentioned as metal foil, for example. Among them, copper foil is preferable. As the copper foil, a foil made of copper alone or an alloy of copper and other metals (such as tin, chromium, silver, magnesium, nickel, zirconium, silicon, titanium, etc.) can be used.

The support body may be treated with matte treatment, corona discharge treatment, antistatic treatment, etc. on the surface bonded to the resin composition layer.

Moreover, as a support body, the support body with a mold release layer which has a mold release layer on the surface bonded to a resin composition layer can be used. Examples of the release agent used for the release layer of the support with a release layer include at least one release agent selected from alkyd resins, polyolefin resins, polyurethane resins, and silicone resins. As a commercial item of a mold release agent, "SK-1", "AL-5", and "AL-7" etc. which are the alkyd resin type mold release agent by Lintec Co., Ltd. are mentioned, for example. In addition, examples of the support with a release layer include "LUMIRROR T60" manufactured by Toray Co., Ltd., "Purex" manufactured by Teijin Co., Ltd., and "Unipeel" manufactured by UNITIKA Co., Ltd. wait.

The thickness of the support is preferably in the range of 5 μm to 75 μm, more preferably in the range of 10 μm to 60 μm. Furthermore, when using the support body with a release layer, it is preferable that the thickness of the whole support body with a release layer exists in the said range.

The resin sheet can be produced, for example, by coating a resin composition on a support with a coating device such as a die coater. Also, if necessary, a resin composition can be dissolved in a solvent to produce a resin varnish, and the resin varnish can be applied to produce a resin sheet. By using a solvent, the viscosity can be adjusted and the coatability can be improved. When using a resin varnish, the resin varnish is usually dried after coating to form a resin composition layer.

As the solvent, for example, the solvents described as the solvents that the resin composition may contain can be used. A solvent may be used individually by 1 type, and may use it in combination of 2 or more types by arbitrary ratios.

Drying can be implemented by known methods such as heating and hot air blowing. Regarding the drying conditions, the content of the solvent in the resin composition layer is usually 10% by mass or less, preferably 5% by mass or less. For example, when using a resin varnish containing 30% to 60% by mass of an organic solvent, the resin composition layer can be formed by drying at 50°C to 150°C for 3 minutes to 10 minutes, but it also depends on the boiling point of the solvent. .

The resin sheet may contain any layers other than the support body and the resin composition layer as needed. For example, in the resin sheet, a protective film selected according to the support may be provided on the surface of the resin composition layer that is not bonded to the support (that is, the surface opposite to the support). The thickness of the protective film is, for example, 1 μm to 40 μm. The protective film can prevent dirt and the like from adhering or being damaged on the surface of the resin composition layer. When the resin sheet has a protective film, the resin sheet can be used by peeling off the protective film. In addition, the resin sheet can be stored in a roll form.

The resin sheet can be suitably used for sealing a semiconductor wafer (resin sheet for semiconductor wafer sealing). Examples of applicable semiconductor chip packages include fan-out WLP, fan-in WLP, fan-out PLP, fan-in PLP, and the like. Moreover, the resin sheet can be used for sealing a circuit board (resin sheet for sealing a circuit board), for example.

In addition, the resin sheet can be favorably used to form an insulating layer in the manufacture of a semiconductor chip package (resin sheet for insulation of a semiconductor chip package). For example, the resin sheet can be used to form an insulating layer of a circuit board (resin sheet for an insulating layer of a circuit board). Examples of packages using such substrates include FC-CSP, MIS-BGA packages, and ETS-BGA packages.

Furthermore, a resin sheet can also be used for the material of MUF used after connecting a semiconductor wafer to a board|substrate.

Furthermore, the resin sheet can be used in a wide range of other applications requiring high insulation reliability. For example, a resin sheet can be suitably used for forming the insulating layer of circuit boards, such as a printed wiring board. [12. Circuit board]

A circuit board according to an embodiment of the present invention includes a cured product of a resin composition. Usually, a circuit board includes a cured product layer formed of a cured product of a resin composition. The hardened layer can generally function as an insulating layer or a sealing layer, preferably as a sealing layer. The circuit substrate can be manufactured, for example, by a manufacturing method comprising the following steps (1) and (2): (1) a step of forming a resin composition layer on a substrate; (2) A step of curing the resin composition layer to form a cured product layer.

The substrate is prepared in step (1). Examples of base materials include substrates such as glass epoxy substrates, metal substrates (stainless steel and cold-rolled steel sheets (SPCC), etc.), polyester substrates, polyimide substrates, BT resin substrates, and thermosetting polyphenylene ether substrates. . In addition, the substrate may have a metal layer such as copper foil on the surface as a part of the substrate. For example, a substrate having a peelable first metal layer and a second metal layer on both surfaces can be used. When such a base material is used, generally, a conductor layer serving as a wiring layer that can function as circuit wiring is formed on the surface of the second metal layer opposite to the first metal layer. Examples of the material of the metal layer include copper foil, copper foil with a carrier, and materials for the conductor layer described later, and copper foil is preferred. As a base material which has a metal layer, the ultra-thin copper foil "Micro Thin" of the copper foil with a carrier manufactured by Mitsui Metal Mining Co., Ltd. is mentioned, for example.

Also, the conductor layer may be formed on one surface or both surfaces of the substrate. In the following description, a member including a base material and a conductor layer formed on the surface of the base material may be appropriately referred to as a "base material with a wiring layer". Examples of the conductive material contained in the conductive layer include one or more selected from the group consisting of gold, platinum, palladium, silver, copper, aluminum, cobalt, chromium, zinc, nickel, titanium, tungsten, iron, tin, and indium. metal material. As the conductor material, a single metal or an alloy can be used. Examples of alloys include alloys of two or more metals selected from the above-mentioned metals (for example, nickel-chromium alloys, copper-nickel alloys, and copper-titanium alloys). Among them, chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver, or copper as a single metal are preferred from the viewpoint of the versatility of conductor layer formation, cost, and ease of pattern formation; and Alloy nickel-chromium alloy, copper-nickel alloy, copper-titanium alloy and other alloys. Among them, a single metal of chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver or copper is more preferable; and a nickel-chromium alloy, and a single metal of copper is particularly preferable.

The conductor layer may be patterned to function as a wiring layer, for example. At this time, the line width (circuit width)/line space (width between circuits) ratio of the conductor layer is not particularly limited, but is preferably 20/20 μm or less (that is, the pitch (pitch) is 40 μm or less), and more preferably 10 /10 μm or less, more preferably 5/5 μm or less, still more preferably 1/1 μm or less, particularly preferably 0.5/0.5 μm or more. The pitch may be uniform or non-uniform throughout the conductor layer. The minimum pitch of the conductor layers can be, for example, below 40 μm, below 36 μm or below 30 μm.

The thickness of the conductor layer varies according to the design of the circuit substrate, preferably 3 μm to 35 μm, more preferably 5 μm to 30 μm, further preferably 10 μm to 20 μm, particularly preferably 15 μm to 20 μm.

After preparing the base material, a resin composition layer is formed on the base material. When the conductor layer is formed on the surface of the substrate, it is preferable to form the resin composition layer so that the conductor layer is embedded in the resin composition layer.

Formation of the resin composition layer is performed, for example, by laminating a resin sheet and a base material. This lamination can be performed, for example, by hot-pressing a resin sheet onto a base material from the support side, and bonding the resin composition layer to the base material. Examples of members for heating and pressing the resin sheet to the substrate (hereinafter also referred to as "heat pressing members") include heated metal plates (SUS end plates, etc.) and metal rolls (SUS rolls, etc.). Furthermore, it is preferable not to directly press the heated pressing member against the resin sheet, but to apply pressure through an elastic material such as heat-resistant rubber so that the resin sheet sufficiently conforms to the surface of the base material to be uneven.

The lamination of the base material and the resin sheet can be implemented, for example, by a vacuum lamination method. Lamination conditions may be, for example, the following conditions. The heating and pressing temperature is preferably in the range of 60°C to 160°C, more preferably in the range of 80°C to 140°C. The heating and pressing pressure is preferably in the range of 0.098 MPa to 1.77 MPa, more preferably in the range of 0.29 MPa to 1.47 MPa. The heating and pressing time is preferably in the range of 20 seconds to 400 seconds, more preferably in the range of 30 seconds to 300 seconds. Lamination is preferably carried out under reduced pressure conditions with a pressure of 13 hPa or less.

After lamination, the laminated resin sheet can be smoothed under normal pressure (atmospheric pressure), for example, by pressing a heated pressing member from the support side. The pressure conditions for the smoothing treatment can be the same as the heat pressing conditions for the above-mentioned laminate. Furthermore, lamination and smoothing can be performed continuously using a vacuum laminator.

After the resin composition layer is formed on the substrate, the resin composition layer is thermally cured to form a cured product layer. The thermosetting conditions of the resin composition layer may also vary according to the type of the resin composition, but the curing temperature is usually in the range of 120°C to 240°C, preferably in the range of 150°C to 220°C, and more preferably 170°C. In the range of °C to 200 °C, the curing time is in the range of 5 minutes to 120 minutes, preferably in the range of 10 minutes to 100 minutes, and more preferably in the range of 15 minutes to 90 minutes.

Before thermally curing the resin composition layer, a preheating treatment of heating at a temperature lower than the curing temperature may be performed on the resin composition layer. For example, before the resin composition layer is thermally cured, it is usually at a temperature of not less than 50°C and less than 120°C, preferably at a temperature of not less than 60°C and not more than 110°C, and more preferably at a temperature of not less than 70°C and not more than 100°C. The preheating of the resin composition layer is usually more than 5 minutes, preferably 5 minutes to 150 minutes, and more preferably 15 minutes to 120 minutes.

As described above, a circuit board having a cured product layer formed of a cured product of the resin composition can be manufactured. And, the manufacturing method of a circuit board may further include arbitrary steps. For example, when manufacturing a circuit board using a resin sheet, the manufacturing method of a circuit board may include the process of peeling off the support body of a resin sheet. The support body may be peeled off before thermal curing of the resin composition layer or after thermal curing of the resin composition layer.

The method of manufacturing a circuit board may include, for example, a step of polishing the surface of the hardened material layer after forming the hardened material layer. The grinding method is not particularly limited. Examples of the polishing method include, for example, a chemical mechanical polishing method using a chemical mechanical polishing apparatus, a mechanical polishing method such as buffing, a surface grinding method in which a grinding wheel is rotated, and the like.

The manufacturing method of the circuit board may include, for example, the step of connecting conductor layers between layers through a hole. As a method of interlayer connection, for example, a method of opening a hole in a cured material layer is mentioned. Holes such as through holes and via holes can be formed in the cured layer by opening holes. As a method of forming a through hole, laser irradiation, etching, mechanical drilling, etc. are mentioned, for example. The size and shape of the through hole can be appropriately determined according to the design of the circuit substrate. Furthermore, the step perforation can be performed by grinding or grinding the hardened material layer for interlayer connection.

After the through-holes are formed, it is preferable to perform a step of removing smudges in the through-holes. This step is sometimes called the stain removal step. For example, in the case of forming the conductor layer on the hardened material layer by a plating step, wet desmear treatment may be performed on the through hole. Moreover, when performing formation of the conductor layer on the cured material layer by a plating process, dry desmear processes, such as a plasma processing process, can be performed. Furthermore, a roughening treatment may be applied to the cured product layer by a desmearing step.

In addition, before forming the conductor layer on the cured material layer, roughening treatment may be performed on the cured material layer. By this roughening treatment, the surface generally including the hardened material layer inside the via hole is roughened. As the roughening treatment, either dry roughening or wet roughening can be performed. Plasma treatment etc. are mentioned as an example of a dry roughening process. In addition, as an example of the wet roughening treatment, a method of sequentially performing swelling treatment with a swelling liquid, roughening treatment with an oxidizing agent, and neutralization treatment with a neutralizing solution is mentioned.

After the via holes are formed, a conductor layer may be formed on the hardener layer. By forming the conductor layer at the position where the through hole is formed, the newly formed conductor layer and the conductor layer on the surface of the substrate will be opened to realize interlayer connection. The method for forming the conductor layer includes, for example, a plating method, a plating method, a vapor deposition method, and the like. For example, plating can be performed on the surface of the hardened material layer by an appropriate method such as a semi-additive method or a full-additive method to form a conductor layer having a desired wiring pattern. And, for example, when the support in the resin sheet is a metal foil, a conductor layer having a desired wiring pattern can be formed by a subtractive method. The material of the formed conductor layer can be a single metal or an alloy. In addition, the conductor layer may have a single-layer structure, or may have a multi-layer structure including two or more layers of different types of materials.

Here, an example of an embodiment in which a conductor layer is formed on a cured material layer will be described in detail. A plated sheet layer is formed on the surface of the hardened material layer by electroless plating. Next, a mask pattern exposing a part of the plating sheet layer is formed corresponding to a desired wiring pattern on the formed plating sheet layer. After forming an electrolytic plating layer by electrolytic plating on the exposed plating sheet layer, the photomask pattern is removed. Then, by removing unnecessary plating sheet layers by etching or the like, a conductor layer having a desired wiring pattern can be formed.

The manufacturing method of the circuit board may include the step (4) of removing the base material. By removing the base material, a circuit board having a hardened layer and a conductor layer embedded in the hardened layer is obtained. This step (4) can be carried out, for example, using a substrate having a peelable metal layer. [13. Semiconductor chip packaging]

A semiconductor chip package related to one embodiment of the present invention includes a cured product of a resin composition. As this semiconductor chip package, the following examples are mentioned, for example.

A semiconductor chip package related to the first example includes the above-mentioned circuit substrate and a semiconductor chip mounted on the circuit substrate. The semiconductor chip package can be manufactured by bonding a semiconductor chip to a circuit substrate.

As the bonding conditions between the circuit board and the semiconductor wafer, any conditions that allow conductive connection of the terminal electrodes of the semiconductor wafer and the circuit wiring of the circuit board can be employed. For example, conditions used in flip-chip mounting of semiconductor wafers can be employed. In addition, for example, the semiconductor wafer and the circuit board can be bonded through an insulating adhesive.

As an example of the bonding method, a method of pressing a semiconductor wafer to a circuit board is mentioned. As pressing conditions, the pressing temperature is usually in the range of 120°C to 240°C, preferably in the range of 130°C to 200°C, and more preferably in the range of 140°C to 180°C, and the pressing time is usually 1 seconds to 60 seconds, preferably 5 seconds to 30 seconds.

In addition, as another example of the bonding method, a method of bonding a semiconductor chip to a circuit board by reflow is mentioned. The reflow conditions can be set in the range of 120°C to 300°C.

After the semiconductor die is bonded to the circuit substrate, the semiconductor die may be filled with a molded underfill material. As the molding underfill material, it is preferable to use the resin composition related to the above-mentioned embodiment.

A semiconductor chip package related to the second example includes a semiconductor chip and a cured product of a resin composition that seals the semiconductor chip. In such a semiconductor chip package, generally, a cured product of the resin composition functions as a sealing layer. Examples of semiconductor chip packages related to the second example include fan-out WLP, fan-out PLP, and the like.

FIG. 1 is a cross-sectional view schematically showing a fan-out type WLP as an example of a semiconductor chip package according to an embodiment of the present invention. For example, as shown in FIG. 1, a semiconductor chip package 100 as a fan-out type WLP includes: a semiconductor chip 110, a sealing layer 120 formed to cover the periphery of the semiconductor chip 110, and a sealing layer 120 formed on the semiconductor chip 110. On the opposite side, the rewiring formation layer 130 as an insulating layer, the rewiring layer 140 as a conductor layer, the solder resist layer 150 and the bump 160 are formed.

The manufacturing method of such a semiconductor chip package includes: (A) a step of laminating a temporary fixed film on the substrate; (B) a step of temporarily fixing the semiconductor wafer on the temporary fixing film; (C) a step of forming a sealing layer on the semiconductor wafer; (D) a step of peeling the substrate and the temporary fixing film from the semiconductor wafer; (E) a step of peeling off the surface of the substrate and the temporary fixing film on the semiconductor wafer to form a rewiring formation layer; (F) a step of forming a rewiring layer as a conductor layer on the rewiring forming layer; and (G) A step of forming a solder resist layer on the rewiring layer. And, the manufacturing method of above-mentioned semiconductor chip package can comprise: (H) A step of dicing a plurality of semiconductor wafer packages into individual semiconductor wafer packages and performing singulation. (step (A))

Step (A) is a step of laminating a temporary fixing film on the substrate. The lamination conditions of the base material and the temporary fixing film may be the same as the lamination conditions of the base material and the resin sheet in the production method of the circuit board.

Examples of substrates include: silicon wafers; glass wafers; glass substrates; metal substrates such as copper, titanium, stainless steel, and cold-rolled steel plate (SPCC); Substrates subjected to thermosetting treatment; substrates made of bismaleimide triazine resins such as BT resins, etc.

Any material that can be peeled from the semiconductor wafer and temporarily fix the semiconductor wafer can be used for the temporary fixing film. As a commercial item, Nitto Denko Co., Ltd. product "REVALPHA" etc. are mentioned. (step (B))

Step (B) is a step of temporarily fixing the semiconductor wafer on the temporary fixing film. Temporary fixing of the semiconductor wafer can be performed using, for example, devices such as flip chip bonders and die bonders. The layout and number of semiconductor wafers can be appropriately set according to the shape and size of the temporary fixing film, the number of semiconductor wafer packages to be produced, and the like. For example, semiconductor wafers may be temporarily fixed by arranging them in a matrix form of multiple rows and multiple columns. (step (C))

Step (C) is a step of forming a sealing layer on the semiconductor wafer. The sealing layer can be formed of a cured product of the resin composition related to the above-mentioned embodiment. The sealing layer is usually formed by a method including a step of forming a resin composition layer on a semiconductor wafer, and a step of thermally curing the resin composition layer to form a hardened layer as a sealing layer. Regarding the formation of the resin composition layer on the semiconductor wafer, for example, except that a semiconductor wafer is used instead of the base material, the same method as the method of forming the resin composition layer on the base material described in the above-mentioned method of manufacturing a circuit board can be used. to proceed.

After the resin composition layer is formed on the semiconductor wafer, the resin composition layer is thermally cured to obtain a sealing layer covering the semiconductor wafer. Thereby, sealing of the semiconductor wafer by the cured product of the resin composition is performed. As the thermosetting conditions of the resin composition layer, the same conditions as those of the thermosetting conditions of the resin composition layer in the production method of the circuit board can be adopted. Furthermore, before thermosetting the resin composition layer, the resin composition layer may be heated at a temperature lower than the curing temperature to give a preheating treatment. The processing conditions of this preheating process can employ|adopt the same conditions as the preheating process in the manufacturing method of a circuit board. (step (D))

Step (D) is a step of peeling the substrate and the temporary fixing film from the semiconductor wafer. As the peeling method, it is desirable to use an appropriate method suitable for the material of the temporary fixing film. As a peeling method, the method of peeling off by heating, foaming, or expanding a temporarily fixed film is mentioned, for example. Moreover, as a peeling method, the method of peeling off by reducing the adhesive force of a temporary fixing film by irradiating ultraviolet rays to a temporary fixing film through a board|substrate, for example is mentioned.

In the method of heating, foaming or expanding the temporary fixing film, the heating conditions are usually heating at 100° C. to 250° C. for 1 second to 90 seconds or for 5 minutes to 15 minutes. In addition, in the method of peeling off by irradiating ultraviolet rays to lower the adhesive force of the temporarily fixed film, the irradiation amount of ultraviolet rays is usually 10 mJ/cm ² to 1000 mJ/cm ² .

When the substrate and the temporary fixing film are peeled off from the semiconductor wafer as described above, the surface of the sealing layer is exposed. The manufacturing method of the semiconductor wafer package may include the step of polishing the surface of the exposed sealing layer. Grinding can improve the smoothness of the surface of the sealing layer. As a polishing method, the same method as that described in the method of manufacturing a circuit board can be used. (step (E))

The step (E) is a step of forming a rewiring forming layer as an insulating layer on the surface of the semiconductor wafer from which the base material and the temporary fixing film have been peeled off. Usually, the redistribution forming layer is formed on the semiconductor wafer and the sealing layer. The rewiring formation layer can be formed of, for example, a photosensitive resin composition or a thermosetting resin composition. In addition, after the rewiring formation layer is formed, via holes are usually formed in the rewiring formation layer for interlayer connection between the semiconductor wafer and the rewiring layer. (step (F))

Step (F) is a step of forming a rewiring layer as a conductor layer on the rewiring forming layer. The method of forming the rewiring layer on the rewiring formation layer may be the same as the method of forming the conductor layer on the cured material layer in the method of manufacturing the circuit board. In addition, the steps (E) and (F) can be repeated, and the rewiring layer and the rewiring formation layer can be alternately stacked (stacked). (step (G))

Step (G) is a step of forming a solder resist layer on the rewiring layer. Any insulating material can be used as the material of the solder resist layer. Among these, a photosensitive resin composition and a thermosetting resin composition are preferable from the viewpoint of the ease of manufacture of a semiconductor chip package.

And, in the step (G), bump processing for forming bumps may be performed as needed. The bump processing can be performed by methods such as solder balls and solder plating. In addition, the formation of the via hole in bump processing can be performed similarly to step (E). (step (H))

The manufacturing method of a semiconductor chip package may also include step (H) in addition to steps (A) to (G). Step (H) is a step of dicing a plurality of semiconductor wafer packages into individual semiconductor wafer packages and performing singulation. The method of dicing the semiconductor wafer packages into individual semiconductor wafer packages is not particularly limited.

As the semiconductor chip package related to the third example, in the semiconductor chip package 100 shown as an example in FIG. The solder resist layer 150 is packaged on the semiconductor chip. [14. Semiconductor devices]

A semiconductor device according to an embodiment of the present invention includes the above-mentioned circuit board or semiconductor chip package. Examples of semiconductor devices include electrical products (such as computers, mobile phones, smart phones, tablet devices, wearable devices, digital cameras, medical equipment, and televisions, etc.) and vehicles (such as motorcycles, automobiles, trains, Ships, aircraft, etc.) and other semiconductor devices. Example

Hereinafter, an Example is shown and this invention is demonstrated concretely. However, this invention is not limited to the Example shown below. In the following description, unless otherwise specified, "parts" and "%" indicating amounts mean "parts by mass" and "% by mass", respectively. In addition, the temperature conditions and pressure conditions in the case where there is no particular designation are room temperature (25° C.) and atmospheric pressure (1 atm). [Description of inorganic filler]

The inorganic fillers used in the following examples and comparative examples are as described above; Inorganic filler 1: spherical silica particles (average particle size 1 μm, specific surface area 4.5m ² /g); inorganic filler 2: spherical alumina particles (average particle size 1.5 μm) surface-treated with an aminosilane coupling agent ("KBM573" manufactured by Shin-Etsu Chemical Co., Ltd.) , specific surface area 1.6m ² /g). [Manufacture example 1. Manufacture of elastomer 1]

In a reaction vessel, 69 g of difunctional hydroxyl-terminated polybutadiene (number average molecular weight = 5047 (GPC method), hydroxyl equivalent = 1800 g/eq., solid content 100% by mass, "G- 3000"), 40 g of an aromatic hydrocarbon mixed solvent ("Ipzole 150" manufactured by Idemitsu Petrochemical Co., Ltd.), and 0.005 g of dibutyltin laurate were mixed and dissolved uniformly. After becoming uniform, the temperature was raised to 50° C., and 8 g of isophorone diisocyanate (manufactured by Evonik Degussa Japan Co., Ltd., IPDI, isocyanate group equivalent=113 g/eq) was added while stirring, and the reaction was performed for about 3 hours. Next, after cooling the reactant to room temperature, 23 g of cresol novolak resin ("KA-1160" manufactured by DIC Corporation, hydroxyl equivalent = 117 g/eq.), 60 g of diethylene glycol monoethyl Ether acetate (ethyl diglycol Acetate, manufactured by Daicel Co., Ltd.) was heated to 80° C. while stirring, and the reaction was performed for about 4 hours. The disappearance of the NCO peak at 2250 cm ^-1 was confirmed by FT-IR. Based on the confirmation that the NCO peak disappeared, it was regarded as the end point of the reaction. After the reactant was cooled to room temperature, it was filtered with a 100-mesh filter cloth to obtain an elastomer 1 (non-volatile) with a polybutadiene structure and a phenolic hydroxyl group. Composition 50% by mass). The number average molecular weight was 5500. [Manufacturing example 2. Manufacture of elastic body 2]

In a reaction vessel, 50 g of difunctional hydroxyl-terminated polybutadiene (number average molecular weight = 5047 (GPC method), hydroxyl equivalent = 1800 g/eq., solid content 100% by mass, "G-3000" manufactured by Nippon Soda Co., Ltd. ”), 23.5 g of an aromatic hydrocarbon mixed solvent (“Ipzole 150” manufactured by Idemitsu Petrochemical Co., Ltd.), and 0.005 g of dibutyltin laurate were mixed and dissolved uniformly. After becoming uniform, the temperature was raised to 50° C., and 4.8 g of toluene-2,4-diisocyanate (isocyanate group equivalent = 87.08 g/eq) was added while stirring, and reaction was performed for about 3 hours. Next, after cooling the reactant to room temperature, 8.96 g of benzophenone tetracarboxylic dianhydride (acid anhydride equivalent = 161.1 g/eq.), 0.07 g of triethylenediamine, 40.4 g of diethylene glycol mono Ethyl ether acetate (made by Daicel Co., Ltd.) was heated up to 130 degreeC, stirring, and it reacted for about 4 hours. The disappearance of the NCO peak at 2250 cm ^-1 was confirmed by FT-IR. Based on the confirmation of the disappearance of the NCO peak, it is regarded as the end point of the reaction. After the reactant is cooled to room temperature, it is filtered with a 100-mesh filter cloth to obtain compounds with an imide structure, a carbamate structure, and a polybutadiene structure. Elastomer 2 (non-volatile content 50% by mass). The number average molecular weight is 13700. [Manufacture example 3. Manufacture of elastic body 3]

In a reaction vessel, 80 g of polycarbonate diol (number-average molecular weight: about 1000, hydroxyl equivalent: 500 g/eq., non-volatile content: 100%, "C-1015N" manufactured by Kuraray Co., Ltd.) and 0.01 g of diol Dibutyltin laurate was uniformly dissolved in 37.6 g of diethylene glycol monoethyl ether acetate ("Ethyl diglycol Acetate" manufactured by Daicel Corporation). Next, the temperature of this mixture was raised to 50 degreeC, and 27.8 g of toluene-2, 4- diisocyanates (isocyanate group equivalent weight: 87.08) were added, stirring further, and reaction was performed for about 3 hours. After cooling the reactant to room temperature, 14.3 g of benzophenone tetracarboxylic dianhydride (acid anhydride equivalent: 161.1 g/eq.), 0.12 g of triethylenediamine, and 84.0 g of diethylene glycol monoethyl Ether acetate ("Ethyl diglycol Acetate" manufactured by Daicel Co., Ltd.) was heated up to 130° C. while stirring, and the reaction was performed for about 4 hours. The disappearance of the NCO peak at 2250 cm ^-1 was confirmed by FT-IR. Based on the confirmation of the disappearance of the NCO peak, it was regarded as the end point of the reaction. After the reactant was cooled to room temperature, it was filtered with a 100-mesh filter cloth to obtain compounds with an imide structure, a carbamate structure, and a polycarbonate structure. Elastomer 3 (non-volatile content: 50% by mass). The number average molecular weight is 8500. [Example 1]

While stirring, make 2 parts of liquid chelate type epoxy resin ("EP-49-10P" manufactured by ADEKA Co., Ltd., epoxy equivalent 240g/eq., chelate modification (phosphoric acid modification) 1.0% by mass) , 4 parts of liquid epoxy resin ("ZX1059" manufactured by Nippon Steel & Sumitomo Metal Chemical Co., Ltd., a 1:1 mixture (mass ratio) of bisphenol A type epoxy resin and bisphenol F type epoxy resin, epoxy equivalent: 169 g/eq.) and 3 parts of bixylenol-type epoxy resin ("YX4000H" manufactured by Mitsubishi Chemical Corporation, epoxy equivalent 185 g/eq.) were heated and dissolved in 10 parts of MEK. After cooling to room temperature, 16 parts of Elastomer 1 (non-volatile content 50% by mass), 10 parts of a phenolic hardener having a triazine skeleton and a phenolic structure ("LA-3018-50P" manufactured by DIC Co., Ltd., active group Equivalent about 151g/eq., 50% solid content of 2-methoxypropanol solution), 1 part of imidazole hardening accelerator ("1B2PZ" manufactured by Shikoku Chemical Industry Co., Ltd., 1-benzyl-2-phenyl imidazole, MEK solution with a solid content of 5% by mass), 75 parts of inorganic filler 1, and 10 parts of MEK were mixed, uniformly dispersed with a high-speed rotary mixer, and filtered through a cartridge filter ("SHP020" manufactured by ROKITECHNO Co., Ltd.) , to manufacture resin varnishes. [Example 2]

Change the amount of chelate-type epoxy resin ("EP-49-10P" manufactured by ADEKA Co., Ltd., epoxy equivalent 240g/eq.) to 1.5 parts, and change the amount of elastomer 1 (non-volatile content 50% by mass) to Changed to 18 servings. Except for the above matters, it carried out similarly to Example 1, and produced the resin varnish. [Example 3]

Change the amount of chelate-type epoxy resin ("EP-49-10P" manufactured by ADEKA Co., Ltd., epoxy equivalent 240g/eq.) to 0.7 parts, and change the amount of elastomer 1 (non-volatile content 50% by mass) to Changed to 19 copies. Except for the above matters, it carried out similarly to Example 1, and produced the resin varnish. [Example 4]

Change the amount of chelate-type epoxy resin ("EP-49-10P" manufactured by ADEKA Co., Ltd., epoxy equivalent 240g/eq.) to 3 parts, and change the amount of elastomer 1 (non-volatile content 50% by mass) Changed to 14 copies. Except for the above matters, it carried out similarly to Example 1, and produced the resin varnish. [Example 5]

Change the amount of chelate-type epoxy resin ("EP-49-10P" manufactured by ADEKA Co., Ltd., epoxy equivalent 240g/eq.) to 4 parts, and change the amount of elastomer 1 (non-volatile content 50% by mass) to Changed to 12 servings. Except for the above matters, it carried out similarly to Example 1, and produced the resin varnish. [Example 6]

A chelate-modified epoxy resin ("EP-49-10P" manufactured by ADEKA Co., Ltd., epoxy equivalent 240g/eq.) was changed into a liquid chelate-modified epoxy resin ("EP-49-10P" manufactured by ADEKA Co., Ltd. 49-10P2", epoxy equivalent 300g/eq., chelate modification (phosphoric acid modification) 1.5% by mass). Except for the above matters, it carried out similarly to Example 1, and produced the resin varnish. [Example 7]

Chelate type epoxy resin ("EP-49-10P" manufactured by ADEKA Co., Ltd., epoxy equivalent 240g/eq.) was changed into liquid chelate type epoxy resin ("EP-49-10P" manufactured by ADEKA Co., Ltd. 23", epoxy equivalent 175g/eq.). Except for the above matters, it carried out similarly to Example 1, and produced the resin varnish. [Example 8]

Except having used 75 parts of inorganic fillers 2 instead of 75 parts of inorganic fillers 1, it carried out similarly to Example 1, and produced the resin varnish. [Example 9]

Except having used 16 parts of elastomer 2 (50 mass % of non-volatile components) instead of 16 parts of elastomer 1 (50 mass % of non-volatile components), it carried out similarly to Example 1, and produced the resin varnish. [Example 10]

Except having used 16 parts of Elastomer 3 (50 mass % of non-volatile components) instead of 16 parts of Elastomer 1 (50 mass % of non-volatile components), it carried out similarly to Example 1, and produced the resin varnish. [Example 11]

Same as Example 1, except that 8 parts of hydroxyl-containing acrylic polymer ("ARUFON UH-2000" manufactured by Toagosei Co., Ltd., weight average molecular weight: 11,000) was used instead of 16 parts of Elastomer 1 (non-volatile content: 50% by mass) To operate, to manufacture resin varnish. [Example 12]

In addition to using 7.5 parts of phenol novolak resin ("TD-2090-60M" produced by DIC Co., Ltd., MEK solution with a hydroxyl equivalent of about 105g/eq. and a solid content of 60%) instead of 10 parts of phenols with a triazine skeleton and a phenolic structure Except for the hardening agent ("LA-3018-50P" manufactured by DIC Co., Ltd., active group equivalent of about 151g/eq., 2-methoxypropanol solution with a solid content of 50%), the rest was performed in the same manner as in Example 1, Manufacture of resin varnishes. [Example 13]

In addition to using 10 parts of naphthalene-based phenol resin ("SN485" manufactured by Nippon Steel Chemicals Co., Ltd., MEK solution with a hydroxyl equivalent of 215g/eq. and a solid content of 60% by mass) instead of 10 parts of a phenolic hardening resin having a triazine skeleton and a phenolic structure Agent ("LA-3018-50P" manufactured by DIC Co., Ltd., active group equivalent of about 151g/eq., 2-methoxypropanol solution with 50% solid content), the rest was performed in the same manner as in Example 1 to manufacture Resin varnish. [Example 14]

In addition to using 10 parts of an active ester compound ("HPC-8000-65T" manufactured by DIC Co., Ltd., a toluene solution with an active group equivalent of about 223 g/eq. and a solid content of 65% by mass) instead of 10 parts of phenol having a triazine skeleton and a phenolic structure Except for the hardening agent ("LA-3018-50P" produced by DIC Co., Ltd., about 151g/eq. of active group equivalent, 2-methoxypropanol solution of 50% solid content), the same operation was carried out as in Example 1, Manufacture of resin varnishes. [Comparative example 1]

Except not having used the chelate type epoxy resin ("EP-49-10P" by ADEKA Co., Ltd., epoxy equivalent 240g/eq.), it carried out similarly to Example 1, and manufactured the resin varnish. [Comparative example 2]

A chelate type epoxy resin ("EP-49-10P" manufactured by ADEKA Co., Ltd., epoxy equivalent 240 g/eq.) was not used. And, the liquid epoxy resin ("ZX1059" manufactured by Nippon Steel Sumitomo Metal Chemical Co., Ltd., a 1:1 mixture (mass ratio) of bisphenol A type epoxy resin and bisphenol F type epoxy resin, epoxy equivalent: 169 g/eq.) was changed to 6 parts. Except for the above matters, it carried out similarly to Example 1, and produced the resin varnish. [Comparative example 3]

A chelate type epoxy resin ("EP-49-10P" manufactured by ADEKA Co., Ltd., epoxy equivalent 240 g/eq.) was not used. And the quantity of the inorganic filler 1 was changed into 82 parts. Furthermore, a phenolic hardener having a triazine skeleton and a phenolic structure ("LA-3018-50P" manufactured by DIC Co., Ltd., an active group equivalent of about 151 g/eq., and a solid content of 50% in 2-methoxypropanol solution ) was changed to 18 parts. Except for the above matters, it carried out similarly to Example 1, and produced the resin varnish. [Comparative example 4]

A chelate type epoxy resin ("EP-49-10P" manufactured by ADEKA Co., Ltd., epoxy equivalent 240 g/eq.) was not used. And, the liquid epoxy resin ("ZX1059" manufactured by Nippon Steel Sumitomo Metal Chemical Co., Ltd., a 1:1 mixture (mass ratio) of bisphenol A type epoxy resin and bisphenol F type epoxy resin, epoxy equivalent: 169 g/eq.) was changed to 6 parts. Furthermore, 0.3 parts of a silane coupling agent containing a triazine functional group (manufactured by Shikoku Chemicals Co., Ltd. "VD-5", 2,4-diamino-6-triethoxy silyl triazine). Except for the above matters, it carried out similarly to Example 1, and produced the resin varnish. [Manufacture of resin sheet]

As a support, a polyethylene terephthalate film ("LUMIRROR R80" manufactured by Toray Co. ", thickness 38μm, softening point 130℃). The resin varnish produced in Examples and Comparative Examples was coated on the support with a die coater so that the thickness of the dried resin composition layer was 50 μm, and dried at 85° C. to 100° C. for 4 minutes to obtain a resin sheet. [Evaluation of Copper Foil Adhesion Strength] ＜Substrate treatment of copper clad laminates＞

A glass cloth base epoxy resin double-sided copper-clad laminate (copper foil thickness 18 μm, substrate thickness 0.8 mm, “R-1766” manufactured by Panasonic Corporation) having copper foil on the surface was prepared. Using a microetchant ("CZ8101" manufactured by MEC Co., Ltd.), etching was performed under the condition that the amount of copper etching was 2 μm, and both surfaces were roughened. The copper-clad laminate thus obtained is sometimes referred to as a "roughened copper-clad laminate". ＜Lamination of resin sheets＞

The resin sheets produced in Examples and Comparative Examples were laminated with a resin composition layer and a roughened copper clad layer using a batch-type vacuum pressure laminator (manufactured by Nikko-Materials Co., Ltd., two-stage stack laminator "CVP700"). Laminated on one side of a roughened copper clad laminate by board bonding. The lamination was carried out by depressurizing for 30 seconds to bring the air pressure below 13 hPa, and then pressing at 100° C. and a pressure of 0.74 MPa for 30 seconds. ＜Substrate treatment of copper foil＞

Copper foil (electrodeposited copper foil "3EC-III" manufactured by Mitsui Metal Mining Co., Ltd., thickness 35 μm) is immersed in a microetch ("MECetchBOND CZ-8100" manufactured by MEC Co., Ltd.) to roughen the glossy surface of the copper foil processing (etch 1 μm). ＜Lamination and hardening of copper foil＞

The support laminated on the resin sheet of the roughened copper-clad laminate was peeled off to expose the resin composition layer. The resin composition layer and the copper foil were laminated so that the roughened glossy surface was bonded to the resin composition layer. The lamination was carried out by depressurizing for 30 seconds to bring the air pressure below 13 hPa, and then performing pressing under the conditions of 100° C. and a pressure of 0.74 MPa for 30 seconds. Next, hot pressing was performed for 60 seconds at 100° C. and a pressure of 0.5 MPa under atmospheric pressure to smooth the resin composition layer. Furthermore, the resin composition was cured under the curing conditions of 100°C for 30 minutes, followed by 190°C for 90 minutes to obtain a layer structure of "roughened copper clad laminate/cured resin composition layer/copper foil". sample. <Measurement and evaluation of peel strength (peel strength) of copper foil>

A notch surrounding a portion with a width of 10 mm and a length of 100 mm was cut out on the copper foil. One end of this part was peeled off and clamped with a clamp (AUTOCOM type testing machine "AC-50C-SL" manufactured by TSE Co., Ltd.), and the load (kgf/ cm) to obtain the peel strength as the copper foil adhesion strength. [Evaluation of Si adhesion strength] ＜Lamination and hardening on silicon wafer＞

The resin sheets produced in Examples and Comparative Examples were bonded to silicon wafers in a batch-type vacuum pressure laminator (manufactured by Nikko-Material S Co., Ltd., two-stage stack laminator "CVP700") Laminated on one side of a 12-inch silicon wafer (thickness 775μm). The lamination was carried out by depressurizing for 30 seconds to bring the air pressure below 13hPa, and then pressing at 100°C and a pressure of 0.74MPa for 30 seconds. After lamination, the support body of the resin sheet is peeled off. The resin composition was cured under the curing conditions of 100° C. for 30 minutes, followed by 190° C. for 90 minutes, to obtain a laminate having a layer configuration of “silicon wafer/resin composition cured product layer”. ＜Preparation of test pieces＞

The resulting laminate was cut into 1 cm squares, and placed on a ceramic backing plate (11.4 cm squares, P/N901450) with epoxy adhesive with the hardened layer facing upward. Furthermore, epoxy adhesive is used to fix the stud pin (nail-shaped mold; the diameter of the bonding surface is 2.7 mm, P/N901106) on the hardened layer, and heated at 150°C for 1 hour, and the stud pin (studpin) Adhesive to the hardened layer. ＜Stud pull test＞

Using a stud pull tester (ROMULUS, manufactured by Quad Group Inc.), the stud pin is pulled at a speed of 2kgf/sec in a direction perpendicular to the main surface of the hardened layer, and the load value when the hardened layer is peeled off is measured. (kgf/cm ² ) as Si adhesion strength. [Warping evaluation]

The resin sheets produced in Examples and Comparative Examples were bonded to silicon wafers using a batch-type vacuum pressure laminator (manufactured by Nikko-Material S Co., Ltd., two-stage stack laminator "CVP700") Laminated on the entire single side of a 12-inch silicon wafer (thickness 775μm). The support of the resin sheet is peeled off to expose the resin composition layer, further resin sheets are laminated on the surface of the resin composition layer in the same manner, and the support is peeled off. By the aforementioned lamination, two resin composition layers (total thickness 100 μm) were formed on one side of a 12-inch silicon wafer. Furthermore, lamination was carried out under the same conditions as in the aforementioned [evaluation of Si adhesion strength].

Heating in an oven at 100°C for 30 minutes, followed by heating at 190°C for 90 minutes, cured the resin composition layer to obtain a laminate having a layer composition of "silicon wafer/resin composition hardened layer". The end of the obtained laminate was pressed against a horizontal table. The distance between the end of the wafer on the opposite side to the pressed end and the table was measured as the amount of warpage. And, the warpage was evaluated according to the following criteria; Evaluation criteria for warpage: "○": The amount of warpage is not less than 0 mm and not more than 1.5 mm (1500 μm); "×": The amount of warping is greater than 1.5 mm. [Measurement of modulus of elasticity]

The resin sheets produced in Examples and Comparative Examples were thermally cured at 190° C. for 90 minutes, and the support was peeled off to obtain a sheet-shaped cured product. According to Japanese Industrial Standards (JISK7127), the tensile test of the cured product was performed with a Tensilon universal testing machine (manufactured by A&D Co., Ltd.), and the modulus of elasticity (tensile modulus) at room temperature of the cured product was measured. [Measurement of melt viscosity]

The supports were peeled off from the resin sheets produced in Examples and Comparative Examples to obtain resin composition layers. By compressing the resin composition layer using a die, measurement pellets (18 mm in diameter, 1.0 g to 1.1 g) were produced. Then, the measurement of the minimum melt viscosity was performed about the particle|grains for this measurement using the dynamic viscoelasticity measuring apparatus ("Rheosol-G3000" by UBM Co., Ltd.). Specifically, for 1 g of the particles for measurement, the dynamic viscoelasticity was measured by using a parallel plate with a diameter of 18 mm in a temperature range from 60° C. to 200° C. from the initial temperature, and the minimum value was obtained. The measurement conditions were set at a heating rate of 5° C./min, a measurement temperature interval of 2.5° C., a vibration frequency of 1 Hz, and a deformation of 5 deg. [result]

The results of the above-mentioned Examples and Comparative Examples are shown in the following tables. In the table below, the abbreviations have the following meanings; (B) content rate: (B) content rate of inorganic filler material; Active group ratio: the active group number of (D) hardening|curing agent when the epoxy group number of (A) epoxy resin was set as 1.

100: Semiconductor chip packaging 110: Semiconductor wafer 120: sealing layer 130: Rewiring formation layer 140: Redistribution layer 150: solder mask 160: Bump

[ Fig. 1 ] is a cross-sectional view schematically showing a fan-out type WLP as an example of a semiconductor chip package according to an embodiment of the present invention.

100: Semiconductor chip packaging

110: Semiconductor wafer

120: sealing layer

130: Rewiring formation layer

140: Redistribution layer

150: solder mask

160: Bump

Claims (13)

A resin composition comprising (A) epoxy resin, (B) inorganic filler and (C) elastomer, (A) epoxy resin comprising: (A-1) containing epoxy group and having chelate compound Epoxy resin that forms the structure of the ability. The resin composition according to claim 1, wherein the modified amount of the chelate compound of the component (A-1) is 0.3% by mass to 10% by mass. Such as the resin composition of claim 1, wherein the ratio W(A-1)/W(C) of the mass W(A-1) of the component (A-1) to the mass W(C) of the component (C) is 0.01～1.0. The resin composition according to claim 1, wherein the amount of the component (B) is 40% by mass or more with respect to 100% by mass of non-volatile components of the resin composition. The resin composition according to claim 1, wherein the component (C) has a number average molecular weight of 1000 or more. The resin composition according to claim 1, further comprising (D) a curing agent. The resin composition according to claim 1, further comprising (E) a hardening accelerator. The resin composition as claimed in item 1 is used for sealing layer. A cured product, which is a cured product of the resin composition according to any one of claims 1-8. A resin sheet comprising: supports, and A resin composition layer comprising the resin composition according to any one of claims 1 to 8 formed on the support. A circuit board comprising a cured product of the resin composition according to any one of claims 1-8. A semiconductor chip package comprising a cured product of the resin composition according to any one of claims 1-8. A semiconductor device comprising the circuit substrate of claim 11 or the semiconductor chip package of claim 12.

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