TW202316679A - Optoelectronic product and manufacture method thereof - Google Patents

Abstract

Embodiments of the invention provide a category carrier, on which LED sections are arranged to form an array with rows and columns. Each LED section is assigned to one of categories. Each row has two or more LED sections belonging to two or more different categories. Each column has two or more LED sections belonging to two or more different categories. The category carrier can be used to manufacture an LED display.

Description

Optoelectronic product and its manufacturing method

The present invention mainly relates to an optoelectronic product and a related manufacturing method, and in particular relates to an optoelectronic product for manufacturing an LED display and a manufacturing method thereof.

Light-emitting diode (Light-Emitting Diode, LED) is an optoelectronic semiconductor element with good characteristics such as low energy consumption, low heat generation, long operating life, shockproof, small size, and fast response, so it is suitable for various lighting and display use.

When the semiconductor process technology continues to break through, the size of the LED chip (chip) is lower than the naked eye, for example: less than 100μm, 50μm, or 30μm, and its use is no longer limited to the backlight of the LCD display. LED grains of R, G, and B colors can be used directly to form a pixel, and many pixels can form an LED display. This means that the filter and liquid crystal layer in a typical liquid crystal panel are no longer needed. And because the LED grain itself will emit light, there is no need for an additional backlight module.

However, for a 4K resolution LED display, about 24 million LED dies need to be installed. To transfer millions or even tens of millions of LED chips from the carrier or substrate to the panel of the display, and arrange them neatly, this is the so-called mass transfer. How to efficiently transfer large quantities so that the transfer result has high precision, high yield, and low cost is the goal that the industry is striving for.

The invention discloses a manufacturing method of optoelectronic products, including: providing at least one growth substrate on which a plurality of light-emitting element blocks are formed, each light-emitting element block includes a plurality of light-emitting elements; designating each light-emitting element block as several sorting one of them; and, transferring at least a few of the light-emitting element blocks from each growth substrate to a sorting carrier, arranged in a plurality of rows and a plurality of columns. Each row has at least two light-emitting element blocks, respectively belonging to different first and second categories among the categories. Each column has at least two light-emitting element blocks, which respectively belong to the first and second categories.

The invention discloses an optoelectronic product, which includes a classification carrier board and a plurality of light-emitting element blocks. The light-emitting element blocks are placed on the classification carrier board and arranged in a plurality of rows and a plurality of columns. Each light-emitting element block includes a plurality of light-emitting elements. Each light-emitting element block has a photoelectric characteristic type, and the photoelectric characteristic type on the sorting carrier conforms to a predetermined non-flat block characteristic pattern.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to drawings so that those skilled in the art of the present invention can fully understand the spirit of the present invention. The present invention is not limited to the following embodiments, but can be implemented in other forms. In this specification, there are some same symbols, which represent elements with the same or similar structure, function, and principle, and can be inferred by those with general knowledge in the industry based on the teaching of this specification. For the sake of brevity in the description, elements with the same symbols will not be repeated.

In an embodiment of the present invention, a sorting carrier is provided, and the sorting carrier has LED blocks arranged in rows and columns, and each LED block has LED dies arranged in a matrix. Each LED block is assigned to a category according to a detection result. Each row of the classification carrier has a plurality of LED blocks assigned to at least two different classifications; each column of the classification carrier has a plurality of LED blocks assigned to at least two different classifications. The classification carrier is an optoelectronic product and can be used to manufacture an LED display.

The sorting carrier board can increase the capacity utilization rate of LED grains, and can also improve the LEDs on the sorting carrier board. On the other hand, using the method of the present invention can also increase the speed of LED die transfer, thereby increasing the speed of mass production of an LED display.

Please refer to Figure 1 and Figure 2 together. FIG. 1 shows a manufacturing method 100 implemented according to the present invention; FIG. 2 shows a growth substrate 110 implemented according to the present invention, and six adjacent LED sections in the growth substrate 110 for illustration. S1-S6. Although embodiments of the invention are implemented with LED dies, the invention is not limited thereto. In other embodiments, other semiconductor components such as photodiodes or integrated circuit components may be used for implementation.

In the manufacturing method 100 of FIG. 1 , step S02 provides the growth substrate 110 of FIG. 2 on which several LED blocks 112 are formed, and each LED block 112 has several LED dies 114 with approximately the same photoelectric characteristics and the same size. For example, among the LED blocks S1-S6, each LED block has 4×4 LED dies 114 arranged in a matrix and formed on a growth substrate 110 . Although the number of embodiments of the invention is implemented in 4x4, the invention is not limited to this number. In one embodiment, the size of a block is less than 10×10mm ² , for example, between 2×2mm ^2˜6 ×6mm ² , or between 5×5mm ^2˜8 ×8mm ² .

The material of the LED die 114 includes a first semiconductor layer (not shown), an active layer (not shown), and a second semiconductor layer (not shown). The first semiconductor layer and the second semiconductor layer can provide electrons and holes respectively, so that electrons and holes can recombine in the active layer to emit light. The first semiconductor layer, the active layer, and the second semiconductor layer may comprise III-V group semiconductor materials, such as AlxInyGa(1-x-y)N or AlxInyGa(1-x-y)P, wherein 0≦x, y≦1; (x +y)≦1. Depending on the material of the active layer, the LED die can emit a red light with a peak between 610 nm and 650 nm, a green light with a peak between 530 nm and 570 nm, and a green light with a peak between 500 nm and 485 nm. Cyan, blue light with a peak between 450 nm and 490 nm, violet light with a peak between 400 nm and 450 nm, or ultraviolet light with a peak between 280 nm and 400 nm.

The material of the growth substrate 110 can be germanium (Ge), gallium arsenide (GaAs), indium phosphorus (InP), silicon (Si), glass, sapphire (Sapphire), silicon carbide (SiC), lithium aluminate (LiAlO ₂ ), zinc oxide (ZnO), gallium nitride (GaN), aluminum nitride (AlN), etc. There are horizontal cutting lines (or called horizontal boundary lines) 116H and vertical cutting lines (or called vertical boundary lines) 116V between the LED blocks 112 and the LED blocks 112 . The horizontal scribe line 116H has a scribe line width 117V. The vertical scribe line 116V has a scribe line width 117H.

The growth substrate 100 has a vertical section pitch 118V and a horizontal section pitch 118H. The block vertical line pitch (vertical section pitch) 118V is the longitudinal length of one LED block 112 , as shown in FIG. 2 . For example, the block vertical line distance 118V may be the distance between the center horizontal line of the LED block 112 and the center horizontal line of another adjacent LED block 112 above and below. Block vertical line distance 118V can also be the upper left corner of one LED block 112, to the upper left corner of another LED block 112 adjacent up and down, the distance between the two; The spacing between the centerlines of two horizontal scribe lines 116H. Similarly, the block horizontal pitch 118H refers to the lateral width of an LED block 112 , which may be the distance between the centerlines of two adjacent vertical cutting lines 116V.

Step S04 of FIG. 1 performs binning on these LED blocks 112 , and designates each LED block 112 as one of several binnings. For example, automatic optical inspection (automatic optical inspection, AOI), luminescence test (Photoluminescence, PL), and/or electroluminescence test (Electroluminescence, EL) are performed on all LED dies 114 in each LED block 112. ). In another embodiment, in order to improve the test efficiency, the LED die 114 in each LED block 112 is sampled for electroluminescence test (Electroluminescence, EL), for example: only 5% of one LED block 112, 10%, or 30% of the LED dies 114 are tested for EL. Based on the results of the test, a classification is assigned to the tested LED block 112 . The classification basis can be one of the average photoelectric characteristics of the LED die 114 in an LED block 112 . For example, the optoelectronic characteristic may be, but not limited to, peak or/dominant wavelength, luminance intensity level, and/or chromaticity scale. FIG. 3 illustrates the classification results of the LED block 112 on the growth substrate 110, wherein three classifications ‶B1 ″, ‶B2 ″, and ‶B3 ″ respectively represent all or part of the LED crystal grains 114 in an LED block 112. The median or average of the emitted wavelengths is approximately W1, W2, and W3. Another category‶X" indicates that the photoelectric characteristic standard or appearance of an LED block does not meet the manufacturing standard and should be rejected. The optoelectronic characteristic standard may be forward voltage, reverse voltage, luminous intensity, or emission wavelength. For example, the LED block 112A is designated as a category‶B3", which means that the LED dies 114 in the LED block 112A, their individual emission wavelengths will fall around W1, and the average value is about W1. The LED block 112B is designated as category ‶X″, which means that the photoelectric characteristic standard or appearance of the test does not meet the manufacturing standard. For example, the results of the AOI, PL, and EL tests of too many LED dies 114 do not meet the production standards and are considered invalid or defective, or the wavelengths of too many LED dies 114 do not fall within the scope of classification Inside. In an LED block 112A, perhaps due to process variation, there will be one or two specific LED dies 114 whose emission wavelength is comparable to that of other LED dies 114 located in the same LED block 112 The ground is different, but this will not affect the emission wavelength category of the LED block 112, because the emission wavelength category is the average value of the emission wavelengths of all LED chips 114 in the LED block 112.

Please refer to Figure 1 and Figure 4. In step S06 of FIG. 1 , these LED blocks 112 are transferred to several auxiliary bin carriers 120 according to their individual classification to form a block array. A block array includes a plurality of LED blocks 112 arranged in an array on the auxiliary sorting carrier 120 . There are only a plurality of LED blocks 112 of the same classification on each auxiliary classification carrier board 120 . For example, on the growth substrate 110, the LED blocks 112 classified into -B1", -B2", and -B3" are respectively transferred to three different auxiliary sorting carriers 120. Step S06 can transfer one at a time The LED block 112 can also transfer multiple LED blocks 112 of the same classification at one time. Figure 4 shows an example of an auxiliary sorting carrier 120, on which a plurality of LED blocks 112 classified as "B1" are placed in the form of an array Arranged on the auxiliary sorting carrier 120 to form a block matrix. The material of the auxiliary sorting carrier 120 can be silicon, glass, sapphire, silicon carbide, thermal release tape, UV release tape, chemical release tape, heat-resistant tape , blue film (Blue Tape), or tape with a power release layer (DRL). Transfer tools can include pick-and-place head, stamp, roller, vacuum head, magnetic head, laser Laser lift-off, laser ablation, and/or a combination of the aforementioned methods.

FIG. 4 also shows the block vertical pitch 122V and the block horizontal pitch 122H on the auxiliary sorting carrier 120 . The block vertical distance 122V is the distance between the center horizontal line of the LED block 112 and the center horizontal line of another adjacent LED block 112 on the auxiliary sorting carrier 120 . The block horizontal distance 122H is the distance between the center vertical line of the LED block 112 and the center vertical line of another adjacent LED block 112 on the auxiliary sorting carrier 120 . The block vertical line spacing 122V in FIG. 4 may be equal to or not equal to the block vertical line spacing 118V in FIG. 2 . Similarly, the block horizontal line spacing 122H in FIG. 4 may be equal to or not equal to the block horizontal line spacing 118H in FIG. 2 .

Please refer to Figure 1, Figure 5 and Figure 6. FIG. 5 shows a block array with a predetermined category pattern 130 in one embodiment; FIG. 6 shows a category carrier 140 produced according to the category pattern 130 . Step S08 of FIG. 1 transfers the differently classified LED blocks 112 from several auxiliary sorting carriers 120 to a sorting carrier 140 according to the preset sorting pattern 130 in FIG. 5 . The sorting pattern 130 in FIG. 5 shows an example of a block array with a fixed arrangement in one embodiment, which is a 3x3 array, and each row and each column has a B1, B2, and B3 LED block. The quantity and arrangement of the sorting patterns in this embodiment are only examples, and the present invention is not limited to the quantity and arrangement. The sorting carrier 140 in FIG. 6 is a block array produced according to the sorting pattern 130 in FIG. 5 , and the LED blocks 112 thereon are arranged in several columns Y1, Y2 . . . and several rows X1, X2 . . . The sorting pattern 130 appears repeatedly on the sorting carrier 140 , for example, the nine LED blocks 112 in the upper left area 142 reproduce the sorting pattern 130 in FIG. 5 . Each row and each column of the classification carrier 140 in FIG. 6 has more than two types of LED blocks 112 . Each row contains LED blocks belonging to category B1 and LED blocks belonging to category B2. Each column contains LED blocks belonging to category B1 and LED blocks belonging to category B2. The material of the sorting carrier 140 can be silicon, glass, sapphire, silicon carbide, thermal release tape, UV release tape, chemical release tape, heat-resistant tape , or tape with a dynamic release layer (DRL), or blue film (Blue Tape).

The sorting pattern 130 only gives arrangement rules between the LED blocks 112 , but does not limit the distance between the LED blocks 112 . In other words, the distance between the LED blocks 112 on the sorting carrier 140 in FIG. 6 does not necessarily need to be equal to the distance between the LED blocks in the sorting pattern 130 . FIG. 6 also shows the block vertical pitch 144V and the block horizontal pitch 144H on the sorting carrier 140 .

It can be seen from the classification pattern 130 of FIG. 5 that in each row and each column of the block array of the classification carrier 140 of FIG. The number of blocks 112 is about the same, 1:1:1. The ratio between different categories in this embodiment is only an example, and the present invention is not limited to this ratio, but the numbers in the ratio must be positive integers. For example, the number of LED blocks 112 in category B1: the number of LED blocks 112 in category B2: the number of LED blocks 112 in category B3 can be 1:2:3, 1:3:5, 1:5:7 or other practices a reasonable ratio.

Step S08 may transfer one LED block 112 at a time, or transfer multiple LED blocks 112 of the same classification at a time.

In one embodiment, step S08 in FIG. 1 is followed by step S06 , that is, each LED block 112 on the sorting carrier 140 in FIG. 6 is transferred from a single auxiliary sorting carrier 120 . For example, the LED blocks 112 classified as B1 in FIG. 6 are all transferred from an auxiliary sorting carrier 120 that only has the LED blocks 112 classified as B1. Similarly, the LED blocks 112 classified as B2 in FIG. 6 are all transferred from an auxiliary sorting carrier 120 having only LED blocks 112 classified as B2. In another embodiment, step S06 can be omitted, and step S08 continues step S04, that is, each LED block 112 in FIG. 6 is directly transferred from the growth substrate 110 without first being transferred to the auxiliary classification carrier 120 on.

In one embodiment, the sorting carrier 140 in FIG. 6 can then be inspected and repaired to improve the yield of each LED block 112 on the sorting carrier 140 . For example, electroluminescent tests are performed on all LED dies 114 on the classification carrier 140, and the LED dies 114 that do not meet the predetermined specifications are repaired or replaced, so that on the classification carrier 140, roughly each The LED dies 114 in the LED blocks 112 are all qualified products.

Please refer to Figures 1, 7A and 7B. Step S10 in FIG. 1 is continued with step S08, select a portion of LED chips 114, and transfer them from the sorting carrier 140 to the auxiliary pixel carrier 150. 7A and 7B show the steps of how the LED die 114 is transferred from the sorting carrier 140 to the auxiliary pixel carrier 150 in one implementation. Fig. 7A shows that the pick-up head 146 picks up the first group of LED dies (including several LED dies 114) at a time and places them on the auxiliary pixel carrier 150, and each LED die 114 is in a corresponding position. The mth column and the nth row of the LED block 112 are both positive integers, for example, the first column and the first row. In other words, the pick-up head 146 can pick up the LED die 114 at a predetermined position in each LED block 112 from several LED blocks 112 .

The sorting carrier 140 in FIG. 7B shows that the first group of LED dies 114 has been transferred, and the pickup head 146 picks up another group of LED dies containing the same position in several LED blocks 112 (for example: column 1 row 2 ) LED dies 114 are placed on the auxiliary pixel carrier 150 adjacent to the first group of LED dies 114 placed previously. FIG. 7B also shows that several batches of LED dies 114 are arranged on the auxiliary pixel carrier 150 according to a predetermined direction. In other words, after the first batch of LED dies 114 are placed on the auxiliary pixel carrier 150, the next batch of LED dies 114 are displaced by a predetermined distance relative to the first batch of LED dies 114 and then placed on the auxiliary pixel on the carrier board 150. As shown in FIG. 7B , several batches of LED chips 114 are arranged on the auxiliary pixel carrier 150 from left to right, but the invention is not limited thereto. In other embodiments, several batches of LED chips 114 are arranged on the auxiliary pixel carrier 150 from right to left, from top to bottom or from bottom to top, and finally form a matrix on the auxiliary pixel carrier 150 The LED die 114 is shown in FIG. 8 , and the distance between adjacent LED dies is larger than the distance between the sorting carrier 140 . The auxiliary pixel carrier 150 can be made of silicon, glass, sapphire, silicon carbide, thermal release tape, UV release tape, chemical release tape, heat-resistant tape, Or a tape with a dynamic release layer (DRL), or a blue film (Blue Tape). Each LED die 114 corresponds to a sub-pixel in the display.

FIG. 8 shows an auxiliary pixel carrier 150 with LED die 114 of a single color, in which the matrix has a pixel vertical pitch 154V and a pixel horizontal pitch 154H. The pixel vertical pitch 154V in FIG. 8 is equal to the block vertical pitch 144V in FIG. 6 . In some embodiments, the pixel vertical pitch 154V is not equal to the block vertical pitch 122V in FIG. 4 . Similarly, the pixel horizontal pitch 154H in FIG. 8 is equal to the block horizontal pitch 144H in FIG. 6 . In some embodiments, the pixel horizontal pitch 154H is not equal to the block horizontal pitch 122H in FIG. 4 . The vertical pixel spacing 154V and the horizontal pixel spacing 154H are equal to the pixel spacing on the display.

Please refer to Figure 1 and Figure 9A. Step S12 in FIG. 1 is continued with step S10, select a portion of LED chips 114, and transfer them from the auxiliary pixel carrier 150 to the pixel carrier 160. FIG. 9A shows a pixel carrier 160 implemented according to an embodiment of the present invention. The pixel carrier 160 has a matrix composed of a plurality of pixels, and each pixel has a blue LED die 114B, a red LED die 114R, and a green LED die 114G. Wherein, the blue LED die 114B can be transferred in batches from the auxiliary pixel carrier 150 having only the blue LED die 114B, and the pixel vertical distance 164V and the pixel horizontal distance 164H are the same as those of the auxiliary pixel carrier 150. The pixel vertical pitch 154V is the same as the pixel horizontal pitch 154H. The green LED chips 114G can be transferred in batches from the auxiliary pixel carrier 150 with only the green LED chips 114G, and the vertical pixel spacing 164V and the horizontal pixel spacing 164H are perpendicular to the pixels on the auxiliary pixel carrier 150 The pitch 154V is the same as the pixel horizontal pitch 154H. The red LED chips 114R can be transferred in batches from the auxiliary pixel carrier 150 that only has the red LED chips 114R, and the pixel vertical distance 164V and the pixel horizontal distance 164H are perpendicular to the pixels on the auxiliary pixel carrier 150 The pitch 154V is the same as the pixel horizontal pitch 154H. The pixel carrier 160 can also be manufactured according to the manufacturing method 100 in FIG. 1 , skipping S10, and continuing S08 from S12. For example, as previously explained, blue LED die 114B can be batch transferred from sorting carrier 140 having only blue LED die 114B, and green LED die 114G can be batch transferred from a sorting carrier 140 having only green LED die. The sorting carrier 140 of the die 114G, the red LED die 114R can be batch transferred from the sorting carrier 140 having only the red LED die 114R. The vertical pixel pitch 164V and the horizontal pixel pitch 164H in FIG. 9A are respectively equal to the block vertical pitch 144V and the block horizontal pitch 144H in FIG. 6 . The pixel vertical pitch 164V and the pixel horizontal pitch 164H are equal to the pixel pitch on the display. The pixel carrier 160 can be made of silicon, glass, sapphire, silicon carbide, thermal release tape, UV release tape, chemical release tape, heat-resistant tape, or It is a tape with a dynamic release layer (DRL), or a blue film (Blue Tape). In another embodiment, the pixel carrier 160 may be a circuit board with conductive lines, a TFT substrate, a redistribution layer (redistribution layer; RDL) substrate, or a pixel package substrate used in a display. . Each LED die 114 corresponds to a sub-pixel in the display. In a display application, a display is assembled by using several pixel carriers 160 , and the crystal grains on each pixel carrier 160 may come from different growth substrates. Although the LED crystal grains 114 of a single pixel carrier 160 in FIG. The combination ratio and/or arrangement of the LED dies 114 are the same. For example, it is the same as the classification pattern 130 . In this way, visually, the display effects of different pixel carriers 160 are consistent or close to each other. At the junction of the pixel carrier 160, there is no difference in color or brightness. It is possible to make the display have the advantage of uniform display.

In each pixel of FIG. 9A , the blue LED grain 114B, the red LED grain 114R, and the green LED grain 114G are arranged in an oblique line, for example, from the upper left to the lower right (or reverse), the blue LED grain 114B , the red LED die 114R, and the green LED die 114G are arranged in sequence, but the present invention is not limited thereto. 9B and 9C illustrate a two-pixel carrier board 160, in which blue LED chips 114B, red LED chips 114R, and green LED chips 114G are respectively arranged in a horizontal line and a vertical line, for example, from left to right (or Reverse), blue LED grain 114B, red LED grain 114R, and green LED grain 114G are arranged in sequence; from top to bottom (or reverse), blue LED grain 114B, red LED grain 114R, It is arranged in sequence with the green LED die 114G.

In one embodiment, there is a solder material on the electrode 113 on each LED die 114 , and the solder material may be a low-temperature solder material, including tin (Sn) and/or bismuth (Bi). Low-temperature bonding can be used when subsequent LED dies are bonded to electrode pads in displays or packages. In this way, high-temperature bonding can be avoided, because the thermal expansion coefficient (coefficient of thermal expansion; CTE) of the LED die and the display or the package body does not match, resulting in poor bonding.

The manufacturing method 100 of FIG. 1 and the sorting carrier 140 of FIG. 6 can increase the capacity utilization of LED dies. The sorting carrier 140 can combine LED blocks 112 of different sorts together and apply them on a display. When avoiding a single class, classes not selected for use on the display may be discarded or create manufacturer's inventory. In other words, with a few exceptions (eg, non-compliance, failure, etc.), LED die scattered in various categories can be used in displays. For example, on the growth substrate 110 as shown in FIG. 3 , the largest number of category B1 LED blocks 112 are mainly distributed in the middle area of the growth substrate 110 . If a pixel carrier is only allowed to use the LED dies 114 in the B1 LED block 112, then the LED blocks 112 classified into B2 and B3 cannot be used, thereby reducing the overall capacity utilization.

The manufacturing method 100 of FIG. 1 can efficiently produce the classification carrier 140 with a high yield. In step S04, through a rough test and inspection, the LED blocks 112 that do not meet the specifications, that is, the LED blocks 112 of the category X, have been rejected. Therefore, the LED blocks 112 transferred to the classification carrier 140 will be There are fewer defective LED dies 114 . And these small amount of defective LED dies 114 can be optionally repaired one by one in step S08 to produce sorting carrier 140 with higher yield. The LED blocks 112 of classification X may theoretically have a large number of defective LED dies 114. If they are not initially eliminated before being transferred to the classification carrier, after being transferred to the classification carrier, the LED dies 114 of each LED block 112 Both need to be inspected and repaired, which will consume a considerable amount of repair time, making the production speed of the pixel carrier 160 slow.

The sorting carrier 140 allows the auxiliary pixel carrier 150 or the pixel carrier 160 to be produced quickly. As exemplified in FIGS. 7A, 7B, and 9A, the LED die 114 on the classification carrier 140 can be transferred to the auxiliary pixel carrier 150 or the pixel carrier 160 in batches. As long as the pick-up head 146 in FIGS. 7A and 7B can pick up a sufficient amount of LED chips 114 at one time, the auxiliary pixel carrier 150 or pixel carrier 160 can be produced quickly.

10 and 11 respectively show the characteristic distribution curve of the LED die 114 in a sub-row of the LED block row Y9 in FIG. 6 and the characteristic distribution of the LED die 114 in a sub-row of the LED block row X3. curve. In one embodiment, the characteristic distribution curve is the relationship between emission wavelength and position. The LED blocks 112 in the block column YA and the block row XA of the classification carrier 140 in FIG. 6 are represented by block BL (YA, XA) below. As shown in FIG. 6, each LED block 112 (LED die 114 in it) is classified according to its emission wavelength category. The emission wavelength category referred to herein may be the median or average value of the emission wavelengths of all or part of the LED dies 114 in an LED block 112 . The classification of the block BL (Y9, X1) in Fig. 6 is ‶B1", which means that the median or average value of the emission wavelengths of all or part of the LED crystal grains 114 in the block BL (Y9, X1) is W1, also That is, the emission wavelength category of the block BL (Y9, X1) is W1. Similarly, the emission wavelength category of the block BL (Y9, X2) in Fig. 6 is W2, and so on. Fig. 10 shows the classified carrier board in Fig. 6 The distribution relationship between the radiation wavelength of one of the block columns Y9 and the position of the LED crystal grain in 140. The black dot in the figure represents an LED crystal grain 114, and the figure presented by the distribution relationship and the number of LED crystal grains 114 are only examples or for example Simplified description, not in order to limit the scope of the present application.There are a plurality of sub-columns and sub-rows made up of LED grains 114 in an LED block 112 in Fig. 6, for example, with reference to Fig. 2, block S1 comprises 4 sub-rows Rows and 4 sub-columns, each sub-row contains 4 LED crystal grains 114, and each sub-column contains 4 LED crystal grains 114. As shown in Figure 10, the LED crystal grains 114 in the specific sub-column in block column Y9 in Figure 6 The emitted wavelength will change regularly with the physical position of the LED block 112 to which the LED grain 114 belongs, and this regular change can be visually expressed as a repeated stepped pattern. The smallest unit pattern of this stepped pattern can be Up stairs (from bottom left to top right), down stairs (from top left to bottom right), or a combination of up and down stairs. For example, Figure 10 shows a staircase pattern that includes a repeated descending staircase pattern, which represents the block row X1 The LED crystal grains 114 belong to the same emission wavelength category W1, and similarly, the LED crystal grains 114 of block rows X2～X10 also belong to the same emission wavelength category respectively. The wavelength fluctuation range of the LED crystal grains 114 in a single emission wavelength category is about ± A%, for example, A=5, 10, or 15. Between block BL (Y9, X1) and block BL (Y9, X2), between block BL (Y9, X2) and block BL (Y9, X3) ) There will be a discontinuous wavelength change, the discontinuous wavelength change range is about ± B%, and B is about 2, 3, 4, 5, 6 times of A. The wavelength change range here refers to adjacent The absolute value of the wavelength difference between the two LED crystal grains 114 and the wavelength percentage (Percentage) of the first LED crystal grain.

BL(Y9, X1), BL(Y9, X2), and BL(Y9, X3) collectively represent the first wavelength distribution block 183a. Similarly, BL(Y9, X4), BL(Y9, X5), and BL(Y9, X6) collectively display a second wavelength distribution block 183b whose distribution pattern is similar to that of the first wavelength distribution block 183a. BL(Y9, X7), BL(Y9, X8), and BL(Y9, X9) jointly display the third wavelength distribution block 183c, whose distribution pattern is similar to that of the first wavelength distribution block 183a and the second wavelength distribution block 183b . Taking Figure 10 as an example, the intersection of different wavelength distribution blocks, that is, BL (Y9, X3) and blocks BL (Y9, X4), BL (Y9, X6) and blocks BL (Y9, X7), BL ( There are relatively obvious discrete wavelength changes 182a, 182b, 182c between Y9, X9) and the block BL (Y9, X10). In other words, the wavelength distribution of LED crystal grains in any sub-column on the classification carrier 140 has multiple similar wavelength distribution blocks, and a single wavelength distribution block has multiple discontinuous wavelength distributions (that is, different emission wavelengths). category transition region).

FIG. 11 shows the distribution relationship between one emission wavelength and the position of the LED die in the block row X3 of the sorting carrier 140 in FIG. 6 . FIG. 11 shows that the LED dies 114 in the block row Y1 belong to a single emission wavelength category W1 , and similarly, the LED chips 114 in the block rows Y2 - Y9 respectively belong to a single emission wavelength category. The variation range of the wavelength of the LED die 114 in a single emission wavelength category is about ±A%, for example, A=5, 10, or 15. There will be discontinuous wavelength changes between block BL (Y1, X3) and block BL (Y2, X3), between block BL (Y2, X3) and block BL (Y3, X3), discontinuous The wavelength change is about ±B%, and B is 2, 3, 4, 5, 6 times of A. BL(Y1, X3), BL(Y2, X3), and BL(Y3, X3) collectively display the fourth wavelength distribution block 183d. Similarly, BL(Y4, X3), BL(Y5, X3), and BL(Y6, X3) collectively display a fifth wavelength distribution block 183e whose distribution pattern is similar to that of the fourth wavelength distribution block 183d. BL (Y7, X3), BL (Y8, X3), BL (Y9, X3) jointly display the sixth wavelength distribution block 183f, and its distribution pattern is the same as that of the fourth wavelength distribution block 183d and the fifth wavelength distribution block 183e resemblance. Taking Figure 11 as an example, the junctions of different wavelength distribution blocks, that is, between BL (Y3, X3) and block BL (Y4, X3), BL (Y6, X3) and block BL (Y7, X3) will be There are relatively distinct discrete wavelength changes 182d, 182e. In other words, the wavelength distribution of any row of LED dies on the sorting carrier 140 has multiple similar wavelength distribution blocks, and a single wavelength distribution block has multiple discontinuous wavelength distribution locations.

As shown in FIG. 6 , the relationship between the emission wavelength of any column or any row of LED crystal grains 114 in the classification carrier 140 and its position, each row and each column of the classification carrier 140 will have repeated discontinuous wavelength changes. , as shown by the wavelength changes 182a~182e in FIGS. Each column has at least two types of LED blocks 112 .

Please refer to Figures 2 and 12. 12 is a schematic cross-sectional view along the line AA-AA in FIG. 2 , which shows that 4 LED crystal grains 114 belonging to LED block S1 and the other 4 LED crystal grains 114 belonging to LED block S4 are formed in the growth process. on the substrate 110. FIG. 12 shows block vertical spacing 118V from the centerline of one horizontal scribe 116H to the centerline of another adjacent horizontal scribe 116H. The horizontal scribe line 116H has a scribe line width 117V. The vertical die gap 115V is the distance between two adjacent LED dies 114 in one LED block in FIG. 12 .

13A-13E show schematic diagrams of the steps of transferring the LED die 114 from the growth substrate 110 to the auxiliary pixel carrier 150 according to an embodiment of the present invention.

FIG. 13A shows dicing tool 126 cutting through growth substrate 110 from horizontal dicing lanes 116H such that LED blocks 112 are separated from each other. After separation, the LED dies 114 within each LED block 112 are still co-attached to a single portion of the growth substrate 110 . At this point, each LED block 112 is assigned to one of several categories.

FIG. 13B shows the LED block 112 in FIG. 13A . After being turned upside down, the LED block 112 is adhered to the auxiliary sorting carrier 120 through the adhesive layer 128 according to the category of the LED block 112 . At this time, the LED block 112 still has a single part of the growth substrate 110, and the single part of the growth substrate 110 is not in contact with the adhesive layer 128, so that the LED die 114 is connected to the electrode 113 with the electrode 113 facing down. The adhesive layer 128 is contacted and fixed on the auxiliary sorting carrier 120 . As shown in Figure 13B. There is only one sort of LED block 112 on each auxiliary sorting carrier 120 .

Figure 13C shows the growth substrate 110 removed. For example, laser lift-off can be used, so that the LED block 112 in FIG. 13B only has the LED die 114 without the growth substrate 110 . FIG. 13C shows a block vertical section gap (vertical section gap) 123V, which is approximately the distance between adjacent LED dies 114 belonging to two LED blocks 112 in FIG. 13C . Because the outermost edge of the part of the growth substrate 110 after cutting will still exceed the outermost edge of the outermost LED crystal grain, when the LED block 112 is arranged on the auxiliary sorting carrier 120 as shown in FIG. The vertical section gap 123V prevents the growth substrates 110 of adjacent LED blocks 112 from colliding with each other. In FIG. 13C , the block vertical pitch 123V is greater than the chip vertical pitch 115V. For example, when the chip vertical pitch 115V<60 μm, the block vertical pitch must be greater than 60 μm to avoid the growth of the substrate 110 when the adjacent LED blocks 112 are shifted. collision between. But the present invention is not limited thereto. In some embodiments, the block vertical spacing 123V may be less than or equal to the wafer vertical spacing 115V. For example, when the wafer vertical spacing 115V>60 μm, the block vertical spacing 123V may be equal to the wafer vertical spacing 115V.

FIG. 13D shows a sorting carrier 140 on which LED blocks 112 of different sorts are transferred from different auxiliary sorting carriers 120 according to the sorting pattern 130 in FIG. 5 . Compared with FIG. 13C , the LED block 112 in FIG. 13D is turned upside down, so that the LED die 114 faces up with the electrode 113 (face up), and the side of the LED die 114 opposite to the electrode 113 passes through the adhesive layer 148 , and the adhesive layer 114 is placed on the sorting carrier 140 . FIG. 13D also shows block vertical pitch 143V and block vertical line pitch 144V. The block vertical spacing 143V is the distance between adjacent LED dies 114 belonging to two adjacent LED blocks 112 in FIG. 13D . The block vertical distance 144V is approximately equal to the distance between the center lines of two adjacent LED blocks 112 . In some embodiments, the block vertical spacing 143V in FIG. 13D is greater than or equal to the block vertical spacing 123V in FIG. 13C .

The transfer step of FIG. 13D, for example, can use a cutting tool to cut the auxiliary sorting carrier 120 in FIG. above; then part of the auxiliary sorting carrier 120 and the LED blocks 112 on it are turned over together, and adhered to the sorting carrier 140 through the adhesive layer 148; and then the auxiliary sorting carrier 120 is removed to separate it from the LED block 112 , the result is shown in Figure 13D.

FIG. 13E shows that the two LED chips 114 of the auxiliary pixel carrier 150 can be respectively transferred from the two adjacent LED blocks 112 in FIG. 13D , and placed on the auxiliary pixel carrier 150 through the adhesive layer 158. . In one embodiment, the distance between the midlines of two adjacent LED dies 114 in FIG. 13E , that is, the pixel vertical pitch 154V, is equal to the block vertical pitch 144V in FIG. 13D . In another embodiment, the auxiliary pixel carrier 150 can be replaced by the aforementioned pixel carrier 160 . That is, the LED die 114 can be directly transferred from the sorting carrier 140 to the pixel carrier 160 .

The transfer process shown in FIGS. 13A to 13E is just an example of the present invention and is not intended to limit the present invention. 14A to 14D illustrate another process of transferring the LED die 114 from the growth substrate 110 to the auxiliary pixel carrier 150.

FIG. 14A is a continuation of FIG. 13A . After splitting and separating the LED blocks 112, according to individual categories, the LED crystal grains 114 face up with the electrodes 113, and a single part of the growth substrate 110 is fixed in contact with the adhesive layer 128. Auxiliary sorting carrier 120 . For example, an LED block 112 in FIG. 13A is picked up and placed on the adhesive layer 128 of the auxiliary sorting carrier 120 . There is only one sort of LED block 112 on each auxiliary sorting carrier 120 . The relationship between the block vertical pitch and the wafer vertical pitch on the auxiliary sorting carrier 120 is similar to that of FIG. 13B and FIG. 13C , and will not be repeated here.

FIG. 14B is a continuation of FIG. 14A , according to the sorting pattern 130 in FIG. 5 , the LED blocks 112 are transferred from the auxiliary sorting carriers 120 of different sorts to the sorting carrier 140 . Compared with FIG. 14A , the LED block 112 in FIG. 14B is still attached to the growth substrate 110 , but turned upside down. The LED blocks 112 are disposed on the classification carrier 140 through the adhesive layer 148 .

FIG. 14C shows that the growth substrate 110 in FIG. 14B is removed, leaving only the LED die 114 on the classification carrier 140 . For example, the method of removing the growth substrate 110 adopts laser lift-off, so that the growth substrate 110 in FIG. 14B is removed from the LED die 114 . The relationship between the block vertical pitch and the wafer vertical pitch on the sorting carrier 140 is similar to that shown in FIG. 13D , and will not be repeated here.

FIG. 14D shows that the two LED dies 114 of the auxiliary pixel carrier 150 can be respectively transferred from the two adjacent LED blocks 112 in FIG. 14C and placed on the adhesive layer 158 . In one embodiment, the pixel vertical pitch 154V in FIG. 14D is equal to the block vertical pitch 144V in FIG. 14C . In another embodiment, the auxiliary pixel carrier 150 can be replaced by the aforementioned pixel carrier 160 . That is, the LED die 114 can be directly transferred from the sorting carrier 140 to the pixel carrier 160 .

Both FIGS. 13B and 14A show that the growth substrate 110 is first cut to separate the LED blocks 112 from each other, and then transferred to the auxiliary sorting carrier 120 , but the invention is not limited thereto. In some embodiments of the present invention, there is no need to cut the growth substrate 110, but all the LED blocks 112 are first transferred to another temporary substrate (not shown), and then the above steps of S04, FIG. 13A, or In the step of FIG. 14A , the step of transferring the LED block to the classification carrier 140 or the pixel carrier is carried out. In this way, the growth substrate 110 can be recycled. It should be noted that in this embodiment, the step of peeling off a single portion of the growth substrate 110 needs to be changed to removing a single portion of the temporary substrate.

For example, the growth substrate 110 with the LED blocks 112 can be turned upside down and adhered to a first temporary substrate (not shown). The growth substrate 110 is then detached, leaving all LED blocks 112 on the first temporary substrate. The first temporary substrate with the LED blocks 112 can be cut so that the LED blocks 112 are separated from each other, and then transferred to the auxiliary sorting carrier 120 or the sorting carrier 140 . Briefly, in some embodiments, the growth substrate 110 in FIGS. 13B-13E and FIGS. 14A-14D can be replaced with a first temporary substrate, and all LED dies 114 are flipped upside down.

In another embodiment, all the LED blocks 112 on the growth substrate 110 can be flipped and transferred to the first temporary substrate (not shown), and then flipped and transferred to the second temporary substrate (not shown) before being cut. , so that the LED blocks 112 are separated from each other. Briefly, in one embodiment, the growth substrate 110 in FIGS. 13B-13E and FIGS. 14A-14D is replaced with a second temporary substrate, but the orientation of all LED dies 114 remains unchanged.

15A-15D are schematic diagrams showing the steps of transferring the LED block 112b from the substrate 110′ to the carrier 170 according to an embodiment of the present invention, while the LED block 112a remains on the substrate 110′. The substrate 110′ can be the aforementioned growth substrate 110, the first temporary substrate, or the second temporary substrate. The carrier 170 can be the aforementioned auxiliary classification carrier 120 , classification carrier 140 , auxiliary pixel carrier 150 , or pixel carrier 160 . The first temporary substrate or the second temporary substrate includes a supporting substrate (not shown) and an adhesive material (not shown) for fixing the LED die on the supporting substrate. The supporting substrate can be glass or sapphire. The adhesive material may be polyimide (PI), butylcyclobutene (BCB), parylene, fluorocarbons, or acrylates.

FIG. 15A is similar to FIG. 12 , showing LED blocks 112 a and 112 b on a substrate 110 ′, and each LED block has several LED dies 114 .

In FIG. 15B , the substrate 110′ in FIG. 15A is turned over, and attached to the carrier 170 through the adhesive layer 178 .

FIG. 15C shows a patterned light blocking layer 172 formed on the substrate 110' of FIG. 15B. The light blocking layer 172 substantially covers the LED blocks 112a, but exposes the LED blocks 112b. FIG. 15C also shows that the laser 174 irradiates the carrier 170 to selectively perform laser lift-off (laser lift-off) or laser ablation (laser ablation) on the LED die 114 in the LED block 112b. For example, the substrate 110' is a sapphire substrate, and the laser 174 can penetrate the substrate 110', so that the GaN that is in contact with the GaN-based LED die 114 and the substrate 110' is vaporized, so that the LED die 114 can be slightly applied. Under the condition of stress, it can be separated from the substrate 110´. The light blocking layer 172 blocks the laser 174 from irradiating the LED die 114 in the LED block 112a. Therefore, the LED block 112a will remain attached to the substrate 110'.

FIG. 15D shows the substrate 110′ separated from the carrier plate 170. At this time, due to the previous irradiation of the laser 174, the bonding force between the LED die 114 in the LED block 112b and the substrate 110´ is reduced and is smaller than the bonding force between the LED die 114 and the adhesive layer 178, so the LED die The particles 114 are separated from the substrate 110′ and fixed on the adhesive layer 178 of the carrier 170 . The LED dies 114 in the LED block 112a are still attached to the substrate 110', as shown in FIG. 15D. In this way, the LED blocks 112b are transferred to the carrier 170, while the LED blocks 112a remain on the substrate 110′.

In another embodiment, in FIG. 15B, the LED blocks 112a, 112b are not in direct contact with the adhesive layer 178, but are separated by a distance greater than zero, for example: 5-25 μm, and the subsequent laser peeling in FIG. 15C, 15D ( After the laser lift-off or laser ablation step, the LED block 112 b falls down by gravity and is fixed on the carrier 170 through the adhesive layer 178 . Subsequently, if the adhesive material on the substrate 110′ remains, it can be removed by etching or plasma bombardment.

FIGS. 16A-16D illustrate how to transfer the LED blocks 112 to the sorting carrier 140 in batches from the auxiliary sorting carriers 120a, 120b, and 120c.

FIG. 16A uses a pick-up head 190 to pick up 18 LED blocks 112 at a time (like the blocks marked with black dots in the figure), and transfer them from the auxiliary sorting carrier 120a to the sorting carrier 140 in batches. On the auxiliary sorting carrier 120a, there are only LED blocks 112 of classification‶B1 ". Arrows are used in Fig. 16A to illustrate the positions of the two LED blocks 112 on the auxiliary sorting carrier 120a and the sorting carrier 140. In other words, Fig. 16A is based on A picking rule, 18 LED blocks 112 are transferred from the auxiliary sorting carrier 120a to the sorting carrier 140 in batches. This picking rule is presented, for example, in the arrangement of the LED blocks 112 of the sorting carrier 140 in FIG. 16A .

FIG. 16B adopts the same pick-up head 190 , that is, picks up 18 LED blocks 112 at a time with the same pick-up rule, and transfers batches from the auxiliary sorting carrier 120 a to the sorting carrier 140 . The arrows in FIG. 16B illustrate the movement of the two LED blocks 112 at the positions of the auxiliary sorting carrier 120 a and the sorting carrier 140 . FIG. 16B shows the 18 LED blocks 112 picked up this time, placed next to the LED blocks 112 picked up previously in FIG. 16A .

By repeating the batch transfer method of the pick-up head 190 in FIGS. 16A and 16B , the LED blocks 112 of the classification "B1" in the auxiliary sorting carrier 120a can be efficiently and quickly transferred to the sorting carrier 140, And place it on the sorting carrier 140 according to the sorting pattern 130 shown in FIG. 5 .

Using different pick-up heads, and using a method similar to that shown in Figures 16A and 16B, the LED blocks 112 of the categories ‶B2" and ‶B3" can be quickly and efficiently transferred from the auxiliary sorting carrier to which they belong and placed on On the sorting carrier 140. Fig. 16C adopts pick-up head 192 to pick up 18 LED blocks 112 of classification‶B2″ at a time, and transfer them from auxiliary sorting carrier 120b to sorting carrier 140. There are only LED areas of classification‶B2″ on auxiliary sorting carrier 120b Block 112. Fig. 16D adopts the pick-up head 194 to pick up 18 LED blocks 112 of classification‶B3″ at a time, and transfer them from the auxiliary sorting carrier 120c to the sorting carrier 140. There are only LED areas classified‶B3″ on the auxiliary sorting carrier 120c Block 112. It can be seen from the sorting carrier 140 of FIG. 16D that the LED blocks 112 of classification ‶B1 ″, ‶B2 ″ and ‶B3 ″ have been placed in a part of the sorting carrier 140. Finally, the classification carrier 140 of FIG. 6 can be completed, which has Classification pattern 130 of FIG. 5 .

The present invention is not limited to the sorting pattern 130 in FIG. 5 and the sorting carrier 140 in FIG. 6 . FIG. 17 shows another sorting pattern 230 , and FIG. 18 shows a sorting carrier 240 formed according to the sorting pattern 230 .

In another embodiment, a sorting carrier can also be formed without a preset sorting pattern. There is no repeating sorting pattern on this sorting carrier. There are several LED blocks on the sorting carrier, and each LED block has a plurality of LED chips arranged in a matrix. Each LED block is assigned a classification according to a detection result. The number of LED blocks for each classification has a preset and fixed classification ratio in the classification carrier board. For example, the B1 bin ratio is the number of LED blocks in class B1 divided by the number of all LED bins on the class carrier. In a sorting carrier board implemented according to the invention, the proportion of B1 sorting is 1/3, the proportion of B2 sorting is 1/3, and the proportion of B3 sorting is also 1/3. Of course, LED blocks of the same classification should be scattered on the classification carrier board as much as possible to avoid uneven brightness or uneven color that may occur due to excessive concentration of LED blocks of the same classification.

。變異性σ越小，表示光電特性分佈曲線CV1與CV2彼此越靠近，矩形區塊A1跟A2在光電特性上越相似。 Figure 20 shows the relationship of the display 200 and the variability σ. As shown in FIG. 20 , in one embodiment, the display 200 is composed of multiple pixel substrates 160 , and the LED dies of each pixel substrate 160 come from multiple sorted substrates with the same classification ratio. Therefore, in the display 200, between the rectangular blocks A1 and A2 at different positions, the variability σ of the photoelectric characteristic distribution curve of the single-color LED grain will be small, for example: σ<30%, 25%, 15%, 10% . In one embodiment, in the display 200 , the rectangular blocks A1 and A2 include at least 10,000 LED dies of the same color. The photoelectric characteristic distribution curve can measure the photoelectric characteristics of any column, any row, or all single-color LED dies. The calculation example of the variability is as follows, the rectangular block A1 has a photoelectric characteristic distribution curve CV1, and the rectangular block A2 has a photoelectric characteristic distribution curve CV2. The photoelectric characteristic distribution curve CV1 is a graph of the relationship between different classification wavelengths W1, W2, W3...Wn and the number of LED grains C1(W1), C1(W2), C1(W3)..., C1(Wn). The photoelectric characteristic distribution curve CV2 is a graph of the relationship between different classification wavelengths W1, W2, W3...Wn and the number of LED grains C2(W1), C2(W2), C2(W3)..., C2(Wn). Variability σ =

. The smaller the variability σ, the closer the photoelectric characteristic distribution curves CV1 and CV2 are to each other, and the more similar the photoelectric characteristics of the rectangular blocks A1 and A2 are.

According to the implementation of the present invention, if there is no preset sorting pattern on a sorting carrier board, if the relationship between the emission wavelength and the position of the LED crystal grain is drawn similarly to Figure 10 or 11, it will be found that there are many obvious discontinuous wavelength changes, but it is possible Has no repeatability variation with position. 19A and 19B show the relationship between the emission wavelength and the position of two rows of LED crystal grains on a classification substrate. It can be found that the LED grains roughly belonging to the same LED block have similar emission wavelengths, while the LED grains belonging to different LED blocks have similar emission wavelengths. There may be a large difference in emission wavelength between LED dies.

To sum up, although the present invention has been disclosed by the above embodiments, it is not intended to limit the present invention. Those skilled in the art of the present invention can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be defined by the scope of the appended patent application.

100: Manufacturing method 110: Growth substrate 110´: Substrate 112, 112a, 112b, 112A, 112B: LED blocks 113: electrode 114, 114B, 114G, 114R: LED die 115V: chip vertical spacing 116H: Horizontal cutting road 116V: vertical cutting track 117H, 117V: width of cutting track 118H, 122H, 144H: block horizontal line distance 118V, 122V, 144V: block vertical line spacing 120, 120a, 120b, 120c: auxiliary classification carrier 123V, 143V: block vertical spacing 126: Cutting tool 128: Adhesive layer 130, 230: classification pattern 140, 240: classification carrier board 142: area 146: pick up head 148: Adhesive layer 150: Auxiliary pixel carrier board 154H, 164H: pixel horizontal line spacing 154V, 164V: pixel vertical line spacing 158: Adhesive layer 160:Pixel carrier board 170: carrier board 172: light blocking layer 174: laser 178: Adhesive layer 182a, 182b, 182c, 182d, 182e: wavelength change 183a, 183b, 183c, 183d, 183e, 183f: wavelength distribution blocks 190, 192, 194: pick-up head 200: display A1, A2: rectangular block AA-AA: line B1, B2, B3, X: classification CV1, CV2: Photoelectric characteristic distribution curve C1(W1)-C1(W9), C2(W1)-C2(W9): Number of LED grains S1, S2, S3, S4, S5, S6: LED blocks S02, S04, S06, S08, S10, S12: steps W1, W2, W3: wavelength X1, X2, X3, X4, X5, X6, X7, X8, X9, X10: columns Y1, Y2, Y3, Y4, Y5, Y6, Y7, Y8, Y9: row

FIG. 1 shows a manufacturing method 100 according to an embodiment of the invention.

FIG. 2 shows a growth substrate 110 and exemplary LED blocks S1 - S6 according to an embodiment of the present invention.

FIG. 3 shows an arrangement pattern of LED blocks 112 on a growth substrate 110 according to an embodiment of the present invention.

FIG. 4 shows an auxiliary sorting carrier 120 according to an embodiment of the present invention.

FIG. 5 shows a preset classification pattern 130 according to an embodiment of the present invention.

FIG. 6 shows a sorting carrier 140 generated according to the sorting pattern 130 according to an embodiment of the present invention.

7A and 7B show a transfer method according to an embodiment of the present invention, illustrating that the LED die 114 is transferred from the sorting carrier 140 to the auxiliary pixel carrier 150.

FIG. 8 shows an auxiliary pixel carrier 150 according to an embodiment of the present invention.

9A-9C show a pixel carrier 160 with three color LEDs according to an embodiment of the present invention.

10 and 11 respectively show the relationship between the emission wavelength and the position of a row of LED dies in column Y9 and a row of LED dies in row X3 in FIG. 6 .

FIG. 12 is a schematic cross-sectional view along the line AA-AA in FIG. 2 .

13A-13E show the transfer steps according to an embodiment of the present invention, illustrating the process of transferring the LED die 114 to the auxiliary pixel carrier 150.

14A-14D illustrate the transfer steps according to another embodiment of the present invention, illustrating the process of transferring the LED die 114 to the auxiliary pixel carrier 150.

15A-15D show processing steps according to an embodiment of the present invention, exemplifying the process of transferring LED blocks to the carrier 170 .

FIGS. 16A-16D show transfer steps according to an embodiment of the present invention, exemplifying the process of transferring LED blocks onto the sorting carrier 140 in batches.

FIG. 17 shows a classification pattern 230 according to another embodiment of the present invention.

FIG. 18 shows a sorting carrier formed according to a sorting pattern according to an embodiment of the present invention.

19A and 19B show the relationship between the emission wavelength and the position of two rows of LED dies on a classification carrier according to an embodiment of the present invention.

Figure 20 shows a display and the relationship of variability σ.

S02, S04, S06, S08, S10, S12: steps

Claims (10)

A method for arranging LEDs, comprising: providing a plurality of first LED blocks and a plurality of second LED blocks co-located on a substrate; and transferring the plurality of first LED blocks and the plurality of second LED blocks to a classification carrier to form a block array, the block array includes a plurality of rows and a plurality of columns; Wherein, each block in the plurality of first LED blocks includes a plurality of first LED dies, and the plurality of first LED dies as a whole belong to a first category, Wherein, each block in the plurality of second LED blocks includes a plurality of second LED dies, and the plurality of second LED dies as a whole belongs to a second category, Wherein, each row in the plurality of rows includes at least one of the plurality of first LED blocks and at least one of the plurality of second LED blocks, Wherein, each row in the plurality of rows includes at least one of the plurality of first LED blocks and at least one of the plurality of second LED blocks. The method as claimed in claim 1, wherein the first classification depends on an optoelectronic characteristic of the plurality of first LED dies as a whole, and the optoelectronic characteristic includes emission wavelength, luminous intensity and chromaticity. The method according to claim 1, wherein the plurality of first LED blocks and the plurality of second LED blocks are arranged in the block array according to a preset sorting pattern. The method as described in claim 1, wherein, the number ratio of the plurality of first LED blocks and the plurality of second LED blocks is substantially equal to any two rows in the plurality of rows or any two columns in the plurality of columns same. The method as described in Claim 1, wherein the transferring step includes: transferring the plurality of first LED blocks to a first auxiliary sorting carrier; and Transferring the plurality of second LED blocks to a second auxiliary sorting carrier. The method according to claim 5, wherein the transferring step includes transferring the plurality of first LED blocks on the first auxiliary sorting carrier and the plurality of second LED blocks on the second auxiliary sorting carrier block to the classification carrier to form the block array. The method according to claim 1, wherein the transferring step uses a pick-and-place pickup, laser lift-off, laser ablation, or a combination of the foregoing methods. The method as claimed in item 1, wherein, the plurality of first LED dies and the plurality of second LED dies are arranged in a plurality of sub-rows and a plurality of sub-columns in the block array, along the plurality of sub-rows One or one of the plurality of sub-rows can measure a photoelectric characteristic curve of LED crystal grains, the photoelectric characteristic curve has at least one discontinuous change, and the discontinuous change is generally located in two adjacent blocks in the block array of the junction. The method as claimed in claim 1, wherein the substrate comprises a supporting substrate and an adhesive material is located on the supporting substrate. The method according to claim 1, wherein the transferring step includes forming a patterned light-blocking layer on the side of the substrate opposite to the LED block.

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