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TW202248381A - Adhesive sheet, reinforcement film, and device manufacturing method - Google Patents

Adhesive sheet, reinforcement film, and device manufacturing method Download PDF

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TW202248381A
TW202248381A TW111112182A TW111112182A TW202248381A TW 202248381 A TW202248381 A TW 202248381A TW 111112182 A TW111112182 A TW 111112182A TW 111112182 A TW111112182 A TW 111112182A TW 202248381 A TW202248381 A TW 202248381A
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adhesive sheet
meth
acrylate
adhesive
weight
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TW111112182A
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Chinese (zh)
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片岡賢一
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日商日東電工股份有限公司
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00Processes of polymerisation
    • C08F2/46Polymerisation initiated by wave energy or particle radiation
    • C08F2/48Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10Esters
    • C08F222/1006Esters of polyhydric alcohols or polyhydric phenols
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F265/00Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00
    • C08F265/04Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00 on to polymers of esters
    • C08F265/06Polymerisation of acrylate or methacrylate esters on to polymers thereof
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/06Non-macromolecular additives organic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38Pressure-sensitive adhesives [PSA]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10Substrates, e.g. flexible substrates
    • H10K77/111Flexible substrates

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

An adhesive sheet (2) is obtained by forming, into a layered configuration, an adhesive composition that contains an acrylic base polymer and a polyfunctional (meth)acrylate having four or more (meth)acryloyl groups in one molecule as a photocuring agent. Relative to the total amount of constituent monomer components, the acrylic base polymer contains at least 70 wt% of (meth)acrylic acid alkyl esters, which are chain alkyls with the alkyl group having at least 6 carbons. The content in the adhesive composition of polyfunctional (meth)acrylate having four or more functional groups is preferably at least 7 parts by weight relative to 100 parts by weight of the acrylic base polymer.

Description

黏著片材、補強膜、及裝置之製造方法Adhesive sheet, reinforcing film, and manufacturing method of device

本發明係關於一種含有光硬化性黏著劑組合物之黏著片材、及於膜基材上具備該黏著片材之補強膜。進而,本發明係關於一種將補強膜貼合於被黏著體之表面的附補強膜之裝置之製造方法。The present invention relates to an adhesive sheet containing a photocurable adhesive composition, and a reinforcing film provided with the adhesive sheet on a film substrate. Furthermore, the present invention relates to a method of manufacturing a device with a reinforcing film that bonds a reinforcing film to the surface of an adherend.

有時會於顯示器等光學裝置或電子裝置之表面貼附黏著性膜,以保護表面或賦予耐衝擊性等。此種黏著性膜通常於膜基材之主表面固著積層有黏著劑層(黏著片材),並經由該黏著片材而貼合於裝置表面。Sometimes an adhesive film is attached to the surface of an optical device such as a display or an electronic device to protect the surface or impart impact resistance. Such an adhesive film is usually fixed and laminated with an adhesive layer (adhesive sheet) on the main surface of the film substrate, and is bonded to the surface of the device through the adhesive sheet.

於裝置之組裝、加工、運輸等使用前之狀態下,藉由將黏著性膜暫時黏著於裝置或裝置構成零件之表面,可抑制被黏著體之損傷或破損。於專利文獻1中揭示有一種於膜基材上具備包含光硬化性黏著劑組合物之黏著片材之補強膜。In the state before the device is assembled, processed, transported, etc., damage or breakage of the adherend can be suppressed by temporarily adhering the adhesive film to the surface of the device or device component parts. Patent Document 1 discloses a reinforcing film provided with an adhesive sheet comprising a photocurable adhesive composition on a film substrate.

該補強膜剛與被黏著體貼合後,由於黏著劑之黏著性較低,故而可自被黏著體剝離。因此,能夠自被黏著體進行二次加工,並且能夠自被黏著體之無需補強之部位而位置選擇性地將補強膜剝離去除。補強膜之黏著劑藉由光硬化而與被黏著體牢固地接著,故而成為膜基材永久接著於被黏著體之表面之狀態,從而可用作負責裝置之表面保護等之補強材料。 [先前技術文獻] [專利文獻] The reinforcing film can be peeled off from the adherend due to the low adhesiveness of the adhesive immediately after it is attached to the adherend. Therefore, secondary processing can be performed from the adherend, and the reinforcing film can be selectively peeled and removed from the portion of the adherend that does not require reinforcement. The adhesive of the reinforcement film is firmly bonded to the adherend by photohardening, so the film substrate is permanently attached to the surface of the adherend, and can be used as a reinforcing material responsible for surface protection of the device. [Prior Art Literature] [Patent Document]

[專利文獻1]日本專利特開2020-41113號公報[Patent Document 1] Japanese Patent Laid-Open No. 2020-41113

[發明所欲解決之問題][Problem to be solved by the invention]

近年來,顯示器之無邊框化不斷進展,提出了一種於顯示器之顯示區域配置指紋感測器等光學感測器之構成。例如,藉由在作為顯示元件之有機EL(Electroluminescence,電致發光)面板之背面配置光學感測器,可實現於顯示區域內具有光學感測器之構成。In recent years, the borderless display has progressed continuously, and a configuration in which an optical sensor such as a fingerprint sensor is arranged in the display area of the display has been proposed. For example, by arranging an optical sensor on the back of an organic EL (Electroluminescence, electroluminescence) panel as a display element, a configuration with an optical sensor in the display area can be realized.

已指出於該構成中,於在亮處視認畫面時,會視認(識別)到配置於圖像顯示面板之背面之光學感測器等構件。可藉由於圖像顯示面板之背面(圖像顯示面板與光學感測器之間)配置高霧度之黏著片材,來降低自顯示器正面之光學感測器之視認性(識別性)。另一方面,若考慮到便於在裝置之製造步驟中利用目視或檢查裝置進行光學檢查,則黏著片材較佳為低霧度。It has been pointed out that in this configuration, when the screen is viewed in a bright place, components such as an optical sensor arranged on the back surface of the image display panel are visually recognized (recognized). Visibility (recognition) of the optical sensor from the front of the display can be reduced by arranging a high-haze adhesive sheet on the back of the image display panel (between the image display panel and the optical sensor). On the other hand, the adhesive sheet preferably has a low haze in consideration of the convenience of optical inspection by visual inspection or inspection equipment in the manufacturing process of the device.

鑒於上述情況,本發明之目的在於提供一種黏著片材,其在不降低裝置之製造步驟中之檢查性之情況下,於組裝至裝置中而得之最終製品中為高霧度。 [解決問題之技術手段] In view of the above circumstances, an object of the present invention is to provide an adhesive sheet having a high haze in a final product assembled into a device without lowering the inspection property in the manufacturing steps of the device. [Technical means to solve the problem]

本發明之一形態係使光硬化性黏著劑組合物形成為層狀而得之黏著片材。黏著劑組合物含有丙烯酸系基礎聚合物及光硬化劑,進而亦可含有光聚合起始劑。One aspect of the present invention is an adhesive sheet obtained by forming a photocurable adhesive composition in a layered form. The adhesive composition contains an acrylic base polymer and a photocuring agent, and may further contain a photopolymerization initiator.

丙烯酸系基礎聚合物中,相對於構成單體成分總量,含有70重量%以上之(甲基)丙烯酸烷基酯,該(甲基)丙烯酸烷基酯中之烷基為碳數6以上之鏈狀烷基。光硬化劑含有於1分子中具有4個以上(甲基)丙烯醯基之多官能(甲基)丙烯酸酯。The acrylic base polymer contains at least 70% by weight of an alkyl (meth)acrylate based on the total amount of monomer components, and the alkyl group in the alkyl (meth)acrylate is one with 6 or more carbon atoms. chain alkyl. The photocuring agent contains polyfunctional (meth)acrylate having 4 or more (meth)acryl groups in 1 molecule.

相對於丙烯酸系基礎聚合物100重量份,黏著劑組合物中之四官能以上之多官能(甲基)丙烯酸酯之含量較佳為7重量份以上。The content of the tetrafunctional or higher polyfunctional (meth)acrylate in the adhesive composition is preferably 7 parts by weight or more relative to 100 parts by weight of the acrylic base polymer.

黏著片材之光硬化後之霧度H 1與光硬化前之霧度H 0的差H 1-H 0較佳為1.0%以上。黏著片材之光硬化前之霧度H 0較佳為未達6%,亦可為5%以下。黏著片材之光硬化後之霧度H 1較佳為3%以上,亦可為5%以上或6%以上。 The difference H 1 -H 0 between the haze H 1 after photocuring and the haze H 0 before photocuring of the adhesive sheet is preferably 1.0% or more. The haze H0 of the adhesive sheet before photocuring is preferably less than 6%, and may be less than 5 %. The haze H1 of the adhesive sheet after photocuring is preferably 3% or more, and may be 5% or more or 6% or more.

本發明之又一形態係將上述黏著片材固著積層於膜基材之一主表面上而成之補強膜。將該補強膜之片材暫時黏著於被黏著體之表面後,使黏著片材光硬化,藉此可形成附補強膜之裝置。被黏著體亦可為有機EL面板。 [發明之效果] Still another aspect of the present invention is a reinforcing film obtained by fixedly laminating the above-mentioned adhesive sheet on one main surface of the film substrate. A device with a reinforcing film can be formed by temporarily adhering the sheet of the reinforcing film to the surface of the adherend, and then photocuring the adhesive sheet. The adherend may also be an organic EL panel. [Effect of Invention]

上述黏著片材於光硬化前霧度較低,因此即便於貼合於被黏著體之狀態下,亦可確保利用目視或拍攝所進行之光學檢查之精度。又,黏著片材於光硬化後霧度較高,因此不易自裝置之外表面視認(辨識)到配置於較黏著片材更靠背面之光學感測器等構件。The above-mentioned adhesive sheet has a low haze before photohardening, so even in the state of being attached to the adherend, the accuracy of optical inspection by visual inspection or photography can be ensured. In addition, the adhesive sheet has a high haze after light hardening, so it is difficult to visually recognize (identify) from the outer surface of the device to components such as optical sensors arranged on the back side of the adhesive sheet.

圖1係表示於黏著片材2之兩面暫時黏著有離型膜51、52的附離型膜之黏著片材之剖視圖。圖2係膜基材1之一主表面上固著積層有黏著片材2且黏著片材2上暫時黏著有離型膜52之補強膜的剖視圖。黏著片材2係使光硬化性黏著劑組合物形成為層狀而得者,藉由紫外線等活性光線之照射而硬化,從而提昇與被黏著體之接著強度。FIG. 1 is a cross-sectional view of an adhesive sheet with a release film, in which release films 51 and 52 are temporarily attached to both sides of the adhesive sheet 2 . 2 is a cross-sectional view of a reinforcement film in which an adhesive sheet 2 is fixedly laminated on one main surface of a film substrate 1 and a release film 52 is temporarily adhered to the adhesive sheet 2 . The adhesive sheet 2 is obtained by forming a photocurable adhesive composition in a layered form, and is hardened by irradiation with active light rays such as ultraviolet rays to increase the bonding strength with the adherend.

圖3係表示裝置20之表面上貼設有補強膜10之狀態之剖視圖。藉由自圖2所示之補強膜之黏著片材2之表面剝離去除離型膜51,並將黏著片材2之露出面貼合於裝置20之表面,而於裝置20之表面貼設補強膜10。於該狀態下,黏著片材2處於光硬化前且裝置20上暫時黏著有補強膜10(黏著片材2)之狀態。藉由使黏著片材2光硬化,使得裝置20與黏著片材2之界面處之接著力提昇,成為補強膜10固著於裝置20之表面之狀態。FIG. 3 is a cross-sectional view showing a state where the reinforcing film 10 is attached to the surface of the device 20 . The release film 51 is removed by peeling off the surface of the adhesive sheet 2 of the reinforcing film shown in FIG. Film 10. In this state, the adhesive sheet 2 is in a state where the reinforcing film 10 (adhesive sheet 2 ) is temporarily adhered to the device 20 before photocuring. By photocuring the adhesive sheet 2 , the adhesive force at the interface between the device 20 and the adhesive sheet 2 is improved, and the reinforcing film 10 is fixed to the surface of the device 20 .

「固著」係指所積層之2個層牢固地接著,不能或難以於兩者之界面處進行剝離之狀態。「暫時黏著」係指所積層之2個層之間之接著力較小,可於兩者之界面處容易地進行剝離之狀態。"Fixed" refers to the state where two layers of laminated layers are firmly connected, and it is impossible or difficult to peel off at the interface between the two. "Temporary adhesion" refers to the state in which the adhesive force between the two laminated layers is small and can be easily peeled off at the interface between the two.

圖1所示之黏著片材為黏著片材2之兩面暫時黏著有離型膜51、52之狀態,離型膜51、52可自黏著片材2之表面容易地剝離。於圖2所示之補強膜中,膜基材1與黏著片材2固著,離型膜51暫時黏著於黏著片材2上。若將膜基材1與離型膜51剝離,則於黏著片材2與離型膜51之界面處發生剝離,維持黏著片材2固著於膜基材1上之狀態。剝離後之離型膜51上不殘存黏著劑。The adhesive sheet shown in FIG. 1 is in a state where release films 51 and 52 are temporarily attached to both sides of the adhesive sheet 2 , and the release films 51 and 52 can be easily peeled off from the surface of the adhesive sheet 2 . In the reinforcing film shown in FIG. 2 , the film substrate 1 is fixed to the adhesive sheet 2 , and the release film 51 is temporarily adhered to the adhesive sheet 2 . When the film substrate 1 and the release film 51 are peeled off, peeling occurs at the interface between the adhesive sheet 2 and the release film 51 , and the adhesive sheet 2 remains fixed on the film substrate 1 . No adhesive remains on the peeled release film 51 .

圖3所示之附補強膜之裝置於黏著片材2光硬化前,處於裝置20與黏著片材2暫時黏著之狀態。若將膜基材1與裝置20剝離,則於黏著片材2與裝置20之界面處發生剝離,故而維持黏著片材2固著於膜基材1上之狀態。使黏著片材2光硬化後,黏著片材2與裝置20之接著力上升,成為固著狀態,故而難以將膜基材1自裝置20剝離,若將兩者剝離,則存在黏著片材2發生凝集破壞之情形。The device with a reinforcing film shown in FIG. 3 is in a state where the device 20 and the adhesive sheet 2 are temporarily adhered before the adhesive sheet 2 is photohardened. When the film substrate 1 and the device 20 are peeled off, peeling occurs at the interface between the adhesive sheet 2 and the device 20, so that the state where the adhesive sheet 2 is fixed on the film substrate 1 is maintained. After the adhesive sheet 2 is light-cured, the adhesive force between the adhesive sheet 2 and the device 20 is increased, and it is in a fixed state, so it is difficult to peel the film base material 1 from the device 20. When both are peeled off, the adhesive sheet 2 remains Coagulation failure occurs.

[黏著片材] 黏著片材2含有包含基礎聚合物及光硬化劑之光硬化性組合物。黏著片材2於光硬化前與裝置或裝置零件等被黏著體之接著力較小,故而可自被黏著體剝離。黏著片材2藉由光硬化而提昇與被黏著體之接著力,故而接著可靠性優異。 [adhesive sheet] The adhesive sheet 2 contains a photocurable composition containing a base polymer and a photocuring agent. The adhesive sheet 2 has low adhesive force with the adherend such as devices or device parts before photocuring, so it can be peeled off from the adherend. The adhesive sheet 2 is excellent in adhesion reliability because the adhesive force with the adherend is improved by photocuring.

光硬化性黏著劑於一般存放環境中幾乎不發生硬化,藉由紫外線等活性光線之照射而硬化。因此,黏著片材2固著積層於膜基材1上而成之補強膜具有如下優點:可任意設定黏著片材2之硬化時點、可靈活應對步驟之準備時間。Photocurable adhesives hardly harden in the general storage environment, and harden by the irradiation of active light such as ultraviolet rays. Therefore, the reinforcing film formed by adhesive sheet 2 fixedly laminated on the film substrate 1 has the following advantages: the hardening time point of the adhesive sheet 2 can be set arbitrarily, and the preparation time of the steps can be flexibly handled.

黏著片材2之厚度例如為1~300 μm左右。存在黏著片材2之厚度越大,則與被黏著體之接著性越提昇之傾向。另一方面,於黏著片材2之厚度過大之情形時,存在光硬化前之流動性較高而難以進行操作之情形。因此,黏著片材2之厚度較佳為3~100 μm,更佳為5~50 μm,進而較佳為6~40 μm,尤佳為8~30 μm。就薄型化之觀點而言,黏著片材2之厚度亦可為25 μm以下、20 μm以下或18 μm以下。The thickness of the adhesive sheet 2 is, for example, about 1 to 300 μm. There is a tendency that the adhesiveness with an adherend improves so much that the thickness of the adhesive sheet 2 is large. On the other hand, when the thickness of the adhesive sheet 2 is too large, the fluidity before photocuring may be high and handling may be difficult. Therefore, the thickness of the adhesive sheet 2 is preferably 3-100 μm, more preferably 5-50 μm, further preferably 6-40 μm, especially preferably 8-30 μm. From the viewpoint of thinning, the thickness of the adhesive sheet 2 may be 25 μm or less, 20 μm or less, or 18 μm or less.

顯示器等光學裝置所使用之黏著片材之全光線透過率較佳為80%以上,更佳為85%以上,進而較佳為90%以上。The total light transmittance of the adhesive sheet used in optical devices such as displays is preferably at least 80%, more preferably at least 85%, and still more preferably at least 90%.

於黏著片材之霧度較高之情形下,於在裝置之製造步驟中利用目視或拍攝進行光學檢查時,存在黏著片材上之光散射阻礙檢查而導致檢查精度降低之情形。因此,基於確保檢查精度之觀點而言,黏著片材之霧度較佳為未達6%,亦可為5%以下、4%以下或3%以下。另一方面,藉由於作為最終製品之顯示器等中,黏著片材之霧度較高,而可抑制使用者視認(辨識)到配置於較黏著片材更靠背面之光學感測器等構件。基於該觀點而言,黏著片材之霧度較佳為3%以上,更佳為5%以上,進而較佳為6%以上,亦可為7%以上、8%以上、9%以上或10%以上。When the haze of the adhesive sheet is high, when optical inspection is performed by visual inspection or photography in the manufacturing process of the device, light scattering on the adhesive sheet may hinder the inspection and reduce inspection accuracy. Therefore, from the viewpoint of ensuring inspection accuracy, the haze of the adhesive sheet is preferably less than 6%, and may be 5% or less, 4% or less, or 3% or less. On the other hand, since the haze of the adhesive sheet is high in the final product such as a display, it is possible to prevent the user from seeing (recognizing) components such as optical sensors arranged on the back side of the adhesive sheet. From this point of view, the haze of the adhesive sheet is preferably 3% or more, more preferably 5% or more, further preferably 6% or more, and may be 7% or more, 8% or more, 9% or more, or 10% or more. %above.

本發明之黏著片材於光硬化前霧度較低,藉由光硬化而霧度上升。因此,藉由在使黏著片材光硬化前實施光學檢查,可提高光學檢查之精度。又,於使黏著片材光硬化而得之最終製品中,黏著片材之霧度較高,故而裝置之使用者不易辨識到配置於背面之光學感測器等。The adhesive sheet of the present invention has a low haze before photohardening, and the haze increases after photohardening. Therefore, by performing optical inspection before photocuring the adhesive sheet, the accuracy of optical inspection can be improved. In addition, in the final product obtained by photocuring the adhesive sheet, the haze of the adhesive sheet is high, so it is difficult for the user of the device to recognize the optical sensor and the like arranged on the back.

由光硬化引起之黏著片材之霧度之上升量、即光硬化後之黏著片材之H 1與光硬化前之黏著片材之霧度H 0的差H 1-H 0較佳為1.0%以上,更佳為1.5%以上,亦可為2.0%以上、2.5%以上、3.0%以上、4.0%以上或5.0%以上。霧度上升量之上限並無特別限定,一般而言可為30%以下、20%以下或15%以下。 The increase in haze of the adhesive sheet caused by photohardening, that is, the difference H 1 -H 0 between the H 1 of the adhesive sheet after photohardening and the haze H 0 of the adhesive sheet before photohardening is preferably 1.0 % or more, more preferably 1.5% or more, and may be 2.0% or more, 2.5% or more, 3.0% or more, 4.0% or more or 5.0% or more. The upper limit of the haze increase amount is not particularly limited, but generally, it may be 30% or less, 20% or less, or 15% or less.

<黏著劑組合物> 構成黏著片材2之黏著劑組合物含有基礎聚合物及光硬化劑,具有光硬化性。如下所述,藉由使黏著劑組合物含有特定之基礎聚合物及光硬化劑,可獲得由光硬化引起之霧度上升較大之黏著片材。就提高光硬化之效率之觀點而言,構成黏著片材2之黏著劑組合物(光硬化性組合物)較佳為含有光聚合起始劑。 <Adhesive composition> The adhesive composition constituting the adhesive sheet 2 contains a base polymer and a photocuring agent, and has photocurability. As described below, by making the adhesive composition contain a specific base polymer and a photocuring agent, an adhesive sheet having a large increase in haze due to photocuring can be obtained. From the viewpoint of improving the efficiency of photocuring, the adhesive composition (photocurable composition) constituting the adhesive sheet 2 preferably contains a photopolymerization initiator.

(基礎聚合物) 基礎聚合物為黏著劑組合物之主要構成成分,為決定黏著片材之接著力等諸特性之主要要素。根據易於控制接著力等之方面而言,黏著劑組合物較佳為含有丙烯酸系聚合物作為基礎聚合物,較佳為黏著劑組合物之50重量%以上為丙烯酸系聚合物。 (base polymer) The base polymer is the main component of the adhesive composition, and is the main factor determining the properties of the adhesive sheet such as the adhesive force. The adhesive composition preferably contains an acrylic polymer as a base polymer from the viewpoint of easy control of the adhesive force, and more than 50% by weight of the adhesive composition is preferably an acrylic polymer.

丙烯酸系基礎聚合物含有(甲基)丙烯酸烷基酯作為主要單體成分。再者,於本說明書中,「(甲基)丙烯酸」係指丙烯酸及/或甲基丙烯酸。The acrylic base polymer contains an alkyl (meth)acrylate as a main monomer component. In addition, in this specification, "(meth)acrylic acid" means acrylic acid and/or methacrylic acid.

作為(甲基)丙烯酸烷基酯,較佳為使用烷基碳數1~22之(甲基)丙烯酸C 1-22烷基酯。於(甲基)丙烯酸烷基酯中,烷基可具有分枝,亦可具有環狀烷基。 As the alkyl (meth)acrylate, a C 1-22 alkyl (meth)acrylate having 1 to 22 alkyl carbon atoms is preferably used. In the alkyl (meth)acrylate, the alkyl group may have a branch or may have a cyclic alkyl group.

丙烯酸系基礎聚合物中,較佳為相對於構成單體成分總量,含有70重量%以上之(甲基)丙烯酸烷基酯,該(甲基)丙烯酸烷基酯中之烷基為碳數6以上之鏈狀烷基。存在具有碳數6以上之鏈狀烷基之(甲基)丙烯酸烷基酯(以下,記載為「C6以上烷基(甲基)丙烯酸酯」)之比率越高,則光硬化後之黏著片材之霧度越高之傾向。C6以上烷基(甲基)丙烯酸酯之量相對於構成單體成分總量,更佳為75重量%以上,進而較佳為80重量%以上,亦可為85重量%以上、90重量%以上、93重量%以上或95重量%以上。The acrylic base polymer preferably contains at least 70% by weight of an alkyl (meth)acrylate based on the total amount of monomer components, and the alkyl group in the alkyl (meth)acrylate has the number of carbon atoms A chain alkyl group of 6 or more. The higher the ratio of alkyl (meth)acrylates (hereinafter referred to as "alkyl (meth)acrylates with C6 or more") having a chained alkyl group having 6 or more carbon atoms, the better the photocured adhesive sheet will be. The higher the haze of the material tends to be. The amount of the C6 or higher alkyl (meth)acrylate is more preferably 75% by weight or more, more preferably 80% by weight or more, and may be 85% by weight or more, or 90% by weight or more with respect to the total amount of constituent monomer components , 93% by weight or more or 95% by weight or more.

C6以上烷基(甲基)丙烯酸酯之量之上限並無特別限定。如下所述,為了將交聯點導入至丙烯酸系基礎聚合物中,較佳為使用含羥基單體或含羧基單體,相對於丙烯酸系基礎聚合物之構成單體成分總量,C6以上烷基(甲基)丙烯酸酯之量較佳為99.5重量%以下,更佳為99重量%以下,亦可為98重量%以下或97重量%以下。The upper limit of the amount of C6 or more alkyl (meth)acrylate is not particularly limited. As described below, in order to introduce crosslinking points into the acrylic base polymer, it is preferable to use a hydroxyl group-containing monomer or a carboxyl group-containing monomer. The amount of base (meth)acrylate is preferably 99.5% by weight or less, more preferably 99% by weight or less, and may be 98% by weight or less or 97% by weight or less.

C6以上烷基(甲基)丙烯酸酯之鏈狀烷基可為直鏈,亦可具有分枝。作為C6以上烷基(甲基)丙烯酸酯之具體例,可例舉:(甲基)丙烯酸己酯、(甲基)丙烯酸庚酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸辛酯、(甲基)丙烯酸異辛酯、(甲基)丙烯酸壬酯、(甲基)丙烯酸異壬酯、(甲基)丙烯酸癸酯、(甲基)丙烯酸異癸酯、(甲基)丙烯酸十一烷基酯、(甲基)丙烯酸十二烷基酯、(甲基)丙烯酸異十三烷基酯、(甲基)丙烯酸十四烷基酯、(甲基)丙烯酸異十四烷基酯、(甲基)丙烯酸十五烷基酯、(甲基)丙烯酸十六烷基酯、(甲基)丙烯酸十七烷基酯、(甲基)丙烯酸十八烷基酯、(甲基)丙烯酸異十八烷基酯、(甲基)丙烯酸十九烷基酯、(甲基)丙烯酸二十烷基酯、丙烯酸二十二烷基酯等。The chain alkyl group of C6 or more alkyl (meth)acrylate may be a straight chain or may have a branch. Specific examples of alkyl (meth)acrylates with C6 or more include: hexyl (meth)acrylate, heptyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, (meth)acrylate ) octyl acrylate, isooctyl (meth)acrylate, nonyl (meth)acrylate, isononyl (meth)acrylate, decyl (meth)acrylate, isodecyl (meth)acrylate, (meth)acrylate base) undecyl acrylate, dodecyl (meth)acrylate, isotridecyl (meth)acrylate, tetradecyl (meth)acrylate, isodecayl (meth)acrylate Tetradecyl ester, Pentadecyl (meth)acrylate, Hexadecyl (meth)acrylate, Heptadecyl (meth)acrylate, Octadecyl (meth)acrylate, ( Isostearyl methacrylate, nonadecyl (meth)acrylate, eicosyl (meth)acrylate, behenyl acrylate, etc.

就降低丙烯酸系基礎聚合物之玻璃轉移溫度而使黏著片材具有適度柔軟性之觀點而言,C6以上烷基(甲基)丙烯酸酯中之鏈狀烷基之碳數較佳為9以下。作為低Tg之C6以上烷基(甲基)丙烯酸酯之具體例,可例舉:丙烯酸2-乙基己酯(Tg:-70℃)、丙烯酸正己酯(Tg:-65℃)、丙烯酸正辛酯(Tg:-65℃)、丙烯酸異壬酯(Tg:-60℃)、丙烯酸正壬酯(Tg:-58℃)、丙烯酸異辛酯(Tg:-58℃)等。From the viewpoint of lowering the glass transition temperature of the acrylic base polymer and making the adhesive sheet moderately flexible, the carbon number of the chain alkyl group in the alkyl (meth)acrylate of C6 or more is preferably 9 or less. Specific examples of low Tg C6 or higher alkyl (meth)acrylates include: 2-ethylhexyl acrylate (Tg: -70°C), n-hexyl acrylate (Tg: -65°C), n-hexyl acrylate Octyl acrylate (Tg: -65°C), isononyl acrylate (Tg: -60°C), n-nonyl acrylate (Tg: -58°C), isooctyl acrylate (Tg: -58°C), etc.

如上所述,C6以上烷基(甲基)丙烯酸酯中之鏈狀烷基可具有分枝。認為於烷基之碳數較大之情形時或烷基具有分枝結構之情形時,由於分子體積較大,故而於藉由官能基數較大之光硬化劑來使黏著劑光硬化時,容易形成體積較大之相疇,霧度上升顯著。As mentioned above, the chain alkyl group in C6 or more alkyl (meth)acrylate may have a branch. It is considered that when the carbon number of the alkyl group is large or the alkyl group has a branched structure, the molecular volume is large, so it is easy to light-cure the adhesive with a light-hardening agent with a large functional group. Larger phase domains are formed, and the haze increases significantly.

丙烯酸系基礎聚合物之構成單體成分可含有2種以上之C6以上烷基(甲基)丙烯酸酯,亦可含有(甲基)丙烯酸C 6-9烷基酯及(甲基)丙烯酸C 10-22烷基酯。 The monomer components of the acrylic base polymer can contain more than two kinds of C6 or more alkyl (meth)acrylates, and can also contain C 6-9 alkyl (meth)acrylates and C 10 (meth)acrylates -22 Alkyl esters.

丙烯酸系基礎聚合物之構成單體成分除可含有C6以上烷基(甲基)丙烯酸酯以外,亦可含有具有碳數5以下之烷基之(甲基)丙烯酸烷基酯、或具有環狀烷基之(甲基)丙烯酸烷基酯。The monomer components of the acrylic base polymer may contain not only C6 or more alkyl (meth)acrylates, but also alkyl (meth)acrylates having an alkyl group with 5 or less carbon atoms, or a cyclic Alkyl (meth)acrylates.

作為具有碳數5以下之烷基之(甲基)丙烯酸烷基酯之具體例,可例舉:(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸丁酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸第二丁酯、(甲基)丙烯酸第三丁酯、(甲基)丙烯酸戊酯、(甲基)丙烯酸異戊酯、(甲基)丙烯酸新戊酯等。Specific examples of alkyl (meth)acrylates having an alkyl group having 5 or less carbon atoms include methyl (meth)acrylate, ethyl (meth)acrylate, butyl (meth)acrylate, Isobutyl (meth)acrylate, second butyl (meth)acrylate, third butyl (meth)acrylate, amyl (meth)acrylate, isoamyl (meth)acrylate, (meth) Neopentyl acrylate, etc.

作為具有脂環式烷基之(甲基)丙烯酸烷基酯之具體例,可例舉:(甲基)丙烯酸環戊酯、(甲基)丙烯酸環己酯、(甲基)丙烯酸環庚酯、(甲基)丙烯酸環辛酯等(甲基)丙烯酸環烷基酯;(甲基)丙烯酸異𦯉酯等具有二環式脂肪族烴環之(甲基)丙烯酸酯;(甲基)丙烯酸二環戊酯、(甲基)丙烯酸二環戊氧基乙酯、(甲基)丙烯酸三環戊酯、(甲基)丙烯酸-1-金剛烷酯、(甲基)丙烯酸-2-甲基-2-金剛烷酯、(甲基)丙烯酸-2-乙基-2-金剛烷酯等具有三環以上之脂肪族烴環之(甲基)丙烯酸酯。Specific examples of alkyl (meth)acrylates having an alicyclic alkyl group include cyclopentyl (meth)acrylate, cyclohexyl (meth)acrylate, and cycloheptyl (meth)acrylate. Cycloalkyl (meth)acrylates such as cyclooctyl (meth)acrylate; (meth)acrylates with bicyclic aliphatic hydrocarbon rings such as iso(meth)acrylate; (meth)acrylic acid Dicyclopentyl, Dicyclopentyloxyethyl (meth)acrylate, Tricyclopentyl (meth)acrylate, 1-adamantyl (meth)acrylate, 2-methyl (meth)acrylate (Meth)acrylates having an aliphatic hydrocarbon ring having three or more rings, such as 2-adamantyl ester and 2-ethyl-2-adamantyl (meth)acrylate.

丙烯酸系基礎聚合物較佳為除含有上述(甲基)丙烯酸烷基酯以外,亦含有具有可交聯官能基之單體成分作為共聚成分。作為具有可交聯官能基之單體,可例舉含羥基單體、含羧基單體。於丙烯酸系基礎聚合物中,作為共聚成分,可具有含羥基單體及含羧基單體兩者,亦可僅具有任意一者。藉由向丙烯酸系基礎聚合物中導入交聯結構,有凝集力提昇、光硬化前之黏著片材2自被黏著體剝離之剝離性提昇的傾向。The acrylic base polymer preferably contains a monomer component having a crosslinkable functional group as a copolymerization component in addition to the above-mentioned alkyl (meth)acrylate. The monomer having a crosslinkable functional group may, for example, be a hydroxyl group-containing monomer or a carboxyl group-containing monomer. The acrylic base polymer may have both a hydroxyl group-containing monomer and a carboxyl group-containing monomer as a copolymerization component, or may have only any one. The introduction of a crosslinked structure into the acrylic base polymer tends to improve the cohesive force, and the peelability of the adhesive sheet 2 before photocuring from the adherend tends to improve.

作為含羥基單體,可例舉:(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸2-羥基丙酯、(甲基)丙烯酸4-羥基丁酯、(甲基)丙烯酸6-羥基己酯、(甲基)丙烯酸8-羥基辛酯、(甲基)丙烯酸10-羥基癸酯、(甲基)丙烯酸12-羥基月桂酯、(甲基)丙烯酸4-(羥甲基)環己基甲酯等。作為含羧基單體,可例舉:(甲基)丙烯酸、(甲基)丙烯酸2-羧基乙酯、(甲基)丙烯酸羧基戊酯、伊康酸、馬來酸、富馬酸、丁烯酸等。Examples of hydroxyl-containing monomers include: 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, 6-hydroxy (meth)acrylate Hydroxyhexyl, 8-hydroxyoctyl (meth)acrylate, 10-hydroxydecyl (meth)acrylate, 12-hydroxylauryl (meth)acrylate, 4-(hydroxymethyl)cyclo(meth)acrylate Hexyl Methyl Etc. Examples of carboxyl group-containing monomers include: (meth)acrylic acid, 2-carboxyethyl (meth)acrylate, carboxypentyl (meth)acrylate, itaconic acid, maleic acid, fumaric acid, butene Acid etc.

於丙烯酸系基礎聚合物中,相對於構成單體成分總量,含羥基單體及含羧基單體之合計量較佳為0.5~20重量%,更佳為1~15重量%,亦可為1.5~10重量%。In the acrylic base polymer, the total amount of the hydroxyl group-containing monomer and the carboxyl group-containing monomer is preferably 0.5 to 20% by weight, more preferably 1 to 15% by weight, and may be 1.5 to 10% by weight.

於丙烯酸系基礎聚合物中,作為構成單體成分,亦可含有N-乙烯基吡咯啶酮、甲基乙烯基吡咯啶酮、乙烯基吡啶、乙烯基哌啶酮、乙烯基嘧啶、乙烯基哌𠯤、乙烯基吡𠯤、乙烯基吡咯、乙烯基咪唑、乙烯基㗁唑、乙烯基嗎啉、N-丙烯醯嗎啉、N-乙烯基羧酸醯胺類、N-乙烯基己內醯胺等含氮單體。The acrylic base polymer may contain N-vinylpyrrolidone, methylvinylpyrrolidone, vinylpyridine, vinylpiperidone, vinylpyrimidine, vinylpiperidone, etc. 𠯤, vinyl pyrrole, vinyl pyrrole, vinyl imidazole, vinyl azole, vinyl morpholine, N-acryloyl morpholine, N-vinyl carboxylic acid amides, N-vinyl caprolactam and other nitrogen-containing monomers.

丙烯酸系基礎聚合物亦可含有除上述以外之單體成分。於丙烯酸系基礎聚合物中,作為單體成分,亦可含有例如乙烯酯單體、芳香族乙烯基單體、含環氧基單體、乙烯醚單體、含磺基單體、含磷酸基單體、含酸酐基單體等。The acrylic base polymer may contain monomer components other than the above. In the acrylic base polymer, as monomer components, vinyl ester monomers, aromatic vinyl monomers, epoxy group-containing monomers, vinyl ether monomers, sulfo group-containing monomers, phosphoric acid group-containing monomers, etc. Monomers, monomers containing acid anhydride groups, etc.

藉由使用溶液聚合、乳化聚合、塊狀聚合等各種公知方法使上述單體成分聚合,可獲得作為基礎聚合物之丙烯酸系聚合物。就黏著劑之接著力、保持力等特性之平衡及成本等觀點而言,較佳為溶液聚合法。作為溶液聚合之溶劑,可使用乙酸乙酯、甲苯、甲基乙基酮等。溶液濃度通常為20~80重量%左右。作為聚合起始劑,可使用偶氮系、過氧化物系等各種公知物質。為調整分子量,可使用鏈轉移劑。反應溫度通常為50~80℃左右,反應時間通常為1~8小時左右。An acrylic polymer as a base polymer can be obtained by polymerizing the above-mentioned monomer components using various known methods such as solution polymerization, emulsion polymerization, and bulk polymerization. The solution polymerization method is preferable from the standpoint of the balance of properties such as adhesive force and holding force of the adhesive, and cost. As a solvent for solution polymerization, ethyl acetate, toluene, methyl ethyl ketone and the like can be used. The solution concentration is usually about 20 to 80% by weight. As a polymerization initiator, various well-known substances, such as an azo system and a peroxide system, can be used. To adjust the molecular weight, chain transfer agents can be used. The reaction temperature is usually about 50 to 80°C, and the reaction time is usually about 1 to 8 hours.

丙烯酸系基礎聚合物之重量平均分子量較佳為10萬~200萬,更佳為20萬~150萬,進而較佳為30萬~100萬。再者,於向丙烯酸系基礎聚合物中導入交聯結構之情形時,基礎聚合物之分子量係指導入交聯結構前之分子量。The weight average molecular weight of the acrylic base polymer is preferably from 100,000 to 2 million, more preferably from 200,000 to 1.5 million, and still more preferably from 300,000 to 1 million. In addition, when introducing a crosslinked structure into an acrylic base polymer, the molecular weight of a base polymer means the molecular weight before introducing a crosslinked structure.

(交聯劑) 就使黏著劑具有適度凝集力並表現出接著力,並且確保光硬化前之黏著片材自被黏著體剝離之剝離性的觀點而言,較佳為向丙烯酸系基礎聚合物中導入交聯結構。例如,藉由向使丙烯酸系基礎聚合物聚合後之溶液中添加交聯劑,並視需要進行加熱,而導入交聯結構。作為交聯劑,可例舉異氰酸酯系交聯劑、環氧系交聯劑、㗁唑啉系交聯劑、氮丙啶系交聯劑、碳二醯亞胺系交聯劑、金屬螯合物系交聯劑等。該等交聯劑與導入至丙烯酸系基礎聚合物中之羥基、羧基等官能基反應而形成交聯結構。基於與丙烯酸系基礎聚合物之羥基或羧基之反應性較高而易於導入交聯結構之方面而言,較佳為異氰酸酯系交聯劑及環氧系交聯劑。 (crosslinking agent) Introducing a cross-linked structure into the acrylic base polymer is preferable from the viewpoint of making the adhesive have moderate cohesion and adhesive force, and ensuring the peelability of the adhesive sheet before photocuring from the adherend. . For example, a crosslinked structure is introduced by adding a crosslinking agent to a solution obtained by polymerizing an acrylic base polymer, and heating as necessary. The crosslinking agent may, for example, be an isocyanate crosslinking agent, an epoxy crosslinking agent, an azoline crosslinking agent, an aziridine crosslinking agent, a carbodiimide crosslinking agent, a metal chelate Cross-linking agent, etc. These crosslinking agents react with functional groups such as hydroxyl and carboxyl introduced into the acrylic base polymer to form a crosslinking structure. Isocyanate-based crosslinking agents and epoxy-based crosslinking agents are preferred because they have high reactivity with the hydroxyl group or carboxyl group of the acrylic base polymer and are easy to introduce a crosslinked structure.

作為異氰酸酯系交聯劑,可使用於1分子中具有2個以上異氰酸基之多異氰酸酯。作為多異氰酸酯系交聯劑,例如可例舉:伸丁基二異氰酸酯、六亞甲基二異氰酸酯等低級脂肪族多異氰酸酯類;伸環戊基二異氰酸酯、伸環己基二異氰酸酯、異佛爾酮二異氰酸酯等脂環族異氰酸酯類;2,4-甲苯二異氰酸酯、4,4'-二苯基甲烷二異氰酸酯、苯二甲基二異氰酸酯等芳香族異氰酸酯類;三羥甲基丙烷/甲苯二異氰酸酯三聚體加成物(例如,東曹製造之「Coronate L」)、三羥甲基丙烷/六亞甲基二異氰酸酯三聚體加成物(例如,東曹製造之「Coronate HL」)、苯二甲基二異氰酸酯之三羥甲基丙烷加成物(例如,三井化學製造之「Takenate D110N」、六亞甲基二異氰酸酯之異氰尿酸酯體(例如,東曹製造之「Coronate HX」)等異氰酸酯加成物等。As an isocyanate type crosslinking agent, the polyisocyanate which has 2 or more isocyanate groups in 1 molecule can be used. Examples of the polyisocyanate-based crosslinking agent include: lower aliphatic polyisocyanates such as butyl diisocyanate and hexamethylene diisocyanate; cyclopentyl diisocyanate, cyclohexylene diisocyanate, isophorone Alicyclic isocyanate such as diisocyanate; Aromatic isocyanate such as 2,4-toluene diisocyanate, 4,4'-diphenylmethane diisocyanate, xylylene diisocyanate; Trimethylolpropane/toluene diisocyanate Trimer adducts (for example, "Coronate L" manufactured by Tosoh), trimethylolpropane/hexamethylene diisocyanate trimer adducts (for example, "Coronate HL" manufactured by Tosoh), Trimethylolpropane adduct of xylylene diisocyanate (for example, "Takenate D110N" manufactured by Mitsui Chemicals, isocyanurate form of hexamethylene diisocyanate (for example, "Coronate HX" manufactured by Tosoh) ”) and other isocyanate adducts, etc.

作為環氧系交聯劑,可使用於1分子中具有2個以上環氧基之多官能環氧化合物。環氧系交聯劑亦可為於1分子中具有3個以上或4個以上環氧基者。環氧系交聯劑之環氧基亦可為縮水甘油基。作為環氧系交聯劑,例如可例舉:N,N,N',N'-四縮水甘油基間苯二甲胺、二縮水甘油基苯胺、1,3-雙(N,N-二縮水甘油胺甲基)環己烷、1,6-己二醇二縮水甘油醚、新戊二醇二縮水甘油醚、乙二醇二縮水甘油醚,丙二醇二縮水甘油醚、聚乙二醇二縮水甘油醚、聚丙二醇二縮水甘油醚、山梨醇聚縮水甘油醚、丙三醇聚縮水甘油醚、季戊四醇聚縮水甘油醚、聚丙三醇聚縮水甘油醚、山梨醇酐聚縮水甘油醚、三羥甲基丙烷聚縮水甘油醚、己二酸二縮水甘油酯、鄰苯二甲酸二縮水甘油酯,三縮水甘油基-三(2-羥乙基)異氰尿酸酯、間苯二酚二縮水甘油醚、雙酚S二縮水甘油醚等。作為環氧系交聯劑,亦可使用長瀨化成製造之「Denacol」、三菱瓦斯化學製造之「Tetrad X」「Tetrad C」等市售品。As an epoxy crosslinking agent, the polyfunctional epoxy compound which has 2 or more epoxy groups in 1 molecule can be used. The epoxy-type crosslinking agent may have 3 or more or 4 or more epoxy groups in 1 molecule. The epoxy group of the epoxy-based crosslinking agent may also be a glycidyl group. Examples of epoxy-based crosslinking agents include: N,N,N',N'-tetraglycidyl-m-xylylenediamine, diglycidylaniline, 1,3-bis(N,N-di Glycidylaminomethyl) cyclohexane, 1,6-hexanediol diglycidyl ether, neopentyl glycol diglycidyl ether, ethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, polyethylene glycol di Glycidyl ether, polypropylene glycol diglycidyl ether, sorbitol polyglycidyl ether, glycerol polyglycidyl ether, pentaerythritol polyglycidyl ether, polyglycerol polyglycidyl ether, sorbitan polyglycidyl ether, trihydroxy Methyl propane polyglycidyl ether, diglycidyl adipate, diglycidyl phthalate, triglycidyl-tris(2-hydroxyethyl)isocyanurate, resorcinol diglycidyl Glyceryl ether, bisphenol S diglycidyl ether, etc. As the epoxy-based crosslinking agent, commercially available items such as "Denacol" manufactured by Nagase Kasei, "Tetrad X" and "Tetrad C" manufactured by Mitsubishi Gas Chemical can also be used.

交聯劑之使用量可根據丙烯酸系基礎聚合物之組成及分子量等適當地調整。相對於丙烯酸系基礎聚合物100重量份,交聯劑之使用量為0.03~2重量份左右,較佳為0.05~1重量份,更佳為0.08~0.8重量份,亦可為0.1~0.5重量份。The usage-amount of a crosslinking agent can be adjusted suitably according to the composition, molecular weight, etc. of an acrylic base polymer. With respect to 100 parts by weight of the acrylic base polymer, the amount of crosslinking agent used is about 0.03 to 2 parts by weight, preferably 0.05 to 1 part by weight, more preferably 0.08 to 0.8 parts by weight, or 0.1 to 0.5 parts by weight share.

為促進交聯結構之形成,亦可使用交聯觸媒。作為交聯觸媒,可例舉:有機金屬錯合物(螯合物)、金屬與烷氧基之化合物、及金屬與醯氧基之化合物等有機金屬化合物;以及三級胺等。尤其是,就抑制常溫溶液狀態下之交聯反應之進行以確保黏著劑組合物之適用期之觀點而言,較佳為有機金屬化合物。作為有機金屬化合物之金屬,可例舉鐵、錫、鋁、鋯、鋅、鈦、鉛、鈷等。相對於丙烯酸系基礎聚合物100重量份,交聯觸媒之使用量一般為0.5重量份以下。In order to promote the formation of the cross-linked structure, a cross-linking catalyst can also be used. As a crosslinking catalyst, organometallic compounds, such as an organometallic complex (chelate compound), the compound of a metal and an alkoxy group, and the compound of a metal and an acyloxy group; and a tertiary amine etc. are mentioned. In particular, an organometallic compound is preferable from the viewpoint of suppressing the progress of the crosslinking reaction in a solution state at room temperature to secure the pot life of the adhesive composition. The metal of the organometallic compound may, for example, be iron, tin, aluminum, zirconium, zinc, titanium, lead or cobalt. The usage-amount of a crosslinking catalyst is generally 0.5 weight part or less with respect to 100 weight part of acrylic base polymers.

(光硬化劑) 構成黏著片材2之黏著劑組合物除含有丙烯酸系基礎聚合物以外,亦含有光硬化劑。若含有光硬化性黏著劑組合物之黏著片材2在與被黏著體貼合後進行光硬化,則與被黏著體之接著力提昇。 (light hardener) The adhesive composition constituting the adhesive sheet 2 also contains a photocuring agent in addition to the acrylic base polymer. When the adhesive sheet 2 containing the photocurable adhesive composition is photocured after being bonded to an adherend, the adhesive force with the adherend is enhanced.

作為光硬化劑,可使用於1分子中具有4個以上(甲基)丙烯醯基之多官能(甲基)丙烯酸酯。關於多官能(甲基)丙烯酸酯,代表性而言有多元醇與(甲基)丙烯酸之酯。就與丙烯酸系基礎聚合物之相容性之觀點而言,光硬化劑之分子量較佳為2000以下,更佳為1000以下,亦可為800以下或600以下。就使光硬化後之黏著劑具有適度凝集性從而提高接著性之觀點而言,光硬化劑之官能基當量(即每個(甲基)丙烯醯基之分子量)較佳為60~200,更佳為70~150,亦可為75~130或80~120。As a light hardening agent, the polyfunctional (meth)acrylate which has 4 or more (meth)acryloyl groups in 1 molecule can be used. Polyfunctional (meth)acrylates are typically esters of polyhydric alcohols and (meth)acrylic acid. From the viewpoint of compatibility with the acrylic base polymer, the molecular weight of the photocuring agent is preferably 2,000 or less, more preferably 1,000 or less, and may be 800 or 600 or less. From the point of view of making the adhesive after light hardening moderately cohesive and thereby improving adhesion, the functional group equivalent weight of the light hardener (that is, the molecular weight of each (meth)acryl group) is preferably 60-200, more preferably Preferably it is 70-150, and it can also be 75-130 or 80-120.

作為四官能以上之多官能(甲基)丙烯酸酯之具體例,可例舉:四羥甲基甲烷四(甲基)丙烯酸酯、二-三羥甲基丙烷四(甲基)丙烯酸酯、二-三羥甲基丙烷五(甲基)丙烯酸酯、二-三羥甲基丙烷六(甲基)丙烯酸酯、季戊四醇四(甲基)丙烯酸酯、乙氧化季戊四醇四(甲基)丙烯酸酯、丙氧化季戊四醇四(甲基)丙烯酸酯、二季戊四醇五(甲基)丙烯酸酯、二季戊四醇六(甲基)丙烯酸酯等。多官能(甲基)丙烯酸酯亦可併用2種以上。Specific examples of tetrafunctional or higher polyfunctional (meth)acrylates include: tetramethylolmethane tetra(meth)acrylate, di-trimethylolpropane tetra(meth)acrylate, di - Trimethylolpropane penta(meth)acrylate, di-trimethylolpropane hexa(meth)acrylate, pentaerythritol tetra(meth)acrylate, ethoxylated pentaerythritol tetra(meth)acrylate, propane Oxidized pentaerythritol tetra(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, and the like. A polyfunctional (meth)acrylate can also use 2 or more types together.

由於多官能(甲基)丙烯酸酯顯示出與丙烯酸系基礎聚合物之適度之相容性,並且與丙烯酸系基礎聚合物之折射率差較小,故而可降低光硬化前之黏著片材之霧度。又,藉由使用四官能以上之多官能(甲基)丙烯酸酯作為光硬化劑,有光硬化後之黏著片材之霧度上升之傾向,且有多官能(甲基)丙烯酸酯之量越多,則由光硬化所引起之黏著片材之霧度上升量H 1-H 0越大之傾向。 Since the multifunctional (meth)acrylate shows moderate compatibility with the acrylic base polymer and has a small refractive index difference with the acrylic base polymer, it can reduce the fogging of the adhesive sheet before photohardening Spend. Also, by using a polyfunctional (meth)acrylate with four or more functions as a light hardener, there is a tendency for the haze of the adhesive sheet after light curing to increase, and the more the amount of the polyfunctional (meth)acrylate The larger the amount, the larger the haze increase H 1 -H 0 of the adhesive sheet due to photohardening tends to be.

相對於丙烯酸系基礎聚合物100重量份,黏著劑組合物中之四官能以上之多官能(甲基)丙烯酸酯之量較佳為7重量份以上,更佳為8重量份以上,進而較佳為10重量份以上,亦可為13重量份以上或15重量份以上。黏著劑組合物中之四官能以上之多官能(甲基)丙烯酸酯之量並無特別限定,但於光硬化劑之量過大之情形時,光硬化前之黏著片材之霧度有可能上升。又,於光硬化劑之量過大之情形時,光硬化後之黏著片材之接著力或柔軟性有可能不足。因此,相對於丙烯酸系基礎聚合物100重量份,黏著劑組合物中之四官能以上之多官能(甲基)丙烯酸酯之量較佳為40重量份以下,更佳為35重量份以下,進而較佳為30重量份以下,亦可為25重量份以下。With respect to 100 parts by weight of the acrylic base polymer, the amount of the tetrafunctional or higher polyfunctional (meth)acrylate in the adhesive composition is preferably 7 parts by weight or more, more preferably 8 parts by weight or more, and even more preferably It is 10 parts by weight or more, and may be 13 parts by weight or more, or 15 parts by weight or more. The amount of the tetrafunctional or more functional (meth)acrylate in the adhesive composition is not particularly limited, but if the amount of the photohardener is too large, the haze of the adhesive sheet before photohardening may increase . Also, when the amount of the photocuring agent is too large, the adhesion and flexibility of the adhesive sheet after photocuring may be insufficient. Therefore, with respect to 100 parts by weight of the acrylic base polymer, the amount of the tetrafunctional or higher polyfunctional (meth)acrylate in the adhesive composition is preferably 40 parts by weight or less, more preferably 35 parts by weight or less, and further It is preferably 30 parts by weight or less, and may be 25 parts by weight or less.

於黏著劑組合物中,作為光硬化劑,除含有四官能以上之多官能(甲基)丙烯酸酯以外,亦可含有三官能以下之(甲基)丙烯酸酯、或其他光硬化性單體或低聚物。於黏著劑組合物含有四官能以上之多官能(甲基)丙烯酸酯作為光硬化劑之情形時,相對於丙烯酸系基礎聚合物100重量份,光硬化劑之總量(四官能以上之多官能(甲基)丙烯酸酯與其他光硬化劑之合計)較佳為40重量份以下,亦可為30重量份以下或25重量份以下。相對於丙烯酸系基礎聚合物100重量份,除四官能以上之多官能(甲基)丙烯酸酯以外的光硬化劑之含量較佳為15重量份以下,更佳為10重量份以下,亦可為5重量份以下、3重量份以下、1重量份以下。In the adhesive composition, as a photohardening agent, in addition to polyfunctional (meth)acrylates containing more than four functions, (meth)acrylates below three functions, or other photocurable monomers or Oligomer. When the adhesive composition contains polyfunctional (meth)acrylates with four or more functions as light hardeners, the total amount of light hardeners (polyfunctional (tetrafunctional or more) The total of (meth)acrylate and other photocuring agents) is preferably 40 parts by weight or less, and may be 30 parts by weight or less or 25 parts by weight or less. With respect to 100 parts by weight of the acrylic base polymer, the content of light hardeners other than polyfunctional (meth)acrylates with four or more functions is preferably 15 parts by weight or less, more preferably 10 parts by weight or less, and may be 5 parts by weight or less, 3 parts by weight or less, and 1 part by weight or less.

(光聚合起始劑) 黏著劑組合物較佳為含有光聚合起始劑。光聚合起始劑藉由活性光線之照射而產生活性種,從而促進光硬化劑之硬化反應。於使用多官能(甲基)丙烯酸酯作為光硬化劑之情形時,較佳為使用光自由基聚合起始劑。作為光自由基聚合起始劑,較佳為藉由波長較450 nm短之可見光或紫外線而裂解並產生自由基之光自由基產生劑,可例舉羥基酮類、苯偶醯二甲基縮酮類、胺基酮類、醯基氧化膦類、二苯甲酮類、含三氯甲基之三𠯤衍生物等。光聚合起始劑可單獨使用,亦可混合使用2種以上。 (photopolymerization initiator) The adhesive composition preferably contains a photopolymerization initiator. The photopolymerization initiator generates active species by the irradiation of active light, thereby promoting the hardening reaction of the photohardener. When using a polyfunctional (meth)acrylate as a photocuring agent, it is preferable to use a photoradical polymerization initiator. As the photoradical polymerization initiator, it is preferably a photoradical generator that is cleaved by visible light or ultraviolet light with a wavelength shorter than 450 nm to generate free radicals, such as hydroxyketones, benzoyl dimethyl acetal Ketones, amino ketones, acyl phosphine oxides, benzophenones, trichloromethyl-containing trioxane derivatives, etc. A photoinitiator may be used individually, and may mix and use 2 or more types.

相對於丙烯酸系基礎聚合物100重量份,黏著劑組合物中之光聚合起始劑之含量為0.001~5重量份左右,亦可為0.01~3重量份或0.03~1重量份。The content of the photopolymerization initiator in the adhesive composition is about 0.001-5 parts by weight, or 0.01-3 parts by weight or 0.03-1 part by weight relative to 100 parts by weight of the acrylic base polymer.

(低聚物) 黏著劑組合物除含有丙烯酸系基礎聚合物以外,亦可含有低聚物。例如,黏著劑組合物除含有丙烯酸系基礎聚合物以外,亦可含有丙烯酸系低聚物。作為低聚物,可使用重量平均分子量為1000~30000左右者。丙烯酸系低聚物含有(甲基)丙烯酸烷基酯作為主要構成單體成分。就提高光硬化後之黏著片材2之接著力之觀點而言,丙烯酸系低聚物之玻璃轉移溫度較佳為40℃以上,更佳為50℃以上。低聚物亦可與丙烯酸系基礎聚合物同樣地含有可交聯官能基。 (Oligomer) The adhesive composition may contain oligomers in addition to the acrylic base polymer. For example, the adhesive composition may contain an acrylic oligomer in addition to the acrylic base polymer. As an oligomer, what has a weight average molecular weight of about 1000-30000 can be used. The acrylic oligomer contains an alkyl (meth)acrylate as a main constituent monomer component. From the viewpoint of improving the adhesive force of the adhesive sheet 2 after photocuring, the glass transition temperature of the acrylic oligomer is preferably 40°C or higher, more preferably 50°C or higher. The oligomer may contain a crosslinkable functional group similarly to the acrylic base polymer.

黏著劑組合物中之低聚物之含量並無特別限定。於黏著劑組合物除含有丙烯酸系基礎聚合物以外,亦含有丙烯酸系低聚物之情形時,就將接著力調整至適當範圍之觀點而言,相對於丙烯酸系基礎聚合物100重量份,低聚物之量較佳為0.1~20重量份,更佳為0.3~10重量份,進而較佳為0.5~5重量份。The content of the oligomer in the adhesive composition is not particularly limited. When the adhesive composition contains an acrylic oligomer in addition to the acrylic base polymer, from the viewpoint of adjusting the adhesive force to an appropriate range, it is less than 100 parts by weight of the acrylic base polymer. The amount of the polymer is preferably 0.1-20 parts by weight, more preferably 0.3-10 parts by weight, and still more preferably 0.5-5 parts by weight.

(其他添加劑) 除上述例示之各成分以外,黏著劑組合物亦可於不損害本發明之特性之範圍內含有矽烷偶合劑、黏著性賦予劑、塑化劑、軟化劑、防劣化劑、填充劑、著色劑、紫外線吸收劑、抗氧化劑、界面活性劑、防靜電劑等添加劑。 (other additives) In addition to the components exemplified above, the adhesive composition may also contain a silane coupling agent, an adhesiveness-imparting agent, a plasticizer, a softener, an anti-deterioration agent, a filler, and a coloring agent within a range that does not impair the characteristics of the present invention. , UV absorbers, antioxidants, surfactants, antistatic agents and other additives.

<黏著片材之形成> 藉由輥式塗佈、接觸輥式塗佈、凹版塗佈、反向塗佈、輥式刷塗、噴塗、浸漬輥塗佈、棒式塗佈、刮塗、氣刀塗佈、淋幕式塗佈、模唇塗佈、模嘴塗佈等,將上述黏著劑組合物塗佈至基材上,並視需要將溶劑乾燥去除,藉此形成黏著片材。作為乾燥方法,可適宜採用恰當之方法。加熱乾燥溫度較佳為40℃~200℃,更佳為50℃~180℃,進而較佳為70℃~170℃。乾燥時間較佳為5秒~20分鐘,更佳為5秒~15分鐘,進而較佳為10秒~10分鐘。 <Formation of Adhesive Sheet> By roll coating, contact roll coating, gravure coating, reverse coating, roll brush coating, spray coating, dip roll coating, rod coating, knife coating, air knife coating, curtain coating Coating, lip coating, die coating, etc., the above-mentioned adhesive composition is applied to the base material, and the solvent is dried and removed if necessary, thereby forming an adhesive sheet. As a drying method, an appropriate method can be suitably adopted. The heating and drying temperature is preferably from 40°C to 200°C, more preferably from 50°C to 180°C, further preferably from 70°C to 170°C. The drying time is preferably from 5 seconds to 20 minutes, more preferably from 5 seconds to 15 minutes, and still more preferably from 10 seconds to 10 minutes.

於黏著劑組合物含有交聯劑之情形時,較佳為於溶劑乾燥之同時或於溶劑乾燥後,藉由加熱或熟化來進行交聯。加熱溫度及加熱時間可根據所使用之交聯劑之種類而適當設定,通常於20℃~160℃之範圍內進行1分鐘至7天左右之加熱來進行交聯。用於將溶劑乾燥去除之加熱亦可兼作用於交聯之加熱。When the adhesive composition contains a crosslinking agent, it is preferable to perform crosslinking by heating or aging simultaneously with or after solvent drying. The heating temperature and heating time can be appropriately set according to the type of cross-linking agent used, and the cross-linking is usually carried out by heating in the range of 20°C to 160°C for about 1 minute to 7 days. The heating for drying and removing the solvent can also be used as the heating for crosslinking.

藉由向丙烯酸系基礎聚合物中導入交聯結構,有凝膠分率上升,黏著片材2之儲存模數上升之傾向。並存在如下傾向:光硬化前之黏著劑之凝膠分率越高,則黏著劑越硬,於補強膜因二次加工等而自被黏著體剝離時,可抑制被黏著體中之糊劑殘留。光硬化前之黏著片材2之凝膠分率(即構成黏著片材之光硬化性組合物之凝膠分率)較佳為25%以上,更佳為30%以上,亦可為35%以上、40%以上或45%以上。另一方面,於凝膠分率過大之情形時,接著力或柔軟性有可能降低。因此,光硬化前之黏著片材2之凝膠分率較佳為80%以下,亦可為75%以下或70%以下。By introducing a crosslinked structure into the acrylic base polymer, the gel fraction increases, and the storage modulus of the adhesive sheet 2 tends to increase. And there is a tendency as follows: the higher the gel fraction of the adhesive before photohardening, the harder the adhesive is, and when the reinforcing film is peeled off from the adherend due to secondary processing, etc., the paste in the adherend can be suppressed residual. The gel fraction of the adhesive sheet 2 before photocuring (that is, the gel fraction of the photocurable composition constituting the adhesive sheet) is preferably 25% or more, more preferably 30% or more, and may be 35% above, above 40%, or above 45%. On the other hand, when the gel fraction is too large, the adhesive force and flexibility may decrease. Therefore, the gel fraction of the adhesive sheet 2 before photocuring is preferably 80% or less, and may be 75% or less or 70% or less.

凝膠分率可以乙酸乙酯等溶劑中之不溶分之形式求出,具體而言,將黏著片材於乙酸乙酯中於23℃下浸漬7天後,以不溶成分相對於浸漬前之試樣之重量分率(單位:重量%)之形式求出凝膠分率。一般而言,聚合物之凝膠分率與交聯度相等,聚合物中之交聯部分越多,則凝膠分率越大。The gel fraction can be obtained as the insoluble fraction in solvents such as ethyl acetate. Specifically, after immersing the adhesive sheet in ethyl acetate at 23°C for 7 days, the ratio of the insoluble fraction to that before immersion was determined. Calculate the gel fraction in the form of the weight fraction of the sample (unit: weight %). Generally speaking, the gel fraction of a polymer is equal to the degree of cross-linking, and the more cross-linking parts in the polymer, the greater the gel fraction.

黏著片材之形成中所使用之基材並無特別限定。例如,可藉由於離型膜51上塗佈黏著劑組合物,並視需要實施溶劑去除及交聯後,附設離型膜52,而如圖1所示,得到兩面暫時黏著有離型膜之黏著片材。亦可於黏著片材2上附設離型膜52後進行交聯。The base material used for formation of an adhesive sheet is not specifically limited. For example, by coating the adhesive composition on the release film 51, and performing solvent removal and crosslinking as necessary, and attaching the release film 52, as shown in FIG. Adhesive sheet. It is also possible to attach a release film 52 to the adhesive sheet 2 and then carry out cross-linking.

作為離型膜51、52,可較佳地使用聚乙烯、聚丙烯、聚對苯二甲酸乙二酯、聚酯膜等塑膠膜。離型膜之厚度通常為3~200 μm,較佳為10~100 μm左右。對於離型膜51、52之與黏著片材2之接觸面,較佳為利用矽酮系、氟系、長鏈烷基系或脂肪酸醯胺系等之離型劑、或者氧化矽粉末等實施離型處理。關於離型膜51、52,亦可對離型處理面及非處理面中之任一者或兩者實施防靜電處理。藉由對離型膜實施防靜電處理,可抑制將離型膜自黏著片材剝離時產生靜電。As the release films 51 and 52, plastic films such as polyethylene, polypropylene, polyethylene terephthalate, and polyester films can be preferably used. The thickness of the release film is usually 3-200 μm, preferably about 10-100 μm. For the contact surfaces of the release films 51, 52 and the adhesive sheet 2, it is preferable to use silicone-based, fluorine-based, long-chain alkyl-based or fatty acid amide-based release agents, or silicon oxide powder. Release treatment. Regarding the release films 51 and 52 , antistatic treatment may be performed on either one or both of the release-treated surface and the non-treated surface. By applying antistatic treatment to the release film, static electricity can be suppressed when the release film is peeled off from the adhesive sheet.

[補強膜] 上述黏著片材被用於各種構件之貼合。於一實施方式中,黏著片材2被用於可撓性塑膠膜基材向各種裝置或其構成構件之表面之貼合。由於藉由將可撓性塑膠膜貼合於裝置或其構成構件之表面而賦予了適度之剛度,故而對於厚度小之構件,可期待提昇操作性及防止破損等效果。 [reinforcing film] The above-mentioned adhesive sheet is used for bonding various members. In one embodiment, the adhesive sheet 2 is used for bonding the flexible plastic film substrate to the surface of various devices or their constituent members. Appropriate rigidity is imparted by attaching a flexible plastic film to the surface of the device or its constituent parts, so it can expect effects such as improved operability and damage prevention for thin-thick members.

於經由黏著片材2將膜基材1貼合於裝置或其構成構件之情形時,亦可如圖2所示,製作黏著片材固著積層於膜基材1上而成之補強膜10,將補強膜10之黏著片材2貼合於裝置或其構成構件之後使黏著片材2進行光硬化。When the film substrate 1 is attached to the device or its constituent members via the adhesive sheet 2, as shown in FIG. After bonding the adhesive sheet 2 of the reinforcing film 10 to the device or its constituent members, the adhesive sheet 2 is photocured.

<膜基材> 作為補強膜10之膜基材1,可使用可撓性之塑膠膜。為將膜基材1與黏著片材2固著,較佳為膜基材1之黏著片材2附設面未實施離型處理。 <Film substrate> As the film substrate 1 of the reinforcing film 10, a flexible plastic film can be used. In order to fix the film substrate 1 and the adhesive sheet 2, it is preferable that the adhesive sheet 2 attachment surface of the film substrate 1 is not subjected to release treatment.

膜基材1之厚度例如為4~500 μm左右。就藉由賦予剛度及緩和衝擊等而對裝置進行補強之觀點而言,膜基材1之厚度較佳為12 μm以上,更佳為20 μm以上,亦可為30 μm以上、40 μm以上或45 μm以上。就使補強膜具有可撓性並提高操作性之觀點而言,膜基材1之厚度較佳為300 μm以下,更佳為200 μm以下。The thickness of the film substrate 1 is, for example, about 4 to 500 μm. From the viewpoint of reinforcing the device by imparting rigidity and mitigating impact, the thickness of the film substrate 1 is preferably at least 12 μm, more preferably at least 20 μm, and may be at least 30 μm, at least 40 μm, or Above 45 μm. The thickness of the film substrate 1 is preferably 300 μm or less, more preferably 200 μm or less, from the viewpoint of making the reinforcing film flexible and improving handleability.

作為構成膜基材1之塑膠材料,可例舉聚酯系樹脂、聚烯烴系樹脂、環狀聚烯烴系樹脂、聚醯胺系樹脂、聚醯亞胺系樹脂、聚醚醚酮、聚醚碸、聚芳酯系樹脂、芳香族聚醯胺系樹脂等。於顯示器等光學裝置用之補強膜中,膜基材1較佳為透明膜。又,於自膜基材1側照射活性光線而使黏著片材2進行光硬化之情形時,膜基材1較佳為相對於黏著劑之硬化所使用之活性光線具有透明性。基於兼具機械強度及透明性之方面而言,可較佳地使用聚對苯二甲酸乙二酯、聚對苯二甲酸丁二酯、聚萘二甲酸乙二酯等聚酯系樹脂、透明聚醯亞胺、透明芳香族聚醯胺、聚醚醚酮。於自被黏著體側照射活性光線之情形時,只要被黏著體相對於活性光線具有透明性即可,膜基材1相對於活性光線可不透明。As the plastic material constituting the film substrate 1, polyester resin, polyolefin resin, cyclic polyolefin resin, polyamide resin, polyimide resin, polyetheretherketone, polyether Polyarylate-based resins, aromatic polyamide-based resins, etc. In the reinforcing film for optical devices such as displays, the film substrate 1 is preferably a transparent film. Also, when the adhesive sheet 2 is photocured by irradiating active light from the film base 1 side, the film base 1 is preferably transparent to the active light used for curing the adhesive. In terms of both mechanical strength and transparency, polyester-based resins such as polyethylene terephthalate, polybutylene terephthalate, and polyethylene naphthalate can be preferably used. Polyimide, transparent aromatic polyamide, polyether ether ketone. When irradiating active rays from the adherend side, it is only necessary that the adherend is transparent to the actinic rays, and the film substrate 1 may be opaque to the actinic rays.

膜基材1之表面上可設置有易接著層、易滑層、離型層、防靜電層、硬塗層、抗反射層等功能性塗層。再者,為將膜基材1與黏著片材2固著,較佳為膜基材1之黏著片材2附設面不設離型層。The surface of the film substrate 1 may be provided with functional coatings such as an easy-adhesive layer, an easy-slip layer, a release layer, an antistatic layer, a hard coat layer, and an anti-reflection layer. Furthermore, in order to fix the film substrate 1 and the adhesive sheet 2 , it is preferable that no release layer is provided on the surface of the film substrate 1 where the adhesive sheet 2 is attached.

<補強膜之製作> 藉由在膜基材1上積層光硬化性黏著片材2,可獲得補強膜。關於黏著片材2,可直接形成於膜基材1上,亦可將形成於離型膜上之黏著片材轉印至膜基材1上。例如,可藉由自圖1所示之附離型膜之黏著片材,將暫時黏著於黏著片材2之一面之離型膜52剝離,並將膜基材1貼合於黏著片材2之露出面上,而獲得如圖2所示於膜基材1上固著積層有黏著片材2且於黏著片材2上暫時黏著有離型膜的補強膜。 <Production of Reinforcement Membrane> A reinforced film can be obtained by laminating the photocurable adhesive sheet 2 on the film substrate 1 . The adhesive sheet 2 may be directly formed on the film substrate 1 , or the adhesive sheet formed on the release film may be transferred onto the film substrate 1 . For example, the release film 52 temporarily attached to one side of the adhesive sheet 2 can be peeled off from the adhesive sheet with a release film shown in FIG. 1 , and the film substrate 1 can be attached to the adhesive sheet 2 As shown in FIG. 2 , an adhesive sheet 2 is fixedly laminated on the film substrate 1 and a release film is temporarily attached to the adhesive sheet 2 .

[附補強膜之裝置] 上述本發明之補強膜係貼合於裝置或裝置構成零件而使用。要貼合補強膜之被黏著體並無特別限定,可例舉各種電子裝置、光學裝置及其構成零件等。 [Device with reinforcement film] The above-mentioned reinforcing film of the present invention is used by being attached to a device or a device component. The adherend to which the reinforcing film is bonded is not particularly limited, and examples thereof include various electronic devices, optical devices, and their constituent parts.

於一實施方式中,要貼合補強膜之被黏著體為有機EL面板。有機EL面板可為頂部發光型及底部發光型之任一者。頂部發光型有機EL面板具有如下構成:於基板上依序具備陽極(金屬電極)、有機發光層及陰極(透明電極),並自陰極側提取光。底部發光型有機EL面板構成為於透明基板上依序具備陰極、有機發光層及陽極,並自透明基板側提取光。藉由使用聚醯亞胺膜等可撓性耐熱膜作為有機EL面板之基板,可實現薄型化及柔性化。In one embodiment, the adherend to which the reinforcing film is bonded is an organic EL panel. The organic EL panel may be any of a top emission type and a bottom emission type. A top emission type organic EL panel has a structure in which an anode (metal electrode), an organic light-emitting layer, and a cathode (transparent electrode) are sequentially provided on a substrate, and light is extracted from the cathode side. The bottom emission type organic EL panel is configured by sequentially including a cathode, an organic light-emitting layer, and an anode on a transparent substrate, and extracting light from the transparent substrate side. By using a flexible heat-resistant film such as a polyimide film as a substrate of an organic EL panel, thinning and flexibility can be realized.

補強膜可貼合於整個被黏著體,亦可選擇性地僅貼合於需補強之部分(補強對象區域)。又,亦可於將補強膜貼合於整個需補強之部分(補強對象區域)及無需補強之區域(非補強對象區域)後,切斷去除非補強對象區域中所貼合之補強膜。於黏著劑進行光硬化前,補強膜處於暫時黏著於被黏著體表面之狀態,故而可將補強膜自被黏著體之表面剝離去除。亦可將補強膜貼合於補強對象區域及非補強對象區域,選擇性地對補強對象區域照射光而使黏著劑進行光硬化後,選擇性地剝離去除黏著劑未硬化之非補強對象區域中之補強膜。The reinforcement film can be attached to the entire adherend, or selectively attached only to the part to be reinforced (reinforcement target area). Also, after bonding the reinforcing film to the entire portion to be reinforced (reinforcement target area) and the non-reinforcement target area (non-reinforcement target area), the reinforcing film attached to the non-reinforcement target area may be cut and removed. Before the adhesive is photohardened, the reinforcing film is in a state of temporarily adhering to the surface of the adherend, so the reinforcing film can be peeled off from the surface of the adherend. It is also possible to attach the reinforcement film to the reinforcement target area and the non-reinforcement target area, selectively irradiate the reinforcement target area with light to light-cure the adhesive, and then selectively peel off and remove the non-reinforcement target area where the adhesive has not hardened The reinforcement film.

由於藉由貼合補強膜而賦予了適度之剛度,故而對於使用可撓性基板之有機EL面板等厚度較小之構件,可期待提昇操作性及防止破損等效果。例如,可於有機EL面板之背面(與光提取側為相反側之面)之可撓性基板上貼合補強膜。亦可於有機EL面板之光提取面貼合補強膜。補強膜亦可貼合於有機EL面板之基板以外處,例如,可將補強膜貼合於將有機發光層及電極密封之密封材料上。Appropriate rigidity is imparted by laminating a reinforcing film, so it can be expected to improve operability and prevent damage to thin members such as organic EL panels using flexible substrates. For example, a reinforcing film may be attached to the flexible substrate on the back surface (the surface opposite to the light extraction side) of the organic EL panel. A reinforcement film can also be pasted on the light extraction surface of the organic EL panel. The reinforcing film can also be pasted outside the substrate of the organic EL panel, for example, the reinforcing film can be pasted on the sealing material that seals the organic light-emitting layer and the electrodes.

於裝置之製造步驟中,於在半成品上貼合補強膜之情形時,可將補強膜貼合於未切斷成製品尺寸之大尺寸半成品上。亦可將補強膜卷對卷地貼合於藉由卷對卷工藝而製造之裝置之母卷上。於貼合補強膜前,為了清潔化等目的,可對被黏著體之表面進行活化處理。作為表面活化處理,可例舉電漿處理、電暈處理、輝光放電處理等。In the manufacturing process of the device, when attaching the reinforcing film to the semi-finished product, the reinforcing film can be attached to the large-sized semi-finished product that has not been cut into the product size. The reinforcement film can also be laminated roll-to-roll on the parent roll of the device manufactured by the roll-to-roll process. Before pasting the reinforcement film, the surface of the adherend can be activated for the purpose of cleaning. The surface activation treatment may, for example, be plasma treatment, corona treatment or glow discharge treatment.

就可自被黏著體剝離,且防止存放或操作時發生剝離之觀點而言,光硬化前之黏著片材2與被黏著體之接著力較佳為0.005~1 N/25 mm左右。關於接著力,將聚醯亞胺膜作為被黏著體,藉由拉伸速度300 mm/分鐘、剝離角度180°之剝離試驗而求出接著力。除非特別說明,否則接著力為25℃下之測定值。From the standpoint of peeling from the adherend and preventing peeling during storage or handling, the adhesive force between the adhesive sheet 2 and the adherend before photocuring is preferably about 0.005 to 1 N/25 mm. Regarding the adhesive force, the adhesive force was determined by a peeling test with a tensile speed of 300 mm/min and a peeling angle of 180° using a polyimide film as an adherend. Unless otherwise specified, the adhesive strength is measured at 25°C.

如上所述,光硬化前之黏著片材2之霧度較佳為未達6%,亦可為5%以下、4%以下或3%以下。藉由使光硬化前之黏著片材2之霧度較小,即便於將補強膜貼合於被黏著體後,亦不會阻礙自膜基材1側藉由目視或拍攝等進行有機EL面板等被黏著體之光學檢查,而可維持檢查精度。As mentioned above, the haze of the adhesive sheet 2 before photocuring is preferably less than 6%, and may be 5% or less, 4% or less, or 3% or less. By reducing the haze of the adhesive sheet 2 before photocuring, even after bonding the reinforcing film to the adherend, it does not prevent the organic EL panel from the film base 1 side by visual inspection or photography. Optical inspection of adherends can maintain inspection accuracy.

將補強膜貼合於被黏著體,並視需要進行光學檢查或補強膜自非補強對象區域之去除後,對黏著片材2照射活性光線,藉此使黏著劑進行光硬化。作為活性光線,可例舉紫外線、可見光、紅外線、X射線、α射線、β射線及γ射線等。基於可抑制存放狀態下之黏著劑之硬化且使硬化較容易之方面而言,活性光線較佳為紫外線。活性光線之照射強度及照射時間可根據黏著劑之組成及厚度等而適當設定。關於對黏著片材2之活性光線之照射,可自膜基材1側及被黏著體側之任一面實施,亦可自兩個面進行活性光線之照射。After attaching the reinforcing film to the adherend and performing an optical inspection or removing the reinforcing film from the non-reinforcing target area as necessary, the adhesive sheet 2 is irradiated with active light to light-harden the adhesive. The actinic ray may, for example, be ultraviolet rays, visible light, infrared rays, X-rays, α-rays, β-rays, or γ-rays. The active light rays are preferably ultraviolet rays, since hardening of the adhesive in a storage state can be suppressed and hardening can be facilitated. The irradiation intensity and irradiation time of the active light can be appropriately set according to the composition and thickness of the adhesive. Irradiation of active light to the adhesive sheet 2 may be performed from either one of the film substrate 1 side and the adherend side, or may be irradiated from both sides.

伴隨光硬化,黏著片材2對於被黏著體之接著力上升。光硬化後之黏著片材2與被黏著體之接著力較佳為2 N/25 mm以上,更佳為2.5 N/25 mm以上。光硬化後之黏著片材2與被黏著體之接著力較佳為光硬化前之黏著片材2與被黏著體之接著力的5倍以上。The adhesive force of the adhesive sheet 2 to an adherend increases with light hardening. The adhesive force between the adhesive sheet 2 and the adherend after photocuring is preferably 2 N/25 mm or more, more preferably 2.5 N/25 mm or more. The adhesive force between the adhesive sheet 2 and the adherend after photocuring is preferably more than 5 times the adhesive force between the adhesive sheet 2 and the adherend before photocuring.

如上所述,黏著片材2藉由光硬化而霧度上升。光硬化後之黏著片材2之霧度較佳為3%以上,更佳為5%以上,進而較佳為6%以上,亦可為7%以上、8%以上、9%以上或10%以上。由光硬化所引起之黏著片材之霧度上升量H 1-H 0較佳為1.0%以上,更佳為1.5%以上,亦可為2.0%以上、2.5%以上、3.0%以上、4.0%以上或5.0%以上,亦可為30%以下、20%以下或15%以下。 As mentioned above, the haze of the adhesive sheet 2 increases by photocuring. The haze of the adhesive sheet 2 after photocuring is preferably 3% or more, more preferably 5% or more, further preferably 6% or more, and may be 7% or more, 8% or more, 9% or more, or 10% above. The haze increase H 1 -H 0 of the adhesive sheet caused by photohardening is preferably 1.0% or more, more preferably 1.5% or more, and may be 2.0% or more, 2.5% or more, 3.0% or more, or 4.0% Above or above 5.0%, may also be below 30%, below 20%, or below 15%.

如上所述,藉由貼合補強膜而向被黏著體賦予適度之剛度,並且使應力得到緩和、分散,故而可抑制製造步驟中可能發生之各種異常,而提昇生產效率,並改善良率。又,由於補強膜於黏著劑進行光硬化前可自被黏著體剝離,故而可於發生積層或貼合不良之情形時進行二次加工,亦可進行自非補強對象區域選擇性地去除補強膜等加工。進而,於光硬化前,黏著片材之霧度較低,故而即便於貼合有補強膜之狀態下,亦能確保利用目視或拍攝所進行之檢查之精度。As described above, by attaching the reinforcing film, moderate rigidity is given to the adherend, and the stress is relaxed and dispersed, so various abnormalities that may occur in the manufacturing process can be suppressed, and the production efficiency can be improved, and the yield rate can be improved. In addition, since the reinforcing film can be peeled off from the adherend before the adhesive is photohardened, it is possible to carry out secondary processing when lamination or poor bonding occurs, and it is also possible to selectively remove the reinforcing film from the non-reinforcing target area Wait for processing. Furthermore, the haze of the adhesive sheet is low before photohardening, so even in the state where the reinforcing film is pasted, the accuracy of inspection by visual inspection or photography can be ensured.

於完成後之裝置之使用中,即便於因裝置掉落、重貨載置於裝置上、飛來物與裝置碰撞等而突然被負載外力之情形時,藉由貼合有補強膜,亦可防止裝置之破損。又,由於使黏著劑進行光硬化後補強膜牢固地接著於裝置,故而即使長時間使用,補強膜亦不易剝離,可靠性優異。又,由於藉由光硬化而使黏著片材高霧度化,故而不易自裝置之外表面視認到配置於補強膜之背面之光學感測器等,亦可較佳地用於在顯示器之顯示區域中具備指紋感測器等光學感測器之圖像顯示裝置。 [實施例] In the use of the completed device, even when the device is dropped, heavy goods are placed on the device, and a flying object collides with the device and is suddenly loaded with an external force, by affixing a reinforcing film, it can Prevent damage to the device. In addition, since the reinforcing film is firmly attached to the device after photocuring the adhesive, the reinforcing film is not easily peeled off even if it is used for a long time, and the reliability is excellent. In addition, since the adhesive sheet is highly fogged by photohardening, it is difficult to visually recognize the optical sensor placed on the back of the reinforcement film from the outer surface of the device, and it can also be preferably used for displaying on a display. Image display devices equipped with optical sensors such as fingerprint sensors in the area. [Example]

以下,舉出與黏著片材相關之實施例及比較例進一步加以說明,但本發明並不限定於該等實施例。Hereinafter, examples and comparative examples related to the adhesive sheet are given and further described, but the present invention is not limited to these examples.

[實施例1] <黏著劑組合物之製備> 向具備溫度計、攪拌機、回流冷卻管及氮氣導入管之反應容器中,投入作為單體之丙烯酸2-乙基己酯(2EHA)96.2重量份及丙烯酸2-羥基乙酯(2HEA)3.8重量份、作為聚合起始劑之偶氮二異丁腈(AIBN)0.2重量份、以及作為溶劑之乙酸乙酯156重量份,並通入氮氣,一面攪拌一面進行約1小時氮氣置換。其後,加熱至60℃,使其反應7小時,獲得重量平均分子量(Mw)為60萬之丙烯酸系聚合物之溶液。 [Example 1] <Preparation of Adhesive Composition> Into the reaction vessel equipped with thermometer, stirrer, reflux cooling pipe and nitrogen introduction pipe, drop 96.2 parts by weight of 2-ethylhexyl acrylate (2EHA) and 3.8 parts by weight of 2-hydroxyethyl acrylate (2HEA) as monomers, 0.2 parts by weight of azobisisobutyronitrile (AIBN) as a polymerization initiator and 156 parts by weight of ethyl acetate as a solvent were blown with nitrogen, and nitrogen replacement was carried out for about 1 hour while stirring. Then, it heated to 60 degreeC, it was made to react for 7 hours, and the solution of the acrylic-type polymer whose weight average molecular weight (Mw) was 600,000 was obtained.

向上述丙烯酸系聚合物溶液(聚合物100重量份)中添加作為交聯劑之六亞甲基二異氰酸酯之異氰尿酸酯體(東曹製造之「Coronate HX」)0.1重量份、作為交聯觸媒之乙醯丙酮鐵(日本化學產業製造之「三乙醯丙酮鐵」)0.02重量份、作為光硬化劑之二季戊四醇聚丙烯酸酯(二季戊四醇五丙烯酸酯與二季戊四醇六丙烯酸酯之混合物;新中村化學工業製造之「NK Ester A-DPH」)10重量份、及作為光聚合起始劑之2,2-二甲氧基-1,2-二苯乙烷-1-酮(IGM Resins製造之「Omnirad651」)0.1重量份,並均勻地混合,獲得黏著劑組合物。To the above-mentioned acrylic polymer solution (100 parts by weight of polymer), 0.1 part by weight of hexamethylene diisocyanate isocyanurate ("Coronate HX" manufactured by Tosoh) was added as a crosslinking agent. 0.02 parts by weight of iron acetylacetonate ("triacetylacetonate iron" manufactured by Nippon Chemical Industry Co., Ltd.) as a joint catalyst, dipentaerythritol polyacrylate (a mixture of dipentaerythritol pentaacrylate and dipentaerythritol hexaacrylate) as a light hardener ; "NK Ester A-DPH" manufactured by Shin Nakamura Chemical Industry) 10 parts by weight, and 2,2-dimethoxy-1,2-diphenylethane-1-one (IGM Resins "Omnirad651") 0.1 parts by weight, and uniformly mixed to obtain an adhesive composition.

<黏著片材之製作> 將上述黏著劑組合物以乾燥後之厚度為20 μm之方式塗佈於經矽酮離型處理之厚度75 μm之聚對苯二甲酸乙二酯膜(重剝離膜)上。於130℃下乾燥1分鐘而去除溶劑後,將表面經矽酮離型處理之厚度50 μm之聚對苯二甲酸乙二酯膜(輕剝離膜)之離型處理面貼合於黏著劑之塗佈面。其後,於25℃之氛圍中進行4天熟化處理,使其進行交聯,獲得兩面暫時黏著有離型膜之黏著片材。 <Production of Adhesive Sheet> The above-mentioned adhesive composition was coated on a silicone release-treated polyethylene terephthalate film (heavy release film) with a thickness of 75 μm so that the thickness after drying was 20 μm. After drying at 130°C for 1 minute to remove the solvent, attach the release-treated surface of a polyethylene terephthalate film (light release film) with a thickness of 50 μm that has been treated with silicone release to the surface of the adhesive Coated side. Thereafter, aging treatment was carried out for 4 days in an atmosphere of 25° C. to make it cross-linked, and an adhesive sheet with a release film temporarily adhered on both sides was obtained.

[實施例2~7、比較例1~7] 除將丙烯酸系聚合物之單體之組成、光硬化劑之種類及添加量變更為如表1所示以外,以與實施例1相同之方式製備黏著劑組合物,並製作黏著片材。 [Examples 2-7, Comparative Examples 1-7] The adhesive composition was prepared in the same manner as in Example 1, and an adhesive sheet was produced, except that the composition of the monomer of the acrylic polymer, the type and the addition amount of the light hardener were changed as shown in Table 1.

[實施例8、比較例8及9] 將丙烯酸系聚合物之單體之組成、光硬化劑之種類及添加量變更為如表1所示。又,添加屬於四官能環氧化合物之N,N,N',N'-四縮水甘油基間苯二甲胺(四官能之環氧化合物,三菱瓦斯化學製造之「Tetrad C」)0.1重量份作為交聯劑來代替異氰酸酯系交聯劑,且不添加交聯觸媒。除該等變更以外,以與實施例1相同之方式製備黏著劑組合物,並製作黏著片材。 [Example 8, Comparative Examples 8 and 9] The monomer composition of the acrylic polymer, the type and amount of light hardener were changed as shown in Table 1. Also, 0.1 parts by weight of N,N,N',N'-tetraglycidyl-m-xylylenediamine (tetrafunctional epoxy compound, "Tetrad C" manufactured by Mitsubishi Gas Chemical) belonging to a tetrafunctional epoxy compound was added As a cross-linking agent instead of isocyanate-based cross-linking agent, without adding a cross-linking catalyst. Except these changes, the adhesive composition was prepared in the same manner as Example 1, and the adhesive sheet was produced.

[評估] <光硬化前之霧度> 將實施例及比較例之黏著片材之一面之離型膜(輕剝離膜)剝離,將黏著片材貼合於玻璃板後,將另一離型膜(重剝離膜)剝離,從而準備霧度測定用試樣。使用霧度計(日本電色工業製造之「NDH-5000」),自黏著片材側之表面照射光,依據JIS K7136對光硬化前之黏著片材之霧度H 0進行測定。 [Evaluation] <Haze before photohardening> Peel off the release film (light release film) on one side of the adhesive sheet of the examples and comparative examples, attach the adhesive sheet to the glass plate, and then peel off the other release film The film (heavy release film) was peeled off to prepare a sample for haze measurement. Using a haze meter ("NDH-5000" manufactured by Nippon Denshoku Industries), light was irradiated from the surface of the adhesive sheet side, and the haze H0 of the adhesive sheet before photohardening was measured according to JIS K7136.

<光硬化後之霧度> 自實施例及比較例之黏著片材剝離輕剝離膜,並將黏著片材貼合於玻璃板後,自重剝離膜側之面,利用波長365 nm之LED(light-emitting diode,發光二極管)光源,照射2000 mJ/cm 2之紫外線而使黏著劑組合物進行光硬化。其後,剝離重剝離膜,自黏著片材側之面照射光,對光硬化前之黏著片材之霧度H 1進行測定。 <Haze after light hardening> Peel off the light-release film from the adhesive sheets of the examples and comparative examples, and attach the adhesive sheet to the glass plate, then peel off the surface of the film side by its own weight, and use an LED with a wavelength of 365 nm (light -emitting diode (light emitting diode) light source, irradiating 2000 mJ/cm 2 of ultraviolet rays to make the adhesive composition photoharden. Thereafter, the heavy release film was peeled off, light was irradiated from the surface of the adhesive sheet side, and the haze H1 of the adhesive sheet before photohardening was measured.

於表1中示出實施例及比較例之黏著劑組合物中之丙烯酸系聚合物之組成、光硬化劑之種類及添加量、以及黏著片材之光硬化前後之霧度。於表1中,聚合物組成為構成單體之重量比,光硬化劑之量為相對於丙烯酸系聚合物之固形物成分100重量份之添加量。單體及光硬化劑之詳情如下。Table 1 shows the composition of the acrylic polymer in the adhesive composition of Examples and Comparative Examples, the type and amount of photocuring agent added, and the haze of the adhesive sheet before and after photocuring. In Table 1, the polymer composition is the weight ratio of the constituent monomers, and the amount of the photocuring agent is the added amount relative to 100 parts by weight of the solid content of the acrylic polymer. The details of the monomer and light hardener are as follows.

<單體> 2EHA    丙烯酸2-乙基己酯 BA        丙烯酸丁酯 2HEA    丙烯酸2-羥基乙酯 4HBA    丙烯酸4-羥基丁酯 AA        丙烯酸 <光硬化劑> DPH      二季戊四醇聚丙烯酸酯(折射率:1.489,黏度:7500 mPa·s(25℃)) TMMT   季戊四醇四丙烯酸酯(折射率:1.480,黏度:215 mPa·s(40℃)) HDN      1,6-己二醇二丙烯酸酯(折射率:1.456,黏度:6 mPa·s(25℃)) DCP       三環癸烷二甲醇二丙烯酸酯(折射率:1.503,黏度:135 mPa·s(25℃)) TMPT    三羥甲基丙烷三丙烯酸酯(折射率:1.474,黏度:105 mPa·s(25℃)) <Single> 2EHA 2-ethylhexyl acrylate BA Butyl Acrylate 2HEA 2-Hydroxyethyl Acrylate 4HBA 4-Hydroxybutyl Acrylate AA Acrylic <Light hardener> DPH dipentaerythritol polyacrylate (refractive index: 1.489, viscosity: 7500 mPa s (25°C)) TMMT Pentaerythritol tetraacrylate (refractive index: 1.480, viscosity: 215 mPa s (40°C)) HDN 1,6-Hexanediol Diacrylate (Refractive Index: 1.456, Viscosity: 6 mPa·s(25℃)) DCP tricyclodecane dimethanol diacrylate (refractive index: 1.503, viscosity: 135 mPa s (25°C)) TMPT Trimethylolpropane triacrylate (refractive index: 1.474, viscosity: 105 mPa s (25°C))

[表1]    黏著劑組成 霧度(%) 聚合物組成 光硬化劑 H 0 H 1 H 1-H 0 2EHA BA 2HEA 4HBA AA 種類 實施例1 96.2 - 3.8 - - DPH 10 2.0 3.4 1.4 實施例2 96.2 - 3.8 - - DPH 20 3.2 10.8 7.6 實施例3 96.2 - 3.8 - - TMMT 10 1.1 3.0 1.9 實施例4 96.2 - 3.8 - - TMMT 20 3.7 7.2 3.5 實施例5 90.9 - - 9.1 - DPH 20 5.3 8.1 2.8 實施例6 98.5 - - 1.5 - DPH 20 4.7 16.0 11.3 實施例7 72.7 18.2 - 9.1 - DPH 20 4.8 6.5 1.7 實施例8 96.2 - - - 3.8 DPH 20 4.0 12.4 8.5 比較例1 96.2 - 3.8 - - HDN 20 0.7 1.0 0.3 比較例2 96.2 - 3.8 - - DCP 20 0.8 1.2 0.4 比較例3 96.2 - 3.8 - - TMPT 20 0.7 1.0 0.3 比較例4 96.2 - 3.8 - - DPH 1 0.7 1.2 0.5 比較例5 96.2 - 3.8 - - DPH 5 0.9 1.3 0.4 比較例6 96.2 - 3.8 - - TMMT 5 0.7 1.3 0.5 比較例7 63.6 27.3 - 9.1 - DPH 20 3.5 4.2 0.7 比較例8 - 95.0 - - 5.0 DPH 20 0.7 1.1 0.4 比較例9 - 95.0 - - 5.0 TMMT 20 0.7 1.0 0.4 [Table 1] Adhesive Composition Haze (%) polymer composition light hardener H 0 H 1 H 1 -H 0 2EHA BA 2HEA 4HBA AAA type quantity Example 1 96.2 - 3.8 - - DPH 10 2.0 3.4 1.4 Example 2 96.2 - 3.8 - - DPH 20 3.2 10.8 7.6 Example 3 96.2 - 3.8 - - TMMT 10 1.1 3.0 1.9 Example 4 96.2 - 3.8 - - TMMT 20 3.7 7.2 3.5 Example 5 90.9 - - 9.1 - DPH 20 5.3 8.1 2.8 Example 6 98.5 - - 1.5 - DPH 20 4.7 16.0 11.3 Example 7 72.7 18.2 - 9.1 - DPH 20 4.8 6.5 1.7 Example 8 96.2 - - - 3.8 DPH 20 4.0 12.4 8.5 Comparative example 1 96.2 - 3.8 - - HDN 20 0.7 1.0 0.3 Comparative example 2 96.2 - 3.8 - - DCP 20 0.8 1.2 0.4 Comparative example 3 96.2 - 3.8 - - TMPT 20 0.7 1.0 0.3 Comparative example 4 96.2 - 3.8 - - DPH 1 0.7 1.2 0.5 Comparative Example 5 96.2 - 3.8 - - DPH 5 0.9 1.3 0.4 Comparative example 6 96.2 - 3.8 - - TMMT 5 0.7 1.3 0.5 Comparative Example 7 63.6 27.3 - 9.1 - DPH 20 3.5 4.2 0.7 Comparative Example 8 - 95.0 - - 5.0 DPH 20 0.7 1.1 0.4 Comparative Example 9 - 95.0 - - 5.0 TMMT 20 0.7 1.0 0.4

於使用四官能以上之多官能丙烯酸酯作為光硬化劑之實施例1~8中,由黏著片材之光硬化所引起之霧度上升量H 1-H 0為1%以上,與此相對,於使用二官能丙烯酸酯之比較例1、2及使用三官能丙烯酸酯之比較例3中,H 1-H 0未達1%。於四官能以上之丙烯酸酯之使用量較少之比較例4~6中,H 1-H 0亦未達1%。根據實施例1與實施例2之對比、及實施例3與實施例4之對比,可知黏著劑組合物中之四官能以上之多官能丙烯酸酯之含量越多,則由光硬化所引起之黏著片材之霧度上升越大。 In Examples 1 to 8 in which polyfunctional acrylates with four or more functions were used as light hardeners, the haze increase H 1 -H 0 caused by light hardening of the adhesive sheet was 1% or more. In contrast, In Comparative Examples 1 and 2 using a difunctional acrylate and Comparative Example 3 using a trifunctional acrylate, H 1 -H 0 did not reach 1%. In Comparative Examples 4-6 in which the amount of acrylates with four or more functions was less, H 1 -H 0 did not reach 1%. According to the comparison between Example 1 and Example 2, and the comparison between Example 3 and Example 4, it can be seen that the more the content of multifunctional acrylates with four or more functions in the adhesive composition is, the more the adhesion caused by photohardening will be. The greater the haze rise of the sheet is.

根據實施例2、實施例7及比較例7之對比,可見構成丙烯酸系聚合物之單體成分中之2EHA(C8烷基丙烯酸酯)之比率越高,則由光硬化所引起之霧度上升越大之傾向。於實施例5與實施例6之對比中,亦可見相同之傾向。根據實施例8與比較例8、9之對比,可知於使用屬於含羧基單體之丙烯酸作為丙烯酸系聚合物之共聚單體成分,並使用環氧系交聯劑之情形時,由於使用具有較大碳數之烷基之(甲基)丙烯酸烷基酯作為構成基礎聚合物之主單體成分,由光硬化所引起之霧度上升亦較大。According to the comparison of Example 2, Example 7 and Comparative Example 7, it can be seen that the higher the ratio of 2EHA (C8 alkyl acrylate) in the monomer components constituting the acrylic polymer, the higher the haze caused by photohardening greater tendency. In the comparison between Example 5 and Example 6, the same tendency can also be seen. According to the comparison of Example 8 and Comparative Examples 8 and 9, it can be seen that when using acrylic acid belonging to carboxyl-containing monomers as the comonomer component of the acrylic polymer, and using an epoxy crosslinking agent, due to the use of Alkyl (meth)acrylate with a large carbon number alkyl group is the main monomer component of the base polymer, and the haze increase caused by photohardening is also relatively large.

1:膜基材 2:黏著片材 10:補強膜 20:被黏著體(有機EL面板) 51:離型膜 52:離型膜 100:附補強膜之裝置 1: Membrane substrate 2: Adhesive sheet 10: Reinforcing film 20: Adhered body (organic EL panel) 51: Release film 52: Release film 100: Device with reinforced membrane

圖1係表示於兩面具備離型膜之黏著片材之積層構成之剖視圖。 圖2係表示補強膜之積層構成之剖視圖。 圖3係表示貼合有補強膜之裝置之積層構成例之剖視圖。 Fig. 1 is a cross-sectional view showing a laminated structure of an adhesive sheet provided with a release film on both sides. Fig. 2 is a cross-sectional view showing a laminated structure of a reinforcing film. Fig. 3 is a cross-sectional view showing an example of a laminated structure of a device bonded with a reinforcing film.

2:黏著片材 2: Adhesive sheet

51:離型膜 51: Release film

52:離型膜 52: Release film

Claims (8)

一種黏著片材,其係使含有丙烯酸系基礎聚合物及光硬化劑之光硬化性黏著劑組合物形成為層狀而得者, 關於上述黏著劑組合物, 於上述丙烯酸系基礎聚合物中,相對於構成單體成分總量,(甲基)丙烯酸烷基酯之量為70重量%以上,該(甲基)丙烯酸烷基酯中之烷基為碳數6以上之鏈狀烷基, 上述光硬化劑含有於1分子中具有4個以上(甲基)丙烯醯基之多官能(甲基)丙烯酸酯, 相對於上述丙烯酸系基礎聚合物100重量份,含有7重量份以上之上述多官能(甲基)丙烯酸酯,且 光硬化後之霧度H 1與光硬化前之霧度H 0的差H 1-H 0為1.0%以上。 An adhesive sheet obtained by forming a photocurable adhesive composition containing an acrylic base polymer and a photocuring agent into a layered form. Regarding the above adhesive composition, in the above acrylic base polymer, The amount of alkyl (meth)acrylate is 70% by weight or more relative to the total amount of monomer components, and the alkyl group in the alkyl (meth)acrylate is a chain alkyl group with 6 or more carbon atoms. The light curing agent contains a polyfunctional (meth)acrylate having 4 or more (meth)acryl groups in one molecule, and contains 7 parts by weight or more of the above-mentioned polyfunctional (meth)acrylate with respect to 100 parts by weight of the acrylic base polymer. (meth)acrylate, and the difference H 1 -H 0 between the haze H 1 after photocuring and the haze H 0 before photocuring is 1.0% or more. 如請求項1之黏著片材,其中上述黏著劑組合物進而含有光聚合起始劑。The adhesive sheet according to claim 1, wherein the adhesive composition further contains a photopolymerization initiator. 如請求項1或2之黏著片材,其中上述丙烯酸系基礎聚合物含有選自由含羥基單體及含羧基單體所組成之群中之1種以上作為構成單體成分,且上述丙烯酸系基礎聚合物中導入有交聯結構。The adhesive sheet according to claim 1 or 2, wherein the acrylic base polymer contains at least one monomer component selected from the group consisting of hydroxyl-containing monomers and carboxyl-containing monomers, and the acrylic base polymer A crosslinked structure is introduced into the polymer. 如請求項1至3中任一項之黏著片材,其光硬化前之霧度H 0為5%以下。 The adhesive sheet according to any one of Claims 1 to 3, whose haze H0 before photohardening is 5 % or less. 如請求項1至4中任一項之黏著片材,其光硬化後之霧度H 1為6%以上。 As the adhesive sheet according to any one of Claims 1 to 4, the haze H1 after photohardening is 6% or more. 一種補強膜,其係將如請求項1至5中任一項之黏著片材固著積層於膜基材之一主表面上而成。A reinforced film, which is obtained by adhering and laminating the adhesive sheet according to any one of claims 1 to 5 on one of the main surfaces of the film substrate. 一種裝置之製造方法,其係表面貼合有補強膜之裝置之製造方法,且係 於將如請求項6之補強膜之上述黏著片材暫時黏著於被黏著體之表面後, 使上述黏著片材進行光硬化。 A method of manufacturing a device, which is a method of manufacturing a device with a reinforcing film attached to its surface, and is After temporarily adhering the above-mentioned adhesive sheet of the reinforcing film as in claim 6 to the surface of the adherend, The above-mentioned adhesive sheet was subjected to photocuring. 如請求項7之裝置之製造方法,其中上述被黏著體為有機EL面板。The manufacturing method of the device according to claim 7, wherein the above-mentioned adherend is an organic EL panel.
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