TW202042202A - Display device - Google Patents

Abstract

A display device has a transparent substrate, a plurality of light emitting chip packages and a transparent medium. The light emitting chip packages are disposed in a matrix in the display device, and at least one light emitting chip package is electrically turned on to form a picture on the display device. Each of the light emitting chip packages has at least one light emitting chip and a package assembly covering the light emitting chip. The package assembly has a light emitting surface which is disposed to face a first surface of the transparent substrate, while the transparent medium is disposed between the light emitting surface of the package assembly and the first surface of the transparent substrate. The transparent medium has a refractive index which lies between the refractive index of air and the refractive index of the transparent substrate.

Description

Display device

The invention relates to a display device, in particular to a display device for light-emitting diodes.

Light emitting diode (LED) is an electronic component that uses semiconductor materials as luminescent materials. Compared with incandescent lamps and cold cathode fluorescent lamps (CCFL), it has the advantages of energy saving and environmental protection. , Long life, small size and fast response. With the popularization of flat-panel displays and the development of large-size, flat, thin, and light-weight display screens, technology development using LEDs as the self-luminous source of flat-panel displays has become increasingly important.

Due to the nature of light, if there is a medium on the light-emitting side of the light-emitting diode, it will inevitably produce reflection. In order to improve the contrast of the light emitting diode display, the arrangement structure of the light emitting diode on the display substrate must have a high light output rate and low reflectance. Therefore, this case hopes to propose solutions to these technical issues.

In view of the above problems, the present invention proposes the following display devices.

In an embodiment, the first proposed display device includes a transparent substrate, a plurality of light-emitting chip packages, and at least one transparent medium. The transparent substrate has a first surface and a second surface opposite to the first surface. These light-emitting chip packages are arranged in the display device in an array form. The light-emitting chip package has at least one light-emitting chip and a packaging material covering the light-emitting chip. The packaging material of the light-emitting chip package has a light-emitting side of the light-emitting chip package. The light-emitting surface faces the first surface of the transparent substrate, and at least one light-emitting chip package is illuminated to form a display screen of the display device. The transparent medium is arranged between the light-emitting surface of the light-emitting chip package and the first surface of the transparent substrate, and the refractive index of the transparent medium is greater than that of air and less than that of the transparent substrate.

In an embodiment, the surface of the light emitting chip package of the first proposed display device facing the light output side is black, and the surface of the light emitting chip package opposite to the light output side is white.

In one embodiment, the refractive index of the transparent medium of the first proposed display device is greater than the refractive index of the packaging material of the corresponding light-emitting chip package and less than the refractive index of the transparent substrate.

In one embodiment, the first surface of the transparent substrate of the proposed first display device is provided with a conductive circuit pattern, the light-emitting chip package has a plurality of conductive pins, and the conductive pins extend toward the light-emitting side of the light-emitting chip package. It is electrically connected to the conductive circuit pattern.

In one embodiment, the light emitting chip package of the first proposed display device has a convex structure.

In one embodiment, the light emitting chip package of the first proposed display device has a light emitting angle, the second surface of the transparent substrate is provided with a plurality of surface roughness areas, and the surface roughness areas are located at the light emitting angle of the corresponding light emitting chip package. In an area where a cone intersects the second surface.

In an embodiment, the second surface of the transparent substrate of the proposed first display device is provided with a plurality of surface roughness areas, and the surface roughness areas are located in an area of the corresponding light emitting chip package projected perpendicularly to the second surface.

In one embodiment, the proposed second display device includes a transparent substrate and a plurality of light-emitting chip packages. The transparent substrate has a first surface and a second surface opposite to the first surface. These light-emitting chip packages are arranged in the display device in an array form. The light-emitting chip package has at least one light-emitting chip, a packaging material covering the light-emitting chip, and a plurality of conductive pins. The conductive pins face a light-emitting side of the light-emitting chip package. Extending and electrically connected to the conductive circuit pattern, the packaging material of the light-emitting chip package has a light-emitting surface, and the light-emitting surface faces the first surface of the transparent substrate. After at least one light-emitting chip package is lit, it forms a display screen of the display device.

In one embodiment, the light emitting chip package of the second type of display device proposed has a convex structure.

In one embodiment, the proposed third display device includes a transparent substrate and a plurality of light-emitting chip packages. The transparent substrate has a first surface and a second surface opposite to the first surface, and the second surface is provided with a plurality of surface roughness areas. These light-emitting chip packages are arranged in the display device in an array form. The light-emitting chip package has at least one light-emitting chip and a package material covering the light-emitting chip. The package material of the light-emitting chip package has a light-emitting surface, and the light-emitting surface faces the transparent substrate. On the first surface, at least one light-emitting chip package is lit to form a display screen of the display device. The light-emitting chip package has a light-emitting angle, and the surface roughness area is located in an area where a cone formed by the light-emitting angle of the corresponding light-emitting chip package intersects the second surface or is located in the corresponding light-emitting chip package and projected vertically on the second surface In an area.

In summary, the display device proposed in each embodiment of the present invention utilizes that the surface of each light-emitting chip package facing the light-emitting side except for the light-emitting surface is black, which improves the contrast and saturation of the picture displayed by the display device. By using the surface of each light-emitting chip package facing the backlight side to be white, the transparency that a viewer on the backlight side of the display device feels when looking at the display device is improved. By disposing the conductive pins of the light-emitting chip package on the light-emitting side of the light-emitting chip package, the light-emitting surface of the light-emitting chip package can be close to the surface of the transparent substrate facing the light-emitting surface of the light-emitting chip package. The reflected light of the emitted light on the transparent substrate facing the light-emitting surface of the light-emitting chip package is seen by the user on the backlight side. In addition, a transparent medium can be provided between the light-emitting surface of the light-emitting chip package and the transparent substrate facing the light-emitting surface, thereby reducing the reflection of the light emitted from the light-emitting chip package on the transparent substrate and on the light-emitting surface of the entire display device. A rough surface area is formed at the position corresponding to the light-emitting chip package to reduce the reflection of the light emitted from the light-emitting chip package on the light-emitting surface of the entire display device. Therefore, the various solutions provided by the present invention effectively solve the problem of reflection of light emitted from the light-emitting chip package on the transparent substrate.

In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail in conjunction with the accompanying drawings.

FIG. 1A is a schematic plan view showing the light-emitting side of the light-emitting chip package of the display device according to the first embodiment of the present invention. FIG. 1B is a schematic side view showing the conductive pins on the backlight side of the light-emitting chip package of FIG. 1A. 1A and 1B, in one embodiment, a light emitting chip package 10 for a display device has an upper surface 101 facing the light-emitting side of the light emitting chip package 10 and a backlight side facing the light emitting chip package 10 The lower surface 102 on the backlight side is opposite to the upper surface 101 on the light emitting side. The light-emitting chip package 10 has one or more light-emitting chips 11 and a packaging material 12 covering the light-emitting chips 11. At least one light-emitting chip 11 of the light-emitting chip package 10 may be a single-color chip or three single-color chips each emitting red, green, and blue light, and the packaging material 12 may be epoxy resin or silicon glue. The light-emitting chip 11 is arranged in the light-emitting chip package 10, the packaging material 12 covers the light-emitting chip 11 and forms a light-emitting surface 121 on the light-emitting side of the light-emitting chip package 10, the light-emitting surface 121 faces the light-emitting side and preferably has a convex structure (Not shown in the figure), so that the traveling direction of the light emitted from the light-emitting chip 11 after passing through the light-emitting surface 121 can be as parallel as possible or completely parallel to the center normal direction of the light-emitting surface 121. The upper surface 101 of the light emitting chip package 10 facing the light exit side includes the light exit surface 121 and the peripheral surface 1012 other than the light exit surface 121. The light-emitting chip package 10 further has a plurality of conductive pins 103 that extend toward the backlight side of the light-emitting chip package 10 and are bent inwardly at the bottom of the light-emitting chip package 10 on the backlight side. In other embodiments, it is not limited thereto. The peripheral surface 1012 of the light emitting chip package 10 facing the light emitting side except for the light emitting surface 121 is black, and the lower surface 102 of the light emitting chip package 10 facing the backlight side, that is, the side facing the light emitting side, is white. The light emitting chip package 10 is, for example, an LED lamp bead.

2A is a schematic plan view showing the light-emitting side of the light-emitting chip package of the display device according to the second embodiment of the present invention. FIG. 2B is a schematic side view showing the conductive pins of the light emitting chip package of FIG. 2A extending toward the light emitting side. 2A and 2B at the same time, in one embodiment, a light emitting chip package 20 for a display device has an upper surface 201 facing the light emitting side of the light emitting chip package 20 and a backlight side facing the light emitting chip package 20 The lower surface 202 facing the backlight side is opposite to the upper surface 201 facing the light emitting side. The light-emitting chip package 20 has one or more light-emitting chips 21 and a packaging material 22 covering the light-emitting chips 21. At least one light-emitting chip 21 of the light-emitting chip package 20 may be a single-color chip or three single-color chips each emitting red, green, and blue light, and the packaging material 22 may be epoxy resin or silicon glue. The light-emitting chip 21 is disposed in the light-emitting chip package 20. The packaging material 22 covers the light-emitting chip 21 and forms a light-emitting surface 221 on the light-emitting side of the light-emitting chip package 20. The light-emitting surface 221 faces the light-emitting side and preferably has a convex structure (Not shown in the figure), the traveling direction of the light emitted from the light-emitting chip 21 after passing through the light-emitting surface 221 can be as parallel as possible or completely parallel to the center normal direction of the light-emitting surface 221. The upper surface 201 of the light emitting chip package 20 facing the light exit side includes the light exit surface 221 and the peripheral surface 2012 other than the light exit surface 221. The light-emitting chip package 20 further has a plurality of conductive pins 203 that extend toward the light-emitting side of the light-emitting chip package 20 and bend outward at the top of the light-emitting chip package 20 on the light-emitting side, but In other embodiments, it is not limited thereto. The peripheral surface 2012 of the light emitting chip package 20 facing the light emitting side except for the light emitting surface 221 is black, and the lower surface 202 of the light emitting chip package 20 facing the backlight side, that is, the side facing the light emitting side, is white. The light-emitting chip package 20 is, for example, an LED lamp bead. The number of conductive pins 203 of the light emitting chip package 20 may be six as shown in FIG. 2A, but is not limited thereto. Compared with the first embodiment, by arranging one end of the conductive pins 203 of the light-emitting chip package 20 on the light-emitting side of the light-emitting chip package 20, when the conductive pins 203 of the light-emitting chip package 20 and the display device After a transparent substrate is joined, the upper surface 201 of the light-emitting chip package 20 facing the light-emitting side will be close to the transparent substrate, so that the reflected light of the light-emitting chip package 20 through the light-emitting surface 221 on the transparent substrate is blocked by the upper surface 201 , Reducing the chance of the reflected light being seen by the user on the backlight side of the light emitting chip package 20.

3A is a schematic diagram showing a partial cross-section of the display device according to the third embodiment of the present invention. 3B is a schematic plan view showing a transparent substrate of the display device of the third embodiment of the present invention and the light-emitting side of the light-emitting chip package shown in FIG. 1B. 3C is a schematic plan view showing a transparent substrate of the display device of the third embodiment of the present invention and the backlight side of the light-emitting chip package shown in FIG. 1B. As shown in FIGS. 3A to 3C, in one embodiment, the display device 3 has a lower transparent substrate 31, an upper transparent substrate 32, and a plurality of light-emitting chip packages 10 as shown in FIG. 1B. The lower transparent substrate 31 has a first surface 311 and a second surface 312 opposite to the first surface 311, and the upper transparent substrate 32 has a first surface 321 and a second surface 322 opposite to the first surface 321. These light-emitting chip packages 10 are arranged in the display device 3 in an array form, located between the lower transparent substrate 31 and the upper transparent substrate 32 and fixed on the first surface 311 of the lower transparent substrate 31, specifically, the lower transparent substrate 31 Conductive circuit patterns are arranged on the first surface 311, and the conductive pins 103 of the light-emitting chip package 10 are connected to the conductive circuit patterns. The backlight side of the light emitting chip package 10 faces the first surface 311 of the lower transparent substrate 31, and the light emitting side of the light emitting chip package 10 faces the first surface 321 of the upper transparent substrate 32. In this way, the upper transparent substrate 32 will be located above the first surface 311 of the lower transparent substrate 31 and sandwich the multiple light-emitting chip packages 10 between the lower transparent substrate 31 and the upper transparent substrate 32. In this embodiment, the light emitting surface 121 of the packaging material 12 of the light emitting chip package 10 faces the first surface 321 of the upper transparent substrate 32. The light emitted from the light-emitting chip package 10 passes through the aforementioned convex structure of the light-emitting surface 121 and is preferably perpendicular to the first surface 321 of the upper transparent substrate 32 after passing through the light-emitting surface 121, so that the light emitted from the light-emitting chip package 10 is as good as possible The ground is incident on the upper transparent substrate 32 while reducing the reflection of the emitted light on the upper transparent substrate 32. One or more light-emitting chip packages 10 are lit to form a display screen of the display device 3. In addition, the display device 3 also has a transparent medium 33. The transparent medium 33 is, for example, a cured colloid, which is arranged between the upper transparent substrate 32 and the lower transparent substrate 31 in the form of a whole layer as shown in FIG. 3A. The light emitting surface 121 of the packaging material 12 and the first surface 321 of the upper transparent substrate 32 that cover the light emitting chip packages 10 and contact the light emitting chip packages 10, because the transparent medium 33 is filled with the light emitting chip packages 10 and The gap between the upper transparent substrate 32, that is, is set between the light-emitting surface 121 of the light-emitting chip package 10 and the first surface 321 of the upper transparent substrate 32, so that the light emitted from the light-emitting chip package 10 sequentially passes through the transparent medium 33 And the upper transparent substrate 32. In other embodiments, a transparent medium 33 may also be provided between the light-emitting surface 121 of the packaging material 12 of each light-emitting chip package 10 and the first surface 321 of the upper transparent substrate 32, and a display device has multiple A transparent medium 33. The refractive index of the transparent medium 33 is larger than the refractive index of air and smaller than the refractive index of the upper transparent substrate 32. Preferably, the refractive index of the transparent medium 33 is also greater than the refractive index of the packaging material 12 of the corresponding light-emitting chip package 10. For example, the material of the transparent medium 33 can be polyvinyl butyral (PVB), the material of the packaging material 12 can be a silyl packaging material, and the material of the transparent substrate 32 can be glass, so the refractive index of the transparent medium 33 It is between the refractive index of the silyl-methyl package material of 1.4 and the refractive index of glass of 1.55, for example, 1.488. In this way, the reflection of the light emitted from the light emitting chip package 10 on the upper transparent substrate 32 can be reduced and the amount of light emitted by the light emitting chip package 10 entering the upper transparent substrate 32 can be increased. The lower transparent substrate 31 or the upper transparent substrate 32 is, for example, glass, polyethylene terephthalate (PET), polyimide (PI), polyethylene naphthalate (PEN), polycarbonate (PC ) Or polymethyl methacrylate (PMMA). Please continue to refer to FIGS. 1A, 3A, 3B, and 3C. In this embodiment, the peripheral surface 1012 of each light-emitting chip package 10 facing the light-emitting side except for the light-emitting surface 121 is black, which can improve the display device 3. The contrast and saturation of the display image are also because the black area absorbs the reflected light from the light emitting chip package 10 on the upper transparent substrate 32, thereby reducing the amount of reflected light. In addition, the lower surface 102 of each light-emitting chip package 10 facing the backlight side is white, which can improve the permeability felt by the user on the backlight side when facing the second surface 312 of the lower transparent substrate 31. Therefore, the high transparency effect of the entire display device 3 can be presented.

4A is a schematic diagram showing a partial cross-section of the display device of the fourth embodiment of the present invention. 4B is a schematic plan view showing a transparent substrate of the display device of the fourth embodiment of the present invention and the backlight side of the light-emitting chip package shown in FIG. 2B. 4C is a schematic plan view showing a transparent substrate of the display device of the fourth embodiment of the present invention and the light emitting side of the light emitting chip package shown in FIG. 2B. As shown in FIGS. 4A to 4C, in one embodiment, the display device 4 has a transparent substrate 41 and a plurality of light-emitting chip packages 20 as shown in FIG. 2B. The transparent substrate 41 has a first surface 411 and a second surface 412 opposite to the first surface 411. These light-emitting chip packages 20 are arranged in the display device 4 in an array form and fixed on the first surface 411 of the transparent substrate 41. Specifically, the first surface 411 of the transparent substrate 41 is configured with conductive circuit patterns. The conductive pins 203 of the body 20 are joined to the conductive circuit pattern, and the light-emitting side of the light-emitting chip package 20 faces the first surface 411 of the transparent substrate 41. In this embodiment, the light-emitting surface 221 of the packaging material 22 of the light-emitting chip package 20 faces the first surface 411 of the transparent substrate 41. The emitted light of the light-emitting chip package 20 passes through the aforementioned convex structure of the light-emitting surface 221 and is preferably perpendicular to the first surface 411 of the transparent substrate 41 after passing through the light-emitting surface 221, so that the emitted light of the light-emitting chip package 20 is as large as possible It is incident on the transparent substrate 41 while reducing the reflection of the emitted light on the transparent substrate 41. One or more light-emitting chip packages 20 are lit to form a display screen of the display device 4. In addition, the display device 4 also has a plurality of transparent media 43. As shown in FIG. 4A, the plurality of transparent media 43 are respectively disposed on the light-emitting side of the light-emitting chip packages 20 and respectively contact the packaging materials of the corresponding light-emitting chip packages 20. The light emitting surface 221 of 22 and the first surface 411 of the transparent substrate 41, the transparent medium 43 is arranged between the light emitting surface 221 of the light emitting chip package 20 and the first surface 411 of the transparent substrate 41, so that the light emitting chip package 20 emits The light passes through the transparent medium 43 and the transparent substrate 41 in sequence. The refractive index of the transparent medium 43 is larger than the refractive index of air and smaller than the refractive index of the transparent substrate 41. Preferably, the refractive index of the transparent medium 43 is also greater than the refractive index of the packaging material 22 of the corresponding light-emitting chip package 20. For example, the material and the range of the refractive index of the transparent medium 43 can be the same as the material and the range of the refractive index of the transparent medium 33 described above, and will not be repeated here. Thereby, the reflection of the light emitted from the light-emitting chip package 20 on the transparent substrate 41 can be reduced. The material of the transparent substrate 41 can be the same as the material of the lower transparent substrate 31 or the upper transparent substrate 32 described above, and will not be repeated here. Please continue to refer to FIGS. 2A, 4A, 4B, and 4C. In this embodiment, the peripheral surface 2012 of each light-emitting chip package 20 facing the light-emitting side except for the light-emitting surface 221 is black, which can improve the display device 4 The contrast and saturation of the display image are also because the black area absorbs the reflected light from the light emitting chip package 20 on the transparent substrate 41, thereby reducing the amount of reflected light. In addition, the lower surface 202 of each light-emitting chip package 20 facing the backlight side is white, which can improve the transparency felt by the user on the backlight side of the display device 4 when facing the first surface 411 of the transparent substrate 41. Therefore, the high transparency effect of the entire display device 4 can be presented.

5 is a schematic side view showing a transparent substrate and a surface roughness area formed on the transparent substrate corresponding to each light-emitting chip package in the display device of the fifth embodiment of the present invention. This embodiment is an extended embodiment of the foregoing fourth embodiment. The description of the elements and corresponding elements in the figure that are the same as those in FIG. 4A has been described above, and will not be repeated here. As shown in FIG. 2B, FIG. 4A, and FIG. 5, the conductive circuit pattern arranged on the first surface 411 of the transparent substrate 41 of the display device 4 includes a transparent conductive pattern layer 62 and a plurality of mutual electrical circuits arranged on the transparent conductive pattern layer 62. The isolated conductive pin contacts 621 and the transparent conductive pattern layer 62 contact the first surface 411 of the transparent substrate 41. In other embodiments (not shown), the conductive circuit pattern disposed on the first surface 411 of the transparent substrate 41 of the display device 4 may include a transparent conductive pattern layer, a metal conductive pattern layer disposed on the transparent conductive pattern layer, and a configuration There are a plurality of conductive pin contacts on the metal conductive pattern layer that are electrically isolated from each other. The transparent conductive pattern layer contacts the first surface 411 of the transparent substrate 41 and is used to improve the heat dissipation capacity, and the metal conductive pattern layer is used to improve the conductivity. Alternatively, the conductive circuit pattern configured on the first surface 411 of the transparent substrate 41 of the display device 4 may only include a metal conductive pattern layer and a plurality of electrically isolated conductive pin contacts disposed on the metal conductive pattern layer. The pattern layer contacts the first surface 411 of the transparent substrate 41. The conductive pin contacts 621 are for electrically connecting the conductive pins 203 of each light-emitting chip package 20. The conductive pins 203 of the light-emitting chip packages 20 are respectively connected to the corresponding conductive pin contacts 621 in the conductive circuit pattern. In this embodiment, the normal direction of the first surface 411 of the transparent substrate 41 is opposite to the direction of light emitted from the light-emitting chip package 20 (the arrow direction in FIG. 5), and the first surface 411 of the transparent substrate 41 is opposite to each other. There is a gap 40 between the light-emitting surfaces 221 of the packaging material 22 of the light-emitting chip package 20. The transparent medium 43 is disposed between the first surface 411 of the transparent substrate 41 and the light-emitting surface 221 of the packaging material 22 of the corresponding light-emitting chip package 20, that is, in the gap 40.

Please continue to refer to FIG. 5, in one embodiment, the second surface 412 of the transparent substrate 41 is provided with a plurality of surface roughness areas A, and the surface roughness areas A are located on the light emitting side of the corresponding light emitting chip package 20 and located on the corresponding light emitting chip package The light exit angle θ of the body 20 forms an area where a cone and the second surface 412 intersect. In another embodiment, when the volume of the light-emitting chip package 20 is relatively large, the rough surface area A is located in the area where the corresponding light-emitting chip package 20 is projected perpendicularly to the second surface 412. As shown in FIG. 5, the surface roughness area A may be a concave-convex microstructure 46 formed on the second surface 412 of the transparent substrate 41. The surface roughness area A helps to guide the light in the transparent substrate 41 while reducing the reflected light generated when the emitted light of the light emitting chip package 20 passes through the transparent substrate 41, and because of the location of the rough surface area A and the position of the light emitting chip package 20 Correspondingly, the area of the surface roughness area A can be minimized and blocked by the corresponding light-emitting chip package 20, so that the display screen of the display device 4 is softened without affecting the transparency of the entire display device 4.

In summary, the display device proposed in each embodiment of the present invention utilizes that the surface of each light-emitting chip package facing the light-emitting side except for the light-emitting surface is black, which improves the contrast and saturation of the picture displayed by the display device. By using the surface of each light-emitting chip package facing the backlight side to be white, the transparency that a viewer on the backlight side of the display device feels when looking at the display device is improved. By disposing the conductive pins of the light-emitting chip package on the light-emitting side of the light-emitting chip package, the light-emitting surface of the light-emitting chip package can be close to the surface of the transparent substrate facing the light-emitting surface of the light-emitting chip package. The reflected light of the emitted light on the transparent substrate facing the light-emitting surface of the light-emitting chip package is seen by the user on the backlight side. In addition, a transparent medium can be provided between the light-emitting surface of the light-emitting chip package and the transparent substrate facing the light-emitting surface, thereby reducing the reflection of the light emitted from the light-emitting chip package on the transparent substrate and on the light-emitting surface of the entire display device. A rough surface area is formed at the position corresponding to the light-emitting chip package to reduce the reflection of the light emitted from the light-emitting chip package on the light-emitting surface of the entire display device. Therefore, the various solutions provided by the present invention effectively solve the problem of reflection of light emitted from the light-emitting chip package on the transparent substrate.

The various embodiments of the present invention are disclosed above, but they are not intended to limit the present invention. Anyone with ordinary knowledge in the technical field can make some changes and modifications without departing from the spirit and scope of the present invention. The scope of protection of the invention shall be subject to the scope of the attached patent application.

10: Light-emitting chip package 101: The upper surface facing the light emitting side 1012: The surrounding surface facing the light emitting side 102: The bottom surface facing the backlight side 103: Conductive pins １１: Light-emitting chip 12: Packaging materials 121: Glossy surface 20: Light-emitting chip package 201: The upper surface facing the light emitting side 2012: The surrounding surface facing the light emitting side 202: The bottom surface facing the backlight side 203: Conductive pins 21: Light-emitting chip 22: Packaging materials 221: Glossy surface 3: Display device 31: Lower transparent substrate 311: The first surface of the lower transparent substrate 312: The second surface of the lower transparent substrate 32: Upper transparent substrate 321: The first surface of the upper transparent substrate 322: The second surface of the upper transparent substrate 33: Transparent medium 4: Display device 40: Clearance 41: Transparent substrate 411: The first surface 412: The second surface 43: Transparent medium 46: Microstructure 62: Transparent conductive layer 621: Conductive pin contacts A: Rough area θ: light angle

FIG. 1A is a schematic plan view showing the light-emitting side of the light-emitting chip package of the display device according to the first embodiment of the present invention. FIG. 1B is a schematic side view showing the conductive pins on the backlight side of the light-emitting chip package of FIG. 1A. 2A is a schematic plan view showing the light-emitting side of the light-emitting chip package of the display device according to the second embodiment of the present invention. FIG. 2B is a schematic side view showing the conductive pins of the light emitting chip package of FIG. 2A extending toward the light emitting side. 3A is a schematic diagram showing a partial cross-section of the display device according to the third embodiment of the present invention. 3B is a schematic plan view showing a transparent substrate of the display device of the third embodiment of the present invention and the light-emitting side of the light-emitting chip package shown in FIG. 1B. 3C is a schematic plan view showing a transparent substrate of the display device of the third embodiment of the present invention and the backlight side of the light-emitting chip package shown in FIG. 1B. 4A is a schematic diagram showing a partial cross-section of the display device of the fourth embodiment of the present invention. 4B is a schematic plan view showing a transparent substrate of the display device of the fourth embodiment of the present invention and the backlight side of the light-emitting chip package shown in FIG. 2B. 4C is a schematic plan view showing a transparent substrate of the display device of the fourth embodiment of the present invention and the light emitting side of the light emitting chip package shown in FIG. 2B. 5 is a schematic side view showing a transparent substrate and a surface roughness area formed on the transparent substrate corresponding to each light-emitting chip package in the display device of the fifth embodiment of the present invention.

20: Light-emitting chip package

201: The upper surface facing the light emitting side

202: The bottom surface facing the backlight side

203: Conductive pin

4: display device

40: gap

41: Transparent substrate

411: First Surface

412: second surface

43: transparent medium

46: Microstructure

62: Transparent conductive layer

621: Conductive pin contacts

A: rough area

θ: light angle

Claims (10)

A display device including: A transparent substrate having a first surface and a second surface opposite to the first surface; A plurality of light-emitting chip packages are arranged in the display device in an array form, the light-emitting chip package has at least one light-emitting chip and a packaging material covering the light-emitting chip, and the packaging material of the light-emitting chip package is packaged in the light-emitting chip A light-emitting side of the body has a light-emitting surface, the light-emitting surface faces the first surface of the transparent substrate, and at least one light-emitting chip package is lit to form a display screen of the display device; and At least one transparent medium, the transparent medium is disposed between the light-emitting surface of the light-emitting chip package and the first surface of the transparent substrate, and the refractive index of the transparent medium is greater than that of air and less than that of the transparent substrate . The display device according to item 1 of the scope of patent application, wherein a surface of the light emitting chip package facing the light emitting side is black, and a surface of the light emitting chip package facing the light emitting side is white. The display device according to claim 1, wherein the refractive index of the transparent medium is greater than the refractive index of the packaging material of the corresponding light-emitting chip package and less than the refractive index of the transparent substrate. The display device according to claim 1, wherein the first surface of the transparent substrate is provided with a conductive circuit pattern, the light-emitting chip package has a plurality of conductive pins, and the conductive pins face the light-emitting chip package. The light emitting side of the body extends and is electrically connected to the conductive circuit pattern. The display device according to item 1 of the scope of patent application, wherein the light emitting surface of the light emitting chip package has a convex structure. The display device according to claim 1, wherein the light emitting chip package has a light exit angle, the second surface of the transparent substrate is provided with a plurality of surface roughness areas, and the surface roughness areas are located on the corresponding light emitting chip The light exit angle of the package body forms an area where a cone and the second surface intersect. The display device according to item 1 of the scope of patent application, wherein the second surface of the transparent substrate is provided with a plurality of surface roughness areas, and the surface roughness areas are located on the corresponding light emitting chip package projected vertically on the second surface. In one area. A display device including: A transparent substrate having a first surface and a second surface opposite to the first surface, the first surface is provided with a conductive circuit pattern; and A plurality of light-emitting chip packages are arranged in the display device in an array form. The light-emitting chip package has at least one light-emitting chip, a packaging material covering the light-emitting chip, and a plurality of conductive pins, the conductive pins facing the light-emitting chip A light-emitting side of the package body extends and is electrically connected to the conductive circuit pattern. The package material of the light-emitting chip package has a light-emitting surface facing the first surface of the transparent substrate. At least one light-emitting chip package The body is lit to form a display screen of the display device. The display device according to item 8 of the scope of patent application, wherein the light emitting surface of the light emitting chip package has a convex structure. A display device including: A transparent substrate having a first surface and a second surface opposite to the first surface, the second surface is provided with a plurality of surface roughness areas; and A plurality of light-emitting chip packages are arranged in the display device in an array form, the light-emitting chip package has at least one light-emitting chip and a packaging material covering the light-emitting chip, and the packaging material of the light-emitting chip package has a light-emitting surface, The light-emitting surface faces the first surface of the transparent substrate, and at least one light-emitting chip package is lit to form a display screen of the display device; Wherein, the light-emitting chip package has a light-emitting angle, and the surface roughness area is located in a region where a cone formed by the light-emitting angle of the light-emitting chip package intersects with the second surface or is located in the corresponding light-emitting chip The package body is vertically projected in an area of the second surface.

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