TW201821585A - High efficiency thermal conductivity structure - Google Patents

Abstract

The present invention provides a high efficiency thermal conductivity structure comprising: a base, plurality of thermal conductive threads formed on the both sides of the base, the base can be any highly thermally conductive material and said thermal conductive threads can be form by physical or chemical process; thermal conductive threads comprised of carbon nanotube or other high thermal conductivity material tubular column; the diameter or cross-section of said thermal conductive threads are sizes of microns or nanometers, and length are sizes of nanometers to millimeters. In use, the present invention can be placed between a heat source and a heat-dissipating unit. The heat of the heat source is conducting to the sheet-shape base via said thermal conductive threads, after the base readjusts the heat conduct path, the heat is conducting to the heat-dissipating unit base via the other side of the base of said thermal conductive threads efficiently. In addition, it allows one side of the present invention to contact the heat source, while the other side is exposed to the air directly, and said thermal conductive threads which are in the air can be pressed into a fin-shape; said thermal conductive threads do not need to be rearranged and do not need to be fixed by adhesive. The base and thermal conductive threads are flexibility, and can be applied to a variety of flatness and curvature surfaces.

Description

Highly efficient thermal structure

The invention relates to a heat-conducting structure with high thermal conductivity, which has a substrate with a sheet, and the substrate has heat-distributing wires formed on both sides; in use, the invention is placed between the heat source and the heat-dissipating unit; The heat is first transmitted to the substrate of the sheet via the heat conducting wire, and after re-adjusting the heat conduction path on the substrate by heat, it can be more efficiently transmitted to the heat dissipating unit via the heat conducting wire on the other side; the structure of the present invention has the winding property Can be applied to a variety of different flatness and curvature surfaces.

According to heat dissipation, heat dissipation is one of the most important technologies in today's mainstream. Because of the conversion of most energy, most of the energy will be converted into heat energy. With the increase of heat energy and temperature, it will affect the performance of equipment operation. As a result of the burning of the equipment, the electrical equipment is usually equipped with a heat sink to dissipate the heat as much as possible to maintain the normal operation of the electrical equipment.

There are many technologies for heat dissipation, one of which is to provide a structure for increasing the contact area with air at one end of a heat dissipating unit by means of heat conduction, such as: heat sink fins, and the other end is directly through the heat sink unit. After the heat source is contacted, the heat of the heat source is transmitted to the heat dissipating unit, and then the heat dissipating fins of the heat dissipating unit are radiated to the air or other fluid by heat convection.

Due to the irregular surface of the contact surface between the heat dissipating unit and the heat source, a large number of voids are formed between the contact surfaces of the two. If there is air with very low thermal conductivity (0.024W/m-k) in this gap, it will cause poor thermal conductivity. In order to improve the thermal conductivity, a thermal conductive paste (10-15 W/mk) with a high thermal conductivity is generally applied between the heat dissipating unit and the heat source, such as a silver paste, to replace the air having a very low thermal conductivity, so that the heat source and the heat dissipating unit No gap, so that heat can be reliably transmitted to the heat sink through the thermal paste; however, the thermal paste is usually a high thermal conductivity main component, such as: metal particles, graphite, carbon tubes, diamonds, and a mixture of bonding agents; but these links The thermal conductivity of the agent is much lower than that of the heat dissipating unit (aluminum is 237W/mk), and the bonding agent will be coated with the main component with high thermal conductivity, which causes the heat to be directly directly from the heat source through the main component with high thermal conductivity. It is transmitted to the heat dissipating unit, which is inevitably blocked by the bonding agent with low thermal conductivity; therefore, the overall thermal and thermal conductivity efficiency is limited, and there is room for improvement.

A conventional method of "preparation method of a heat sink" such as the Chinese Patent Certificate No. CN100517661C, which is a carbon nanotube (20000 W/mk) having a long thermal conductivity and a direct contact with a heat source. The heat of the heat source is directly guided to the heat dissipation unit by contacting the carbon nanotubes on the heat dissipation unit with the heat source. However, in order not to grow the carbon nanotubes on the non-contact surface, the entire heat dissipation unit is covered with a passivation layer (20), and then the passivation layer is removed on the side in contact with the heat source, thereby growing the nanocarbon. tube. Since the volume of the heat dissipating unit is not small and the shape is complicated, the method is not simple to manufacture, and the handling space of the product needs to be protected.

In the prior art, a thermal interface material is provided. For example, the "method of manufacturing a thermal interface material" of the Chinese Patent Certificate No. I331132, and the "carbon nanotube assembly material of the US Patent Publication No. 2007/0244245" and a method for manufacturing the same (Carbon "Method For Manufacturing A Thermal Interface Material", US Patent Publication No. 7674410, "Metal Interface Material", US Patent Publication No. 2006/0234056 "Thermal interface material and method for making the same" and "Thermal Interface Material And Method For Manufacturing Same", disclosed in US Patent Publication No. 2008/0081176, the disclosure of which is incorporated herein by reference. After the carbon nanotubes are formed and arranged in the same direction, the liquid connecting agent is poured, so that the carbon nanotubes can be positioned after the bonding agent is solidified, thereby forming a thermal interface material; however, due to the carbon nanotubes The arrangement is not easy, and the gap between the carbon tubes is extremely small, and it is intended to have a relatively thick consistency. The filling agent is filled in the gap between the carbon tubes, which is extremely difficult and not very feasible; even after the preparation, the carbon nanotubes coated by the bonding agent will not dissipate heat in the radial direction higher than the existing ones. Thermal paste.

In view of this, our inventors have devote themselves to further research on thermal interface materials, and have begun research and development and improvement, with a better invention to solve the above problems, and have been experimentally and modified to have the present invention.

Therefore, the object of the present invention is to solve the above problems. To achieve the above object, the inventors have provided a highly efficient heat conducting structure comprising:

a substrate disposed in a sheet shape, wherein the two end faces of the substrate are independently arranged to form a plurality of heat conductive wires; the substrate is any high thermal conductive material on which a heat conductive wire can be physically or chemically formed, such as copper. , aluminum, silver, carbon, diamond film, etc.; the heat conducting wire comprises a carbon nanotube, aluminum, copper, silver or other column with high thermal conductivity material; the diameter or cross section of the heat conducting wire is micron or The size of the nanometer, the length of the heat conducting wire is from nanometer to millimeter.

In use, the heat conducting structure of the present invention is placed between the heat source and the heat dissipating unit; the heat of the heat source is first transmitted to the substrate through the heat conducting wire, and if the temperature of the heat dissipating unit itself is not uniform, the position of each heat conducting wire is different, And the heat is conducted from the high temperature to the low temperature, so after the heat is re-adjusted through the substrate, the heat can be transferred to the heat dissipating unit through the heat conducting wire on the other side more efficiently; the heat conducting structure has the winding property and can be applied without The flat surface is also easy to produce.

In addition, since the heat conducting wires are arranged independently and are not covered by the bonding agent, the contact surface between the heat source and the heat radiating unit is uneven during assembly, and some of the heat conducting wires will bend and contact each other, which will increase the path of heat conduction. Further improve the thermal conductivity; in addition, the thermal conductive wire has a winding property and can be applied to an uneven surface.

When the invention is produced, it is only necessary to form a heat conducting wire directly on both sides of the substrate; since the heat conducting wire has been fixed and arranged on the substrate, there is no need to rearrange and do not need to inject a bonding agent between the heat conducting wires; production of the structure of the present invention Feasible and low cost.

The invention will be described in detail below with reference to the drawings.

Please refer to Figures 1 and 2 first. The present invention is a highly efficient heat conducting structure comprising:

A substrate 1, in one embodiment, is provided in the form of a sheet, which is any highly thermally conductive material on which a plurality of thermally conductive wires can be physically or chemically formed, such as copper, aluminum, silver, carbon. , diamond film, etc.

The plurality of heat conducting wires 2a, 2b are independently arranged and formed on the two end faces of the substrate 1;

The heat conducting wires 2a, 2b comprise a carbon nanotube, aluminum, copper, silver or other tubular or columnar material having a high thermal conductivity material; the diameter or cross section length of the heat conducting wires 2a, 2b is micron or nano The size of the meter; the length is from nanometer to millimeter;

The molding of the heat-conductive wires 2a, 2b can be formed by physical or chemical methods, and the physical or chemical molding methods are conventional techniques, and therefore will not be described in detail herein;

Therefore, as shown in FIG. 3, in the present embodiment, the heat conducting structure of the present invention is disposed between a heat source 3 and a heat dissipating unit 4, that is, the substrate 1 is located at the heat source 3 and the Between the heat dissipating units 4, the heat conducting wire 2a of one end surface of the substrate 1 is coupled to the heat source 3, and the heat conducting wire 2b of the other end surface of the substrate is coupled to the heat dissipating unit 4; 3 and the surface of the heat dissipating unit 4 may be irregular concave and convex surface; since the substrate 1 and the heat conducting wires 2a, 2b on both sides thereof are made of a highly conductive material, when the heat dissipating unit 4 and the heat source 3 are pressed together The heat conducting structure of the present invention can be effectively engaged with the heat dissipating unit 4 and the heat source 3; therefore, the heat of the heat source 3 can be directly transmitted to the heat radiating unit 4.

The arrangement of the heat dissipating unit 4 itself is different from the heat dissipating conditions at different positions, so that the heat dissipating unit 4 will have a temperature unevenness. Therefore, the heat dissipating unit 4 will exhibit a high temperature distribution region H and a low temperature distribution region L, which will affect the heat dissipating unit 4 Heat dissipation efficiency; the heat is transmitted from high temperature to low temperature. Therefore, when the heat of the heat source 3 is conducted to the substrate 1 through the heat conducting wire 2b of one end surface thereof, the substrate 1 will adjust the heat conduction path, as shown in FIG. As indicated by the direction of the arrow, heat will be conducted to the aforementioned relatively low temperature zone L, thereby further improving the heat dissipation efficiency.

When combined, the heat conducting wires 2a, 2b are bent by the unevenness of the surface of the heat source 3 and the heat radiating unit 4, and the adjacent heat conducting wires 2a, 2b may contact each other, which also increases the path of heat conduction, and the heat conduction efficiency can be improved. Therefore, it is further improved.

When the space is narrow and the heat dissipating unit 4 is not disposed, the arrangement can be as shown in the embodiment shown in FIG. 4; the heat conducting wire 2a of one end surface of the substrate 1 is connected to the surface of a heat source 3. The heat conducting wire 2b of the other end surface of the substrate 1 is directly exposed to the air, and the heat conducting wire 2b of the other end surface can be pressed into a fin shape to increase the contact area with the flowing air, thereby Heat can be dissipated by heat convection.

It should be particularly noted that the heat conducting wires 2a, 2b are separately arranged on both sides of the substrate 1, and the heat conducting wires 2a, 2b are not covered by other objects (such as: known polymer materials or thermal grease). The heat of the heat source 3 will be unobstructed and directly transmitted to the heat sink unit 4.

In summary, the technical means disclosed by the present invention can effectively solve the problems of the prior knowledge, achieve the intended purpose and efficacy, and are not found in the publication before publication, have not been publicly used, and have long-term progress, The invention referred to in the Patent Law is correct, and the application is filed according to law, and the company is invited to give a detailed examination and grant a patent for invention.

The above is only the preferred embodiments of the present invention, and the scope of the present invention is not limited thereto, that is, the equivalent changes and modifications made by the scope of the invention and the contents of the invention are all It should remain within the scope of this invention.

1‧‧‧Substrate

2a, 2b‧‧‧thermal wire

3‧‧‧heat source

4‧‧‧Heat unit

H‧‧‧High temperature distribution area

L‧‧‧low temperature distribution area

Figure 1 is a perspective view of the present invention. Figure 2 is a schematic side view of the invention. Fig. 3 is a schematic cross-sectional view showing the heat conducting wire of one end face of the present invention contacting the heat source, and the heat conducting wire of the other end face contacting the heat dissipating component. Fig. 4 is a perspective view showing the heat conducting wire of one end face of the present invention contacting the heat source, and the heat conducting wire of the other end face is exposed to the air and arranged to form a fin shape.

Claims (8)

A thermally conductive structure having high efficiency, comprising: a substrate having a plurality of heat conducting wires formed on both end faces thereof; the heat conducting wires are arranged in a column or a tube, and the cross section length of the heat conducting wires is micron The size of the grade or nanometer, and the length of the heat conductive wire is from nanometer to millimeter; the substrate and the heat conductive thread are made of a material having high thermal conductivity. The thermally conductive structure having high efficiency as described in claim 1, wherein the heat conductive wire is physically or chemically formed on both end faces of the substrate. The high-efficiency heat-conducting structure according to the first aspect of the patent application, wherein the material of the substrate is a high thermal conductive material capable of forming a heat conductive wire by physical or chemical methods, and is made of copper, aluminum, silver, Carbon, or diamond film. The high-efficiency heat-conducting structure according to claim 1, wherein the heat-conductive wire is columnar or tubular with a material having high thermal conductivity, and is a carbon nanotube, aluminum, copper or silver. The high-efficiency heat-conducting structure according to claim 1, wherein the substrate is in the form of a sheet or a geometric shape. The high-efficiency heat-conducting structure according to any one of claims 1 to 5, further comprising a heat source and a heat dissipating unit, wherein the substrate is located between the heat source and the heat dissipating unit, the substrate The heat conducting wire of one end surface is coupled to the heat source, and the heat conducting wire of the other end surface of the substrate is coupled to the heat dissipating unit. The high-efficiency heat-conducting structure according to any one of claims 1 to 5, further comprising a heat source, wherein the heat-conducting wire of one end surface of the substrate is coupled to the heat source, and the substrate is further The heat conducting wire of one end face is exposed to the air. The high-efficiency heat-conducting structure according to claim 7, wherein the heat-conductive wire of the other end surface of the substrate is pressed to form a fin shape.