TW201703928A - Machining device - Google Patents
Machining device Download PDFInfo
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- TW201703928A TW201703928A TW104144458A TW104144458A TW201703928A TW 201703928 A TW201703928 A TW 201703928A TW 104144458 A TW104144458 A TW 104144458A TW 104144458 A TW104144458 A TW 104144458A TW 201703928 A TW201703928 A TW 201703928A
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- Prior art keywords
- vibration
- signal
- processing
- vibration signal
- workpiece
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- 238000003754 machining Methods 0.000 title claims abstract description 22
- 230000005856 abnormality Effects 0.000 claims abstract description 28
- 238000012545 processing Methods 0.000 claims description 51
- 238000005498 polishing Methods 0.000 claims description 8
- 239000004744 fabric Substances 0.000 claims description 3
- 239000004575 stone Substances 0.000 claims description 2
- 238000003860 storage Methods 0.000 abstract description 4
- 230000005540 biological transmission Effects 0.000 abstract description 3
- 230000007274 generation of a signal involved in cell-cell signaling Effects 0.000 abstract 3
- 230000007246 mechanism Effects 0.000 description 27
- 238000010586 diagram Methods 0.000 description 9
- 238000005520 cutting process Methods 0.000 description 8
- 238000001514 detection method Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 230000008859 change Effects 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 3
- 230000000149 penetrating effect Effects 0.000 description 3
- 238000010183 spectrum analysis Methods 0.000 description 3
- 230000007723 transport mechanism Effects 0.000 description 3
- 235000012431 wafers Nutrition 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000006698 induction Effects 0.000 description 2
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910013641 LiNbO 3 Inorganic materials 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 1
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000002123 temporal effect Effects 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Machine Tool Sensing Apparatuses (AREA)
- Milling, Broaching, Filing, Reaming, And Others (AREA)
Abstract
Description
本發明是有關於一種加工板狀的被加工物的加工裝置。 The present invention relates to a processing apparatus for processing a sheet-like workpiece.
在IC、LSI等為代表的半導體元件的製造工序中,有時會使用在圓盤狀的基台上固定有複數個磨石的磨削工具,將以矽等的半導體材料所製成的半導體晶圓等薄化加工(磨削)。又,有時也會使用在圓盤狀的基台上固定有切割刃(刀具)的切削工具,將半導體晶圓的凸塊電極或封裝基板的密封樹脂等加工(切削、旋繞切削)成平坦。 In a manufacturing process of a semiconductor element typified by an IC, an LSI or the like, a semiconductor tool made of a semiconductor material such as germanium may be used by using a grinding tool in which a plurality of grindstones are fixed on a disk-shaped base. Thinning processing (grinding) such as wafers. In addition, a cutting tool in which a cutting edge (cutter) is fixed to a disk-shaped base is used, and a bump electrode of a semiconductor wafer or a sealing resin of a package substrate is processed (cutting, spiral cutting) into a flat surface. .
在這樣的加工當中,當發生工具的磨損、或者突發的加工負荷之變化、及其他的異常時,會變得無法恰當地加工被加工物。因此,會藉由熟練的作業人員聽辨加工時的聲音之方法、或監控用以旋轉工具的馬達的電流之方法,來判斷出異常的發生(例如,參照專利文獻1)。 In such processing, when the wear of the tool, the sudden change in the machining load, and other abnormalities occur, the workpiece cannot be properly processed. Therefore, the occurrence of an abnormality is determined by a method in which a skilled worker listens to the sound during processing or a method of monitoring the current of the motor for rotating the tool (for example, refer to Patent Document 1).
專利文獻1:日本專利特開2011-143516號公報 Patent Document 1: Japanese Patent Laid-Open No. 2011-143516
然而,聽辨加工時的聲音之方法,因為需要熟練的作業人員所以在通用性上有困難,又,因為是依據感覺所以在判斷上會有偏差。另一方面,監控馬達的電流之方法,與聽辨加工時的聲音之方法相比雖然可以縮小判斷的偏差,但會有一定程度的測量誤差,因此不適用於輕微的異常之檢測。 However, the method of listening to the sound during processing has difficulty in versatility because of the need for a skilled worker, and because there is a bias in judgment based on the feeling. On the other hand, the method of monitoring the current of the motor can reduce the variation of the judgment as compared with the method of listening to the sound during processing, but there is a certain degree of measurement error, and thus it is not suitable for the detection of a slight abnormality.
本發明是有鑑於所述問題點而作成的,其目的在於提供一種可恰當地檢測加工中的異常的加工裝置。 The present invention has been made in view of the above problems, and an object thereof is to provide a processing apparatus capable of appropriately detecting an abnormality in processing.
根據本發明所提供的加工裝置,包含保持被加工物的工作夾台、及加工該工作夾台所保持的被加工物的加工件,且該加工件具有於端部固定有工具座且可旋轉地受主軸殼體所支撐的主軸、及在下表面側配設有磨削磨石、研磨布、或刀具,且安裝於該工具座的加工工具,該加工裝置的特徵在於具備:振動信號生成件,生成對應於該加工工具的振動的振動信號;及控制件,依據以該振動信號生成件所生成的振動信號來判定該加工工具的狀態。該振動信號生成件包含:超音波振動器,配設於該工具座,且生成成為對應於該加工工具的振動之振動信號的電壓;及傳送件,與該超音波振動器連接,且將該電壓傳送到該控制件。該傳送件包含:第1線圈件,設於該工具座側;以及 第2線圈件,與該第1線圈件保持間隔而相向,且設於該主軸殼體側。該控制件包含:記憶件,記憶基準信號及判定對象信號,該基準信號對應於起因於伴隨該主軸的旋轉的該加工工具的振動的振動信號,該判定對象信號對應於起因於伴隨被加工物的加工的該加工工具的振動的振動信號;及判定件,依據從該判定對象信號去除該基準信號後所得到的信號來判定該加工工具的狀態。 A processing apparatus according to the present invention includes a working chuck for holding a workpiece, and a workpiece that processes the workpiece held by the working chuck, and the workpiece has a tool holder fixed at the end and rotatably a main shaft supported by the main shaft housing and a machining tool attached to the tool holder on the lower surface side and having a grinding grindstone, a polishing cloth, or a cutter, wherein the processing device is characterized by: a vibration signal generating member; Generating a vibration signal corresponding to the vibration of the processing tool; and a control member determining the state of the processing tool based on the vibration signal generated by the vibration signal generating member. The vibration signal generating member includes: an ultrasonic vibrator disposed on the tool holder and generating a voltage that is a vibration signal corresponding to vibration of the processing tool; and a transmitting member coupled to the ultrasonic vibrator, and the The voltage is delivered to the control. The conveying member includes: a first coil member disposed on the tool holder side; The second coil member is opposed to the first coil member so as to face the spindle housing side. The control unit includes: a memory, a memory reference signal, and a determination target signal, the reference signal corresponding to a vibration signal resulting from vibration of the processing tool accompanying rotation of the spindle, the determination target signal corresponding to the accompanying workpiece The vibration signal of the vibration of the processing tool is processed; and the determining means determines the state of the processing tool based on the signal obtained by removing the reference signal from the determination target signal.
又,較佳的是,在本發明中,該控制件更具備有解析件,該解析件將相當於該振動信號的時間變化的波形做傅立葉變換,以將振動區分成頻率成分。 Further, preferably, in the present invention, the control member further includes an analysis member that performs a Fourier transform on a waveform corresponding to a time change of the vibration signal to distinguish the vibration into frequency components.
又,較佳的是,在本發明中,該記憶件更記憶異常判定信號,該異常判定信號對應於起因於加工發生異常時的該加工工具的振動之振動信號,該判定件是藉由將從該判定對象信號去除該基準信號後所得到的信號與該異常判定信號做比較,以判定有無加工之異常。 Further, preferably, in the present invention, the memory member further memorizes an abnormality determination signal corresponding to a vibration signal resulting from vibration of the processing tool when an abnormality occurs in processing, the determining member is The signal obtained by removing the reference signal from the determination target signal is compared with the abnormality determination signal to determine whether there is an abnormality in processing.
由於本發明的加工裝置具備生成對應於該加工工具的振動之振動信號的振動信號生成件、及依據以振動信號生成件所生成的振動信號來判定加工工具的狀態之控制件,因此可恰當地檢測伴隨加工工具的振動之異常。 The processing apparatus of the present invention includes a vibration signal generator that generates a vibration signal corresponding to the vibration of the processing tool, and a control that determines the state of the processing tool based on the vibration signal generated by the vibration signal generator. The abnormality accompanying the vibration of the processing tool is detected.
2‧‧‧磨削裝置(加工裝置) 2‧‧‧grinding device (processing device)
4‧‧‧基台 4‧‧‧Abutment
4a‧‧‧開口 4a‧‧‧ Opening
6‧‧‧搬送機構 6‧‧‧Transportation agency
8a、8b‧‧‧片匣 8a, 8b‧‧‧ piece
10‧‧‧對位機構 10‧‧‧ Alignment agency
11‧‧‧被加工物 11‧‧‧Processed objects
12‧‧‧搬入機構 12‧‧‧ Moving into the institution
14‧‧‧轉台 14‧‧‧ turntable
16、72‧‧‧工作夾台 16, 72‧‧‧Working table
16a、72a‧‧‧保持面 16a, 72a‧‧‧ Keep face
18‧‧‧支撐構造 18‧‧‧Support structure
20‧‧‧Z軸移動機構 20‧‧‧Z-axis moving mechanism
22‧‧‧Z軸導軌 22‧‧‧Z-axis guide
24‧‧‧Z軸移動板 24‧‧‧Z-axis moving board
26‧‧‧Z軸滾珠螺桿 26‧‧‧Z-axis ball screw
28‧‧‧Z軸脈衝馬達 28‧‧‧Z-axis pulse motor
30‧‧‧支撐具 30‧‧‧Support
32‧‧‧磨削單元(加工件) 32‧‧‧grinding unit (machined parts)
34‧‧‧搬出機構 34‧‧‧ Moving out of the institution
36‧‧‧洗淨單元 36‧‧‧cleaning unit
38、100‧‧‧控制裝置(控制件) 38, 100‧‧‧Control devices (controls)
38a、100a‧‧‧記憶部(記憶件) 38a, 100a‧‧‧ memory (memory)
38b、100b‧‧‧解析部(解析件) 38b, 100b‧‧‧ Analysis Department (analytical)
38c、100c‧‧‧判定部(判定件) 38c, 100c‧‧‧Decision Department (decision)
40、76‧‧‧主軸殼體 40, 76‧‧‧ spindle housing
42、78‧‧‧主軸 42, 78‧‧‧ spindle
44‧‧‧固定具 44‧‧‧ Fixtures
46、80‧‧‧罩蓋單元 46, 80‧‧‧ cover unit
46a、80a‧‧‧開口 46a, 80a‧‧‧ openings
48、82‧‧‧輪座(工具座) 48, 82‧‧·wheel seat (tool seat)
48a、52a‧‧‧上表面 48a, 52a‧‧‧ upper surface
48b、52b‧‧‧下表面 48b, 52b‧‧‧ lower surface
48c‧‧‧開口 48c‧‧‧ openings
50‧‧‧磨削輪(加工工具) 50‧‧‧ grinding wheel (machining tool)
52、86‧‧‧輪基台 52, 86‧‧ round abutments
52c‧‧‧內螺紋部 52c‧‧‧Threaded Department
54‧‧‧磨石(磨削磨石) 54‧‧‧Minestone (grinding grindstone)
56‧‧‧外螺紋 56‧‧‧External thread
58、90‧‧‧振動信號生成裝置(振動信號生成件) 58, 90‧‧‧Vibration signal generating device (vibration signal generating device)
60、92‧‧‧超音波振動器 60, 92‧‧‧ Ultrasonic vibrators
62、94‧‧‧傳送通道(傳送件) 62, 94‧‧‧Transportation channel (transportation)
64、96‧‧‧第1電感器(第1線圈件) 64, 96‧‧‧1st inductor (1st coil part)
66、98‧‧‧第2電感器(第2線圈件) 66, 98‧‧‧2nd inductor (2nd coil part)
70‧‧‧旋削裝置(加工裝置) 70‧‧‧Rotary cutting device (processing device)
74‧‧‧旋削單元(加工件) 74‧‧‧Rotary cutting unit (machined parts)
84‧‧‧旋削輪(加工工具) 84‧‧‧Rotary turning wheel (machining tool)
88‧‧‧刀具(切割刃) 88‧‧‧Tools (cutting edge)
V‧‧‧電壓 V‧‧‧ voltage
t‧‧‧時間 t‧‧‧Time
f‧‧‧頻率 F‧‧‧frequency
X、Y、Z‧‧‧方向 X, Y, Z‧‧ Direction
圖1是示意地顯示磨削裝置之構成例的圖。 Fig. 1 is a view schematically showing a configuration example of a grinding device.
圖2是示意地顯示磨削單元之構造的分解立體圖。 Fig. 2 is an exploded perspective view schematically showing the configuration of the grinding unit.
圖3是示意地顯示磨削單元之構造的分解立體圖。 Fig. 3 is an exploded perspective view schematically showing the configuration of the grinding unit.
圖4是示意地顯示磨削單元之截面等的圖。 4 is a view schematically showing a cross section and the like of a grinding unit.
圖5(A)是顯示傳送到控制裝置的電壓的波形(時域的波形)之例的圖形,圖5(B)是顯示傅立葉變換後的波形(頻域的波形)之例的圖形。 Fig. 5(A) is a diagram showing an example of a waveform (waveform in the time domain) of a voltage transmitted to the control device, and Fig. 5(B) is a diagram showing an example of a waveform (waveform in the frequency domain) after Fourier transform.
圖6(A)是顯示基準信號之例的圖形,圖6(B)是顯示判定對象信號之例的圖形,圖6(C)是顯示從判定對象信號去除基準信號後所得到的信號之例的圖形。 6(A) is a diagram showing an example of a reference signal, FIG. 6(B) is a diagram showing an example of a determination target signal, and FIG. 6(C) is an example of a signal obtained by removing a reference signal from a determination target signal. Graphics.
圖7是示意地顯示旋削裝置之構成例的圖。 Fig. 7 is a view schematically showing a configuration example of a turning device.
參照所附圖式,說明有關於本發明的實施形態。圖1是示意地顯示本實施形態的磨削裝置之構成例的圖。如圖1所示,磨削裝置(加工裝置)2具備有支撐各構造的基台4。在基台4的上表面前端側,形成有開口4a,且在此開口4a內設有搬送加工對象的被加工物11(參照圖4)的搬送機構6。 Embodiments of the present invention will be described with reference to the accompanying drawings. Fig. 1 is a view schematically showing a configuration example of a grinding apparatus of the embodiment. As shown in Fig. 1, the grinding device (processing device) 2 is provided with a base 4 that supports each structure. An opening 4a is formed in the front end side of the upper surface of the base 4, and a conveying mechanism 6 for conveying a workpiece 11 (see FIG. 4) to be processed is provided in the opening 4a.
又,在開口4a更前方的區域中,載置有可收容被加工物11的片匣8a、8b。被加工物11可為例如形成圓盤狀的半導體晶圓或樹脂基板、陶瓷基板、封裝基板等。但,被加工物11不受限於此,可以將任意之材質、形狀的板狀物作為被加工物11來使用。 Further, in the region further forward of the opening 4a, the sheets 8a, 8b capable of accommodating the workpiece 11 are placed. The workpiece 11 may be, for example, a semiconductor wafer or a resin substrate in which a disk shape is formed, a ceramic substrate, a package substrate, or the like. However, the workpiece 11 is not limited thereto, and a plate material of any material or shape can be used as the workpiece 11.
在載置片匣8a的載置區域以及開口4a的後方,設有進行被加工物11的對位的對位機構10。對位機構10是對例如以搬送機構6從片匣8a搬送,而載置於對位機構10的被 加工物11的中心進行對位。 A positioning mechanism 10 that performs alignment of the workpiece 11 is provided on the placement area of the sheet stack 8a and the rear of the opening 4a. The registration mechanism 10 is carried by, for example, the transport mechanism 6 from the cassette 8a, and placed on the registration mechanism 10. The center of the workpiece 11 is aligned.
在對位機構10的後方,設有吸引保持被加工物11且可旋繞的搬入機構12。在搬入機構12的後方,設置有繞著與鉛直方向(Z軸方向)平行的旋轉軸在預設的角度範圍旋轉的轉台14。在轉台14的上表面,以大致等角度間隔的方式設有複數個(於本實施形態為3個)吸引保持被加工物11的工作夾台16。 At the rear of the registration mechanism 10, a loading mechanism 12 that sucks and holds the workpiece 11 and is rotatable is provided. Behind the loading mechanism 12, a turntable 14 that rotates around a rotation axis parallel to the vertical direction (Z-axis direction) at a predetermined angular range is provided. On the upper surface of the turntable 14, a plurality of (three in the present embodiment) suction holding table 16 for holding the workpiece 11 are provided at substantially equal angular intervals.
以對位機構10進行過對位的被加工物11是藉由搬入機構12,而搬入已定位於前方的搬入搬出位置的工作夾台16。將轉台14朝預定的旋轉方向旋轉,而將工作夾台16依搬入搬出位置、第1磨削位置、以及第2磨削位置的順序定位。 The workpiece 11 that has been aligned by the registration mechanism 10 is carried by the loading mechanism 12, and the work chuck 16 that has been positioned at the front loading/unloading position is carried. The turntable 14 is rotated in a predetermined rotation direction, and the work chuck 16 is positioned in the order of loading and unloading the position, the first grinding position, and the second grinding position.
將各工作夾台16與馬達等的旋轉驅動源(未圖示)連結,並繞著與鉛直方向平行的旋轉軸旋轉。各工作夾台16的上表面成為吸引保持被加工物11的保持面16a。此保持面16a通過在工作夾台16的內部所形成的流路(未圖示)與吸引源(未圖示)連接。被搬入工作夾台16的被加工物11會因作用在保持面16a的吸引源的負壓而被吸引。 Each of the work chucks 16 is coupled to a rotational drive source (not shown) such as a motor, and is rotated about a rotation axis parallel to the vertical direction. The upper surface of each of the work clamps 16 serves as a holding surface 16a for sucking and holding the workpiece 11. The holding surface 16a is connected to a suction source (not shown) through a flow path (not shown) formed inside the working chuck 16. The workpiece 11 carried into the work chuck 16 is attracted by the negative pressure of the suction source acting on the holding surface 16a.
在轉台14的後方,大致鉛直地豎立有2根形成為柱狀的支撐構造18。在各支撐構造18的前表面側,設有Z軸移動機構20。Z軸移動機構20具備有配置在支撐構造18的前表面且與Z軸方向平行的一對Z軸導軌22。在Z軸導軌22上可滑動地設置有Z軸移動板24。 At the rear of the turntable 14, two support structures 18 formed in a columnar shape are vertically erected. A Z-axis moving mechanism 20 is provided on the front surface side of each of the support structures 18. The Z-axis moving mechanism 20 includes a pair of Z-axis guide rails 22 that are disposed on the front surface of the support structure 18 and that are parallel to the Z-axis direction. A Z-axis moving plate 24 is slidably disposed on the Z-axis guide 22.
在Z軸移動板24的後表面側(背面側),設有螺帽 部(未圖示),且在此螺帽部螺合有與Z軸導軌22平行的Z軸滾珠螺桿26。在Z軸滾珠螺桿26的一端部連結有Z軸脈衝馬達28。藉由以Z軸脈衝馬達28旋轉Z軸滾珠螺桿26,Z軸移動板24即沿Z軸導軌22在Z軸方向上移動。 On the rear surface side (back side) of the Z-axis moving plate 24, a nut is provided A portion (not shown) is provided with a Z-axis ball screw 26 that is parallel to the Z-axis guide 22 in the nut portion. A Z-axis pulse motor 28 is coupled to one end of the Z-axis ball screw 26. By rotating the Z-axis ball screw 26 with the Z-axis pulse motor 28, the Z-axis moving plate 24 is moved in the Z-axis direction along the Z-axis guide 22.
在各Z軸移動板24的前表面(正面),固定有支撐具30。在各支撐具30上支撐有磨削被加工物11的磨削單元(加工件)32。和工作夾台16一起被定位到第1磨削位置或第2磨削位置的被加工物11是以各磨削單元32來磨削。有關於磨削單元32的細節將於後文敘述。 A support 30 is fixed to the front surface (front surface) of each of the Z-axis moving plates 24. A grinding unit (machining member) 32 that grinds the workpiece 11 is supported on each of the support members 30. The workpiece 11 that is positioned to the first grinding position or the second grinding position together with the work chuck 16 is ground by each grinding unit 32. Details regarding the grinding unit 32 will be described later.
在與搬入機構12相鄰的位置上設有吸引保持磨削後的被加工物11且可旋繞的搬出機構34。在搬出機構34的前方,且在開口4a的後方,設有洗淨磨削後的被加工物11的洗淨單元36。以洗淨單元36洗淨的被加工物11是以搬送機構6搬送,並收容到例如片匣8b。 At a position adjacent to the loading mechanism 12, a carry-out mechanism 34 that sucks and holds the workpiece 11 after grinding is provided. A washing unit 36 that cleans the workpiece 11 after grinding is provided in front of the unloading mechanism 34 and behind the opening 4a. The workpiece 11 washed by the cleaning unit 36 is conveyed by the transport mechanism 6 and stored in, for example, the cassette 8b.
搬送機構6、對位機構10、搬入機構12、轉台14、工作夾台16、Z軸移動機構20、磨削單元32、搬出機構34、洗淨單元36等各構成要素會被連接到控制裝置(控制件)38。控制裝置38會控制各部的動作而可以恰當地磨削被加工物11。 The components of the transport mechanism 6, the registration mechanism 10, the loading mechanism 12, the turntable 14, the work chuck 16, the Z-axis moving mechanism 20, the grinding unit 32, the carry-out mechanism 34, and the cleaning unit 36 are connected to the control device. (Control) 38. The control device 38 controls the operation of each unit to appropriately grind the workpiece 11.
圖2以及圖3是示意地顯示磨削單元32之構造的分解立體圖,圖4是示意地顯示磨削單元32之截面等的圖。還有,在圖2、圖3、以及圖4中,是省略磨削單元32之構成的一部分。 2 and 3 are exploded perspective views schematically showing the structure of the grinding unit 32, and FIG. 4 is a view schematically showing a cross section and the like of the grinding unit 32. Further, in FIGS. 2, 3, and 4, a part of the configuration of the grinding unit 32 is omitted.
磨削單元32具備有圓筒狀的主軸殼體40。在主軸 殼體40的內部,收容有繞著Z軸旋轉的主軸42。主軸42的下端部是從主軸殼體40突出於外部。在主軸42的上端側連結有使主軸42旋轉的馬達等的旋轉驅動源(未圖示)。 The grinding unit 32 is provided with a cylindrical main shaft housing 40. On the spindle Inside the casing 40, a main shaft 42 that rotates about the Z axis is housed. The lower end portion of the main shaft 42 protrudes from the main shaft housing 40 to the outside. A rotary drive source (not shown) such as a motor that rotates the main shaft 42 is coupled to the upper end side of the main shaft 42.
在主軸殼體40的下端部,透過固定具44固定有圓盤狀的罩蓋單元46。在罩蓋單元46的中央形成有在鉛直方向上貫通的圓形的開口46a,且於此開口46a中插入有主軸42的下端部。 A disk-shaped cover unit 46 is fixed to the lower end portion of the spindle housing 40 through the fixture 44. A circular opening 46a penetrating in the vertical direction is formed in the center of the cover unit 46, and a lower end portion of the main shaft 42 is inserted into the opening 46a.
在主軸42的下端可裝卸地固定有圓盤狀的輪座(工具座)48,且在此輪座48的下表面48b側裝設有磨削輪(加工工具)50。磨削輪50包含以鋁及不鏽鋼等的金屬材料形成的圓筒狀的輪基台52、及環狀地配置在輪基台52的下表面52b側的複數個磨石(磨削磨石)54。 A disk-shaped wheel base (tool base) 48 is detachably fixed to the lower end of the main shaft 42, and a grinding wheel (machining tool) 50 is mounted on the lower surface 48b side of the wheel base 48. The grinding wheel 50 includes a cylindrical wheel base 52 formed of a metal material such as aluminum or stainless steel, and a plurality of grindstones (grinding grindstones) arranged annularly on the lower surface 52b side of the wheel base 52. 54.
在輪基台52的上表面52a側形成有複數個(在本實施形態為4個)內螺紋部52c,該內螺紋部52c在凹部的內周面刻有螺紋(螺紋槽)。另一方面,在輪座48之對應內螺紋部52c的位置,形成有將輪座48從上表面48a貫通到下表面48b的複數個(在本實施形態為4個)開口48c。藉由通過此開口48c將外螺紋56旋緊在內螺紋部52c,即可將磨削輪50裝卸自如地固定在輪座48的下表面48b側。 A plurality of (four in the present embodiment) female screw portions 52c are formed on the upper surface 52a side of the wheel base 52, and the female screw portions 52c are formed with threads (thread grooves) on the inner circumferential surface of the recess. On the other hand, in the position corresponding to the internal thread portion 52c of the wheel base 48, a plurality of (four in the present embodiment) openings 48c for penetrating the wheel base 48 from the upper surface 48a to the lower surface 48b are formed. By screwing the external thread 56 to the internal thread portion 52c through the opening 48c, the grinding wheel 50 can be detachably fixed to the lower surface 48b side of the wheel base 48.
如圖4所示,在使被加工物11吸引保持在工作夾台16的狀態下,使工作夾台16與磨削輪50相互地旋轉,並一面供給純水等的磨削液一面使磨石54接觸被加工物11的上表面,藉此便可磨削被加工物11。 As shown in FIG. 4, in the state in which the workpiece 11 is sucked and held by the work chuck 16, the work chuck 16 and the grinding wheel 50 are rotated together, and the grinding liquid such as pure water is supplied while grinding. The stone 54 contacts the upper surface of the workpiece 11, whereby the workpiece 11 can be ground.
在此磨削單元32設有用以檢測磨削輪50的振動 之振動檢測機構。振動檢測機構包含有振動信號生成裝置(振動信號生成件)58(圖4),該振動信號生成裝置58可生成對應於磨削輪50的振動之振動信號。 Here, the grinding unit 32 is provided to detect the vibration of the grinding wheel 50. Vibration detecting mechanism. The vibration detecting mechanism includes a vibration signal generating device (vibration signal generating member) 58 (FIG. 4) that can generate a vibration signal corresponding to the vibration of the grinding wheel 50.
振動信號生成裝置58具備有固定於輪座48的內部的複數個(在本實施形態為4個)超音波振動器60。此超音波振動器60是以例如鈦酸鋇(BaTiO3)、鋯鈦酸鉛(Pb(Zi,Ti)O3)、鈮酸鋰(LiNbO3)、鉭酸鋰(LiTaO3)等的材料所形成,以將磨削輪50的振動變換為電壓(振動信號)。 The vibration signal generating device 58 includes a plurality of (four in the present embodiment) ultrasonic vibrators 60 that are fixed to the inside of the wheel base 48. The ultrasonic vibrator 60 is made of, for example, barium titanate (BaTiO 3 ), lead zirconate titanate (Pb(Zi, Ti)O 3 ), lithium niobate (LiNbO 3 ), lithium niobate (LiTaO 3 ), or the like. It is formed to convert the vibration of the grinding wheel 50 into a voltage (vibration signal).
超音波振動器60是構成為可對預定之頻率的振動共振。因此,可因應超音波振動器60的共振頻率,而決定可藉由振動檢測機構檢測的振動之頻率。據此,藉由將超音波振動器60和輪座48一起更換,即可配合磨削輪50或被加工物11的種類(材質、大小、及重量等)、發生頻率高的異常之態樣等將振動檢測機構最佳化。 The ultrasonic vibrator 60 is configured to resonate with vibration at a predetermined frequency. Therefore, the frequency of the vibration detectable by the vibration detecting mechanism can be determined in accordance with the resonance frequency of the ultrasonic vibrator 60. According to this, by replacing the ultrasonic vibrator 60 and the wheel base 48 together, it is possible to match the type (material, size, weight, etc.) of the grinding wheel 50 or the workpiece 11 and the abnormality of the occurrence frequency. The vibration detection mechanism is optimized.
例如,超音波振動器60的共振頻率是50kHz~100kHz、100kHz~300kHz、300kHz~500kHz的其中任一個的情況下,藉由適當更換3種輪座48,便可恰當地檢測50kHz~500kHz的頻率範圍之振動。 For example, when the resonant frequency of the ultrasonic vibrator 60 is any one of 50 kHz to 100 kHz, 100 kHz to 300 kHz, and 300 kHz to 500 kHz, the frequency of 50 kHz to 500 kHz can be appropriately detected by appropriately replacing the three types of wheel bases 48. The vibration of the range.
另外,為了可以不更換輪座48而檢測較廣頻率範圍的振動,也可以將共振頻率不同的複數個超音波振動器60設在1個輪座48中。例如,若將共振頻率是50kHz~100kHz、100kHz~300kHz、300kHz~500kHz的3種超音波振動器60設於1個輪座48,便可不交換輪座48而檢測50kHz~500kHz的頻率範圍的振動。 Further, in order to detect vibration in a wide frequency range without changing the wheel base 48, a plurality of ultrasonic vibrators 60 having different resonance frequencies may be provided in one wheel base 48. For example, when three types of ultrasonic vibrators 60 having a resonance frequency of 50 kHz to 100 kHz, 100 kHz to 300 kHz, and 300 kHz to 500 kHz are provided in one wheel base 48, vibrations in a frequency range of 50 kHz to 500 kHz can be detected without exchanging the wheel base 48. .
在此,宜將複數的超音波振動器60就主軸42的軸心對稱地配置。藉此,可高精度地檢測磨削輪50的振動。再者,超音波振動器60的數量、配置、形狀等不限定於圖3以及圖4所示的態樣。例如,輪座48只具備1個超音波振動器60也無妨。 Here, it is preferable to arrange the plurality of ultrasonic vibrators 60 symmetrically about the axis of the main shaft 42. Thereby, the vibration of the grinding wheel 50 can be detected with high precision. Further, the number, arrangement, shape, and the like of the ultrasonic vibrators 60 are not limited to those shown in FIGS. 3 and 4 . For example, it is also possible that the wheel base 48 is provided with only one ultrasonic vibrator 60.
在超音波振動器60中,連接有用以傳送以超音波振動器60所生成的電壓的非接觸型的傳送通道(傳送件)62(圖4)。此傳送通道62包含連接到超音波振動器60的第1電感器(第1線圈件)64、及相對於第1電感器64以預定的間隔相向的第2電感器(第2線圈件)66。 In the ultrasonic vibrator 60, a non-contact type conveying path (transport member) 62 (Fig. 4) for transmitting a voltage generated by the ultrasonic vibrator 60 is connected. The transmission path 62 includes a first inductor (first coil) 64 connected to the ultrasonic vibrator 60, and a second inductor (second coil) 66 that faces at a predetermined interval with respect to the first inductor 64. .
第1電感器64、以及第2電感器66,最典型的是導線捲繞成的圓環狀的線圈,並分別固定在輪座48的上表面48a側、以及罩蓋單元46的下表面側。 The first inductor 64 and the second inductor 66 are most typically annular coils in which wires are wound, and are fixed to the upper surface 48a side of the wheel housing 48 and the lower surface side of the cover unit 46, respectively. .
如上所述,第1電感器64與第2電感器66會相向且磁性地耦合。因此,以超音波振動器60所生成的電壓會藉由第1電感器64與第2電感器66的相互感應,而傳送到第2電感器66側。 As described above, the first inductor 64 and the second inductor 66 are opposed to each other and magnetically coupled. Therefore, the voltage generated by the ultrasonic vibrator 60 is transmitted to the second inductor 66 side by mutual induction between the first inductor 64 and the second inductor 66.
在第2電感器66中,透過配線等而連接有控制裝置38。控制裝置38可依據於從第2電感器66傳送來的電壓來判定磨削輪50的振動狀態。 In the second inductor 66, the control device 38 is connected to the wiring or the like. The control device 38 can determine the vibration state of the grinding wheel 50 based on the voltage transmitted from the second inductor 66.
具體而言,控制裝置38包含:記憶部(記憶件)38a,記憶從第2電感器66傳送來的電壓(振動信號)等的資訊;解析部(解析件)38b,將相當於每任意的單位時間所傳送的電壓(振動信號)的時間變化之波形(時域的波形)藉 由傅立葉變換(例如快速傅立葉變換)來進行頻譜解析;及判定部(判定件)38c,判定磨削輪50的狀態。 Specifically, the control device 38 includes a memory unit (memory) 38a that stores information such as a voltage (vibration signal) transmitted from the second inductor 66, and an analysis unit (analyzer) 38b, which is equivalent to each arbitrary one. The time variation waveform (waveform of the time domain) of the voltage (vibration signal) transmitted per unit time is borrowed The spectrum analysis is performed by Fourier transform (for example, fast Fourier transform), and the determination unit (decision) 38c determines the state of the grinding wheel 50.
再者,作為頻譜解析的單位時間,可考慮的有磨削被加工物11的任意厚度所需要的時間(每磨削厚度)、及1片被加工物11的磨削所需要的時間(每1工件)等的態樣。有關於控制裝置38的各部的細節將於後文敘述。 Further, as the unit time of the spectrum analysis, the time required for grinding the arbitrary thickness of the workpiece 11 (per grinding thickness) and the time required for the grinding of one workpiece 11 can be considered (per 1 workpiece) and other aspects. Details regarding the various parts of the control unit 38 will be described later.
圖5(A)是顯示傳送到控制裝置38的電壓的波形(時域的波形)之例的圖形,圖5(B)是顯示傅立葉變換後的波形(頻域的波形)之例的圖形。再者,在圖5(A)中,分別以縱軸表示電壓(V)、以橫軸表示時間(t),在圖5(B)中,分別以縱軸表示振幅、以橫軸表示頻率(f)。 FIG. 5(A) is a diagram showing an example of a waveform (waveform in the time domain) of a voltage transmitted to the control device 38, and FIG. 5(B) is a diagram showing an example of a waveform (waveform in the frequency domain) after Fourier transform. In addition, in FIG. 5(A), the vertical axis represents voltage (V) and the horizontal axis represents time (t), and in FIG. 5(B), the vertical axis represents the amplitude and the horizontal axis represents the frequency. (f).
若將源自振動信號生成裝置58的電壓(振動信號)的波形以控制裝置38的解析部38b做傅立葉變換,就如圖5(B)所示,將磨削輪50的振動區分成主要的頻率成分,而可容易地解析在磨削中發生的異常。藉此,可即時且精度良好地檢測磨削中的異常。 When the waveform of the voltage (vibration signal) derived from the vibration signal generating device 58 is Fourier transformed by the analyzing unit 38b of the control device 38, the vibration of the grinding wheel 50 is divided into main ones as shown in Fig. 5(B). The frequency component makes it easy to resolve the anomalies that occur during grinding. Thereby, the abnormality in the grinding can be detected instantaneously and accurately.
以下,說明有關於以本實施形態的磨削裝置2實施的異常之檢測流程。一開始,作為檢測的前處理而實施基準信號取得步驟,該基準信號取得步驟是取得相當於本底水準(background level)的基準信號。在此基準信號取得步驟,首先,是在各部無異常的狀態下旋轉磨削輪50。 Hereinafter, a flow of detection of an abnormality performed by the grinding apparatus 2 of the present embodiment will be described. Initially, a reference signal acquisition step is performed as a pre-processing of detection, and the reference signal acquisition step is to acquire a reference signal corresponding to a background level. In the reference signal acquisition step, first, the grinding wheel 50 is rotated in a state where there is no abnormality in each portion.
其結果,從超音波振動器60生成起因於伴隨主軸42之旋轉的磨削輪50的振動之電壓(振動信號)。相當於所生成的電壓的時間變化的波形(時域的波形)會被記憶在控制 裝置38的記憶部38a。 As a result, a voltage (vibration signal) due to the vibration of the grinding wheel 50 accompanying the rotation of the main shaft 42 is generated from the ultrasonic vibrator 60. A waveform (time domain waveform) equivalent to the time variation of the generated voltage is memorized in control The memory portion 38a of the device 38.
接著,控制裝置38的解析部38b會讀取記憶於記憶部38a的上述電壓的波形,並進行傅立葉變換(快速傅立葉變換)。其結果,將在時域中的電壓(振動信號)之波形變換為基準信號(頻域的波形)。圖6(A)是顯示基準信號之例的圖形。所得到的基準信號會被記憶於記憶部38a。 Next, the analyzing unit 38b of the control device 38 reads the waveform of the voltage stored in the memory unit 38a, and performs Fourier transform (Fast Fourier Transform). As a result, the waveform of the voltage (vibration signal) in the time domain is converted into a reference signal (waveform in the frequency domain). Fig. 6(A) is a diagram showing an example of a reference signal. The obtained reference signal is memorized in the memory unit 38a.
在基準信號取得步驟之後,就開始實際的檢測步驟。在實際的檢測步驟中,一開始,實施判定對象信號取得步驟,該判定對象信號取得步驟是磨削被加工物11來取得成為判定之對象的判定對象信號。在此判定對象信號取得步驟中,首先,是使磨削輪50旋轉來磨削被加工物11。 After the reference signal acquisition step, the actual detection step begins. In the actual detection step, the determination target signal acquisition step is performed, and the determination target signal acquisition step is to grind the workpiece 11 to acquire a determination target signal to be determined. In the determination target signal acquisition step, first, the grinding wheel 50 is rotated to grind the workpiece 11.
其結果,從超音波振動器60生成起因於伴隨被加工物11的磨削的磨削輪50之振動的振動電壓(振動信號)。相當於所生成的電壓的時間變化之波形(時域的波形)會被記憶在控制裝置38的記憶部38a。 As a result, a vibration voltage (vibration signal) due to the vibration of the grinding wheel 50 accompanying the grinding of the workpiece 11 is generated from the ultrasonic vibrator 60. A waveform (waveform in the time domain) corresponding to the temporal change of the generated voltage is stored in the memory portion 38a of the control device 38.
接著,控制裝置38的解析部38b會讀取已記憶於記憶部38a的上述電壓的波形,並進行傅立葉變換(快速傅立葉變換)。其結果,可將在時域中的電壓(振動信號)的波形變換為判定對象信號(頻域的波形)。圖6(B)是顯示判定對象信號之例的圖形。所得到的判定對象信號會被記憶於記憶部38a。 Next, the analyzing unit 38b of the control device 38 reads the waveform of the voltage stored in the memory unit 38a, and performs Fourier transform (Fast Fourier Transform). As a result, the waveform of the voltage (vibration signal) in the time domain can be converted into the determination target signal (waveform in the frequency domain). Fig. 6(B) is a diagram showing an example of a determination target signal. The obtained determination target signal is stored in the memory unit 38a.
在判定對象信號取得步驟之後,會實施比較判定步驟,該比較判定步驟是將判定對象信號與基準信號做比較而判定磨削輪50的狀態。在此比較判定步驟中,首先, 判定部38c會讀取已記憶於記憶部38a的基準信號以及判定對象信號,並從判定對象信號去除基準信號。 After the determination target signal acquisition step, a comparison determination step of determining the state of the grinding wheel 50 by comparing the determination target signal with the reference signal is performed. In this comparison determination step, first, The determination unit 38c reads the reference signal and the determination target signal that have been stored in the storage unit 38a, and removes the reference signal from the determination target signal.
具體而言,是在檢測對象的全頻率範圍中,從判定對象信號的信號強度(振幅)減去(做減法運算)基準信號的信號強度(振幅)。此時,為了可以恰當地去除判定對象信號中的基準信號,也可以對判定對象信號或基準信號的信號強度(振幅)乘上任意之值。 Specifically, the signal intensity (amplitude) of the reference signal is subtracted (subtracted) from the signal strength (amplitude) of the determination target signal in the entire frequency range of the detection target. At this time, in order to appropriately remove the reference signal in the determination target signal, the signal strength (amplitude) of the determination target signal or the reference signal may be multiplied by an arbitrary value.
圖6(C)是顯示從判定對象信號去除基準信號後所得到的信號之例的圖形。像這樣,藉由從判定對象信號去除基準信號,可以恰當地判定磨削輪50的狀態而檢測磨削中的異常。 Fig. 6(C) is a diagram showing an example of a signal obtained by removing a reference signal from a determination target signal. As described above, by removing the reference signal from the determination target signal, it is possible to appropriately determine the state of the grinding wheel 50 and detect an abnormality in the grinding.
具體而言,例如,藉由將從判定對象信號去除基準信號所得到的信號,與已預先記憶在記憶部38a的異常判定信號做比較,可以判定有無磨削中的異常。也就是說,在異常判定信號中的振動模式(振動成分)的部分或者全部,與從判定對象信號去除基準信號所得到的信號中的振動模式一致的情況下,判定部38c會判定為已發生對應該振動模式的異常。 Specifically, for example, by comparing the signal obtained by removing the reference signal from the determination target signal with the abnormality determination signal previously stored in the memory unit 38a, it is possible to determine whether or not there is an abnormality in the grinding. In other words, when part or all of the vibration mode (vibration component) in the abnormality determination signal matches the vibration mode in the signal obtained by the determination target signal removal reference signal, the determination unit 38c determines that it has occurred. An exception to the vibration mode.
再者,異常判定信號是藉由將起因於在磨削中產生異常之時的磨削輪50的振動的電壓(振動信號)之波形,在解析部38b中進行傅立葉變換(快速傅立葉變換)而得到。 In addition, the abnormality determination signal is subjected to Fourier transform (fast Fourier transform) in the analysis unit 38b by the waveform of the voltage (vibration signal) caused by the vibration of the grinding wheel 50 when an abnormality occurs during the grinding. get.
如以上所述,由於本實施形態的磨削裝置(加工裝置)2具備生成對應於磨削輪50之振動的振動信號的振動信號生成裝置(振動信號生成件)58、及依據振動信號生成裝 置58所生成的振動信號來判定磨削輪50的狀態的控制裝置(控制件)38,因此可恰當地檢測伴隨磨削輪50的振動的異常。 As described above, the grinding apparatus (processing apparatus) 2 of the present embodiment includes a vibration signal generating device (vibration signal generator) 58 that generates a vibration signal corresponding to the vibration of the grinding wheel 50, and a vibration signal generating device. The control device (controller) 38 that determines the state of the grinding wheel 50 is set by the vibration signal generated by 58. Therefore, the abnormality accompanying the vibration of the grinding wheel 50 can be appropriately detected.
又,在本實施形態的磨削裝置2中,由於將相當於電壓(振動信號)的時間變化的波形(時域的波形)做傅立葉變換,因此與將電壓(振動信號)直接解析的情況做比較,可將在磨削中發生的異常的解析變容易。藉此,可以高精度地檢測磨削中的異常。 Further, in the grinding apparatus 2 of the present embodiment, since the waveform (time domain waveform) corresponding to the time change of the voltage (vibration signal) is subjected to Fourier transform, the voltage (vibration signal) is directly analyzed. By comparison, it is easy to analyze the abnormality that occurs during grinding. Thereby, the abnormality in grinding can be detected with high precision.
再者,本發明並不限定於上述實施形態的記載,可進行各種變更來實施。例如,在上述實施形態中,雖然是將電壓(振動信號)做傅立葉變換,但將電壓不做傅立葉變換而進行解析亦可。 Furthermore, the present invention is not limited to the description of the above embodiments, and various modifications can be made. For example, in the above-described embodiment, the voltage (vibration signal) is subjected to Fourier transform, but the voltage may be analyzed without performing Fourier transform.
又,藉由利用上述實施形態的構成,也可將找出磨削輪(加工工具)50的基準高度的設置(setup)自動化。在此設置中,為例如,控制裝置38使磨削輪50慢慢下降,並使磨削輪50的下端與工作夾台16的保持面16a接觸。 Further, by using the configuration of the above-described embodiment, it is possible to automatically find the setting of the reference height of the grinding wheel (machining tool) 50. In this arrangement, for example, the control device 38 gradually lowers the grinding wheel 50 and brings the lower end of the grinding wheel 50 into contact with the holding surface 16a of the working chuck 16.
又,控制裝置38是依據以超音波振動器60所生成的電壓(振動信號),以檢測磨削輪50與工作夾台16的接觸,而將當時的磨削輪50的高度設定為基準高度。另外,當檢測到磨削輪50與工作夾台16的接觸後,控制裝置38即停止磨削輪50的下降。 Further, the control device 38 determines the contact between the grinding wheel 50 and the work chuck 16 based on the voltage (vibration signal) generated by the ultrasonic vibrator 60, and sets the height of the grinding wheel 50 at that time as the reference height. . In addition, when the contact of the grinding wheel 50 with the work chuck 16 is detected, the control device 38 stops the lowering of the grinding wheel 50.
又,在上述實施形態中,是說明有關於磨削被加工物11的磨削裝置2,但本發明的加工裝置也可以是研磨被加工物11的研磨裝置。研磨裝置(加工裝置)的基本的構成, 與磨削裝置2相同。但,在研磨裝置中,是使用在下表面側設有研磨布的研磨墊(加工工具)來代替磨削輪50。 Further, in the above-described embodiment, the grinding device 2 for grinding the workpiece 11 is described. However, the processing device of the present invention may be a polishing device for polishing the workpiece 11. The basic structure of the polishing device (processing device), The same as the grinding device 2. However, in the polishing apparatus, a polishing pad (machining tool) provided with a polishing cloth on the lower surface side is used instead of the grinding wheel 50.
又,本發明的加工裝置也可以是旋削(旋繞切削)被加工物11的旋削裝置。圖7是示意地顯示旋削裝置之構成例的圖。如圖7所示,旋削裝置(加工裝置)70具備有吸引保持被加工物11的工作夾台72。在工作夾台72的下方,設有水平移動機構(未圖示),且工作夾台72是藉由水平移動機構而在水平方向上移動。 Further, the processing apparatus of the present invention may be a turning device that rotates (screws and cuts) the workpiece 11. Fig. 7 is a view schematically showing a configuration example of a turning device. As shown in FIG. 7, the turning device (processing device) 70 is provided with a work chuck 72 that sucks and holds the workpiece 11. Below the work chuck 72, a horizontal moving mechanism (not shown) is provided, and the work chuck 72 is moved in the horizontal direction by the horizontal moving mechanism.
工作夾台72的上表面成為吸引保持被加工物11的保持面72a。此保持面72a通過在工作夾台72的內部所形成的流路(未圖示)與吸引源(未圖示)連接。被搬入工作夾台72的被加工物11是藉作用在保持面72a的吸引源的負壓而被吸引。 The upper surface of the work chuck 72 serves as a holding surface 72a for sucking and holding the workpiece 11. This holding surface 72a is connected to a suction source (not shown) through a flow path (not shown) formed inside the work chuck 72. The workpiece 11 carried into the work chuck 72 is sucked by the negative pressure of the suction source acting on the holding surface 72a.
在工作夾台72的上方,配置有旋削(旋繞切削)被加工物11的旋削單元(加工件)74。此旋削單元74的構成與上述實施形態的磨削單元32的構成類似。 Above the work chuck 72, a turning unit (machined member) 74 that is turned (screw-cut) the workpiece 11 is disposed. The configuration of the turning unit 74 is similar to that of the grinding unit 32 of the above embodiment.
旋削單元74具備有圓筒狀的主軸殼體76。在主軸殼體76的內部,收容有繞著Z軸旋轉的主軸78。主軸78的下端部是從主軸殼體76突出於外部。在主軸78的上端側連結有使主軸78旋轉的馬達等的旋轉驅動源(未圖示)。 The turning unit 74 is provided with a cylindrical main shaft housing 76. Inside the spindle housing 76, a spindle 78 that rotates about the Z axis is housed. The lower end portion of the main shaft 78 protrudes from the main shaft housing 76 to the outside. A rotary drive source (not shown) such as a motor that rotates the spindle 78 is coupled to the upper end side of the spindle 78.
在主軸殼體76的下端部,固定有圓盤狀的罩蓋單元80。在罩蓋單元80的中央形成有在鉛直方向上貫通的圓形的開口80a,且於此開口80a中插入有主軸78的下端部。 A disk-shaped cover unit 80 is fixed to the lower end portion of the spindle housing 76. A circular opening 80a penetrating in the vertical direction is formed in the center of the cover unit 80, and a lower end portion of the main shaft 78 is inserted into the opening 80a.
在主軸78的下端可裝卸地固定有圓盤狀的輪座 (工具座)82,且在此輪座82的下表面側裝設有旋削輪(加工工具)84。旋削輪84包含以鋁及不鏽鋼等的金屬材料形成的圓筒狀的輪基台86、及固定在輪基台86的下表面側的以鑽石等製成的刀具(切割刃)88。 A disc-shaped wheel base is detachably fixed to the lower end of the main shaft 78 A (tool base) 82 is provided with a turning wheel (machining tool) 84 on the lower surface side of the wheel base 82. The turning wheel 84 includes a cylindrical wheel base 86 formed of a metal material such as aluminum or stainless steel, and a cutter (cutting blade) 88 made of diamond or the like fixed to the lower surface side of the wheel base 86.
如圖7所示,在使被加工物11吸引保持在工作夾台72的狀態下旋轉旋削輪84,而使工作夾台72在水平方向上移動並且使刀具88接觸於被加工物11的上表面,藉此便可旋削被加工物11。 As shown in FIG. 7, the turning wheel 84 is rotated while the workpiece 11 is attracted and held by the working chuck 72, so that the working chuck 72 is moved in the horizontal direction and the cutter 88 is brought into contact with the workpiece 11. The surface, whereby the workpiece 11 can be turned.
在旋削單元74中設有用以檢測旋削輪84的振動之振動檢測機構。振動檢測機構包含有振動信號生成裝置(振動信號生成件)90,該振動信號生成裝置90可生成對應於旋削輪84的振動的振動信號。 A vibration detecting mechanism for detecting the vibration of the turning wheel 84 is provided in the turning unit 74. The vibration detecting mechanism includes a vibration signal generating device (vibration signal generating member) 90 that can generate a vibration signal corresponding to the vibration of the turning wheel 84.
振動信號生成裝置90具備有固定於輪座82的內部的複數超音波振動器92。再者,輪座82只具備1個超音波振動器92也無妨。 The vibration signal generating device 90 is provided with a plurality of ultrasonic vibrators 92 fixed to the inside of the wheel base 82. Furthermore, it is also possible that the wheel base 82 is provided with only one ultrasonic vibrator 92.
在超音波振動器92中,連接有用以傳送以超音波振動器92所生成的電壓的非接觸型的傳送通道(傳送件)94。此傳送通道94包含連接到超音波振動器60的第1電感器(第1線圈件)96、及對應第1電感器96而以預定的間隔相向的第2電感器(第2線圈件)98。 In the ultrasonic vibrator 92, a non-contact type conveying path (transport member) 94 for transmitting a voltage generated by the ultrasonic vibrator 92 is connected. The transmission path 94 includes a first inductor (first coil) 96 connected to the ultrasonic vibrator 60, and a second inductor (second coil) 98 that faces the first inductor 96 and faces at a predetermined interval. .
第1電感器96、以及第2電感器98,最典型的是導線捲繞成的圓環狀的線圈,並分別固定在輪座82的上表面側、以及罩蓋單元80的下表面側。 The first inductor 96 and the second inductor 98 are most typically annular coils in which wires are wound, and are fixed to the upper surface side of the wheel housing 82 and the lower surface side of the cover unit 80, respectively.
如以上所述,第1電感器96與第2電感器98會相向 且磁性地耦合。因此,以超音波振動器92所生成的電壓會藉由第1電感器96與第2電感器98的相互感應,而傳送到第2電感器98側。 As described above, the first inductor 96 and the second inductor 98 face each other. And magnetically coupled. Therefore, the voltage generated by the ultrasonic vibrator 92 is transmitted to the second inductor 98 side by mutual induction between the first inductor 96 and the second inductor 98.
在第2電感器98中,透過配線等連接有控制裝置100。控制裝置100可依據從第2電感器98傳送來的電壓而判定旋削輪84的振動狀態。 In the second inductor 98, the control device 100 is connected via a wiring or the like. The control device 100 can determine the vibration state of the turning wheel 84 based on the voltage transmitted from the second inductor 98.
具體而言,控制裝置100包含:記憶部(記憶件)100a,記憶從第2電感器98傳送來的電壓(振動信號)等的資訊;解析部(解析件)100b,將相當於每任意單位時間所傳送的電壓(振動信號)的時間變化之波形(時域的波形)藉由傅立葉變換(例如快速傅立葉變換)做頻譜解析;及判定部(判定件)100c,判定旋削輪84的狀態。再者,記憶部100a、解析部100b、以及判定部100c的功能,與上述實施形態的記憶部38a、解析部38b、以及判定部38c的功能是同樣的。 Specifically, the control device 100 includes a memory unit (memory) 100a that stores information such as a voltage (vibration signal) transmitted from the second inductor 98, and an analysis unit (analyzer) 100b that corresponds to each arbitrary unit. The waveform of the time change of the voltage (vibration signal) transmitted by the time (waveform in the time domain) is subjected to spectrum analysis by Fourier transform (for example, fast Fourier transform), and the determination unit (decision) 100c determines the state of the rotary wheel 84. The functions of the storage unit 100a, the analysis unit 100b, and the determination unit 100c are the same as those of the storage unit 38a, the analysis unit 38b, and the determination unit 38c of the above-described embodiment.
如此所構成的旋削裝置(加工裝置)70,由於也具備有生成對應於旋削輪(加工工具)84的振動的振動信號的振動信號生成裝置(振動信號生成件)90、及依據以振動信號生成裝置90所生成的振動信號來判定旋削輪84的狀態的控制裝置(控制件)100,因此可恰當地檢測伴隨旋削輪84的振動的異常。 The turning device (processing device) 70 configured as described above also includes a vibration signal generating device (vibration signal generating device) 90 that generates a vibration signal corresponding to the vibration of the turning wheel (machining tool) 84, and is generated based on the vibration signal. The control device (controller) 100 that determines the state of the turning wheel 84 by the vibration signal generated by the device 90 can appropriately detect the abnormality accompanying the vibration of the turning wheel 84.
其他,上述實施形態的構成、方法等,只要不脫離本發明的目的範圍,均可適當變更來實施。 In addition, the configuration, the method, and the like of the above-described embodiments can be appropriately modified without departing from the scope of the invention.
2‧‧‧磨削裝置(加工裝置) 2‧‧‧grinding device (processing device)
11‧‧‧被加工物 11‧‧‧Processed objects
16‧‧‧工作夾台 16‧‧‧Working table
16a‧‧‧保持面 16a‧‧‧ Keep face
32‧‧‧磨削單元(加工件) 32‧‧‧grinding unit (machined parts)
38‧‧‧控制裝置(控制件) 38‧‧‧Control device (control)
38a‧‧‧記憶部(記憶件) 38a‧‧‧Memory (memory)
38b‧‧‧解析部(解析件) 38b‧‧‧analysis department (analytical part)
38c‧‧‧判定部(判定件) 38c‧‧‧Decision Department (Decision)
40‧‧‧主軸殼體 40‧‧‧ spindle housing
42‧‧‧主軸 42‧‧‧ Spindle
46‧‧‧罩蓋單元 46‧‧‧ Cover unit
46a‧‧‧開口 46a‧‧‧ openings
48‧‧‧輪座(工具座) 48‧‧·wheel seat (tool seat)
50‧‧‧磨削輪(加工工具) 50‧‧‧ grinding wheel (machining tool)
52‧‧‧輪基台 52‧‧‧ wheel abutment
54‧‧‧磨石(磨削磨石) 54‧‧‧Minestone (grinding grindstone)
58‧‧‧振動信號生成裝置(振動信號生成件) 58‧‧‧Vibration signal generator (vibration signal generator)
60‧‧‧超音波振動器 60‧‧‧Ultrasonic vibrator
62‧‧‧傳送通道(傳送件) 62‧‧‧Transport channel (transportation)
64‧‧‧第1電感器(第1線圈件) 64‧‧‧1st inductor (1st coil part)
66‧‧‧第2電感器(第2線圈件) 66‧‧‧2nd inductor (2nd coil part)
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TWI813825B (en) * | 2018-12-07 | 2023-09-01 | 日商迪思科股份有限公司 | Processing device |
TWI831985B (en) * | 2019-06-25 | 2024-02-11 | 德商Dmg森超音波雷射科技有限公司 | Machine tool and method and device for controlling an ultrasound tool unit for machining thereon |
US12109589B2 (en) | 2019-06-25 | 2024-10-08 | Dmg Mori Ultrasonic Lasertec Gmbh | Method and device for controlling an ultrasound tool unit for machining on a machine tool |
Also Published As
Publication number | Publication date |
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KR20160100844A (en) | 2016-08-24 |
JP6403601B2 (en) | 2018-10-10 |
KR102422909B1 (en) | 2022-07-21 |
CN105881194A (en) | 2016-08-24 |
CN105881194B (en) | 2019-05-31 |
TWI672192B (en) | 2019-09-21 |
JP2016150394A (en) | 2016-08-22 |
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