TW201714204A - Processing fluid supply device, substrate processing system, and processing fluid supply method - Google Patents

Abstract

A processing fluid supply device includes: a processing fluid tank for retaining processing fluid; a first processing fluid pipe connecting a processing unit and the processing fluid tank; an opening and closing unit for opening and closing the first processing fluid pipe; a pressurizing unit for applying pressure to the processing fluid by a gas to feed the processing fluid inside the processing fluid tank into the first processing fluid pipe; a pressure adjusting unit for adjusting the pressure inside the processing fluid tank; and a control unit for controlling the pressure adjusting unit before closing the opening and closing unit so as to gradually release air within the processing fluid tank, which is in a pressurized state, to the atmosphere and close the opening and closing unit after starting to release the air.

Description

Processing liquid supply device, substrate processing system, and processing liquid supply method

The present invention relates to a processing liquid supply device that supplies a processing liquid, a substrate processing system including the supply device, and a processing liquid supply method that supplies the processing liquid. The substrate to be processed by the processing liquid includes, for example, a semiconductor wafer, a substrate for a liquid crystal display device, a substrate for a plasma display, a substrate for a field emission display (FED), a substrate for a disk, and a disk. A substrate, a substrate for a magneto-optical disk, a substrate for a photomask, a ceramic substrate, a substrate for a solar cell, or the like.

Patent Document 1 listed below discloses a processing liquid supply device that supplies a processing liquid to a substrate processing unit. The processing liquid supply device includes a processing liquid tank that stores a processing liquid, a processing liquid pipe that connects the processing liquid tank and the substrate processing unit, and a valve that opens and closes the processing liquid pipe. The processing liquid supply device further includes a pressurizing unit that pressurizes the processing liquid inside the processing liquid tank by a so-called pressurized pressure feeding method, thereby moving the processing liquid to the processing liquid pipe.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2000-21703

In the processing liquid supply device, when it is notified that the supply is not required from the substrate processing unit side, the valve on the substrate processing unit side is closed while the inside of the processing liquid tank and the processing liquid pipe is maintained pressurized. Therefore, after the valve is closed, the pressure inside the treatment liquid tank and the treatment liquid piping is maintained in a pressurized state.

Since the pressurized gas of high pressure is continuously pressurized, a large amount of gas (an inert gas such as nitrogen) is dissolved in the treatment liquid inside the treatment liquid tank and the treatment liquid piping. Since the solubility of the gas to the liquid is proportional to the pressure, there is a possibility that a large amount of gas is dissolved in the treatment liquid inside the treatment liquid pipe in a high pressure state.

When a treatment liquid (for example, an organic solvent or the like) supplied to the substrate contains air bubbles, the gas-liquid interface formed by the liquid and the air bubbles of the treatment liquid attracts and collects minute foreign matter contained in the treatment liquid. And grow into particles. As a result, there is a possibility that particles are generated on the surface of the substrate after drying. Further, when the amount of the bubbles contained in the treatment liquid is large, the gas-liquid interface is increased in area, and there is a possibility that the problem of generation of particles is remarkable.

Such a problem arises not only in the case where an organic solvent is supplied to the substrate, but also in the case where other kinds of the treatment liquid are supplied to the substrate.

Therefore, an object of the present invention is to provide a processing liquid supply device and a processing liquid supply method capable of reducing the amount of bubbles contained in a supply of a processing liquid.

Further, another object of the present invention is to provide a substrate processing system capable of suppressing or preventing generation of particles.

The present invention provides a processing liquid supply device that supplies a processing liquid to a processing unit that performs a treatment using a processing liquid on a substrate, and includes a processing liquid tank that stores a processing liquid, and a first processing liquid pipe that is connected to the above a processing unit and the processing liquid tank; an opening and closing unit for opening and closing the first processing liquid pipe; and a pressurizing unit for utilizing the gas Pressurizing the treatment liquid inside the treatment liquid tank to move the treatment liquid to the first treatment liquid pipe; the pressure adjustment unit for adjusting the pressure inside the treatment liquid tank; and a control device In order to stop the supply of the processing liquid from the processing liquid supply device toward the processing unit, the pressure adjusting unit is controlled to open the inside of the processing liquid tank in a pressurized state before the opening and closing unit is closed, and The opening and closing unit is closed after the opening of the atmosphere is started.

According to this configuration, when the supply of the processing liquid from the processing liquid supply device to the processing unit is stopped, the control device gradually opens the atmosphere inside the processing liquid tank that is pressurized by the pressurizing unit before the opening and closing unit is closed. The above-mentioned opening and closing unit is closed after the opening of the atmosphere. Since the opening and closing unit is closed after the pressure reduction in the inside of the processing liquid tank is started, the inside of the processing liquid tank and the inside of the first processing liquid pipe are maintained at a lower pressure than the above-described pressurized state after the opening and closing unit is closed. State. Since the solubility of the gas to the liquid is proportional to the pressure, a large amount of gas is not dissolved inside the treatment liquid pipe in the decompressed state. Since the amount of dissolved gas in the treatment liquid is small, the amount of bubbles generated in the treatment liquid can be reduced.

Further, since the atmosphere inside the treatment liquid tank is gradually opened, it is possible to suppress or prevent the gas dissolved in the treatment liquid from appearing as bubbles in the decompression process.

Thereby, it is possible to provide a processing liquid supply device capable of reducing the amount of bubbles contained in the supplied processing liquid.

In one embodiment of the present invention, the control device closes the opening and closing unit after the pressure inside the processing liquid tank drops to atmospheric pressure.

According to this configuration, since the opening and closing unit is closed after the pressure inside the treatment liquid tank is lowered to the atmospheric pressure, the inside of the treatment liquid tank is closed after the opening and closing unit is closed. The inside of the first treatment liquid pipe is maintained at atmospheric pressure. Therefore, the amount of dissolved gas of the treatment liquid dissolved in the inside of the treatment liquid tank and the inside of the first treatment liquid pipe can be further reduced. Therefore, the amount of bubbles of the treatment liquid can be further reduced.

The processing liquid supply device may further include a pressure gauge for detecting a pressure inside the processing liquid tank, wherein the control device is not detected at a time point when a predetermined time has elapsed since the opening of the atmosphere It is judged to be an error state when the predetermined threshold value is reached.

According to this configuration, the error state is judged to be an error state when the pressure value does not reach the predetermined threshold value at the time point when the predetermined time elapses from the opening of the atmosphere. Thereby, the decompression speed inside the treatment liquid tank can be prevented from being excessively fast, so that the amount of bubbles contained in the treatment liquid can be more effectively reduced.

The treatment liquid device may further include an atmosphere communication pipe that communicates between the inside of the treatment liquid tank and the atmosphere, and the pressure adjustment unit includes an atmosphere on-off valve that opens and closes the atmosphere communication pipe.

According to this configuration, by opening the atmosphere opening and closing valve and opening the atmosphere communication pipe, the internal atmosphere of the treatment liquid tank can be opened. Therefore, it is possible to realize a configuration in which the internal atmosphere of the processing liquid tank can be opened by a simple structure.

The atmosphere communication pipe may be provided with an orifice. In this case, since the orifice is provided in the atmosphere communication pipe, it is difficult for the gas to communicate with the inside of the pipe through the atmosphere. Therefore, even if the atmosphere communication pipe is opened, the inside of the treatment liquid tank is not decompressed in one breath, but the internal pressure is gradually lowered in a certain amount of time. Therefore, it is possible to realize a configuration in which the inside of the processing liquid tank is gradually opened to the atmosphere by a simple structure.

The processing liquid device may further include a communication liquid tank connected to the processing solution The inside communicates with the atmosphere of the atmosphere, and the pressure adjustment unit includes an opening adjustment unit that adjusts an opening degree of the atmosphere communication pipe.

According to this configuration, by adjusting the opening degree of the atmosphere communication pipe, the ease of passage of the gas inside the atmosphere communication pipe can be adjusted. Therefore, when the atmosphere inside the processing liquid tank is opened, the opening of the atmosphere communication pipe can be made low, and the time from when the inside of the processing liquid tank is opened to when the internal pressure is reduced to the atmospheric pressure can be performed. lengthen. Therefore, it is possible to realize a configuration in which the inside of the processing liquid tank is gradually opened to the atmosphere by a simple structure.

The processing liquid tank may include a plurality of processing liquid tanks, and the first processing liquid piping includes an individual piping connected to each of the processing liquid tanks, and a common piping connecting the plurality of individual pipings and the processing unit The opening and closing unit includes an individual opening and closing valve that opens and closes each of the separate pipes, and a common opening and closing valve that opens and closes the common pipe.

According to this configuration, when the supply of the processing liquid from the processing liquid supply device to the processing unit is stopped, the control device gradually opens the inside of the processing liquid tank in the pressurized state before the common opening and closing valve and the individual opening and closing valve are closed. The opening and closing unit is closed after the opening of the atmosphere begins. Thereby, even in the case where a plurality of processing liquid tanks are provided, the amount of bubbles generated by the treatment liquid can be reduced.

The treatment liquid stored in the treatment liquid tank may also contain an organic solvent.

When an organic solvent is used as the treatment liquid, most of the organic solvent is a flammable liquid, and the organic solvent cannot be transported by pumping, and the above-mentioned pressurizing unit is used to carry out the organic solvent to the treatment unit. Delivery (pressurized pressure feed method). In this case, the amount of bubbles contained in the organic solvent supplied from the treatment liquid supply device can be reduced.

Moreover, the present invention provides a substrate processing system including performing on a substrate a processing unit that uses a treatment liquid and a processing liquid supply device, wherein the processing unit includes a discharge unit that discharges a processing liquid to be supplied to the substrate, and a second processing liquid pipe that connects the first processing a liquid pipe and the discharge unit; and a process liquid valve for opening and closing the second process liquid pipe; and the control device includes: a control device for stopping supply of the process liquid from the process liquid pipe to the discharge unit; The treatment liquid valve is closed, and then the pressure adjustment unit is controlled to decompress the inside of the treatment liquid tank.

According to this configuration, when the discharge of the treatment liquid from the discharge unit is stopped, the control device first closes the treatment liquid valve, stops the supply of the treatment liquid from the treatment liquid pipe to the discharge portion, and then gradually opens the inside of the treatment liquid tank to the atmosphere. The above-mentioned opening and closing unit is closed after the opening of the atmosphere.

Since the opening and closing unit is closed after the start of the pressure reduction in the inside of the processing liquid tank, the inside of the processing liquid tank and the inside of the first processing liquid pipe are maintained in a state of being depressurized more than the above-described pressurized state after the opening and closing unit is closed. Since the solubility of the gas to the liquid is proportional to the pressure, a large amount of gas is not dissolved inside the treatment liquid pipe in the decompressed state. Therefore, the amount of dissolved gas of the treatment liquid dissolved in the inside of the treatment liquid tank and the inside of the first treatment liquid pipe can be reduced. Since the amount of dissolved gas in the treatment liquid is small, the amount of bubbles generated in the treatment liquid can be reduced.

Further, since the atmosphere inside the treatment liquid tank is gradually opened, it is possible to suppress or prevent the gas dissolved in the treatment liquid from appearing as bubbles in the decompression process.

Thereby, the amount of bubbles contained in the treatment liquid supplied to the treatment unit can be reduced. Thereby, a substrate processing system capable of suppressing or preventing generation of particles on the substrate can be provided.

In an embodiment of the invention, the processing liquid valve may be disposed above the opening and closing unit. In this case, the opening and closing unit is disposed in the processing liquid valve Further, in order to allow the treatment liquid stored in the treatment liquid tank to reach the treatment unit, it is necessary to pressurize the treatment liquid inside the treatment liquid tank with a higher pressure. In this case, the pressure inside the processing liquid tank and the first processing liquid piping at the time of supply becomes higher, and as a result, there is a possibility that the problem of the occurrence of the above-described bubbles is further remarkable.

However, since the inside of the processing liquid tank is gradually opened to the atmosphere, and the opening and closing unit is closed after the opening of the atmosphere, the amount of bubbles contained in the processing liquid supplied to the processing unit can be further reduced, thereby further suppressing Or prevent the generation of particles on the substrate.

The processing liquid supply device may be disposed below the processing unit.

According to this configuration, since the processing liquid supply device is installed in the lower layer, the length of the pipe of the first processing liquid pipe becomes long. Therefore, a portion having a high pressure is locally present inside the first treatment liquid pipe, and there is a possibility that the problem of the occurrence of the bubble is further increased.

However, since the inside of the processing liquid tank is gradually opened to the atmosphere, and the opening and closing unit is closed after the opening of the atmosphere, the amount of bubbles contained in the processing liquid supplied to the processing unit can be further reduced, thereby further suppressing Or prevent the generation of particles on the substrate.

Moreover, the present invention provides a processing liquid supply method, which is performed by a processing liquid supply device including: a processing liquid tank for storing a processing liquid; and a first processing liquid pipe connected to the substrate a treatment unit for treating the treatment liquid and the treatment liquid tank; an opening and closing unit for opening and closing the first treatment liquid pipe; and a pressurizing unit for pressurizing the treatment liquid inside the treatment liquid tank by gas Thereby, the treatment liquid is moved to the first treatment liquid pipe; wherein, in order to stop the treatment liquid The supply of the processing liquid supply device to the processing unit is gradually opened to the inside of the processing liquid tank in a pressurized state, and the opening and closing unit is closed after the opening of the atmosphere.

According to the method, when the supply of the treatment liquid from the treatment liquid supply device to the treatment unit is stopped, the control device gradually opens the atmosphere inside the treatment liquid tank which is pressurized by the pressurizing unit before the opening and closing unit is closed, and The above-mentioned opening and closing unit is closed after the opening of the atmosphere. Since the opening and closing unit is closed after the start of the pressure reduction in the inside of the processing liquid tank, the inside of the processing liquid tank and the inside of the first processing liquid pipe are maintained at a state of being decompressed more than the above-described pressurized state after the opening and closing unit is closed. . Since the solubility of the gas to the liquid is proportional to the pressure, a large amount of gas is not dissolved inside the treatment liquid pipe in the decompressed state. Therefore, the amount of dissolved gas of the treatment liquid dissolved in the inside of the treatment liquid tank and the inside of the first treatment liquid pipe can be reduced. Since the amount of dissolved gas in the treatment liquid is small, the amount of bubbles generated in the treatment liquid can be reduced.

Further, since the atmosphere inside the treatment liquid tank is gradually opened, it is possible to suppress or prevent the gas dissolved in the treatment liquid from appearing as bubbles in the decompression process.

Thereby, it is possible to provide a processing liquid supply method capable of reducing the amount of bubbles contained in the supplied processing liquid.

The above and other objects, features and advantages of the present invention will be apparent from

1‧‧‧Substrate processing system

2‧‧‧Processing unit

3‧‧‧Organic solvent supply device

4‧‧‧Substrate processing device

5‧‧‧1st control device

6‧‧‧2nd control device

7‧‧‧Processing chamber

8‧‧‧Organic solvent nozzle

9‧‧‧Organic solvent tank

10‧‧‧Individual solvent individual piping

11‧‧‧Organic solvent common piping

12‧‧‧ Flowmeter

13‧‧‧Common opening and closing valve

14‧‧‧Individual opening and closing valves

15‧‧‧ Pressurizing unit

16‧‧‧ pressure gauge

17‧‧‧Atmospheric communication piping

18‧‧‧Atmospheric opening and closing valve

19‧‧‧Fixed orifice

20‧‧‧ Pressurized gas piping

21‧‧‧Pressure valve

22‧‧‧Processing side piping

23‧‧‧Processing side common piping

24‧‧‧Processing side branch piping

25‧‧‧Organic Solvent Valve

26‧‧‧Rotary chuck

27‧‧‧Drug nozzle

28‧‧‧ rinse liquid nozzle

29‧‧‧Rotating base

30‧‧‧Rotary drive unit

31‧‧‧Drug valve

32‧‧‧Pharmaceutical piping

33‧‧‧ rinse valve

34‧‧‧ rinse liquid piping

41‧‧‧ liquid film

42‧‧‧ Foreign objects

43‧‧‧ bubbles

103‧‧‧Organic solvent supply device

106‧‧‧3rd control device

218‧‧‧ opening adjustment unit

D‧‧‧Delay

W‧‧‧Substrate

Fig. 1 is a schematic view showing the configuration of a substrate processing system according to an embodiment of the present invention.

2 is a view of the processing unit provided in the substrate processing system viewed from a horizontal direction Schematic diagram of the department.

Fig. 3 is a flow chart showing the discharge stop control executed in the above substrate processing apparatus.

Fig. 4 is a flow chart showing the discharge stop control executed in the organic solvent supply device.

Fig. 5 is a timing chart showing the measured values of the organic solvent valve, the common opening and closing valve, the individual opening and closing valves, and the atmospheric opening and closing valve of the discharge stop control in the substrate processing system, and the measured values of the pressure gauge.

Fig. 6 is a view showing a state of decompression from the opening of the atmosphere inside the organic solvent tank to the opening of the atmosphere.

Fig. 7 is a view showing a state in which a small foreign matter contained in a liquid film of an organic solvent is on the surface of a substrate.

Fig. 8 is a schematic view showing the configuration of a substrate processing system of another embodiment.

Fig. 9 is a view showing a modification of the present invention.

Fig. 1 is a schematic view of a substrate processing system 1 according to an embodiment of the present invention as seen from a horizontal direction. The substrate processing system 1 is a one-chip system in which a semiconductor wafer as an example of the substrate W is processed one at a time. The substrate processing system 1 includes a processing unit 2 that processes the substrate W, and an organic solvent supply device 3 that supplies the processing unit 2 with a processing liquid supply device that is an organic solvent as an example of the processing liquid. The processing unit 2 and the organic solvent supply device 3 are mutually independent units (units that can be moved independently of each other). That is, as shown in FIG. 1, the substrate processing system 1 is exemplified by a substrate processing apparatus 4 including a processing unit 2 and an organic solvent supply device 3 disposed at a position away from the substrate processing apparatus 4. The substrate processing device 4 is disposed in a clean room, and In one aspect, the organic solvent supply device 3 is disposed in a space below the clean room (for example, a subterranean layer) called a sub-fab. The substrate processing system 1 further includes: a first control device 5 that controls opening and closing of a device or a valve provided in the substrate processing device 4; and a second control device 6 that is provided to the organic solvent supply device 3 or The valve is opened and closed for control.

Further, the processing unit 2 may be a one-chip unit that processes the substrate W one at a time, or may be a batch type unit that processes the plurality of substrates W at one time. FIG. 1 shows an example in which the processing unit 2 is a one-chip unit. In addition, although only one organic solvent supply apparatus 3 is shown in FIG. 1, when a plurality of organic solvents are provided, the organic solvent supply device 3 corresponding to the liquid type may be provided.

The processing unit 2 includes a box-shaped processing chamber 7 having an internal space, and an organic solvent nozzle (discharge portion) 8 for supplying an organic solvent to the substrate W held in the horizontal position in the processing chamber 7. (Refer to Figure 2). In this embodiment, the processing unit 2 is provided in plural. A plurality of processing units are arranged, for example, in a three-layer structure as shown in FIG. 1. Although not shown in FIG. 1, four processing units are disposed in each layer portion, for example. In this embodiment, the processing unit 2 exemplifies the case where the organic solvent supply device 3 supplies the chemical liquid to all of the processing units 2 corresponding to a total of 12 processing units 2, but may be an organic solvent supply. The device 3 supplies the chemical solution to the processing unit 2 of the portion corresponding to each of the processing units 2 (for example, each of the three processing units 2 stacked in the vertical direction).

The organic solvent supply device 3 includes a plurality of (for example, two in FIG. 1) organic solvent tanks (treatment liquid tanks) 9 for storing organic solvents, and an organic solvent individual piping (individual piping) 10, which are connected to each The organic solvent tank 9 and the organic solvent common pipe (common pipe) 11 are connected to each of a plurality of (for example, two in FIG. 1) organic solvent individual pipes 10 And the processing unit 2 side. The organic solvent stored in the organic solvent tank 9 is, for example, IPA (isopropyl alcohol; Isopropyl Alcohol). Each of the organic solvent individual pipes 10 is provided with an individual opening and closing valve (opening and closing means) 14 that opens and closes the organic solvent individual pipe 10. In the organic solvent common pipe 11, a flow meter 12 for measuring the flow rate of the organic solvent flowing through the organic solvent common pipe 11 and a common opening and closing for opening and closing the organic solvent common pipe 11 are sequentially disposed from the organic solvent tank 9 side. Valve (opening and closing unit) 13. The organic solvent individual pipe 10 and the organic solvent common pipe 11 are made of a resin resistant resin such as PFA (tetrafluoroethylene-perfluoro-alkylvinyl-ether-tetrafluoro-ethlene-copolymer). form. The organic solvent individual pipe 10 and the organic solvent common pipe 11 constitute a first treatment liquid pipe.

The organic solvent supply device 3 is a liquid supply device of a pressurized pressure feed method. Therefore, the organic solvent supply device 3 further includes a pressurizing unit 15 that moves the organic solvent in the organic solvent tank 9 to the organic solvent common pipe 11 via the organic solvent individual pipe 10, and a pressure gauge 16 for measuring the organic solvent. a pressure inside the tank 9; a new liquid supply unit (not shown) that supplies a new liquid from the organic solvent of the organic solvent supply source to the organic solvent tank 9; and a liquid amount sensor (not shown) for The amount of liquid (for example, the liquid level) stored in the inside of the organic solvent tank 9 is detected. The pressurizing unit 15, the pressure gauge 16, the new liquid supply unit, and the liquid amount sensor are provided in each of the organic solvent tanks 9. Since IPA is a flammable liquid, it is necessary to implement explosion-proof measures when using the pump pressure feeding method. In order to simplify the apparatus, the organic solvent supply device 3 is a pressurized pressure feed method.

Further, the organic solvent supply device 3 further includes an atmosphere communication pipe 17 that communicates with the inside of the organic solvent tank 9 and the atmosphere, and an atmospheric on-off valve (pressure adjustment unit) 18 that opens and closes each of the atmosphere communication pipes 17. The atmosphere communication pipe 17 and the atmosphere on-off valve 18 are provided in each of the organic solvent tanks 9. Connected to the atmosphere at the atmosphere 17, opening and closing at the atmosphere A downstream side (atmosphere side) of the valve 18 is provided with a fixing orifice (aperture) 19.

Each pressurizing unit 15 includes a pressurized gas pipe 20 through which a high-pressure gas for pressurization (for example, an inert gas such as nitrogen gas) flows, and a pressurizing valve 21 that opens and closes the pressurized gas pipe 20. The high pressure gas from the pressurized gas pipe 20 is supplied to the organic solvent tank 9 by opening the pressurizing valve 21. In this supply state, the pressure inside the organic solvent tank 9 and the pressure inside the pipes 10 and 11 corresponding to the organic solvent tank 9 are maintained at a high pressure (for example, about 2 atmospheres in this embodiment).

Each of the organic solvent tanks 9 is partitioned into a container shape by a partition wall. The partition walls of the organic solvent tank 9 are formed, for example, using stainless steel, and the entire inner surface thereof is coated with PTFE (polytetrafluoroethylene). The capacity of each organic solvent tank 9 is several liters to several tens of liters.

The organic solvent is supplied to the processing unit 2 side from one organic solvent tank 9 selected from the plurality of organic solvent tanks 9. Further, if the organic solvent stored in one of the organic solvent tanks 9 in use is used up, the supply source of the organic solvent is switched to another organic solvent tank 9, and the organic solvent stored in the other organic solvent tank 9 is It is supplied to the processing unit 2 side.

At this time, a new liquid of the organic solvent can be supplied from the fresh liquid supply unit (not shown) to the empty organic solvent tank 9 (an organic solvent tank 9). Further, since the inside of the organic solvent tank 9 in a pressurized state is in a high pressure state, the atmosphere opening and closing valve 18 corresponding to the organic solvent tank 9 is opened before the supply of the organic solvent, and the organic solvent tank 9 is opened. The inside is decompressed from the high pressure state to the atmospheric pressure, whereby the supply of the new liquid of the organic solvent to the organic solvent tank 9 can be performed.

The switching of the supply source of the organic solvent is performed by opening and closing the individual opening and closing valves 14 which are interposed in the respective individual pipes 10 of the organic solvent. That is, individual opening and closing The valve 14 functions as a switching valve for switching the organic solvent tank 9 of the supply source.

The second control device 6 is configured using, for example, a microcomputer. The second control device 6 includes an arithmetic unit such as a CPU (Central Processing Unit), a fixed memory device, a storage unit such as a hard disk drive, and an output input unit. A program for execution by the arithmetic unit is stored in the storage unit.

The second control device 6 opens and closes the common opening and closing valve 13, the individual opening and closing valve 14, the air opening and closing valve 18, the pressure valve 21, and the like in accordance with a program set in advance in the storage unit. Further, the detection outputs of the flow meter 12 and the pressure gauge 16 are input to the second control device 6.

When the organic solvent stored in the organic solvent tank 9 is supplied to the processing unit 2 side, the second control device 6 opens and closes an organic solvent tank while closing the individual opening and closing valves 14 corresponding to the other organic solvent tank 9. 9 corresponds to the individual opening and closing valve 14, and the common opening and closing valve 13 is opened. Further, the second control device 6 opens the pressurizing valve 21 corresponding to the organic solvent tank 9. Thereby, the high-pressure gas is supplied to the organic solvent tank 9, and the organic solvent stored in the organic solvent tank 9 is pressure-fed out to the corresponding organic solvent individual piping 10 by the supply pressure (nitrogen pressure) at that time. The organic solvent common pipe 10 is moved to the organic solvent common pipe 11 . Thereby, the organic solvent is supplied from the organic solvent supply device 3 toward the processing unit 2. In the supply state of the organic solvent, the pressure inside the organic solvent tank 9 and the pressure inside the pipes 10 and 11 corresponding to the organic solvent tank 9 are maintained at a high pressure (for example, about 2 atmospheres).

Further, when the organic solvent stored in the other organic solvent tank 9 is supplied to the processing unit 2 side, the second control device 6 opens and the other state in a state where the individual opening and closing valve 14 corresponding to the organic solvent tank 9 is closed. The organic solvent tank 9 corresponds to the individual opening and closing valve 14 and opens the common opening and closing valve 13. Further, the second control device 6 is opened with another organic solvent tank 9 Corresponding pressure valve 21. Thereby, the high-pressure gas is supplied to the other organic solvent tank 9, and the organic solvent stored in the other organic solvent tank 9 is pressure-fed out to the corresponding organic solvent individual piping by the supply pressure (nitrogen pressure) at this time. 10 is moved to the organic solvent common pipe 11 via the organic solvent individual pipe 10 . Thereby, the organic solvent is supplied from the organic solvent supply device 3 toward the processing unit 2 side. In the supply state of the organic solvent, the pressure inside the other organic solvent tank 9 and the pressure inside the pipes 10 and 11 corresponding to the other organic solvent tank 9 are maintained at a high pressure (for example, about 2 atmospheres).

In the following description, the organic solvent tank 9 in the organic solvent supply to the processing unit 2 side is referred to as "the current organic solvent tank 9".

The organic solvent from the organic solvent supply device 3 is supplied to the organic solvent nozzle 8 included in each processing unit 2 via the processing-side piping (second processing liquid piping) 22 inside the substrate processing apparatus 4. The processing-side common pipe 22 includes a processing-side common pipe 23 connected to the organic solvent common pipe 11 and a processing-side branch pipe 24 that connects the respective organic solvent nozzles 8 and the processing-side common piping 23 . An organic solvent valve 25 for opening and closing the processing side branch pipe 24 is interposed in the processing side branch pipe 24. When the organic solvent is supplied from the organic solvent supply device 3 toward the processing unit 2, the organic solvent valve 25 is opened by the second control device 6, and the organic solvent is supplied to the organic solvent nozzle 8 included in each processing unit 2. . Further, the treatment-side common piping 23 and the treatment-side branch piping 24 are resistant to chemicals such as PFA (perfluoro-alkylvinyl-ether-tetrafluoro-ethlene-copolymer). Formed from a resin.

2 is a schematic view of the inside of the processing unit 2 as viewed in the horizontal direction.

The processing unit 2 further includes a rotary chuck 26 that holds a substrate W in a horizontal posture in the processing chamber 7 and causes the substrate W to pass around the center of the substrate W. The vertical axis of rotation rotates; a liquid medicine nozzle 27 for supplying the liquid medicine to the substrate W held by the rotary chuck 26; and a rinse liquid nozzle 28 for supplying the substrate W held by the rotary chuck 26. Washing fluid.

The rotary chuck 26 includes a disk-shaped rotary base 29 that substantially horizontally holds the substrate W to be rotatable about a vertical axis, and a rotary drive unit 30 of a motor or the like that causes the rotary base 29 to be vertically The axis rotates. The chemical liquid nozzle 27 and the rinsing liquid nozzle 28 may be fixed nozzles in which the liquid medicine position of the liquid medicine and the rinsing liquid on the substrate W are fixed, or the liquid liquid position of the chemical liquid and the rinsing liquid may be at the rotation center of the substrate W. A scanning nozzle that moves into the range of the periphery of the substrate W.

The chemical liquid nozzle 27 is connected to the chemical liquid pipe 32 through which the chemical liquid valve 31 is disposed. The chemical liquid is supplied to the chemical liquid nozzle 27. The chemical liquid supplied to the chemical liquid nozzle 27 includes, for example, sulfuric acid, acetic acid, nitric acid, hydrochloric acid, hydrofluoric acid, ammonia water, hydrogen peroxide water, organic acid (for example, citric acid, oxalic acid, etc.), and an organic base (for example, TMAH: four A liquid of at least one of methyl alkoxide or the like and an interface activator or an anticorrosive agent.

The rinse liquid nozzle 28 is connected to the rinse liquid pipe 34 through which the rinse liquid valve 33 is disposed. Pure water (deionized water) as an example of the rinsing liquid is supplied to the rinsing liquid nozzle 28. The rinse liquid supplied to the rinse liquid nozzle 28 is not limited to pure water, and may be any of carbonated water, electrolytic ionized water, hydrogen water, ozone water, and hydrochloric acid water having a diluted concentration (for example, about 10 to 100 ppm). .

The first control device 5 is configured using, for example, a computer. The first control device 5 includes an arithmetic unit such as a CPU, a fixed memory device, a storage unit such as a hard disk drive, and an output input unit. A program for execution by the arithmetic unit is stored in the storage unit. The first control device 5 controls the operation of the rotary drive unit 30 or the like in accordance with a program set in advance in the storage unit. Further, the first control device 5 pairs the organic solvent valve 25 and the chemical liquid valve 31. The opening and closing operations of the flushing liquid valve 33 and the like are controlled. Further, the first control device 5 (substrate processing device 4) is provided to be communicable with the second control device 6 (organic solvent supply device 3).

As shown in FIGS. 1 and 2, before the start of the process of the processing unit 2 included in the substrate processing apparatus 4, the first control device 5 transmits a supply request signal to the organic solvent supply device 3. When the organic solvent supply device 3 receives the supply request signal, the second control device 6 opens the individual opening and closing valve 14 corresponding to the current organic solvent tank 9, opens the common opening and closing valve 13, and opens to correspond to the current organic solvent tank 9. Pressurizing valve 21. Thereby, the organic solvent can be supplied from the organic solvent supply device 3 to the processing unit 2 via the organic solvent common pipe 11 . In the state where the organic solvent supply device 3 supplies the organic solvent, the pressure inside the organic solvent tank 9 and the pressure inside the pipes 10 and 11 corresponding to the organic solvent tank 9 are maintained at a high pressure (for example, about 2 atmospheres). ).

As shown in FIG. 2, when the processing unit 2 processes the substrate W with the processing liquid (chemical liquid, rinsing liquid, and organic solvent), the first control device 5 holds the substrate W horizontally by rotating the chuck 26. The substrate W is rotated about the vertical axis. In this state, the first control device 5 opens the chemical liquid valve 31, and discharges the chemical liquid from the chemical liquid nozzle 27 toward the upper surface of the substrate W. The chemical liquid supplied to the substrate W is diffused outward on the substrate W by the centrifugal force generated by the rotation of the substrate W, and is discharged from the peripheral portion of the upper surface of the substrate W toward the periphery of the substrate W. After the discharge of the chemical liquid from the chemical liquid nozzle 27 is stopped, the first control device 5 opens the rinse liquid valve 33, and discharges the rinse liquid from the rinse liquid nozzle 28 toward the upper surface of the substrate W in the rotated state. Thereby, the liquid medicine on the substrate W is washed away by the rinsing liquid. After the discharge of the rinse liquid from the rinse liquid nozzle 28 is stopped, the first control device 5 opens the organic solvent valve 25 to discharge the organic solvent from the organic solvent nozzle 8 toward the upper surface of the substrate W in the rotated state. Thereby, the substrate W is made The rinse solution is replaced with an organic solvent. Then, the first control device 5 causes the substrate W to be dried at a high speed by the spin chuck 26 to dry the substrate W. In this way, a series of processes for the substrate W are performed.

FIG. 3 is a flow chart showing the discharge stop control executed by the substrate processing apparatus 4. Fig. 4 is a flow chart showing the discharge stop control executed by the organic solvent supply device 3. FIG. 5 is a timing chart showing the measured values of the organic solvent valve 25, the common opening and closing valve 13, the individual opening and closing valve 14, and the atmospheric opening and closing valve 18 in the substrate processing system 1 and the opening and closing state of the atmospheric opening and closing valve 18. Fig. 6 is a view showing a state of decompression from the opening of the atmosphere inside the organic solvent tank 9 to the opening of the atmosphere.

In the processing unit 2, when the organic solvent is discharged from the organic solvent nozzle 8, the first control device 5 opens the organic solvent valve 25. Thereby, the organic solvent is discharged from the organic solvent nozzle 8.

Then, when the discharge stop timing is reached (YES in step S1 in Fig. 3), the first control device 5 closes the organic solvent valve 25 (step S2 in Fig. 3). Then, when the first control device 5 determines that the substrate processing device 4 is in a state where the organic solvent is not required to be supplied (YES in step S3 of FIG. 3), the first control device 5 does not need to transmit the organic solvent supply device 3. The signal is supplied (step S4 of Fig. 3). In addition, in the case where the stop timing is not issued (NO in step S1 of FIG. 3), it is determined that the organic solvent is not in a state of being supplied (NO in step S3 of FIG. 3), and after the supply of the signal is not required. The process shown in Figure 3 returns.

The state in which the organic solvent is not supplied is a state in which the substrate processing apparatus 4 does not need to supply more organic solvent. An example of a state in which the organic solvent is not required to be supplied is a state in which the discharge of the organic solvent in the processing unit 2 is completed, and the discharge of the organic solvent in the other processing unit 2 is completed. Also, in addition to another processing unit 2 In addition to the completion of the discharge of the organic solvent, the processing unit 2 included in the substrate processing apparatus 4 may not have a predetermined discharge state of the organic solvent, and may be added to the condition in which the organic solvent is not supplied. in.

When the supply signal from the substrate processing apparatus 4 is not received (YES in step T1 of FIG. 4), the second control unit 6 opens the atmospheric on-off valve 18 corresponding to the current organic solvent tank 9 (step T2 of FIG. 4). ).

The inside of the organic solvent tank 9 is depressurized by opening the atmospheric opening and closing valve 18. However, since the fixed orifice 19 is provided in the atmosphere communication pipe 17, it is difficult for the gas to communicate with the inside of the pipe 17 through the atmosphere. Therefore, even if the atmosphere communication pipe 17 is opened, the inside of the organic solvent tank 9 is not depressurized at a time, and the internal pressure is gradually lowered for a certain period of time. That is, it takes a certain amount of time from the start of the opening of the atmosphere inside the organic solvent tank 9 until the internal pressure drops to the atmospheric pressure. By combining the atmospheric opening and closing valve 18 and the fixed orifice 19, it is possible to gradually open the atmosphere of the organic solvent tank 9 in a pressurized state.

Further, as shown in FIG. 5, there is a predetermined delay D between the closing of the organic solvent valve 25 and the opening of the atmosphere opening and closing valve 18.

Next, the second control device 6 refers to the detection output of the pressure gauge 16 corresponding to the current organic solvent tank 9, and checks whether or not the inside of the organic solvent tank 9 is reduced to atmospheric pressure (step T3 in Fig. 4). Then, when the pressure inside the organic solvent tank 9 is lowered to the atmospheric pressure (YES in step T3 in Fig. 4), the second control unit 6 closes the common opening and closing valve 13 and the individual opening and closing valve 14 (step T4 in Fig. 4). Therefore, after the valves 13 and 14 are closed, the inside of the organic solvent tank 9, the inside of the organic solvent individual pipe 10, and the inside of the organic solvent common pipe 11 are maintained at atmospheric pressure. Since the solubility of the gas to the liquid is proportional to its pressure, the liquid at atmospheric pressure does not have a relatively large amount of gas dissolved therein. therefore, The amount of dissolved gas of the organic solvent dissolved in the inside of the organic solvent tank 9, the inside of the organic solvent individual pipe 10, and the organic solvent common pipe 11 can be reduced.

When the pressure inside the organic solvent tank 9 is higher than the atmospheric pressure (NO in step T3 of FIG. 4), then the second control device 6 starts from the opening of the atmospheric opening and closing valve 18 (that is, the atmosphere is open). Whether or not the predetermined time (X seconds (for example, about 5 seconds)) has been investigated (step T5 of Fig. 4). Then, if X seconds elapse from the opening of the atmospheric on-off valve 18 (YES in step T5 of FIG. 4), the second control unit 6 refers to the detection output of the pressure gauge 16 corresponding to the current organic solvent tank 9 (FIG. 4). Step T6). At this time, when the measured value (measured pressure) after X seconds has elapsed since the opening of the atmosphere has not reached the threshold value (set to a predetermined threshold value in which the large air pressure is slightly high), the second control device 6 determines that Error status.

The second control device 6 is provided with a memory (not shown). The threshold value of the pressure value is stored in the memory system. As shown in Fig. 6, the threshold value is the lower limit pressure value after X seconds from the start of the atmosphere opening. If the measured value does not reach the threshold value, if the decompression speed inside the organic solvent tank 9 is too fast, it is taken as It is judged to be in an error state by rapid decompression. The dotted line shown in Fig. 6 is an error state. The two-point chain line shown in Fig. 6 is in a state of not being erroneous (OK state). When the decompression rate inside the organic solvent tank 9 is too fast, there is a possibility that a gas dissolved in the organic solvent appears as bubbles (microbubbles) during the depressurization. Therefore, the second control device 6 detects that the decompression speed inside the organic solvent tank 9 is faster than the predetermined speed as an error state.

When the second control device 6 determines that it is in an error state, it performs a predetermined error process (step T7 in Fig. 4). The error processing includes a case where the occurrence of an error state is stored in the recording file, or an alarm is issued from the substrate processing apparatus 4 or the organic solvent supply device 3.

Moreover, in the case where the signal is not required to be supplied (step T1 of FIG. 4 is No), when X seconds have not elapsed since the opening of the atmospheric opening and closing valve 18 (NO in step T5 of Fig. 4), the measured value is above the threshold value (YES in step T5 of Fig. 4), valves 13, 14 After the shutdown and the end of the error processing, the processing shown in Fig. 4 is returned.

Fig. 7 is a view showing a state in which the fine foreign matter 42 contained in the liquid film 41 of the organic solvent is on the surface of the substrate W. A liquid film 41 of an organic solvent is formed on the surface of the substrate W by supplying an organic solvent to the surface of the substrate W.

There is a case where the organic solvent discharged from the organic solvent nozzle 8 contains the air bubbles 43. When the liquid film 41 of the organic solvent contains the air bubbles 43, the gas-liquid interface is formed by the liquid of the organic solvent and the air bubbles 43. The minute foreign matter 42 contained in the organic solvent is attracted to the gas-liquid interface, and grows into minute particles of a predetermined size. As a result, there is a possibility that fine particles are generated on the surface of the substrate W after drying. Further, when the amount of the bubbles contained in the liquid film 41 of the organic solvent is large, there is a possibility that the gas-liquid interface has a large area and the problem of generation of fine particles is remarkable.

Further, as described above with reference to Fig. 1, the installation place of the organic solvent supply device 3 is the lower layer (lower layer) of the substrate processing apparatus 4. In other words, the valves 13 and 14 are disposed below the organic solvent valve 25. In this case, in order to allow the organic solvent stored in the organic solvent tank 9 to reach the treatment unit 2, it is necessary to pressurize the organic solvent in the organic solvent tank 9 at a higher pressure. In this case, the pressure inside the grooves 9, 10, and 11 becomes higher, and as a result, there is a possibility that the problem of generating bubbles is further remarkable.

Moreover, since the organic solvent supply device 3 is provided in the lower layer, the pipe length of the organic solvent common pipe 11 is long (for example, 5 to 10 m). Therefore, a portion having a high pressure is locally present inside the organic solvent common pipe 11, and there is a possibility that the problem of the bubble generation described above is further enhanced.

Here, in order to contribute to the understanding of the features and effects of the present embodiment, Other forms of substrate processing systems are discussed for reference.

Fig. 8 is a view showing the configuration of a substrate processing system of another form.

In the other aspects, portions corresponding to those in the first embodiment of the present invention are denoted by the same reference numerals as in the case of FIGS. 1 to 6 and the description thereof is omitted.

The substrate processing system of another form includes an organic solvent supply device 103 and a third control device 106 that controls the organic solvent supply device 103. The third control device 106 is constituted by a computer. The difference between the organic solvent supply device 103 and the above-described organic solvent supply device 3 is that the atmospheric communication pipe 17 (see FIG. 1), the atmospheric opening and closing valve 18 (see FIG. 1), and the pressure gauge 16 (see FIG. 1) are discarded. . The other configuration is the same as that of the organic solvent supply device 3 described above.

In the organic solvent supply device 103, if a supply signal is not received from the substrate processing device 4 (if the organic solvent valve 25 is closed), the third control device 106 then closes the common on-off valve 13 and the individual on-off valve 14 . In the organic solvent supply device 3 in a state in which the organic solvent is supplied as described above, the organic solvent tank 9 and the pipes 10 and 11 corresponding to the organic solvent tank 9 (hereinafter, may be referred to as "slots, etc. 9, 10" , 11") The internal pressure is maintained at a high pressure (for example, about 2 atmospheres). Since the common opening and closing valve 13 and the individual opening and closing valve 14 are closed without releasing the pressure inside the grooves 9, 10, and 11, the pressure inside the grooves 9, 10, and 11 is maintained after the valves 13 and 14 are closed. The state of high pressure.

Since the pressure is continuously supplied by the pressurized gas of a high pressure, a large amount of gas (an inert gas such as nitrogen) is dissolved in the organic solvent inside the tanks 9, 10, and 11. In addition, the ambient gas (for example, oxygen) outside the pipes 10 and 11 penetrates the pipe wall of the pipes 10 and 11 made of PFA, and the solution is present in the liquid-tight state inside the pipes 10 and 11. The possibility in organic solvents. By "the solubility of gas to liquid is proportional to its pressure" Henry's law, inside the pipes 10, 11 under high pressure, there is also the possibility that a large amount of ambient gas (for example, oxygen) is dissolved in the organic solvent. As a result, there is a possibility that the amount of bubbles contained in the organic solvent discharged to the substrate W increases.

Further, since the pressure inside the grooves 9, 10, and 11 is maintained at a high pressure after the valves 13 and 14 are closed, when the organic solvent is re-discharged in the processing unit 2, the organic solvent valve 25 is When the organic solvent is discharged from the organic solvent nozzle 8 and the organic solvent is kept at a high pressure (especially, the organic solvent in the organic solvent common pipe 11), the gas is rapidly decompressed, and the gas dissolved in the inside becomes a bubble. The possibility of a large amount of foaming.

On the other hand, according to the embodiment, when the supply of the processing liquid from the organic solvent supply device 3 to the processing unit 2 is stopped, the third control device 106 opens the atmosphere communication pipe before the closing of the common opening and closing valve 13 and the individual opening and closing valve 14 is facilitated. 17. The inside of the organic solvent tank 9 in a pressurized state is gradually opened to the atmosphere, and after the pressure inside the organic solvent tank 9 is lowered to the atmospheric pressure, the common opening and closing valve 13 and the individual opening and closing valve 14 are closed. Therefore, after the valves 13 and 14 are closed, the inside of the organic solvent tank 9, the inside of the organic solvent individual pipe 10, and the inside of the organic solvent common pipe 11 are maintained at atmospheric pressure.

The amount of gas dissolved in the liquid at atmospheric pressure is small. Therefore, the amount of dissolved gas in the organic solvent dissolved in the inside of the organic solvent tank 9, the inside of the organic solvent individual pipe 10, and the organic solvent common pipe 11 can be reduced. Since the amount of dissolved gas dissolved in the organic solvent is small, the amount of bubbles generated in the organic solvent can be reduced.

When the processing unit 2 re-discharges the organic solvent, the inside of the organic solvent individual pipe 10 and the inside of the organic solvent common pipe 11 are maintained in a pressurized state, and the organic solvent valve 25 is opened in this state. At the time of this re-discharging, the pressure of the inside of the pipes 10 and 11 is decompressed with the opening of the organic solvent valve 25, but the pipe is dissolved. Since the amount of dissolved gas in the organic solvent inside 10 and 11 is small, the amount of bubbles generated in the organic solvent accompanying the pressure reduction can be reduced.

Further, since the atmosphere inside the organic solvent tank 9 is gradually opened, it is possible to suppress or prevent the gas dissolved in the organic solvent, and it may become a bubble during the depressurization.

Thereby, the amount of bubbles contained in the organic solvent supplied from the organic solvent supply device 3 to the processing unit 2 can be reduced.

Although an embodiment of the present invention has been described above, the present invention may be embodied in other forms.

For example, in the above-described embodiment, the pressure inside the organic solvent tank 9 is lowered to the atmospheric pressure based on the measured value of the pressure gauge 16, but the pressure drop inside the organic solvent tank 9 can be detected by the measured value of the pressure gauge 16. The pressure inside the organic solvent tank 9 is lowered to atmospheric pressure by a predetermined pressure and by a predetermined time from the detection.

In addition, although the common on-off valve 13 and the individual on-off valve 14 are closed after the pressure inside the organic solvent tank 9 is lowered to the atmospheric pressure, the time may be set to be before the atmospheric pressure is started. The common opening and closing valve 13 and the individual opening and closing valve 14 are closed.

In addition, it has been described that the fixed orifice 19 and the atmosphere opening and closing valve 18 are respectively disposed in the atmosphere communication pipe 17, but the orifice may be provided in the atmosphere opening and closing valve 18 itself. That is, a valve with an orifice may be provided as the atmosphere opening and closing valve 18.

Further, as shown in FIG. 9, instead of the fixing orifice 19, an opening degree adjusting unit 218 for adjusting the opening degree of the atmosphere communication pipe 17 may be provided. The opening adjustment unit 218 may be a flow adjustment valve as shown in FIG. 9 or a variable orifice (flow adjustment orifice).

Although not shown, the flow regulating valve includes a valve body in which a valve seat is provided, a valve body that opens and closes the valve seat, and an actuator that causes the valve body to be between an open position and a closed position. mobile. As the actuator, an electric motor, a cylinder, or the like can be employed. Further, as the flow rate adjusting valve, various forms such as a needle valve, a diaphragm valve, and a butterfly valve may be employed.

Further, the opening degree adjusting unit 218 may be used in combination with the atmosphere opening and closing valve 18. When the opening degree adjusting unit 218 has an opening and closing function, the atmosphere opening and closing valve 18 may be abolished.

Further, the fixing opening 19 or the opening degree adjusting unit 218 may not be provided. In this case, the second control device 6 can also gradually open the inside of the organic solvent tank 9 by setting the opening speed of the atmospheric opening and closing valve 18 to a low speed.

Further, the pressure adjusting means for adjusting the pressure inside the organic solvent tank 9 does not need to be provided in the atmosphere communication pipe 17. The pressure adjustment unit can also be disposed directly in the organic solvent tank 9, for example.

In the above-described embodiment, the organic solvent supply device 3 is described as an example in which a plurality of organic solvent tanks 9 are provided. However, the organic solvent supply device 3 may include only one organic solvent tank 9. In this case, since the organic solvent tank of the supply source is not required to be switched, the organic solvent individual pipe 10 and the individual opening and closing valve 14 can be abolished.

Further, the organic solvent supply device 3 may include not only a mechanism for supplying an organic solvent but also a mechanism for supplying another chemical liquid. In other words, it may be configured to be common to other chemical supply devices.

In addition, in the above-described embodiment, IPA is described as an organic solvent supplied from the organic solvent supply device 3, but in addition to IPA, An organic solvent such as methanol, ethanol, acetone, hydrofluoroether (HEF, Hydro Fluoro Ether) or ethylene glycol (EG, Ethylene Glycol) may be used.

Further, in the above description, the unit in which the processing unit 2 and the organic solvent supply device 3 are independent of each other has been described. However, the processing unit 2 and the organic solvent supply device 3 may be a part of a common device. That is, the substrate processing system may include a substrate processing apparatus including the processing unit 2 and the organic solvent supply device 3. In this case, a control device in which the first and second control devices 5 and 6 are integrated may be used.

In addition, the organic solvent supply device 3 that supplies an organic solvent is exemplified to describe the treatment liquid supply device. However, the treatment liquid supply device is not limited to the case where the organic solvent is supplied, and the chemical solution or the rinse solution may be supplied.

Further, in the above-described embodiment, the semiconductor wafer is proposed as the substrate W to be processed, but the semiconductor wafer is not limited thereto, and for example, a glass substrate for a liquid crystal display device, a substrate for a plasma display panel, or a FED may be used. Other types of substrates such as a substrate, a substrate for a disk, a substrate for a magnetic disk, a substrate for a magnetic disk, a substrate for a mask, a ceramic substrate, and a substrate for a solar cell are used as processing targets.

The embodiments of the present invention have been described in detail, but these are only specific examples for clarifying the technical contents of the present invention, and the present invention is not limited to the specific examples, and the scope of the present invention is It is only limited by the scope of the attached patent application.

The present application is directed to Japanese Patent Application No. 2015-189918, the entire disclosure of which is hereby incorporated by reference.

1‧‧‧Substrate processing system

2‧‧‧Processing unit

3‧‧‧Organic solvent supply device

4‧‧‧Substrate processing device

5‧‧‧1st control device

6‧‧‧2nd control device

7‧‧‧Processing chamber

8‧‧‧Organic solvent nozzle

9‧‧‧Organic solvent tank

10‧‧‧Individual solvent individual piping

11‧‧‧Organic solvent common piping

12‧‧‧ Flowmeter

13‧‧‧Common opening and closing valve

14‧‧‧Individual opening and closing valves

15‧‧‧ Pressurizing unit

16‧‧‧ pressure gauge

17‧‧‧Atmospheric communication piping

18‧‧‧Atmospheric opening and closing valve

19‧‧‧Fixed orifice

20‧‧‧ Pressurized gas piping

21‧‧‧Pressure valve

22‧‧‧Processing side piping

23‧‧‧Processing side common piping

24‧‧‧Processing side branch piping

25‧‧‧Organic Solvent Valve

Claims (12)

A processing liquid supply device for supplying a processing liquid to a processing unit for performing a treatment using a processing liquid on a substrate, comprising: a processing liquid tank storing a processing liquid; and a first processing liquid pipe connected to the processing unit and The processing liquid tank; the opening and closing unit for opening and closing the first processing liquid pipe; and the pressurizing unit for supplying the processing liquid inside the processing liquid tank to the inside of the first processing liquid pipe, and using the gas pair The treatment liquid is pressurized; a pressure adjustment unit for adjusting the pressure inside the treatment liquid tank; and a control device for opening and closing the supply of the treatment liquid from the treatment liquid supply device toward the treatment unit Before the unit is closed, the pressure adjusting unit is controlled to gradually open the inside of the processing liquid tank in a pressurized state, and the opening and closing unit is closed after the opening of the atmosphere. The processing liquid supply device according to claim 1, wherein the control device closes the opening and closing unit when the pressure inside the processing liquid tank drops to atmospheric pressure. The processing liquid supply device according to claim 2, further comprising a pressure gauge for measuring a pressure inside the processing liquid tank, wherein the control device is the pressure gauge at a time point when a predetermined time elapses from the opening of the atmosphere When the detected value is equal to or greater than a predetermined threshold, the above-described opening and closing unit is closed. The treatment liquid supply device according to any one of claims 1 to 3, further comprising an atmosphere communication pipe that communicates the inside of the treatment liquid tank with the atmosphere, wherein the pressure adjustment unit includes an atmosphere opening and closing for opening and closing the atmosphere communication pipe valve. The processing liquid supply device of claim 4, wherein the atmosphere communication piping is disposed There are holes. The processing liquid supply device according to any one of claims 1 to 3, further comprising an atmosphere communication pipe that communicates between the inside of the treatment liquid tank and the atmosphere, wherein the pressure adjustment unit includes adjusting an opening degree of the atmosphere communication pipe. Opening adjustment unit. The processing liquid supply device according to any one of claims 1 to 3, wherein the processing liquid tank includes a plurality of processing liquid tanks, and the first processing liquid piping includes individual piping connected to each processing liquid tank, and A common pipe connecting each of the plurality of individual pipes to the processing unit, the opening and closing unit includes an individual opening and closing valve that opens and closes each of the separate pipes, and a common opening and closing valve that opens and closes the common pipe. The treatment liquid supply device according to any one of claims 1 to 3, wherein the treatment liquid stored in the treatment liquid tank contains an organic solvent. A substrate processing system comprising: a processing unit that performs a process of using a processing liquid on a substrate; and a processing liquid supply device according to any one of claims 1 to 3, wherein the processing unit includes a discharge unit for discharging a treatment liquid to be supplied to the substrate; a second treatment liquid pipe connected to the first treatment liquid pipe and the discharge portion; and a treatment liquid valve for opening and closing the second treatment liquid pipe; and the control device including the control The apparatus closes the processing liquid valve in order to stop the supply of the processing liquid from the processing liquid piping to the discharge unit, and then controls the pressure adjusting unit to depressurize the inside of the processing liquid tank. The substrate processing system of claim 9, wherein the processing liquid valve is disposed above the opening and closing unit. The substrate processing system of claim 10, wherein the processing liquid supply device is disposed below the processing unit. A processing liquid supply method is performed by a processing liquid supply device including: a processing liquid tank storing a processing liquid; and a first processing liquid pipe connected to a substrate to be treated with a processing liquid The processing unit and the processing liquid tank; the opening and closing unit for opening and closing the first processing liquid pipe; and the pressurizing unit for sending the processing liquid inside the processing liquid tank to the inside of the first processing liquid pipe And pressurizing the treatment liquid with a gas; wherein, in order to stop the supply of the treatment liquid from the treatment liquid supply device toward the treatment unit, the inside of the treatment liquid tank in a pressurized state is gradually opened to the atmosphere, and The opening and closing unit is closed after the opening of the atmosphere is started.