TW201830630A - Fingerprint recognition package structure - Google Patents
Fingerprint recognition package structure Download PDFInfo
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- TW201830630A TW201830630A TW106104144A TW106104144A TW201830630A TW 201830630 A TW201830630 A TW 201830630A TW 106104144 A TW106104144 A TW 106104144A TW 106104144 A TW106104144 A TW 106104144A TW 201830630 A TW201830630 A TW 201830630A
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- line carrier
- fingerprint identification
- line
- package structure
- electrically connected
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- 229910000679 solder Inorganic materials 0.000 claims abstract description 21
- 239000008393 encapsulating agent Substances 0.000 claims description 27
- 239000000565 sealant Substances 0.000 claims description 9
- 238000007789 sealing Methods 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 abstract 5
- 238000010586 diagram Methods 0.000 description 6
- 238000013459 approach Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229920006336 epoxy molding compound Polymers 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body (electrodes)
- H01L23/485—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body (electrodes) consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
Abstract
Description
本發明是有關於一種封裝結構，且特別是有關於一種指紋辨識封裝結構。The present invention relates to a package structure, and more particularly to a fingerprint identification package structure.
隨著科技的進步，越來越多需要辨識使用者資訊的電子裝置應運而生，例如是指紋辨識封裝結構，此類指紋辨識封裝結構能夠裝設於各類的電子產品，例如智慧型手機、行動電話、平板電腦、筆記型電腦以及個人數位助理(PDA)等，用以辨認使用者的指紋，而要如何能夠製造出低成本的指紋辨識封裝結構是本領域亟欲探討的課題。With the advancement of technology, more and more electronic devices that need to identify user information have emerged, such as fingerprint identification package structures. Such fingerprint identification package structures can be installed in various electronic products, such as smart phones. Mobile phones, tablets, notebook computers, and personal digital assistants (PDAs) are used to identify the user's fingerprints. How to create a low-cost fingerprint identification package is an issue to be explored in the field.
本發明提供一種指紋辨識封裝結構，其可辨識指紋且具有低成本。The present invention provides a fingerprint identification package structure that can recognize fingerprints and has low cost.
本發明的一種指紋辨識封裝結構，包括第一線路載體、指紋辨識晶片、封膠體及多個銲球。第一線路載體包括相對的第一面與第二面，第一面具有指紋辨識線路。指紋辨識晶片設置在第一線路載體的第二面上且以打線的方式電性連接於第一線路載體。封膠體設置於第一線路載體上且包封指紋辨識晶片，其中封膠體包括多個導通孔，分別電性連接於第一線路載體。這些銲球配置於封膠體且電性連接於這些導通孔。A fingerprint identification package structure of the invention comprises a first line carrier, a fingerprint identification chip, a sealant and a plurality of solder balls. The first line carrier includes opposing first and second sides, the first side having a fingerprint identification line. The fingerprint identification chip is disposed on the second surface of the first line carrier and electrically connected to the first line carrier by wire bonding. The encapsulant is disposed on the first line carrier and encloses the fingerprint identification chip, wherein the encapsulant comprises a plurality of via holes electrically connected to the first line carrier. The solder balls are disposed on the encapsulant and electrically connected to the via holes.
在本發明的一實施例中，上述的這些導通孔內填導電金屬，以分別電性連接於第一線路載體。In an embodiment of the invention, the conductive vias are filled with a conductive metal to be electrically connected to the first line carrier.
本發明的一種指紋辨識封裝結構，包括第一線路載體、指紋辨識晶片、封膠體及第二線路載體。指紋辨識晶片設置在第一線路載體上且以打線的方式電性連接於第一線路載體。封膠體設置於第一線路載體上且包封指紋辨識晶片。第二線路載體設置於封膠體上且電性連接於第一線路載體，第二線路載體包括相對的第一面與第二面，第一面朝向第一線路載體，第二面具有指紋辨識線路。A fingerprint identification package structure of the present invention includes a first line carrier, a fingerprint identification chip, a sealant and a second line carrier. The fingerprint identification chip is disposed on the first line carrier and electrically connected to the first line carrier by wire bonding. The encapsulant is disposed on the first line carrier and encloses the fingerprint identification wafer. The second line carrier is disposed on the encapsulant and electrically connected to the first line carrier, and the second line carrier includes opposite first and second sides, the first side faces the first line carrier, and the second side has the fingerprint identification line .
在本發明的一實施例中，上述的第二線路載體為可撓線路載體。In an embodiment of the invention, the second line carrier is a flexible line carrier.
在本發明的一實施例中，上述的第一線路載體與第二線路載體分別配置在封膠體的相對兩面，封膠體包括多個導通孔，且各個導通孔電性連接於第一線路載體與第二線路載體。In an embodiment of the present invention, the first line carrier and the second line carrier are respectively disposed on opposite sides of the sealing body, the sealing body includes a plurality of conductive holes, and each of the conductive holes is electrically connected to the first line carrier and Second line carrier.
在本發明的一實施例中，上述的指紋辨識封裝結構更包括多個銲球，分別配置於第一線路載體且電性連接於指紋辨識晶片。In an embodiment of the invention, the fingerprint identification package structure further includes a plurality of solder balls disposed on the first line carrier and electrically connected to the fingerprint recognition chip.
在本發明的一實施例中，上述的封膠體外露出第一線路載體的一部分，第二線路載體的一部分從封膠體上向下彎折而連接至第一線路載體外露於封膠體的部分。In an embodiment of the invention, a portion of the first line carrier is exposed outside the sealing body, and a portion of the second line carrier is bent downward from the sealing body to be connected to a portion of the first line carrier exposed to the sealing body.
在本發明的一實施例中，上述的第二線路載體上設具指紋辨識線路之訊號輸出線路，而向下彎折連接至第一線路載體上。In an embodiment of the invention, the second line carrier is provided with a signal output line with a fingerprint identification line, and is bent downwardly to the first line carrier.
在本發明的一實施例中，上述的指紋辨識封裝結構，更包括多個銲球，分別配置於第一線路載體且電性連接於指紋辨識晶片。In an embodiment of the invention, the fingerprint identification package structure further includes a plurality of solder balls disposed on the first line carrier and electrically connected to the fingerprint recognition chip.
基於上述，本發明的指紋辨識封裝結構藉由第一線路載體的第一面具有指紋辨識線路，將指紋辨識晶片設置在第一線路載體的第二面上且以打線的方式電性連接於第一線路載體，包封指紋辨識晶片的封膠體包括電性連接於第一線路載體的導通孔，且銲球電性連接於這些導通孔，以將指紋辨識線路所接收到的指紋資訊經由第一線路載體傳遞至指紋辨識晶片，並將經指紋辨識晶片處理過的資訊透過導通孔與銲球而傳遞至其他外部的電路。本發明的另一種指紋辨識封裝結構還包括第二線路載體，並將指紋辨識線路改配置在第二線路載體，第一線路載體與第二線路載體之間可透過貫穿封膠體的導通孔電性連接，或是第二線路載體可為可撓性線路載體而從封膠體上向第一線路載體的方向彎折而電性連接至第一線路載體。上述配置的指紋辨識晶片透過打線的方式連接於第一線路載體，可具有較低的成本。Based on the above, the fingerprint identification package structure of the present invention has a fingerprint identification line on the first side of the first line carrier, and the fingerprint identification chip is disposed on the second surface of the first line carrier and electrically connected to the first line by way of wire bonding. a line carrier, the encapsulant encapsulating the fingerprint identification chip includes a via hole electrically connected to the first line carrier, and the solder ball is electrically connected to the via holes to pass the fingerprint information received by the fingerprint identification line through the first The line carrier is transferred to the fingerprint identification chip, and the information processed by the fingerprint identification wafer is transmitted to the other external circuits through the via holes and the solder balls. Another fingerprint identification package structure of the present invention further includes a second line carrier, and the fingerprint identification line is modified to be disposed on the second line carrier, and the electrical conductivity of the through hole penetrating through the encapsulant is transmitted between the first line carrier and the second line carrier. The connection, or the second line carrier, may be a flexible line carrier bent from the encapsulant toward the first line carrier and electrically connected to the first line carrier. The fingerprint identification chip of the above configuration is connected to the first line carrier by wire bonding, which can have lower cost.
為讓本發明的上述特徵和優點能更明顯易懂，下文特舉實施例，並配合所附圖式作詳細說明如下。The above described features and advantages of the invention will be apparent from the following description.
圖1是依照本發明的一實施例的一種指紋辨識封裝結構的示意圖。請參閱圖1，本實施例的指紋辨識封裝結構100包括第一線路載體110、指紋辨識晶片120、封膠體130及多個銲球140。第一線路載體110包括相對的第一面114與第二面112，第一面114具有指紋辨識線路105。指紋辨識線路105可以是電容式指紋辨識線路105，例如包括由多個感測電極(未繪示)所構成的感測陣列，並利用感測電極相對於手指表面之脊紋與溝紋所形成的電容差異來取得指紋影像。或者，指紋辨識線路105也可以是電阻式指紋辨識線路或是包括了發光單元與半導體感光陣列的光動能指紋辨識模組等，指紋辨識線路105的種類與辨識方式並不以此為限制。FIG. 1 is a schematic diagram of a fingerprint identification package structure according to an embodiment of the invention. Referring to FIG. 1 , the fingerprint identification package structure 100 of the present embodiment includes a first line carrier 110 , a fingerprint identification chip 120 , a sealant 130 , and a plurality of solder balls 140 . The first line carrier 110 includes opposing first and second faces 114, 112 having a fingerprint identification line 105. The fingerprint identification line 105 can be a capacitive fingerprint identification line 105, for example, including a sensing array composed of a plurality of sensing electrodes (not shown), and using the sensing electrodes to form ridges and grooves with respect to the surface of the finger. The difference in capacitance is used to obtain a fingerprint image. Alternatively, the fingerprint identification line 105 may be a resistive fingerprint identification circuit or a photo-energy fingerprint identification module including a light-emitting unit and a semiconductor photosensitive array. The type and identification mode of the fingerprint identification line 105 are not limited thereto.
指紋辨識晶片120設置在第一線路載體110的第二面112上且以打線的方式電性連接於第一線路載體110。封膠體130設置於第一線路載體110上且包封指紋辨識晶片120，該封膠體130例如為EMC (Epoxy molding compound)材質。在本實施例中，封膠體130包括多個導通孔132，分別電性連接於第一線路載體110。更明確地說，這些導通孔132內填導電金屬，例如是金、銀、銅、鋁、鐵、鎳或其合金等導電金屬，以分別電性連接於第一線路載體110，但在其他實施例中，導通孔132也可以只有內壁具有導電層，同樣也可以達到電性連接於第一線路載體110的效果。此外，這些銲球140配置於封膠體130且電性連接於這些導通孔132。The fingerprint identification chip 120 is disposed on the second surface 112 of the first line carrier 110 and electrically connected to the first line carrier 110 by wire bonding. The encapsulant 130 is disposed on the first line carrier 110 and encloses the fingerprint identification wafer 120. The encapsulant 130 is, for example, an EMC (Epoxy molding compound) material. In this embodiment, the encapsulant 130 includes a plurality of vias 132 electrically connected to the first line carrier 110, respectively. More specifically, the via holes 132 are filled with a conductive metal, such as a conductive metal such as gold, silver, copper, aluminum, iron, nickel or an alloy thereof, to be electrically connected to the first line carrier 110, respectively, but in other implementations. In the example, the via hole 132 may have a conductive layer only on the inner wall, and the effect of electrically connecting to the first line carrier 110 may also be achieved. In addition, the solder balls 140 are disposed on the encapsulant 130 and electrically connected to the via holes 132 .
藉由上述配置，在使用者的手指接觸或靠近本實施例的指紋辨識封裝結構100的指紋辨識線路105之後，指紋辨識線路105所接收到的指紋資訊可經由第一線路載體110的接墊116、導線125、接墊122傳遞至指紋辨識晶片120，而在指紋辨識晶片120內進行資料處理，經指紋辨識晶片120處理過的資訊可透過接墊122、116、118、導通孔132與銲球140而傳遞至其他外部的電路(未繪示)。上述的配置在結構上相當簡單，且具有低成本的優點。With the above configuration, after the user's finger contacts or approaches the fingerprint identification line 105 of the fingerprint identification package structure 100 of the embodiment, the fingerprint information received by the fingerprint identification line 105 can pass through the pad 116 of the first line carrier 110. The wire 125 and the pad 122 are transferred to the fingerprint identification chip 120, and the data processing is performed in the fingerprint identification chip 120. The information processed by the fingerprint recognition chip 120 can pass through the pads 122, 116, 118, the via 132 and the solder ball. 140 is passed to other external circuits (not shown). The above configuration is relatively simple in construction and has the advantage of low cost.
當然，指紋辨識封裝結構100的形式並不限於此，下面介紹其他種指紋辨識封裝結構100。需說明的是，在下面的實施例中，與前一實施例相同或是相似的元件以相同或是相似的標號表示。Of course, the form of the fingerprint identification package structure 100 is not limited thereto, and other types of fingerprint identification package structures 100 are described below. It should be noted that in the following embodiments, the same or similar elements as those of the previous embodiment are denoted by the same or similar reference numerals.
圖2是依照本發明的另一實施例的一種指紋辨識封裝結構的示意圖。請參閱圖2，本實施例的指紋辨識封裝結構100a包括第一線路載體110、指紋辨識晶片120、封膠體130、第二線路載體150及多個銲球140。指紋辨識晶片120設置在第一線路載體110上且以打線的方式電性連接於第一線路載體110。封膠體130設置於第一線路載體110上且包封指紋辨識晶片120。2 is a schematic diagram of a fingerprint identification package structure in accordance with another embodiment of the present invention. Referring to FIG. 2 , the fingerprint identification package structure 100 a of the present embodiment includes a first line carrier 110 , a fingerprint identification chip 120 , a sealant 130 , a second line carrier 150 , and a plurality of solder balls 140 . The fingerprint identification chip 120 is disposed on the first line carrier 110 and electrically connected to the first line carrier 110 in a wire bonding manner. The encapsulant 130 is disposed on the first line carrier 110 and encapsulates the fingerprint recognition wafer 120.
第二線路載體150設置於封膠體130上且電性連接於第一線路載體110，第二線路載體150包括相對的第一面152與第二面154，第一面152朝向第一線路載體110，第二面154具有指紋辨識線路105。在本實施例中，第二線路載體150為可撓線路載體，以具有較低的成本，但第二線路載體150的種類不以此為限制。更明確地說，如圖2所示，第一線路載體110與第二線路載體150分別配置在封膠體130的相對兩面。在本實施例中，第一線路載體110與第二線路載體150的長寬尺寸實質上相同，但不以此為限制。封膠體130包括多個導通孔132，且各個導通孔132分別電性連接於第一線路載體110與第二線路載體150。這些銲球140分別配置於第一線路載體110且電性連接於指紋辨識晶片120。The second line carrier 150 is disposed on the encapsulant 130 and electrically connected to the first line carrier 110. The second line carrier 150 includes an opposite first surface 152 and a second surface 154. The first surface 152 faces the first line carrier 110. The second side 154 has a fingerprint identification line 105. In the present embodiment, the second line carrier 150 is a flexible line carrier to have a lower cost, but the type of the second line carrier 150 is not limited thereto. More specifically, as shown in FIG. 2, the first line carrier 110 and the second line carrier 150 are disposed on opposite sides of the encapsulant 130, respectively. In this embodiment, the length and width dimensions of the first line carrier 110 and the second line carrier 150 are substantially the same, but are not limited thereto. The sealing body 130 includes a plurality of via holes 132 , and each of the via holes 132 is electrically connected to the first line carrier 110 and the second line carrier 150 respectively. The solder balls 140 are respectively disposed on the first line carrier 110 and electrically connected to the fingerprint recognition wafer 120.
因此，在使用者的手指接觸或靠近本實施例的指紋辨識封裝結構100a的指紋辨識線路105之後，指紋辨識線路105所接收到的指紋資訊可經由第二線路載體150、接墊156、導通孔132、第一線路載體110的接墊118、116、導線125、接墊122傳遞至指紋辨識晶片120，而在指紋辨識晶片120內進行資料處理，經指紋辨識晶片120處理過的資訊可透過接墊122、導線125、第一線路載體110的接墊116、118、119與銲球140而傳遞至其他外部的電路(未繪示)。上述的配置將指紋辨識線路105改配置在第二線路載體150上，而使得佈線空間分散至第一線路載體110與第二線路載體150上，第一線路載體110與第二線路載體150上的走線間距可以提高，在製程上較為簡單，第二線路載體150還可選用可撓線路載體來降低成本。Therefore, after the user's finger contacts or approaches the fingerprint identification line 105 of the fingerprint identification package structure 100a of the embodiment, the fingerprint information received by the fingerprint identification line 105 can pass through the second line carrier 150, the pad 156, and the through hole. 132, the pads 118, 116, the wires 125, and the pads 122 of the first line carrier 110 are transferred to the fingerprint identification chip 120, and the data processing is performed in the fingerprint identification chip 120, and the information processed by the fingerprint identification chip 120 can be transmitted through The pads 122, the wires 125, the pads 116, 118, 119 of the first line carrier 110 and the solder balls 140 are transferred to other external circuits (not shown). The above configuration configures the fingerprint identification line 105 on the second line carrier 150 such that the wiring space is dispersed on the first line carrier 110 and the second line carrier 150, and the first line carrier 110 and the second line carrier 150 The spacing of the traces can be increased, and the process is relatively simple. The second line carrier 150 can also use a flexible line carrier to reduce the cost.
圖3是依照本發明的再一實施例的一種指紋辨識封裝結構的示意圖。請參閱圖3，圖3的指紋辨識封裝結構100b與圖2的指紋辨識封裝結構100a的主要差異在於，在本實施例中，第一線路載體110與第二線路載體150的長寬尺寸均大於封膠體130的長寬尺寸，而使得封膠體130外露出(或稱未覆蓋)第一線路載體110的一部分，第二線路載體150上設有指紋辨識線路105以及指紋辨識線路105之訊號輸出線路156，指紋辨識線路105位在封膠體130上方，訊號輸出線路為第二線路載體150在圖3的左方部分。由於第二線路載體150是可撓性線路載體而可彎折，例如是捲帶(PI)或薄膜等可撓性線路載體，第二線路載體150的訊號輸出線路156的部分從封膠體130上向下彎折而連接至第一線路載體110外露於封膠體130的部分，並與第一線路載體110上的接墊118電性連接。FIG. 3 is a schematic diagram of a fingerprint identification package structure according to still another embodiment of the present invention. Referring to FIG. 3, the main difference between the fingerprint identification package structure 100b of FIG. 3 and the fingerprint identification package structure 100a of FIG. 2 is that, in this embodiment, the length and width dimensions of the first line carrier 110 and the second line carrier 150 are both greater than The length and width of the encapsulant 130 are such that the encapsulant 130 is exposed (or uncovered) to a portion of the first line carrier 110, and the second line carrier 150 is provided with a fingerprint identification line 105 and a signal output line of the fingerprint identification line 105. 156, the fingerprint identification line 105 is located above the encapsulant 130, and the signal output line is the second line carrier 150 in the left part of FIG. Since the second line carrier 150 is a flexible line carrier and can be bent, for example, a flexible line carrier such as a tape reel (PI) or a film, a portion of the signal output line 156 of the second line carrier 150 is from the encapsulant 130. The portion of the first line carrier 110 exposed to the encapsulant 130 is bent downwardly and electrically connected to the pad 118 on the first line carrier 110.
在使用者的手指接觸或靠近本實施例的指紋辨識封裝結構100b的指紋辨識線路105之後，指紋辨識線路105所接收到的指紋資訊可經由第二線路載體150的接墊156、第一線路載體110的接墊118、116、導線125、接墊122傳遞至指紋辨識晶片120，而在指紋辨識晶片120內進行資料處理，經指紋辨識晶片120處理過的資訊可透過接墊122、導線125、第一線路載體110的接墊116、119與銲球140而傳遞至其他外部的電路(未繪示)。上述的配置將圖2中貫穿封膠體130的導通孔132改成由可撓的第二線路載體150向下彎折而連接至第一線路載體110來取代，製程簡單且成本較低。After the user's finger contacts or approaches the fingerprint identification line 105 of the fingerprint identification package structure 100b of the embodiment, the fingerprint information received by the fingerprint identification line 105 can be via the pad 156 of the second line carrier 150, the first line carrier. The pads 118, 116, the wires 125, and the pads 122 of the 110 are transferred to the fingerprint identification chip 120, and the data processing is performed in the fingerprint identification chip 120. The information processed by the fingerprint recognition chip 120 can pass through the pads 122 and the wires 125. The pads 116, 119 of the first line carrier 110 and the solder balls 140 are transferred to other external circuits (not shown). The above configuration replaces the through hole 132 of the sealing body 130 in FIG. 2 by being bent downward by the flexible second line carrier 150 to be connected to the first line carrier 110, which is simple in process and low in cost.
綜上所述，本發明的指紋辨識封裝結構藉由第一線路載體的第一面具有指紋辨識線路，將指紋辨識晶片設置在第一線路載體的第二面上且以打線的方式電性連接於第一線路載體，包封指紋辨識晶片的封膠體包括電性連接於第一線路載體的導通孔，且銲球電性連接於這些導通孔，以將指紋辨識線路所接收到的指紋資訊經由第一線路載體傳遞至指紋辨識晶片，並將經指紋辨識晶片處理過的資訊透過導通孔與銲球而傳遞至其他外部的電路。本發明的另一種指紋辨識封裝結構還包括第二線路載體，並將指紋辨識線路改配置在第二線路載體，第一線路載體與第二線路載體之間可透過貫穿封膠體的導通孔電性連接，或是第二線路載體可為可撓性線路載體而從封膠體上向第一線路載體的方向彎折而電性連接至第一線路載體。上述配置的指紋辨識晶片透過打線的方式連接於第一線路載體，可具有較低的成本。In summary, the fingerprint identification package structure of the present invention has a fingerprint identification circuit on the first side of the first line carrier, and the fingerprint identification chip is disposed on the second surface of the first line carrier and electrically connected by wire bonding. In the first line carrier, the encapsulant encapsulating the fingerprint identification chip includes a via hole electrically connected to the first line carrier, and the solder ball is electrically connected to the via holes to receive the fingerprint information received by the fingerprint identification line. The first line carrier is transferred to the fingerprint identification wafer, and the information processed by the fingerprint identification wafer is transmitted to the other external circuits through the via holes and the solder balls. Another fingerprint identification package structure of the present invention further includes a second line carrier, and the fingerprint identification line is modified to be disposed on the second line carrier, and the electrical conductivity of the through hole penetrating through the encapsulant is transmitted between the first line carrier and the second line carrier. The connection, or the second line carrier, may be a flexible line carrier bent from the encapsulant toward the first line carrier and electrically connected to the first line carrier. The fingerprint identification chip of the above configuration is connected to the first line carrier by wire bonding, which can have lower cost.
雖然本發明已以實施例揭露如上，然其並非用以限定本發明，任何所屬技術領域中具有通常知識者，在不脫離本發明的精神和範圍內，當可作些許的更動與潤飾，故本發明的保護範圍當視後附的申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any one of ordinary skill in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of the invention is defined by the scope of the appended claims.
100、100a、100b‧‧‧指紋辨識封裝結構100, 100a, 100b‧‧‧ fingerprint identification package structure
105‧‧‧指紋辨識線路105‧‧‧Fingerprint identification line
110‧‧‧第一線路載體110‧‧‧First line carrier
112‧‧‧第二面112‧‧‧ second side
114‧‧‧第一面114‧‧‧ first side
116、118、119‧‧‧接墊116, 118, 119‧‧‧ pads
120‧‧‧指紋辨識晶片120‧‧‧Fingerprint identification chip
122‧‧‧接墊122‧‧‧ pads
125‧‧‧導線125‧‧‧Wire
130‧‧‧封膠體130‧‧‧ Sealant
132‧‧‧導通孔132‧‧‧through holes
140‧‧‧銲球140‧‧‧ solder balls
150‧‧‧第二線路載體150‧‧‧Second line carrier
152‧‧‧第一面152‧‧‧ first side
154‧‧‧第二面154‧‧‧ second side
156‧‧‧接墊156‧‧‧ pads
圖1是依照本發明的一實施例的一種指紋辨識封裝結構的示意圖。 圖2是依照本發明的另一實施例的一種指紋辨識封裝結構的示意圖。 圖3是依照本發明的再一實施例的一種指紋辨識封裝結構的示意圖。FIG. 1 is a schematic diagram of a fingerprint identification package structure according to an embodiment of the invention. 2 is a schematic diagram of a fingerprint identification package structure in accordance with another embodiment of the present invention. FIG. 3 is a schematic diagram of a fingerprint identification package structure according to still another embodiment of the present invention.
Claims (9)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW106104144A TWI653725B (en) | 2017-02-08 | 2017-02-08 | Fingerprint identification package structure |
| CN201710513512.1A CN108400120B (en) | 2017-02-08 | 2017-06-29 | Fingerprint identification packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW106104144A TWI653725B (en) | 2017-02-08 | 2017-02-08 | Fingerprint identification package structure |
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| Publication Number | Publication Date |
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| TW201830630A true TW201830630A (en) | 2018-08-16 |
| TWI653725B TWI653725B (en) | 2019-03-11 |
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| CN112151524A (en) * | 2019-06-28 | 2020-12-29 | 中芯长电半导体（江阴）有限公司 | Packaging structure and packaging method of fan-out type fingerprint identification chip |
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| US20120092324A1 (en) * | 2010-10-18 | 2012-04-19 | Qualcomm Mems Technologies, Inc. | Touch, handwriting and fingerprint sensor with elastomeric spacer layer |
| US8975726B2 (en) * | 2012-10-11 | 2015-03-10 | Taiwan Semiconductor Manufacturing Company, Ltd. | POP structures and methods of forming the same |
| KR20150018350A (en) * | 2013-08-08 | 2015-02-23 | 삼성전자주식회사 | Fingerprint Recognizing Apparatus And Manufacturing Method Thereof And Electronic Device |
| TWI587412B (en) * | 2014-05-08 | 2017-06-11 | 矽品精密工業股份有限公司 | Package structures and methods for fabricating the same |
| US9818018B2 (en) * | 2014-07-22 | 2017-11-14 | Nanotek Instruments, Inc. | Flexible fingerprint sensor materials and processes |
| CN106356348A (en) * | 2015-07-24 | 2017-01-25 | 晨星半导体股份有限公司 | Capacitive sensor structure, circuit board structure with capacitive sensor and packaging structure of capacitive sensor |
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| CN108400120A (en) | 2018-08-14 |
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