TW202239302A - Liquid-cooling heat dissipation structure - Google Patents

Abstract

A liquid-cooling heat dissipation structure includes a substrate and a cover body mated with the substrate to define a heat exchange chamber therebetween. A radiating fin unit and a stop section are disposed in the heat exchange chamber. The stop section serves to first divide a cooling liquid entering the heat exchange chamber, whereby the cooling liquid first flows through the periphery of the radiating fin unit and then flow into the middle of the radiating fin unit so that the cooling liquid is prevented from straightly passing through the radiating fin unit. Multiple cooperative flow-stopping protrusions are disposed in the periphery of the radiating fin unit to help the cooling liquid to uniformly flow through the radiating fin unit. By means of the structural design of the liquid-cooling heat dissipation structure, the heat exchange efficiency is greatly enhanced.

Description

Liquid cooling structure

The invention relates to the field of liquid heat dissipation structures, in particular to a heat dissipation structure of a liquid (water) cooling head.

With the sharp increase in demand for big data and cloud computing services, the heat dissipation requirements of related electronic products are also getting higher and higher, especially for servers in large computing centers, whose computing density has increased, and the waste heat generated in a space of the same size has also increased significantly In order to reduce the energy consumed by heat dissipation, liquids are recently used to take the heat source away from the server and dissipate heat in other ways, so as to solve the problem of high-density waste heat. The working mechanism of the water-cooled head or water-cooled plate is that the working liquid takes away the heat of the chip, and the working liquid will gradually heat up when passing through the chip, so the temperature distribution of the chip will be affected by the configuration of the flow channels in the water-cooled plate, and the temperature close to the water inlet is lower , the water outlet is higher. However, in the new generation of chip design, the heating area becomes larger, which makes the difference between the high and low temperature of the inlet and outlet larger, resulting in uneven temperature distribution of the chip. Due to the large difference in chip temperature, the life of the chip is shortened. Furthermore, after the working liquid enters the water cooling head from the water inlet, it directly and quickly flows out from the water cooling head through the water cooling head. Since the working liquid stays in the water cooling head for a short time, the contact time with the cooling fins in the water cooling head is shorter. , unable to take away the heat source with sufficient heat exchange. Therefore, how to solve the above-mentioned problems and deficiencies is the direction that the inventor of this case and the relevant manufacturers engaged in this industry want to study and improve urgently.

In order to improve the above-mentioned problems, an object of the present invention is to provide a baffle between an inlet in a heat exchange chamber and a heat dissipation fin unit, by which a baffle that enters the heat exchange chamber from the inlet The cooling liquid is divided so that the cooling fluid flows from the periphery of the heat dissipation fin unit to the middle of the heat dissipation fin unit, so as to prevent the cooling liquid from passing through the heat dissipation fin unit in a straight line. Another object of the present invention is to make the flow field in the heat exchange chamber evenly distributed so as to reduce the temperature difference of the heating element and achieve a liquid-cooled heat dissipation structure with uniform temperature distribution. Another object of the present invention is to utilize a plurality of baffle protrusions located on the periphery of the heat dissipation fin unit to distribute the surrounding cooling liquid to the area that needs heat dissipation to effectively reduce the temperature difference of the heating element in a liquid cooling heat dissipation structure. Another object of the present invention is to delay the residence time of the cooling liquid in the heat exchange chamber, so as to ensure that there is enough time for sufficient and reliable heat exchange with the cooling fin unit. Another object of the present invention is to arrange a plurality of ribs in the heat exchange chamber, and each rib is located between two adjacent heat dissipation fin groups, so as to block the cooling liquid flowing through each heat radiation fin group from flowing to another heat radiation fin group . To achieve the above purpose, the present invention provides a liquid-cooled heat dissipation structure, which includes: a substrate having a heat exchange surface and a heat contact surface; a heat dissipation fin unit including a plurality of heat dissipation fin groups arranged on the heat exchange surface, and Each heat dissipation fin group has a top surface and two inflow sides; a cover system is combined with the substrate and covered above the heat dissipation fin unit, and a heat exchange chamber is defined between the substrate and the cover to accommodate the The heat dissipation fin unit, the cover body has an inner side and a side wall, the inner side is provided with a guide channel corresponding to the top surface of each heat dissipation fin group, a peripheral channel group is defined between the heat dissipation fin unit and the side wall, An inlet and an outlet are respectively arranged on the cover body, the inlet communicates with the heat exchange chamber, and the outlet communicates with the guide channel; a baffle is arranged in the heat exchange chamber and is located between the inlet and the cooling fin unit The inlet is isolated from the cooling fin unit, and the baffle is adjacent to the inlet so that a cooling liquid entering the heat exchange chamber from the inlet is divided and flows along the peripheral channel to a middle of the cooling fin unit. flow, thereby preventing the cooling liquid from passing through the cooling fin unit in a straight line. The aforementioned peripheral channel group is provided with a plurality of flow blocking protrusions corresponding to the two inflow sides of each cooling fin group. The aforementioned group of peripheral flow channels has a first, second and third peripheral flow channels, the first and second peripheral flow channels are respectively defined between the inflow sides and the side wall, and the third peripheral flow channel is defined at The cooling liquid between the baffle and the side wall and corresponding to the peripheral channel of the inlet flows from the inflow sides to the middle of the heat dissipation fin unit and flows out from the outlet through the guide channel. The aforementioned third peripheral channel is optionally provided with another cooling fin unit. The aforementioned baffle protrusions are distributed in the first and second peripheral channels, and are arranged on the side wall of the cover or the heat exchange surface of the base plate. A rib is provided between the two adjacent heat dissipation fin groups, and each rib has a free end that contacts or combines with the inner side of the cover. The aforementioned rib has another free end combined with the heat exchange surface of the base plate. The aforementioned baffle is arranged on the heat exchange surface of the substrate or inside the cover.

The above-mentioned purpose of the present invention and its structural and functional characteristics will be described based on the preferred embodiments of the accompanying drawings. The present invention provides a liquid cooling heat dissipation structure, for example, a liquid (water) cooling head (water block) is part of a liquid (water) cooling circuit (liquid cooling loop), used to contact a heating element to help the heating element dissipate heat, And the liquid cooling heat dissipation structure communicates with the external heat dissipation unit and/or pump through the pipe body. In the present invention, a baffle is provided in a heat exchange chamber in a liquid-cooled heat dissipation unit to divide a cooling liquid that enters the heat exchange chamber, so that the divided cooling fluid flows to the periphery of a heat dissipation fin unit Then flow to the middle of the heat dissipation fin unit to prevent the cooling fluid from passing through the heat dissipation fin unit in a straight line. The present invention also selects a plurality of flow blocking protrusions corresponding to the heat dissipation fin unit to help the cooling liquid flow evenly The detailed structure of the cooling fin unit is as follows. Please refer to Figure 1A, which is a three-dimensional exploded schematic diagram of the present invention; Figure 1B, which is a three-dimensional assembly schematic diagram of the present invention; Figure 1C, which is a cross-sectional schematic diagram of the combination of the present invention; As shown in these figures, the liquid cooling heat dissipation structure of the present invention includes a base plate 11 and a cover body 12 covering the base plate 11, and a heat exchange chamber 14 is defined between the base plate 11 and the cover body 12 for a cooling liquid 19. flow, and a blocking portion 15 is disposed in the heat exchange chamber 14 , and a cooling fin unit 13 is disposed in the heat exchange chamber 14 . The substrate 11 has a heat exchange surface 111 and a heat contact surface 112. The cover 12 has an inner side 121 and a side wall 122. The inner side 121 is facing the heat exchange surface 111 of the substrate 11 and has a guiding channel 123. , an inlet 124 and an outlet 125 are separately arranged on the cover 12, the inlet 124 communicates with the heat exchange chamber 14, the outlet 125 communicates with the guide channel 123, and the side wall 122 is arranged around the outer edge of the cover 12 This substrate 11 is bonded. A liquid inlet joint 21 and a liquid outlet joint 22 are respectively connected to the inlet 124 and the outlet 125 . The baffle 15 is arranged on the heat exchange surface 111 of the base plate 11 or the inner side 121 of the cover 12, and is located behind the inlet 124, except for blocking the cooling liquid 19 from flowing into the heat exchange chamber 14 from the inlet 124 and directly flowing through the cooling The fin unit 13, and the cold liquid 19 is divided into two sides and then flows through the heat dissipation fin unit 13, as described in detail later. The heat dissipation fin unit 13 has a plurality of fins 131 arranged at intervals and has flow channels 132 between the fins 131, the heat dissipation fin unit 13 has a top surface 134 and two inflow sides 135 and two non-inflow sides 136, The top surface 134 is adjacent to or adjacent to the inner side 121 of the cover 12 and corresponds to the guide channel 123. The two inflow sides 135 are opposite sides and communicate with the flow channel 132 between the fins 131. The two non-inflow sides 136 is also the opposite side and adjacent to the two inflow sides 135 . The heat dissipation fin unit 13 is disposed or formed on the heat exchanging surface 111 of the substrate 11 , that is, the heat dissipation fin unit 13 and the substrate 11 are integrally or not integrally formed. In addition, the two non-inflow sides 136 are respectively adjacent to the inlet 124 and the outlet 125 of the cover 12 , and the blocking portion 15 is adjacent to the inlet 124 and located between the inlet 124 and the non-inflow side 136 of the cooling fin unit 13 . Furthermore, in this embodiment, it is shown that the heat dissipation fin unit 13 has a plurality of heat dissipation fin groups 137, and a rib 138 is arranged between two adjacent heat dissipation fin groups 137, and the thickness of the single rib 138 is compared with The thickness of the single fin 131 is also thick. The cooling fin unit 13 and/or the rib 138 are integrally formed on the heat exchanging surface 111 of the substrate 11, or are combined with the substrate 11 as separate individual elements by a combination (the combination means such as welding Including brazing, soft welding and ultrasonic welding, etc.) on the heat exchange surface 111 of the substrate 11 . Each rib 138 has a free end (the upper end in the figure) adjacent to the inner side 12 of the cover 12 or in contact with or combined with the inner side 12 . A peripheral channel set 17 is formed between the heat dissipation fin unit 13 and the sidewall 122 on the periphery of the heat dissipation fin unit 13 . The peripheral channel set includes a first peripheral channel 171 , a second peripheral channel 172 and a third peripheral channel 173 . Wherein the first and second peripheral channels 171, 172 are respectively located between the inflow sides 135 and the side wall 122, and the third peripheral channel 173 is located between the blocking portion 15 and the side wall 122 corresponding to the inlet 124, also That is to say, the inlet 124 is located above the third peripheral flow channel 173 , and the two ends of the third peripheral flow channel 173 communicate with the first and second peripheral flow channels 171 and 172 respectively. Another fin unit 18 is optionally disposed or formed on the third peripheral channel 173 and located below the inlet 124 . The heat dissipation fins 18 are not limited to the aforementioned implementation, and if the corresponding heat generating elements have fewer heat generating areas, fewer heat dissipation fins 18 can be disposed on the third peripheral channel 173 . The cooling liquid 19 flows into the third peripheral channel 173 of the heat exchange chamber 14 from the inlet 124 of the cover 12 through the liquid inlet joint 21, and the cooling liquid 19 is not only blocked by the blocking portion 15 at the rear of the inlet 124 to pass through the cooling liquid 19 in a straight line. Radiating fin unit 13, and is also divided into two opposite flows from the two ends of the third peripheral flow channel 173 respectively through the first peripheral flow channel 171 and the second peripheral flow channel 172, and then in the first and second The cooling liquid 19 in the peripheral flow channels 171, 172 further flows from the two inflow sides 135 of the heat dissipation fin unit 13 to a middle of the heat dissipation fin unit 13, and then the cooling liquid 19 flows from the outlet 125 through the guide channel 123 And the liquid outlet joint 22 flows out of the heat exchange chamber 14 . The ribs 138 are used to block the cooling liquid 19 flowing through each cooling fin set 137 from flowing to another cooling fin set 137 . With this design, the divided cooling liquid 19 has not been heated, and can flow through each cooling fin set 137 with the same liquid temperature. Furthermore, since the baffle 15 prevents the cooling liquid 19 flowing into the heat exchange chamber 14 from flowing straight through the cooling fin unit 13, the residence time of the cooling liquid 19 in the heat exchange chamber 14 can be delayed, so that the cooling liquid 19 can After fully exchanging heat with the cooling fin unit 13, the heat is taken away. Please continue to refer to FIG. 3 which is a top perspective schematic diagram of the present invention provided with a flow blocking convex body. As shown in the figure, in another implementation, a plurality of flow blocking protrusions 127 are distributed in the peripheral channel group 17, for example, distributed in the first peripheral channel 171 and the second peripheral channel 172 corresponding to the cooling fin unit 13. equal to the inflow side 135 , and each cooling fin group 137 corresponds to at least two opposing flow blocking protrusions 127 . The flow blocking protrusions 127 are shown disposed on the side wall 122 of the cover 12 in this embodiment, but are not limited thereto, and may also be disposed on the heat exchange surface 111 of the substrate 11 . The cooling liquid 19 flowing in the first peripheral flow channel 171 and the second peripheral flow channel 172 is guided to flow to each heat dissipation fin group 137 of the heat dissipation fin unit 13 by each flow blocking protrusion 127 , The cooling liquid 19 is reduced to concentrate at the end of the flow direction, and the cooling liquid 19 flows more uniformly in the liquid cooling heat dissipation structure. In addition, not limited to the aforementioned implementation, the present invention can make each heat dissipation fin group 137 correspond to a plurality of opposite flow blocking protrusions 127 according to different heat dissipation requirements. Therefore, the flow blocking protrusions 127 can be set according to the temperature difference of each heating area of the heating element during design, for example, two opposite flow blocking protrusions 127 are set in the low temperature area, and four or more are arranged in the high temperature area. There are many opposite blocking protrusions 127 . Please continue to refer to Figures 4A to 4C, which are schematic diagrams of various shapes of the baffle protrusions. As shown in the figure, the aforesaid baffle convex body 127 is not limited to a semicircle, but can also be any geometric shape such as a triangle (as shown in Figure 4A), a square (as shown in Figure 4B) or an L-shape (as shown in Figure 4C). . With the above structure, the flow field of the cooling liquid 19 entering the heat exchange chamber 14 can be evenly distributed, so as to reduce the temperature difference of the heating element and make the temperature of the heating element evenly distributed. The present invention has been described in detail above, but what is described above is only a preferred embodiment of the present invention, and should not limit the scope of the present invention. That is, all equivalent changes and modifications made according to the application scope of the present invention shall still fall within the scope of the patent of the present invention.

11: Substrate 111: heat exchange surface 112: thermal contact surface 12: Cover body 121: inside 122: side wall 123: Guideway 124: import 125: export 127: Baffle convex body 13, 18: cooling fin unit 131: fins 132: Runner 134: top surface 135: Inflow side 136: Non-inflow side 137: cooling fin group 138: rib heat exchange chamber 14: assistant department 15: block 17: Peripheral runner group 171: The first peripheral runner 172: The second peripheral runner 173: The third peripheral runner 19: cooling liquid 21: Inlet connector 22: Outlet connector

Fig. 1A is a three-dimensional exploded schematic diagram of the present invention; Figure 1B is a schematic diagram of a three-dimensional combination of the present invention; Fig. 1C is a combined sectional schematic diagram of the present invention: Fig. 2 is a top perspective schematic diagram of the present invention; Figure 3 is a perspective schematic diagram of a top view with a baffle convex body for this creation; Figures 4A to 4C are schematic diagrams of various shapes of the flow blocking protrusions.

11: Substrate

111: heat exchange surface

112: thermal contact surface

12: Cover body

122: side wall

124: import

125: export

13, 18: cooling fin unit

134: top surface

135: Inflow side

136: Non-inflow side

15: block

21: Inlet connector

22: Outlet connector

Claims (6)

A liquid cooling heat dissipation structure comprising: A substrate with a heat exchange surface and a thermal contact surface; A heat dissipation fin unit, including a plurality of heat dissipation fin groups arranged on the heat exchange surface, and has a top surface and two inflow sides; A cover is combined with the substrate and covered above the heat dissipation fin unit, a heat exchange chamber is defined between the substrate and the cover to accommodate the heat dissipation fin unit, the cover has an inner side and a The side wall, the inner side is provided with a guide channel corresponding to the top surface of the heat dissipation fin unit, a peripheral flow channel group is defined between the heat dissipation fin unit and the side wall, an inlet and an outlet are separately arranged on the cover, the The inlet communicates with the heat exchange chamber, and the outlet communicates with the guide channel; a baffle, disposed in the heat exchange chamber and between the inlet and the heat dissipation fin unit, the baffle is located behind the inlet to divert a cooling liquid entering the heat exchange chamber from the inlet And flow toward a center of the heat dissipation fin unit along the peripheral channel, thereby preventing the cooling liquid from passing through the heat dissipation fin unit in a straight line. The liquid-cooling heat dissipation structure as described in Claim 1, wherein the peripheral channel group is provided with a plurality of flow blocking protrusions corresponding to the two inflow sides of each heat dissipation fin group. The liquid cooling heat dissipation structure according to claim 1 or 2, wherein the peripheral flow channel group has a first, second and third peripheral flow channels, and the first and second peripheral flow channels are respectively defined on the inflow sides Between the sidewall and the sidewall, the third peripheral channel is defined between the baffle and the sidewall and corresponds to the cooling liquid entering the peripheral channel from the inflow sides to the middle of the cooling fin unit and passes through The guideway flows out from the outlet. According to the liquid cooling heat dissipation structure described in Claim 3, another heat dissipation fin unit is selected for the third peripheral channel. The liquid cooling heat dissipation structure as claimed in claim 3, wherein the flow blocking protrusions are distributed in the first and second peripheral channels, and are arranged on the side wall of the cover or the heat exchange surface of the substrate. The liquid cooling heat dissipation structure as claimed in claim 1, wherein the blocking portion is disposed on the heat exchange surface of the substrate or disposed inside the cover.

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