TW201934738A - Resin mask stripping and cleaning method having excellence in resin mask detachment property and continuous operation stability - Google Patents

Abstract

One embodiment of the present invention provides a resin mask stripping and cleaning method which is excellent in resin mask detachment property and continuous operation stability. In one aspect of the present application, there is provided a resin mask stripping and cleaning method for stripping and cleaning a resin mask attached to a material to be washed by a circulation type cleaning apparatus that repeatedly uses a detergent solution. This circulation type cleaning apparatus has a primary filter for filtering the detergent solution used for the stripping and cleaning, and the primary filter is a mesh having a mesh size of 8 meshes or more and 80 meshes or less. The detergent solution is a detergent composition having a quaternary ammonium hydroxide (component A) represented by the following formula (I), an amine (component B) represented by the following formula (II), and water (component C), wherein the a content of the component A is 1% by mass or more and 6.5% by mass or less, a content of the component B is 1% by mass or more and 10% by mass or less, and a content of the component C is 50% by mass or more and 98% by mass or less.

Description

Resin mask peeling and washing method

This application relates to a method for peeling and cleaning a resin mask and a method for manufacturing an electronic component.

In recent years, for personal computers and various electronic devices, reductions in power consumption, high-speed processing, and miniaturization are being promoted, and the miniaturization of the wiring of package substrates and the like mounted thereon is being developed year by year. In the formation of fine wiring and connection terminals such as pillars and bumps, the metal mask method has been mainly used so far. However, it is difficult to cope with the miniaturization of wiring due to its low versatility, and it is being used in other areas. New methods change.

As one of the new methods, a method of using a dry film resist instead of a metal mask as a thick film resin mask is known. This resin mask is finally peeled / removed, but in this case, an alkaline peeling detergent is used.

As this peeling detergent, for example, Patent Document 1 describes a detergent composition for a resin masking layer used in the manufacture of a circuit board, which contains quaternary ammonium in 100 parts by mass of the detergent composition. 0.5 mass parts to 3.0 mass parts of hydroxide, 3.0 mass parts to 10.0 mass parts of water-soluble amine, 0.3 mass parts to 2.5 mass parts of acid or its ammonium salt, 50.0 mass parts of water or more 95.0 parts by mass or less.

Patent Document 2 describes a photoresist stripping liquid composition containing 0.5 to 5% by mass of an alkyl ammonium hydroxide; 60 to 90% by mass of an aprotic polar solvent; and 0.1 to 3% by mass of an aromatic polyol; The linear polyol is 0.1 to 5 mass%; and water is 5 to 30 mass%.

Patent Document 3 describes a negative resin masking detergent composition containing a specific quaternary ammonium hydroxide, an amine, a carboxylic acid having 1 to 5 carbon atoms or a salt thereof, and water.

Prior art literature

Patent literature

Patent Document 1: Japanese Patent Application Laid-Open No. 2015-79244

Patent Document 2: Japanese Patent Publication No. 2013-527992

Patent Document 3: Japanese Patent Application Laid-Open No. 2017-120400

Problem to be Solved by the Invention When a fine wiring is formed on a printed circuit board or the like, of course, a resin mask such as a dry film resist remains. Residues of detergents and the like are required to have high detergent properties for the detergent composition. The resin mask changes the physical properties such as solubility in the developing solution by light and electron rays, and protects the surface of the substance from subsequent etching and other treatments. This resin mask is roughly divided according to the reaction method with light and electron rays. It is positive and negative. In the case of a negative-type resin mask, when exposed to light, the solubility in a developing solution is reduced, and the exposed portion remains after development to form a protective film. In a positive-type resin mask, when exposed, the solubility in a developing solution increases, and the exposed portion is removed. By using this resin mask, fine connection portions of a circuit board such as a metal wiring, a metal pillar, and a solder bump can be formed.

However, the characteristics of the resin mask vary depending on the plating solution used during the formation of the connection portion, heat treatment, and the like, and it is difficult to remove (peel) the resin mask in the cleaning step of the next step. In particular, the negative resin mask has the property of curing by the reaction with light and electron rays. Therefore, the curing progressed beyond the necessary level due to the plating bath and heat, and it could not be completely removed (peeled) during the cleaning step. Or it takes a long time to remove (peel off), which causes damage to the substrate and metal surface. Therefore, a high resin mask removal property is required for the detergent composition.

Furthermore, not only the performance improvement of the detergent composition described above, but also a cleaning device and an operation method that consider productivity and environmental impact are important factors in obtaining a high-quality package substrate. In the case of an influence on the environmental burden, a cleaning device and an operation method capable of fully exerting the performance of the detergent composition and further having excellent continuous operation stability are required.

Therefore, one aspect of the present application provides a resin mask peeling and cleaning method that is excellent in resin mask removal properties and continuous operation stability.

Solution to Problem One aspect of the present application relates to a method for peeling and cleaning a resin mask, which utilizes a circulation-type cleaning device that repeatedly uses a cleaning solution to mask the resin attached to the object to be cleaned. Carry out peeling and washing,
This circulation type cleaning device has a primary filter that filters the cleaning liquid used for peeling cleaning,
The primary filter is a mesh with a mesh size of 8 meshes or more and 80 meshes or less.
This washing liquid contains a quaternary ammonium hydroxide (component A) represented by the following formula (I), an amine (component B) represented by the following formula (II), and water (component C). A detergent composition having a content of A of 1% to 6.5% by mass, a content of component B of 1% to 10% by mass, and a content of component C of 50% to 98% by mass.

In the formula (I), R ¹ , R ² , R ^3, and R ⁴ are each independently at least one selected from the group consisting of methyl, ethyl, propyl, hydroxymethyl, hydroxyethyl, and hydroxypropyl.

In the formula (II), R ⁵ represents at least one selected from a hydrogen atom, a methyl group, an ethyl group, and an amino ethyl group, and R ⁶ represents a group selected from a hydrogen atom, hydroxyethyl group, hydroxypropyl group, methyl group, and At least one kind of ethyl group, R ⁷ represents at least one kind selected from aminoethyl, hydroxyethyl, and hydroxypropyl, or, in formula (II), R ⁵ represents selected from methyl, ethyl, At least one of an aminoethyl group, a hydroxyethyl group, and a hydroxypropyl group, R ⁶ and R ⁷ are bonded to each other and form a pyrrolidine ring or a piperazine ring together with the N atom in the formula (II).

One aspect of the present application relates to a method for manufacturing an electronic component, which includes: soldering and plating at least one electronic component selected from a printed circuit board, a wafer, and a metal plate using a resin mask. A step of at least one processing in a coating process; and a step of cleaning the electronic component that has been subjected to at least one of a soldering and a plating process by a cleaning method of the present application.

ADVANTAGE OF THE INVENTION According to this application, in one aspect, the resin mask peeling and washing method which is excellent in resin mask removal property and continuous operation stability is provided.

This application is based on the insight that by using a circulation-type cleaning device having a primary filter having a specific mesh size, and using a specific quaternary ammonium hydroxide (component A) and a specific amine in a specific amount (Component B) and water (component C) The detergent composition can effectively remove the resin mask as the cleaning liquid used in the circulation type cleaning device, and can further improve the continuous operation stability. Stop operations for long periods of time to reduce frequent maintenance such as productivity.

That is, one aspect of the present application relates to a resin mask peeling and cleaning method (hereinafter, also referred to as "the cleaning method of the present application"), which uses a circulation-type cleaning device that repeatedly uses a cleaning solution. , Peel and wash the resin mask attached to the object to be cleaned,
This circulation type cleaning device has a primary filter that filters the cleaning liquid used for peeling cleaning,
The primary filter is a mesh with a mesh size of 8 meshes or more and 80 meshes or less.
This washing liquid contains a quaternary ammonium hydroxide (component A) represented by the above formula (I), an amine (component B) represented by the above formula (II), and water (component C). Detergent composition containing 1 mass% or more and 6.5 mass% or less, component B content of 1 mass% or more and 10 mass% or less, and component C content of 50 mass% or more and 98 mass% or less (hereinafter, Also called "detergent composition of the present application").

Although the details of the effect mechanism of the effect of the washing method of this application are unclear, it is estimated as follows.

The negative resin mask usually contains an alkali-soluble resin dissolved in an alkaline developer, an acid generator that generates an acid by exposure, and a cross-linking agent that forms a crosslink between the alkali-soluble resin using an acid as a catalyst. Examples of the alkali-soluble resin include p-hydroxystyrene (PHS) resin, methacrylate resin, and the like. It can be considered that if the negative resin mask is irradiated with light, electron rays, etc., an acid is generated from the acid generator in the exposed portion of the negative resin mask, and the alkali-soluble resin is crosslinked by the baking heat after exposure. The agent uses an acid as a catalyst to cause a condensation crosslinking reaction. It is considered that the alkali-soluble resin changes into a huge polymer compound having a three-dimensional structure by a condensation and crosslinking reaction, and becomes a resin insoluble in an alkali developing solution. At this time, the highly reactive cross-linking agent can react with the alkali-soluble resin more than necessary by plating treatment, welding, etc., so the alkali-soluble resin changes into a huge polymer compound having a more complicated three-dimensional structure. As a result, peeling and removal of the negative resin mask after development becomes difficult.

On the other hand, regarding the detergent composition of the present application, it is considered that the alkaline component A and the component B use a solder paste, an acid component contained in the flux component, or heating to cut off the negative molecular weight. Bonding of the resin of the type resin mask can reduce the molecular weight. In addition, it is considered that the component A and water (component C) are impregnated into a low-molecular-weight negative resin mask, strain of the resin is strained, and stress is generated in the resin, so that the resin mask can be easily peeled off at a suitable size, and the Efficiently removes the resin mask.

Furthermore, it is thought that the cleaning method of this application can control the peeling sheet of a resin mask to an appropriate size. Therefore, it is estimated that the entanglement on the input / output conveyor for conveying the objects to be cleaned, such as a semiconductor package, is unlikely to occur, the peeling sheet is easily collected with a single filter, and the cleaning liquid can be reused. Frequent maintenance such as reducing productivity without performing long-term stop operations can achieve a low environmental burden and high productivity.

However, this application can also be interpreted without being limited to this mechanism.

In the present application, the resin mask refers to a mask for protecting the surface of a substance from the effects of processes such as etching, plating, and heating, that is, a mask that functions as a protective film. As the resin mask, in one or more embodiments, a resist layer after the exposure or development step, and at least one of exposure and development (hereinafter, also referred to as "exposed and And / or a developed resist layer) or a cured resist layer. Examples of the resin material forming the resin mask include a film-like photosensitive resin or a resist film in one or more embodiments. As the resist film, a general-purpose resist film can be used.

(Detergent composition)
[Ingredient A: quaternary ammonium hydroxide]

The component A in the detergent composition of the present application is a quaternary ammonium hydroxide represented by the following formula (I). Component A can be used individually by 1 type or in mixture of 2 or more types.

In the formula (I), R ¹ , R ² , R ^3, and R ⁴ are each independently at least one selected from the group consisting of methyl, ethyl, propyl, hydroxymethyl, hydroxyethyl, and hydroxypropyl.

Examples of the component A include a salt formed from a quaternary ammonium cation and a hydroxide, and the like. Specific examples of the component A include tetramethylammonium hydroxide (TMAH), tetraethylammonium hydroxide, tetrapropylammonium hydroxide, and 2-hydroxyethyltrimethylammonium hydroxide (choline). ), 2-hydroxyethyltriethylammonium hydroxide, 2-hydroxyethyltripropylammonium hydroxide, 2-hydroxypropyltrimethylammonium hydroxide, 2-hydroxypropyltriethylammonium hydroxide, 2-hydroxypropyltripropylammonium hydroxide, dimethylbis (2-hydroxyethyl) ammonium hydroxide, diethylbis (2-hydroxyethyl) ammonium hydroxide, dipropylbis (2-hydroxy Ethyl) ammonium hydroxide, tris (2-hydroxyethyl) methylammonium hydroxide, tris (2-hydroxyethyl) ethylammonium hydroxide, tris (2-hydroxyethyl) propylammonium hydroxide, tetra At least one of (2-hydroxyethyl) ammonium hydroxide and tetra (2-hydroxypropyl) ammonium hydroxide. Among these, from the viewpoints of improved removability of the resin mask, improved capture properties of the release sheet, and improved continuous operation stability, the component A is preferably selected from tetramethylammonium hydroxide (TMAH) and 2-hydroxyethyltrimethyl At least one of methylammonium hydroxide (choline), dimethylbis (2-hydroxyethyl) ammonium hydroxide, and diethylbis (2-hydroxyethyl) ammonium hydroxide, more preferably selected from At least one of tetramethylammonium hydroxide (TMAH), 2-hydroxyethyltrimethylammonium hydroxide (choline), and dimethylbis (2-hydroxyethyl) ammonium hydroxide is further preferred Dimethylbis (2-hydroxyethyl) ammonium hydroxide.

The content of the component A at the time of use of the detergent composition of the present application is preferably 1% by mass or more from the viewpoints of improved resin mask removability, improved release sheet capture properties, and improved continuous operation stability. It is more preferably 2% by mass or more, still more preferably 2.5% by mass or more, and still more preferably 3% by mass or more. From the viewpoint of reducing the burden of drainage treatment, it is preferably 6.5% by mass or less, more preferably 6% by mass or less, It is more preferably 5.5 mass% or less, and still more preferably 5 mass% or less. More specifically, the content of component A is preferably 1% by mass or more and 6.5% by mass or less, more preferably 2% by mass or more and 6% by mass or less, still more preferably 2.5% by mass or more and 5.5% by mass or less, even more preferably 3 mass% or more and 5 mass% or less. When the component A is a combination of two or more types, the content of the component A means the total content thereof.

In the present application, the "content of each component at the time of use of the detergent composition" means the content of each component at the time of washing, that is, the time when the detergent composition starts to be used for washing.

[Ingredient B: amine]
The component B in the detergent composition of the present application is an amine represented by the following formula (II). Component B can be used individually by 1 type or in mixture of 2 or more types.

In the formula (II), R ⁵ represents a hydrogen atom, a methyl group, an ethyl group, or an amino ethyl group, and R ⁶ is at least one selected from a hydrogen atom, a hydroxyethyl group, a hydroxypropyl group, a methyl group, or an ethyl group. R ⁷ is at least one selected from aminoethyl, hydroxyethyl, or hydroxypropyl; or, in formula (II), R ⁵ is selected from methyl, ethyl, aminoethyl, and hydroxyethyl R ⁶ and R ⁷ are bonded to each other and form a pyrrolidine ring or a piperazine ring with at least one of a group and a hydroxypropyl group.

As component B, it is preferably selected from the group consisting of monoethanolamine, monoisopropanolamine, N-methylmonoethanolamine, and N- from the viewpoints of improved resin mask removal properties, improved release sheet capture properties, and continuous operation stability. Methyl isopropanolamine, N-ethyl monoethanolamine, N-ethyl isopropanolamine, diethanolamine, diisopropanolamine, N-dimethylmonoethanolamine, N-dimethylmonoisopropanolamine , N-methyldiethanolamine, N-methyldiisopropanolamine, N-diethylmonoethanolamine, N-diethylmonoisopropanolamine, N-ethyldiethanolamine, N-ethyldiiso Propanolamine, N- (β-aminoethyl) ethanolamine, N- (β-aminoethyl) isopropanolamine, N- (β-aminoethyl) diethanolamine, N- (β-amine (Ethylethyl) diisopropanolamine, 1-methylpiperazine, 1- (2-hydroxyethyl) pyrrolidine, 1- (2-hydroxyethyl) piperazine, ethylenediamine, and diethylenetriamine At least one kind of amine, more preferably selected from monoethanolamine, monoisopropanolamine, diethanolamine, N-methylmonoethanolamine, N-ethylmonoethanolamine, N- (β-aminoethyl) ethanolamine, 1 -(2-hydroxyethyl) piperazine and at least one kind of diethylene triamine, more preferably selected from monoethanolamine and monoisopropanol , Diethanolamine, monoethanolamine, N- methyl, N- ethyl-monoethanolamine and at least one, even more preferably monoethanolamine.

The content of the component B at the time of use of the detergent composition of the present application is preferably 1% by mass or more from the viewpoints of improved resin mask removability, improved release sheet capture properties, and improved continuous operation stability. More preferably 2% by mass or more, further more preferably 2.5% by mass or more, still more preferably 3% by mass or more, and from the same viewpoint, more preferably 10% by mass or less, more preferably 8% by mass or less, and still more preferably 6 Mass% or less, more preferably 5 mass% or less. More specifically, the content of the component B is preferably 1% by mass or more and 10% by mass or less, more preferably 2% by mass or more and 8% by mass or less, still more preferably 2.5% by mass or more and 6% by mass or less, even more preferably 3 mass% or more and 5 mass% or less. When the component B is a combination of two or more, the content of the component B means the total content thereof.

[Ingredient C: water]
The component C in the detergent composition of the present application is water. As component C, ion-exchanged water, RO water, distilled water, pure water, and ultrapure water can be used. The content of the component C may be appropriately set in accordance with the mode of use of the detergent composition of the present application.

The content of the component C at the time of use of the detergent composition of the present application is relatively high from the viewpoints of improved resin mask removal properties, improved release sheet capture properties, improved continuous operation stability, and reduced drainage treatment load. 50% by mass or more, 60% by mass or more, 70% by mass or more, and from the same viewpoint, 98% by mass or less, 96% by mass or less, and 95.5% by mass or less are more preferable . More specifically, the content of the component C is preferably 50% by mass or more and 98% by mass or less, more preferably 60% by mass or more and 96% by mass or less, and still more preferably 70% by mass or more and 95.5% by mass or less.

[Other ingredients]
The detergent composition of the present application may contain other components in addition to the components A to C as necessary. Examples of the other components include those that can be used in general detergents, and examples include those selected from chelating agents, thickeners, dispersants, alkaline substances, surfactants, polymer compounds, solubilizers, and At least one of an oxidant, a preservative, a rust inhibitor, a defoamer, an antibacterial agent, and the like. The content of other components at the time of use of the detergent composition of the present application is preferably 0% by mass or more and 2% by mass or less, more preferably 0% by mass or more and 1.5% by mass or less, still more preferably 0% by mass or more and 1.3 Mass% or less, more preferably 0 mass% or more and 1 mass% or less.

In one or more embodiments, the detergent composition of the present application may also be substantially free of acid. In this application, the use of an acid includes the use of an acid and / or a salt thereof. The "substantially free of acid" means that the content of the acid in the detergent composition of the present application is less than 0.3% by mass, preferably 0.1% by mass or less, and more preferably substantially 0% by mass.

[Manufacturing method of detergent composition]
The detergent composition of the present application can be produced by blending the component A, the component B and the component C, and the other components described above as necessary by a known method. For example, the detergent composition of this application is a composition which mix | blended the component A, the component B, and the component C, and the said other component as needed. Therefore, the present application relates to a method for producing a detergent composition including a step of blending at least component A, component B, and component C. In the present application, "compounding" includes mixing ingredients A to C and other ingredients as needed at the same time or in any order. In the manufacturing method of the detergent composition of this application, the compounding quantity of each component can be made the same as the content of each component of the said detergent composition of this application.

The pH at the time of use of the detergent composition of the present application is preferably 10 or more, more preferably 10.5 or more, from the viewpoints of improved resin mask removal properties, improved release sheet capture properties, and improved continuous operation stability. In addition, from the same viewpoint, it is preferably 14 or less, and more preferably 13.5 or less. More specifically, the pH at the time of use of the detergent composition of the present application is preferably 10 or more and 14 or less, and more preferably 10.5 or more and 13.5 or less. The pH can be adjusted, for example, by the contents of component A, component B, and component C. If necessary, inorganic acids such as nitric acid and sulfuric acid can be added; organic acids such as hydroxycarboxylic acid, polycarboxylic acid, amino polycarboxylic acid, and amino acid can be blended. Acids; and basic substances other than component A such as metal salts, ammonium salts, ammonia, and amines. The pH is the pH of the detergent composition at 25 ° C, and specifically, it can be measured by the method described in the examples.

The detergent composition of the present application can be prepared as a concentrate having a reduced amount of component C, that is, in a range that does not cause separation, precipitation, etc., and impair storage stability. The concentrate of the detergent composition is preferably a concentrate having a dilution factor of 3 or more from the viewpoint of transportation and storage, and preferably a concentrate having a dilution factor of 10 or less from the viewpoint of storage stability. Thing. The concentrate of the detergent composition can be diluted with water (component C) at the time of use so that the components A to C have the above-mentioned content (that is, the content at the time of washing) and used. Furthermore, when using the concentrate of a detergent composition, each component can be added separately and used. In the present application, the "during use" or "during washing" of the concentrate of the detergent composition refers to a state where the concentrate of the detergent composition has been diluted.

In the case where the detergent composition of the present application is a concentrate, the content of component A in the concentrate of the detergent composition is improved from the resin mask removal property, the release sheet capture property is improved, and the continuous operation is stable From the viewpoint of improving properties, it is preferably 0.3% by mass or more, more preferably 1% by mass or more, still more preferably 2% by mass or more, and still more preferably 3% by mass or more. From the same viewpoint, 10% by mass is more preferable. Below, more preferably 8% by mass or less, still more preferably 6% by mass or less, still more preferably 5% by mass or less. More specifically, the content of component A in the concentrate of the detergent composition is preferably 0.3% by mass or more and 10% by mass or less, more preferably 1% by mass or more and 8% by mass or less, and still more preferably 2% by mass or more. The content is 6 mass% or less, and more preferably 3 mass% or more and 5 mass% or less.

When the detergent composition of the present application is a concentrate, the content of component B in the concentrate of the detergent composition is improved from the resin mask removal property, the release sheet capture property is improved, and the continuous operation is stable From the viewpoint of improving properties, it is preferably 5 mass% or more, more preferably 9 mass% or more, still more preferably 15 mass% or more, still more preferably 18 mass% or more, and from the same viewpoint, 30 mass% is more preferable. Below, more preferably 25% by mass or less, still more preferably 20% by mass or less, still more preferably 15% by mass or less. More specifically, the content of the component B in the concentrate of the detergent composition is preferably 5 mass% or more and 30 mass% or less, more preferably 9 mass% or more and 25 mass% or less, and still more preferably 15 mass% or more. And 20% by mass or less.

When the detergent composition of the present application is a concentrate, the content of component C in the concentrate of the detergent composition is improved from the resin mask removal property, the release sheet capture property is improved, and the continuous operation is stable. From the viewpoints of improving properties and stabilizing the detergent composition, 50% by mass or more, 60% by mass or more, and 70% by mass or more are more preferable, and 90% by mass are preferable from the same viewpoint. % Or less, more preferably 85% by mass or less, still more preferably 80% by mass or less. More specifically, the content of component C in the concentrate of the detergent composition is preferably 50% by mass or more and 90% by mass or less, more preferably 60% by mass or more and 85% by mass or less, and still more preferably 70% by mass or more. And 80% by mass or less.

The pH of the concentrate of the detergent composition of the present application is preferably 10 or more, more preferably 10.5 or more, from the viewpoint of improving the detergency after the dilution and the removability of the resin mask. From the viewpoint of detergency, it is preferably 14 or less, and more preferably 13.5 or less. More specifically, the pH of the concentrate of the detergent composition of the present application is preferably 10 or more and 14 or less, and more preferably 10.5 or more and 13.5 or less.

[Washed]
In one or more embodiments, the detergent composition of the present application may be suitably used for washing the object to be washed with a resin mask, or after being subjected to a plating treatment and / or heating. Washing of the object to be washed with the treated resin mask.

Examples of the object to be cleaned include electronic components and intermediates for manufacturing the same. Examples of the electronic component include at least one component selected from a metal plate such as a printed circuit board, a wafer, a copper plate, and an aluminum plate. This manufacturing intermediate includes the intermediate manufactured product after the resin masking process as the intermediate manufactured product in the manufacturing process of the electronic component.

As the resin mask, a negative resin mask or a positive resin mask may be used, and a negative resin mask is preferred because the effects of the present application are easily exhibited. Examples of the negative-type resin mask include a negative-type dry film resist that has been subjected to exposure and / or development processing. In the present application, the negative resin mask refers to a mask formed using a negative resist, and examples thereof include a negative resist layer that has been subjected to exposure and / or development processing. In the present application, the positive-type resin mask refers to a mask formed using a positive-type resist, and examples thereof include a positive-type resist layer subjected to exposure and / or development processing.

Specific examples of the object to be cleaned to which a resin mask is attached include, for example, soldering and plating treatments (copper plating, aluminum plating, and nickel plating) performed by using a resin mask such as a dry film resist. Etc.), at least one of the processing steps, so that electronic parts such as wiring, connection terminals, and the like are formed on the surface of the substrate. More specifically, printed circuit boards and wafers having fine wiring or pillars formed by copper plating or aluminum plating using a negative resin mask, and printing in which solder bumps are formed using a negative resin mask can be cited. Circuit boards and wafers.

[Manufacturing method of electronic parts]
In one aspect of the present application, it relates to a method for manufacturing an electronic component (hereinafter, also referred to as "the method for manufacturing an electronic component of this application"), which includes: A step of performing at least one of soldering and plating processing using at least one type of electronic component in the board; and performing at least one of soldering and plating processing by the cleaning method of the present application The electronic parts are cleaned.

According to the electronic component manufacturing method of the present application, the resin mask adhering to the electronic component can be effectively removed by washing with the cleaning method of the present application, and therefore, highly reliable electronic component manufacturing can be achieved. Furthermore, by performing the cleaning by the cleaning method of the present application, continuous operation stability can be improved, and thus the manufacturing efficiency of electronic parts can be improved.

[Circulation type cleaning device]
The circulation type cleaning device in the present application is a cleaning device that continuously cleans objects to be cleaned (for example, electronic components such as printed circuit boards, wafers, and metal plates) to which a resin mask is attached. The circulation type cleaning device in the present application includes a primary filter that filters (cleans once) the cleaning liquid used for peeling and cleaning the resin mask. As an embodiment of the circulation-type cleaning device in the present application, the following circulation-type cleaning device is provided, which includes a liquid storage tank for storing the cleaning liquid, a cleaning tank for cleaning the object to be cleaned, Circulation path for supplying the cleaning liquid in the liquid storage tank to the cleaning tank and circulating the cleaning liquid in the cleaning tank back to the liquid storage tank, and fluid machinery such as a liquid feeding pump disposed in the circulation path, and Primary filter placed on the path from the cleaning tank to the liquid storage tank. As the liquid storage tank, any storage tank that can store a sufficient amount of cleaning liquid for the circulating cleaning liquid, and can input the cleaning liquid, water, etc., the concentration of the cleaning liquid components, and the temperature can be adjusted. can. The washing tank may be any washing tank that can bring the washing liquid into contact with the material to be cleaned by means of immersion washing, ultrasonic washing, air spray washing, liquid jet washing, and brush washing. As a fluid machine such as a liquid-feeding pump, any machine capable of conveying liquid such as a volute pump, a cascade pump, a gear pump, or a piston pump may be used.

In one or more embodiments, the circulation-type cleaning device in the present application may also include a secondary filter that filters (the secondary filtration) the cleaning solution filtered by the primary filter.

In one or more embodiments, from the viewpoint of productivity, the circulation type cleaning device in the present application preferably has an input / output conveyor for objects to be washed, and more preferably has an automatic input / output conveyor. Output conveyor.

In one or more embodiments, the primary filter in the present application is a filter disposed on a path from the cleaning tank to the liquid storage tank to filter the cleaning liquid used for peeling off and cleaning the resin mask. Thereby, the filter which removes a peeling sheet from a washing | cleaning liquid. From the viewpoint of improving the operability of maintenance, the primary filter is preferably a structure having a filter portion at a part as a structure that is detachable for discarding the accumulated release sheet. In one or more embodiments, the primary filter in this application may include a mesh with a mesh size of 8 meshes or more and 80 meshes or less.

Regarding the mesh size of the primary filter in the present application, from the viewpoint of improving the trapping property of the release sheet and improving the stability of continuous operation, it is 8 or more, preferably 10 or more, more preferably 12 or more, and further 14 mesh or more is preferable, and from the same viewpoint, it is 80 mesh or less, preferably 70 mesh or less, more preferably 60 mesh or less, and still more preferably 50 mesh or less. More specifically, the mesh size of the primary filter is 8 mesh or more and 80 mesh or less, preferably 10 mesh or more and 70 mesh or less, more preferably 12 mesh or more and 60 mesh or less, and still more preferably 14 mesh or more and 50 mesh. Head below. The grid size is obtained by the following formula.
Grid size (mesh) = 25.4 ÷ [opening (mm) + wire diameter (mm)]

Regarding the opening rate of the primary filter in this application, from the viewpoint of improving the trapping property of the peeling sheet and improving the continuous operation stability, it is 30% or more, preferably 35% or more, more preferably 38% or more, and further It is preferably 40% or more, and from the same viewpoint, it is 75% or less, preferably 72% or less, more preferably 70% or less, and still more preferably 68% or less. More specifically, the opening rate of the primary filter is 30% or more and 75% or less, preferably 35% or more and 72% or less, more preferably 38% or more and 70% or less, and still more preferably 40% or more and 68%. %the following. The aperture ratio is determined by the following formula.
Opening rate (%) = [opening (mm) ÷ (opening (mm) + wire diameter (mm))] ² × 100

With regard to the opening of the primary filter in the present application, from the viewpoint of improving the trapping properties of the release sheet and improving the continuous operation stability, it is preferably 0.2 mm or more, more preferably 0.3 mm or more, and still more preferably 0.4 mm or more, and From the same viewpoint, it is preferably 5 mm or less, more preferably 4 mm or less, and still more preferably 3 mm or less. More specifically, the opening of the primary filter is preferably 0.2 mm or more and 5 mm or less, more preferably 0.3 mm or more and 4 mm or less, and still more preferably 0.4 mm or more and 3 mm or less.

In this application, the material used for the net for the primary filter may be made of metal or resin. From the viewpoint of durability, it is preferably made of stainless steel. As the method of weaving the mesh, plain weave, twill weave, plain weave weave, and twill weave are not particularly limited. From the viewpoint of availability, plain weave and twill weave are preferred, and plain weave is more preferred.

In the case where the circulation type cleaning device in the present application has a secondary filter, as the secondary filter, the same filter as the above-mentioned primary filter can be cited. For example, the mesh size and the opening can be appropriately used. Mesh with a smaller porosity than the primary filter.

This application further relates to one or more of the following aspects.

<1> A method for peeling and cleaning a resin mask, which uses a circulation-type cleaning device that repeatedly uses a cleaning solution to peel and clean a resin mask attached to an object to be cleaned.
This circulation type cleaning device has a primary filter that filters the cleaning liquid used for peeling cleaning,
The primary filter is a mesh with a mesh size of 8 meshes or more and 80 meshes or less.
This washing liquid contains a quaternary ammonium hydroxide (component A) represented by the following formula (I), an amine (component B) represented by the following formula (II), and water (component C). A detergent composition having a content of A of 1% to 6.5% by mass, a content of component B of 1% to 10% by mass, and a content of component C of 50% to 98% by mass.

In the formula (I), R ¹ , R ² , R ^3, and R ⁴ are each independently at least one selected from the group consisting of methyl, ethyl, propyl, hydroxymethyl, hydroxyethyl, and hydroxypropyl.

In the formula (II), R ⁵ represents at least one selected from a hydrogen atom, a methyl group, an ethyl group, and an amino ethyl group, and R ⁶ represents a group selected from a hydrogen atom, hydroxyethyl group, hydroxypropyl group, methyl group, and At least one kind of ethyl group, R ⁷ represents at least one kind selected from aminoethyl, hydroxyethyl, and hydroxypropyl, or, in formula (II), R ⁵ represents selected from methyl, ethyl, At least one of an aminoethyl group, a hydroxyethyl group, and a hydroxypropyl group, R ⁶ and R ⁷ are bonded to each other and form a pyrrolidine ring or a piperazine ring together with the N atom in the formula (II).

<2> The resin mask peeling and washing method according to <1>, wherein component A is selected from the group consisting of tetramethylammonium hydroxide (TMAH), tetraethylammonium hydroxide, tetrapropylammonium hydroxide, 2 -Hydroxyethyltrimethylammonium hydroxide (choline), 2-hydroxyethyltriethylammonium hydroxide, 2-hydroxyethyltripropylammonium hydroxide, 2-hydroxypropyltrimethylammonium hydroxide , 2-hydroxypropyltriethylammonium hydroxide, 2-hydroxypropyltripropylammonium hydroxide, dimethylbis (2-hydroxyethyl) ammonium hydroxide, diethylbis (2-hydroxyethyl ) Ammonium hydroxide, dipropylbis (2-hydroxyethyl) ammonium hydroxide, tris (2-hydroxyethyl) methylammonium hydroxide, tris (2-hydroxyethyl) ethylammonium hydroxide, tris ( At least one of 2-hydroxyethyl) propylammonium hydroxide, tetra (2-hydroxyethyl) ammonium hydroxide, and tetra (2-hydroxypropyl) ammonium hydroxide, preferably selected from tetramethylhydrogen Ammonium oxide (TMAH), 2-hydroxyethyltrimethylammonium hydroxide (choline), dimethylbis (2-hydroxyethyl) ammonium hydroxide, and diethylbis (2-hydroxyethyl) hydrogen At least one kind of ammonium oxide, more preferably selected from tetramethylammonium hydroxide (TMAH), 2-hydroxyethyltrimethylammonium hydroxide (choline), and dimethylbis (2-hydroxyethyl) Hydrogen and oxygen At least one ammonium, and further preferably dimethyl bis (2-hydroxyethyl) ammonium hydroxide.

<3> The resin mask peeling and washing method according to <1> or <2>, wherein the content of the component A at the time of use of the detergent composition of the present application is preferably 1% by mass or more, and more preferably 2 mass% or more, more preferably 2.5 mass% or more, still more preferably 3 mass% or more.

<4> The resin mask peeling and washing method according to any one of <1> to <3>, wherein a content of the component A at the time of use of the detergent composition of the present application is preferably 6.5% by mass Below, more preferably 6% by mass or less, still more preferably 5.5% by mass or less, still more preferably 5% by mass or less.

<5> The resin mask peeling and washing method according to any one of <1> to <4>, wherein the content of component A at the time of use of the detergent composition of the present application is preferably 1% by mass Above and below 6.5% by mass, more preferably above 2% by mass and below 6% by mass, still more preferably above 2.5% by mass and below 5.5% by mass, still more preferably above 3% by mass and below 5% by mass.

<6> The resin mask peeling and washing method according to any one of <1> to <5>, wherein component B is preferably selected from monoethanolamine, monoisopropanolamine, N-methylmonoethanolamine, N-methylisopropanolamine, N-ethylmonoethanolamine, N-ethylisopropanolamine, diethanolamine, diisopropanolamine, N-dimethylmonoethanolamine, N-dimethylmonoisopropylamine Alcoholamine, N-methyldiethanolamine, N-methyldiisopropanolamine, N-diethylmonoethanolamine, N-diethylmonoisopropanolamine, N-ethyldiethanolamine, N-ethyl Diisopropanolamine, N- (β-aminoethyl) ethanolamine, N- (β-aminoethyl) isopropanolamine, N- (β-aminoethyl) diethanolamine, N- (β -Aminoethyl) diisopropanolamine, 1-methylpiperazine, 1- (2-hydroxyethyl) pyrrolidine, 1- (2-hydroxyethyl) piperazine, ethylenediamine and diethylene glycol At least one trimethylamine, more preferably selected from monoethanolamine, monoisopropanolamine, diethanolamine, N-methylmonoethanolamine, N-ethylmonoethanolamine, N- (β-aminoethyl) ethanolamine At least one of 1- (2-hydroxyethyl) piperazine and diethylene triamine, more preferably selected from monoethanolamine, monoisopropanolamine, diethanolamine, N- Group monoethanolamine, N- monoethanolamine and at least one kind, further preferably monoethanolamine.

<7> The resin mask peeling and washing method according to any one of <1> to <6>, wherein the content of the component B during use of the detergent composition is preferably 1% by mass or more, and more preferably 2 mass% or more, more preferably 2.5 mass% or more, still more preferably 3 mass% or more.

<8> The resin mask peeling and washing method according to any one of <1> to <7>, wherein the content of the component B during use of the detergent composition is preferably 10% by mass or less, and more preferably 8 mass% or less, more preferably 6 mass% or less, still more preferably 5 mass% or less.

<9> The resin mask peeling and washing method according to any one of <1> to <8>, wherein the content of the component B at the time of use of the detergent composition is preferably 1% by mass or more and 10% by mass % Or less, more preferably 2% by mass or more and 8% by mass or less, still more preferably 2.5% by mass or more and 6% by mass or less, still more preferably 3% by mass or more and 5% by mass or less.

<10> The resin mask peeling and washing method according to any one of <1> to <9>, wherein the content of the component C during use of the detergent composition is preferably 50% by mass or more, and more preferably 60% by mass or more, more preferably 70% by mass or more.

<11> The resin mask peeling and washing method according to any one of <1> to <10>, wherein the content of the component C during use of the detergent composition is preferably 98% by mass or less, and more preferably 96% by mass or less, more preferably 95.5% by mass or less.

<12> The resin mask peeling and washing method according to any one of <1> to <11>, wherein the content of the component C during use of the detergent composition is preferably 50% by mass or more and 98% by mass % Or less, more preferably 60% by mass or more and 96% by mass or less, still more preferably 70% by mass or more and 95.5% by mass or less.

<13> The resin mask peeling and washing method according to any one of <1> to <12>, wherein the detergent composition does not substantially contain an acid.

<14> The resin mask peeling and washing method according to any one of <1> to <13>, wherein the acid content in the detergent composition is less than 0.3% by mass, and preferably 0.1% by mass or less More preferably, it is substantially 0% by mass.

<15> The resin mask peeling and washing method according to any one of <1> to <14>, wherein the pH of the detergent composition at 25 ° C is preferably 10 or more, and more preferably 10.5 or more.

<16> The resin mask peeling and washing method according to any one of <1> to <15>, wherein the pH of the detergent composition at 25 ° C is preferably 14 or less, and more preferably 13.5 or less.

<17> The resin mask peeling and washing method according to any one of <1> to <16>, wherein the pH of the detergent composition at 25 ° C is preferably 10 or more and 14 or less, more preferably 10.5 Above and below 13.5.

<18> The resin mask peeling and washing method according to any one of <1> to <17>, wherein the detergent composition is prepared by diluting a concentrate having a reduced amount of component C with component C Detergent composition.

<19> The resin mask peeling and washing method according to <18>, wherein the dilution ratio of the concentrate of the detergent composition is 3 times or more and 10 times or less.

<20> The resin mask peeling and washing method according to any one of <1> to <19>, wherein the mesh size of the primary filter is 8 mesh or more, preferably 10 mesh or more, and more preferably 12 Above mesh, more preferably above 14 mesh.

<21> The resin mask peeling and washing method according to any one of <1> to <20>, wherein the mesh size of the primary filter is 80 meshes or less, preferably 70 meshes or less, more preferably 60 The mesh size is preferably less than 50 mesh.

<22> The resin mask peeling and washing method according to any one of <1> to <21>, wherein the mesh size of the primary filter is 8 mesh or more and 80 mesh or less, preferably 10 mesh or more And 70 mesh or less, more preferably 12 mesh or more and 60 mesh or less, still more preferably 14 mesh or more and 50 mesh or less.

<23> The method for peeling and washing a resin mask according to any one of <1> to <22>, wherein the primary filter has an opening ratio of 30% or more, preferably 35% or more, and more preferably 38 % Or more, more preferably 40% or more.

<24> The method for peeling and washing a resin mask according to any one of <1> to <23>, wherein the primary filter has an opening ratio of 75% or less, preferably 72% or less, and more preferably 70 % Or less, more preferably 68% or less.

<25> The method for peeling and washing a resin mask according to any one of <1> to <24>, wherein the primary filter has an open porosity of 30% or more and 75% or less, preferably 35% or more It is 72% or less, more preferably 38% or more and 70% or less, and still more preferably 40% or more and 68% or less.

<26> The resin mask peeling and washing method according to any one of <1> to <25>, wherein the opening of the primary filter is preferably 0.2 mm or more, more preferably 0.3 mm or more, and still more preferably 0.4 mm or more.

<27> The resin mask peeling and washing method according to any one of <1> to <26>, wherein the opening of the primary filter is preferably 5 mm or less, more preferably 4 mm or less, and still more preferably 3 mm or less.

<28> The resin mask peeling and washing method according to any one of <1> to <27>, wherein the opening of the primary filter is preferably 0.2 mm or more and 5 mm or less, more preferably 0.3 mm or more and 4 mm or more Hereinafter, it is more preferably 0.4 mm or more and 3 mm or less.

<29> The resin mask peeling and washing method according to any one of <1> to <28>, wherein the circulation-type washing device includes 2 for filtering the washing liquid filtered by the primary filter. Secondary filter, secondary filter is a mesh with smaller mesh size and opening ratio than primary filter.

<30> The resin mask peeling and washing method according to any one of <1> to <29>, wherein the resin mask is a negative resin mask.

<31> The resin mask peeling and cleaning method according to any one of <1> to <30>, wherein the object to be cleaned is an intermediate for manufacturing electronic parts.

<32> The method for peeling and cleaning a resin mask according to any one of <1> to <31>, wherein the object to be cleaned is selected from the group consisting of copper plating or aluminum plating using a negative resin mask At least one of a printed wiring board and a wafer having fine wirings or pillars, and a printed wiring board and a wafer having solder bumps formed using a negative resin mask.

<33> A method of manufacturing an electronic component, comprising: performing at least one of soldering and plating processing using a resin mask on at least one electronic component selected from a printed circuit board, a wafer, and a metal plate. And a step of washing the electronic component that has been subjected to at least one of soldering and plating treatment by a resin mask peeling and cleaning method according to any one of the items <1> to <32>.

EXAMPLES Hereinafter, the present application will be specifically described by way of examples, but the present application is not limited by these examples.

1. Preparation of detergent composition a to g In a 200 mL glass beaker, 4.0 g of AH212 (ingredient A), 8.0 g of monoethanolamine (ingredient B), and 198.0 g of water (ingredient C) were added in terms of effective ingredients. This is stirred to be uniformly mixed, thereby preparing a detergent composition a.

In addition, by the same method as the detergent composition a, when components other than the components A to C are also added, these components are also added at the same time, and the detergent composition b to be prepared at the composition ratio shown in Table 1 g. Table 1 shows the content (% by mass) and the pH of each component of each of the detergent compositions a to g.

The pH is the pH of the detergent composition at 25 ° C., and is a value measured by using a pH meter (Asian Industries Ltd., HM-30G) and immersing the electrode in the detergent composition for 3 minutes.

As a component of a detergent composition, the following were used.
Dimethylbis (2-hydroxyethyl) ammonium hydroxide (ingredient A) [manufactured by Yokkaichi Synthesis, AH212 (50% aqueous solution)]
Tetramethylammonium hydroxide (ingredient A) [manufactured by Showa Denko, TMAH (25%)]
2-hydroxyethyltrimethylammonium hydroxide (component A) [manufactured by Tokyo Chemical Industry Co., Ltd., choline (48% -50% aqueous solution)]
Sodium hydroxide (non-component A) [manufactured by Kanto Chemical Co., Ltd., Rotter grade, solid content 48% by mass]
Monoethanolamine (ingredient B) [manufactured by Nippon Shokubai Co., Ltd.]
Water (component C) [purified water of 1 μS / cm or less manufactured by pure water device G-10DSTSET made by Organo Corporation]
Dimethyl sulfene (other ingredients) [manufactured by Toray Fine Chemicals Co., Ltd., industrial DMSO]
Gallic acid (other ingredients) [manufactured by Tokyo Chemical Industry Co., Ltd.]
Glycerin (Other Ingredients) [Made by Kao Corporation, Refined Glycerin]

2. Evaluation The prepared detergent compositions a to g and the primary filters and secondary filters described below were combined and evaluated as shown in Table 2. In addition, the resin mask removability, release sheet size, release roll rollability, and liquid filterability shown below were evaluated.

[Production of test piece]
A photosensitive film (manufactured by Asahi Kasei Co., Ltd., SUNFORT UFG-250, 40 mm x 50 mm x 20 μm) was laminated on a copper plate (manufactured by Taiyou Machinery Co., Ltd., C1100P, 55 mm x 75 mm x) under the following conditions. 1 mm) surface, and a test piece cured by exposure treatment was prepared.

＜ Lamination ＞
A clean roll (manufactured by RAYON INDUSTRIAL CO., LTD., RY-505Z) and a vacuum applicator (manufactured by Rohm & Haas Company, VA7024 / HP5) were used at a roll temperature of 50 ° C, a roll pressure of 1.4 bar, and a treatment time of 30 seconds.

＜ Exposure processing ＞
A direct drawing device for printed circuit boards (Mercurex LI-9500, manufactured by SCREEN Graphic and Precision Solutions Co., Ltd.) was used to perform exposure at an exposure amount of 150 mJ / cm ² .

[Resin Mask Removability Evaluation]
The test piece was immersed in a state where each detergent composition heated to 55 ° C was stirred to the extent that the entire liquid flowed, the peeling state of the resin mask was visually observed, and the time required to completely peel the resin mask was measured as Peel time (seconds). The dipping time is set to a maximum of 180 seconds. The measurement results are shown in Table 1. The shorter the peeling time, the higher the removability of the resin mask.

[Measurement of release sheet size]
The detergent composition after the evaluation of the removal of the resin mask was filtered with a filter paper (qualitative filter paper No. 2 (f70mm) manufactured by Toyo Filter Co., Ltd.), and the filter paper was observed at 20 times with a microscope (manufactured by Keyence Corporation, VHX-2000). The average peeling sheet size (mm ² ) of the peeling sheet on the surface was determined by automatic area measurement. The measurement results are shown in Table 1.

[Evaluation of Winding Property of Release Sheet Roller]
If the release sheet adheres to or is wound on the substrate conveying roller in the cleaning device, the cleaning device may suffer from defects such as poor roller rotation. Evaluation for confirming the occurrence of the defect was performed as follows.

A test piece was taken out of the detergent composition after the evaluation of the removability of the resin mask, and a glass rod (length: 15 cm, f10 mm) was placed in the beaker. The stirring rate was 60 times per minute without touching the beaker wall. The detergent composition is stirred. Thereafter, the glass rod was taken out of the beaker, and the presence or absence of a peeling sheet attached to the glass rod was visually confirmed. The results are shown in Table 1. When the adhesion of the release sheet to the glass rod was not confirmed, it was evaluated that suppression of adhesion to peripheral members such as a substrate conveyance roller in the cleaning device was achieved, and stable operation was achieved.

[Evaluation of liquid filterability]
As shown in Table 2, each of the detergent compositions a to g and each of the primary filters (5 mesh, 10 mesh, 24 mesh, 100 mesh, and 300 mesh) were combined to evaluate the liquid filterability.

Specifically, first, a test piece was taken out of the detergent composition after the evaluation of the removability of the resin mask, and the detergent composition was filtered with a primary filter (stainless steel mesh). Then, 20 mL of water was filtered with a primary filter (stainless steel mesh) that filtered the detergent composition, and the time (seconds) required for the total filtration of 20 mL of water was measured (primary filtration). The measurement results are shown in Table 2.

Next, the detergent composition after primary filtration was filtered with a secondary filter (stainless steel mesh, 300 mesh). Next, 20 mL of water was filtered with a secondary filter (stainless steel mesh, 300 mesh) filtering the detergent composition, and the time (seconds) required for the total filtration of 20 mL of water was measured (secondary filtration). It should be noted that the filtration areas of the primary filtration and secondary filtration are both 0.785 cm ² (f1 cm). The measurement results are shown in Table 2.

In Table 2, if the time required for the total filtration of 20 mL of water in one filtration and / or two filtrations exceeds 10 seconds, it is evaluated that the continuous operation stability is poor. In the case of primary filtration, the cleaning liquid does not circulate from the cleaning tank to the pump. In the case of secondary filtration, the pump is blocked or the nozzle is blocked and the cleaning liquid is not circulated. The operation needs to be stopped. The filter replacement or maintenance of the cleaning device (washing, clogging removal) can be judged as having poor continuous operation stability.

On the other hand, in both primary filtration and secondary filtration, when the time required for the total filtration of 20 mL of water was within 10 seconds, it was evaluated that the continuous operation stability was high.

The primary and secondary filters use the following nets.
5 mesh [plain weave, wire diameter 0.7mm, opening 4.38mm, opening rate 74.3%, stainless steel]
10 mesh [plain weave, wire diameter 0.5mm, opening 2.04mm, opening rate 64.5%, stainless steel]
24 mesh [plain weave, wire diameter 0.25mm, opening 0.81mm, opening rate 58.4%, stainless steel]
100 mesh [plain weave, wire diameter 0.1mm, opening 0.154mm, opening rate 36.8%, stainless steel]
300 mesh [plain weave, 0.04mm diameter, 0.045mm opening, 28.0% opening rate, stainless steel]
[Table 1]

[Table 2]

As shown in Tables 1 and 2, Examples 1 to 6 in which detergent compositions a to c containing components A to C and a primary filter having a specific mesh size were used in combination, had excellent resin mask removal properties. , And excellent continuous operation stability.

INDUSTRIAL APPLICABILITY By using the present application, it is possible to provide a cleaning method having excellent resin mask removal properties and continuous operation stability. Therefore, the washing method of the present application can shorten the washing steps of the electronic parts to which the resin mask is attached and improve the performance / reliability of the manufactured electronic parts, thereby improving the productivity of the semiconductor device.

Claims (6)

A resin mask peeling and washing method, which uses a circulation-type washing device that repeatedly uses a washing liquid to peel and wash a resin mask attached to an object to be washed. The circulation-type washing device includes peeling and washing A primary filter that filters the used cleaning solution. The primary filter is a mesh with a mesh size of 8 meshes or more and 80 meshes or less. The cleaning solution contains four particles represented by the following formula (I). Grade ammonium hydroxide (component A), amine (component B) represented by the following formula (II), and water (component C), and the content of component A is 1% by mass or more and 6.5% by mass or less, component B A detergent composition having a content of 1% by mass or more and 10% by mass or less and a content of component C of 50% by mass or more and 98% by mass or less, In the formula (I), R ¹ , R ² , R ³ and R ⁴ are each independently at least one selected from the group consisting of methyl, ethyl, propyl, methylol, hydroxyethyl and hydroxypropyl, In the formula (II), R ⁵ represents at least one selected from a hydrogen atom, a methyl group, an ethyl group, and an amino ethyl group, and R ⁶ represents a group selected from a hydrogen atom, hydroxyethyl group, hydroxypropyl group, methyl group, and At least one kind of ethyl group, R ⁷ represents at least one kind selected from aminoethyl, hydroxyethyl, and hydroxypropyl, or, in formula (II), R ⁵ represents selected from methyl, ethyl, At least one of an aminoethyl group, a hydroxyethyl group, and a hydroxypropyl group, R ⁶ and R ⁷ are bonded to each other and form a pyrrolidine ring or a piperazine ring together with the N atom in the formula (II). The method for peeling and cleaning a resin mask according to claim 1, wherein the primary filter has an opening ratio of 30% to 75%. The resin mask peeling and washing method according to claim 1 or 2, wherein the detergent composition contains substantially no acid. The method for peeling and cleaning a resin mask according to claim 1 or 2, wherein the resin mask is a negative resin mask. The resin mask peeling and cleaning method according to claim 1 or 2, wherein the object to be cleaned is an intermediate for manufacturing electronic parts. An electronic component manufacturing method comprising the steps of performing at least one of soldering and plating processing using a resin mask on at least one electronic component selected from a printed circuit board, a wafer, and a metal plate; And a step of washing the electronic component that has been subjected to at least one of a soldering and plating process by a cleaning method according to any one of claims 1 to 5.