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TW201738963A - Heat treatment device capable of uniformly carrying out temperature change of the processed article even when the temperature control conditions are changed - Google Patents

Heat treatment device capable of uniformly carrying out temperature change of the processed article even when the temperature control conditions are changed Download PDF

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TW201738963A
TW201738963A TW106109550A TW106109550A TW201738963A TW 201738963 A TW201738963 A TW 201738963A TW 106109550 A TW106109550 A TW 106109550A TW 106109550 A TW106109550 A TW 106109550A TW 201738963 A TW201738963 A TW 201738963A
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sub
damper
container
chamber
valve
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TW106109550A
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TWI781096B (en
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Yorihiko Wada
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Koyo Thermo Systems Co Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67098Apparatus for thermal treatment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67098Apparatus for thermal treatment
    • H01L21/67109Apparatus for thermal treatment mainly by convection
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67248Temperature monitoring

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Furnace Details (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Waste-Gas Treatment And Other Accessory Devices For Furnaces (AREA)
  • Muffle Furnaces And Rotary Kilns (AREA)
  • Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)

Abstract

The invention provides a heat treatment device capable of uniformly carrying out temperature change of the processed article even when the temperature control conditions are changed, and capable of automatically performing tuning operation for temperature change of the processed article. The heat treatment device 1 includes a chamber 4 for accommodating the processed article 100; a medium supply unit 7 including a reference damper 32 and sub-dampers 31 and 33 that supply the cooling air to the chamber 4; and a control section 18 that controls the supply mode of the cooling air by the sub-dampers 31 and 33 based on the supply mode for the reference damper 32 supplying the cooling air.

Description

熱處理裝置 Heat treatment device

本發明關於一種熱處理裝置。 The present invention relates to a heat treatment apparatus.

已知用於對半導體基板等被處理物進行熱處理的熱處理裝置(例如,參照下述的文獻1)。作為熱處理裝置的一例,文獻1所記載的熱處理裝置具有:被隔熱件包圍的加熱器;及被加熱器包圍的石英管。另外,連接有貫通隔熱件的管,在該管上連接有送風機。 A heat treatment apparatus for heat-treating a workpiece such as a semiconductor substrate is known (for example, refer to Document 1 below). As an example of the heat treatment apparatus, the heat treatment apparatus described in Document 1 includes a heater surrounded by a heat insulator and a quartz tube surrounded by a heater. Further, a pipe penetrating the heat insulator is connected, and a blower is connected to the pipe.

在藉由加熱器的加熱對石英管內的被處理物進行熱處理後,使送風機運作,從而將冷卻空氣導入石英管。藉此,石英管和被處理物被冷卻。此時,控制送風機的控制部對加熱器的輸出和送風機的風量進行控制,以使石英管的實際溫度與目標溫度的偏差為零。如此,已知在石英管的強制冷卻中使用送風機的結構。 After heat-treating the object to be treated in the quartz tube by heating of the heater, the blower is operated to introduce the cooling air into the quartz tube. Thereby, the quartz tube and the object to be treated are cooled. At this time, the control unit that controls the blower controls the output of the heater and the air volume of the blower so that the deviation between the actual temperature of the quartz tube and the target temperature is zero. Thus, a structure in which a blower is used in forced cooling of a quartz tube is known.

[專利文獻1]日本專利特開平1-282619號公報 [Patent Document 1] Japanese Patent Laid-Open No.1-282619

另外,在使用送風機對石英管等容器進行強制冷卻的結構中,可以考慮使用複數個阻尼器的結構。例如,在該結構中,與送風機連接的配管具有分支成複數個的分支管。並且,在各分支 管上連接有阻尼器。複數個阻尼器將來自送風機的冷卻空氣供給至例如沿著容器的長度方向的複數個部位。各阻尼器例如藉由作業員的手動操作來調整開度。並且,冷卻空氣從送風機穿過對應的阻尼器後,與容器接觸,從而對該容器進行冷卻。為了使容器的冷卻速度在該容器的各部盡可能地均等,作業員係手動調整各阻尼器的開度。 Further, in a configuration in which a blower is used to forcibly cool a container such as a quartz tube, a configuration in which a plurality of dampers are used can be considered. For example, in this configuration, the pipe connected to the blower has a branch pipe branched into a plurality of branches. And, in each branch A damper is connected to the tube. A plurality of dampers supply cooling air from the blower to, for example, a plurality of locations along the length of the container. Each damper adjusts the opening degree by, for example, manual operation by an operator. And, after the cooling air passes through the corresponding damper from the blower, it comes into contact with the container, thereby cooling the container. In order to make the cooling rate of the container as equal as possible in each part of the container, the operator manually adjusts the opening degree of each damper.

另一方面,在容器內進行熱處理的被處理物的內容和數量不一定每次都相同。即,容器內的被處理物的合計的熱容量不一定每次都相同。另外,容器(被處理物)的目標冷卻溫度和冷卻區域也不一定每次都相同。另外,驅動送風機的送風機馬達的頻率(例如,送風機馬達的轉速)也存在根據電源的條件而不同的情況。如此,在產生了冷卻條件的差異的情況下,如果不調整各阻尼器的開度,則容器的各部的冷卻速度會產生偏差。 On the other hand, the content and the number of the objects to be processed which are heat-treated in the container are not necessarily the same every time. That is, the total heat capacity of the objects to be processed in the container is not always the same every time. In addition, the target cooling temperature and the cooling area of the container (object to be treated) are not necessarily the same every time. Further, the frequency of the blower motor that drives the blower (for example, the rotational speed of the blower motor) may be different depending on the conditions of the power supply. As described above, when the difference in the cooling conditions is generated, if the opening degree of each damper is not adjusted, the cooling rate of each portion of the container varies.

另一方面,從進行均勻的熱處理的觀點出發,較佳為,與冷卻條件的差異無關地使容器和複數個被處理物的整體盡可能均等地冷卻。因此,作業員對應於冷卻條件藉由手動作業來調整各阻尼器的開度。藉此,從各阻尼器與容器接觸的冷卻空氣的流量被調整,實現了容器和被處理物的更均等的冷卻。 On the other hand, from the viewpoint of performing uniform heat treatment, it is preferred to cool the entire container and the plurality of objects to be processed as uniformly as possible regardless of the difference in cooling conditions. Therefore, the operator adjusts the opening degree of each damper by manual work in accordance with the cooling condition. Thereby, the flow rate of the cooling air which is in contact with the container from each damper is adjusted, and more uniform cooling of the container and the workpiece is achieved.

如此,對於藉由手動作業來進行各阻尼器的開度調整作業的結構來說,較佳為實現自動的調整作業。 As described above, it is preferable to realize an automatic adjustment work for the configuration in which the opening degree adjustment operation of each damper is performed by manual work.

本發明鑒於上述情況,目的在於提供如下的熱處理裝置:即使在溫度控制條件發生了變化的情況下,也能夠使被處理物更均等地進行溫度變化,並且,能夠自動地進行用於使被處理物更均等地進行溫度變化的調整作業。 In view of the above, it is an object of the present invention to provide a heat treatment apparatus capable of more uniformly changing a temperature of a workpiece even when temperature control conditions are changed, and automatically performing processing for processing The material is more uniformly adjusted for temperature changes.

(1)為了解決上述課題,本發明的一個方面的熱處理裝置具備:容器,其在被處理物的熱處理時收納上述被處理物;介質供給部,其包括用於將溫度調整用的介質供給至上述容器的基準閥和副閥;以及控制部,其以上述基準閥供給上述介質的供給形態為基準,控制上述副閥供給上述介質的供給形態。 (1) In order to solve the above problems, a heat treatment apparatus according to an aspect of the present invention includes a container that stores the processed object during heat treatment of the workpiece, and a medium supply unit that supplies the medium for temperature adjustment to The reference valve and the sub-valve of the container; and a control unit that controls a supply form of the sub-valve to supply the medium based on a supply mode in which the reference valve supplies the medium.

根據該結構,利用控制部來控制副閥供給介質的供給形態。藉此,能夠在被處理物的溫度控制條件發生了變化的情況下變更副閥供給介質的供給形態。其結果是,即使在被處理物的溫度控制條件發生了變化的情況下,也能夠使被處理物更均等地冷卻。另外,以基準閥供給介質的供給形態為基準來控制副閥供給介質的供給形態的結果是,能夠更加可靠地抑制副閥的控制運算發散。從而,實現了對被處理物的更正確的溫度控制。另外,由於副閥被控制部控制,因此不需要人力對副閥的調整作業。根據以上的情況,根據本發明,能夠實現如下的熱處理裝置:即使在溫度控制條件發生了變化的情況下,也能夠使被處理物更均等地進行溫度變化,並且能夠自動地進行用於使被處理物更均等地發生溫度變化的調整作業。 According to this configuration, the supply unit of the sub valve supply medium is controlled by the control unit. Thereby, the supply form of the sub valve supply medium can be changed when the temperature control condition of the workpiece changes. As a result, even when the temperature control condition of the workpiece changes, the workpiece can be more uniformly cooled. In addition, as a result of controlling the supply form of the sub valve supply medium based on the supply form of the reference valve supply medium, it is possible to more reliably suppress the control calculation and divergence of the sub valve. Thereby, more accurate temperature control of the object to be processed is achieved. Further, since the sub valve is controlled by the control unit, it is not necessary to adjust the work of the sub valve by human power. According to the above, according to the present invention, it is possible to realize a heat treatment apparatus that can change the temperature of the workpiece more uniformly even when the temperature control condition is changed, and can automatically perform the method for making the object The treatment of the temperature change is more evenly performed.

(2)存在這樣的情況:上述控制部以上述基準閥的開度固定的狀態為基準,來控制上述副閥的開度。 (2) The control unit controls the opening degree of the sub valve based on the state in which the opening degree of the reference valve is fixed.

根據該結構,控制部在副閥的開度控制中無需變更基準閥的開度,結果是,能夠使副閥的控制所需要的運算更加簡化。另外,在副閥的開度控制中,能夠更加可靠地抑制產生振盪。 According to this configuration, the control unit does not need to change the opening degree of the reference valve in the opening degree control of the sub valve, and as a result, the calculation required for the control of the sub valve can be simplified. Further, in the opening degree control of the sub valve, it is possible to more reliably suppress the occurrence of oscillation.

(3)存在這樣的情況:上述控制部構成為:以上述容器 中被從上述基準閥供給上述介質的部位處的溫度為基準,控制從上述副閥向上述容器供給的上述介質的流量。 (3) There is a case where the control unit is configured to: The flow rate of the medium supplied from the sub valve to the container is controlled based on the temperature at the portion where the medium is supplied from the reference valve.

根據該結構,能夠使因從副閥供給至容器的介質而引起的容器的溫度變化程度與因從基準閥供給至容器的介質而引起的容器的溫度變化程度更加均等。 According to this configuration, the degree of temperature change of the container due to the medium supplied from the sub valve to the container can be made more uniform with the degree of temperature change of the container due to the medium supplied from the reference valve to the container.

(4)存在這樣的情況:上述控制部控制上述副閥的開度,以使上述容器中被從上述基準閥供給上述介質的部位處的溫度、和上述容器中的被從上述副閥供給上述介質的部位處的溫度之偏差減小。 (4) The control unit controls the opening degree of the sub-valve such that the temperature of the container from the portion where the medium is supplied from the reference valve and the above-mentioned container are supplied from the sub-valve The deviation in temperature at the location of the medium is reduced.

根據該結構,控制部能夠控制副閥,以使容器中被從基準閥供給上述介質的部位處的溫度和容器中被從副閥供給介質的部位處的溫度更加均等。 According to this configuration, the control unit can control the sub valve such that the temperature in the container at the portion where the medium is supplied from the reference valve and the temperature at the portion of the container from the sub valve supply medium are more uniform.

(5)存在這樣的情況:上述副閥設置有複數個,上述控制部控制各上述副閥,以使一個上述副閥和其他上述副閥進行不同的動作。 (5) There is a case where the plurality of sub-valves are provided, and the control unit controls each of the sub-valves so that one of the sub-valves and the other sub-valves perform different operations.

根據該結構,藉由複數個副閥的動作,能夠使容器的更廣的區域均等地發生溫度變化。另外,能夠對容器的各區域更加細微地進行溫度控制。 According to this configuration, the temperature of the wider area of the container can be uniformly changed by the operation of the plurality of sub-valves. In addition, it is possible to perform temperature control more finely on each area of the container.

(6)存在這樣的情況:上述控制部構成為採用比例控制來控制各上述副閥,上述控制部將一個上述副閥的控制增益和其他上述副閥的控制增益設定為不同的值。 (6) The control unit is configured to control each of the sub-valves by proportional control, and the control unit sets the control gain of one of the sub-valves and the control gain of the other sub-valves to different values.

根據該結構,一個上述副閥能夠進一步提高用於實現目標的介質供給形態的回應速度。另一方面,其他上述副閥能夠進一步降低用於實現目標的介質供給形態的回應速度。如此,藉由將 針對目標的回應速度不同的副閥組合在一起,能夠使容易發生熱的偏差的容器發生更均等的溫度變化。 According to this configuration, one of the above-described sub-valves can further increase the response speed of the medium supply form for achieving the target. On the other hand, the other sub-valves described above can further reduce the response speed of the medium supply form for achieving the target. So by The combination of the sub-valves having different response speeds of the target enables a more uniform temperature change in the container which is prone to heat deviation.

(7)存在這樣的情況:上述介質是用於冷卻上述容器的冷卻介質,從一個上述副閥向上述容器供給上述冷卻介質的位置,係被設定成比從其他上述副閥向上述容器供給上述冷卻介質的位置高,上述控制部將針對一個上述副閥的上述控制增益設定成比針對其他上述副閥的上述控制增益大。 (7) The medium is a cooling medium for cooling the container, and the position at which the cooling medium is supplied from the one of the sub-valves to the container is set to be supplied to the container from the other sub-valve. The control unit has a high control position, and the control unit sets the control gain for one of the sub-valves to be larger than the control gain for the other sub-valves.

根據該結構,由於容器的熱朝向上方,因此存在這樣的傾向:容器的上部的熱量比容器的下部的熱量大。因此,藉由使對容器的上部側進行冷卻的一個副閥的控制增益更大,能夠朝向容器的上部側更迅速地供給更多的介質。藉此,能夠更加可靠地冷卻容易積存熱量的容器的上部側。另一方面,藉由使對容器的下部側進行冷卻的其他副閥的控制增益更小,能夠抑制朝向容器的下部側急劇地供給過度的介質。藉此,能夠抑制熱比較容易逃逸的容器的下部側比容器的其它部分先被冷卻。其結果是,容器的各部被更均等地冷卻。 According to this configuration, since the heat of the container faces upward, there is a tendency that the heat of the upper portion of the container is larger than the heat of the lower portion of the container. Therefore, by making the control gain of one of the sub-valves that cool the upper side of the container larger, more medium can be supplied more quickly toward the upper side of the container. Thereby, the upper side of the container which is easy to accumulate heat can be cooled more reliably. On the other hand, by making the control gain of the other sub-valve that cools the lower side of the container smaller, it is possible to suppress the excessive supply of the excessive medium toward the lower side of the container. Thereby, the lower side of the container which can suppress the heat from being easily escaped is cooled first than the other part of the container. As a result, the parts of the container are more evenly cooled.

(8)存在這樣的情況:上述容器包括:向上述容器的外部敞開的開口部、及相對於上述容器的外部被封閉的形狀的裡部,上述介質是用於冷卻上述容器的冷卻介質,從一個上述副閥向上述容器供給上述冷卻介質的位置被設定成靠上述開口部和上述裡部中的上述裡部,並且,從其他上述副閥向上述容器供給上述冷卻介質的位置被設定成靠上述開口部和上述裡部中的上述開口部,上述控制部將針對一個上述副閥的上述控制增益設定成比針對其他上述副閥的上述控制增益大。 (8) There is a case where the container includes an opening that is open to the outside of the container and a inner portion that is closed with respect to the outside of the container, and the medium is a cooling medium for cooling the container. A position at which the sub-valve supplies the cooling medium to the container is set to be closer to the inner portion of the opening portion and the inner portion, and a position at which the cooling medium is supplied from the other sub-valve to the container is set to be In the opening portion and the opening portion in the inner portion, the control portion sets the control gain for one of the sub valves to be larger than the control gain for the other sub valve.

根據該結構,容器的熱容易積存在裡部,因此存在容器的裡部的熱量比容器的開口部的熱量大的傾向。因此,藉由使對容器的裡部側進行冷卻的一個副閥的控制增益更大,而能夠朝向容器的裡部側更迅速地供給更多的介質。藉此,能夠更加可靠地冷卻容易積存熱量的容器的裡部側。另一方面,藉由使對容器的開口部側進行冷卻的其他副閥的控制增益更小,而能夠抑制朝向容器的開口部側急劇地供給過度的介質。藉此,能夠抑制熱比較容易逃逸的容器的開口部側比容器的其它部分先被冷卻之情形。其結果是,容器的各部被更均等地冷卻。 According to this configuration, since the heat of the container is likely to accumulate in the inner portion, the heat in the inner portion of the container tends to be larger than the heat in the opening portion of the container. Therefore, by making the control gain of one of the sub-valves that cool the inner side of the container larger, it is possible to supply more medium more quickly toward the inner side of the container. Thereby, it is possible to more reliably cool the inner side of the container in which heat is easily accumulated. On the other hand, by making the control gain of the other sub-valve that cools the opening side of the container smaller, it is possible to suppress the supply of an excessive medium to the opening side of the container. Thereby, it is possible to suppress the case where the opening side of the container which is relatively easy to escape from heat is cooled before the other part of the container. As a result, the parts of the container are more evenly cooled.

(9)存在這樣的情況:上述副閥設置有複數個,來自上述基準閥的上述介質的出口位置被設定於來自各上述副閥的上述介質的出口位置之間。 (9) There is a case where the plurality of sub-valves are provided, and an exit position of the medium from the reference valve is set between the exit positions of the mediums from the sub-valves.

根據該結構,能夠藉由複數個閥並利用介質使容器的更廣的區域更均等地進行溫度變化。另外,對於容器中的被供給來自基準閥的介質的部位以外的區域,能夠進一步增大其配置在被供給來自基準閥的介質的部位附近的比例。其結果是,對於容器的更廣的區域,能夠減小與被供給來自基準閥的介質的部位之間的溫度差。 According to this configuration, it is possible to change the temperature of the wider area of the container more uniformly by the plurality of valves by using the medium. Further, in a region other than the portion of the container to which the medium from the reference valve is supplied, the ratio of the vicinity of the portion to which the medium from the reference valve is supplied can be further increased. As a result, the temperature difference between the portion to which the medium from the reference valve is supplied can be reduced for a wider area of the container.

根據本發明,能夠實現如下的熱處理裝置:即使在溫度控制條件發生了變化的情況下,也能夠使被處理物更均等地進行溫度變化,並且能夠自動地進行用於使被處理物更均等地發生溫度變化的調整作業。 According to the present invention, it is possible to realize a heat treatment apparatus that can change the temperature of the workpiece more uniformly even when the temperature control condition is changed, and can automatically perform the apparatus for equalizing the workpiece more uniformly. Adjustment work for temperature changes.

1‧‧‧熱處理裝置 1‧‧‧ Heat treatment unit

2‧‧‧基座板 2‧‧‧Base plate

2a‧‧‧貫通孔 2a‧‧‧through holes

3‧‧‧加熱器 3‧‧‧heater

3a‧‧‧側壁 3a‧‧‧ Sidewall

3b‧‧‧頂壁 3b‧‧‧ top wall

4‧‧‧腔室(容器) 4‧‧‧Case (container)

4a‧‧‧上部 4a‧‧‧ upper

4b‧‧‧中間部 4b‧‧‧Intermediate

4c‧‧‧下部 4c‧‧‧ lower

4d‧‧‧開口部 4d‧‧‧ openings

4e‧‧‧裡部 4e‧‧‧Li

5‧‧‧晶舟 5‧‧‧The boat

6‧‧‧升降機構 6‧‧‧ Lifting mechanism

7‧‧‧介質供給部 7‧‧‧Media Supply Department

8‧‧‧凸緣 8‧‧‧Flange

10‧‧‧空間 10‧‧‧ space

11‧‧‧送風機單元 11‧‧‧Air blower unit

12‧‧‧供給管 12‧‧‧Supply tube

13‧‧‧歧管 13‧‧‧Management

14‧‧‧阻尼器單元 14‧‧‧damper unit

15‧‧‧排氣管 15‧‧‧Exhaust pipe

16‧‧‧排氣冷卻器 16‧‧‧Exhaust cooler

17‧‧‧感測器單元 17‧‧‧Sensor unit

18‧‧‧控制部 18‧‧‧Control Department

21‧‧‧送風機 21‧‧‧Air blower

22‧‧‧送風機馬達 22‧‧‧Air blower motor

30‧‧‧阻尼器 30‧‧‧ damper

31‧‧‧第1副阻尼器(副閥;一個副閥) 31‧‧‧1st secondary damper (sub-valve; one sub-valve)

32‧‧‧基準阻尼器(基準閥) 32‧‧‧Base damper (reference valve)

33‧‧‧第2副阻尼器(副閥;其他副閥) 33‧‧‧2nd secondary damper (sub-valve; other secondary valves)

41‧‧‧入口管 41‧‧‧Inlet pipe

42‧‧‧閥箱 42‧‧‧Valve

43‧‧‧支承軸 43‧‧‧Support shaft

44‧‧‧閥體 44‧‧‧ valve body

45‧‧‧阻尼器馬達 45‧‧‧damper motor

46、47‧‧‧出口管 46, 47‧‧‧ export pipe

48‧‧‧馬達殼 48‧‧‧ motor casing

49‧‧‧輸出軸 49‧‧‧ Output shaft

51~53‧‧‧溫度感測器 51~53‧‧‧temperature sensor

100‧‧‧被處理物 100‧‧‧Processed objects

A1‧‧‧(冷卻空氣的)氣流 A1‧‧‧ (cooling air) airflow

kp1、kp2‧‧‧控制增益 Kp1, kp2‧‧‧ control gain

P1‧‧‧全閉位置 P1‧‧‧ Fully closed position

P2‧‧‧全開位置 P2‧‧‧ Fully open position

T1‧‧‧腔室上部溫度(容器中的被從副閥供給介質的部位處 的溫度) T1‧‧‧ Upper chamber temperature (in the container where the medium is supplied from the secondary valve) temperature)

T2‧‧‧腔室中間部溫度(容器中的被從基準閥供給介質的部位處的溫度) T2‧‧‧The temperature in the middle of the chamber (the temperature in the container where the medium is supplied from the reference valve)

T3‧‧‧腔室下部溫度(容器中的被從副閥供給介質的部位處的溫度) T3‧‧‧ Lower chamber temperature (temperature in the container where the medium is supplied from the sub-valve)

T1t、T3t、Tft‧‧‧目標溫度 T1t, T3t, Tft‧‧‧ target temperature

圖1是以截面顯示本發明的一個實施形態的熱處理裝置的一部分的示意圖,顯示從側方觀察熱處理裝置的狀態。 Fig. 1 is a schematic view showing a part of a heat treatment apparatus according to an embodiment of the present invention in a cross section, showing a state in which the heat treatment apparatus is viewed from the side.

圖2是將圖1的熱處理裝置的主要部分放大顯示的圖。 Fig. 2 is an enlarged view of a main part of the heat treatment apparatus of Fig. 1;

圖3是在熱處理裝置的冷媒供給部中設置的阻尼器的剖視圖,顯示從側方觀察阻尼器的狀態。 3 is a cross-sectional view of the damper provided in the refrigerant supply portion of the heat treatment apparatus, showing a state in which the damper is viewed from the side.

圖4是用於說明熱處理裝置中的冷卻動作的一例的流程圖。 4 is a flow chart for explaining an example of a cooling operation in the heat treatment apparatus.

以下參照附圖對用於實施本發明的形態進行說明。並且,本發明能夠作為用於對被處理物進行熱處理的熱處理裝置來廣泛應用。 The form for carrying out the invention will be described below with reference to the drawings. Further, the present invention can be widely applied as a heat treatment apparatus for heat-treating a workpiece.

圖1是以截面顯示本發明的一個實施形態的熱處理裝置1的一部分的示意圖,顯示從側方觀察熱處理裝置1的狀態。圖2是將圖1的熱處理裝置1的主要部分放大後顯示的圖。圖3是在熱處理裝置1的介質供給部7中設置的阻尼器30的剖視圖,顯示從側方觀察阻尼器30的狀態。 Fig. 1 is a schematic view showing a part of a heat treatment apparatus 1 according to an embodiment of the present invention, showing a state in which the heat treatment apparatus 1 is viewed from the side. Fig. 2 is an enlarged view of a main part of the heat treatment apparatus 1 of Fig. 1; 3 is a cross-sectional view of the damper 30 provided in the medium supply portion 7 of the heat treatment apparatus 1, and shows a state in which the damper 30 is viewed from the side.

參照圖1,熱處理裝置1構成為能夠對被處理物100實施熱處理。更具體來說,熱處理裝置1構成為能夠藉由朝向被處理物100供給被加熱的氣體來對被處理物100的表面實施熱處理。另外,熱處理裝置1構成為,能夠使用為介質的空氣作為冷卻空氣,來對被處理物100強制冷卻。 Referring to Fig. 1, the heat treatment apparatus 1 is configured to be capable of performing heat treatment on the workpiece 100. More specifically, the heat treatment apparatus 1 is configured to be capable of heat-treating the surface of the workpiece 100 by supplying the heated gas toward the workpiece 100. Further, the heat treatment apparatus 1 is configured to forcibly cool the workpiece 100 by using air as a medium as cooling air.

被處理物100例如是玻璃基板或半導體基板等。 The workpiece 100 is, for example, a glass substrate or a semiconductor substrate.

熱處理裝置1具有基座板2、加熱器3、作為容器的腔室4、晶舟(boat)5、升降機構6以及介質供給部7。 The heat treatment apparatus 1 has a base plate 2, a heater 3, a chamber 4 as a container, a boat 5, a lifting mechanism 6, and a medium supply portion 7.

基座板2被設置為支撐加熱器3和腔室4的構件。在基座板2的中央形成有貫通孔2a。以從上方堵塞該貫通孔2a的方式配置有加熱器3。 The base plate 2 is provided as a member that supports the heater 3 and the chamber 4. A through hole 2a is formed in the center of the base plate 2. The heater 3 is disposed to block the through hole 2a from above.

加熱器3例如是電熱加熱器,構成為能夠將氣體加熱至例如大約600℃。加熱器3整體上形成為箱狀。加熱器3具有:在上下方向(鉛直方向)上延伸的圓筒狀的側壁3a;和將側壁3a的上端堵住的頂壁3b。在側壁3a的下端部,形成有向下敞開的開口部。加熱器3的側壁3a的下端部被基座板2承接。在被加熱器3包圍的空間中,配置有腔室4。 The heater 3 is, for example, an electrothermal heater, and is configured to be capable of heating the gas to, for example, about 600 °C. The heater 3 is formed in a box shape as a whole. The heater 3 has a cylindrical side wall 3a extending in the vertical direction (vertical direction) and a top wall 3b blocking the upper end of the side wall 3a. At the lower end portion of the side wall 3a, an opening portion that is open downward is formed. The lower end portion of the side wall 3a of the heater 3 is received by the base plate 2. In the space surrounded by the heater 3, a chamber 4 is disposed.

腔室4構成為在被處理物100的熱處理時收納被處理物100的容器。腔室4整體上形成為圓筒狀。腔室4的上端部被堵塞。另外,腔室4向下敞開。腔室4的下端部被基座板2承接。腔室4內的空間通過基座板2的貫通孔2a向基座板2的下方的空間敞開。如此,腔室4包括:向腔室4的外部敞開的開口部4d;相對於腔室4的外部被閉合的形狀的裡部4e。 The chamber 4 is configured as a container that accommodates the workpiece 100 during heat treatment of the workpiece 100. The chamber 4 is formed in a cylindrical shape as a whole. The upper end portion of the chamber 4 is blocked. In addition, the chamber 4 is open downward. The lower end portion of the chamber 4 is received by the base plate 2. The space inside the chamber 4 is opened to the space below the base plate 2 through the through hole 2a of the base plate 2. As such, the chamber 4 includes an opening portion 4d that is open to the outside of the chamber 4, and a rear portion 4e that is closed with respect to the outside of the chamber 4.

在熱處理裝置1執行熱處理動作時,在腔室4內的空間中配置有被處理物100。被處理物100例如以水平配置的狀態支撐於晶舟5。 When the heat treatment apparatus 1 performs the heat treatment operation, the workpiece 100 is placed in the space inside the chamber 4. The workpiece 100 is supported by the wafer boat 5 in a state of being horizontally arranged, for example.

晶舟5是為了將被處理物100配置在腔室4內而設置的。晶舟5例如具有上下並排的複數個狹槽,複數個被處理物100被保持於該等狹槽。晶舟5被升降機構6支撐,且能夠藉由升降機構6的動作與被處理物100一起在上下方向上移位。藉由該升降機構6的動作,被處理物100和晶舟5進出腔室4。 The wafer boat 5 is provided to arrange the workpiece 100 in the chamber 4. The wafer boat 5 has, for example, a plurality of slots arranged side by side, and a plurality of workpieces 100 are held in the slots. The wafer boat 5 is supported by the elevating mechanism 6 and can be displaced in the vertical direction together with the workpiece 100 by the operation of the elevating mechanism 6. By the operation of the elevating mechanism 6, the workpiece 100 and the wafer boat 5 enter and exit the chamber 4.

在晶舟5和被處理物100被配置於腔室4內的狀態 下,腔室4的下端部和基座板2的貫通孔2a被與晶舟5連結的凸緣8封閉。藉此,被處理物100和晶舟5被密閉在腔室4內。在該狀態下,基於加熱器3的加熱對被處理物100加熱。然後,在加熱器3對被處理物100的加熱結束後,被處理物100、晶舟5和腔室4被從介質供給部7供給的冷卻空氣強制冷卻。 The state in which the wafer boat 5 and the workpiece 100 are disposed in the chamber 4 Next, the lower end portion of the chamber 4 and the through hole 2a of the base plate 2 are closed by the flange 8 coupled to the wafer boat 5. Thereby, the workpiece 100 and the boat 5 are sealed in the chamber 4. In this state, the object to be processed 100 is heated based on the heating of the heater 3. Then, after the heating of the workpiece 100 by the heater 3 is completed, the workpiece 100, the boat 5, and the chamber 4 are forcibly cooled by the cooling air supplied from the medium supply unit 7.

介質供給部7構成為,藉由向形成在加熱器3與腔室4之間的空間10強制地供給作為溫度調整用的冷卻介質的冷卻空氣,來冷卻腔室4和被處理物100。空間10是形成在基座板2、和配置於該基座板2上的腔室4及加熱器3之間的空間。該空間10整周地包圍腔室4的外周部。另外,該空間10是從上方覆蓋腔室4的上端部的空間。並且,在圖1中,以箭頭A1示意性地表示冷卻空氣的氣流。在本實施形態中,介質供給部7構成為藉由電子控制來控制冷卻空氣朝向空間10供給的供給形態。 The medium supply unit 7 is configured to cool the chamber 4 and the workpiece 100 by forcibly supplying cooling air as a cooling medium for temperature adjustment to the space 10 formed between the heater 3 and the chamber 4. The space 10 is a space formed between the base plate 2 and the chamber 4 and the heater 3 disposed on the base plate 2. This space 10 surrounds the outer peripheral portion of the chamber 4 over the entire circumference. Further, the space 10 is a space that covers the upper end portion of the chamber 4 from above. Further, in Fig. 1, the flow of the cooling air is schematically indicated by an arrow A1. In the present embodiment, the medium supply unit 7 is configured to control the supply mode in which the cooling air is supplied toward the space 10 by electronic control.

介質供給部7具有送風機單元11、供給管12、歧管13、阻尼器單元14、排氣管15、排氣冷卻器16、感測器單元17以及控制部18。 The medium supply unit 7 includes a blower unit 11, a supply pipe 12, a manifold 13, a damper unit 14, an exhaust pipe 15, an exhaust gas cooler 16, a sensor unit 17, and a control unit 18.

送風機單元11是為了將存在於加熱器3的外部的空氣取入並將該空氣作為冷卻空氣供給至供給管12而設置的。 The blower unit 11 is provided to take in air existing outside the heater 3 and supply the air to the supply pipe 12 as cooling air.

送風機單元11具有送風機21和用於驅動該送風機21的送風機馬達22。 The blower unit 11 has a blower 21 and a blower motor 22 for driving the blower 21.

送風機21例如是離心送風機,並且構成為:將存在於加熱器3的外部的空氣吸入,並對該空氣加壓,將其作為冷卻空氣以加壓狀態輸出。該送風機21具有葉輪(未圖示)。該葉輪與送風機馬達22的輸出軸連結,借助該送風機馬達22的驅動而運作。送 風機馬達22在本實施形態中為電動馬達。該送風機馬達22產生與所提供的的電力的頻率相對應的輸出。 The blower 21 is, for example, a centrifugal blower, and is configured to suck air that is present outside the heater 3, pressurize the air, and output it as a cooling air in a pressurized state. The blower 21 has an impeller (not shown). The impeller is coupled to the output shaft of the blower motor 22, and is operated by the drive of the blower motor 22. give away In the present embodiment, the fan motor 22 is an electric motor. The blower motor 22 produces an output corresponding to the frequency of the supplied power.

並且,被吸入送風機21中的空氣可以是常溫,也可以預先被冷卻器(未圖示)冷卻。供給管12的一端與送風機21的排出口連接。 Further, the air sucked into the blower 21 may be at normal temperature, or may be cooled in advance by a cooler (not shown). One end of the supply pipe 12 is connected to the discharge port of the blower 21.

供給管12是大致筆直地延伸的配管。供給管12可以是剛體狀的金屬管,也可以是能夠彈性變形的可撓管。供給管12的另一端與歧管13連接。 The supply pipe 12 is a pipe that extends substantially straight. The supply pipe 12 may be a rigid metal pipe or a flexible pipe that can be elastically deformed. The other end of the supply pipe 12 is connected to the manifold 13.

歧管13是為了將冷卻空氣分別分配至阻尼器單元14的後述的複數個阻尼器30而設置的。歧管13例如是使用具有規定的直徑的圓筒狀的金屬管而形成的。在本實施形態中,歧管13的兩端部被堵塞。另外,在本實施形態中,歧管13在與供給管12延伸的方向大致垂直的方向上延伸。 The manifold 13 is provided to distribute cooling air to a plurality of dampers 30 to be described later of the damper unit 14, respectively. The manifold 13 is formed, for example, by using a cylindrical metal pipe having a predetermined diameter. In the present embodiment, both end portions of the manifold 13 are blocked. Further, in the present embodiment, the manifold 13 extends in a direction substantially perpendicular to the direction in which the supply pipe 12 extends.

更具體來說,在本實施形態中,歧管13在上下方向上延伸,且沿著與腔室4的長度方向平行的方向配置。歧管13被配置在加熱器3的側方(換言之,是腔室4的側方)。 More specifically, in the present embodiment, the manifold 13 extends in the vertical direction and is arranged in a direction parallel to the longitudinal direction of the chamber 4. The manifold 13 is disposed on the side of the heater 3 (in other words, the side of the chamber 4).

在本實施形態中,供給管12連接在歧管13的上端部的外周部。根據上述的結構,通過供給管12的冷卻空氣在進入歧管13後在歧管13內向下方行進。然後,該冷卻空氣被送入阻尼器單元14的阻尼器30。 In the present embodiment, the supply pipe 12 is connected to the outer peripheral portion of the upper end portion of the manifold 13. According to the above configuration, the cooling air that has passed through the supply pipe 12 travels downward in the manifold 13 after entering the manifold 13. Then, the cooling air is sent to the damper 30 of the damper unit 14.

阻尼器單元14是為了將送入歧管13中的冷卻空氣分別向腔室4的上部4a、中間部4b以及下部4c供給而設置的。阻尼器單元14在本實施形態中被配置於歧管13與加熱器3之間。 The damper unit 14 is provided to supply the cooling air sent into the manifold 13 to the upper portion 4a, the intermediate portion 4b, and the lower portion 4c of the chamber 4, respectively. In the present embodiment, the damper unit 14 is disposed between the manifold 13 and the heater 3.

阻尼器單元14具有複數個阻尼器30。在本實施形態 中,作為複數個阻尼器30,具有基準阻尼器32和作為複數個副阻尼器的第1副阻尼器31及第2副阻尼器33。並且,在對阻尼器31、32、33統稱的情況下,稱為阻尼器30。 The damper unit 14 has a plurality of dampers 30. In this embodiment The plurality of dampers 30 include a reference damper 32 and a first sub damper 31 and a second sub damper 33 as a plurality of sub dampers. Further, in the case where the dampers 31, 32, and 33 are collectively referred to, they are referred to as dampers 30.

基準阻尼器32被設置為用於向腔室4供給冷卻空氣的基準閥。另外,副阻尼器31、33被設置為用於向腔室4供給冷卻空氣的副閥。第1副阻尼器31是本發明的「一個副閥」的一例。第2副阻尼器33是本發明的「其他副閥」的一例。各阻尼器30構成為能夠調整開度。即,構成為能夠調整通過各阻尼器30的冷卻空氣的流量。 The reference damper 32 is provided as a reference valve for supplying cooling air to the chamber 4. In addition, the sub dampers 31, 33 are provided as a sub valve for supplying cooling air to the chamber 4. The first sub damper 31 is an example of the "one sub valve" of the present invention. The second sub damper 33 is an example of the "other sub valve" of the present invention. Each damper 30 is configured to be able to adjust the opening degree. That is, it is configured such that the flow rate of the cooling air passing through each damper 30 can be adjusted.

第1副阻尼器31構成為朝向腔室4的上部4a供給冷卻空氣。基準阻尼器32構成為朝向腔室4的中間部4b供給冷卻空氣。第2副阻尼器33構成為朝向腔室4的下部4c供給冷卻空氣。 The first sub damper 31 is configured to supply cooling air toward the upper portion 4a of the chamber 4. The reference damper 32 is configured to supply cooling air toward the intermediate portion 4b of the chamber 4. The second sub damper 33 is configured to supply cooling air toward the lower portion 4c of the chamber 4.

第1副阻尼器31、基準阻尼器32以及第2副阻尼器33按照該順序沿著腔室4的長度方向即上下方向排列。即,基準阻尼器32被配置在第1副阻尼器31的下方。另外,第2副阻尼器33被配置在基準阻尼器32的下方。 The first sub damper 31, the reference damper 32, and the second sub damper 33 are arranged in this order along the longitudinal direction of the chamber 4, that is, in the vertical direction. That is, the reference damper 32 is disposed below the first sub damper 31. Further, the second sub damper 33 is disposed below the reference damper 32.

參照圖1~圖3,阻尼器30(即,基準阻尼器32、副阻尼器31、33各者)具有入口管41、閥箱42、支承軸43、閥體44、阻尼器馬達45以及出口管46、47。 Referring to FIGS. 1 to 3, the damper 30 (i.e., each of the reference damper 32 and the sub dampers 31, 33) has an inlet pipe 41, a valve casing 42, a support shaft 43, a valve body 44, a damper motor 45, and an outlet. Tubes 46, 47.

並且,在本實施形態中,以基準阻尼器32為包含有阻尼器馬達45的電動式的阻尼器的形態為例進行說明,但不限於此。例如,基準阻尼器32可以是未設置阻尼器馬達45的基於人力的手動開度調整式的、且能夠使閥體44的開度固定的阻尼器。 Further, in the present embodiment, the configuration in which the reference damper 32 is an electric damper including the damper motor 45 will be described as an example, but the invention is not limited thereto. For example, the reference damper 32 may be a damper that is not provided with the damper motor 45 and that is capable of fixing the opening degree of the valve body 44 based on a manual manual opening degree adjustment.

入口管41與歧管13和閥箱42連接,且構成為將來 自歧管13的冷卻空氣導入閥箱42內。入口管41的內徑被設定得比歧管13的內徑小。入口管41的一端與歧管13的外周部連接。 The inlet pipe 41 is connected to the manifold 13 and the valve casing 42 and is configured to be future The cooling air from the manifold 13 is introduced into the valve box 42. The inner diameter of the inlet pipe 41 is set to be smaller than the inner diameter of the manifold 13. One end of the inlet pipe 41 is connected to the outer peripheral portion of the manifold 13.

第1副阻尼器31的入口管41與歧管13的上部連接。基準阻尼器32的入口管41與歧管13的中間部連接。第2副阻尼器33的入口管41與歧管13的下部連接。入口管41從歧管13朝向對應的閥箱42水平地延伸。 The inlet pipe 41 of the first sub damper 31 is connected to the upper portion of the manifold 13. The inlet pipe 41 of the reference damper 32 is connected to the intermediate portion of the manifold 13. The inlet pipe 41 of the second sub damper 33 is connected to the lower portion of the manifold 13. The inlet tube 41 extends horizontally from the manifold 13 toward the corresponding valve box 42.

閥箱42例如形成為中空的四角柱狀。入口管41的另一端與閥箱42的一側壁連接。通過入口管41的冷卻空氣被導入閥箱42內。閥箱42收納支承軸43和閥體44。 The valve box 42 is formed, for example, in a hollow quadrangular prism shape. The other end of the inlet pipe 41 is connected to a side wall of the valve casing 42. The cooling air passing through the inlet pipe 41 is introduced into the valve casing 42. The valve box 42 houses the support shaft 43 and the valve body 44.

支承軸43被支撐於閥箱42,並且可繞該支承軸43擺動地支撐閥體44。在本實施形態中,支承軸43與閥體44以能夠一體旋轉的方式連結。支承軸43例如在水平方向上延伸,且配置成與入口管41鄰接。支承軸43的一部分貫通閥箱42,並與阻尼器馬達45的輸出軸49連結。 The support shaft 43 is supported by the valve box 42, and the valve body 44 is swingably supported around the support shaft 43. In the present embodiment, the support shaft 43 and the valve body 44 are coupled to each other so as to be rotatable together. The support shaft 43 extends, for example, in the horizontal direction, and is disposed to be adjacent to the inlet pipe 41. A part of the support shaft 43 penetrates the valve box 42 and is coupled to the output shaft 49 of the damper motor 45.

阻尼器馬達45是為了藉由使閥體44繞支承軸43擺動來設定阻尼器30的閥開度而設置的。 The damper motor 45 is provided to set the valve opening degree of the damper 30 by swinging the valve body 44 around the support shaft 43.

阻尼器馬達45具有馬達殼48和被該馬達殼48支撐的輸出軸49。 The damper motor 45 has a motor housing 48 and an output shaft 49 supported by the motor housing 48.

阻尼器馬達45是伺服馬達等構成為能夠進行旋轉位置控制的電動馬達。阻尼器馬達45構成為,接收來自控制部18的控制信號,從而能夠變更該阻尼器馬達45的輸出軸49的旋轉位置。 The damper motor 45 is an electric motor configured to be capable of rotational position control such as a servo motor. The damper motor 45 is configured to receive a control signal from the control unit 18, thereby changing the rotational position of the output shaft 49 of the damper motor 45.

馬達殼48例如固定於閥箱42。阻尼器馬達45的輸出軸49以能夠聯動地旋轉的方式與支承軸43連結。該輸出軸49可以與支承軸43連結成能夠一體地旋轉,也可以經由未圖示的減 速機構與支承軸43可聯動旋轉地連結。根據上述的結構,藉由阻尼器馬達45的驅動來設定輸出軸49的旋轉位置,與此相伴,閥體44的繞支承軸43的旋轉位置(即,阻尼器30的開度)被設定。 The motor case 48 is fixed to the valve case 42, for example. The output shaft 49 of the damper motor 45 is coupled to the support shaft 43 so as to be rotatable in conjunction therewith. The output shaft 49 may be coupled to the support shaft 43 so as to be rotatable integrally, or may be reduced by a not shown The speed mechanism and the support shaft 43 are coupled to each other in a rotationally coupled manner. According to the above configuration, the rotational position of the output shaft 49 is set by the driving of the damper motor 45, and the rotational position of the valve body 44 about the support shaft 43 (i.e., the opening degree of the damper 30) is set.

閥體44構成為對入口管41的另一端進行開閉。閥體44例如是使用矩形的平板狀構件而形成的。閥體44的一個緣部與支承軸43連結。閥體44例如被配置成在垂直地立起的姿勢下堵塞入口管41。 The valve body 44 is configured to open and close the other end of the inlet pipe 41. The valve body 44 is formed, for example, using a rectangular flat member. One edge of the valve body 44 is coupled to the support shaft 43. The valve body 44 is configured, for example, to block the inlet pipe 41 in a vertically rising posture.

閥體44從垂直地立起的姿勢起繞支承軸43旋轉例如數十度,藉此被配置在全開位置P2。即,當閥體44處於垂直位置即全閉位置P1時,阻尼器30的開度為零。另外,當閥體44處於從垂直位置旋轉了數十度的規定的全開位置P2時,阻尼器30的開度為100%。 The valve body 44 is rotated about the support shaft 43 by, for example, several tens of degrees from a vertically standing posture, thereby being disposed at the fully open position P2. That is, when the valve body 44 is in the vertical position, that is, the fully closed position P1, the opening degree of the damper 30 is zero. Further, when the valve body 44 is in the predetermined full-open position P2 rotated by several tens of degrees from the vertical position, the opening degree of the damper 30 is 100%.

並且,閥體44的旋轉位置與阻尼器30的開度之間的關係根據阻尼器30的結構來決定。因此,關於閥體44的旋轉位置與阻尼器30的開度之間的關係,存在有為線形的情況、和為非線形的情況。在本實施形態中,閥體44的旋轉位置與阻尼器30的旋轉位置之間的關係被預先儲存於控制部18。 Further, the relationship between the rotational position of the valve body 44 and the opening degree of the damper 30 is determined according to the structure of the damper 30. Therefore, the relationship between the rotational position of the valve body 44 and the opening degree of the damper 30 is a case where it is linear and a case where it is non-linear. In the present embodiment, the relationship between the rotational position of the valve body 44 and the rotational position of the damper 30 is stored in advance in the control unit 18.

當閥體44將入口管41的另一端打開時,來自入口管41的冷卻空氣被導入閥體44內,進而被向出口管46、47引導。 When the valve body 44 opens the other end of the inlet pipe 41, the cooling air from the inlet pipe 41 is introduced into the valve body 44, and is guided to the outlet pipes 46, 47.

在本實施形態中,在各阻尼器31、32、33設有2個出口管(即,出口管46、47)。各出口管46、47是為了將對應的閥箱42內的空間和形成於加熱器3內的空間10連接起來而設置的。各出口管46、47的一端與對應的閥箱42的一個側壁連接。 In the present embodiment, two outlet pipes (i.e., outlet pipes 46, 47) are provided in each of the dampers 31, 32, and 33. Each of the outlet pipes 46, 47 is provided to connect the space in the corresponding valve casing 42 with the space 10 formed in the heater 3. One end of each of the outlet pipes 46, 47 is connected to one side wall of the corresponding valve casing 42.

另外,各出口管46、47的另一端貫通加熱器3的側 壁3a而面對空間10。在各阻尼器31、32、33中,出口管46的另一端和出口管47的另一端在加熱器3的側壁3a的圓周方向上等間隔地(在本實施方式中,以180度的間隔)配置。 In addition, the other end of each of the outlet pipes 46, 47 penetrates the side of the heater 3 The wall 3a faces the space 10. In each of the dampers 31, 32, 33, the other end of the outlet pipe 46 and the other end of the outlet pipe 47 are equally spaced in the circumferential direction of the side wall 3a of the heater 3 (in the present embodiment, at intervals of 180 degrees) ) Configuration.

第1副阻尼器31的出口管46、47的另一端被配置成水平地面對腔室4的上部4a。基準阻尼器32的出口管46、47的另一端被配置成水平地面對腔室4的中間部4b。第2副阻尼器33的出口管46、47的另一端被配置成水平地面對腔室4的下部4c。 The other end of the outlet pipes 46, 47 of the first sub damper 31 is disposed to face the upper portion 4a of the chamber 4 horizontally. The other end of the outlet tubes 46, 47 of the reference damper 32 is disposed to face the intermediate portion 4b of the chamber 4 horizontally. The other end of the outlet pipes 46, 47 of the second sub damper 33 is disposed to face the lower portion 4c of the chamber 4 horizontally.

根據上述的結構,冷卻空氣被從第1副阻尼器31供給至腔室4的位置(即,第1副阻尼器31的出口管46、47的另一端的位置)被設定得比冷卻空氣被從第2副阻尼器33供給至腔室4的位置(即,第2副阻尼器33的出口管46、47的另一端的位置)高。 According to the above configuration, the position at which the cooling air is supplied from the first sub damper 31 to the chamber 4 (that is, the position of the other end of the outlet pipes 46, 47 of the first sub damper 31) is set to be smaller than the cooling air. The position supplied from the second sub damper 33 to the chamber 4 (that is, the position of the other end of the outlet pipes 46 and 47 of the second sub damper 33) is high.

另外,冷卻空氣被從第1副阻尼器31供給至腔室4的位置被設定得靠近開口部4d和裡部4e中的裡部4e。另外,冷卻空氣被從第2副阻尼器33供給至腔室4的位置被設定得靠近開口部4d和裡部4e中的開口部4d。 Further, the position at which the cooling air is supplied from the first sub damper 31 to the chamber 4 is set to be close to the inner portion 4e of the opening portion 4d and the inner portion 4e. Further, the position at which the cooling air is supplied from the second sub damper 33 to the chamber 4 is set to be close to the opening portion 4d of the opening portion 4d and the inner portion 4e.

另外,來自基準阻尼器32的冷卻空氣的出口即出口管46、47的另一端的位置被設定在來自第1副阻尼器31的冷卻空氣的出口即出口管46、47的另一端位置與來自第2副阻尼器33的冷卻空氣的出口即出口管46、47的另一端位置之間。 Further, the outlet of the cooling air from the reference damper 32, that is, the other end of the outlet pipes 46, 47 is set at the other end of the outlet pipes 46, 47 which are the outlets of the cooling air from the first sub damper 31, and The outlet of the cooling air of the second sub damper 33 is between the other end positions of the outlet pipes 46, 47.

另外,在本實施形態中,各阻尼器31、32、33的出口管46的另一端在腔室4的圓周方向上的位置被對齊。同樣,各阻尼器31、32、33的出口管47的另一端在腔室4的圓周方向上的位置被對齊。 Further, in the present embodiment, the other end of the outlet pipe 46 of each of the dampers 31, 32, 33 is aligned in the circumferential direction of the chamber 4. Also, the positions of the other ends of the outlet pipes 47 of the respective dampers 31, 32, 33 in the circumferential direction of the chamber 4 are aligned.

根據上述的結構,通過第1副阻尼器31的冷卻空氣 以朝向腔室4的上部4a的方式被供給至空間10中。另外,通過基準阻尼器32的冷卻空氣以朝向腔室4的中間部4b的方式被供給至空間10中。而且,通過第2副阻尼器33的冷卻空氣以朝向腔室4的下部4c的方式被供給至空間10中。被供給至空間10中的冷卻空氣一邊吸收來自腔室4的熱一邊朝向排氣管15流動。 According to the above configuration, the cooling air passing through the first sub damper 31 It is supplied into the space 10 in such a manner as to face the upper portion 4a of the chamber 4. Further, the cooling air passing through the reference damper 32 is supplied into the space 10 so as to face the intermediate portion 4b of the chamber 4. Further, the cooling air that has passed through the second sub damper 33 is supplied into the space 10 so as to face the lower portion 4c of the chamber 4. The cooling air supplied into the space 10 flows toward the exhaust pipe 15 while absorbing heat from the chamber 4.

排氣管15貫通加熱器3的頂壁3b。排氣管15的一端面對空間10。排氣管15將到達空間10的上端的冷卻空氣向排氣管15的另一端側引導。排氣管15在加熱器3的外側的空間中與排氣冷卻器16連接。排氣冷卻器16對吸收了來自腔室4的熱的冷卻空氣進行冷卻。藉由通過排氣冷卻器16而被冷卻的冷卻空氣向熱處理裝置1的外部空間排出。 The exhaust pipe 15 penetrates the top wall 3b of the heater 3. One end of the exhaust pipe 15 faces the space 10. The exhaust pipe 15 guides the cooling air reaching the upper end of the space 10 to the other end side of the exhaust pipe 15. The exhaust pipe 15 is connected to the exhaust gas cooler 16 in a space outside the heater 3. The exhaust gas cooler 16 cools the cooling air that has absorbed the heat from the chamber 4. The cooling air cooled by the exhaust gas cooler 16 is discharged to the external space of the heat treatment apparatus 1.

根據上述的結構,冷卻空氣從送風機21通過供給管12和歧管13後通過對應的阻尼器31、32、33,從而到達空間10,進而通過排氣管15和排氣冷卻器16被排出至熱處理裝置1的外部。利用感測器單元17檢測與各阻尼器31、32、33的出口管46、47的另一端相鄰的位置處的腔室4的溫度。 According to the above configuration, the cooling air passes through the supply pipe 12 and the manifold 13 from the blower 21, passes through the corresponding dampers 31, 32, 33, and reaches the space 10, and is discharged to the exhaust pipe 15 and the exhaust gas cooler 16 to The outside of the heat treatment apparatus 1. The temperature of the chamber 4 at a position adjacent to the other end of the outlet pipes 46, 47 of the respective dampers 31, 32, 33 is detected by the sensor unit 17.

更具體來說,感測器單元17分別檢測與第1副阻尼器31的出口管46的另一端面對的位置處的腔室4的溫度、與基準阻尼器32的出口管46的另一端面對的位置處的腔室4的溫度、以及與第2副阻尼器33的出口管46的另一端面對的位置處的腔室4的溫度。 More specifically, the sensor unit 17 detects the temperature of the chamber 4 at the position of the other end face of the outlet pipe 46 of the first sub damper 31, and the other end of the outlet pipe 46 of the reference damper 32, respectively. The temperature of the chamber 4 at the facing position and the temperature of the chamber 4 at the position opposite the other end surface of the outlet pipe 46 of the second sub damper 33.

感測器單元17具有溫度感測器51~53。 The sensor unit 17 has temperature sensors 51 to 53.

溫度感測器51~53例如是熱電偶等電氣式溫度感測器,構成為輸出指定檢測溫度的電信號。溫度感測器51~53例如 在與腔室4相鄰的位置處被加熱器3支撐。 The temperature sensors 51 to 53 are, for example, electrical temperature sensors such as thermocouples, and are configured to output an electrical signal specifying a detected temperature. Temperature sensors 51~53, for example It is supported by the heater 3 at a position adjacent to the chamber 4.

溫度感測器51與腔室4的上部4a的外周面相鄰地配置,並且與第1副阻尼器31的出口管46的另一端相鄰。溫度感測器51檢測出與第1副阻尼器31的出口管46水平地對置的腔室4之上部4a的溫度,作為腔室上部溫度T1。 The temperature sensor 51 is disposed adjacent to the outer peripheral surface of the upper portion 4a of the chamber 4, and is adjacent to the other end of the outlet pipe 46 of the first sub damper 31. The temperature sensor 51 detects the temperature of the upper portion 4a of the chamber 4 that is horizontally opposed to the outlet pipe 46 of the first sub damper 31 as the chamber upper temperature T1.

溫度感測器52與腔室4的中間部4b的外周面相鄰地配置,並且與基準阻尼器32的出口管46的另一端相鄰。溫度感測器52檢測出與基準阻尼器32的出口管46水平地對置的腔室4之中間部4b的溫度,作為腔室中間部溫度T2。 The temperature sensor 52 is disposed adjacent to the outer peripheral surface of the intermediate portion 4b of the chamber 4, and is adjacent to the other end of the outlet pipe 46 of the reference damper 32. The temperature sensor 52 detects the temperature of the intermediate portion 4b of the chamber 4 horizontally opposed to the outlet pipe 46 of the reference damper 32 as the chamber intermediate portion temperature T2.

溫度感測器53與腔室4的下部4c的外周面相鄰地配置,並且與第2副阻尼器33的出口管46的另一端相鄰。溫度感測器53檢測出與第2副阻尼器33的出口管46水平地對置的腔室4之下部4c的溫度,作為腔室下部溫度T3。各溫度感測器51~53的溫度檢測結果被提供給控制部18。 The temperature sensor 53 is disposed adjacent to the outer peripheral surface of the lower portion 4c of the chamber 4, and is adjacent to the other end of the outlet pipe 46 of the second sub damper 33. The temperature sensor 53 detects the temperature of the lower portion 4c of the chamber 4 horizontally opposed to the outlet pipe 46 of the second sub damper 33 as the lower chamber temperature T3. The temperature detection results of the temperature sensors 51 to 53 are supplied to the control unit 18.

控制部18構成為以基準阻尼器32供給冷卻空氣的供給形態為基準來控制副阻尼器31、33供給冷卻空氣的供給形態。控制部18是使用PLC(Programmable Logic Controller:可程式設計邏輯控制器)等來形成的。並且,控制部18可以使用包括有CPU(Central Processing Unit:中央處理單元)、ROM(Read Only Memory:唯讀記憶體)以及RAM(Random Access Memory:隨機存取記憶體)的電腦來形成,也可以使用時序電路等來形成。 The control unit 18 is configured to control the supply form of the cooling air supplied to the sub dampers 31 and 33 with reference to the supply mode of the cooling air supplied from the reference damper 32. The control unit 18 is formed using a PLC (Programmable Logic Controller) or the like. Further, the control unit 18 can be formed using a computer including a CPU (Central Processing Unit), a ROM (Read Only Memory), and a RAM (Random Access Memory). It can be formed using a sequential circuit or the like.

控制部18與各溫度感測器51~53連接,接收指定該等溫度感測器51~53的溫度檢測結果即腔室溫度T1~T3的電信號。另外,控制部18與送風機馬達22連接,藉由控制送風機馬達 22的驅動,藉此控制從送風機21供給的冷卻空氣的流量。 The control unit 18 is connected to the temperature sensors 51 to 53 and receives electrical signals specifying the temperature detection results of the temperature sensors 51 to 53, that is, the chamber temperatures T1 to T3. In addition, the control unit 18 is connected to the blower motor 22 by controlling the blower motor The drive of 22 controls the flow rate of the cooling air supplied from the blower 21.

另外,控制部18與第1副阻尼器31的阻尼器馬達45、基準阻尼器32的阻尼器馬達45以及第2副阻尼器33的阻尼器馬達45連接,分別控制該等馬達45的動作。 Further, the control unit 18 is connected to the damper motor 45 of the first sub damper 31, the damper motor 45 of the reference damper 32, and the damper motor 45 of the second sub damper 33, and controls the operations of the motors 45, respectively.

在本實施形態中,控制部18以基準阻尼器32的開度固定的狀態為基準,來控制第1副阻尼器31和第2副阻尼器33各自的開度。更具體來說,在介質供給部7冷卻腔室4和被處理物100的動作開始時,控制部18首先設定基準阻尼器32的開度。 In the present embodiment, the control unit 18 controls the opening degrees of the first sub damper 31 and the second sub damper 33 with reference to the state in which the opening degree of the reference damper 32 is fixed. More specifically, when the operation of the medium supply unit 7 to cool the chamber 4 and the workpiece 100 is started, the control unit 18 first sets the opening degree of the reference damper 32.

此時的基準阻尼器32的開度例如被設定為50%。這樣,控制部18驅動基準阻尼器32的阻尼器馬達45,以使基準阻尼器32的開度為50%,例如使閥體44配置在全閉位置P1與全開位置P2之間的一半的位置處。這樣,藉由將基準阻尼器32的開度設定為0%與100%的中間的50%,藉此能夠使來自各副阻尼器31、33的冷卻空氣流量相對於來自基準阻尼器32的冷卻空氣流量的調整幅度更大。 The opening degree of the reference damper 32 at this time is set, for example, to 50%. Thus, the control unit 18 drives the damper motor 45 of the reference damper 32 such that the opening degree of the reference damper 32 is 50%, for example, the valve body 44 is disposed at a position halfway between the fully closed position P1 and the fully open position P2. At the office. Thus, by setting the opening degree of the reference damper 32 to 50% of the middle between 0% and 100%, the cooling air flow rate from each of the sub dampers 31, 33 can be made to be cooled with respect to the cooling from the reference damper 32. The air flow is adjusted more.

並且,對於基準阻尼器32的開度,可以對應於被處理物100的熱容量(具體來說,是被處理物100的片數、材質、體積)、被處理物100的目標冷卻溫度、送風機馬達22的運作頻率等,由控制部18適當地設定。 Further, the opening degree of the reference damper 32 may correspond to the heat capacity of the workpiece 100 (specifically, the number, material, and volume of the workpiece 100), the target cooling temperature of the workpiece 100, and the blower motor. The operating frequency and the like of 22 are appropriately set by the control unit 18.

另外,控制部18構成為:以腔室4中的被從基準阻尼器32供給冷卻空氣的中間部4b處的腔室中間部溫度T2為基準,來控制從各副阻尼器31、33的出口管46、47向腔室4供給的冷卻空氣的流量。更具體來說,控制部18對各副阻尼器31、33的開度進行回饋控制,以減小腔室4中的被從基準阻尼器32供給冷 卻空氣的部位處的溫度(腔室中間部溫度T2)、和腔室4中的被從各副阻尼器31、33供給冷卻空氣的上部4a和下部4c處的溫度(腔室上部溫度T1、腔室下部溫度T3)的偏差。 Further, the control unit 18 is configured to control the outlets from the sub dampers 31 and 33 with reference to the chamber intermediate portion temperature T2 at the intermediate portion 4b of the chamber 4 supplied with the cooling air from the reference damper 32. The flow of cooling air supplied by the tubes 46, 47 to the chamber 4. More specifically, the control unit 18 performs feedback control on the opening degrees of the respective sub dampers 31 and 33 to reduce the supply of cold from the reference damper 32 in the chamber 4. The temperature at the portion of the air (the chamber intermediate portion temperature T2) and the temperature at the upper portion 4a and the lower portion 4c of the chamber 4 supplied with the cooling air from the respective sub dampers 31, 33 (the upper chamber temperature T1) Deviation of the lower chamber temperature T3).

控制部18構成為採用比例控制來分別控制各阻尼器31、32、33。在本實施形態中,控制部18藉由PID控制(Proportional Integral Differential Control,比例積分微分控制)分別控制各阻尼器31、32、33的阻尼器馬達45,藉此控制各阻尼器31、32、33的開度。並且,控制部18也可以藉由PI控制(Proportional Integral Control,比例積分控制)等其它控制方法來控制各阻尼器31、32、33。 The control unit 18 is configured to control each of the dampers 31, 32, and 33 by proportional control. In the present embodiment, the control unit 18 controls the damper motors 45 of the respective dampers 31, 32, 33 by PID control (Proportional Integral Differential Control), thereby controlling the dampers 31, 32, The opening of 33. Further, the control unit 18 may control the dampers 31, 32, and 33 by other control methods such as PI control (Proportional Integral Control).

控制部18控制各副阻尼器31、33,以使第1副阻尼器31和第2副阻尼器33執行不同的動作。具體來說,控制部18將第1副阻尼器31的控制增益kp1和第2副阻尼器33的控制增益kp2設定為不同的值。在本實施形態中,控制部18將對腔室4的上部4a供給冷卻空氣的第1副阻尼器31的控制增益kp1設定得比對腔室4的下部4c供給冷卻空氣的第2副阻尼器33的控制增益kp2大(kp1>kp2)。 The control unit 18 controls the sub dampers 31 and 33 so that the first sub damper 31 and the second sub damper 33 perform different operations. Specifically, the control unit 18 sets the control gain kp1 of the first sub damper 31 and the control gain kp2 of the second sub damper 33 to different values. In the present embodiment, the control unit 18 sets the control gain kp1 of the first sub damper 31 that supplies the cooling air to the upper portion 4a of the chamber 4 to be the second sub damper that supplies the cooling air to the lower portion 4c of the chamber 4. The control gain kp2 of 33 is large (kp1>kp2).

接下來,對熱處理裝置1中的冷卻動作的一例進行說明。並且,例如在加熱器3的加熱動作停止後執行熱處理裝置1中的冷卻動作。圖4是用於說明熱處理裝置1中的冷卻動作的一例的流程圖。並且,在參照流程圖進行說明的情況下,也適當地參照流程圖以外的圖進行說明。 Next, an example of the cooling operation in the heat treatment apparatus 1 will be described. Then, for example, after the heating operation of the heater 3 is stopped, the cooling operation in the heat treatment apparatus 1 is performed. FIG. 4 is a flowchart for explaining an example of a cooling operation in the heat treatment apparatus 1. Further, in the case of the description with reference to the flowchart, the description will be made with reference to the drawings other than the flowcharts as appropriate.

參照圖4,在冷卻動作開始時,控制部18首先使送風機馬達22運作,藉此將冷卻空氣導入介質供給部7(步驟S1)。 Referring to Fig. 4, at the start of the cooling operation, control unit 18 first operates blower motor 22, thereby introducing cooling air into medium supply unit 7 (step S1).

接下來,控制部18控制基準阻尼器32的開度(步驟S2)。即,控制部18設定基準阻尼器32的目標開度,進而藉由驅動基準阻尼器32的阻尼器馬達45來將基準阻尼器32的開度設定為與該目標開度相當的值。 Next, the control unit 18 controls the opening degree of the reference damper 32 (step S2). In other words, the control unit 18 sets the target opening degree of the reference damper 32, and further sets the opening degree of the reference damper 32 to a value corresponding to the target opening degree by the damper motor 45 that drives the reference damper 32.

接下來,控制部18參照腔室中間部溫度T2,藉此來測量腔室中間部溫度T2(步驟S3)。 Next, the control unit 18 refers to the chamber intermediate portion temperature T2, thereby measuring the chamber intermediate portion temperature T2 (step S3).

接下來,控制部18控制第1副阻尼器31的開度(步驟S4)。即,控制部18設定第1副阻尼器31的目標開度,進而藉由驅動第1副阻尼器31的阻尼器馬達45來將第1副阻尼器31的開度設定為與該目標開度相當的值。此時,控制部18根據檢測出的腔室中間部溫度T2運算目標溫度T1t。然後,控制部18控制第1副阻尼器31的開度,以使目標溫度T1t與腔室上部溫度T1的偏差(T1t-T1)減小。 Next, the control unit 18 controls the opening degree of the first sub damper 31 (step S4). In other words, the control unit 18 sets the target opening degree of the first sub damper 31, and further sets the opening degree of the first sub damper 31 to the target opening degree by driving the damper motor 45 of the first sub damper 31. Quite a value. At this time, the control unit 18 calculates the target temperature T1t based on the detected intermediate portion temperature T2 of the chamber. Then, the control unit 18 controls the opening degree of the first sub damper 31 so as to decrease the deviation (T1t - T1) between the target temperature T1t and the upper chamber temperature T1.

另外,控制部18控制第2副阻尼器33的開度(步驟S5)。即,控制部18設定第2副阻尼器33的目標開度,進而藉由驅動第2副阻尼器33的阻尼器馬達45來將第2副阻尼器33的開度設定為與該目標開度相當的值。此時,控制部18根據檢測出的腔室中間部溫度T2運算目標溫度T3t。然後,控制部18控制第2副阻尼器33的開度,以使目標溫度T3t與腔室下部溫度T3的偏差(T3t-T3)減小。 Moreover, the control unit 18 controls the opening degree of the second sub damper 33 (step S5). In other words, the control unit 18 sets the target opening degree of the second sub damper 33, and further sets the opening degree of the second sub damper 33 to the target opening degree by driving the damper motor 45 of the second sub damper 33. Quite a value. At this time, the control unit 18 calculates the target temperature T3t based on the detected intermediate portion temperature T2 of the chamber. Then, the control unit 18 controls the opening degree of the second sub damper 33 so as to decrease the deviation (T3t - T3) between the target temperature T3t and the lower chamber temperature T3.

並且,可以更換第1副阻尼器31的開度控制(步驟S4)和第2副阻尼器33的開度控制(步驟S5)的順序,也可以並行地執行該等步驟S4、S5。 Further, the order of the opening degree control of the first sub damper 31 (step S4) and the opening degree control of the second sub damper 33 (step S5) may be replaced, or the steps S4 and S5 may be performed in parallel.

接下來,控制部18檢測腔室上部溫度T1、腔室中間 部溫度T2以及腔室下部溫度T3(步驟S6)。然後,控制部18判定該等溫度T1~T3是否達到了冷卻動作結束的目標溫度Tft(步驟S7)。 Next, the control unit 18 detects the upper temperature of the chamber T1 and the middle of the chamber. The portion temperature T2 and the lower chamber temperature T3 (step S6). Then, the control unit 18 determines whether or not the temperatures T1 to T3 have reached the target temperature Tft at which the cooling operation is completed (step S7).

在溫度T1~T3達到了目標溫度Tft的情況下(在步驟S8中為YES),控制部18使送風機馬達22的動作停止(步驟S8),結束腔室4和被處理物100的冷卻動作。 When the temperature T1 to T3 has reached the target temperature Tft (YES in step S8), the control unit 18 stops the operation of the blower motor 22 (step S8), and ends the cooling operation of the chamber 4 and the workpiece 100.

另一方面,在溫度T1~T3未達到冷卻動作結束的目標溫度Tft的情況下(在步驟S8中為NO),控制部18再次執行步驟S3之後的控制。 On the other hand, when the temperature T1 to T3 have not reached the target temperature Tft at which the cooling operation is completed (NO in step S8), the control unit 18 executes the control after step S3 again.

如以上所說明的,根據本實施形態,控制部18以基準阻尼器32供給冷卻空氣的供給形態為基準來控制副阻尼器31、33供給冷卻空氣的供給形態。根據該結構,副阻尼器31、33供給冷卻空氣的供給形態由控制部18控制。藉此,能夠在被處理物100的片數等被處理物100的溫度控制條件發生了變化的情況下變更副阻尼器31、33供給冷卻空氣的供給形態。其結果是,即使在被處理物100的溫度控制條件發生了變化的情況下,也能夠使被處理物100更均等地冷卻。另外,以基準阻尼器32供給冷卻空氣的供給形態為基準來控制副阻尼器31、33供給冷卻空氣的供給形態的結果是,能夠更加可靠地抑制副阻尼器31、33的控制運算發散。從而,實現了對被處理物100的更正確的溫度控制。另外,由於副阻尼器31、33被控制部18控制,因此不需要人力對副阻尼器31、33的調整作業。根據以上的情況,能夠實現如下的熱處理裝置1:即使在溫度控制條件發生了變化的情況下,也能夠使被處理物100更均等地進行溫度變化,並且能夠自動地進行用於使被處理物100更均等 地發生溫度變化的調整作業。 As described above, according to the present embodiment, the control unit 18 controls the supply form of the cooling air supplied to the sub dampers 31 and 33 with reference to the supply mode of the cooling air supplied from the reference damper 32. According to this configuration, the supply form of the cooling air supplied to the sub dampers 31 and 33 is controlled by the control unit 18. By this means, when the temperature control condition of the workpiece 100 such as the number of the workpieces 100 is changed, the supply mode of the cooling air supplied to the sub dampers 31 and 33 can be changed. As a result, even when the temperature control condition of the workpiece 100 changes, the workpiece 100 can be more uniformly cooled. In addition, as a result of controlling the supply form of the cooling air by the sub dampers 31 and 33 with reference to the supply mode of the cooling air supplied from the reference damper 32, it is possible to more reliably suppress the control calculation and divergence of the sub dampers 31 and 33. Thereby, more accurate temperature control of the workpiece 100 is achieved. Further, since the sub dampers 31 and 33 are controlled by the control unit 18, it is not necessary to manually adjust the sub dampers 31 and 33. According to the above, the heat treatment apparatus 1 can realize the temperature change of the workpiece 100 more uniformly even when the temperature control condition is changed, and can automatically perform the object to be processed. 100 more equal The adjustment of the temperature change occurs.

另外,根據本實施形態,控制部18以基準阻尼器32的開度固定的狀態為基準,來控制副阻尼器31、33的開度。根據該結構,控制部18在副阻尼器30的開度控制中無需變更基準阻尼器32的開度,結果是,能夠使副阻尼器31、33的控制所需要的運算更加簡化。另外,在副阻尼器31、33的開度控制中,能夠更加可靠地抑制產生振盪。 Further, according to the present embodiment, the control unit 18 controls the opening degrees of the sub dampers 31 and 33 with reference to the state in which the opening degree of the reference damper 32 is fixed. According to this configuration, the control unit 18 does not need to change the opening degree of the reference damper 32 in the opening degree control of the sub damper 30, and as a result, the calculation required for the control of the sub dampers 31 and 33 can be simplified. Further, in the opening degree control of the sub dampers 31 and 33, it is possible to more reliably suppress the occurrence of oscillation.

另外,根據本實施形態,控制部18構成為:以腔室4中的被從基準阻尼器32供給冷卻空氣的中間部4b處的溫度(腔室中間部溫度T2)為基準,來控制從副阻尼器31、33向腔室4供給的冷卻空氣的流量。根據該結構,能夠使因從副阻尼器31、33供給至腔室4的冷卻空氣而引起的腔室4的上部4a和下部4c的溫度變化程度與因從基準阻尼器32供給至腔室4的中間部4b的冷卻空氣而引起的腔室4的中間部4b的溫度變化程度更加均等。 Further, according to the present embodiment, the control unit 18 is configured to control the slave side based on the temperature (the chamber intermediate portion temperature T2) of the intermediate portion 4b of the chamber 4 supplied with the cooling air from the reference damper 32. The flow rate of the cooling air supplied to the chamber 4 by the dampers 31, 33. According to this configuration, the degree of temperature change of the upper portion 4a and the lower portion 4c of the chamber 4 due to the cooling air supplied from the sub dampers 31, 33 to the chamber 4 can be supplied to the chamber 4 from the reference damper 32. The temperature change of the intermediate portion 4b of the chamber 4 caused by the cooling air of the intermediate portion 4b is more uniform.

另外,根據本實施形態,控制部18控制副阻尼器31、33的開度,以使腔室中間部溫度T2與腔室上部溫度T1的偏差(T2-T1)、和腔室中間部溫度T2與腔室下部溫度T3的偏差(T2-T3)分別減小。根據該結構,控制部18能夠控制副阻尼器31、33,以使腔室4中的被從基準阻尼器32供給冷卻空氣的腔室4的中間部4b處的溫度(腔室中間部溫度T2)、和腔室4中的被從副阻尼器31、33供給冷卻空氣的腔室4的上部4a及下部4c處的溫度(腔室上部溫度T1及腔室下部溫度T3)更加均等。 Further, according to the present embodiment, the control unit 18 controls the opening degrees of the sub dampers 31 and 33 such that the chamber intermediate portion temperature T2 deviates from the chamber upper temperature T1 (T2-T1) and the chamber intermediate portion temperature T2. The deviation from the lower chamber temperature T3 (T2-T3) is decreased, respectively. According to this configuration, the control unit 18 can control the sub dampers 31, 33 so that the temperature at the intermediate portion 4b of the chamber 4 of the chamber 4 supplied with the cooling air from the reference damper 32 (the chamber intermediate portion temperature T2) The temperature (the chamber upper temperature T1 and the lower chamber temperature T3) at the upper portion 4a and the lower portion 4c of the chamber 4 in which the cooling air is supplied from the sub dampers 31, 33 in the chamber 4 is more uniform.

另外,根據本實施形態,控制部18控制各副阻尼器31、33,以使第1副阻尼器31和第2副阻尼器33執行不同的動作。 根據該結構,藉由複數個副阻尼器31、33的動作,能夠使腔室4的更廣的區域均等地發生溫度變化。另外,能夠對腔室4的各區域更加細微地進行溫度控制。 Further, according to the present embodiment, the control unit 18 controls the sub dampers 31 and 33 so that the first sub damper 31 and the second sub damper 33 perform different operations. According to this configuration, the temperature of the wider area of the chamber 4 can be uniformly changed by the operation of the plurality of sub dampers 31 and 33. In addition, temperature control can be performed more finely for each region of the chamber 4.

另外,根據本實施形態,控制部18構成為採用比例積分微分控制來控制各副阻尼器31、33,從而將第1副阻尼器31的控制增益kp1和第2副阻尼器33的控制增益kp2設定為不同的值。根據該結構,第1副阻尼器31能夠進一步提高用於實現目標的冷卻空氣供給形態(即,開度)的回應速度。另一方面,第2副阻尼器33能夠進一步降低用於實現目標的冷卻空氣供給形態(即,開度)的回應速度。如此,藉由將針對目標開度的回應速度不同的副阻尼器31、33組合在一起,能夠使容易發生熱的偏差的腔室4發生更均等的溫度變化。 Further, according to the present embodiment, the control unit 18 is configured to control the sub dampers 31 and 33 by the proportional integral derivative control so as to control the gain kp1 of the first sub damper 31 and the control gain kp2 of the second sub damper 33. Set to a different value. According to this configuration, the first sub damper 31 can further increase the response speed of the cooling air supply mode (ie, the opening degree) for achieving the target. On the other hand, the second sub damper 33 can further reduce the response speed of the cooling air supply form (ie, the opening degree) for achieving the target. As described above, by combining the sub dampers 31 and 33 having different response speeds to the target opening degree, it is possible to cause a more uniform temperature change in the chamber 4 in which the heat variation is likely to occur.

更詳細來說,冷卻空氣被從第1副阻尼器31供給至腔室4的位置被設定得比冷卻空氣被從第2副阻尼器33供給至腔室4的位置高。並且,控制部18將針對第1副阻尼器31的控制增益kp1設定得比針對第2副阻尼器33的控制增益kp2大。根據該結構,由於腔室4的熱朝向上方,因此存在這樣的傾向:腔室4的上部4a的熱量比腔室4的下部4b的熱量大。因此,藉由使對腔室4的上部4a側進行冷卻的第1副阻尼器31的控制增益kp1更大,能夠朝向腔室4的上部4a側更迅速地供給更多的冷卻空氣。藉此,能夠更加可靠地冷卻容易積存熱量的腔室4的上部4a側。另一方面,藉由使對腔室4的下部4c側進行冷卻的第2副阻尼器33的控制增益kp2更小,能夠抑制朝向腔室4的下部4c側急劇地供給過度的冷卻空氣。藉此,能夠抑制熱比較容易逃逸的腔室4的下部4c 側比腔室4的其它部分先被冷卻之情形。其結果是,腔室4的各部被更均等地冷卻。 More specifically, the position at which the cooling air is supplied from the first sub damper 31 to the chamber 4 is set to be higher than the position at which the cooling air is supplied from the second sub damper 33 to the chamber 4. Further, the control unit 18 sets the control gain kp1 for the first sub damper 31 to be larger than the control gain kp2 for the second sub damper 33. According to this configuration, since the heat of the chamber 4 faces upward, there is a tendency that the heat of the upper portion 4a of the chamber 4 is larger than the heat of the lower portion 4b of the chamber 4. Therefore, by increasing the control gain kp1 of the first sub damper 31 that cools the upper portion 4a side of the chamber 4, more cooling air can be supplied more quickly toward the upper portion 4a side of the chamber 4. Thereby, it is possible to more reliably cool the upper portion 4a side of the chamber 4 where heat is easily accumulated. On the other hand, by reducing the control gain kp2 of the second sub damper 33 that cools the lower portion 4c side of the chamber 4, it is possible to suppress the sudden supply of excessive cooling air toward the lower portion 4c side of the chamber 4. Thereby, the lower portion 4c of the chamber 4 which is relatively easy to escape from heat can be suppressed. The side is cooled before the other portions of the chamber 4 are first cooled. As a result, the respective portions of the chamber 4 are more uniformly cooled.

另外,冷卻空氣被從第1副阻尼器31供給至腔室4的位置被設定得靠近開口部4d和裡部4e中的裡部4e。另外,冷卻空氣被從第2副阻尼器33供給至腔室4的位置被設定得靠近開口部4d和裡部4e中的開口部4d。並且,控制部18將針對第1副阻尼器31的控制增益kp1設定得比針對第2副阻尼器33的控制增益kp2大。根據該結構,腔室4的熱容易積存在裡部4e,因此存在裡部4e的熱量比開口部4d的熱量大的傾向。因此,藉由使針對對裡部4e側進行冷卻的第1副阻尼器31的控制增益kp1更大,能夠朝向腔室4的裡部4e側更迅速地供給更多的冷卻空氣。藉此,能夠更加可靠地冷卻容易積存熱量的腔室4的裡部4e側。另一方面,藉由使針對對腔室4的開口部4d側進行冷卻的第2副阻尼器33的控制增益kp2更小,能夠抑制朝向腔室4的開口部4d側急劇地供給過度的冷卻空氣。藉此,能夠抑制熱比較容易逃逸的腔室4的開口部4d側比腔室4的其它部分先被冷卻之情形。其結果是,腔室4的各部被更均等地冷卻。 Further, the position at which the cooling air is supplied from the first sub damper 31 to the chamber 4 is set to be close to the inner portion 4e of the opening portion 4d and the inner portion 4e. Further, the position at which the cooling air is supplied from the second sub damper 33 to the chamber 4 is set to be close to the opening portion 4d of the opening portion 4d and the inner portion 4e. Further, the control unit 18 sets the control gain kp1 for the first sub damper 31 to be larger than the control gain kp2 for the second sub damper 33. According to this configuration, since the heat of the chamber 4 is easily accumulated in the inner portion 4e, the heat of the inner portion 4e tends to be larger than the heat of the opening portion 4d. Therefore, by making the control gain kp1 of the first sub damper 31 that cools the inner portion 4e side larger, it is possible to supply more cooling air more rapidly toward the inner portion 4e side of the chamber 4. Thereby, it is possible to more reliably cool the inner portion 4e side of the chamber 4 where heat is easily accumulated. On the other hand, by reducing the control gain kp2 of the second sub damper 33 that cools the opening 4d side of the chamber 4, it is possible to suppress the sudden supply of excessive cooling toward the opening 4d side of the chamber 4. air. Thereby, it is possible to suppress the case where the opening portion 4d side of the chamber 4 where the heat is relatively easy to escape is cooled earlier than the other portions of the chamber 4. As a result, the respective portions of the chamber 4 are more uniformly cooled.

另外,基準阻尼器32的出口管46、47的另一端位置被設定在第1副阻尼器31的出口管46、47的另一端位置與第2副阻尼器33的出口管46、47的另一端位置之間。根據該結構,能夠藉由複數個阻尼器31、32、33並利用冷卻空氣使腔室4的更廣的區域更均等地發生溫度變化。另外,對於腔室4中的被供給來自基準阻尼器32的冷卻空氣的部位(中間部4b)以外的區域,能夠進一步增大其配置在被供給來自基準阻尼器32的冷卻空氣的部位附近 的比例。其結果是,對於腔室4的更廣的區域,能夠減小與被供給來自基準阻尼器32的冷卻空氣的中間部4b之間的溫度差。 Further, the other end positions of the outlet pipes 46, 47 of the reference damper 32 are set at the other end position of the outlet pipes 46, 47 of the first sub damper 31 and the outlet pipes 46, 47 of the second sub damper 33. Between one end position. According to this configuration, the temperature of the wider area of the chamber 4 can be more uniformly changed by the plurality of dampers 31, 32, and 33 by the cooling air. Further, in a region other than the portion (intermediate portion 4b) to which the cooling air from the reference damper 32 is supplied, the region of the chamber 4 can be further increased in the vicinity of the portion to which the cooling air from the reference damper 32 is supplied. proportion. As a result, the temperature difference between the intermediate portion 4b to which the cooling air supplied from the reference damper 32 is supplied can be reduced for a wider area of the chamber 4.

以上,對本發明的實施形態進行了說明,但本發明不限於上述的實施形態。只要記載於申請專利範圍中,本發明就能夠進行各種變更。 Although the embodiments of the present invention have been described above, the present invention is not limited to the above embodiments. The present invention can be variously modified as long as it is described in the patent application.

(1)在上述的實施形態中,以下述形態為例進行了說明:在進行各副阻尼器31、33的開度控制的期間,基準阻尼器32的開度固定。可是,也可以不是這樣。例如,也可以是,在進行各副阻尼器31、33的開度控制的期間,基準阻尼器32的開度藉由控制部18或人力定期地變更。 (1) In the above-described embodiment, the following embodiment has been described as an example in which the opening degree of the reference damper 32 is fixed while the opening degree control of each of the sub dampers 31 and 33 is performed. However, this may not be the case. For example, while the opening degree control of each of the sub dampers 31 and 33 is performed, the opening degree of the reference damper 32 may be periodically changed by the control unit 18 or the manpower.

(2)另外,在上述的實施形態中,以使送風機21的風量固定的形態為例進行了說明。可是,也可以不是這樣。例如,也可以是,送風機21的風量對應於腔室4的各部的溫度T1、T2、T3等被控制部18變更。 (2) In the above embodiment, the form in which the air volume of the blower 21 is fixed is described as an example. However, this may not be the case. For example, the air volume of the blower 21 may be changed by the control unit 18 in accordance with the temperatures T1, T2, and T3 of the respective portions of the chamber 4.

(3)另外,在上述的實施形態中,以下述形態為例進行了說明:在加熱器3的加熱動作結束後,介質供給部7開始進行腔室4和被處理物100的冷卻處理。可是,也可以不是這樣。例如,可以是,藉由使介質供給部7與加熱器3協調工作,藉此在加熱器3停止動作的途中從介質供給部7朝向腔室4供給冷卻空氣。 (3) In the above-described embodiment, the following configuration has been described as an example. After the heating operation of the heater 3 is completed, the medium supply unit 7 starts the cooling process of the chamber 4 and the workpiece 100. However, this may not be the case. For example, by operating the medium supply unit 7 in cooperation with the heater 3, cooling air can be supplied from the medium supply unit 7 toward the chamber 4 while the heater 3 is stopped.

(4)另外,在上述的實施形態中,以設置有2個副阻尼器的形態為例進行了說明。可是,也可以不是這樣。例如,副阻尼器可以是1個,也可以是3個以上。 (4) Further, in the above-described embodiment, the configuration in which two sub dampers are provided has been described as an example. However, this may not be the case. For example, the sub damper may be one or three or more.

(5)另外,在上述的實施形態中,以控制部18控制各阻尼器31、32、33的開度的形態為例進行了說明。可是,也可以 不是這樣。例如,也可以是,控制部18以通過各阻尼器31、32、33的冷卻空氣的壓力等其它要素作為控制對象。 (5) In the above embodiment, the configuration in which the control unit 18 controls the opening degrees of the dampers 31, 32, and 33 has been described as an example. However, it can also It's not like this. For example, the control unit 18 may control other elements such as the pressure of the cooling air passing through the dampers 31, 32, and 33.

(6)另外,在上述的實施形態中,作為控制冷卻空氣的閥構件,以阻尼器為例進行了說明。可是,也可以不是這樣。例如,作為控制冷卻空氣的閥構件,也可以使用電磁閥等具有能夠調整閥體的開度的結構的其它閥構件。 (6) Further, in the above-described embodiment, the damper has been described as an example of a valve member for controlling the cooling air. However, this may not be the case. For example, as the valve member that controls the cooling air, another valve member having a structure capable of adjusting the opening degree of the valve body such as a solenoid valve may be used.

(7)另外,在上述的實施形態中,以將本發明應用於在加熱蒸鍍等中使用的爐的情況為例進行了說明。可是,也可以不是這樣。例如,也可以將本發明應用於具有熱風循環爐等其它爐的熱處理裝置中。 (7) In the above embodiment, the case where the present invention is applied to a furnace used for heating vapor deposition or the like has been described as an example. However, this may not be the case. For example, the present invention can also be applied to a heat treatment apparatus having another furnace such as a hot air circulation furnace.

(8)另外,在上述的實施形態中,以使用空氣作為熱處理用介質的形態為例進行了說明。可是,也可以不是這樣。例如,作為熱處理用介質,也可以使用空氣以外的氣體,也可以使用水等液體。在使用液體作為熱處理用介質的情況下,用泵來代替送風機。 (8) In the above embodiment, the form in which air is used as the medium for heat treatment has been described as an example. However, this may not be the case. For example, as the medium for the heat treatment, a gas other than air may be used, or a liquid such as water may be used. In the case where a liquid is used as the medium for the heat treatment, a pump is used instead of the blower.

(9)另外,在上述的實施形態中,以介質供給部7對腔室4和被處理物100進行冷卻的形態為例進行了說明。可是,也可以不是這樣。例如,也可以是,在對腔室4等容器和被處理物100加熱時應用本發明的結構。這種情況下,各阻尼器31、32、33將被加熱的空氣等熱處理用介質朝向腔室4供給。 (9) In the above embodiment, the form in which the medium supply unit 7 cools the chamber 4 and the workpiece 100 has been described as an example. However, this may not be the case. For example, the structure of the present invention may be applied when the container and the workpiece 100 such as the chamber 4 are heated. In this case, each of the dampers 31, 32, and 33 supplies the medium for heat treatment such as heated air toward the chamber 4.

(10)另外,在上述的實施形態中,以腔室4為縱型爐的形態為例進行了說明。可是,也可以不是這樣。例如,也可以將本發明應用於具有橫向配置的腔室的熱處理裝置中。 (10) Further, in the above-described embodiment, the case where the chamber 4 is a vertical furnace has been described as an example. However, this may not be the case. For example, the invention can also be applied to a heat treatment apparatus having a chamber in a lateral configuration.

(產業上之可利用性) (industrial availability)

本發明能夠作為熱處理裝置被廣泛地應用。 The present invention can be widely applied as a heat treatment device.

1‧‧‧熱處理裝置 1‧‧‧ Heat treatment unit

2‧‧‧基座板 2‧‧‧Base plate

2a‧‧‧貫通孔 2a‧‧‧through holes

3‧‧‧加熱器 3‧‧‧heater

3a‧‧‧側壁 3a‧‧‧ Sidewall

3b‧‧‧頂壁 3b‧‧‧ top wall

4‧‧‧腔室(容器) 4‧‧‧Case (container)

4a‧‧‧上部 4a‧‧‧ upper

4b‧‧‧中間部 4b‧‧‧Intermediate

4c‧‧‧下部 4c‧‧‧ lower

4d‧‧‧開口部 4d‧‧‧ openings

4e‧‧‧裡部 4e‧‧‧Li

5‧‧‧晶舟 5‧‧‧The boat

6‧‧‧升降機構 6‧‧‧ Lifting mechanism

7‧‧‧介質供給部 7‧‧‧Media Supply Department

8‧‧‧凸緣 8‧‧‧Flange

10‧‧‧空間 10‧‧‧ space

11‧‧‧送風機單元 11‧‧‧Air blower unit

12‧‧‧供給管 12‧‧‧Supply tube

13‧‧‧歧管 13‧‧‧Management

14‧‧‧阻尼器單元 14‧‧‧damper unit

15‧‧‧排氣管 15‧‧‧Exhaust pipe

16‧‧‧排氣冷卻器 16‧‧‧Exhaust cooler

17‧‧‧感測器單元 17‧‧‧Sensor unit

18‧‧‧控制部 18‧‧‧Control Department

21‧‧‧送風機 21‧‧‧Air blower

22‧‧‧送風機馬達 22‧‧‧Air blower motor

30‧‧‧阻尼器 30‧‧‧ damper

31‧‧‧第1副阻尼器(副閥;一個副閥) 31‧‧‧1st secondary damper (sub-valve; one sub-valve)

32‧‧‧基準阻尼器(基準閥) 32‧‧‧Base damper (reference valve)

33‧‧‧第2副阻尼器(副閥;其他副閥) 33‧‧‧2nd secondary damper (sub-valve; other secondary valves)

44‧‧‧閥體 44‧‧‧ valve body

45‧‧‧阻尼器馬達 45‧‧‧damper motor

46、47‧‧‧出口管 46, 47‧‧‧ export pipe

51~53‧‧‧溫度感測器 51~53‧‧‧temperature sensor

100‧‧‧被處理物 100‧‧‧Processed objects

A1‧‧‧(冷卻空氣的)氣流 A1‧‧‧ (cooling air) airflow

Claims (9)

一種熱處理裝置,其特徵在於,其具備:容器,其在被處理物的熱處理時收納上述被處理物;介質供給部,其包括用於將溫度調整用的介質供給至上述容器的基準閥和副閥;以及控制部,其以上述基準閥供給上述介質的供給形態為基準,控制上述副閥供給上述介質的供給形態。 A heat treatment apparatus comprising: a container that accommodates the object to be processed during heat treatment of the object to be processed; and a medium supply unit that includes a reference valve and a pair for supplying a medium for temperature adjustment to the container And a control unit that controls a supply form of the sub-valve to supply the medium based on a supply mode in which the reference valve supplies the medium. 如請求項1之熱處理裝置,其中,上述控制部以上述基準閥的開度固定的狀態為基準,來控制上述副閥的開度。 The heat treatment apparatus according to claim 1, wherein the control unit controls the opening degree of the sub valve based on a state in which the opening degree of the reference valve is fixed. 如請求項1或2之熱處理裝置,其中,上述控制部構成為:以上述容器中被從上述基準閥供給上述介質的部位處的溫度為基準,控制從上述副閥向上述容器供給的上述介質的流量。 The heat treatment apparatus according to claim 1 or 2, wherein the control unit is configured to control the medium supplied from the sub valve to the container based on a temperature of a portion of the container to which the medium is supplied from the reference valve Traffic. 如請求項3之熱處理裝置,其中,上述控制部控制上述副閥的開度,以使上述容器中被從上述基準閥供給上述介質的部位處的溫度、和上述容器中被從上述副閥供給上述介質的部位處的溫度之偏差減小之方式為之。 The heat treatment apparatus according to claim 3, wherein the control unit controls an opening degree of the sub valve such that a temperature of a portion of the container supplied from the reference valve to the medium and a supply of the container from the sub valve are The manner in which the deviation of the temperature at the portion of the medium is reduced is the same. 如請求項1或2之熱處理裝置,其中,上述副閥設置有複數個,上述控制部控制各上述副閥,以使一個上述副閥和其他上述副閥進行不同的動作。 The heat treatment apparatus according to claim 1 or 2, wherein the plurality of sub-valves are provided, and the control unit controls each of the sub-valves so that one of the sub-valves and the other sub-valves perform different operations. 如請求項5之熱處理裝置,其中,上述控制部構成為採用比例控制來控制各上述副閥,上述控制部將一個上述副閥的控制增益和其他上述副閥的控制增益設定為不同的值。 The heat treatment apparatus according to claim 5, wherein the control unit is configured to control each of the sub-valves by proportional control, and the control unit sets a control gain of one of the sub-valves and a control gain of the other sub-valves to different values. 如請求項6之熱處理裝置,其中,上述介質是用於冷卻上述容器的冷卻介質, 從一個上述副閥向上述容器供給上述冷卻介質的位置,係被設定成比從其他上述副閥向上述容器供給上述冷卻介質的位置高,上述控制部將針對一個上述副閥的上述控制增益設定成比針對其他上述副閥的上述控制增益大。 The heat treatment device of claim 6, wherein the medium is a cooling medium for cooling the container, The position at which the cooling medium is supplied from the one sub valve to the container is set higher than a position at which the cooling medium is supplied from the other sub valve to the container, and the control unit sets the control gain for one of the sub valves. The above control gain is larger than that of the other sub-valves. 如請求項6之熱處理裝置,其中,上述容器包含:向上述容器的外部敞開的開口部、及相對於上述容器的外部被封閉的形狀的裡部,上述介質是用於冷卻上述容器的冷卻介質,從一個上述副閥向上述容器供給上述冷卻介質的位置被設定成靠上述開口部和上述裡部中的上述裡部,並且,從其他上述副閥向上述容器供給上述冷卻介質的位置被設定成靠上述開口部和上述裡部中的上述開口部,上述控制部將針對一個上述副閥的上述控制增益設定成比針對其他上述副閥的上述控制增益大。 The heat treatment apparatus according to claim 6, wherein the container comprises: an opening that is open to the outside of the container, and a inside that is closed with respect to an outer portion of the container, the medium being a cooling medium for cooling the container The position at which the cooling medium is supplied from the one of the sub-valves to the container is set to be the inner portion of the opening portion and the inner portion, and the position at which the cooling medium is supplied from the other sub-valve to the container is set. The control unit sets the control gain for one of the sub-valves to be larger than the control gain for the other sub-valves by the opening in the opening and the opening in the inner portion. 如請求項1或2之熱處理裝置,其中,上述副閥設置有複數個,來自上述基準閥的上述介質的出口位置被設定於來自各上述副閥的上述介質的出口位置之間。 The heat treatment apparatus according to claim 1 or 2, wherein the plurality of sub-valves are provided, and an outlet position of the medium from the reference valve is set between an exit position of the medium from each of the sub-valves.
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