根據本發明，提供具有以下結構之聚芳族化合物： (FG1
)n
-Ar1
-L1
-Ar2
-L2
-Ar3
-L3
-Ar4
-FG2
其中： FG1
視情況存在，且當存在時為選自以下各者之反應性官能基：(甲基)丙烯酸酯、乙烯基醚、乙烯酯、順丁烯二醯亞胺、納迪醯亞胺、衣康醯亞胺或環氧樹脂， n=0或1， Ar1
為視情況經取代之芳族環， Ar2
、Ar3
及Ar4
中之每一者獨立地為視情況經取代之多價芳族環， L1
、L2
及L3
中之每一者獨立地為非共軛連接基團，及 FG2
為選自以下各者之反應性官能基：(甲基)丙烯酸酯、乙烯基醚、乙烯酯、順丁烯二醯亞胺、納迪醯亞胺、衣康醯亞胺或環氧樹脂。 當根據本發明之聚芳族化合物經取代時，此類取代基包括低碳數烷基、烷氧基及其類似物。在本發明之某些實施例中，其芳族環為多取代的。 例示性視情況經取代之芳族環包括：2,4-二取代苯環(例如，2,4-二甲基苯基)、2,5-二取代苯環(例如，2,5-二甲基苯基)、2,3,4-三取代苯環(例如，2,3,4-三甲基苯基)，及其類似物。 例示性視情況經取代之多價芳族環包括2,4,5-三取代苯環(例如，2,4,5-三甲基苯環)、2,3,4-三取代苯環(例如，2,3,4-三甲基苯環)及其類似物。 考慮用於本文中之例示性非共軛連接基團包括-CH2
-、-CH2
-O-CH2
-及其類似物。考慮用於本文中之例示性聚芳族化合物包括具有以下結構之化合物：， 其中末端-OH經選自以下各者之反應性官能基置換及/或官能化：(甲基)丙烯酸酯、乙烯基醚、乙烯酯、順丁烯二醯亞胺、納迪醯亞胺、衣康醯亞胺或環氧樹脂 考慮用於本文中之其他例示性聚芳族化合物包括具有以下結構之化合物：其中： R為H、低碳數烷基或或烷氧基，及 羥基(-OH)中之一者或兩者經選自以下各者之反應性官能基置換及/或官能化：(甲基)丙烯酸酯、乙烯基醚、乙烯酯、順丁烯二醯亞胺、納迪醯亞胺、衣康醯亞胺或環氧樹脂。 根據本發明之另一態樣，提供穩定、高折射率、非黃化的光學透明調配物，該等調配物包含： 上述聚芳族化合物中之一或多者， 視情況選用之其他樹脂，及 視情況選用之光引發劑、催化劑及/或硬化劑； 其中： 固化時，所得調配物具有在約1.55至約1.90範圍內的折射率，及 固化之後，所得調配物通過標準行業QUV測試(其中，測試物質在受控高溫下暴露於交替循環之UV光及水分)至少500小時而其黃色指數值無顯著增加。 本發明調配物進一步定義為具有＜1.0之黃色指數值B*，及/或在約1 µm至約1000 µm範圍內的厚度，及/或該調配物至少97%透明。 在一些實施例中，本發明調配物具有＜2.0之黃色指數值B*；在一些實施例中，本發明調配物具有＜3.0之黃色指數值B*。 在一些實施例中，本發明調配物具有在約10 µm至約1000 µm範圍內之厚度。在一些實施例中，本發明調配物具有在約10 µm至約500 µm範圍內之厚度。 在一些實施例中，本發明調配物至少98%透明；在一些實施例中，本發明調配物至少99%透明；在一些實施例中，本發明調配物至少99.5%透明。 根據本發明之某些實施例，本發明調配物進一步包含具有可自由基聚合之碳-碳雙鍵之一或多種單體，亦即經歷加成聚合之單體。此類單體包括丙烯酸酯、甲基丙烯酸酯、二甲基丙烯酸酯、環氧樹脂、乙烯醚、二乙烯基醚、二烯丙基醚、二丙炔基醚、混合丙炔基烯丙基醚、乙烯酯、氰基丙烯酸酯、聚矽氧、含聚矽氧之丙烯酸酯、含聚矽氧之乙烯醚、單順丁烯二醯亞胺、雙順丁烯二醯亞胺、納迪醯亞胺、衣康醯亞胺，以及其任何兩種或多於兩種之混合物。 根據本發明之某些實施例，考慮用於本文中之丙烯酸酯樹脂衍生自選自以下各者之脂族丙烯酸酯：丙烯酸異癸酯、丙烯酸2-乙基己酯、或二(丙烯醯氧乙基) 1,4-環己二醇單丙烯酸酯。 苯磷酸酯 (DABP) 根據本發明之某些實施例，考慮用於本文中之丙烯酸酯樹脂衍生自芳族丙烯酸酯，該芳族丙烯酸酯未含任何稠合/共軛芳族環，或任何與超過一個羰基直接地鍵聯之芳族環，且選自丙酸苯甲酯、或丙烯醯氧乙基 丙烯酸苯氧基丁酯。 聯苯亞磷酸酯(ADP) 根據本發明之某些實施例，考慮用於本文中之丙烯酸酯樹脂衍生自具有非稠合/非共軛芳族環之化合物：SR 540。 根據本發明之某些實施例，考慮用於本文中之丙烯酸酯樹脂衍生自：丙烯酸苯甲酯(BZ)。 根據某些實施例，本發明之調配物進一步包含奈米粒子。典型地，該等奈米粒子具有小於40 nm之平均粒徑。在一些實施例中，該等奈米粒子具有小於25 nm之平均粒徑；在一些實施例中，該等奈米粒子上之粒度分佈小於10 nm；在一些實施例中，該等奈米粒子具有在4-10 nm範圍內之平均粒徑。 根據某些實施例，用於本發明調配物之奈米粒子為穩定金屬氧化物。 根據某些實施例，用於本發明調配物之奈米粒子藉由存在一或多種封端劑來穩定。 根據本發明之某些實施例，本發明調配物之折射率在約1.55至約1.74的範圍內。 根據本發明之某些實施例，本發明調配物包含： 在約5重量%至約98重量%範圍內的該光穩定的樹脂，及 在約2重量%至約95重量%範圍內的該等具有高折射率的奈米粒子。 根據本發明之某些實施例，本發明調配物視情況進一步包含一或多種流動添加劑、黏著促進劑、流變改質劑、韌化劑、助熔劑、膜增韌劑、苯酚酚醛清漆硬化劑、環氧樹脂固化催化劑(例如咪唑)、固化劑(例如過氧化二異丙苯)、光引發劑以及其任何兩者或大於兩者之混合物。 根據本發明之某些實施例，提供包含一固化等分試樣之本發明聚芳族化合物的樹脂。 根據本發明之某些實施例，提供用於固化本發明調配物之方法，例如藉由暴露於充分能量之電磁能量(諸如UV、LED及其類似物)或足以增進固化之熱量及其類似物。 根據本發明之某些實施例，提供包含僅由一等分試樣之根據本發明之調配物分離之第一透明組件及第二透明組件的總成。 根據本發明總成的某些實施例，當等分試樣應用於該第一及/或該第二透明組件時，總成之厚度為約1 µm至約1000 µm。 根據本發明之某些實施例，提供包含利用一固化等分試樣之根據本發明之調配物黏附在其上之第一透明組件及第二透明組件之製品。 根據本發明之某些實施例，提供發光元件，其中利用一固化等分試樣之根據本發明之調配物，在其上黏附其至少一個透光部分。 在一些實施例中，所得調配物之折射率在約1.55至約2.0的範圍內。在一些實施例中，所得調配物之折射率在約1.55至約1.80範圍內。在一些實施例中，所得調配物之折射率在約1.55至約1.74範圍內。 在一些實施例中，本發明調配物包含： 在約5重量%至約98重量%範圍內的該光穩定的樹脂，及 在約2重量%至約95重量%範圍內的該等具有高折射率的奈米粒子。 在一些實施例中，本發明調配物包含： 在約10重量%至約50重量%範圍內的該光穩定的樹脂，及 在約50重量%至約90重量%範圍內的該等具有高折射率的奈米粒子。 在一些實施例(例如，當折射率為約1.55時)中，本發明調配物包含： 在約5重量%至約50重量%範圍內的該光穩定的樹脂，及 在約2重量%至約40重量%範圍內的該等具有高折射率的奈米粒子。 在一些實施例(例如，當折射率為約1.74時)中，本發明調配物包含： 在約5重量%至約30重量%範圍內的該光穩定的樹脂，及 在約70重量%至約95重量%範圍內的該等具有高折射率的奈米粒子。非黃化、光穩定樹脂
多種非黃化、光穩定之樹脂考慮用於本文中；考慮用於本文中之例示性非黃化，光穩定之樹脂衍生自丙烯酸酯、甲基丙烯酸酯、環氧樹脂、乙烯醚、乙烯酯、氰基丙烯酸酯、聚矽氧、含聚矽氧之丙烯酸酯、含聚矽氧之乙烯醚、可自由基聚合之一或多種單體以及其任何兩個或大於兩個之混合物。 考慮用於本文中之非黃化、光穩定之樹脂通常不衍生自不飽和含硫化合物，該等不飽和含硫化合物傾向於在老化及/或暴露於光、水分、熱及其類似物時黃化。類似地，考慮用於本文中之非黃化、光穩定之樹脂通常不衍生自聚芳族化合物，該等聚芳族化合物在其芳族環之間具有大體共軛，因而物質在老化及/或暴露於光、水分、熱量及其類似物時亦傾向於黃化。丙烯酸酯
考慮用於實施本發明之丙烯酸酯為此項技術中熟知的。舉例而言，參見美國專利第5,717,034號，該專利之全部內容在此以引用之方式併入本文中。 考慮用於本文中之例示性丙烯酸酯包括單官能(甲基)丙烯酸酯、雙官能(甲基)丙烯酸酯、三官能(甲基)丙烯酸酯、多官能(甲基)丙烯酸酯及其類似者。 例示性單官能(甲基)丙烯酸酯包括苯基苯酚丙烯酸酯、甲氧基聚乙烯丙烯酸酯、丁二酸丙烯醯基氧基乙酯、脂肪酸丙烯酸酯、甲基丙稀醯丙烯醯基氧基乙基鄰苯二甲酸、苯氧基乙二醇甲基丙烯酸酯、脂肪酸甲基丙烯酸酯、丙烯酸β-羧基乙酯、丙烯酸異冰片酯、丙烯酸異丁酯、丙烯酸第三丁酯、丙烯酸羥基乙酯、丙烯酸羥基丙酯、丙烯酸二氫環戊二乙酯、甲基丙烯酸環己酯、甲基丙烯酸第三丁酯、甲基丙烯酸二甲胺基乙酯、甲基丙烯酸二乙胺基乙酯、甲基丙烯酸第三丁基胺基乙酯、丙烯酸4-羥基丁酯、丙烯酸四氫呋喃酯、丙烯酸苯甲酯、乙基卡必醇丙烯酸酯(ethylcarbitol acrylate)、丙烯酸苯氧基乙酯、甲氧基三乙二醇丙烯酸酯、單季戊四醇丙烯酸酯、二季戊四醇丙烯酸酯、三季戊四醇丙烯酸酯、多季戊四醇丙烯酸酯及其類似物。 例示性雙官能(甲基)丙烯酸酯包括己二醇二甲基丙烯酸酯、甲基丙烯酸羥基丙烯醯基氧基丙酯、己二醇二丙烯酸酯、丙烯酸胺基甲酸酯、環氧丙烯酸酯、雙酚A型環氧丙烯酸酯、改質環氧丙烯酸酯、脂肪酸改質環氧丙烯酸酯、胺改質雙酚A型環氧丙烯酸酯、甲基丙烯酸烯丙酯、乙二醇二甲基丙烯酸酯、二乙二醇二甲基丙烯酸酯、乙氧基化雙酚A二甲基丙烯酸酯、三環癸烷二甲醇二甲基丙烯酸酯、丙三醇二甲基丙烯酸酯、聚丙二醇二丙烯酸酯、丙氧基化乙氧基化雙酚A二丙烯酸酯、9,9-雙(4-(2-丙烯醯氧基乙氧基)苯基)茀、三環癸烷二丙烯酸酯、二丙二醇二丙烯酸酯、聚丙二醇二丙烯酸酯、PO改質新戊二醇二丙烯酸酯、三環癸烷二甲醇二丙烯酸酯、1,12-十二烷二醇二甲基丙烯酸酯及其類似物。 例示性三官能(甲基)丙烯酸酯包括三羥甲基丙烷三甲基丙烯酸酯、三羥甲基丙烷三丙烯酸酯、三羥甲基丙烷乙氧基三丙烯酸酯、聚醚三丙烯酸酯、甘油丙氧基三丙烯酸酯及其類似物。 例示性多官能(甲基)丙烯酸酯包括二季戊四醇聚丙烯酸酯、二季戊四醇六丙烯酸酯、季戊四醇四丙烯酸酯、季戊四醇乙氧基四丙烯酸酯、二(三羥甲基丙烷)四丙烯酸酯及其類似物。 考慮用於實施本發明之額外例示性丙烯酸酯包括描述於美國專利第5,717,034號中之彼等丙烯酸酯，該專利之全部內容在此以引用之方式併入本文中。環氧樹脂
多種環氧基官能化樹脂考慮用於本文中，例如基於雙酚A之液體型環氧樹脂、基於雙酚A之固體型環氧樹脂、基於雙酚F之液體型環氧樹脂(例如，Epiclon EXA-835LV)、基於苯酚-酚醛清漆樹脂之多官能環氧樹脂、二環戊二烯型環氧樹脂(例如，Epiclon HP-7200L)、萘型環氧樹脂及其類似物，以及其任何兩者或多於兩者之混合物。 考慮用於本文中之例示性環氧基官能化樹脂包括環脂族醇之二環氧化物、氫化雙酚A (可商業上獲得，如Epalloy 5000)、六氫鄰苯二甲酸酐之雙官能環脂族縮水甘油酯(可商業上獲得，如Epalloy 5200)、Epiclon EXA-835LV、Epiclon HP-7200L及其類似物，以及其任何兩種或多於兩種之混合物。 在某些實施例中，環氧樹脂組分可包括兩種或大於兩種不同的雙酚類環氧樹脂的組合。此等雙酚類環氧樹脂可選自雙酚A環氧樹脂、雙酚F環氧樹脂或雙酚S環氧樹脂或其組合。此外，可使用相同樹脂類型(諸如A、F或S)內的兩種或多於兩種不同雙酚環氧樹脂。 考慮用於本文中之雙酚環氧樹脂之可商業上獲得實例包括雙酚F型環氧樹脂(諸如來自日本Nippon Kayaku之RE-404-S；及來自Dai Nippon Ink & Chemicals, Inc.之EPICLON 830 (RE1801)、830S (RE1815)、830A (RE1826)及830W；以及來自Resolution之RSL 1738及YL-983U)及雙酚A型環氧樹脂(諸如來自Resolution之YL-979及YL-980)。 可購自Dai Nippon及上文所提及之雙酚環氧樹脂經提昇為液體、未經稀釋之表氯醇-雙酚F環氧樹脂，其具有比基於雙酚A環氧樹脂之習知環氧樹脂低得多的黏度，且具有類似於液體雙酚A環氧樹脂之物理性質。雙酚F環氧樹脂之黏度低於雙酚A環氧樹脂，該兩種環氧樹脂類型之間的其他物理特性皆相同，其提供較低黏度，且由此提供快速流動的底部填充密封劑材料。此等四個雙酚F環氧樹脂之EEW在165與180之間。在25℃下之黏度在3,000與4,500 cp之間(除RE1801以外，其黏度上限為4,000 cp)。RE1815及830W之可水解氯化物含量經報導為200 ppm，且RE1826之可水解氯化物含量為100 ppm。 可購自Resolution及上文所提及之雙酚環氧樹脂經提昇為含低氯化物之液體環氧樹脂。雙酚A環氧樹脂的EEW (g/eq)在180與195之間且在25℃下的黏度在100與250 cp之間。YL-979之總氯化物含量經報導為在500與700 ppm之間，且YL-980之總氯化物含量為在100與300 ppm之間。雙酚F環氧樹脂的EEW (g/eq)在165與180之間且在25℃下的黏度在30與60之間。RSL-1738之總氯化物含量報導為在500與700 ppm之間，且YL-983U之總氯化物含量在150與350 ppm之間。 除雙酚環氧樹脂外，考慮將其他環氧化合物用作本發明調配物之環氧樹脂組分。舉例而言，可使用環脂族環氧樹脂，諸如3,4-環氧環己基甲基-3,4-環氧環己基碳酸酯。亦可使用單官能、雙官能或多官能反應性稀釋劑來調整黏度及/或降低所得樹脂材料之Tg。例示性反應性稀釋劑包括丁基縮水甘油醚、甲苯基縮水甘油醚、聚乙二醇縮水甘油醚、聚丙二醇縮水甘油醚及其類似物。 適用於本文之環氧樹脂包括酚類化合物之聚縮水甘油衍生物，諸如以商標名EPON出售之彼等者，諸如來自Resolution之EPON 828、EPON 1001、EPON 1009及EPON 1031；來自Dow Chemical Co.之DER 331、DER 332、DER 334及DER 542；以及來自Nippon Kayaku之BREN-S。其他合適之環氧樹脂包括由多元醇及其類似物製備之聚環氧化物及酚-甲醛酚醛清漆之聚縮水甘油衍生物，後者諸如來自Dow Chemical之DEN 431、DEN 438及DEN 439。亦可以商標名ARALDITE出售甲酚類似物，諸如來自Ciba Specialty Chemicals Corporation之ARALDITE ECN 1235、ARALDITE ECN 1273及ARALDITE ECN 1299。SU-8為可購自Resolution之雙酚A型環氧樹脂酚醛清漆。胺、胺基醇及多元羧酸之聚縮水甘油加成物亦適用於本發明，其市售樹脂包括來自F.I.C. Corporation之GLYAMINE 135、GLYAMINE 125及GLYAMINE 115；來自Ciba Specialty Chemicals之ARALDITE MY-720、ARALDITE 0500及ARALDITE 0510，及來自Sherwin-Williams Co.之PGA-X及PGA-C。 本文中視情況使用之適當的單官能環氧樹脂共反應物稀釋劑包括黏度低於環氧樹脂組分之黏度(通常低於約250 cp)的彼等物。 單官能環氧樹脂共反應物稀釋劑應具有有約6個至約28個碳原子之烷基的環氧基，其實例包括C6 - 28
烷基縮水甘油醚、C6 - 28
脂肪酸縮水甘油酯、C6 - 28
烷基苯酚縮水甘油醚及其類似者。 在包括此類單管能環氧樹脂共反應物稀釋劑之情況下，此類共反應物稀釋劑應按組合物之總重量計以約0.5重量%至約10重量%的量採用；在一些實施例中，此類共反應物稀釋劑應按組合物之總重量計以約0.25重量%至約5重量%的量採用。 環氧樹脂組分應以在約1重量%至約40重量%範圍內的量存在於組合物中；在一些實施例中，本發明調配物包含約2重量%至約18重量%之環氧樹脂；在一些實施例中，本發明調配物包含約5重量%至約15重量%之環氧樹脂。 在一些實施例中，本文所採用之環氧樹脂組分為經矽烷改質之環氧樹脂，例如包括以下各者之物質組合物： (A)由以下結構涵蓋之環氧樹脂組分：其中： Y可存在或可不存在，且當Y存在時為直接鍵、CH2
、CH(CH3
)2
、C=O或S， 此處R1
為烷基、烯基、羥基、羧基及鹵基，及 此處x為1-4； (B)由以下結構包涵之環氧基官能化之烷氧基矽烷：其中 R1
為含環氧乙烷之部分，及 R2
為具有一至十個碳原子之烷基或經烷氧基取代之烷基、芳基或芳烷基；及 (C)組分(A)與(B)之反應產物。 一種此類經矽烷改質之環氧樹脂的實例形成為芳族環氧樹脂(諸如雙酚A、E、F或S環氧樹脂或聯二苯環氧樹脂)與環氧矽烷之反應產物，其中該環氧矽烷由以下結構涵蓋：其中 R1
為含環氧乙烷之部分，其實例包括2-(乙氧基甲基)環氧乙烷、2-(丙氧基甲基)環氧乙烷、2-(甲氧基甲基)環氧乙烷及2-(3-甲氧基丙基)環氧乙烷，及 R2
為具有一至十個碳原子之烷基或經烷氧基取代之烷基、芳基或芳烷基。 在一個實施例中，R1
為2-(乙氧基甲基)環氧乙烷且R2
為甲基。 用於製備經矽烷改質之環氧樹脂之芳族環氧樹脂之理想化結構包括其中 Y可存在或可不存在，且當Y存在時，其為直接鍵、CH2
、CH(CH3
)2
、C=O或S， R1
為烷基、烯基、羥基、羧基或鹵基，及 x為1-4。 當然，當x為2-4時，亦預期芳族環氧樹脂之擴鏈形式由此結構涵蓋。 舉例而言，可由以下結構涵蓋芳族環氧樹脂之擴鏈形式在一些實施例中，經矽氧烷改質之環氧樹脂具有以下結構：-(O-Si(Me)2
-O-Si(Me)(Z)-O-Si(Me)2
-O-Si(Me)2
)n
- 其中： Z為-O-(CH2
)3
-O-Ph-CH2
-Ph-O-(CH2
-CH(OH)-CH2
-O-Ph-CH2
-Ph-O-)n
-CH2
-環氧己烷，且 n在1-4的範圍內。 在一些實施例中，經矽氧烷改質之環氧樹脂係藉由在適於促進其反應之條件下使以下組分之組合接觸來產生： Me2
Si(OMe)2
+ (MeO)3
Si-(CH2
)3
-O-CH2
-環氧己烷 + 環氧己烷-CH2
-O-Ph-CH2
-Ph-O-(CH2
-CH(OH)-CH2
-O-Ph-CH2
-Ph-O-)n
-CH2
-環氧己烷， 其中「n」在約1-4之範圍內。 經矽烷改質之環氧樹脂亦可為芳族環氧樹脂、環氧樹脂矽烷及芳族環氧樹脂與環氧樹脂矽烷之反應產物的組合。反應產物可由芳族環氧樹脂及環氧矽烷以1:100至100:1之重量比(諸如1:10至10:1之重量比)製備。 考慮用於本發明組合物之環氧樹脂單體之量足夠使得所得調配物包含在約1重量%-20重量%範圍內的該環氧樹脂。在某些實施例中，所得調配物包含在約2重量%-18重量%範圍內的該環氧樹脂。在某些實施例中，所得調配物包含約5重量%-15重量%範圍內的該環氧樹脂。 環氧樹脂固化劑視情況與環氧樹脂單體組合使用。例示性環氧樹脂固化劑包括脲、脂族及芳族胺、胺硬化劑、聚醯胺、咪唑、雙氰胺、醯肼、脲-胺混合固化系統、自由基引發劑(例如過氧化酯、過氧化碳酸酯、氫過氧化物、烷基過氧化物、芳基過氧化物、偶氮化合物及其類似物)、有機鹼、過渡金屬催化劑、酚、酸酐、路易斯酸(Lewis acids)、路易斯鹼(Lewis bases)及其類似物。 當環氧樹脂固化劑存在時，本發明組合物包含在約0.1重量%-2重量%範圍內的環氧樹脂固化劑。在某些實施例中，本發明組合物包含在約0.5重量%-5重量%範圍內的環氧樹脂固化劑。順丁烯二醯亞胺、納迪醯亞胺或衣康醯亞胺
考慮用於本文中之順丁烯二醯亞胺、納迪醯亞胺或衣康醯亞胺為具有以下結構之化合物： 各自地為，其中： m為1-15， p為0-15， 各R2
獨立地選自氫或低碳數烷基(諸如C1 - 5
)，及 J為包含有機或有機矽氧烷基團之單價或多價基團，及 其兩者或大於兩者之組合。 在本發明之一些實施例中，J為選自以下各者之單價或多價基團： - 烴基或經取代烴基物種，其典型地具有在約6個至約500個範圍內的碳原子，其中烴基物種選自烷基、烯基、炔基、環烷基、環烯基、芳基、烷芳基、芳基烷基、芳基烯基、烯基芳基、芳基炔基或炔基芳基，然而其限制條件為，僅當X包含兩種或多於兩種不同物種之組合時，X可為芳基； - 伸烴基或經取代之伸烴基物種，其典型地具有在約6個至約500個範圍內的碳原子，其中伸烴基物種選自伸烷基、伸烯基、伸炔基、伸環烷基、伸環烯基、伸芳基、烷基伸芳基、芳基伸烷基、芳基伸烯基、烯基伸芳基、芳基伸炔基或炔基伸芳基， - 雜環或經取代之雜環物種，其典型地具有約6個至約500個範圍內的碳原子， - 聚矽氧烷，或 - 聚矽氧烷-聚胺基甲酸酯嵌段共聚物，以及 具有選自以下各者之連接基團之上述中之一或多者的組合：共價鍵、-O-、-S-、-NR-、-NR-C(O)-、-NR-C(O)-O-、-NR-C(O)-NR-、-S-C(O)-、-S-C(O)-O-、-S-C(O)-NR-、-O-S(O)2
-、-O-S(O)2
-O-、-O-S(O)2
-NR-、-O-S(O)-、-O-S(O)-O-、-O-S(O)-NR-、-O-NR-C(O)-、-O-NR-C(O)-O-、-O-NR-C(O)-NR-、-NR-O-C(O)-、-NR-O-C(O)-O-、-NR-O-C(O)-NR-、-O-NR-C(S)-、-O-NR-C(S)-O-、-O-NR-C(S)-NR-、-NR-O-C(S)-、-NR-O-C(S)-O-、-NR-O-C(S)-NR-、-O-C(S)-、-O-C(S)-O-、-O-C(S)-NR-、-NR-C(S)-、-NR-C(S)-O-、-NR-C(S)-NR-、-S-S(O)2
-、-S-S(O)2
-O-、-S-S(O)2
-NR-、-NR-O-S(O)-、-NR-O-S(O)-O-、-NR-O-S(O)-NR-、-NR-O-S(O)2
-、-NR-O-S(O)2
-O-、-NR-O-S(O)2
-NR-、-O-NR-S(O)-、-O-NR-S(O)-O-、-O-NR-S(O)-NR-、-O-NR-S(O)2
-O-、-O-NR-S(O)2
-NR-、-O-NR-S(O)2
-、-O-P(O)R2
-、-S-P(O)R2
-或-NR-P(O)R2
-；其中各R獨立地為氫、烷基或經取代之烷基。 例示性組合物包括彼等物，其中J為氧烷基、硫烷基、胺基烷基、羧基烷基、氧烯基、硫烯基、胺基烯基、羧基烯基、氧炔基、硫炔基、胺基炔基、羧基炔基、氧基環烷基、硫環烷基、胺基環烷基、羧基環烷基、氧基環烯基、硫環烯基、胺基環烯基、羧基環烯基、雜環、氧基雜環、硫雜環、胺基雜環、羧基雜環、氧基芳基、硫芳基、胺基芳基、羧基芳基、雜芳基、氧基雜芳基、硫雜芳基、胺基雜芳基、羧基雜芳基、氧基烷基芳基、硫烷基芳基、胺基烷基芳基、羧基烷基芳基、氧基芳基烷基、硫芳基烷基、胺基芳基烷基、羧基芳基烷基、氧基芳基烯基、硫芳基烯基、胺基芳基烯基、羧基芳基烯基、氧基烯基芳基、硫烯基芳基、胺基烯基芳基、羧基烯基芳基、氧基芳基炔基、硫芳基炔基、胺基芳基炔基、羧基芳基炔基、氧基炔基芳基、硫炔基芳基、胺基炔基芳基或羧基炔基芳基、氧基伸烷基、硫伸烷基、胺基伸烷基、羧基伸烷基、氧基伸烯基、硫伸烯基、胺基伸烯基、羧基伸烯基、氧基伸炔基、硫伸炔基、胺基伸炔基、羧基伸炔基、氧基伸環烷基、硫伸環烷基、胺基伸環烷基、羧基伸環烷基、氧基伸環烯基、硫伸環烯基、胺基伸環烯基、羧基伸環烯基、氧基伸芳基、硫伸芳基、胺基伸芳基、羧基伸芳基、氧基烷基伸芳基、烷基伸芳基、胺基烷基伸芳基、羧基烷基伸芳基、氧基芳基伸烷基、硫芳基伸烷基、胺基芳基伸烷基、羧基芳基伸烷基、氧基芳基伸烯基、硫芳基伸烯基、胺基芳基伸烯基、羧基芳基伸烯基、氧基烯基伸芳基、硫烯基伸芳基、胺基烯基伸芳基、羧基烯基伸芳基、氧基芳基伸炔基、硫芳基伸炔基、胺基芳基伸炔基、羧基芳基伸炔基、氧基炔基伸芳基、硫炔基伸芳基、胺基炔基伸芳基、羧基炔基伸芳基、伸雜芳基、氧基伸雜芳基、硫伸雜芳基、胺基伸雜芳基、羧基伸雜芳基、含雜原子之二價或多價環部分、含氧基雜原子之二價或多價環部分、含硫雜原子之二價或多價環部分、含胺基雜原子之二價或多價環部分或含羧基雜原子之二價或多價環部分。聚矽氧
考慮用於實施本發明之聚矽氧為此項技術中熟知的。舉例而言，參見美國專利第5,717,034號，該專利之全部內容在此以引用之方式併入本文中。氧雜環丁烷
氧雜環丁烷(亦即，1,3-環氧丙烷)為具有分子式C3
H6
O之雜環有機化合物，其具有含有三個碳原子及一個氧原子之四員環。術語氧雜環丁烷通常亦指任何含有氧雜環丁烷環之有機化合物。舉例而言，參見Burkhard等人，Angew. Chem. Int. Ed. 2010, 49, 9052-9067中，其全部內容在此以引用之方式併入本文中。聚酯類樹脂
考慮用於實施本發明之聚酯係指藉由使多元醇(亦稱為多羥基醇)與飽和或不飽和二元酸反應所形成之縮合聚合物。所使用之典型多元醇為諸如乙二醇之二醇；常用酸為鄰苯二甲酸及順丁烯二酸。不斷地移除酯化反應之副產物(水)，促使完成反應完成。使用不飽和聚酯及諸如苯乙烯之添加劑降低樹脂之黏度。初始液體樹脂藉由交聯鏈轉化為固體。此過程係藉由在不飽和鍵處產生自由基來完成，該等自由基在鏈反應中延伸至相鄰分子之其他不飽和鍵，從而在過程中連接相鄰鏈。聚胺基甲酸酯類樹脂
考慮用於實施本發明之聚胺基甲酸酯係指由藉由胺基甲酸酯(carbamate/urethane)鍵聯連接之有機單元之鏈組成的聚合物。聚胺基甲酸酯聚合物係藉由使異氰酸與多元醇反應而形成。用於製備聚胺基甲酸酯之異氰酸及多元醇兩者均含有平均兩個或多於兩個官能基/分子。視情況選用之添加劑
根據本發明之一些實施例，本文所描述之組合物可進一步包含一或多種流動添加劑、黏著促進劑、流變改質劑、韌化劑、膜增韌劑、UV穩定劑、環氧樹脂固化催化劑(例如咪唑)、固化劑(例如過氧化二異丙苯)及其類似物，以及其任何兩者或大於兩者之混合物。 如本文所使用，術語「流動添加劑」係指改變引入該等流動添加劑之調配物之黏度的化合物。賦予此類性質之例示性化合物包括矽聚合物、丙烯酸乙酯/丙烯酸2-乙基己酯共聚物、酮肟之磷酸酯的醇銨鹽及其類似物，以及其任何兩者或大於兩者之組合。 如本文所使用，術語「黏著促進劑」係指增強引入該等黏著促進劑之調配物黏著性質的化合物。 如本文所使用，術語「流變改質劑」係指改變引入該等流變改質劑之調配物之一或多種物理性質的添加劑。 如本文所使用，術語「韌化劑」係指增強引入該等韌化劑之調配物之抗衝擊性的添加劑。 如本文所使用，術語「UV穩定劑」係指可抑制或吸收導致聚合物降解之有害UV輻射的添加劑。存在現今常用之兩種主要類型的穩定劑：UV吸收劑及受阻胺光穩定劑(Hindered Amine Light Stabilizers；HALS)。 UV吸收劑藉由吸收UV射線及使其消散成熱能來作用。UV吸收劑化學物質包括二苯甲酮、苯并三唑、羥苯基三嗪及其類似物。 HALS藉由清除由UV射線產生之自由基中間物以中和降解來作用。在兩種情況下，由於與基質聚合物中存在之UV添加劑相互作用，引導UV光之損害效應遠離基質聚合物及著色劑。 如本文所使用，術語「膜增韌劑」係指賦予由含有其之調配物製備之膜可撓性的試劑。 如本文所使用，術語「苯酚-酚醛清漆硬化劑」係指參與反應基之進一步交互作用以使得增加其交聯，由此增強其硬度之材料。 如本文所使用，術語「環氧樹脂-固化催化劑」係指促進含環氧樹脂部分之寡聚及/或聚合之反應性試劑，例如咪唑。 如本文所使用，術語「固化劑」係指促進單體材料、寡聚材料或聚合材料之固化的反應性試劑，諸如過氧化二異丙苯。奈米粒子
考慮用於本文中之奈米粒子包括ZrO2
、TiO2
、Al2
O3
、Sb2
O4
(或Sb2
O3
Sb2
O5
)、CdO、CaO2
、Cu2
O、FeO、Fe2
O3
、PbO、MnOMnO3
、SnO2
、ZnO、ZnS、ZnSe、ZnTe及其類似物，或其任何兩個或大於兩個之混合物。典型地，該等奈米粒子具有小於40 nm之平均粒徑；在一些實施例中，該等奈米粒子具有小於25 nm之平均粒徑；在一些實施例中，該等奈米粒子具有4-10 nm之範圍內的平均粒徑。 在一些實施例中，該等奈米粒子為穩定化金屬氧化物奈米粒子。當穩定化時，該等奈米粒子藉由存在一或多種界面活性劑來穩定，例如封端劑(其用於停止奈米粒子之生長及使其穩定免於凝聚)。例示性封端劑包括聚乙烯醇、聚(N-乙烯基-2-吡咯啶酮)、阿拉伯膠、α-甲基丙烯酸、11-巰基十一酸或其二硫化物衍生物、檸檬酸、檸檬酸三鈉、硬脂酸、棕櫚酸、辛酸、癸酸、聚乙二醇及其衍生物、聚丙烯酸及經胺基改質之聚丙烯酸、2-巰基乙醇、澱粉及其類似物，以及其任何兩者或大於兩者之混合物。 考慮使該等奈米粒子穩定之封端劑的量在組合物之約1重量%至約40重量%範圍內；在一些實施例中，所採用之封端劑的量在組合物之約1重量%至約30重量%範圍內；在一些實施例中，所採用之封端劑的量在組合物之約1重量%至約20重量%範圍內；在一些實施例中，所採用之封端劑的量在組合物之約1重量%至約10重量%範圍內；在一些實施例中，所採用之封端劑的量在組合物之約1重量%至約5重量%圍內；在一些實施例中，所採用之封端劑的量在組合物之約2重量%至約40重量%範圍內；在一些實施例中，所採用之封端劑的量在組合物之約2重量%至約30重量%範圍內；在一些實施例中，所採用之封端劑的量在組合物之約2重量%至約20重量%範圍內；在一些實施例中，所採用之封端劑的量在組合物之約2重量%至約10重量%範圍內；在一些實施例中，所採用之封端劑的量在組合物之約2重量%至約5重量%範圍內；在一些實施例中，所採用之封端劑的量在組合物之約3重量%至約40重量%範圍內；在一些實施例中，所採用之封端劑的量在組合物之約3重量%至約30重量%範圍內；在一些實施例中，所採用之封端劑的量在組合物之約3重量%至約20重量%比範圍內；在一些實施例中，所採用之封端劑的量在組合物之約3重量%至約10重量%範圍內；在一些實施例中，所採用之封端劑的量在組合物之約3重量%至約5重量%範圍內；在一些實施例中，所採用之封端劑的量在組合物之約4重量%至約40重量%範圍內；在一些實施例中，所採用之封端劑的量在組合物之約4重量%至約30重量%範圍內；在一些實施例中，所採用之封端劑的量在組合物之約4重量%至約20重量%範圍內；在一些實施例中，所採用之封端劑的量在組合物之約4重量%至約10重量%範圍內；在一些實施例中，所採用之封端劑的量在組合物之約4重量%至約5重量%範圍內。稀釋劑
儘管實施本發明之某些實施例不要求稀釋劑，但非反應性有機稀釋劑可視情況採用以例如有助於操縱例如結果為更低的黏度、改良的可分散性及其類似性質的本發明調配物。 當存在時，例示性有機稀釋劑係選自由以下組成之群：芳族烴(例如苯、甲苯、二甲苯及其類似物)、飽和烴(例如己烷、環己烷、庚烷、十四烷)、氯化烴(例如二氯甲烷、氯仿、四氯化碳、二氯乙烷、三氯乙烯及其類似物)、醚(例如乙醚、四氫呋喃、二噁烷、二醇醚、乙二醇之單烷基醚或二烷基醚及其類似物)、多元醇(例如聚乙二醇、丙二醇、聚丙二醇及其類似物)、酯(例如乙酸乙酯、乙酸丁酯、甲氧基乙酸丙酯及其類似物)；二元酯(例如DBE-9)、α-松香醇、β-松香醇、煤油、鄰苯二甲酸二丁酯、丁基卡必醇(butyl carbitol)、丁基卡必醇乙酸酯、卡必醇乙酸酯、乙基卡必醇乙酸酯、己二醇、高沸點醇及其酯、二醇醚、酮(例如丙酮、甲基乙基酮及其類似物)、醯胺(例如二甲基甲醯胺、二甲基乙醯胺及其類似物)、雜芳族化合物(例如N-甲基吡咯啶酮及其類似物)及其類似物，以及其任何兩種或多於兩種之混合物。製品 / 總成
根據本發明之另一態樣，提供製品/總成，其包含僅藉由一等分試樣之根據本發明之調配物及/或一固化等分試樣之此類調配物分離之第一透明組件及第二透明組件。 可將該等分試樣之本發明調配物應用於在約1 µm至約1000 µm之厚度下的該第一及/或第二透明組件。 考慮用於本文中之適合基質包括聚乙烯對苯二甲酸酯、甲基丙稀酸聚甲酯、聚乙烯、聚丙烯、聚碳酸酯、環氧樹脂、聚醯亞胺、聚醯胺、聚酯、玻璃、氮化矽鈍化之Si晶片、聚醯亞胺鈍化之Si晶片、BT基質、裸Si、SR4基質、SR5基質及其類似物。 如熟習此項技術者容易認識到，可以各種方法測定本發明調配物與其對應基質之間的黏著力，例如依照測試方法D 3359-97藉由ASTM標準橫切膠帶測試來測定。典型地，調配物與基質之間的黏著力為至少1B級，如依照測試方法D 3359-97藉由ASTM標準橫切膠帶測試所測定。在一些實施例中，觀測到相當於至少ASTM 1B級之黏著力(亦即，在經受該膠帶測試之後，至少35%之初始經黏附膜表面保持附接於基質)。在本發明之某些實施例中，觀測到相當於至少ASTM 2B級之黏著力(亦即，在經受膠帶測試之後，至少65%之初始經黏附膜表面保持附接於基質)。在本發明之某些實施例中，觀測到相當於至少ASTM 3B級之黏著力(亦即，在經受膠帶測試之後，至少85%之初始經黏附膜表面保持附接於基質)。在本發明之某些實施例中，觀測到相當於至少ASTM 4B級之黏著力(亦即，在經受膠帶測試之後，至少95%之初始經黏附膜表面保持附接於基質)。在本發明之某些實施例中，觀測到相當於至少ASTM 5B級之黏著力(亦即，在經受膠帶測試之後，至少100%之初始經黏附膜表面保持附接於基質)。 根據本發明之又另一態樣，提供發光元件，其中利用一固化等分試樣之根據本發明之調配物，在其上黏著其至少一個透光部分的。 藉由以下非限制性實例說明本發明之各種態樣。該等實例係出於說明之目的且不限制本發明之任何實施。將理解，可在不背離本發明之精神及範疇之情況下作出各種變化及修改。一般熟習此項技術者容易知曉如何合成或購買獲得本文中所描述之試劑及組分。 實例 實例1 用於化合物I之合成步驟 根據本發明之例示性聚芳族化合物(化合物I)係如下製備。將來自Fudow Co. Ltd.之Nikanol Y-100 (100.0 g，0.04464 mol)及100 ml甲苯添加至具有電磁攪拌器之三頸圓底燒瓶中。 使用冰浴將所得混合物冷卻至0-10℃。向此混合物中添加三甲胺4.041 g (0.04464 mol)。隨後經由加料漏斗將丙烯醯氯(5.01 g，0.0494 mol)逐滴引入至混合物中。控制添加速度以使得反應混合物之溫度總是保持低於10℃。引入所有成分之後，使混合物自然地升至室溫且使反應再進行6小時。 反應混合物隨後經小蘇打水溶液洗滌2次，隨後經蒸餾水洗滌2次。有機層經硫酸鎂乾燥且藉由濾紙過濾。隨後藉由真空移除甲苯溶劑以得到無色低黏度液體94.2 g。此樹脂在589 nm下呈現1.56之RI值。 實例2 用於化合物II之合成步驟 根據本發明之例示性聚芳族化合物(化合物II)係如下製備。將Nikanol Y-50 (100.0g)、甲苯100 ml、三甲胺4.041 g及甲基丙烯醯氯(metharyloyl chloride) 5.12 g置於三頸圓底燒瓶中合成步驟類似於上文所描述之步驟。 反應產物為無色低黏度液體89.6 g。此樹脂在589 nm下呈現1.56之RI值。 實例3 用於本發明調配物之合成步驟 根據本發明之例示性調配物係藉由將以下組分組合來製備：
評估所得調配物之各種效能性質。前述表之評述揭示，根據本發明之例示性調配物具有極佳透明度及折射率；且此等合乎需要之性質甚至在暴露於1000小時之QUV老化時仍大體上保持。 實例4 根據本發明之另一例示性調配物係藉由將以下組分組合來製備：
評估所得調配物之各種效能性質，如在下表中所概述：
前述表之評述揭示，根據本發明之例示性調配物具有極佳透明度及折射率；且此等合乎需要之性質甚至在暴露於1000小時之QUV老化時仍大體上保持。 實例5 基於高度芳族性樹脂之比較性調配物係藉由將以下組分組合來製備：
評估所得調配物之各種效能性質，如在下表中所概述：
前述表之評述揭示，基於高度芳族性樹脂，丙烯酸2-苯基苯氧基乙酯之調配物的透明度及黃色指數在暴露於500小時之QUV老化時不佳。 除本文所展示及所描述之彼等修改外，本發明之各種修改，對以上描述之領域的技術人員而言將為顯而易見的。此類修改亦意欲屬於所附申請專利範圍之範疇內。 本說明書中提及之專利及公開案指示熟習本發明所關於之技術者之水準。此等專利及公開案以引用之方式併入本文中，其程度就如同每一個別申請案或公開案特定地且單獨地以引用之方式併入本文中一樣。 前述描述說明本發明之特定實施例，但並不意欲限制其實施。以下申請專利範圍，包括其所有等效物，意欲界定本發明之範疇。According to the present invention, there is provided a polyaromatic compound having the following structure: (FG1
)n
-Ar1
-L1
-Ar2
-L2
-Ar3
-L3
-Ar4
-FG2
Of which: FG1
Depending on the case, and when present, it is a reactive functional group selected from the group consisting of (meth) acrylate, vinyl ether, vinyl ester, maleimide, nadimide, itacon Yttrium or epoxy resin, n=0 or 1, Ar1
An aromatic ring that is substituted as appropriate, Ar2
, Ar3
And Ar4
Each of them is independently a multivalent aromatic ring that is optionally replaced, L1
, L2
And L3
Each of them is independently a non-conjugated linking group, and FG2
It is a reactive functional group selected from the group consisting of (meth) acrylate, vinyl ether, vinyl ester, maleimide, dinadiimide, itaconide or epoxy resin. When the polyaromatic compound according to the present invention is substituted, such substituents include lower alkyl, alkoxy and the like. In certain embodiments of the invention, the aromatic ring is polysubstituted. Exemplary, optionally substituted, aromatic rings include: 2,4-disubstituted benzene rings (eg, 2,4-dimethylphenyl), 2,5-disubstituted benzene rings (eg, 2,5-di Methylphenyl), 2,3,4-trisubstituted benzene rings (for example, 2,3,4-trimethylphenyl), and analogs thereof. Exemplary, optionally substituted polyvalent aromatic rings include 2,4,5-trisubstituted benzene rings (eg, 2,4,5-trimethylbenzene rings), 2,3,4-trisubstituted benzene rings ( For example, 2,3,4-trimethylbenzene ring and its analogs. Exemplary non-conjugated linking groups contemplated for use herein include -CH2
-, -CH2
-O-CH2
- and its analogues. Exemplary polyaromatic compounds contemplated for use herein include compounds having the structure:Wherein the terminal -OH is replaced and/or functionalized with a reactive functional group selected from the group consisting of (meth) acrylate, vinyl ether, vinyl ester, maleimide, and nadicimine Other examples of the exemplary polyaromatic compounds contemplated for use herein include the compounds having the structure:Wherein: R is H, a lower alkyl or alkoxy group, and one or both of the hydroxyl groups (-OH) are replaced and/or functionalized with a reactive functional group selected from the group consisting of: Acrylate, vinyl ether, vinyl ester, maleimide, naliimide, itaconide or epoxy resin. According to another aspect of the present invention, there is provided a stable, high refractive index, non-yellowing optically clear formulation comprising: one or more of the above polyaromatic compounds, optionally other resins, And optionally using a photoinitiator, a catalyst and/or a hardener; wherein: upon curing, the resulting formulation has a refractive index in the range of from about 1.55 to about 1.90, and after curing, the resulting formulation passes the standard industry QUV test ( Therein, the test substance was exposed to alternating cycles of UV light and moisture at a controlled elevated temperature for at least 500 hours without a significant increase in its yellow index value. Formulations of the invention are further defined as having a yellow index value B* of <1.0, and/or a thickness in the range of from about 1 μm to about 1000 μm, and/or the formulation is at least 97% transparent. In some embodiments, the formulations of the invention have a yellow index value B* of <2.0; in some embodiments, the formulations of the invention have a yellow index value B* of <3.0. In some embodiments, the formulations of the invention have a thickness in the range of from about 10 μm to about 1000 μm. In some embodiments, the formulations of the invention have a thickness ranging from about 10 μm to about 500 μm. In some embodiments, the formulations of the invention are at least 98% transparent; in some embodiments, the formulations of the invention are at least 99% transparent; in some embodiments, the formulations of the invention are at least 99.5% transparent. According to some embodiments of the invention, the formulation of the invention further comprises a monomer having one or more monomers of a free-radically polymerizable carbon-carbon double bond, that is, a monomer undergoing addition polymerization. Such monomers include acrylates, methacrylates, dimethacrylates, epoxies, vinyl ethers, divinyl ethers, diallyl ethers, dipropynyl ethers, mixed propynyl allyl groups. Ether, vinyl ester, cyanoacrylate, polyfluorene oxide, polyoxymethylene-containing acrylate, polyoxyl ether-containing vinyl ether, mono-n-butylene diimide, bis-m-butylene diimide, Nadi Yttrium imine, itaconimide, and mixtures of any two or more thereof. According to certain embodiments of the present invention, it is contemplated that the acrylate resin used herein is derived from an aliphatic acrylate selected from the group consisting of isodecyl acrylate, 2-ethylhexyl acrylate,orDi(propylene oxyethyl) 1,4-cyclohexanediol monoacrylate. Phenyl Phosphate (DABP) According to certain embodiments of the present invention, it is contemplated that the acrylate resin used herein is derived from an aromatic acrylate that does not contain any fused/conjugated aromatic rings, or any An aromatic ring directly bonded to more than one carbonyl group, and selected from benzyl propionate,orPropylene oxiranyl phenoxy butyl acrylate. Biphenyl Phosphite (ADP) According to certain embodiments of the present invention, it is contemplated that the acrylate resin used herein is derived from a compound having a non-fused/non-conjugated aromatic ring:SR 540. According to certain embodiments of the invention, the acrylate resin contemplated for use herein is derived from:Benzyl acrylate (BZ). According to certain embodiments, the formulations of the present invention further comprise nanoparticle. Typically, the nanoparticles have an average particle size of less than 40 nm. In some embodiments, the nanoparticles have an average particle size of less than 25 nm; in some embodiments, the particle size distribution on the nanoparticles is less than 10 nm; in some embodiments, the nanoparticles It has an average particle size in the range of 4-10 nm. According to certain embodiments, the nanoparticles used in the formulations of the present invention are stable metal oxides. According to certain embodiments, the nanoparticles used in the formulations of the present invention are stabilized by the presence of one or more blocking agents. According to certain embodiments of the invention, the refractive index of the formulations of the invention is in the range of from about 1.55 to about 1.74. According to some embodiments of the invention, the formulation of the invention comprises: the light-stable resin in the range of from about 5% by weight to about 98% by weight, and such in the range of from about 2% by weight to about 95% by weight Nanoparticles with a high refractive index. According to some embodiments of the present invention, the formulation of the present invention further comprises one or more flow additives, adhesion promoters, rheology modifiers, toughening agents, fluxing agents, film toughening agents, phenol novolac hardeners, as the case may be. An epoxy resin curing catalyst (such as imidazole), a curing agent (such as dicumyl peroxide), a photoinitiator, and a mixture of any two or more thereof. According to some embodiments of the invention, a resin comprising a cured aliquot of a polyaromatic compound of the invention is provided. According to certain embodiments of the present invention, methods for curing the formulations of the present invention are provided, for example, by exposure to sufficient energy of electromagnetic energy (such as UV, LEDs, and the like) or heat sufficient to enhance curing and the like. . According to some embodiments of the invention, an assembly comprising a first transparent component and a second transparent component separated by only one aliquot of the formulation according to the invention is provided. In accordance with certain embodiments of the present invention, when an aliquot is applied to the first and/or second transparent component, the thickness of the assembly is from about 1 μm to about 1000 μm. In accordance with certain embodiments of the present invention, an article comprising a first transparent component and a second transparent component to which a formulation according to the present invention is adhered using a cured aliquot is provided. According to some embodiments of the invention, a light-emitting element is provided wherein a cured composition of a cured aliquot is used to adhere thereto at least one light transmissive portion. In some embodiments, the resulting formulation has a refractive index in the range of from about 1.55 to about 2.0. In some embodiments, the resulting formulation has a refractive index in the range of from about 1.55 to about 1.80. In some embodiments, the resulting formulation has a refractive index in the range of from about 1.55 to about 1.74. In some embodiments, the formulations of the present invention comprise: the light-stable resin in the range of from about 5% by weight to about 98% by weight, and the high refractive index in the range of from about 2% by weight to about 95% by weight. The rate of nano particles. In some embodiments, the formulations of the present invention comprise: the light-stable resin in the range of from about 10% by weight to about 50% by weight, and the high refractive index in the range of from about 50% by weight to about 90% by weight The rate of nano particles. In some embodiments (eg, when the refractive index is about 1.55), the formulations of the present invention comprise: the light-stable resin in the range of from about 5% by weight to about 50% by weight, and from about 2% by weight to about The nanoparticles having a high refractive index in the range of 40% by weight. In some embodiments (eg, when the refractive index is about 1.74), the formulations of the present invention comprise: the light-stable resin in the range of from about 5% by weight to about 30% by weight, and from about 70% by weight to about The nanoparticles having a high refractive index in the range of 95% by weight.Non-yellowing, light stable resin
A variety of non-yellowing, light-stable resins are contemplated for use herein; contemplated for use in the exemplary non-yellowing, photo-stable resins derived from acrylates, methacrylates, epoxies, vinyl ethers, vinyl esters And cyanoacrylate, polyfluorene oxide, polyoxymethylene-containing acrylate, polyoxyethylene-containing vinyl ether, free radically polymerizable one or more monomers, and mixtures of any two or more thereof. Non-yellowing, light-stable resins contemplated for use herein are generally not derived from unsaturated sulfur-containing compounds that tend to age and/or be exposed to light, moisture, heat, and the like. Yellowing. Similarly, the non-yellowing, light-stable resins contemplated for use herein are generally not derived from polyaromatic compounds which have a substantial conjugation between their aromatic rings and thus the material is aged and/or Or it tends to yellow when exposed to light, moisture, heat and the like.Acrylate
The acrylates contemplated for use in practicing the invention are well known in the art. For example, see U.S. Patent No. 5,717,034, the disclosure of which is incorporated herein in its entirety by reference. Exemplary acrylates contemplated for use herein include monofunctional (meth) acrylates, difunctional (meth) acrylates, trifunctional (meth) acrylates, polyfunctional (meth) acrylates, and the like. . Exemplary monofunctional (meth) acrylates include phenyl phenol acrylate, methoxy polyethylene acrylate, propylene decyl oxy succinate, fatty acid acrylate, methyl propylene propylene decyloxy Ethylphthalic acid, phenoxyethylene glycol methacrylate, fatty acid methacrylate, β-carboxyethyl acrylate, isobornyl acrylate, isobutyl acrylate, tert-butyl acrylate, hydroxyethyl acrylate Ester, hydroxypropyl acrylate, dihydrocyclopentyl acrylate, cyclohexyl methacrylate, tert-butyl methacrylate, dimethylaminoethyl methacrylate, diethylaminoethyl methacrylate , tert-butylaminoethyl methacrylate, 4-hydroxybutyl acrylate, tetrahydrofuran acrylate, benzyl acrylate, ethylcarbitol acrylate, phenoxyethyl acrylate, methoxy Triethylene glycol acrylate, monopentaerythritol acrylate, dipentaerythritol acrylate, tripentaerythritol acrylate, polypentaerythritol acrylate, and the like. Exemplary difunctional (meth) acrylates include hexanediol dimethacrylate, hydroxypropenyl propyl methacrylate, hexanediol diacrylate, urethane acrylate, epoxy acrylate , bisphenol A epoxy acrylate, modified epoxy acrylate, fatty acid modified epoxy acrylate, amine modified bisphenol A epoxy acrylate, allyl methacrylate, ethylene glycol dimethyl Acrylate, diethylene glycol dimethacrylate, ethoxylated bisphenol A dimethacrylate, tricyclodecane dimethanol dimethacrylate, glycerol dimethacrylate, polypropylene glycol II Acrylate, propoxylated ethoxylated bisphenol A diacrylate, 9,9-bis(4-(2-propenyloxyethoxy)phenyl)anthracene, tricyclodecane diacrylate, Dipropylene glycol diacrylate, polypropylene glycol diacrylate, PO modified neopentyl glycol diacrylate, tricyclodecane dimethanol diacrylate, 1,12-dodecanediol dimethacrylate and the like Things. Exemplary trifunctional (meth) acrylates include trimethylolpropane trimethacrylate, trimethylolpropane triacrylate, trimethylolpropane ethoxy triacrylate, polyether triacrylate, glycerin Propoxy triacrylate and its analogs. Exemplary polyfunctional (meth) acrylates include dipentaerythritol polyacrylate, dipentaerythritol hexaacrylate, pentaerythritol tetraacrylate, pentaerythritol ethoxy tetraacrylate, bis(trimethylolpropane) tetraacrylate, and the like. Things. Additional exemplary acrylates contemplated for use in the practice of the present invention include those acrylates described in U.S. Patent No. 5,717,034, the disclosure of which is incorporated herein by reference.Epoxy resin
A wide variety of epoxy functional resins are contemplated for use herein, such as liquid epoxy based bisphenol A, solid epoxy based bisphenol A, liquid epoxy based on bisphenol F (eg, Epiclon) EXA-835LV), a multifunctional epoxy resin based on a phenol-novolac resin, a dicyclopentadiene type epoxy resin (for example, Epiclon HP-7200L), a naphthalene type epoxy resin, and the like, and any two thereof Or more than a mixture of the two. Exemplary epoxy functional functional resins contemplated for use herein include diepoxides of cycloaliphatic alcohols, hydrogenated bisphenol A (commercially available, such as Epalloy 5000), hexahydrophthalic anhydride Cycloaliphatic glycidyl esters (commercially available, such as Epalloy 5200), Epiclon EXA-835LV, Epiclon HP-7200L, and the like, and mixtures of any two or more thereof. In certain embodiments, the epoxy resin component can include a combination of two or more than two different bisphenolic epoxy resins. These bisphenol epoxy resins may be selected from bisphenol A epoxy resins, bisphenol F epoxy resins or bisphenol S epoxy resins or combinations thereof. In addition, two or more than two different bisphenol epoxy resins within the same resin type (such as A, F or S) may be used. Commercially available examples contemplated for use in the bisphenol epoxy resins herein include bisphenol F-type epoxy resins (such as RE-404-S from Nippon Kayaku, Japan; and EPICLON from Dai Nippon Ink & Chemicals, Inc.) 830 (RE1801), 830S (RE1815), 830A (RE1826) and 830W; and RSL 1738 and YL-983U from Resolution) and bisphenol A type epoxy resin (such as YL-979 and YL-980 from Resolution). The bisphenol epoxy resin available from Dai Nippon and mentioned above is upgraded to a liquid, undiluted epichlorohydrin-bisphenol F epoxy resin with a conventional epoxy based on bisphenol A epoxy resin. The resin has a much lower viscosity and has physical properties similar to liquid bisphenol A epoxy resins. Bisphenol F epoxy resin has a lower viscosity than bisphenol A epoxy resin, and the other physical properties are the same between the two epoxy resin types, which provide lower viscosity and thus provide a fast flowing underfill encapsulant material. The EEW of these four bisphenol F epoxy resins is between 165 and 180. The viscosity at 25 ° C is between 3,000 and 4,500 cp (except for RE1801, the upper limit of viscosity is 4,000 cp). The hydrolyzable chloride content of RE1815 and 830W was reported to be 200 ppm, and the hydrolyzable chloride content of RE1826 was 100 ppm. The bisphenol epoxy resin available from Resolution and mentioned above has been upgraded to a low chloride containing liquid epoxy resin. The EEW (g/eq) of the bisphenol A epoxy resin is between 180 and 195 and the viscosity at 25 ° C is between 100 and 250 cp. The total chloride content of YL-979 is reported to be between 500 and 700 ppm, and the total chloride content of YL-980 is between 100 and 300 ppm. The EEW (g/eq) of the bisphenol F epoxy resin is between 165 and 180 and the viscosity at 25 ° C is between 30 and 60. The total chloride content of RSL-1738 is reported to be between 500 and 700 ppm, and the total chloride content of YL-983U is between 150 and 350 ppm. In addition to bisphenol epoxy resins, other epoxy compounds are contemplated for use as the epoxy resin component of the formulations of the present invention. For example, a cycloaliphatic epoxy resin such as 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexyl carbonate can be used. Monofunctional, difunctional or polyfunctional reactive diluents can also be used to adjust the viscosity and/or reduce the Tg of the resulting resin material. Exemplary reactive diluents include butyl glycidyl ether, cresyl glycidyl ether, polyethylene glycol glycidyl ether, polypropylene glycol glycidyl ether, and the like. Epoxy resins suitable for use herein include polyglycidyl derivatives of phenolic compounds such as those sold under the trade name EPON, such as EPON 828, EPON 1001, EPON 1009 and EPON 1031 from Resolution; from Dow Chemical Co. DER 331, DER 332, DER 334 and DER 542; and BREN-S from Nippon Kayaku. Other suitable epoxy resins include polyepoxides prepared from polyols and the like, and polyglycidyl derivatives of phenol-formaldehyde novolacs such as DEN 431, DEN 438 and DEN 439 from Dow Chemical. A cresol analog can also be sold under the trade name ARALDITE, such as ARALDITE ECN 1235, ARALDITE ECN 1273 and ARALDITE ECN 1299 from Ciba Specialty Chemicals Corporation. SU-8 is a bisphenol A type epoxy resin novolac available from Resolution. Polyglycidyl adducts of amines, amino alcohols and polycarboxylic acids are also suitable for use in the present invention. Commercially available resins include GLYAMINE 135, GLYAMINE 125 and GLYAMINE 115 from FIC Corporation; ARALDITE MY-720 from Ciba Specialty Chemicals, ARALDITE 0500 and ARALDITE 0510, and PGA-X and PGA-C from Sherwin-Williams Co. Suitable monofunctional epoxy resin co-reactant diluents as used herein, as appropriate, include those having a viscosity that is less than the viscosity of the epoxy resin component (typically less than about 250 cp). The monofunctional epoxy resin co-reactant diluent should have an epoxy group having an alkyl group of from about 6 to about 28 carbon atoms, examples of which include C6 - 28
Alkyl glycidyl ether, C6 - 28
Fatty acid glycidyl ester, C6 - 28
Alkyl phenol glycidyl ether and the like. In the case of such single-tube epoxy resin co-reactant diluents, such co-reactant diluents should be employed in amounts of from about 0.5% to about 10% by weight, based on the total weight of the composition; In embodiments, such co-reactant diluents should be employed in an amount of from about 0.25 weight percent to about 5 weight percent, based on the total weight of the composition. The epoxy resin component should be present in the composition in an amount ranging from about 1% to about 40% by weight; in some embodiments, the inventive formulation comprises from about 2% to about 18% by weight epoxy Resin; In some embodiments, the formulations of the present invention comprise from about 5% by weight to about 15% by weight epoxy resin. In some embodiments, the epoxy resin component employed herein is a decane-modified epoxy resin, such as a composition of matter including: (A) an epoxy resin component encompassed by the following structure:Where: Y may or may not exist, and when Y exists, it is a direct bond, CH2
, CH (CH3
)2
, C=O or S, where R1
Is an alkyl group, an alkenyl group, a hydroxyl group, a carboxyl group and a halogen group, and wherein x is 1-4; (B) an alkoxy decane functionalized by an epoxy group encompassed by the following structure:Where R1
Is a part containing ethylene oxide, and R2
And is an alkyl group having one to ten carbon atoms or an alkyl group substituted with an alkoxy group, an aryl group or an aralkyl group; and (C) a reaction product of the components (A) and (B). An example of such a decane-modified epoxy resin is formed as a reaction product of an aromatic epoxy resin such as bisphenol A, E, F or S epoxy resin or biphenyl epoxy resin with epoxy decane. Wherein the epoxy decane is covered by the following structure:Where R1
Examples of the ethylene oxide-containing portion include 2-(ethoxymethyl)oxirane, 2-(propoxymethyl)oxirane, and 2-(methoxymethyl)cyclohexane. Oxyethane and 2-(3-methoxypropyl)oxirane, and R2
It is an alkyl group having one to ten carbon atoms or an alkyl group, an aryl group or an aralkyl group substituted by an alkoxy group. In one embodiment, R1
Is 2-(ethoxymethyl)oxirane and R2
Is a methyl group. An idealized structure for preparing an aromatic epoxy resin of a decane-modified epoxy resin includesWhere Y may or may not exist, and when Y is present, it is a direct bond, CH2
, CH (CH3
)2
, C=O or S, R1
It is an alkyl group, an alkenyl group, a hydroxyl group, a carboxyl group or a halogen group, and x is 1-4. Of course, when x is 2-4, it is also expected that the extended form of the aromatic epoxy resin is covered by this structure. For example, the extended structure of the aromatic epoxy resin can be covered by the following structureIn some embodiments, the decane-modified epoxy resin has the following structure: -(O-Si(Me)2
-O-Si(Me)(Z)-O-Si(Me)2
-O-Si(Me)2
)n
- Where: Z is -O-(CH2
)3
-O-Ph-CH2
-Ph-O-(CH2
-CH(OH)-CH2
-O-Ph-CH2
-Ph-O-)n
-CH2
- hexylene oxide, and n is in the range of 1-4. In some embodiments, the decane-modified epoxy resin is produced by contacting a combination of the following components under conditions suitable to promote the reaction: Me2
Si(OMe)2
+ (MeO)3
Si-(CH2
)3
-O-CH2
-Ethylene oxide + Ethylene hexane-CH2
-O-Ph-CH2
-Ph-O-(CH2
-CH(OH)-CH2
-O-Ph-CH2
-Ph-O-)n
-CH2
- hexylene oxide, wherein "n" is in the range of about 1-4. The decane-modified epoxy resin may also be a combination of an aromatic epoxy resin, an epoxy resin decane, and a reaction product of an aromatic epoxy resin and an epoxy resin decane. The reaction product can be prepared from an aromatic epoxy resin and epoxy decane in a weight ratio of 1:100 to 100:1 (such as a weight ratio of 1:10 to 10:1). The amount of epoxy resin monomer contemplated for use in the compositions of the present invention is sufficient such that the resulting formulation comprises the epoxy resin in the range of from about 1% by weight to 20% by weight. In certain embodiments, the resulting formulation comprises the epoxy resin in the range of from about 2% to about 18% by weight. In certain embodiments, the resulting formulation comprises the epoxy resin in the range of from about 5% by weight to 15% by weight. The epoxy resin curing agent is used in combination with an epoxy resin monomer as appropriate. Exemplary epoxy resin curing agents include urea, aliphatic and aromatic amines, amine hardeners, polyamines, imidazoles, dicyandiamide, hydrazine, urea-amine mixed curing systems, free radical initiators (eg, peroxyesters) , peroxycarbonate, hydroperoxide, alkyl peroxide, aryl peroxide, azo compound and the like), organic base, transition metal catalyst, phenol, acid anhydride, Lewis acid, Lewis bases and their analogs. When present in the epoxy resin curing agent, the compositions of the present invention comprise an epoxy resin curing agent in the range of from about 0.1% to about 2% by weight. In certain embodiments, the compositions of the present invention comprise an epoxy resin curing agent in the range of from about 0.5% to about 5% by weight.Maleimide, nadiimide or itaconide
The maleimide, nadiimide or itaconimine contemplated for use herein is a compound having the following structure:, where: m is 1-15, p is 0-15, each R2
Independently selected from hydrogen or a lower alkyl group (such as C1 - 5
And J are monovalent or polyvalent groups comprising an organic or organic oxyalkylene group, and a combination of two or more thereof. In some embodiments of the invention, J is a monovalent or polyvalent group selected from: - a hydrocarbyl or substituted hydrocarbyl species, typically having from about 6 to about 500 carbon atoms, Wherein the hydrocarbyl species is selected from the group consisting of alkyl, alkenyl, alkynyl, cycloalkyl, cycloalkenyl, aryl, alkaryl, arylalkyl, arylalkenyl, alkenylaryl, arylalkynyl or alkyne a aryl group, however, with the proviso that X may be an aryl group only if X comprises a combination of two or more than two different species; a hydrocarbyl group or a substituted hydrocarbyl species, typically having about a carbon atom in the range of 6 to about 500, wherein the hydrocarbyl species is selected from the group consisting of alkylene, alkenyl, alkynyl, cycloalkyl, cycloalkenyl, aryl, alkyl aryl, aromatic Alkylalkyl, arylalkylene, alkenylaryl, arylalkynyl or alkynylaryl, -heterocyclic or substituted heterocyclic species typically having from about 6 to about 500 carbons An atom, a polyoxyalkylene, or a polyoxyalkylene-polyurethane block copolymer, and a linker having a group selected from the group consisting of Combination of one or more of the above: covalent bond, -O-, -S-, -NR-, -NR-C(O)-, -NR-C(O)-O-, -NR- C(O)-NR-, -SC(O)-, -SC(O)-O-, -SC(O)-NR-, -OS(O)2
-, -O-S(O)2
-O-, -O-S(O)2
-NR-, -OS(O)-, -OS(O)-O-, -OS(O)-NR-, -O-NR-C(O)-, -O-NR-C(O)- O-, -O-NR-C(O)-NR-, -NR-OC(O)-, -NR-OC(O)-O-, -NR-OC(O)-NR-, -O- NR-C(S)-, -O-NR-C(S)-O-, -O-NR-C(S)-NR-, -NR-OC(S)-, -NR-OC(S) -O-, -NR-OC(S)-NR-, -OC(S)-, -OC(S)-O-, -OC(S)-NR-, -NR-C(S)-,- NR-C(S)-O-, -NR-C(S)-NR-, -SS(O)2
-, -S-S(O)2
-O-, -S-S(O)2
-NR-, -NR-O-S(O)-, -NR-O-S(O)-O-, -NR-O-S(O)-NR-, -NR-O-S(O)2
-, -NR-O-S(O)2
-O-, -NR-O-S(O)2
-NR-, -O-NR-S(O)-, -O-NR-S(O)-O-, -O-NR-S(O)-NR-, -O-NR-S(O)2
-O-, -O-NR-S(O)2
-NR-, -O-NR-S(O)2
-, -O-P(O)R2
-, -S-P(O)R2
-or-NR-P(O)R2
- wherein each R is independently hydrogen, alkyl or substituted alkyl. Exemplary compositions include those wherein J is oxyalkyl, sulfanyl, aminoalkyl, carboxyalkyl, oxyalkenyl, thioalkenyl, aminoalkenyl, carboxyalkenyl, oxyalkynyl, Thiynyl, alkynyl, carboxyalkynyl, oxycycloalkyl, thiocycloalkyl, aminocycloalkyl, carboxycycloalkyl, oxycycloalkenyl, thiocycloalkenyl, aminocycloolefin Base, carboxycycloalkenyl, heterocyclic, oxyheterocyclic, thioheterocyclic, aminoheterocyclic, carboxyheterocyclic, oxyaryl, thioaryl, aminoaryl, carboxyaryl, heteroaryl, Oxyheteroaryl, thiaheteroaryl, aminoheteroaryl, carboxyheteroaryl, oxyalkylaryl, sulfanylaryl, aminoalkylaryl, carboxyalkylaryl, oxy Arylalkyl, thioarylalkyl, aminoarylalkyl, carboxyarylalkyl, oxyarylalkenyl, thioarylalkenyl, aminarylarylalkenyl,carboxyarylalkenyl, Oxyalkenylaryl, thioalkenylaryl, aminoalkenylaryl, carboxyalkenylaryl,oxyarylalkynyl,thioarylalkynyl,aminoarylalkynyl,carboxyarylalkyne Alkyl, oxyalkynylaryl, thioalkynylaryl, amine Alkynylaryl or carboxyalkynylaryl, oxyalkylene, thioalkyl, aminoalkyl, carboxyalkyl, oxyalkylene, sulfur extended alkenyl, amine extended alkenyl, carboxyalkylene Alkyl, alkynyl, azide, alkynyl, alkynyl, alkoxy, cycloalkyl, thiocycloalkyl , thiocycloalkenyl, aminocycloalkenyl, carboxylcycloalkenyl, oxy aryl, thioaryl, amine aryl, carboxyl aryl, oxyalkyl aryl, alkyl aryl Aminoalkyl aryl, carboxyalkyl aryl, oxyarylalkyl, thioarylalkyl, aminoarylalkyl, carboxyarylalkyl, oxyarylalkylene, thioaryl Alkenyl, aminoarylalkylene, carboxyarylalkylene, oxyalkenylaryl, thioalkenylaryl, aminoalkenylaryl, carboxyalkenylaryl,oxyaryl extended alkynyl, sulfur Aryl extended alkynyl, aminylaryl extended alkynyl, carboxyaryl extended alkynyl, oxyalkynyl extended aryl, acetylenyl extended aryl, aminynyl aryl a carboxy alkynyl aryl group, a heteroaryl group, an oxyheteroaryl group, a sulfur heteroaryl group, an amine group heteroaryl group, a carboxyl group heteroaryl group, a divalent or polyvalent ring moiety containing a hetero atom, an oxygen group a divalent or polyvalent ring moiety of a heteroatom, a divalent or polyvalent ring moiety of a sulfur containing heteroatom, a divalent or polyvalent ring moiety containing an amine heteroatom, or a divalent or polyvalent ring containing a carboxyl heteroatom section.Polyoxyl
Polyoxyxides contemplated for use in practicing the present invention are well known in the art. For example, see U.S. Patent No. 5,717,034, the disclosure of which is incorporated herein in its entirety by reference.Oxetane
Oxetane (ie, 1,3-propylene oxide) has the formula C3
H6
A heterocyclic organic compound of O having a four-membered ring containing three carbon atoms and one oxygen atom. The term oxetane generally also refers to any organic compound containing an oxetane ring. See, for example, Burkhard et al., Angew. Chem. Int. Ed. 2010, 49, 9052-9067, the entire contents of which is incorporated herein by reference.Polyester resin
Polyester contemplated for use in the practice of the invention refers to a condensation polymer formed by reacting a polyol (also known as a polyhydric alcohol) with a saturated or unsaturated dibasic acid. Typical polyols used are diols such as ethylene glycol; the usual acids are phthalic acid and maleic acid. The by-product (water) of the esterification reaction is continuously removed to complete the completion of the reaction. The use of unsaturated polyesters and additives such as styrene reduces the viscosity of the resin. The initial liquid resin is converted to a solid by a crosslinked chain. This process is accomplished by generating free radicals at unsaturated bonds that extend in the chain reaction to other unsaturated bonds of adjacent molecules, thereby joining adjacent chains in the process.Polyurethane resin
Polyurethanes contemplated for use in the practice of the invention refer to polymers composed of chains of organic units linked by carbamate/urethane linkages. The polyurethane polymer is formed by reacting isocyanic acid with a polyol. Both isocyanic acid and polyol used to prepare the polyurethane contain an average of two or more than two functional groups per molecule.Additives as appropriate
According to some embodiments of the invention, the compositions described herein may further comprise one or more flow additives, adhesion promoters, rheology modifiers, toughening agents, film toughening agents, UV stabilizers, epoxy curing A catalyst (e.g., imidazole), a curing agent (e.g., dicumyl peroxide), and the like, and a mixture of any two or more thereof. As used herein, the term "flow additive" refers to a compound that alters the viscosity of a formulation incorporating such flow additives. Exemplary compounds that impart such properties include ruthenium polymers, ethyl acrylate/2-ethylhexyl acrylate copolymers, alkanolammonium salts of ketone oxime phosphates, and the like, and any two or more thereof The combination. As used herein, the term "adhesion promoter" refers to a compound that enhances the adhesive properties of a formulation incorporating such adhesion promoters. As used herein, the term "rheology modifier" refers to an additive that alters one or more of the physical properties of a formulation incorporating such rheology modifiers. As used herein, the term "toughening agent" refers to an additive that enhances the impact resistance of a formulation incorporating such toughening agents. As used herein, the term "UV stabilizer" refers to an additive that inhibits or absorbs harmful UV radiation that causes degradation of the polymer. There are two main types of stabilizers commonly used today: UV absorbers and Hindered Amine Light Stabilizers (HALS). UV absorbers act by absorbing UV rays and dissipating them into heat. UV absorber chemicals include benzophenone, benzotriazole, hydroxyphenyl triazine, and the like. HALS acts by neutralizing the free radical intermediates produced by UV rays to neutralize the degradation. In both cases, the damaging effects of the UV light are directed away from the matrix polymer and the colorant due to interaction with the UV additive present in the matrix polymer. As used herein, the term "membrane toughening agent" refers to an agent that imparts flexibility to a film prepared from a formulation containing the same. As used herein, the term "phenol-novolak hardener" refers to a material that participates in further interaction of the reactive groups such that it increases its cross-linking, thereby enhancing its hardness. As used herein, the term "epoxy-curing catalyst" refers to a reactive agent that promotes oligomerization and/or polymerization of an epoxy-containing moiety, such as imidazole. As used herein, the term "curing agent" refers to a reactive agent that promotes the curing of a monomeric material, oligomeric material, or polymeric material, such as dicumyl peroxide.Nanoparticle
Nanoparticles considered for use in this article include ZrO2
TiO2
Al2
O3
, Sb2
O4
(or Sb2
O3
Sb2
O5
), CdO, CaO2
, Cu2
O, FeO, Fe2
O3
, PbO, MnOMnO3
, SnO2
, ZnO, ZnS, ZnSe, ZnTe, and the like, or any mixture of two or more thereof. Typically, the nanoparticles have an average particle size of less than 40 nm; in some embodiments, the nanoparticles have an average particle size of less than 25 nm; in some embodiments, the nanoparticles have 4 Average particle size in the range of -10 nm. In some embodiments, the nanoparticles are stabilized metal oxide nanoparticles. When stabilized, the nanoparticles are stabilized by the presence of one or more surfactants, such as a blocking agent (which serves to stop the growth of the nanoparticles and stabilize them from agglomeration). Exemplary capping agents include polyvinyl alcohol, poly(N-vinyl-2-pyrrolidone), gum arabic, alpha-methacrylic acid, 11-decylundecanoic acid or its disulfide derivative, citric acid, Trisodium citrate, stearic acid, palmitic acid, octanoic acid, citric acid, polyethylene glycol and derivatives thereof, polyacrylic acid and amino-modified polyacrylic acid, 2-mercaptoethanol, starch and the like, and Any two or more of a mixture of the two. It is contemplated that the amount of blocking agent that stabilizes the nanoparticles is in the range of from about 1% to about 40% by weight of the composition; in some embodiments, the amount of blocking agent employed is about 1 in the composition. From about % by weight to about 30% by weight; in some embodiments, the amount of blocking agent employed is in the range of from about 1% to about 20% by weight of the composition; in some embodiments, the seal is employed The amount of the terminal agent is in the range of from about 1% by weight to about 10% by weight of the composition; in some embodiments, the amount of the blocking agent employed is in the range of from about 1% by weight to about 5% by weight of the composition; In some embodiments, the amount of blocking agent employed ranges from about 2% to about 40% by weight of the composition; in some embodiments, the amount of blocking agent employed is about 2% of the composition. From about % by weight to about 30% by weight; in some embodiments, the amount of blocking agent employed is in the range of from about 2% to about 20% by weight of the composition; in some embodiments, the seal employed The amount of the terminal agent is in the range of from about 2% by weight to about 10% by weight of the composition; in some embodiments, the amount of the blocking agent employed is in the composition. From 2% by weight to about 5% by weight; in some embodiments, the amount of blocking agent employed is in the range of from about 3% by weight to about 40% by weight of the composition; in some embodiments, The amount of blocking agent ranges from about 3% by weight to about 30% by weight of the composition; in some embodiments, the amount of blocking agent employed ranges from about 3% by weight to about 20% by weight of the composition. In some embodiments, the amount of blocking agent employed is in the range of from about 3% by weight to about 10% by weight of the composition; in some embodiments, the amount of blocking agent employed is in the composition. From about 3% by weight to about 5% by weight; in some embodiments, the amount of blocking agent employed is in the range of from about 4% to about 40% by weight of the composition; in some embodiments, employed The amount of blocking agent ranges from about 4% by weight to about 30% by weight of the composition; in some embodiments, the amount of blocking agent employed ranges from about 4% by weight to about 20% by weight of the composition. In some embodiments, the amount of blocking agent employed is in the range of from about 4% by weight to about 10% by weight of the composition; in some embodiments, The amount of blocking agent employed is in the range of from about 4% by weight to about 5% by weight of the composition.Thinner
Although certain embodiments of the invention do not require a diluent, the non-reactive organic diluent may optionally be employed in the present invention, for example, to facilitate manipulation of, for example, lower viscosity, improved dispersibility, and the like. Formulation. When present, exemplary organic diluents are selected from the group consisting of aromatic hydrocarbons (eg, benzene, toluene, xylene, and the like), saturated hydrocarbons (eg, hexane, cyclohexane, heptane, fourteen) Alkane), chlorinated hydrocarbons (eg dichloromethane, chloroform, carbon tetrachloride, dichloroethane, trichloroethylene and the like), ethers (eg diethyl ether, tetrahydrofuran, dioxane, glycol ethers, ethylene) Monoalkyl ethers or dialkyl ethers of alcohols and their analogs), polyols (eg polyethylene glycol, propylene glycol, polypropylene glycol and the like), esters (eg ethyl acetate, butyl acetate, methoxy) Propyl acetate and its analogues; dibasic esters (eg DBE-9), alpha-rosinol, beta-rosinol, kerosene, dibutyl phthalate, butyl carbitol, butyl Kikabi alcohol acetate, carbitol acetate, ethyl carbitol acetate, hexanediol, high boiling alcohols and esters thereof, glycol ethers, ketones (eg acetone, methyl ethyl ketone and Its analogs), guanamines (such as dimethylformamide, dimethylacetamide and the like), heteroaromatic compounds (such as N-methylpyrrolidone and the like) and Analogs, and mixtures of any two or more thereof.product / Assembly
According to another aspect of the present invention, there is provided an article/assembly comprising a first separation of such a formulation by an aliquot of a formulation according to the invention and/or a cured aliquot A transparent component and a second transparent component. The aliquot of the inventive formulation can be applied to the first and/or second transparent component at a thickness of from about 1 μm to about 1000 μm. Suitable matrices contemplated for use herein include polyethylene terephthalate, methyl methacrylate, polyethylene, polypropylene, polycarbonate, epoxy, polyimine, polyamine, Polyester, glass, tantalum nitride passivated Si wafer, polyimide passivated Si wafer, BT substrate, bare Si, SR4 matrix, SR5 matrix and the like. As will be readily appreciated by those skilled in the art, the adhesion between the formulations of the present invention and their corresponding substrates can be determined in a variety of ways, for example, by ASTM standard cross-cut tape testing in accordance with Test Method D 3359-97. Typically, the adhesion between the formulation and the substrate is at least Grade 1B as determined by ASTM standard cross-cut tape test in accordance with Test Method D 3359-97. In some embodiments, an adhesion equivalent to at least ASTM Class 1B is observed (i.e., at least 35% of the initial adherent film surface remains attached to the substrate after being subjected to the tape test). In certain embodiments of the invention, an adhesion equivalent to at least ASTM 2B grade is observed (i.e., at least 65% of the initial adherent film surface remains attached to the substrate after being subjected to tape testing). In certain embodiments of the invention, an adhesion equivalent to at least ASTM Class 3B is observed (i.e., at least 85% of the initial adherent film surface remains attached to the substrate after being subjected to tape testing). In certain embodiments of the invention, an adhesion equivalent to at least ASTM 4B grade is observed (i.e., at least 95% of the initial adherent film surface remains attached to the substrate after being subjected to tape testing). In certain embodiments of the invention, an adhesion equivalent to at least ASTM 5B grade is observed (i.e., at least 100% of the initial transadhesive surface remains attached to the substrate after being subjected to tape testing). According to still another aspect of the present invention, there is provided a light-emitting element, wherein a formulation according to the present invention using a cured aliquot is adhered thereto to at least one of the light-transmitting portions. Various aspects of the invention are illustrated by the following non-limiting examples. The examples are for illustrative purposes and do not limit any implementation of the invention. It will be appreciated that various changes and modifications can be made without departing from the spirit and scope of the invention. Those skilled in the art will readily recognize how to synthesize or purchase the reagents and components described herein. EXAMPLES Example 1 Synthesis Step for Compound I An exemplary polyaromatic compound (Compound I) according to the present invention was prepared as follows.Nikanol Y-100 (100.0 g, 0.04464 mol) from Fudow Co. Ltd. and 100 ml of toluene were added to a three-necked round bottom flask equipped with a magnetic stirrer. The resulting mixture was cooled to 0-10 ° C using an ice bath. To this mixture was added 4.041 g (0.04464 mol) of trimethylamine. Propylene hydrazine chloride (5.01 g, 0.0494 mol) was then introduced dropwise into the mixture via an addition funnel. The rate of addition was controlled such that the temperature of the reaction mixture was always kept below 10 °C. After all the ingredients were introduced, the mixture was naturally allowed to warm to room temperature and the reaction was allowed to proceed for another 6 hours. The reaction mixture was then washed twice with a baking soda aqueous solution, followed by washing twice with distilled water. The organic layer was dried over magnesium sulfate and filtered through a filter paper. The toluene solvent was then removed by vacuum to give a colorless, low-viscosity liquid, 94.2 g. This resin exhibited an RI value of 1.56 at 589 nm. Example 2 Synthesis Step for Compound II An exemplary polyaromatic compound (Compound II) according to the present invention was prepared as follows. Nikanol Y-50 (100.0 g), toluene 100 ml, trimethylamine 4.041 g, and metharyloyl chloride 5.12 g were placed in a three-necked round bottom flask in a synthetic procedure similar to that described above. The reaction product was a colorless, low viscosity liquid of 89.6 g. This resin exhibited an RI value of 1.56 at 589 nm. EXAMPLE 3 Synthetic Steps for Formulations of the Invention Exemplary formulations according to the present invention are prepared by combining the following components:
Various performance properties of the resulting formulations were evaluated. A review of the foregoing table reveals that exemplary formulations in accordance with the present invention have excellent clarity and refractive index; and such desirable properties remain substantially maintained even upon exposure to 1000 hours of QUV aging. Example 4 Another exemplary formulation according to the present invention was prepared by combining the following components:
The various performance properties of the resulting formulations were evaluated as outlined in the table below:
A review of the foregoing table reveals that exemplary formulations in accordance with the present invention have excellent clarity and refractive index; and such desirable properties remain substantially maintained even upon exposure to 1000 hours of QUV aging. Example 5 A comparative formulation based on a highly aromatic resin was prepared by combining the following components:
The various performance properties of the resulting formulations were evaluated as outlined in the table below:
A review of the foregoing table reveals that the clarity and yellowness index of the formulation of 2-phenylphenoxyethyl acrylate based on highly aromatic resins is poor when exposed to 500 hours of QUV aging. Various modifications of the invention in addition to those shown and described herein will be apparent to those skilled in the art. Such modifications are also intended to fall within the scope of the appended claims. The patents and publications referred to in this specification are indicative of the skill of those skilled in the art. These patents and publications are hereby incorporated by reference in their entirety in their entirety in the extent of the disclosure of the disclosure of the disclosure of the disclosure of the disclosure of the disclosure of the disclosure. The foregoing description illustrates specific embodiments of the invention, and is not intended to The scope of the invention is intended to be defined by the following claims.