TW202314892A - Mounting apparatus - Google Patents

Abstract

Provided are a bonding stage (20) holding a substrate (104) on which a semiconductor chip (100) is arranged; a base stand (21); a mounting head (17) mounted with a pressing tool (16) that presses the semiconductor chip (100) on the substrate (104); and a film arranging mechanism (30) provided on the base stand (21) and moving a cover film (110) along the bonding stage (20) to arrange the cover film (110) between the semiconductor chip (100) pressed by the substrate (104) and the pressing tool (16). The film arranging mechanism (30) includes film guides (40) guiding the cover film (110) and defining a height with respect to the bonding stage (20); and lifting mechanisms (50) connected to the film guides (40) via springs (56) and lifting and lowering the film guides (40) with respect to the bonding stage (20).

Description

installation device

The present invention relates to a structure of a mounting device that mounts a semiconductor wafer to a mounted body that is a substrate or other semiconductor wafers via an adhesive material.

Conventionally, there is widely known a flip chip bonder technology in which a semiconductor chip is mounted on an object to be mounted, which is a substrate or another semiconductor chip, without using wires. In the flip chip bonding machine, an adhesive material containing a thermosetting resin is applied to the object to be mounted in advance, and the temperature of the semiconductor wafer is raised and pressed by a pressing tool to melt the solder on the electrode and make the adhesive material on the object to be mounted After solidification, the pressing tool is cooled to solidify the solder, thereby bonding the semiconductor wafer to the substrate. At this time, when the semiconductor wafer is heated and pressurized by the pressing tool, the adhesive material extruded from the semiconductor wafer may climb upward and adhere to the mounting head.

In order to prevent such adhesion of the adhesive material to the pressing tool, there is disclosed a mounting device that covers the bottom surface of the pressing tool with a film member (cover film). For example, in Patent Document 1, a device is proposed in which a resin film is moved horizontally to interpose the resin film between the workpiece and the bonding tool after placing a workpiece including a substrate and a semiconductor wafer on a bonding stage, and then, A bonding tool is used to press the semiconductor wafer from above the resin film, heat and ultrasonic vibration are performed to bond bumps and electrodes, and the semiconductor wafer is fixed to the substrate with an adhesive material. [Prior art literature] [Patent Document]

[Patent Document 1] Japanese Patent Laid-Open No. 2004-165536

[Problem to be Solved by the Invention]

However, in the case of pressing and heating the semiconductor wafer with the bonding tool from above the resin film with the film interposed between the pressing tool and the semiconductor wafer as in the device described in Patent Document 1, if If the bonding stage and the coating film that absorb and fix the workpiece are not arranged in parallel, when the semiconductor wafer is pressed and heated by a bonding tool, the adhesive material extruded from the semiconductor wafer may climb unevenly or generate static electricity during mounting. Therefore, in such an apparatus, parallelism between the bonding stage and the film is required.

On the other hand, since the bonding stage is heated by the heater, the parallelism between the bonding stage and the film may not be ensured due to thermal expansion of the bonding stage.

Therefore, it is an object of the present invention to secure parallelism between the bonding stage and the coating in a mounting device that presses the semiconductor wafer to a mounted object with the coating interposed between the pressing tool and the semiconductor wafer. [Technical means to solve the problem]

The mounting device of the present invention presses the semiconductor wafer arranged on the object to be mounted, and the mounting device is characterized in that it includes: a bonding stage for holding the object to be mounted on which the semiconductor wafer is arranged; a base for supporting the bonding stage; It moves in the direction of approaching/distance relative to the mounted body, and a pressing tool for pressing the semiconductor wafer to the mounted body is installed at the front end; move, thereby disposing the film between the semiconductor wafer and the pressing tool, the film arrangement mechanism includes: a film guide, guiding the film, having a contact portion in contact with the bonding stage to regulate the height of the film relative to the bonding stage; And the lifting mechanism is connected to the film guide via an elastic member, and lifts the film guide relative to the bonding stage.

In this way, the height of the film guide can be adjusted by using the lifting mechanism to ensure the parallelism between the bonding stage and the film.

In the mounting device of the present invention, the film guide and the elevating mechanism may be respectively provided on both sides of the bonding stage so as to sandwich the bonding stage.

In this way, since the height of the coating film relative to the bonding stage is adjusted on both sides of the bonding stage, the parallelism between the bonding stage and the coating film can be ensured.

In the mounting device of the present invention, the film arrangement mechanism may include a connecting member for connecting the film guides respectively provided on both sides of the bonding stage with the bonding stage interposed therebetween.

Thereby, the deviation of the height of the film guide on both sides can be eliminated, and the parallelism of a bonding stage and a film can be ensured.

In the installation device of the present invention, the lifting mechanism may also include: a guide rail, which is arranged on the base and extends in the vertical direction; a slider, which is guided by the guide rail and moves in the vertical direction; The slider is attached to the slider to move relative to the upper and lower directions with a predetermined vertical range, and the film guide is installed at the other end. When the contact part of the film guide contacts the upper surface of the bonding stage, the slider moves the film through the elastic member and the connecting member. The guide is pressed to engage the upper surface of the stage.

In this way, the film guide is pressed against the bonding stage by the biasing force of the elastic member, so the height of the film guide relative to the surface of the bonding stage can be fixed, and the parallelism between the bonding stage and the film can be ensured. .

In the mounting device of the present invention, the film disposing mechanism may include a film sending mechanism that sequentially sends out new coating films including a pair of rollers, and the pair of rollers are provided on the bonding stage with the bonding stage sandwiched between them. The bases on both sides of the stage are joined to erect the film, the film delivery mechanism includes bases supporting the rollers, and guide rails of the elevating mechanism are attached to the bases.

In this way, since the lift mechanism is attached to the base of the film delivery mechanism, the lift mechanism and the film guide can move in the horizontal direction with the film delivery mechanism relative to the bonding stage.

In the installation device of the present invention, it may also be possible that the film arrangement mechanism includes: one side of the film guide and one of the lifting mechanisms, which are arranged on one side of the joint stage; and the other side of the film guide and the other side The lifting mechanism is arranged on the other side of the joining platform, and one side of the lifting mechanism includes: one side of the guide rail, which is arranged on one side of the base and extends along the up and down direction; the slider is guided by one of the side guide rails and moves along Movement in the up and down direction; and the connecting member, one end of which can be relatively moved in the up and down direction through the elastic member to the slide block, and the film guide on one side is installed on the other end, and the lifting mechanism on the other side includes the guide rail on the other side , the guide rail on the other side is arranged on the base platform on the other side and extends in the up and down direction, guides the film guide on the other side in the up and down direction, and the film arrangement mechanism includes guiding the film guide on one side and the film on the other side When the contact portion of the film guide on one side and the contact portion of the film guide on the other side of the slider contact the upper surface of the bonding stage, one side of the slide block is connected via the elastic member and the connecting member. The contact portion of the film guide is pressed against the upper surface of the bonding stage, and the contact portion of the film guide on the other side is pressed onto the bonding stage via the coupling member.

In this way, since the one side film guide and the other side film guide are raised and lowered by the slider arranged on one side, the parallelism between the bonding stage and the film can be ensured with a simple structure.

In the mounting device of the present invention, the film disposing mechanism may include a film sending mechanism that sequentially sends out new coating films including a pair of rollers, and the pair of rollers are provided on the bonding stage with the bonding stage sandwiched between them. The bases on both sides of the stage are joined and the film is erected. The film feeding mechanism includes a base supporting each roller. One side guide rail is installed on one side of the base, and the other side guide rail is installed on the other side base. .

In this way, since the lift mechanism is attached to the base of the film delivery mechanism, the lift mechanism and the film guide can move in the horizontal direction with the film delivery mechanism relative to the bonding stage.

In the installation device of the present invention, it is also possible that the connecting member is a channel-shaped section member, and the channel-shaped section member includes an upper flange, a lower flange facing the upper flange, and a connecting member connecting the upper flange and the lower flange. The web (web) between the upper flange and the lower flange includes a slider guide extending in the up and down direction, and the slider is guided by the slider guide so that it can move between the upper flange and the lower flange The elastic member is provided between the lower end of the slider and the upper surface of the lower flange for relative movement in the up and down direction with respect to the connecting member.

Thus, with a simple structure, when the slider is raised, the film guide is raised together with the slider, and when the slider is lowered and the film guide touches the bonding stage, the film can be guided by the force of the elastic member. Press the piece onto the docking station.

In the mounting device of the present invention, the film arrangement mechanism may include a movement mechanism that moves the film delivery mechanism in the horizontal direction with respect to the bonding stage.

Thereby, the film feeding mechanism, the elevating mechanism, and the film guide can be integrally moved in the horizontal direction relative to the bonding stage. [Effect of the invention]

In the mounting device that presses the semiconductor wafer to the object to be mounted with the coating interposed between the pressing tool and the semiconductor wafer, the parallelism between the bonding stage and the coating can be ensured.

Hereinafter, the mounting device 10 according to the embodiment will be described with reference to the drawings. The mounting device 10 is a device for manufacturing a semiconductor device by mounting a plurality of semiconductor wafers 100 on a substrate 104 as an object to be mounted.

As shown in FIGS. 1 and 2 , the mounting device 10 has a joint stage 20 , a base 21 , a mounting head 17 , a thin film arrangement mechanism 30 , and a control unit 80 that controls the movement of the respective units. In the following description, the extending direction of the coating film 110 is referred to as the X direction, the direction perpendicular to the X direction on the horizontal plane is referred to as the Y direction, and the vertical direction is referred to as the Z direction. Moreover, the side provided with the winding-up roller 63b demonstrated later will be one side, and the side provided with the delivery roller 63a will be demonstrated as the other side.

The bonding stage 20 is a stage that holds the substrate 104 on its upper surface. The bonding stage 20 is provided with, for example, a suction hole (not shown) for sucking and holding the substrate 104 , a heater (not shown) for heating the substrate 104 , and the like. The bonding stage 20 is supported by a base 21 .

The mounting head 17 is provided facing the bonding stage 20, and includes a main body 11, a heat insulating block 12 arranged on the lower side of the main body 11, a heater 14 installed on the lower side of the heat insulating block 12, and a heater mounted on the lower side of the heat insulating block 12. The pressing tool 16 of 14 lower sides.

The main body 11 can move in the up-and-down direction, which is the approaching/separating direction with respect to the substrate 104 adsorbed on the bonding stage 20 , and also can move in the horizontal direction with respect to the substrate 104 by an internal driving mechanism.

The heat insulating block 12 is a plate-shaped member made of ceramics which is sandwiched between the main body 11 and the heater 14 and prevents heat from the heater 14 from being transferred to the main body 11 . The heater 14 is a heater in which a heating resistor including platinum, tungsten, or the like is embedded in a ceramic such as aluminum nitride.

Two cooling grooves 15 extending in a direction perpendicular to the paper surface of FIG. 1 are provided on the upper surface of the heater 14 . Furthermore, the heat insulating block 12 is provided with an air flow path 13 extending in an L-shape from the side surface and communicating the side surface with the cooling groove 15 provided in the heater 14 . When the heater 14 receives electric power from the control unit 80 , the heating resistor generates heat to increase its temperature, thereby heating the pressing tool 16 attached below the heater 14 . Furthermore, when the air from the fan 19 flows to the air flow path 13 of the heat insulating block 12, the heater 14 is cooled, and thereby the pressing tool 16 is cooled.

The size of the upper surface of the pressing tool 16 is substantially the same as that of the heater 14 , and a protrusion 16 a for sucking and pressing the semiconductor wafer 100 is provided on the lower side. The size of the protrusion 16 a is substantially the same as the size of the semiconductor wafer 100 . The pressing tool 16 is made of ceramics. Suction holes 18 for suction holding the semiconductor wafer 100 are formed in the pressing tool 16 . The suction hole 18 passes through the heater 14 and the heat insulating block 12 and communicates from the main body 11 to a suction pump not shown in the figure, and the semiconductor wafer 100 is suctioned and held in the suction pump by the negative pressure generated by the suction pump. The lower surface of the protrusion 16 a of the pressing tool 16 is pressed.

On the base 21 of the mounting device 10 is provided a film placement mechanism 30 that interposes the coating 110 between the semiconductor wafer 100 and the pressing tool 16 when the semiconductor wafer 100 is mounted. As a material of the coating 110, a material having excellent heat resistance and high peelability of the adhesive material 108 is used. Therefore, as a material of the coating 110 , for example, fluorine resins such as polytetrafluoroethylene (PTFE) and tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer (Tetrafluoroethylene Perfluorinated Alkey Vinye Copolymer, PFA) can be used.

The film arrangement mechanism 30 includes a film guide 40 , a connection member 46 , an elevating mechanism 50 , a film sending mechanism 60 , and a moving mechanism 70 .

The film feeding mechanism 60 sequentially sends the strip-shaped coating film 110 to the top of the substrate 104 . There is a delivery roller 63a provided on the other side of the bonding stage 20 and a winding roller 63b provided on one side (hereinafter, when the delivery roller 63a/winding roller 63b is not distinguished, it is simply referred to as "send roller"). 63”). The film 110 is stretched between the pair of feed rollers 63 . When the delivery roller 63 a rotates in a predetermined delivery direction (the direction of the arrow 91 in FIG. 1 ), new coatings 110 are sequentially delivered. Then, the winding roller 63b rotates in the same direction as the sending roller 63a in conjunction with the sending roller 63a, whereby the used film 110 is wound up on the winding roller 63b and recovered. The delivery roller 63a and the winding roller 63b are each driven by a drive motor not shown. In addition, the sending roller 63a may be a driven roller that is not driven by a motor but driven along with the rotation of the winding roller 63b.

The feeding roller 63 a and the winding roller 63 b have the same support structure 65 , and the only difference between them is that they are symmetrical across the bonding stage 20 . Moreover, the lifting mechanism 50 , the film guide 40 and the moving mechanism 70 are respectively provided on one side and the other side of the bonding stage 20 , and the only difference between them is that they are symmetrical with the bonding stage 20 interposed therebetween. Therefore, below, the support structure 65 of the winding roller 63b arrange|positioned at one side of the bonding stage 20, the elevating mechanism 50, the film guide 40, and the moving mechanism 70 are demonstrated.

As shown in FIGS. 3 and 4 , the supporting structure 65 of the winding roller 63 b includes a base 61 and a frame 62 . The base 61 is mounted movably in the Y direction on a rail 71 provided on the upper surface of the base 21 engaging one side of the stage 20 and extending in the Y direction. The frame 62 includes four columns mounted on the base 61 and four beams connecting the upper parts of the columns. The shaft 64 of the winding roller 63b is rotatably attached to two opposing beams extending in the X direction.

The elevating mechanism 50 is attached to the base 61 that supports the winding roller 63 b of the film delivery mechanism 60 , and the film guide 40 is connected to the elevating mechanism 50 . The film guide 40 regulates the height of the film 110 relative to the bonding stage 20 , and the elevating mechanism 50 raises and lowers the film guide 40 relative to the bonding stage 20 .

The lift mechanism 50 includes a guide rail 51 , a slider 54 , a connecting member 55 , a spring 56 , and a Z-direction actuator 58 . The spring 56 is an example of an elastic member, but it is not limited thereto, and an elastic member such as a leaf spring, rubber, or sponge can be used.

The guide rail 51 is attached to the upper surface of the base 61 of the film delivery mechanism 60 so as to extend in the vertical direction. The slider 54 includes a body portion 52 and an arm portion 53 . The main body part 52 fits the hole 52a provided in the center into the guide rail 51, and can move to an up-down direction along the guide rail 51. As shown in FIG. Further, the front end of a Z-direction actuator 58 mounted on the base 61 is connected to the lower end of the main body 52 , and the main body 52 is driven in the vertical direction by the Z-direction actuator 58 . One end of the arm portion 53 is connected to the body portion 52 , and a hole 53 a provided at the other end is fitted into a slider guide 57 of a connection member 55 described later to be vertically movably connected to the slider guide 57 .

The connecting member 55 is a channel-shaped section member comprising a plate-shaped upper flange 55a, a plate-shaped lower flange 55b facing the upper flange 55a, and a plate-shaped lower flange 55b connecting the upper flange 55a and the upper flange 55a in the vertical direction. Plate-shaped web 55c between lower flanges 55b. Between the upper flange 55a and the lower flange 55b, a slider guide 57 extending in the vertical direction is provided. The hole 53a of the arm portion 53 of the slider 54 is fitted into the slider guide 57, and is connected to the connecting member 55 so as to be relatively movable in the vertical direction between the upper flange 55a and the lower flange 55b by being guided by the slider guide 57. .

That is, the arm portion 53 of the slider 54 is attached to the connecting member 55 so as to be vertically movable relative to the lower surface of the upper flange 55a and the upper surface of the lower flange 55b of the connecting member 55 by a predetermined vertical width. In other words, the connecting member 55 is attached to the arm portion 53 of the slider 54 so as to be relatively movable in the vertical direction by a predetermined vertical width between the lower surface of the upper flange 55a and the upper surface of the lower flange 55b.

Between the upper surface of the lower flange 55 b of the connection member 55 and the lower surface of the arm portion 53 of the slider 54 , a spring 56 is attached. The spring 56 biases the arm portion 53 upward so that the upper surface of the arm portion 53 of the slider 54 contacts the lower surface of the upper flange 55a.

The film guide 40 is connected to the surface on the bonding stage 20 side of the web 55 c of the connection member 55 . The film guide 40 includes a base portion 41 , a lower guide roller 42 , an upper guide roller 43 , and a stopper 44 .

The base portion 41 is a long member connected to the web 55 c and extending toward the bonding stage 20 along the side ends of the film 110 on the upper surface of the bonding stage 20 . The lower guide roller 42 is attached to the side surface of the front end portion of the base portion 41 on the bonding stage 20 side, extends from the base portion 41 toward the coating film 110 in a direction at right angles to the direction in which the coating film 110 extends, and rolls on the lower side. A cylindrical rotating body that wraps around the film 110. The upper guide roller 43 is arranged on one side of the lower guide roller 42 . The upper guide roller 43 is mounted on the side surface of the base part 41, extends from the base part 41 toward the coating film 110 in a direction at right angles to the direction in which the coating film 110 extends, and winds the coating film 110 on its upper side in a cylindrical rotation. body.

The stopper 44 is a plate-shaped member attached to the lower end surface of the base portion 41 and extending from the base portion 41 toward the negative side in the Y direction. The lower end of the stopper 44 is arranged at a position to be in contact with one of the upper surfaces of the bonding stage 20 , and constitutes a contact portion that contacts the upper surface of the bonding stage 20 . Regarding the height of the stopper 44 , when the lower end of the stopper 44 abuts against the upper surface of the bonding stage 20 , the height of the lower surface of the cover film 110 is equal to the upper surface of the semiconductor wafer 100 temporarily pressure-bonded on the substrate 104 . contact height.

The front end of the base portion 41 of one film guide 40 and the front end of the base portion 41 of the other film guide 40 are connected by a connection member 46 . The connection member 46 is a long member extending in the X direction along the side end of the coating 110 on the upper surface of the bonding stage 20 . In addition, the film guide 40 on the other side has a symmetrical shape with the film guide 40 on one side with respect to the bonding stage 20, and has the same structure as one side except that.

As shown in FIGS. 1 and 2 , the film 110 of the upper guide roller 43 of the film guide 40 wound on one side extends toward the winding roller 63b disposed on one side, and is wound up to Roller 63b. Furthermore, the film 110 wound on the lower guide roller 42 of the film guide 40 on one side extends toward the other side, and is wound up to the lower side of the lower guide roller 42 of the film guide 40 disposed on the other side. Then, it is wound up to the upper side of the upper guide roller 43 of the film guide 40 arrange|positioned on the other side, and is extended toward the delivery roller 63a.

In this way, the coating film 110 spanned between the delivery roller 63 a on the other side and the winding roller 63 b on one side is wound up on the lower guide rollers of the two film guides 40 arranged on both sides of the bonding stage 20 . 42 and upper guide roller 43. In addition, the height of the film 110 from the bonding stage 20 is defined by the lower guide rollers 42 on both sides.

Returning to Fig. 3, the moving mechanism 70 includes: a track 71, which is arranged on the upper surface of the base 21 on one side of the joint stage 20; To drive the base 61 of the film delivery mechanism 60 guided by the rail 71. The Y-direction actuator 72 moves the winding roller 63b of the film delivery mechanism 60 and the base 61 connected to the lifting mechanism 50 in the Y direction (the direction of the arrow 92 in FIG. 2 ), so that the winding roller 63b of the film delivery mechanism 60 63b. The elevating mechanism 50 moves in the Y direction integrally with the film guide 40 connected to the elevating mechanism 50 .

The support structure 65 of the winding roller 63b arranged on one side of the bonding stage 20, the lifting mechanism 50, the film guide 40, and the moving mechanism 70 have been described above. The supporting structure 65 of the delivery roller 63a, the supporting structure 65 of the winding roller 63b, the lifting mechanism 50, the film guide 40, and the moving mechanism 70 arranged on the other side of the splicing stage 20 have a symmetrical shape with respect to the splicing stage 20, Other than that, it has the same structure as one side, so description is omitted.

The control unit 80 is connected to the main body 11 of the mounting head 17, the heater 14, the fan 19, the Z-direction actuator 58 of the lifting mechanism 50, the unillustrated drive motor of the film delivery mechanism 60, and the Y-direction actuator of the moving mechanism 70. The device 72 and the joint stage 20 control the movement of the mounting head 17, the movement of the slider 54 of the lifting mechanism 50 in the Z direction, the rotation of the feeding roller 63, and the movement of the base 61 in the Y direction, and are controlled by the heater 14 A fan 19 is used to control the temperature of the pressing tool 16 . The control unit 80 includes, for example, a central processing unit (Central Processing Unit, CPU) for performing various calculations, and a memory for storing various data and programs. Detection results from various sensors are input to the control unit 80 , and the control unit 80 performs drive control and temperature control of each unit based on the detection results.

Next, the operation of the mounting device 10 according to the embodiment will be described with reference to FIGS. 3 to 6 . The mounting device 10 utilizes flip-chip bonding technology to mount the semiconductor chip 100 on the substrate 104 . Specifically, as shown in FIG. 1 , the mounting device 10 bonds a protrusion containing a conductive material called a bump 102 formed on the bottom surface of the semiconductor wafer 100 to an electrode 105 formed on the surface of the substrate 104 , whereby the semiconductor The wafer 100 is electrically connected to a substrate 104 .

As shown in FIG. 2 , a plurality of electrodes 105 electrically connected to the bumps 102 of the semiconductor wafer 100 are formed on the substrate 104 to define a mounting area 106 where the semiconductor wafer 100 is mounted. In each mounting area 106, an adhesive material 108 which is an insulating thermosetting resin is applied in advance.

The control unit 80 of the mounting device 10 makes the semiconductor wafer 100 suck and hold on the pressing tool 16 at the front end of the mounting head 17, and lowers the mounting head 17 to press it against the adhesive material 108 in the mounting area 106, thereby temporarily pressing the semiconductor wafer 100. Attached to adhesive material 108. During temporary crimping, the film 110 retreats to a position separated from the mounting area 106 in the horizontal direction by the moving mechanism 70 .

After the temporary pressure bonding, the control unit 80 drives the moving mechanism 70 to move the coating film 110 in the horizontal direction, so that, as shown in FIG. The position between the semiconductor wafer 100 and the pressing tool 16 . At this time, the height of the film 110 is regulated by the lower guide roller 42 of the film guide 40 . The height of the covering film 110 is in the middle of the upper surface of the semiconductor wafer 100 and the pressing tool 16 .

At this time, as shown in FIG. 3 , there is a gap of height Δh1 between the lower end of the stopper 44 of the film guide 40 and the upper surface of the bonding stage 20 . And, the arm portion 53 of the slide block 54 of the lifting mechanism 50 is biased by the spring 56 and contacts the lower surface of the upper flange 55a of the connecting member 55, between the lower surface of the arm portion 53 and the lower flange 55b of the connecting member 55. There are gaps of height Δh0 apart. Also, the length of the spring 56 is Δh0.

As shown in FIG. 5 , the control unit 80 operates the Z-direction actuator 58 of the elevating mechanism 50 to lower the main body 52 of the slider 54 as indicated by an arrow 93 . Accordingly, the arm portion 53 and the film guide 40 also descend as indicated by the arrow 94 in FIG. 5 . Then, when the slider 54 descends by a height Δh1 from the state shown in FIG. 3 , the lower end of the stopper 44 of the film guide 40 comes into contact with the bonding stage 20 as shown in FIG. 5 . At this time, the lower surface of the cover film 110 is at a height in contact with the upper surface of the semiconductor wafer 100 which has been temporarily crimped.

Subsequently, the control unit 80 further lowers the slider 54 by the height Δh2 through the Z-direction actuator 58 . Thus, the spring 56 is compressed by a height Δh2, and a gap of a height Δh2 appears between the upper surface of the arm portion 53 of the slider 54 and the lower surface of the upper flange 55a of the connecting member 55 . And, the stopper 44 of the film guide 40 is pressed onto the joint stage 20 by the reaction force due to the compression of the spring 56 . By the pressing force, the height of the film guide 40 relative to the bonding stage 20 is kept constant.

The control unit 80 operates the Z-direction actuator 58 of the elevating mechanism 50 disposed on the other side in the same manner as the Z-direction actuator 58 of the elevating mechanism 50 disposed on one side, and moves the film guide on the other side. Stopper 44 of 40 is pressed to engage the upper surface of stage 20 . Accordingly, the height of the film guide 40 on the other side relative to the bonding stage 20 becomes the same as the height of the film guide 40 on one side relative to the bonding stage 20 . Thereby, the parallelism of the coating film 110 and the bonding stage 20 can be ensured. Therefore, as shown in FIG. 2 , even when the coating film 110 covers the upper surfaces of the plurality of semiconductor wafers 100 along the longitudinal direction, it can closely contact the upper surfaces of the respective semiconductor wafers 100 .

Next, as indicated by arrow 97 in FIG. 6 , the control unit 80 lowers the mounting head 17 to press the semiconductor wafer 100 from above the coating 110 by the protrusion 16 a of the pressing tool 16 at the tip. By pressing, the adhesive material 108 runs out from the periphery of the semiconductor wafer 100 , and a part of the adhesive material 108 climbs to the side of the semiconductor wafer 100 and reaches the lower surface of the coating film 110 . Also, by pressing, the bumps 102 formed on the semiconductor wafer 100 are brought into contact with the electrodes 105 of the substrate 104 . As described above, since the parallelism between the coating film 110 and the upper surface of the bonding stage 20 is ensured, the coating film 110 is in close contact with the upper surface of the semiconductor wafer 100, thereby suppressing the extrusion of the semiconductor wafer 100. Adhesive material 108 tends to creep or generate static electricity when installed.

Then, the control unit 80 starts power supply to the heater 14 to raise the temperature of the pressing tool 16 by the heater 14 . When the temperature of the pressing tool 16 rises, the semiconductor wafer 100 is heated by the heat, and the adhesive material 108 is softened. When the temperature is further increased to reach the melting temperature of the bumps 102 or higher, the bumps 102 of the semiconductor wafer 100 are melted. And, when the temperature rises to the curing temperature of the adhesive material 108, the adhesive material 108 starts thermal curing.

Then, the control unit 80 starts the fan 19 shown in FIG. 1 to make the cooling air flow to the air passage 13 of the heat insulating block 12 to cool the pressing tool 16 . Thereby, the melted bump 102 is solidified, and the bonding with the electrode 105 of the substrate 104 is completed. Furthermore, the temperature of the thermally cured adhesive material 108 also drops, and the mounting is completed in the state shown in FIG. 6 . Once the mounting is completed, the control unit 80 raises the mounting head 17 .

Once the control unit 80 raises the mounting head 17 , the slider 54 is raised by the Z-direction actuators 58 of the elevating mechanism 50 on one side and the other side. When the slider 54 rises by the height Δh2 shown in FIG. 6 , the upper surface of the arm portion 53 of the slider 54 abuts against the lower surface of the upper flange 55 a of the connection member 55 . Then, when the slider 54 is further raised, the connection member 55 and the film guide 40 are raised as the slider 54 is raised, and the film 110 is also raised accordingly, returning to the height shown in FIG. 3 . Once the control unit 80 raises the cover film 110 to the height shown in FIG. 3 , the moving mechanism 70 retracts the cover film 110 so that it is horizontally separated from the next mounting area 106 to which the semiconductor wafer 100 is to be temporarily pressure-bonded. open position.

As described above, the mounting device 10 of the embodiment can adjust the heights of the film guides 40 on both sides by using the elevating mechanisms 50 respectively arranged on both sides of the bonding stage 20, so as to securely bond the stage 20 and the film. 110 , so that the covering film 110 can be in close contact with the upper surface of the semiconductor wafer 100 . Therefore, when the semiconductor wafer 100 is mounted, the adhesive material 108 extruded from the semiconductor wafer 100 can be suppressed from creeping unevenly or static electricity can be suppressed during mounting.

Moreover, in the mounting device 10 of the embodiment, the film guides 40 on both sides are connected by the connecting member 46, so that the height deviation of the film guides 40 on both sides can be eliminated, and the bonding stage 20 and the coating film 110 can be ensured. parallelism. Furthermore, since the mounting device 10 of the embodiment presses the film guide 40 onto the bonding stage 20 by the force of the spring 56, the height of the film guide 40 relative to the surface of the bonding stage 20 can be fixed, thereby ensuring The parallelism between the stage 20 and the film 110 is bonded.

Next, a mounting device 200 according to another embodiment will be described with reference to FIG. 7 . The film arrangement mechanism 230 of the installation device 200 includes: a film guide 40 provided on one side, a lift mechanism 50, a moving mechanism 70, a film delivery mechanism including a delivery roller 63a on the other side and a winding roller 63b on one side. 60. The other-side lifting mechanism 350 and the other-side film guide 340 provided on the other side. The structures of the film sending mechanism 60 , the film guide 40 provided on one side, the lifting mechanism 50 and the moving mechanism 70 are the same as those of the mounting device 10 described above with reference to FIGS. 1 to 6 , and thus description thereof is omitted.

The other-side elevating mechanism 350 provided on the other side does not include the Z-direction actuator 58 , the slider 54 , and the connecting member 55 , but includes only the other-side guide rail 351 . The other-side guide rail 351 is installed on the other-side base 61 and extends in the vertical direction to guide the other-side film guide 340 in the vertical direction. The other film guide 340 is connected to one of the film guides 40 by the connecting member 46, and moves in the vertical direction driven by the one of the film guides 40 . Furthermore, the other-side film guide 340 includes a base portion 341 , a lower guide roller 342 , an upper guide roller 343 , and a stopper 344 similarly to the one-side film guide 40 . The base part 341 has the same structure as the film guide 40 on one side except that the other end is provided with a hole for fitting into the other guide rail 351 and the length in the X direction is long. The lower guide roller 342, the upper guide roller 342 The guide roller 343 and the stopper 344 have the same structure as the lower guide roller 42 , the upper guide roller 43 and the stopper 44 on one side respectively.

The installation device 200 shown in FIG. 7 drives both the film guide 40 on one side and the film guide 340 on the other side up and down through the Z-direction actuator 58 of the lifting mechanism 50 installed on one side, so it can Make the structure easier.

The mounting device 200 can adjust the height of the film guides 40 disposed on both sides of the bonding stage 20 to ensure the parallelism between the bonding stage 20 and the film 110 .

In the above description, the mounting devices 10 and 200 have been described as mounting the semiconductor wafer 100 on the substrate 104 , but the present invention is not limited thereto, and the semiconductor wafer 100 can also be mounted on other semiconductor wafers 100 . At this time, the other semiconductor wafers 100 constitute a mounted body similarly to the substrate 104 .

10, 200: installation device 11: Ontology 12: Insulation block 13: Air flow path 14: heater 15: cooling tank 16:Press tool 16a: protrusion 17: Mounting head 18: suction hole 19: fan 20: Joining the carrier 21: Abutment 30, 230: film configuration mechanism 40: film guide 41, 341: base part 42, 342: lower guide roller 43, 343: upper guide roller 44, 344: blocker 46: Connecting components 50: Lifting mechanism 51: guide rail 52: Body Department 52a, 53a: holes 53: arm 54: Slider 55: Connecting components 55a: Upper flange 55b: Lower flange 55c: web 56: Spring 57:Slider guide 58:Z direction actuator 60: Film delivery mechanism 61: base 62: frame 63: Feed roller 63a: Delivery roller 63b: winding roller 64: axis 65:Support structure 70: Mobile Mechanism 71: track 72:Y direction actuator 80: Control Department 100: semiconductor wafer 102: Bump 104: Substrate 105: electrode 106: Installation area 108: Adhesive material 110: lamination 340: film guide on the other side 341: Base 350: Lifting mechanism on the other side 351: guide rail on the other side

FIG. 1 is a schematic elevational view showing the structure of a mounting device according to an embodiment. Fig. 2 is a schematic plan view showing the structure of the mounting device according to the embodiment. Fig. 3 is an elevational view showing the structure of one side of the mounting device according to the embodiment, and is a view taken along the arrow A-A shown in Fig. 2 . Fig. 4 is a plan view showing the configuration of one side of the mounting device according to the embodiment. 5 is an elevational view showing a state in which the film guide is lowered by the elevating mechanism to abut against the upper surface of the bonding stage in the mounting device according to the embodiment, and is an A-A arrow view shown in FIG. 2 . 6 is an elevational view showing a state in which the mounting head is lowered to mount the semiconductor wafer on the substrate in the state shown in FIG. 5 , and is a view taken along the arrow A-A shown in FIG. 2 . Fig. 7 is an elevational view showing the structure of a mounting device according to another embodiment.

10: Installation device

11: Ontology

12: Insulation block

13: Air flow path

14: heater

15: cooling tank

16:Press tool

16a: protrusion

17: Mounting head

18: suction hole

19: fan

20: Joining the carrier

21: Abutment

30: film configuration mechanism

40: film guide

42: Bottom guide roller

43: Upper guide roller

46: Connecting components

50: Lifting mechanism

58:Z direction actuator

60: Film delivery mechanism

63a: Delivery roller

63b: winding roller

70: Mobile Mechanism

72:Y direction actuator

80: Control Department

91: Arrow

100: semiconductor wafer

102: Bump

104: Substrate

105: electrode

108: Adhesive material

110: lamination

X, Y, Z: direction

Claims (9)

A mounting device that presses a semiconductor wafer disposed on an object to be mounted, wherein the mounting device is characterized in that it includes: engaging a stage to hold the object to be mounted on which the semiconductor wafer is disposed; an abutment supporting the bonding stage; a mounting head that moves in a direction of approaching/separating from the mounted body, and has a pressing tool that presses the semiconductor wafer to the mounted body mounted on a front end; and a film arrangement mechanism provided on the base, and moves the film along the bonding stage to arrange the film between the semiconductor wafer and the pressing tool, The film configuration mechanism includes: a film guide for guiding the film, having a contact portion in contact with the bonding stage to regulate the height of the film relative to the bonding stage; and The lift mechanism is connected to the film guide via an elastic member, and lifts the film guide relative to the bonding stage. According to the installation device described in claim 1, it is characterized in that, The film guide and the elevating mechanism are respectively provided on both sides of the bonding stage with the bonding stage sandwiched therebetween. According to the installation device described in claim 2, it is characterized in that, The film arrangement mechanism includes a connecting member for connecting the film guides provided on both sides of the bonding stage with the bonding stage interposed therebetween. The installation device according to any one of claims 1 to 3, characterized in that, The lifting mechanism includes: a guide rail, arranged on the abutment and extending along the up and down direction; a slider moved in an up and down direction guided by the guide rail; and The connecting member is attached to the slider so that one end can relatively move up and down by a predetermined vertical range through the elastic member, and the film guide is attached to the other end, When the contact portion of the film guide contacts the upper surface of the bonding stage, the slider presses the film guide to the bonding stage via the elastic member and the connecting member. the upper surface of the table. According to the installation device described in claim 4, it is characterized in that, The film disposing mechanism includes a film sending mechanism that sequentially sends out the new coating film including a pair of rollers, and the pair of rollers are provided on the bonding stage with the bonding stage sandwiched between them. the abutment on both sides of the abutment and set up the film, The film delivery mechanism includes bases supporting each of the rollers, Each of the guide rails of the lifting mechanism is installed on each of the bases. According to the installation device described in claim 2, it is characterized in that, The film configuration mechanism includes: One side of the film guide and one side of the lifting mechanism are arranged on one side of the bonding platform; and The film guide on the other side and the lifting mechanism on the other side are arranged on the other side of the joining stage, The lifting mechanism on one side includes: One of the guide rails is arranged on the abutment on one of the sides and extends along the up and down direction; the slider is guided to move up and down by the one side guide rail; and The connecting member is attached to the slider so that one end thereof can relatively move up and down by a predetermined vertical range through the elastic member, and the one side film guide is attached to the other end, The other-side elevating mechanism includes another-side guide rail, which is provided on the other side of the base and extends in the vertical direction, and guides the other-side film guide in the vertical direction, The film arrangement mechanism includes a connecting member connecting the film guide on one side and the film guide on the other side, When the contact portion of the one-side film guide and the contact portion of the other-side film guide contact the upper surface of the joint stage, the slider moves through the elastic member and The connection member presses the contact portion of the film guide on one side to the upper surface of the bonding stage, and the contact portion of the film guide on the other side is pressed via the connection member. portion is pressed to the upper surface of the bonding stage. According to the installation device described in claim 6, it is characterized in that, The film disposing mechanism includes a film sending mechanism that sequentially sends out the new coating film including a pair of rollers, and the pair of rollers are provided on the bonding stage with the bonding stage sandwiched between them. the abutment on both sides of the abutment and set up the film, The film feeding mechanism respectively includes a base supporting each of the rollers, The guide rail on one side is installed on the base on one side, and the guide rail on the other side is installed on the base on the other side. The installation device according to any one of claims 4 to 7, characterized in that, The connecting member is a trough-shaped sectional member, and the trough-shaped sectional member includes an upper flange, a lower flange facing the upper flange, and a connecting member between the upper flange and the lower flange. web, A slider guide extending in an up-down direction is included between the upper flange and the lower flange, The slider is guided by the slider guide so as to move relative to the connection member between the upper flange and the lower flange in an up and down direction, The elastic member is provided between the lower end of the slider and the upper surface of the lower flange. According to the installation device described in claim 5 or 7, it is characterized in that, The film arrangement mechanism includes a movement mechanism that moves the film delivery mechanism in a horizontal direction relative to the bonding stage.

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