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TW201815360A - Laser apparatus - Google Patents

Laser apparatus Download PDF

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Publication number
TW201815360A
TW201815360A TW105134526A TW105134526A TW201815360A TW 201815360 A TW201815360 A TW 201815360A TW 105134526 A TW105134526 A TW 105134526A TW 105134526 A TW105134526 A TW 105134526A TW 201815360 A TW201815360 A TW 201815360A
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Taiwan
Prior art keywords
laser
light
laser device
item
patent application
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TW105134526A
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Chinese (zh)
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TWI605788B (en
Inventor
吳泰緯
曹宏熙
洪基彬
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財團法人工業技術研究院
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Priority to TW105134526A priority Critical patent/TWI605788B/en
Priority to CN201611186671.7A priority patent/CN107994454A/en
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Publication of TWI605788B publication Critical patent/TWI605788B/en
Publication of TW201815360A publication Critical patent/TW201815360A/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/09Processes or apparatus for excitation, e.g. pumping
    • H01S3/091Processes or apparatus for excitation, e.g. pumping using optical pumping
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/09Processes or apparatus for excitation, e.g. pumping
    • H01S3/091Processes or apparatus for excitation, e.g. pumping using optical pumping
    • H01S3/0915Processes or apparatus for excitation, e.g. pumping using optical pumping by incoherent light
    • H01S3/0933Processes or apparatus for excitation, e.g. pumping using optical pumping by incoherent light of a semiconductor, e.g. light emitting diode
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/09Processes or apparatus for excitation, e.g. pumping
    • H01S3/091Processes or apparatus for excitation, e.g. pumping using optical pumping
    • H01S3/094Processes or apparatus for excitation, e.g. pumping using optical pumping by coherent light
    • H01S3/094003Processes or apparatus for excitation, e.g. pumping using optical pumping by coherent light the pumped medium being a fibre
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/09Processes or apparatus for excitation, e.g. pumping
    • H01S3/091Processes or apparatus for excitation, e.g. pumping using optical pumping
    • H01S3/094Processes or apparatus for excitation, e.g. pumping using optical pumping by coherent light
    • H01S3/0941Processes or apparatus for excitation, e.g. pumping using optical pumping by coherent light of a laser diode

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  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Semiconductor Lasers (AREA)
  • Lasers (AREA)

Abstract

A laser apparatus is provided, which comprises a housing, a laser crystal and at least two light bars. The housing has an annular or polygonal inner wall. The laser crystal is disposed in the housing, and located at or adjacent a center of the annular or polygonal inner wall of the housing. The light bars are disposed in the housing, and located at or adjacent to the annular or polygonal inner wall of the housing. The light bars are annularly or symmetrically arranged around the laser crystal, and irradiate light to the laser crystal to output a laser beam through the laser crystal, respectively.

Description

雷射裝置    Laser device   

本揭露係關於一種雷射裝置,特別是指一種具有複數呈環形或對稱排列之燈條或導光條之雷射裝置。 This disclosure relates to a laser device, and particularly to a laser device having a plurality of circular or symmetrically arranged light bars or light guide bars.

雷射在醫療方面之應用愈來愈廣泛,例如儀器掃描、手術、殺菌等,而手持式雷射裝置是未來發展之趨勢。然而,一般手持雷射裝置大多是由二節骨架所組成,不僅重量重會增加使用者之負擔,而且移動上也造成不便,再加上雷射擊發時,雷射晶體(共振腔)內需要高壓驅動,也是增加危險性之原因。 Lasers are becoming more and more widely used in medical applications, such as instrument scanning, surgery, and sterilization, and handheld laser devices are the future development trend. However, most hand-held laser devices are mostly composed of two-section skeletons. Not only the heavy weight will increase the burden on the user, but also cause inconvenience in movement. In addition, when the laser is fired, the laser crystal (resonant cavity) needs High-voltage drive is also the reason for increased danger.

目前雷射醫療設備中,手持式雷射裝置之架構通常是以閃光燈燈管作為雷射之汞浦源(pump source),並將閃光燈燈管與雷射晶體做平行排列,且利用側向激發之方式對雷射晶體進行照射,進而透過雷射晶體輸出雷射光束。 In the current laser medical equipment, the structure of a handheld laser device usually uses a flash lamp tube as a laser pump source, and arranges the flash lamp tube and the laser crystal in parallel, and uses lateral excitation. In this way, the laser crystal is irradiated, and the laser beam is output through the laser crystal.

詳言之,一般手持式雷射裝置之外觀是以二個活動骨架作90度連接,而雷射晶體(共振腔)則放在第二節骨架中,並透過二面反射鏡將雷射晶體所輸出之雷射光束傳導至第一節骨架。但是,因閃光燈燈管與雷射晶體(共振腔)為平行設置,再加上兩者均需要透過水溶液進行降溫,故手持 式雷射裝置之尺寸無法縮小,從而造成體積大且重量重。 In detail, the appearance of a general handheld laser device is 90 degrees connected by two movable skeletons, while the laser crystal (resonant cavity) is placed in the second section skeleton, and the laser crystal is transmitted through a two-sided mirror. The output laser beam is transmitted to the first section skeleton. However, because the flash lamp tube and the laser crystal (resonant cavity) are arranged in parallel, and both of them need to be cooled by an aqueous solution, the size of the handheld laser device cannot be reduced, resulting in a large volume and heavy weight.

再者,在閃光燈燈管之點亮上,因閃光燈燈管之二端電極需要數百伏特之高壓電源,故若電極與金屬互相接觸則會造成短路,或者長期使用閃光燈燈管後,二端電極外圍之絕緣皮也易老化脫落,此時手持式雷射裝置會充斥著高壓電源,進而危害到使用者之安全。 In addition, in the lighting of the flash tube, the two ends of the flash tube require a high-voltage power source of several hundred volts, so if the electrodes and metal contact each other, it will cause a short circuit, or after long-term use of the flash tube, The insulating skin around the electrodes is also easy to age and fall off. At this time, the handheld laser device will be flooded with high voltage power, which will endanger the safety of the user.

另外,以閃光燈燈管而言,閃光燈燈管之波長介於220至280奈米之間,且雷射晶體之吸收光譜相當的窄,在閃光燈燈管搭配雷射晶體下,容易造成過多的光轉化成熱源,導致雷射轉換效能難以提升。 In addition, with regard to flash lamp tubes, the wavelength of the flash lamp tube is between 220 and 280 nanometers, and the absorption spectrum of the laser crystal is quite narrow. When the flash lamp tube is matched with the laser crystal, it is easy to cause excessive light. Transformed into a heat source, making it difficult to improve laser conversion efficiency.

因此,如何解決上述習知技術之問題,實已成為本領域技術人員之一大課題。 Therefore, how to solve the problems of the conventional technology has become a major issue for those skilled in the art.

本揭露係提供一種雷射裝置,其可提升雷射晶體之接收照度或雷射光束之輸出效能。 This disclosure provides a laser device that can improve the receiving illuminance of a laser crystal or the output efficiency of a laser beam.

本揭露之一雷射裝置包括:一殼體,其具有一環形或多邊形之內壁;一雷射晶體,其設置於該殼體中,並位在或鄰近該殼體之該環形或多邊形之內壁之中心;以及至少二燈條,其設置於該殼體中,並位在或鄰近該殼體之該環形或多邊形之內壁,其中,該些燈條呈環形排列或對稱排列於該雷射晶體之周圍,並分別照射光線至該雷射晶體以通過該雷射晶體輸出一雷射光束。 A laser device disclosed in this disclosure includes: a casing having an inner wall of a ring shape or a polygon; and a laser crystal disposed in the casing and located at or adjacent to the ring or polygon of the case. The center of the inner wall; and at least two light bars disposed in the housing and located on or adjacent to the annular or polygonal inner wall of the housing, wherein the light bars are arranged circularly or symmetrically on the Around the laser crystal, irradiate light to the laser crystal to output a laser beam through the laser crystal.

本揭露之另一雷射裝置包括:一殼體,其具有一環形或多邊形之內壁;一雷射晶體,其設置於該殼體中,並位 在或鄰近該殼體之該環形或多邊形之內壁之中心;以及至少二導光條,其設置於該殼體中,並位在或鄰近該殼體之該環形或多邊形之內壁,其中,該些導光條呈環形排列或對稱排列於該雷射晶體之周圍,並分別照射光線至該雷射晶體以通過該雷射晶體輸出一雷射光束。 Another laser device disclosed in the present disclosure includes: a casing having an annular or polygonal inner wall; and a laser crystal disposed in the casing and located at or adjacent to the annular or polygon of the casing. The center of the inner wall of the inner wall; and at least two light guide strips, which are arranged in the housing and are located on or near the annular or polygonal inner wall of the housing, wherein the light guide bars are arranged in a circle or are symmetrical It is arranged around the laser crystal and irradiates light to the laser crystal to output a laser beam through the laser crystal.

由上可知,本揭露之雷射裝置中,主要是將複數燈條或導光條呈環形或對稱排列於雷射晶體之周圍,並分別照射光線至該雷射晶體以輸出一雷射光束,藉此提升該雷射晶體之接收照度、該雷射光束之轉換效能或輸出效能。 As can be seen from the above, in the laser device disclosed in the present disclosure, a plurality of light bars or light guide bars are arranged in a ring or symmetrically around the laser crystal, and the light is irradiated to the laser crystal to output a laser beam. Thereby, the receiving illuminance of the laser crystal, the conversion efficiency or the output efficiency of the laser beam are improved.

為讓本揭露之上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明。在以下描述內容中將部分闡述本揭露之額外特徵及優點,且此等特徵及優點將部分自所述描述內容顯而易見,或可藉由對本揭露之實踐習得。本揭露之特徵及優點借助於在申請專利範圍中特別指出的元件及組合來認識到並達到。應理解,前文一般描述與以下詳細描述兩者均僅為例示性及解釋性的,且不欲約束本揭露所主張之範圍。 In order to make the above-mentioned features and advantages of the disclosure more comprehensible, embodiments are exemplified below and described in detail with reference to the accompanying drawings. In the following description, additional features and advantages of the present disclosure will be partially explained, and these features and advantages will be partly obvious from the description, or can be acquired through practice of the present disclosure. The features and advantages of this disclosure are recognized and achieved by means of elements and combinations specifically pointed out in the scope of the patent application. It should be understood that both the foregoing general description and the following detailed description are merely exemplary and explanatory and are not intended to limit the scope of the present disclosure.

1、1a、1b‧‧‧雷射裝置 1, 1a, 1b ‧‧‧ laser device

2、20‧‧‧殼體 2, 20‧‧‧ shell

21‧‧‧內壁 21‧‧‧Inner wall

22‧‧‧中心 22‧‧‧ Center

23‧‧‧容置空間 23‧‧‧accommodation space

3‧‧‧雷射晶體 3‧‧‧laser crystal

30‧‧‧雷射光束 30‧‧‧laser beam

31‧‧‧第一端面 31‧‧‧first end

32‧‧‧第二端面 32‧‧‧Second end face

41‧‧‧第一薄膜 41‧‧‧first film

42‧‧‧第二薄膜 42‧‧‧Second film

5‧‧‧燈條 5‧‧‧ light bar

5a‧‧‧發光二極體 5a‧‧‧light-emitting diode

5b‧‧‧導光條 5b‧‧‧light guide

50‧‧‧光線 50‧‧‧ light

51‧‧‧承載部 51‧‧‧bearing department

52‧‧‧發光部 52‧‧‧Lighting Department

53‧‧‧斜面 53‧‧‧ bevel

54‧‧‧V型溝槽 54‧‧‧V-shaped groove

61‧‧‧汞浦光源 61‧‧‧ Mercury light source

62‧‧‧多芯光纖 62‧‧‧Multicore Fiber

71‧‧‧聚焦鏡 71‧‧‧ focusing lens

72‧‧‧反射鏡 72‧‧‧Reflector

73‧‧‧輸出端 73‧‧‧output

D‧‧‧方向 D‧‧‧ direction

α‧‧‧夾角 α‧‧‧ Angle

β、θ‧‧‧角度 β, θ‧‧‧ angle

第1A圖與第1B圖係分別繪示本揭露之雷射裝置於二個不同方向之剖視圖;第2A圖至第2F圖係分別繪示本揭露第1A圖之雷射裝置之各種不同態樣;第3A圖與第3B圖係分別繪示本揭露第一實施例之雷射裝置於二個不同方向之剖視圖; 第4A圖與第4B圖係分別繪示本揭露第二實施例之雷射裝置於二個不同方向之剖視圖;第5圖係繪示本揭露第4B圖之雷射裝置之部分放大圖;以及第6圖係繪示本揭露之雷射裝置與習知技術之手持式雷射裝置之比較表。 Figures 1A and 1B are sectional views of the laser device of the present disclosure in two different directions; Figures 2A to 2F are different views of the laser device of Figure 1A respectively. Figures 3A and 3B are sectional views of the laser device of the first embodiment of the disclosure in two different directions; Figures 4A and 4B respectively show the laser of the second embodiment of the disclosure; Sectional views of the device in two different directions; Figure 5 is a partial enlarged view of the laser device of Figure 4B of this disclosure; and Figure 6 is a hand-held laser of the disclosed laser device and conventional technology Comparison table of radio equipment.

以下藉由特定的具體實施形態說明本揭露之實施方式,熟悉此技術之人士可由本說明書所揭示之內容輕易地了解本揭露之其他優點與功效,亦可藉由其他不同的具體實施形態加以施行或應用。 The following describes the implementation of the disclosure through specific specific implementation forms. Those familiar with this technology can easily understand other advantages and effects of the disclosure from the content disclosed in this description, and can also be implemented by other different specific implementation forms. Or apply.

第1A圖與第1B圖係分別繪示本揭露之雷射裝置1於二個不同方向(如側向及正向)之剖視圖。如圖所示,該雷射裝置1可為手持式雷射裝置,並可為第3A圖至第3B圖之第一實施例之雷射裝置1a、或第4A圖至第4B圖之第二實施例之雷射裝置1b,但不以此為限。 FIG. 1A and FIG. 1B are sectional views of the laser device 1 of the present disclosure in two different directions (such as a lateral direction and a forward direction). As shown in the figure, the laser device 1 may be a handheld laser device, and may be the laser device 1a of the first embodiment shown in FIGS. 3A to 3B, or the second device of FIGS. 4A to 4B. The laser device 1b of the embodiment is not limited thereto.

如第1A圖與第1B圖所示,該雷射裝置1主要包括一殼體2、一雷射晶體3與至少二燈條5,例如第1A圖顯示六燈條5。該殼體2具有一環形或多邊形之內壁21。該環形可為圓形或橢圓形等,該多邊形可為四邊形、五邊形、六邊形或其他多邊形,請見第2A圖至第2F圖。 As shown in FIGS. 1A and 1B, the laser device 1 mainly includes a housing 2, a laser crystal 3, and at least two light bars 5. For example, FIG. 1A shows six light bars 5. The casing 2 has an annular or polygonal inner wall 21. The ring may be a circle or an ellipse, and the polygon may be a quadrangle, a pentagon, a hexagon, or other polygons. See FIGS. 2A to 2F.

該雷射晶體3設置於該殼體2中,並位在或鄰近該殼體2之該環形或多邊形之內壁21之中心22。該雷射晶體3可為雷射增益介質(laser gain medium)。該些燈條5設置於 該殼體2中,並位在或鄰近該殼體2之該環形或多邊形之內壁21。該些燈條5可呈環形排列或對稱排列於該雷射晶體3之周圍,並分別照射光線50至該雷射晶體3以激發該雷射晶體3輸出一雷射光束30。 The laser crystal 3 is disposed in the casing 2 and is located at or near the center 22 of the annular or polygonal inner wall 21 of the casing 2. The laser crystal 3 may be a laser gain medium. The light bars 5 are arranged in the casing 2 and are located on or adjacent to the annular or polygonal inner wall 21 of the casing 2. The light bars 5 may be arranged in a circle or symmetrically around the laser crystal 3, and irradiate light 50 to the laser crystal 3 to excite the laser crystal 3 to output a laser beam 30.

該殼體2可具有一容置空間23,且該容置空間23中可填充有冷卻液(圖未示),以藉由該冷卻液降低該雷射晶體3與該些燈條5之溫度。該冷卻液可為冷卻水或含有冷凝膠體之冷卻液。而且,該雷射裝置1可連接水循環系統(圖未示)至該殼體2之容置空間23中,以透過該水循環系光供給及循環該冷卻液。 The housing 2 may have an accommodating space 23, and the accommodating space 23 may be filled with a cooling liquid (not shown) to reduce the temperature of the laser crystal 3 and the light bars 5 by the cooling liquid. . The cooling liquid may be cooling water or a cooling liquid containing a cold gel. Moreover, the laser device 1 can be connected to a water circulation system (not shown) to the accommodating space 23 of the casing 2 to supply and circulate the cooling liquid through the water circulation system light.

該雷射裝置1可包括第一薄膜41與第二薄膜42。該第一薄膜41與與第二薄膜42分別形成於該雷射晶體3之相對之第一端面31與第二端面32上,且該第一薄膜41、雷射晶體3與第二薄膜42共同構成一共振腔。 The laser device 1 may include a first film 41 and a second film 42. The first thin film 41 and the second thin film 42 are formed on the first and second end faces 31 and 32 of the laser crystal 3, respectively, and the first thin film 41, the laser crystal 3, and the second thin film 42 are common. Form a resonant cavity.

該第一薄膜41可作為第一反射鏡,且該第一薄膜41具有全反射之940至990奈米(nm)之波長、與全反射之2650至3000奈米之波長。該第二薄膜42可作為第二反射鏡,且該第二薄膜42具有全反射之940至990奈米之波長、與部分反射之2650至3000奈米之波長。該第二薄膜42之該部分反射之反射率可為90%至99%,且該雷射晶體3可透過該第二薄膜42輸出該雷射光束30,但不以此為限。 The first film 41 can be used as a first mirror, and the first film 41 has a total reflection wavelength of 940 to 990 nanometers (nm) and a total reflection wavelength of 2650 to 3000 nanometers. The second film 42 can be used as a second reflector, and the second film 42 has a wavelength of 940 to 990 nm in total reflection and a wavelength of 2650 to 3000 nm in partial reflection. The reflectivity of the partial reflection of the second film 42 may be 90% to 99%, and the laser crystal 3 may output the laser beam 30 through the second film 42, but not limited thereto.

另外,該雷射裝置1可包括一殼體20、一聚焦鏡71、一反射鏡72與一輸出端73。該殼體20可結合至該殼體2,該聚焦鏡71位於該殼體20中並對應於該第二薄膜42,該 反射鏡72位於該殼體20中並對應於該聚焦鏡71,該輸出端73位於該殼體20外並對應於該反射鏡72。而且,該聚焦鏡71可將該雷射晶體3透過該第二薄膜42所輸出之該雷射光束30聚焦於該反射鏡72中,並由該反射鏡72將該聚焦鏡71所聚焦之該雷射光束30反射或輸出至該輸出端73外。 In addition, the laser device 1 may include a housing 20, a focusing mirror 71, a reflecting mirror 72 and an output end 73. The housing 20 may be coupled to the housing 2, the focusing mirror 71 is located in the housing 20 and corresponds to the second film 42, and the reflecting mirror 72 is located in the housing 20 and corresponds to the focusing mirror 71. The output end 73 is located outside the casing 20 and corresponds to the reflector 72. Moreover, the focusing lens 71 can focus the laser beam 30 output from the laser crystal 3 through the second film 42 into the reflecting mirror 72, and the reflecting mirror 72 can focus the focusing lens 71 The laser beam 30 is reflected or output outside the output terminal 73.

第2A圖至第2F圖係分別繪示本揭露第1A圖之雷射裝置1之各種不同態樣,且第2A圖至第2F圖之雷射裝置1可應用於第3A圖至第3B圖之雷射裝置1a與第4A圖至第4B圖之雷射裝置1b中。 Figures 2A to 2F show different aspects of the laser device 1 of Figure 1A, and the laser device 1 of Figures 2A to 2F can be applied to Figures 3A to 3B. The laser device 1a and the laser device 1b of FIGS. 4A to 4B are shown in FIG.

如第2A圖所示,該雷射裝置1之殼體2可具有一環形之內壁21,且該雷射裝置1可具有二燈條5。如第2B圖所示,該殼體2可具有一環形之內壁21,且該雷射裝置1可具有三燈條5。如第2C圖所示,該殼體2可具有一環形之內壁21,且該雷射裝置1可具有四燈條5。 As shown in FIG. 2A, the housing 2 of the laser device 1 may have a ring-shaped inner wall 21, and the laser device 1 may have two light bars 5. As shown in FIG. 2B, the housing 2 may have a ring-shaped inner wall 21, and the laser device 1 may have three light bars 5. As shown in FIG. 2C, the housing 2 may have a ring-shaped inner wall 21, and the laser device 1 may have four light bars 5.

又,如第2D圖所示,該殼體2可具有一環形之內壁21,且該雷射裝置1可具有五燈條5。如第2E圖所示,該殼體2可具有五邊形之內壁21,且該雷射裝置1可具有五燈條5。如第2F圖所示,該殼體2可具有六邊形之內壁21,且該雷射裝置1可具有六燈條5。 In addition, as shown in FIG. 2D, the casing 2 may have a ring-shaped inner wall 21, and the laser device 1 may have five light bars 5. As shown in FIG. 2E, the housing 2 may have a pentagonal inner wall 21, and the laser device 1 may have a five light bar 5. As shown in FIG. 2F, the housing 2 may have a hexagonal inner wall 21, and the laser device 1 may have a six light bar 5.

上述燈條5(或下列導光條5b)彼此間隔之角度θ可依運算式θ=360°/N±10%計算之,其中,N為該些燈條5之數量。以第2B圖為例,三燈條5彼此間隔之角度θ=360°/3±10%,也就是該角度θ可介於132度(即120度加12度)至 108度(即120度減12度)之間。 The angle θ between the light bars 5 (or the following light guide bars 5b) from each other can be calculated according to the calculation formula θ = 360 ° / N ± 10%, where N is the number of the light bars 5. Taking Figure 2B as an example, the angle between the three light bars 5 spaced from each other θ = 360 ° / 3 ± 10%, that is, the angle θ can be between 132 degrees (that is, 120 degrees plus 12 degrees) to 108 degrees (that is, 120 degrees Minus 12 degrees).

第3A圖與第3B圖係分別繪示本揭露第一實施例之雷射裝置1a於二個不同方向(如側向及正向)之剖視圖。如圖所示,上述第1A圖至第2F圖之各燈條5可為複數個發光二極體(LED)5a串接而成,或各燈條5可為複數個發光二極體(LED)5a排列而成,各燈條5亦可為一發光二極體(LED)燈管。該些發光二極體5a均可具有承載部51與發光部52,該些發光二極體5a之發光部52或LED燈管可產生該光線50以照射該雷射晶體3。 3A and 3B are sectional views of the laser device 1a according to the first embodiment of the disclosure in two different directions (such as a lateral direction and a forward direction). As shown in the figure, each of the light bars 5 in FIGS. 1A to 2F may be a plurality of light emitting diodes (LEDs) 5a connected in series, or each light bar 5 may be a plurality of light emitting diodes (LEDs) ) 5a is arranged, and each light bar 5 may also be a light emitting diode (LED) tube. Each of the light-emitting diodes 5 a can have a bearing portion 51 and a light-emitting portion 52. The light-emitting portion 52 or the LED tube of the light-emitting diodes 5 a can generate the light 50 to illuminate the laser crystal 3.

該些發光二極體5a之波長可介於950至980奈米之間,並高於習知技術之閃光燈燈管之波長(介於220至280奈米之間)。因此,本揭露以該些發光二極體5a搭配該雷射晶體3能減少該光線50轉換成熱源,並提升該光線50轉換成該雷射光束30之轉換效能。 The wavelength of the light-emitting diodes 5a can be between 950 and 980 nanometers, which is higher than the wavelength of the flash lamp tube of the conventional technology (between 220 and 280 nanometers). Therefore, the disclosure using the light emitting diodes 5a and the laser crystal 3 can reduce the conversion of the light 50 into a heat source, and improve the conversion efficiency of the light 50 into the laser beam 30.

第4A圖與第4B圖係分別繪示本揭露第二實施例之雷射裝置1b於二個不同方向(如側向及正向)之剖視圖,第5圖係繪示本揭露第4B圖之雷射裝置1b之部分放大圖。 4A and 4B are cross-sectional views of the laser device 1b of the second embodiment of the present disclosure in two different directions (such as lateral and forward), and FIG. 5 is a drawing of FIG. 4B of the present disclosure. An enlarged view of a part of the laser device 1b.

如第4A圖至第4B圖所示,雷射裝置1b可具有至少二導光條5b,如第4A圖顯示六導光條5b。該導光條5b可具有一斜面53與複數V型溝槽54,該斜面53面向或接觸該殼體2之該環形或多邊形之內壁21,且該些V型溝槽54面向該雷射晶體3。 As shown in FIG. 4A to FIG. 4B, the laser device 1b may have at least two light guide bars 5b. As shown in FIG. 4A, six light guide bars 5b are shown. The light guide strip 5 b may have an inclined surface 53 and a plurality of V-shaped grooves 54. The inclined surface 53 faces or contacts the annular or polygonal inner wall 21 of the housing 2, and the V-shaped grooves 54 face the laser. Crystal 3.

如第4B圖所示,該導光條5b之該些V型溝槽54可具有相同尺寸或相同角度β(見第5圖)。或者,如第5圖 所示,該導光條5b之該些V型溝槽54可依據方向D由疏至密或由大至小排列。 As shown in FIG. 4B, the V-shaped grooves 54 of the light guide strip 5 b may have the same size or the same angle β (see FIG. 5). Alternatively, as shown in FIG. 5, the V-shaped grooves 54 of the light guide strip 5 b may be arranged from sparse to dense or from large to small according to the direction D.

如第5圖所示,該導光條5b之該斜面53與該殼體2之該環形或多邊形之內壁21之間的夾角α可介於1度至20度,如1、5、10、15或20度。而且,該導光條5b之該些V型溝槽54之角度β可介於5度至85度之間,如20、40、60或80度。 As shown in FIG. 5, the angle α between the inclined surface 53 of the light guide strip 5b and the annular or polygonal inner wall 21 of the housing 2 may be between 1 degree and 20 degrees, such as 1, 5, 10 , 15 or 20 degrees. Moreover, the angle β of the V-shaped grooves 54 of the light guide strip 5b may be between 5 degrees and 85 degrees, such as 20, 40, 60, or 80 degrees.

如第4B圖至第5圖所示,該雷射裝置1b可包括一汞浦光源61與一多芯光纖62。該多芯光纖62分別連接該汞浦光源61與該些導光條5b,該汞浦光源61產生該光線50以通過該多芯光纖62傳導該光線50至該些導光條5b中,且該光線50依序透過該導光條5b之該斜面53與該些V型溝槽54照射至該雷射晶體3。 As shown in FIGS. 4B to 5, the laser device 1 b may include a mercury pump light source 61 and a multi-core optical fiber 62. The multi-core optical fiber 62 is respectively connected to the mercury light source 61 and the light guide bars 5b. The mercury light source 61 generates the light 50 to conduct the light 50 into the light guide bars 5b through the multi-core fiber 62. The light beam 50 passes through the inclined surface 53 and the V-shaped grooves 54 of the light guide strip 5 b in sequence and irradiates the laser crystal 3.

該汞浦光源61可為雷射二極體(Laser Diode,LD)。該雷射二極體之波長可介於965至980奈米之間,並高於習知技術之閃光燈燈管之波長(介於220至280奈米之間)。因此,本揭露以該雷射二極體61與該導光條5b搭配該雷射晶體3能減少該光線50轉換成熱源,並提升該光線50轉換成該雷射光束30之轉換效能。 The mercury pump light source 61 may be a laser diode (LD). The wavelength of the laser diode can be between 965 and 980 nanometers, which is higher than the wavelength of the conventional flash lamp tube (between 220 and 280 nanometers). Therefore, the disclosure using the laser diode 61 and the light guide bar 5b with the laser crystal 3 can reduce the conversion of the light 50 into a heat source, and improve the conversion efficiency of the light 50 into the laser beam 30.

第6圖係繪示本揭露第一實施例之雷射裝置1a、第二實施例之雷射裝置1b與習知技術之手持式雷射裝置之比較表。 FIG. 6 is a comparison table between the laser device 1a of the first embodiment, the laser device 1b of the second embodiment, and the hand-held laser device of the prior art.

如圖所示,經實際測量結果,在尺寸方面,上述習知技術之手持式雷射裝置中,殼體之內壁之直徑約3釐米; 反之,本揭露第一實施例之雷射裝置1a中,該殼體2之內壁21之直徑(以環形為例)約2.3釐米,而第二實施例之雷射裝置1b中,該殼體2之內壁21之直徑(以環形為例)約2釐米。因此,本揭露之雷射裝置1a(1b)之尺寸可小於習知技術之手持式雷射裝置之尺寸。 As shown in the figure, according to actual measurement results, in terms of size, in the handheld laser device of the above-mentioned conventional technology, the diameter of the inner wall of the casing is about 3 cm; on the contrary, the laser device 1a of the first embodiment of the present disclosure The diameter of the inner wall 21 of the casing 2 (taking the ring as an example) is about 2.3 cm, while in the laser device 1b of the second embodiment, the diameter of the inner wall 21 of the casing 2 (taking the ring as an example) About 2 cm. Therefore, the size of the laser device 1a (1b) disclosed in this disclosure may be smaller than the size of the handheld laser device of the conventional technology.

在重量方面,習知技術之手持式雷射裝置中,殼體、燈管、雷射晶體與水溶液總共約300公克;反之,本揭露第一實施例之雷射裝置1a中,該殼體2、發光二極體5a、雷射晶體3與容置空間23內之冷卻液總共約220公克,而第二實施例之雷射裝置1b中,該殼體2、導光條5b、雷射晶體3與容置空間23內之冷卻液總共約200公克。因此,本揭露之雷射裝置1a(1b)之重量可輕於習知技術之手持式雷射裝置之重量。 In terms of weight, in the conventional hand-held laser device, the housing, the lamp tube, the laser crystal and the aqueous solution total about 300 grams; on the contrary, in the laser device 1a of the first embodiment, the housing 2 , The light-emitting diode 5a, the laser crystal 3, and the coolant in the accommodating space 23 total about 220 grams, and in the laser device 1b of the second embodiment, the housing 2, the light guide bar 5b, and the laser crystal The total amount of the coolant in 3 and the accommodating space 23 is about 200 grams. Therefore, the weight of the laser device 1a (1b) disclosed in this disclosure can be lighter than the weight of the handheld laser device of the conventional technology.

在危險性方面,習知技術之手持式雷射裝置中,雷射晶體之二端電極有數百伏特電壓;反之,本揭露第一實施例之雷射裝置1a中,僅有該發光二極體5a之直流電壓(3至24伏特),而第二實施例之雷射裝置1b中,僅有多芯光纖62與導光條5b所傳導之光線50而無電壓。因此,本揭露之雷射裝置1a(1b)之危險性可低於習知技術之手持式雷射裝置之危險性。 In terms of danger, in the hand-held laser device of the conventional technology, the two terminal electrodes of the laser crystal have a voltage of hundreds of volts; on the contrary, in the laser device 1a of the first embodiment of the disclosure, only the light-emitting diode is used. The DC voltage (3 to 24 volts) of the body 5a, and in the laser device 1b of the second embodiment, there is only the light 50 transmitted by the multi-core optical fiber 62 and the light guide bar 5b without voltage. Therefore, the danger of the laser device 1a (1b) disclosed in this disclosure may be lower than the danger of the hand-held laser device of the conventional technology.

在接收照度方面,習知技術之手持式雷射裝置中,雷射晶體之接收照度約3600瓦/平方米(W/m2);反之,本揭露第一實施例之雷射裝置1a中,該雷射晶體3之接收照度約6000瓦/平方米(W/m2),而第二實施例之雷射裝置1b中, 該雷射晶體3之接收照度約7000瓦/平方米(W/m2)。因此,本揭露之雷射裝置1a(1b)之接收照度可高於習知技術之手持式雷射裝置之接收照度。 In terms of receiving illuminance, in the conventional handheld laser device, the receiving illuminance of the laser crystal is about 3600 watts per square meter (W / m 2 ). On the contrary, in the laser device 1a of the first embodiment of the present disclosure, The receiving illuminance of the laser crystal 3 is about 6000 W / m 2 (W / m 2 ), and in the laser device 1 b of the second embodiment, the receiving illuminance of the laser crystal 3 is about 7000 W / m 2 (W / m 2 ). Therefore, the receiving illuminance of the laser device 1a (1b) disclosed in this disclosure may be higher than the receiving illuminance of the handheld laser device of the conventional technology.

由上可知,本揭露之雷射裝置中,主要是將複數燈條或導光條呈環形或對稱排列於雷射晶體之周圍,並分別照射光線至該雷射晶體以輸出一雷射光束,藉此提升該雷射晶體之接收照度、該雷射光束之轉換效能或輸出效能。同時,由第6圖之比較表可知,本揭露之雷射裝置可具有較小之尺寸、較輕之重量、較低之危險性與較高之接收照度。 As can be seen from the above, in the laser device disclosed in the present disclosure, a plurality of light bars or light guide bars are arranged in a ring or symmetrically around the laser crystal, and the light is irradiated to the laser crystal to output a laser beam. Thereby, the receiving illuminance of the laser crystal, the conversion efficiency or the output efficiency of the laser beam are improved. At the same time, it can be seen from the comparison table in FIG. 6 that the laser device disclosed in the present disclosure can have a smaller size, a lighter weight, a lower risk, and a higher received illumination.

上述實施形態僅例示性說明本揭露之原理、特點及其功效,並非用以限制本揭露之可實施範疇,任何熟習此項技藝之人士均可在不違背本揭露之精神及範疇下,對上述實施形態進行修飾與改變。任何運用本揭露所揭示內容而完成之等效改變及修飾,均仍應為下述之申請專利範圍所涵蓋。因此,本揭露之權利保護範圍,應如申請專利範圍所列。 The above-mentioned embodiment merely illustrates the principle, characteristics, and effects of this disclosure by way of example, and is not intended to limit the scope of implementation of this disclosure. Anyone who is familiar with this technique can do the above without departing from the spirit and scope of this disclosure. Modifications and changes to the implementation form. Any equivalent changes and modifications made by using the content disclosed in this disclosure shall still be covered by the scope of patent application described below. Therefore, the scope of protection of the rights in this disclosure should be as listed in the scope of patent application.

Claims (17)

一種雷射裝置,包括:一殼體,其具有一環形或多邊形之內壁;一雷射晶體,其設置於該殼體中,並位在或鄰近該殼體之該環形或多邊形之內壁之中心;以及至少二燈條,其設置於該殼體中,並位在或鄰近該殼體之該環形或多邊形之內壁,其中,該些燈條呈環形排列或對稱排列於該雷射晶體之周圍,並分別照射光線至該雷射晶體以通過該雷射晶體輸出一雷射光束。     A laser device includes: a casing having an annular or polygonal inner wall; and a laser crystal disposed in the casing and located at or adjacent to the annular or polygonal inner wall of the casing And at least two light bars disposed in the housing and located on or adjacent to the inner wall of the ring or polygon of the housing, wherein the light bars are arranged circularly or symmetrically on the laser Around the crystal, light is irradiated to the laser crystal to output a laser beam through the laser crystal.     如申請專利範圍第1項所述之雷射裝置,其中,該殼體更具有一容置空間,且該容置空間中填充有冷卻液,以藉由該冷卻液降低該雷射晶體與該些燈條之溫度。     The laser device according to item 1 of the scope of patent application, wherein the housing further has a containing space, and the containing space is filled with a cooling liquid to reduce the laser crystal and the The temperature of these light bars.     如申請專利範圍第1項所述之雷射裝置,更包括第一薄膜與第二薄膜,其分別形成於該雷射晶體之相對之第一端面與第二端面上,且該第一薄膜、雷射晶體與第二薄膜共同構成一共振腔。     The laser device according to item 1 of the patent application scope further includes a first thin film and a second thin film, which are respectively formed on the first and second end faces of the laser crystal, and the first thin film, The laser crystal and the second film together form a resonant cavity.     如申請專利範圍第3項所述之雷射裝置,其中,該第一薄膜作為第一反射鏡,且該第一薄膜具有全反射之940至990奈米之波長、與全反射之2650至3000奈米之波長。     The laser device according to item 3 of the scope of patent application, wherein the first film serves as a first reflector, and the first film has a total reflection wavelength of 940 to 990 nm, and a total reflection of 2650 to 3000. The wavelength of nanometers.     如申請專利範圍第3項所述之雷射裝置,其中,該第二薄膜作為第二反射鏡,且該第二薄膜具有全反射之 940至990奈米之波長、與部分反射之2650至3000奈米之波長。     The laser device according to item 3 of the scope of patent application, wherein the second film serves as a second reflector, and the second film has a total reflection wavelength of 940 to 990 nm, and a partial reflection of 2650 to 3000. The wavelength of nanometers.     如申請專利範圍第5項所述之雷射裝置,其中,該第二薄膜之該部分反射之反射率為90%至99%,且該雷射晶體透過該第二薄膜輸出該雷射光束。     The laser device according to item 5 of the scope of the patent application, wherein the part of the second film has a reflectivity of 90% to 99%, and the laser crystal outputs the laser beam through the second film.     如申請專利範圍第1項所述之雷射裝置,其中,該些燈條彼此間隔之角度θ依下列運算式計算之:θ=360°/N±10%,N為該些燈條之數量。     The laser device according to item 1 of the scope of patent application, wherein the angle θ between the light bars is calculated according to the following formula: θ = 360 ° / N ± 10%, N is the number of the light bars .     如申請專利範圍第1項所述之雷射裝置,其中,各該燈條為複數發光二極體串接或排列而成,且該些發光二極體產生該光線以照射該雷射晶體。     The laser device according to item 1 of the scope of patent application, wherein each of the light bars is formed by connecting or arranging a plurality of light emitting diodes in series, and the light emitting diodes generate the light to illuminate the laser crystal.     如申請專利範圍第8項所述之雷射裝置,其中,該些發光二極體之波長介於950至980奈米之間。     The laser device according to item 8 of the scope of patent application, wherein the wavelengths of the light-emitting diodes are between 950 and 980 nm.     如申請專利範圍第1項所述之雷射裝置,其中,各該燈條為一發光二極體燈管,且該些發光二極體燈管產生該光線以照射該雷射晶體。     The laser device according to item 1 of the scope of the patent application, wherein each of the light bars is a light emitting diode tube, and the light emitting diode tubes generate the light to illuminate the laser crystal.     一種雷射裝置,包括:一殼體,其具有一環形或多邊形之內壁;一雷射晶體,其設置於該殼體中,並位在或鄰近該殼體之該環形或多邊形之內壁之中心;以及至少二導光條,其設置於該殼體中,並位在或鄰近該殼體之該環形或多邊形之內壁,其中,該些導光條呈環形排列或對稱排列於該雷射晶體之周圍,並分別照射光線至該雷射晶體以通過 該雷射晶體輸出一雷射光束。     A laser device includes: a casing having an annular or polygonal inner wall; and a laser crystal disposed in the casing and located at or adjacent to the annular or polygonal inner wall of the casing The center of the light guide; and at least two light guide strips, which are arranged in the housing and are located on or adjacent to the inner wall of the ring or polygon, wherein the light guide bars are arranged in a ring or symmetrically Around the laser crystal, irradiate light to the laser crystal to output a laser beam through the laser crystal.     如申請專利範圍第11項所述之雷射裝置,其中,該導光條具有一斜面與複數V型溝槽,該斜面面向或接觸該殼體之該環形或多邊形之內壁,且該些V型溝槽面向該雷射晶體。     The laser device according to item 11 of the scope of patent application, wherein the light guide bar has an inclined surface and a plurality of V-shaped grooves, the inclined surface faces or contacts the inner wall of the ring or polygon of the housing, and the The V-shaped groove faces the laser crystal.     如申請專利範圍第12項所述之雷射裝置,其中,該導光條之該斜面與該殼體之該環形或多邊形之內壁之間的夾角介於1度至20度。     The laser device according to item 12 of the scope of patent application, wherein an included angle between the inclined surface of the light guide bar and the inner wall of the ring or polygon of the housing is between 1 degree and 20 degrees.     如申請專利範圍第12項所述之雷射裝置,其中,該導光條之該些V型溝槽之角度介於5度至85度之間。     The laser device according to item 12 of the scope of patent application, wherein the angles of the V-shaped grooves of the light guide bar are between 5 degrees and 85 degrees.     如申請專利範圍第12項所述之雷射裝置,其中,該導光條之該些V型溝槽具有相同尺寸或由疏至密排列。     The laser device according to item 12 of the scope of the patent application, wherein the V-shaped grooves of the light guide bar have the same size or are arranged from sparse to dense.     如申請專利範圍第11項所述之雷射裝置,更包括一汞浦光源與一多芯光纖,該多芯光纖分別連接該汞浦光源與該些導光條,該汞浦光源產生該光線以通過該多芯光纖傳導該光線至該些導光條中,且該光線依序透過該導光條之該斜面與該些V型溝槽照射至該雷射晶體。     The laser device according to item 11 of the scope of patent application, further comprising a mercury pump light source and a multi-core optical fiber, the multi-core fiber is connected to the mercury pump light source and the light guide strips respectively, and the mercury pump light source generates the light The light is transmitted to the light guide bars through the multi-core optical fiber, and the light sequentially shines through the inclined surface of the light guide bar and the V-shaped grooves to the laser crystal.     如申請專利範圍第16項所述之雷射裝置,其中,該汞浦光源為雷射二極體,且該雷射二極體之波長介於965至980奈米之間。     The laser device according to item 16 of the patent application scope, wherein the mercury pump light source is a laser diode, and the wavelength of the laser diode is between 965 and 980 nm.    
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