CN216982363U - Liquid-cooled cooling module - Google Patents

Abstract

The utility model provides a liquid-cooled heat dissipation module, which is used for solving the problems that the existing liquid-cooled heat dissipation system has more components and occupies larger space and the like. The method comprises the following steps: a housing having a circulation flow passage therein, an outer surface of the housing having a recess; a pump for guiding the working fluid to circularly flow in the circulating flow channel; and a heat dissipation fan, which is combined with the shell, and an air inlet of the heat dissipation fan is communicated with the depressed part.

Description

Liquid-cooled cooling module

technical field

The utility model relates to a heat dissipation module, in particular to a liquid-cooled heat dissipation module that can help an electronic device maintain a proper working temperature.

Background technique

Please refer to FIG. 1 , which is an existing liquid-cooled heat dissipation system 9 . The existing liquid-cooled heat dissipation system 9 has a heat absorption unit 91 , a heat dissipation unit 92 , a pump 93 and a pipe assembly 94 . The heat absorbing unit 91 can be attached to the heat source H of the electronic device. The tube assembly 94 communicates with the pump 93 and the heat absorbing unit 91 through a tube 941 , and communicates the pump 93 and the heat dissipation unit 92 through a tube 942 . , and the heat absorbing unit 91 and the heat dissipating unit 92 are connected by a pipe 943 .

According to the aforementioned structure, the pump 93 can drive the working fluid to flow in the pipe assembly 94 , and the working fluid that passes through the heat absorbing unit 91 to absorb heat and increase temperature can be cooled and cooled when passing through the heat radiating unit 92 , and make the working fluid The liquid is directed to the heat absorbing unit 91 again; in this continuous circulation, the heat source H can be maintained at a proper working temperature, so as to avoid the problem of overheating of the electronic device.

However, the existing liquid-cooled heat dissipation system 9 has many components, and a certain installation space must be occupied between the components due to the requirement of assembly and combination, so that the space required for the overall liquid-cooled heat dissipation system 9 is difficult to occupy. To reduce the size, for thin and light electronic devices, it is often difficult to configure the installation space. Furthermore, if the tube assembly 94 of the existing liquid-cooled heat dissipation system 9 cannot be tightly assembled with the corresponding components, it may lead to the leakage of the internal working fluid, so it needs to be assembled carefully, which is relatively time-consuming and labor-intensive. , and the more components of the pipe fitting group 94, the higher the possibility of leakage; in addition, after a period of use, the pipe fitting group 94 will have problems such as working fluid evaporation and pipe fittings aging and cracking, resulting in a longer service life. Short or more often requires inspection and maintenance.

In view of this, the existing liquid-cooled heat dissipation system still needs to be improved.

Utility model content

In order to solve the above problems, the purpose of the present invention is to provide a liquid-cooled heat dissipation module, which can reduce the number of required components and reduce the space occupied by the assembly and combination of components, which can be applied to thin and light electronic devices.

The second objective of the present invention is to provide a liquid-cooled heat dissipation module, which can ensure that the working fluid hardly has the problem of leakage or evaporation and gradually decreases.

Another object of the present invention is to provide a liquid-cooled heat dissipation module, which can be assembled in advance so that it can be quickly assembled to a predetermined position of an electronic device.

Another object of the present invention is to provide a liquid-cooled heat dissipation module, which is additionally provided with a heat dissipation fan to efficiently dissipate heat.

The directionality described in the whole text of this utility model or its similar terms, such as "front", "rear", "left", "right", "up (top)", "down (bottom)", "inside", "outside" ”, “side face”, etc., mainly refer to the directions of the drawings, each directionality or its similar terms are only used to assist the description and understanding of the various embodiments of the present invention, and are not intended to limit the present invention.

The components and components described throughout the present utility model use the quantifier “a” or “an”, which is only for convenience of use and provides the general meaning of the scope of the present utility model; in the present utility model, it should be construed as including one or at least one , and the singular concept also includes the plural, unless it is obvious that it is meant otherwise.

Approximate terms such as "combined", "combined" or "assembled" mentioned in the whole text of the present utility model mainly include the types of components that can be separated without destroying the components after connection, or the components cannot be separated after being connected. It can be selected according to the material of the components to be connected or the assembly requirements.

The liquid-cooled heat dissipation module of the utility model comprises: a casing with a circulating flow channel in the casing, and a concave part on the outer surface of the casing; a pump for guiding a working fluid in the circulating flow channel circulating flow; and a cooling fan, combined with the casing, and an air inlet of the cooling fan communicates with the recessed part.

Therefore, in the liquid-cooled heat dissipation module of the present invention, a circulating flow channel can be formed directly in the casing of the liquid-cooled heat dissipation module, and the pump and the heat dissipation fan can be integrated and connected to the casing, thereby greatly reducing the number of The number of components required can not only reduce the space occupied by the assembly and combination of the components, but also ensure that the working fluid will not leak because the components are not tightly assembled, and there will be almost no working fluid because the fluid is not infused by pipe fittings. At the same time, the cooling fan can help the liquid cooling module to dissipate heat efficiently. In addition, the liquid-cooled heat dissipation module of the present invention can also be assembled in advance, so that it can be quickly assembled to a predetermined position of the electronic device later. Therefore, the liquid-cooled heat dissipation module of the present invention has the functions of improving space utilization rate and assembly efficiency, which is helpful for the development of light and thin electronic devices having the liquid-cooled heat dissipation module.

Wherein, the shell has a heat absorption area and a cooling area, the heat absorption area and the cooling area can be respectively located in the part of the circulation flow channel, the heat absorption area can be used for thermally connecting a heat source, and the cooling fan can be located in the the cooling zone. In this way, the cooling fan can effectively help the cooling area to cool down quickly, and has the effect of improving the heat dissipation efficiency.

Wherein, the concave portion may be communicated with the outer periphery of the casing, the casing may have a through hole located in the concave portion, the through hole is not communicated with the circulating flow channel, and the air inlet of the cooling fan can pass through the through hole from the depression. Inlet air flow. In this way, the housing can have a simpler structure to ensure that the air flow can smoothly flow into the cooling fan from the recessed portion, thereby reducing the manufacturing cost and improving the assembly efficiency.

Wherein, the cooling fan has at least one air outlet, and the air outlet may not communicate with the part of the outer periphery of the casing toward the recessed part. In this way, the chance of the exhausted hot air being sucked back to the cooling fan through the recessed portion can be reduced, which has the effect of avoiding the circulation of the hot air and reducing the heat dissipation efficiency.

Wherein, the casing can have a base plate and a sealing plate, the sealing plate and the base plate can be combined with each other to form the circulating flow channel together, the concave part can be located in the sealing plate, and the base plate is used for thermally connecting a heat source. In this way, the housing can have a simpler structure to ensure that the air flow can smoothly flow into the cooling fan from the recessed portion, thereby reducing the manufacturing cost and improving the assembly efficiency.

Wherein, the base plate may have a first hole, the sealing plate may have a second hole located in the concave portion, and the first hole and the second hole are opposite to each other and may form the through hole together. In this way, the housing can form the through hole with a simpler structure, which has the effects of reducing manufacturing cost and improving assembly efficiency.

Wherein, the base plate may have a protruding portion, the first hole may be located in the protruding portion, and a peripheral edge of the first hole may form a ring wall, and the ring wall may abut against the sealing plate. In this way, it can be ensured that the through hole does not communicate with the circulating flow channel, and the height of the circulating flow channel here is not reduced due to the through hole, which has the effect of maintaining the smoothness of the flow of the working fluid.

Wherein, the substrate has a first side and a second side opposite, the sealing plate can be combined with the first side of the substrate, the cooling fan can have a fan frame combined with the second side of the substrate, the through The holes can be located in the fan frame, so that the air inlets of the cooling fan are formed by the through holes. In this way, the base plate can be used as a cover plate on the air inlet side of the heat dissipation fan, so as to simplify the whole liquid-cooled heat dissipation module components, thereby improving assembly efficiency and reducing axial thickness.

Wherein, the base plate has an opposite first side and a second side, the sealing plate can be combined with the first side of the base plate oppositely, and the base plate can have two flow holes respectively located at the head end and the tail end of the circulation channel The two flow holes can pass through the first side and the second side of the base plate, and a shell of the pump can be combined with the second side of the base plate or connected with the second side of the base plate by integral molding, the The two flow holes communicate with the inside of the housing. In this way, the circulating flow channel can be directly connected to the inside of the pump, so that the components needed to connect the two can be omitted, and the assembly convenience and efficiency can be improved.

Wherein, the base plate may have two flow holes respectively located at the head end and the tail end of the circulation flow channel and may be communicated to the outer periphery of the base plate, and a shell of the pump may have a liquid inlet and a liquid outlet, The pump may be connected by a conduit to the liquid inlet and one of the flow holes, and may be connected to the liquid outlet and the other flow hole by another conduit. In this way, the pump can be in an external form, and the two conduits can be changed according to the installation requirements, so as to be suitable for various electronic devices with different installation space constraints, which has the effects of improving installation convenience and practicability.

The liquid-cooled heat dissipation module may additionally include an auxiliary heat sink that may be thermally connected to the substrate. In this way, it has the effect of improving the overall heat dissipation efficiency.

Wherein, the auxiliary radiator may be located in the circulation flow channel. In this way, the arrangement of the auxiliary radiator also helps to improve the heat dissipation efficiency of the working fluid.

Wherein, the auxiliary radiator may be at least one heat pipe or vapor chamber. In this way, the form, quantity and configuration of the auxiliary radiator can be selected according to requirements such as installation space or heat dissipation efficiency, which has the effect of improving product design flexibility and performance.

Wherein, the sealing plate can have a hollow part, the base plate can have a convex wall, the convex wall can encircle a through hole, the sealing plate can abut against the convex wall, and the hollow part can be connected with the through hole Alignment connection. In this way, it is convenient to process the sealing plate along the hollow portion to form the concave portion, and besides the through hole, the outer casing has another air flow channel formed by the hollow portion and the through hole, which runs through the upper and lower sides. In order to assist in improving the airflow rate on both sides of the casing, it has the functions of improving manufacturing convenience and heat dissipation efficiency.

Wherein, the casing may have a plurality of rough structures, and the plurality of rough structures may be located in the circulation flow channel. In this way, the contact area with the working fluid can be increased by the plurality of rough structures, which has the effect of improving the heat dissipation efficiency.

The liquid-cooled heat dissipation module may additionally include at least one enhanced heat dissipation component, the cooling fan has at least one air outlet, and the enhanced heat dissipation assembly may be connected to the housing and positioned at the air outlet. In this way, the air flow driven by the cooling fan can be used to improve the heat dissipation efficiency of the enhanced heat dissipation component, which has the effect of improving the overall heat dissipation efficiency.

Description of drawings

Figure 1: Diagram of an existing liquid-cooled heat dissipation system;

Fig. 2: The perspective view of the shell and the cooling fan of the first embodiment of the present utility model disassembled;

Fig. 3: the perspective view of the shell of the first embodiment of the present utility model disassembled;

Fig. 4: The top view of the first embodiment of the present utility model without the sealing plate;

Fig. 5: The first embodiment of the present utility model is taken along the line A-A of Fig. 4;

Figure 6: an exploded perspective view of the second embodiment of the present invention;

Fig. 7: The top view of the second embodiment of the present utility model without the sealing plate;

Fig. 8: the sectional view along the B-B line of Fig. 7 of the second embodiment of the present utility model;

Figure 9: An exploded perspective view of the third embodiment of the present invention.

Description of reference numerals

【The utility model】

1: Shell

1a: Substrate

1b: Sealing plate

11: Circulation channel

12: Depressed part

13: Through hole

13a: first hole

13b: Second hole

14: Projection

15: Ring Wall

16: Flow hole

17: Basket Empty Department

18: Convex Wall

181: Through hole

2: Pump

21: Shell cover

211: liquid inlet

212: Liquid outlet

22: Impeller

23: Catheter

3: cooling fan

31: air inlet

32: fan frame

33: Fan wheel

34: Air outlet

4: Auxiliary radiator

5: Strengthen the heat dissipation components

E1: head end

E2: tail end

H: heat source

L: working fluid

P: rough structure

S1: first side

S2: Second side

T: outer surface

Z1: endothermic zone

Z2: Cooling Zone

【current technology】

9: Liquid-cooled cooling system

91: Endothermic unit

92: cooling unit

93: Pump

94: Pipe Fittings

941,942,943: Pipe Fittings

H: heat source.

Detailed ways

In order to make the above-mentioned and other purposes, features and advantages of the present utility model more obvious and easy to understand, the preferred embodiments of the present utility model are listed below, and are described in detail with the accompanying drawings; in addition, those marked with the same symbols in different drawings It is regarded as the same, and its description will be omitted.

Please refer to FIG. 2 , which is the first embodiment of the liquid-cooled heat dissipation module of the present invention, which includes a casing 1 , a pump 2 and a heat dissipation fan 3 , and the pump 2 and the heat dissipation fan 3 are located in The enclosure 1.

The outer casing 1 is generally in the shape of a thin plate, so as to be installed in a light and thin electronic device. The casing 1 can be made of, for example, copper, aluminum, titanium, stainless steel or other thermally conductive materials. Please refer to FIG. 3 and FIG. 5) Circulating flow, for example, flowing in the direction of the arrow shown in FIG. 4 . The casing 1 may have a heat-absorbing zone Z1 and a cooling zone Z2, the heat-absorbing zone Z1 and the cooling zone Z2 are respectively located at a part of the circulation channel 11, so that the working fluid L can flow through the heat-absorbing zone Z1 and the cooling zone Z2; wherein, the housing 1 can be thermally connected to the heat source H of the electronic device by the heat absorbing zone Z1, and the cooling fan 3 can be positioned approximately in the cooling zone Z2 to help the cooling zone Z2 to rapidly cool down.

Referring to FIG. 2 and FIG. 4 , the outer surface T of the casing 1 has a concave portion 12 connected to the outer periphery of the casing 1, so that after the casing 1 is placed in an electronic device such as a notebook computer or a mobile phone, even if it is attached Connected to the casing, circuit board or other forms of substrates of the electronic device, a space for introducing airflow can still be formed by the recess 12 to ensure that the airflow can flow into the cooling fan 3 smoothly. The casing 1 has a through hole 13 located in the concave portion 12, the through hole 13 penetrates through opposite sides of the casing 1, and the through hole 13 is not communicated with the circulation channel 11; the cooling fan 3 is assembled to After the casing 1 , the cooling fan 3 can introduce airflow from the recess 12 through the through hole 13 . In this embodiment, the concave portion 12 and the through hole 13 can be selectively disposed in the cooling zone Z2 , and the cooling fan 3 can be positioned opposite to the concave portion 12 . In other embodiments, the recessed portion 12 can also extend to any position of the housing 1 as long as the airflow on one side of the housing 1 can flow from the recessed portion 12 through the through hole 13 to the other side of the housing 1 That's it.

3 and 5, the present invention does not limit the type of the housing 1. For example, the housing 1 of this embodiment may have a substrate 1a and a sealing plate 1b, and the substrate 1a has an opposite one A first side S1 and a second side S2, the sealing plate 1b is located on the first side S1 of the substrate 1a, the second side S2 of the substrate 1a can be thermally connected to the heat source H, and the sealing plate 1b can be connected to the substrate 1a The two are combined relative to each other to form the circulating flow channel 11 therebetween; the recessed portion 12 is located on the sealing plate 1b. Wherein, the substrate 1a may be composed of a single-layer board or a stack of multi-layer boards. In this embodiment, a single-layer board is used as an example for description, but it is not limited thereto.

The substrate 1a of this embodiment may be recessed on the surface of the first side S1 to form the circulation flow channel 11, and the substrate 1a may additionally have a first hole 13a, and the first hole 13a may be aligned on the substrate 1a to form the circulation Within the concave range of the flow channel 11, the sealing plate 1b may have a second hole 13b located in the concave portion 12; after the sealing plate 1b and the base plate 1a are relatively combined, the first hole 13a and the second hole 13b The through holes 13 are opposite and can be formed together. The structure of the substrate 1a and the sealing plate 1b where the through hole 13 is formed may be any type. For example, but not limited to, the substrate 1a of this embodiment may have a protruding portion 14, and the protruding portion 14 corresponds to The concave portion 12 protrudes toward the second side S2 , the first hole 13 a is located in the protruding portion 14 , and a peripheral edge of the first hole 13 a can form a ring wall 15 for abutting and combining with the ring wall 15 In the sealing plate 1b, the through hole 13 is not communicated with the circulating flow channel 11, and the height of the circulating flow channel 11 here is not reduced due to the through hole 13 being provided.

On the other hand, please refer to FIG. 3 and FIG. 4 again, the substrate 1a may further have two flow holes 16 , and the two flow holes 16 are respectively located at the head end E1 and the tail end E2 of the circulation flow channel 11 and communicate with each other. The pump 2 allows the working fluid L to flow into the circulation flow channel 11 through one of the flow holes 16 , and then leaves the circulation flow channel 11 through the other flow hole 16 to flow through the pump 2 . In this embodiment, the two flow holes 16 can penetrate through the first side S1 and the second side S2 of the substrate 1a, so that the pump 2 can be disposed on the second side S2 of the substrate 1a.

In addition, please refer to FIG. 3 and FIG. 5 , the casing 1 may have a plurality of rough structures P, the plurality of rough structures P are located in the circulating flow channel 11 , and the plurality of rough structures P can increase the amount of the working fluid. The contact area of L can improve the heat dissipation efficiency; for example, the rough structure P can be in the form of capillary structure, groove, bump or column, and the rough structures P can be connected to the substrate 1a or the sealing plate. 1b is integrally formed and connected. Wherein, when the plurality of rough structures P are a plurality of protruding pillars disposed in the circulation channel 11 at intervals, the height of each rough structure P may also be approximately the same as the depth of the circulation channel 11 (excluding the protrusions). 14) is the same, so that the plurality of rough structures P can abut the sealing plate 1b or the base plate 1a, provide the effect of auxiliary support, help the circulation channel 11 to maintain a substantially fixed volume, and prevent the casing 1 from being locally deformed condition.

Referring to FIGS. 3 and 4 , the pump 2 of this embodiment may have a cover 21 , and the cover 21 may be connected to the second side S2 of the substrate 1 a and make the two flow holes of the substrate 1 a The 16 pairs are located in the housing 21 , so that the circulation channel 11 can directly communicate with the inside of the pump 2 . The pump 2 additionally has an impeller 22 located in the casing 21, so that when the impeller 22 rotates, the working fluid L is sucked into the casing 21 from the rear end E2 of the circulation channel 11, and then the working fluid L is sucked into the casing 21. The working fluid L is re-introduced into the head end E1 of the circulation channel 11 , so that the working fluid L can circulate continuously in the circulation channel 11 . Wherein, the cover 21 can be combined with the second side S2 of the base plate 1a, or be integrally connected with the second side S2 of the base plate 1a, which is not limited by the present invention.

Referring to FIG. 4 and FIG. 5 , the cooling fan 3 can be combined with the housing 1 and located in the cooling zone Z2 . An air inlet 31 of the cooling fan 3 communicates with the concave portion 12 , so that when the casing 1 is placed on the casing, circuit board or other forms of substrates of the electronic device with the sealing plate 1b, the concave portion 12 can still provide air intake. The space for wind ensures that the airflow can smoothly flow into the air inlet 31 of the cooling fan 3 . In this embodiment, the cooling fan 3 can have a fan frame 32 and a fan wheel 33, the fan frame 32 can be combined with the second side S2 of the substrate 1a, and the fan wheel 33 is rotatably arranged on the fan In other words, the base plate 1a of the cooling fan 3 can be used as a cover on its air inlet side, that is, the through hole 13 of the base plate 1a can be located inside the fan frame 32, so that the through hole 13 can form the heat dissipation The air inlet 31 of the fan 3 makes the components of the overall liquid-cooled heat dissipation module simpler, and the axial thickness is also thinner. The cooling fan 3 can also have at least one air outlet 34. When the cooling fan 3 is a centrifugal fan, the air outlet 34 can be formed by the substrate 1a and the fan frame 32 together; the cooling fan 3 is an axial fan. In the state, the air outlet 34 can be disposed on the fan frame 32, which is understood by those skilled in the art, and is not limited to the type disclosed in the drawings. In this way, when the fan wheel 33 rotates, the external airflow can flow into the fan frame 32 through the air inlet 31 (the through hole 13 ), and then flow out through the air outlet 34 to enhance the cooling efficiency of the cooling zone Z2 of the casing 1 .

In addition, the liquid-cooled heat dissipation module may further include an auxiliary heat sink 4, which may be, for example, at least one heat pipe and/or a vapor chamber, and the auxiliary heat sink 4 may be thermally connected to the substrate 1a to assist in the absorption of Heat energy of heat source H. Wherein, the auxiliary radiator 4 may be located in the circulating flow channel 11, and this embodiment takes a heat pipe arranged in the circulating flow channel 11 as an example, but is not limited thereto. The auxiliary radiator 4 of the present embodiment may be partially located in the cooling zone Z2.

When the liquid-cooled heat dissipation module according to the first embodiment of the present invention is installed in an electronic device, the heat source H can be thermally connected by the substrate 1a of the casing 1, so that the heat-absorbing zone Z1 of the casing 1 can quickly absorb the heat source H heat energy to heat up. With the rotating operation of the impeller 22 of the pump 2, the working fluid L can be driven to flow in from the head end E1 of the circulation flow channel 11, and flow to the tail end E2 along the circulation flow channel 11, and the working fluid L can be When flowing through the heat-absorbing zone Z1, heat energy is absorbed, so that the heat-absorbing zone Z1 of the casing 1 can be cooled down. The working fluid L, which has absorbed heat and heated up, circulates through the operation of the pump 2, and when it flows through the cooling zone Z2 again, the cooling fan 3 increases the airflow rate around the cooling zone Z2, thereby helping the cooling zone Z2. The cooling zone Z2 cools down rapidly, so that the working fluid L flowing through here can also quickly release heat energy to cool down, so that when it flows through the heat-absorbing zone Z1 again, it can effectively exert its heat-absorbing ability, so that the overall liquid-cooled heat dissipation module can dissipate heat. The improved efficiency enables the electronic device to maintain a proper operating temperature.

Please refer to FIG. 6 and FIG. 7 , which are the second embodiment of the liquid-cooled heat dissipation module of the present invention, which is substantially the same as the above-mentioned first embodiment. In the present embodiment, the sealing plate 1b of the housing 1 may have a hollow portion 17 , so that the concave portion 12 is formed by processing the sealing plate 1b along the hollow portion 17 . Correspondingly, the substrate 1a may have a convex wall 18 protruding toward the first side S1, the convex wall 18 encircles a through hole 181, and the through hole 181 penetrates the first side S1 and the second side S1 of the substrate 1a. side S2. When the base plate 1a is combined with the sealing plate 1b oppositely, the sealing plate 1b abuts against the convex wall 18 and the ring wall 15, so that the hollow part 17 is aligned with the through hole 181, and the first hole 13a It is aligned and communicated with the second hole 13b, so that in addition to the through hole 13, the casing 1 has another air flow channel formed by the hollow portion 17 and the through hole 181, which is connected up and down to assist the lifting of the Air flow rate on both sides of housing 1.

Referring to FIGS. 7 and 8 , on the other hand, the auxiliary radiator 4 of this embodiment is illustrated by a temperature equalizing plate disposed in the circulation flow channel 11 as an example, but it is also replaced with the above-mentioned first embodiment. The illustrated heat pipe, or having the temperature equalizing plate and the heat pipe at the same time, is not limited in the present invention. In addition, the liquid-cooled heat dissipation module of this embodiment may further include at least one enhanced heat dissipation component 5, which may be, for example, a set of fins, and the enhanced heat dissipation component 5 may be connected to the second side S2 of the substrate 1a , and preferably located in the cooling zone Z2 to enhance the heat dissipation efficiency of the cooling zone Z2. In this embodiment, the enhanced heat dissipation component 5 can be connected to the housing 1 and positioned at the air outlet 34 of the heat dissipation fan 3 , for example, the enhanced heat dissipation assembly 5 can be disposed outside the air outlet 34 of the heat dissipation fan 3 or partially Extending into the air outlet 34 can utilize the airflow driven by the heat dissipation fan 3 to improve the heat dissipation efficiency of the enhanced heat dissipation component 5 .

Please refer to FIG. 9 , which is a third embodiment of the liquid-cooled heat dissipation module of the present invention. This embodiment provides an external pump 2 to be suitable for electronic devices with different installation space constraints.

Specifically, in this embodiment, the two flow holes 16 of the substrate 1a can be respectively communicated with the outer periphery of the substrate 1a, and the housing 21 can have a liquid inlet 211 and a liquid outlet 212, and can be composed of a liquid inlet 211 and a liquid outlet 212. The conduit 23 communicates with the liquid inlet 211 and one of the flow holes 16 , and the other conduit 23 communicates with the liquid outlet 212 and the other flow hole 16 . Therefore, when the impeller 22 of the pump 2 rotates, the working fluid L can be sucked into the casing 21 through one of the conduits 23 from the rear end E2 of the circulating flow channel 11, and then the working fluid L can pass through the other The conduit 23 is re-introduced into the head end E1 of the circulating flow channel 11 , so that the working fluid L can circulate continuously in the circulating flow channel 11 . In addition, the liquid-cooled heat dissipation modules of the first and second embodiments above can also be applied to the pump 2 in the external form of this embodiment as long as the arrangement of the two flow holes 16 is modified, which is a technique in the art. Personnel can understand and adjust it according to the needs of use.

In addition, please refer to FIG. 2 , the air outlet 34 is preferably selected not to communicate with the concave portion 12 to the outer periphery of the housing 1 , so as to reduce the hot air discharged from the concave portion 12 and be sucked back to the cooling fan through the concave portion 12 . 3 chances to avoid hot air circulation and reduce heat dissipation efficiency. Taking the embodiment shown in FIG. 9 as an example, the part where the recessed portion 12 communicates with the outer periphery of the casing 1 is one of the long sides and one short side of the casing 1 , and the cooling fan 3 with a single air outlet 34 is used in this embodiment. , so the air outlet 34 can be selected to face the other long side of the housing 1; on the contrary, in the embodiment using the cooling fan 3 with two air outlets 34, the two air outlets 34 can be directed towards the The other long side and the other short side of the casing 1 , or at least one of the air outlets 34 is not connected to the outer periphery of the casing 1 toward the recessed portion 12 , such as the types disclosed in the foregoing embodiments.

To sum up, the liquid-cooled heat dissipation module of the present invention can form a circulating flow channel directly in the casing of the liquid-cooled heat dissipation module, and integrate the pump and the heat dissipation fan together to connect the casing, thereby Significantly reduces the number of components required, which not only reduces the space occupied by the assembly and combination of components, but also ensures that the working fluid will not leak because the components are not tightly assembled. There is a problem that the working fluid evaporates and gradually decreases; at the same time, the cooling fan can help the liquid-cooled cooling module to dissipate heat efficiently. In addition, the liquid-cooled heat dissipation module of the present invention can also be assembled in advance, so that it can be quickly assembled to a predetermined position of the electronic device later. Therefore, the liquid-cooled heat dissipation module of the present invention has the functions of improving space utilization rate and assembly efficiency, which is helpful for the development of light and thin electronic devices having the liquid-cooled heat dissipation module.

Although the present invention has been disclosed by the above-mentioned preferred embodiments, it is not intended to limit the present invention, and any person skilled in the art can make various modifications to the above-mentioned embodiments without departing from the spirit and scope of the present invention. The modification and modification still belong to the technical scope protected by the present invention. Therefore, the protection scope of the present invention should include all changes within the meaning and equivalent scope of the claims. In addition, when the above-mentioned multiple embodiments can be combined, the present invention includes any combination of implementation aspects.

Claims (16)

1. A liquid-cooled heat dissipation module, comprising:

a housing having a circulation flow passage therein, an outer surface of the housing having a recess;

a pump for guiding a working fluid to circularly flow in the circulating channel; and

and the heat dissipation fan is combined with the shell, and an air inlet of the heat dissipation fan is communicated with the concave part.

2. The liquid-cooled heat dissipating module according to claim 1, wherein the housing has a heat absorbing region and a cooling region, the heat absorbing region and the cooling region are respectively located at a portion of the circulation channel, the heat absorbing region is used for thermally connecting a heat source, and the heat dissipating fan is located in the cooling region.

3. The liquid-cooled heat dissipating module as claimed in claim 1, wherein the recess is connected to the outer periphery of the housing, the housing has a through hole located in the recess, the through hole is not connected to the circulating channel, and the air inlet of the heat dissipating fan introduces air flow from the recess through the through hole.

4. The liquid-cooled heat dissipation module as claimed in claim 3, wherein the heat dissipation fan has at least one air outlet, and the air outlet is not connected to the periphery of the housing through the recess.

5. The liquid-cooled heat dissipating module as claimed in claim 3, wherein the housing has a base plate and a sealing plate, the sealing plate and the base plate are combined together to form the circulation channel, the recess is located on the sealing plate, and the base plate is used to connect a heat source.

6. The liquid-cooled heat dissipation module as claimed in claim 5, wherein the base plate has a first hole, the sealing plate has a second hole located in the recess, and the first hole and the second hole are opposite to each other and jointly form the through hole.

7. The liquid-cooled heat dissipation module as claimed in claim 6, wherein the base plate has a protrusion, the first hole is located in the protrusion, and a circumferential edge of the first hole forms an annular wall, and the annular wall is abutted against and combined with the sealing plate.

8. The liquid-cooled heat dissipation module as claimed in claim 5, wherein the base plate has a first side and a second side opposite to each other, the sealing plate is combined with the first side of the base plate, the heat dissipation fan has a fan frame combined with the second side of the base plate, and the through hole is aligned with the fan frame to form an air inlet of the heat dissipation fan.

9. The liquid-cooled heat dissipation module as claimed in claim 5, wherein the base plate has a first side and a second side opposite to each other, the sealing plate is combined with the first side of the base plate, the base plate has two flow holes at the head end and the tail end of the circulation channel, the two flow holes penetrate the first side and the second side of the base plate, a housing of the pump is combined with the second side of the base plate or integrally formed with the second side of the base plate, and the two flow holes are connected to the housing.

10. The liquid-cooled heat dissipating module as claimed in claim 5, wherein the base plate has two flow holes respectively located at the head end and the tail end of the circulating flow channel and connected to the periphery of the base plate, a housing of the pump has a liquid inlet and a liquid outlet, the pump is connected to the liquid inlet and one of the flow holes by a conduit, and connected to the liquid outlet and the other flow hole by another conduit.

11. The liquid-cooled heat dissipation module according to claim 5, further comprising an auxiliary heat sink thermally coupled to the base plate.

12. The liquid-cooled heat dissipation module according to claim 11, wherein the auxiliary heat sink is located in the circulation flow channel.

13. The liquid-cooled heat dissipation module according to claim 11, wherein the auxiliary heat sink is at least one heat pipe or vapor plate.

14. The liquid-cooled heat dissipation module as claimed in claim 5, wherein the sealing plate has a basket hollow portion, the base plate has a protruding wall surrounding a through hole, the sealing plate abuts against and engages the protruding wall, and the basket hollow portion is in aligned communication with the through hole.

15. The liquid-cooled heat dissipation module according to claim 1, wherein the housing has a plurality of roughness structures therein, and the roughness structures are located in the circulation flow channel.

16. The liquid-cooled heat dissipation module as claimed in any one of claims 1 to 15, further comprising at least one heat dissipation enhancing element, wherein the heat dissipation fan has at least one air outlet, and the heat dissipation enhancing element is connected to the housing and located at the air outlet.

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